Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including dielectric layers and inner electrode layers alternately disposed with the dielectric layers in a first direction; and first and second external electrodes disposed on the third and fourth surfaces, respectively, in which the internal electrode layer includes an internal electrode including a main portion and an extraction portion extending from the main portion and connected to the external electrodes, and a dummy electrode disposed on the main portion, and a dummy electrode spaced apart from the inner electrode and connected to the outer electrode, and a width of the lead-out portion may be smaller than a width of the main portion, at least a portion of the dummy electrode overlapping the inner electrode in a second direction, and the dummy electrode may not overlap with the inner electrode of another layer in the first direction.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0186891, filed with the Korean Intellectual Property Office on December 20, 2023, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), which is a multi-layer electronic component, may be a chip capacitor that is mounted on a printed circuit board of various electronic products, including image display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, etc., to charge or discharge therefrom.

[0004] Since the multi-layer ceramic capacitor may have a small size and a high capacitance and may be easily mounted, such a multi-layer ceramic capacitor can be used as a component of various electronic devices. As various electronic devices (such as computers and mobile devices) have been designed to have a smaller size and a higher output power, the demand for miniaturization and high capacitance of the multi-layer ceramic capacitor has also increased.

[0005] An inner electrode (a component of the multi-layer ceramic capacitor) may be exposed from the body and may be covered by an outer electrode and connected to the outer electrode, and a portion where the inner electrode and the outer electrode are connected to each other may become a path for external moisture penetration and may easily cause deterioration of moisture-proof reliability. Therefore, a structure for improving moisture-proof reliability by reducing the exposed area of the inner electrode may be applied, but step difference defects with the dielectric layer may occur due to the reduction of the exposed area of the inner electrode.

[0006] In addition, the body (another component of the multi-layer ceramic capacitor) may mainly include a ceramic material, which is a brittle material, and may be easily affected by tensile stress, so that the warp strength may be reduced due to the reduction of the area of the inner electrode, and the body may not be able to withstand the stress applied from the outside according to the manufacturing process or the use environment, and thus cracks may occur in the body, which may reduce the lifespan. Summary of the Invention

[0007] An embodiment of the present disclosure is to provide a multi-layer electronic component having improved moisture-proof reliability.

[0008] An embodiment of the present disclosure is to provide a multi-layer electronic component having improved warp strength.

[0009] An embodiment of the present disclosure is to provide a multi-layer electronic component having improved reliability.

[0010] According to an embodiment of the present disclosure, a multi-layer electronic component includes: a body including a dielectric layer and inner electrode layers alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction; and a first external electrode and a second external electrode respectively disposed on the third surface and the fourth surface. The inner electrode layers include a first inner electrode layer and a second inner electrode layer. The first inner electrode layer includes a first inner electrode and a first dummy electrode. The first inner electrode includes a first main portion and a first lead portion extending from the first main portion, exposed on the third surface and connected to the first external electrode. The first dummy electrode is spaced apart from the first inner electrode, exposed on the third surface and connected to the first external electrode. The second inner electrode layer includes a second inner electrode and a second dummy electrode. The second inner electrode includes a second main portion and a second lead portion extending from the second main portion, exposed on the fourth surface and connected to the second external electrode. The second dummy electrode is spaced apart from the second inner electrode, exposed on the fourth surface and connected to the second external electrode. At least a part of the first lead portion has a smaller size in the third direction than the first main portion in the third direction, and at least a part of the second lead portion has a smaller size in the third direction than the second main portion in the third direction. The first dummy electrode does not overlap with the second inner electrode in the first direction, and the second dummy electrode does not overlap with the first inner electrode in the first direction. At least a part of the first dummy electrode overlaps with the first inner electrode in the second direction, and at least a part of the second dummy electrode overlaps with the second inner electrode in the second direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following specific embodiments in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a multi-layer electronic component according to an embodiment of the present disclosure; Figure 2 is an exploded perspective view showing a stacked structure of inner electrodes according to the prior art; Figure 3A and Figure 3B is a view showing an inner electrode layer according to an embodiment of the present disclosure; Figure 4A 、 Figure 4B 、 Figure 4C and Figure 4Dis a view showing an inner electrode layer according to an embodiment of the present disclosure; Figure 5A and Figure 5B is a view showing an inner electrode layer according to a modified example of an embodiment of the present disclosure; Figure 6A 、 Figure 6B 、 Figure 6C and Figure 6D is a view showing an inner electrode layer according to a modified example of an embodiment of the present disclosure; Figure 7 is a view showing Figure 5B the inner electrode layer in; and Figure 8A 、 Figure 8B and Figure 8C is a view showing one of the inner electrode layers according to various embodiments or modified examples of the present disclosure. DETAILED DESCRIPTION

[0012] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings as follows.

[0013] These embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure. It should be understood that the various embodiments of the present disclosure, although different, are not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structures, shapes, and dimensions described as examples in the embodiments of the present disclosure can be implemented in another embodiment. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiments can be modified. Therefore, the following detailed description should not be considered limiting, and the scope of the present disclosure is defined only by the properly interpreted appended claims and the full scope of the equivalents given by the claims.

[0014] In the drawings, the same elements will be denoted by the same reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the gist of the present disclosure will be omitted. In the drawings, some elements may be exaggerated, omitted, or briefly shown, and the dimensions of the elements do not necessarily reflect the actual dimensions of these elements. The terms "comprising", "including", "configured to", etc. in the specification are used to indicate the presence of features, quantities, steps, operations, elements, parts, or combinations thereof, and do not exclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, parts, or combinations thereof.

[0015] In the drawings, the first direction may be defined as the stacking direction or the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0016] Multi-layer electronic component Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present disclosure.

[0017] Figure 2 is an exploded perspective view showing a stacked structure of internal electrodes according to the prior art.

[0018] Figure 3A and Figure 3B is a view showing an internal electrode layer according to an embodiment of the present disclosure.

[0019] Figure 4A 、 Figure 4B 、 Figure 4C and Figure 4D is a view showing an internal electrode layer according to an embodiment of the present disclosure.

[0020] Figure 5A and Figure 5B is a view showing an internal electrode layer according to a modified example of an embodiment of the present disclosure.

[0021] Figure 6A 、 Figure 6B 、 Figure 6C and Figure 6D is a view showing an internal electrode layer according to a modified example of an embodiment of the present disclosure.

[0022] Figure 7 is a view showing Figure 5B the internal electrode layer in

[0023] Figure 8A 、 Figure 8B and Figure 8C is a view showing one of the internal electrode layers according to various embodiments or modified examples of the present disclosure.

[0024] Hereinafter, the multilayer electronic component according to the embodiment will be described in more detail with reference to Figures 1 to 8C A multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the embodiment is not limited thereto, and examples of the multilayer electronic component according to the present disclosure may be an inductor, a piezoelectric element, a varistor, or a thermistor.

[0025] The multi-layer electronic component 100 according to an embodiment may include: a main body 110 including a dielectric layer 111 and inner electrode layers 121 and 122 alternately disposed with the dielectric layer 111 in a first direction, and including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in a third direction; and first and second external electrodes 131 and 132 respectively disposed on the third surface 3 and the fourth surface 4. The inner electrode layers 121 and 122 may include a first inner electrode layer 121 and a second inner electrode layer 122. The first inner electrode layer 121 may include: a first inner electrode 121a including a first main portion 121a-1 and a first lead portion 121a-2 extending from the first main portion 121a-1, exposed to the third surface 3, