Multilayer electronic component
By setting grooves on the outer electrode belt of the multi-layer ceramic capacitor and filling the end of the coating, the complexity of the moisture permeability path is increased, and the problem of insulation deterioration in harsh environments is solved, which significantly improves its moisture resistance reliability.
Patent Information
- Application Number
- CN202411769557.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-20
- Filing Date
- 2024-12-04
- Publication Date
- 2025-06-20
AI Technical Summary
Multi-layer ceramic capacitors are susceptible to external moisture permeation in harsh usage environments, resulting in deterioration of insulation breakdown voltage, thereby reducing their moisture-proof reliability.
A multi-layer electronic assembly is designed, with the body including an alternately arranged inner electrode and a dielectric layer, and a groove is provided on the tape portion of the outer electrode to fill the ends of the lower and upper plating layers, thereby increasing the complexity of the moisture permeation path.
By increasing the complexity of the moisture permeability path, the moisture-proof reliability of the multi-layer electronic components is significantly improved, and the direct erosion of moisture on the insulating layer is avoided.
Smart Images
Figure CN120183906A_ABST
Abstract
Description
[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0187344, filed with the Korean Intellectual Property Office on December 20, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field
[0002] The present disclosure relates to a multilayer electronic component. Background Art
[0003] A multilayer ceramic capacitor (MLCC), which is a type of multilayer electronic component, is a chip capacitor mounted on a printed circuit board of various electronic products such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, and smartphones to charge or discharge them. These multilayer ceramic capacitors can be used as components of various electronic devices because they have the advantages of small size, high capacitance, and easy installation.
[0004] Recently, as the usage environment of multilayer ceramic capacitors has become more severe, the following problems have occurred: external moisture and the like penetrate into the body, deteriorating the insulation breakdown voltage of the multilayer ceramic capacitor. Therefore, research is being conducted to improve the moisture-proof reliability of multilayer ceramic capacitors. Summary of the Invention
[0005] One aspect of the present disclosure is to provide a multilayer electronic component having excellent reliability.
[0006] According to one aspect of the present disclosure, a multi-layer electronic component includes: a body including a dielectric layer and first and second inner electrodes alternately arranged with the dielectric layer therebetween, the body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction; a first outer electrode including a first connection portion and a first belt portion, the first connection portion being provided on the third surface, the first belt portion extending from the first connection portion to at least one of the first surface, the second surface, the fifth surface, and the sixth surface; and a second outer electrode including a second connection portion and a second belt portion, the second connection portion being provided on the fourth surface, the second belt portion extending from the second connection portion to at least one of the first surface, the second surface, the fifth surface, and the sixth surface. The first outer electrode includes: a first base electrode layer in contact with the first inner electrode; a first under-plating layer provided on the first base electrode layer; and a first over-plating layer provided on the first under-plating layer. The second outer electrode includes: a second base electrode layer in contact with the second inner electrode; a second under-plating layer provided on the second base electrode layer; and a second over-plating layer provided on the second under-plating layer. The body includes a first groove and a second groove, the first groove and the second groove being respectively provided at ends of the first belt portion and the second belt portion and spaced apart from each other in the second direction. Ends of the first under-plating layer and the first over-plating layer respectively fill at least a part of the first groove, and ends of the second under-plating layer and the second over-plating layer respectively fill at least a part of the second groove. Description of the Drawings
[0007] Through the following specific embodiments in conjunction with the drawings, the above and other aspects, features, and advantages of the present disclosure will be more clearly understood. In the drawings: Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an embodiment; Figure 2 is schematically showing Figure 1 the body of; Figure 3 is schematically showing from Figure 1 a plan view of the multi-layer electronic component observed from the first surface of; Figure 4 is schematically showing along Figure 1 a cross-sectional view of a cross-section taken along line I-I' of; Figure 5 is schematically showing alongFigure 1 Cross-sectional view of the cross-section taken along line II-II'; Figure 6 is schematically showing the Figure 4 Cross-sectional view of the cross-section taken along line III-III'; Figure 7 is Figure 4 Enlarged view of region A of Figure 8 is Figure 7 Variant example of Figure 9 is Figure 4 Variant example of Figure 10 is schematically showing a cross-sectional view corresponding to Figure 4 of a multi-layer electronic component according to another embodiment; Figure 11 is Figure 10 Enlarged view of region B of Figure 12 is a plan view corresponding to Figure 3 of a multi-layer electronic component according to another embodiment; and Figure 13 is schematically showing an enlarged view corresponding to Figure 7 of a prior art multi-layer electronic component. Detailed Description
[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, the embodiments of the present disclosure can be modified in many different forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure are provided to more completely describe the present disclosure to those skilled in the art. Therefore, for clearer explanation, the shapes and sizes of the elements in the drawings may be exaggerated, and the elements indicated by the same reference numerals in the drawings are the same elements.
[0009] In addition, to clearly describe the present disclosure in the drawings, parts irrelevant to the description are omitted, and the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily shown for ease of description. Therefore, the present disclosure is not necessarily limited to the embodiments shown. In addition, the same reference numerals are used to describe components having the same functions within the same concept range. In addition, throughout the specification, when a certain component is referred to as "including" a component, unless otherwise specified, this means that the certain component may also include other components, without excluding other components.
[0010] In one or more aspects, the terms "substantially", "about" and "approximate" may provide an industry-accepted tolerance for the correlation between their corresponding terms and / or items, such as a tolerance of ±1%, ±5% or ±10% of the actual value, or other suitable tolerances.
[0011] In the drawings, the first direction may be defined as the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.
[0012] Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an embodiment.
[0013] Figure 2 is schematically showing Figure 1 a perspective view of the main body of.
[0014] Figure 3 is schematically showing a plan view of the multi-layer electronic component as viewed from the first surface of Figure 1 ..
[0015] Figure 4 is schematically showing a sectional view of a section taken along line I-I' of Figure 1 ..
[0016] Figure 5 is schematically showing a sectional view of a section taken along line II-II' of Figure 1 ..
[0017] Figure 6 is schematically showing a sectional view of a section taken along line III-III' of Figure 4 ..
[0018] Figure 7 is Figure 4 an enlarged view of region A of.
[0019] Figure 13 is schematically showing an enlarged view corresponding to Figure 7 of a multi-layer electronic component of the prior art.
[0020] Hereinafter, the multi-layer electronic component 100 according to an embodiment will be described in detail with reference to Figures 1 to 7 .. In addition, a multi-layer ceramic capacitor is described as an example of the multi-layer electronic component, but the present disclosure is not limited thereto, and can be applied to various multi-layer electronic components such as inductors, piezoelectric elements, varistors, or thermistors.
[0021] The size of the multi-layer electronic component 100 is not particularly limited. The maximum size of the multi-layer electronic component 100 in the second direction may be, for example, 0.2 mm to 3.2 mm, and the maximum size of the multi-layer electronic component 100 in the third direction may be, for example, 0.1 mm to 1.6 mm.
[0022] Referring to Figure 1 , the multi-layer electronic component 100 may include a main body 110 and external electrodes 131 and 132 provided on the main body 110.
[0023] There is no particular limitation on the specific shape of the main body 110, but as shown in Figure 1 and Figure 2 , the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic particles contained in the main body 110 during the sintering process or the polishing process of the corners, the main body 110 may not have a hexahedral shape with completely straight lines, but may generally have a hexahedral shape.
[0024] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.
[0025] Referring to Figure 4 , the main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111 in a first direction. The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated with each other to such an extent that it is difficult to identify the boundary between them without using a scanning electron microscope (SEM).
[0026] There is no particular limitation on the average thickness td of the dielectric layer 111. The average thickness td of the dielectric layer 111 may be, for example, 0.1 μm to 10.0 μm, 0.1 μm to 5.0 μm, 0.1 μm to 2.0 μm, or 0.1 μm to 0.4 μm.
[0027] The dielectric layer 111 can be formed by the following method: preparing a ceramic slurry containing ceramic particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film, and drying the ceramic slurry to prepare a green sheet, and then sintering the green sheet. There is no particular limitation on the ceramic particles as long as the multilayer electronic component can obtain sufficient capacitance. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. Examples of barium titanate-based ceramic particles may include BaTiO3 and (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1- y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti1-y Zr y )O3 (0 < y < 1), etc. Ethanol or the like can be used as an organic solvent, and polyvinyl butyral or the like can be used as a binder. Known materials used in the art can be used as the organic solvent and the binder.
[0028] Refer to Figure 4 , the inner electrodes 121 and 122 can include, for example, a first inner electrode 121 and a second inner electrode 122 alternately arranged in the first direction, and a dielectric layer 111 is interposed therebetween. For example, as adjacent first inner electrode 121 and second inner electrode 122 of electrode pairs having different polarities can be arranged opposite to each other and a dielectric layer 111 is interposed therebetween. The first inner electrode 121 and the second inner electrode 122 can be electrically separated from each other by the dielectric layer 111 provided therebetween.
[0029] The first inner electrode 121 can be spaced apart from the fourth surface 4 and connected to the first outer electrode 131 on the third surface 3. The second inner electrode 122 can be spaced apart from the third surface 3 and connected to the second outer electrode 132 on the fourth surface 4.
[0030] The conductive metal included in the inner electrodes 121 and 122 can be at least one of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more specifically, the conductive metal included in the inner electrodes 121 and 122 can include Ni, but the present disclosure is not limited thereto.
[0031] The average thickness te of the inner electrodes 121 and 122 is not particularly limited. The average thickness te of the inner electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.
[0032] The inner electrodes 121 and 122 can be formed by coating a conductive paste for the inner electrode containing a conductive metal to a predetermined thickness on a ceramic green sheet and then sintering the conductive paste. The printing method of the conductive paste for the inner electrode can include a screen printing method, a gravure printing method, etc., and the present disclosure is not limited thereto.
[0033] The average thickness td of the dielectric layer 111 refers to the average thickness of the dielectric layer 111 in the first direction, and the average thickness te of the inner electrodes 121 and 122 refers to the average thickness of the inner electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be obtained by measuring the thicknesses of a dielectric layer 111 at a plurality of points (e.g., 30 equally spaced points) in the second direction and then taking the average. In addition, the average thickness te of the inner electrodes 121 and 122 can be obtained by measuring the thicknesses of an inner electrode 121 or 122 at a plurality of points (e.g., 30 equally spaced points) in the second direction and then taking the average. The 30 equally spaced points can be specified at the capacitance forming section Ac which will be described later. If these average thickness measurements are extended to 10 dielectric layers 111 and 10 inner electrodes 121 and 122 and then the average is taken, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be made more general.
[0034] Referring to Figure 4 , the main body 110 may include: a capacitance forming section Ac provided inside the main body 110 and in which a capacitance is formed by including first inner electrodes 121 and second inner electrodes 122 arranged alternately and having a dielectric layer 111 interposed therebetween; and a first covering section 112 and a second covering section 113 provided on two surfaces of the capacitance forming section Ac that face each other in the first direction. The covering sections 112 and 113 may mainly serve to prevent damage to the inner electrodes due to physical stress and / or chemical stress. Except that the covering sections 112 and 113 do not include inner electrodes, the covering sections 112 and 113 may have a material similar to that of the dielectric layer 111.
[0035] The average thickness tc of the covering sections 112 and 113 is not particularly limited. For example, the average thickness tc of the covering sections 112 and 113 may be less than or equal to 150 μm, less than or equal to 100 μm, less than or equal to 30 μm, or less than or equal to 20 μm. For example, the average thickness tc of the covering sections 112 and 113 may be greater than or equal to 5 μm, greater than or equal to 10 μm, or greater than or equal to 30 μm. In this case, the average thickness tc of the covering sections 112 and 113 refers to the average thickness of each of the first covering section 112 and the second covering section 113.
[0036] The average thickness tc of the covering parts 112 and 113 may refer to the average thickness of the covering parts 112 and 113 in the first direction, and the average thickness tc of the covering parts 112 and 113 may be: in an image obtained by scanning a cross-section of the main body 110 cut from the center of the main body 110 in the third direction in the first and second directions with a scanning electron microscope (SEM), the average value of the thicknesses of the covering parts 112 and 113 in the first direction measured at five equally spaced points in the second direction.
[0037] The covering parts 112 and 113 may be formed by: stacking a predetermined number of green ceramic sheets on which no conductive paste for the inner electrodes is coated on two surfaces of the capacitance forming part Ac that face each other in the first direction, and then sintering the green ceramic sheets.
[0038] Referring to Figure 5 , the main body 110 may include a first edge part 114 and a second edge part 115 respectively provided on two surfaces of the capacitance forming part Ac that face each other in the third direction. For example, the edge parts 114 and 115 may refer to the regions between the two ends of the inner electrodes 121 and 122 in the third direction and the outer surface of the main body 110 in the third direction in a cross-section of the main body 110 in the first and third directions.
[0039] Except that the edge parts 114 and 115 do not include the inner electrodes 121 and 122, the edge parts 114 and 115 may have a material similar to that of the dielectric layer 111. The edge parts 114 and 115 may mainly serve to prevent damage to the inner electrodes 121 and 122 due to physical stress and / or chemical stress.
[0040] The edge parts 114 and 115 may be formed by: coating a conductive paste for the inner electrodes on a region of the green ceramic sheet except for the regions where the edge parts 114 and 115 are to be formed, and then sintering the conductive paste and the green ceramic sheet. Optionally, in order to suppress the step difference caused by the inner electrodes 121 and 122, after lamination, the laminate is cut so that the inner electrodes 121 and 122 are exposed on two surfaces of the capacitance forming part Ac that face each other in the third direction, and then one or more green ceramic sheets for forming the edge parts may be laminated on two surfaces of the capacitance forming part Ac that face each other in the third direction, and then sintered to form the edge parts 114 and 115.
[0041] The average thickness tm of the edge portions 114 and 115 is not particularly limited. For example, the average thickness tm of the edge portions 114 and 115 may be less than or equal to 150 μm, less than or equal to 100 μm, less than or equal to 20 μm, or less than or equal to 15 μm. For example, the average thickness tm of the edge portions 114 and 115 may be greater than or equal to 5 μm, greater than or equal to 10 μm, or greater than or equal to 30 μm. In this case, the average thickness tm of the edge portions 114 and 115 refers to the average thickness of each of the first edge portion 114 and the second edge portion 115.
[0042] The average thickness tm of the edge portions 114 and 115 may refer to the average thickness of the edge portions 114 and 115 in the third direction, and the average thickness tm of the edge portions 114 and 115 may be: in an image obtained by scanning a cross-section of the main body 110 cut at the center in the second direction of the main body 110 in the first direction and the third direction with a scanning electron microscope (SEM), the average value of the thicknesses of the edge portions 114 and 115 in the third direction measured at five equally spaced points in the first direction.
[0043] The outer electrodes 131 and 132 may include: a first outer electrode 131 including a first connection portion C1 and a first belt portion B1, the first connection portion C1 being provided on the third surface 3, and the first belt portion B1 extending from the first connection portion C1 to at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6; and a second outer electrode 132 including a second connection portion C2 and a second belt portion B2, the second connection portion C2 being provided on the fourth surface 4, and the second belt portion B2 extending from the second connection portion C2 to at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first belt portion B1 may extend from the first connection portion C1 to a part of the corresponding first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6, and the second belt portion B2 may extend from the second connection portion C2 to a part of the corresponding first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6.
[0044] The first connection portion C1 may refer to a region of the first outer electrode 131 located outside a virtual plane P3 parallel to the third surface 3, and the first belt portion B1 may refer to a region of the first outer electrode 131 located inside the virtual plane P3 parallel to the third surface 3. The boundary between the first connection portion C1 and the first belt portion B1 may be located on the virtual plane P3 parallel to the third surface 3.
[0045] The second connection portion C2 may refer to a region of the second outer electrode 132 that is outside a virtual plane P4 parallel to the fourth surface 4, and the second band portion B2 may refer to a region of the second outer electrode 132 that is inside the virtual plane P4 parallel to the fourth surface 4. The boundary between the second connection portion C2 and the second band portion B2 may be located on the virtual plane P4 parallel to the fourth surface 4.
[0046] The first outer electrode 131 may include: a first base electrode layer 131a in contact with the first inner electrode 121; a first lower plating layer 131b provided on the first base electrode layer 131a; and a first upper plating layer 131c provided on the first lower plating layer 131b. The second outer electrode 132 may include: a second base electrode layer 132a in contact with the second inner electrode 122; a second lower plating layer 132b provided on the second base electrode layer 132a; and a second upper plating layer 132c provided on the second lower plating layer 132b.
[0047] The first base electrode layer 131a and the second base electrode layer 132a may each include a metal and glass. The first base electrode layer 131a may be provided in the first connection portion C1 and the first band portion B1, and the second base electrode layer 132a may be provided in the second connection portion C2 and the second band portion B2. The base electrode layers 131a and 132a may be formed by dipping the third surface 3 and the fourth surface 4 into a conductive paste including metal powder and glass frit, and then sintering them. The metal included in the base electrode layers 131a and 132a may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or their alloys.
[0048] In addition, the base electrode layers 131a and 132a may be composed of only one layer including a metal and glass, but the present disclosure is not limited thereto, and the base electrode layers 131a and 132a may have a multilayer structure. Figure 9 Yes Figure 4 is a variant example. Refer to Figure 9 , the first base electrode layer 131a may include a first layer 131a1 including a metal and glass and a second layer 131a2 provided on the first layer 131a1 and including a metal and a resin, and the second base electrode layer 132a may include a first layer 132a1 including a metal and glass and a second layer 132a2 provided on the first layer 132a1 and including a metal and a resin.
[0049] The metal included in the second layers 131a2 and 132a2 is not particularly limited and may include at least one selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys. The resin included in the second layers 131a2 and 132a2 may include, for example, at least one of an epoxy resin, an acrylic resin, and ethyl cellulose. The second layers 131a2 and 132a2 may be formed by coating a conductive resin composition including metal powder and resin on the first layers 131a1 and 132a1 and drying the conductive resin composition, and then performing a curing heat treatment.
[0050] The first lower plating layer 131b and the first upper plating layer 131c may be provided in the first connection portion C1 and the first belt portion B1, and the second lower plating layer 132b and the second upper plating layer 132c may be provided in the second connection portion C2 and the second belt portion B2. The lower plating layers 131b and 132b and the upper plating layers 131c and 132c may improve the mounting characteristics of the multilayer electronic component 100. The types of the lower plating layers 131b and 132b and the upper plating layers 131c and 132c are not particularly limited, and the lower plating layers 131b and 132b and the upper plating layers 131c and 132c may include Ni, Sn, Pd, and / or their alloys. In an embodiment, the first lower plating layer 131b and the second lower plating layer 132b may each include Ni, and the first upper plating layer 131c and the second upper plating layer 132c may each include Sn. The lower plating layers 131b and 132b and the upper plating layers 131c and 132c may be formed using an electrolytic plating method and / or an electroless plating method.
[0051] The drawings depict a structure in which the multilayer electronic component 100 has two outer electrodes 131 and 132, but is not limited thereto, and the number or shape of the outer electrodes 131 and 132 may be changed according to the shape of the inner electrodes 121 and 122 or other uses.
[0052] The main body 110 may include a first groove 141 and a second groove 142 respectively provided at the ends of the first belt portion B1 and the ends of the second belt portion B2, and the first groove 141 and the second groove 142 are spaced apart from each other in the second direction. The first groove 141 may be provided along the end of the first belt portion B1, and the second groove 142 may be provided along the end of the second belt portion B2. As Figure 2 and Figure 3As shown, the first groove 141 and the second groove 142 may be continuously provided on at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, respectively. More specifically, the first groove 141 and the second groove 142 may be continuously provided on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, respectively. The first groove 141 and the second groove 142 may extend along the third direction from the first surface 1 and the second surface 2, and may extend along the first direction from the fifth surface 5 and the sixth surface 6.
[0053] In one embodiment, in the first direction, the lower surface (i.e., the bottom surface) of the first groove 141 may be lower than the portion of the first surface 1 located in the first belt portion B1 and the central portion of the first surface 1, and the lower surface (i.e., the bottom surface) of the second groove 142 may be lower than the portion of the first surface 1 located in the second belt portion B2 and the central portion of the first surface 1.
[0054] There is no limitation on the method of forming the grooves 141 and 142 in the main body 110. However, since there is a risk of cracks and other defects occurring when a strong physical impact is applied to the main body 110, it is preferable to use a laser ablation method or the like to form the grooves 141 and 142.
[0055] According to an embodiment, the end portions of the first lower plating layer 131b and the first upper plating layer 131c may respectively fill at least a part of the first groove 141, and the end portions of the second lower plating layer 132b and the second upper plating layer 132c may respectively fill at least a part of the second groove 142.
[0056] External moisture may generally penetrate into the interior of the main body 110 through the end portions of the external electrodes 131 and 132 (e.g., the end portions of the belt portions B1 and B2). As Figure 13 shown, in the case of a multi-layer electronic component in the prior art in which no grooves are provided in the main body 10, external moisture may penetrate along a straight line between the main body 10 and the external electrode 31. For example, in the case of the prior art, the penetration path PM of external moisture is simple, so external moisture can easily penetrate into the interior of the main body 10, and the reliability of the multi-layer electronic component is reduced due to the penetration of external moisture into the interior of the main body 10.
[0057] In addition, in the case of the embodiment of the present disclosure, as Figure 7 shown, the end portions of the first lower plating layer 131b and the first upper plating layer 131c respectively fill at least a part of the first groove 141, so that the penetration path PM of external moisture can be made more complex than the penetration path PM in the multi-layer electronic component of the prior art. As a result, the moisture-proof reliability of the multi-layer electronic component 100 is improved.
[0058] There is no need to specifically limit the shape of the groove. In Figure 7In [the figure], the cross-section of the inner space of the first groove 141 is shown in a semi-circular shape, but the present disclosure is not limited thereto, and the cross-section of the inner space of the first groove 141 may have various shapes such as a triangular shape, a quadrilateral shape, a trapezoidal shape, or an elliptical shape.
[0059] There is no specific limitation on the size of the groove. However, in an embodiment, the maximum dimension T1 of the first groove 141 in the first direction may be in the range of 2 μm to 20 μm. If T1 is less than 2 μm, the effect of improving the moisture-proof reliability of the present disclosure may not be significant. If T1 exceeds 20 μm, there may be an excessive generation of empty spaces in the first groove 141 that are not filled by the first lower plating layer 131b and the first upper plating layer 131c, and there is a concern that foreign substances may penetrate the empty spaces and cause defects in the multilayer electronic component 100. In an embodiment, the maximum dimension L1 of the first groove 141 in the second direction may be in the range of 2 μm to 20 μm. If L1 is less than 2 μm, the effect of improving the moisture-proof reliability of the present disclosure may not be significant. If L1 exceeds 20 μm, there may be an excessive generation of empty spaces in the first groove 141 that are not filled by the first lower plating layer 131b and the first upper plating layer 131c, and there is a concern that foreign substances may penetrate into the empty spaces and cause defects in the multilayer electronic component 100.
[0060] In addition, it is sufficient that the lower coatings 131b and 132b and the upper coatings 131c and 132c each fill at least a part of the grooves 141 and 142, and there is no particular limitation on the form in which the lower coatings 131b and 132b and the upper coatings 131c and 132c are disposed within the grooves 141 and 142. However, in the embodiment, the end of the first lower coating 131b may fill the region of the first groove 141 adjacent to the first connection portion C1, and the end of the first upper coating 131c may fill the remaining region of the first groove 141 except for the region adjacent to the first connection portion C1. That is, the end of the first lower coating 131b may fill the region of the first groove 141 closer to the first connection portion C1, and the end of the first upper coating 131c may fill the remaining region of the first groove 141 except for the region filled by the end of the first lower coating 131b. The end of the second lower coating 132b may fill the region of the second groove 142 adjacent to the second connection portion C2, and the end of the second upper coating 132c may fill the remaining region of the second groove 142 except for the region adjacent to the second connection portion C2. That is, the end of the second lower coating 132b may fill the region of the second groove 142 closer to the second connection portion C2, and the end of the second upper coating 132c may fill the remaining region of the second groove 142 except for the region filled by the end of the second lower coating 132b. Preferably, the lower coatings 131b and 132b and the upper coatings 131c and 132c completely fill the inner spaces of the grooves 141 and 142, but the present disclosure is not limited thereto.
[0061] In addition, it is sufficient that the lower coatings 131b and 132b and the upper coatings 131c and 132c each fill at least a part of the grooves 141 and 142, and the ends of the base electrode layers 131a and 132a may or may not be disposed within the grooves 141 and 142. For example, referring to Figure 7 , the end of the first base electrode layer 131a may not be disposed within the first groove 141.
[0062] Figure 8 is Figure 7 a variant example of Figure 8 . Referring to
[0063] In the embodiment, the end of the first base electrode layer 131a may fill at least a part of the first groove 141. In this case, the end of the first base electrode layer 131a, the end of the first lower coating 131b, and the end of the first upper coating 131c may be sequentially disposed within the first groove 141, and the end of the first base electrode layer 131a may be closer to the first connection portion C1 than the end of the first lower coating 131b and the end of the first upper coating 131c.
[0063] In addition, Figure 7 and Figure 8is an enlarged view showing the first outer electrode 131 and the first groove 141. However, since the first outer electrode 131 has substantially the same structure as the second outer electrode 132, and the first groove 141 has substantially the same structure as the second groove 142, therefore Figure 7 and Figure 8 The description of can be equally applied to the second outer electrode 132 and the second groove 142.
[0064] Figure 10 is a cross-sectional view schematically showing the corresponding part of the multi-layer electronic component 100' according to another embodiment Figure 4 corresponding to. Figure 11 is Figure 10 An enlarged view of region B of.
[0065] Hereinafter, with reference to Figure 10 and Figure 11 The multi-layer electronic component 100' according to another embodiment will be described. The same / similar reference numerals are used for the same / similar structures as those of the multi-layer electronic component 100 described in Figures 1 to 7 , and the repeated description is omitted.
[0066] The main body 110' of the multi-layer electronic component 100' according to another embodiment may include: a first additional groove 151 covered by a first base electrode layer 131a provided in the first belt portion B1; and a second additional groove 152 covered by a second base electrode layer 132a provided in the second belt portion B2. For example, the main body 110' may include a first additional groove 151 covered by the first belt portion B1 and a second additional groove 152 covered by the second belt portion B2.
[0067] The additional grooves 151 and 152 may be continuously provided on at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. More specifically, the additional grooves 151 and 152 may be continuously provided on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.
[0068] In the case of the multi-layer electronic component 100' according to another embodiment, the first base electrode layer 131a may fill at least a part of the first additional groove 151, and the second base electrode layer 132a may fill at least a part of the second additional groove 152. In this case, as Figure 11As shown, the penetration path PM of external moisture can be made more complex, and as a result, the moisture-proof reliability of the multi-layer electronic component 100' can be improved more effectively. In an embodiment, the first additional groove 151 and the second additional groove 152 may each be provided in plurality. When a plurality of additional grooves 151 and 152 are provided, the effect of improving the moisture-proof reliability of the multi-layer electronic component of the present disclosure can be more remarkable. The shapes and sizes of the additional grooves 151 and 152 do not need to be particularly limited, but the additional grooves 151 and 152 may have shapes and sizes similar to those of the grooves 141 and 142.
[0069] Figure 12 is a plan view corresponding to the multi-layer electronic component 100'' according to another embodiment Figure 3 corresponding.
[0070] Hereinafter, the multi-layer electronic component 100'' according to another embodiment will be described with reference to Figure 12 Same / similar reference numerals are used for the same / similar configurations as those of the multi-layer electronic component 100 described in Figures 1 to 7 and the repeated description is omitted.
[0071] The multi-layer electronic component 100'' according to another embodiment may include: a first external electrode 131'', including a first connection portion C1'' and a first band portion B1''; and a second external electrode 132'', including a second connection portion C2'' and a second band portion B2''.
[0072] According to another embodiment, on the first surface 1, the dimensions of the first band portion B1'' and the second band portion B2'' in the second direction at the central portion in the third direction are respectively larger than the dimensions of the first band portion B1'' and the second band portion B2'' at both ends in the third direction in the second direction. At this time, the first groove 141'' of the main body 110'' may be provided along the end of the first band portion B1'', and the second groove 142'' may be provided along the end of the second band portion B2''. For example, the first groove 141'' may be provided along the outer edge of the first band portion B1'', and the second groove 142'' may be provided along the outer edge of the second band portion B2''. Therefore, the end of the first groove 141'' in the third direction may be closer to the third surface 3 of the main body 110'' in the second direction than the central portion of the first groove 141'' in the third direction, and the end of the second groove 142'' in the third direction may be closer to the fourth surface 4 of the main body 110'' in the second direction than the central portion of the second groove 142'' in the third direction.
[0073] Accordingly, it is prevented that the first base electrode layer completely fills the first groove 141'', so that it is easy to fill the first groove 141'' with the end of the first lower plating layer and the end of the first upper plating layer, and it is prevented that the second base electrode layer completely fills the second groove 142'', so that it is easy to fill the second groove 142'' with the end of the second lower plating layer and the end of the second upper plating layer. As a result, the moisture-proof reliability of the multilayer electronic component 100'' can be improved more effectively.
[0074] As described above, a multilayer electronic component with excellent reliability can be provided.
[0075] The present disclosure is not limited by the above embodiments and the drawings, but is intended to be defined by the appended claims. Therefore, those skilled in the art can make various forms of substitution, modification and change without departing from the technical spirit of the present disclosure described in the claims, and this will also be considered to fall within the scope of the present disclosure.
[0076] In addition, the expression "embodiment" does not mean the same embodiment, and is provided to emphasize and describe different unique features. However, the embodiments presented above do not exclude the combination of features with another embodiment. For example, even if the content described in a specific embodiment is not described in another embodiment, unless there is a description contrary to or contradictory to the content in another embodiment, the content can be understood as a description related to another embodiment.
[0077] Furthermore, expressions such as "first" and "second" are used to distinguish one component from another component, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the claims, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.
[0078] Although the embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.
Claims
1. A multilayer electronic component comprising: a body including a dielectric layer and first and second inner electrodes alternately arranged with the dielectric layer interposed therebetween, the body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; A first external electrode, comprising a first connecting portion and a first band portion, wherein the first connecting portion is disposed on the third surface, and the first band portion extends from the first connecting portion to at least one of the first surface, the second surface, the fifth surface, and the sixth surface; as well as a second outer electrode, comprising a second connecting portion and a second belt portion, wherein the second connecting portion is disposed on the fourth surface, and the second belt portion extends from the second connecting portion to at least one of the first surface, the second surface, the fifth surface, and the sixth surface; The first external electrode includes: a first base electrode layer in contact with the first internal electrode; a first lower plating layer disposed on the first base electrode layer; and a first upper plating layer disposed on the first lower plating layer. The second outer electrode comprises: a second base electrode layer in contact with the second inner electrode; a second lower plating layer disposed on the second base electrode layer; and a second upper plating layer disposed on the second lower plating layer. The body includes a first groove and a second groove, the first groove and the second groove are respectively provided on an end of the first belt portion and an end of the second belt portion and are spaced apart from each other in the second direction, and An end portion of the first lower plating layer and an end portion of the first upper plating layer respectively fill at least a portion of the first groove, and an end portion of the second lower plating layer and an end portion of the second upper plating layer respectively fill at least a portion of the second groove.
2. The multilayer electronic component according to claim 1, wherein The end of the first lower plating layer fills a region of the first groove closer to the first connecting portion, and the end of the first upper plating layer fills a remaining region of the first groove except the region filled by the end of the first lower plating layer, and The end portion of the second lower plating layer fills a region of the second groove closer to the second connection portion, and the end portion of the second upper plating layer fills a remaining region of the second groove except for the region filled by the end portion of the second lower plating layer.
3. The multilayer electronic component according to claim 1, wherein: The first grooves and the second grooves are respectively disposed continuously on at least one of the first surface, the second surface, the fifth surface, and the sixth surface.
4. The multilayer electronic component according to claim 1, wherein: The first grooves and the second grooves are continuously disposed on the first surface, the second surface, the fifth surface, and the sixth surface, respectively.
5. The multilayer electronic component according to claim 1, wherein The end portion of the first base electrode layer is not disposed inside the first groove.
6. The multilayer electronic component according to claim 1, wherein An end portion of the first base electrode layer fills at least a portion of the first groove.
7. The multilayer electronic component according to claim 6, wherein: The end of the first base electrode layer, the end of the first lower plating layer and the end of the first upper plating layer are sequentially arranged in the first groove, and the end of the first base electrode layer is closer to the first connecting portion than the end of the first lower plating layer and the end of the first upper plating layer.
8. The multilayer electronic component according to claim 1, wherein A maximum dimension of the first groove in the first direction is in a range of 2 μm to 20 μm.
9. The multilayer electronic component according to claim 1, wherein: A maximum dimension of the first groove in the second direction is in a range of 2 μm to 20 μm.
10. The multilayer electronic component according to claim 1, wherein The body further comprises: at least one first additional groove covered by the first base electrode layer disposed in the first band portion; and at least one second additional groove covered by the second base electrode layer disposed in the second band portion, and The first base electrode layer fills at least a portion of the at least one first additional groove, and the second base electrode layer fills at least a portion of the at least one second additional groove.
11. The multilayer electronic component according to claim 10, wherein: The at least one first additional groove and the at least one second additional groove are provided in plural.
12. The multilayer electronic component according to claim 1, wherein On the first surface of the main body, the sizes of the first belt portion and the second belt portion in the second direction at the central portions in the third direction are respectively larger than the sizes of the first belt portion and the second belt portion at both ends in the third direction in the second direction, and The first slot is disposed along the end of the first strap portion, and the second slot is disposed along the end of the second strap portion.
13. The multilayer electronic component according to claim 12, wherein: On the first surface of the body: Both ends of the first groove in the third direction are closer to the third surface of the body in the second direction than a central portion of the first groove in the third direction, and Both ends of the second groove in the third direction are closer to the fourth surface of the body in the second direction than a center portion of the second groove in the third direction.
14. The multilayer electronic component according to claim 1, wherein The first base electrode layer and the second base electrode layer each include metal and glass.
15. The multilayer electronic component according to claim 1, wherein The first base electrode layer and the second base electrode layer each include a first layer including metal and glass and a second layer provided on the first layer and including metal and resin.
16. The multilayer electronic component according to claim 1, wherein The first lower plating layer and the second lower plating layer each contain Ni, and The first upper plating layer and the second upper plating layer each contain Sn.
17. The multilayer electronic component according to claim 1, wherein: In the first direction: The lower surface of the first groove is lower than the portion of the first surface located in the first band portion and the central portion of the first surface, and The lower surface of the second groove is lower than the portion of the first surface located in the second band portion and the central portion of the first surface.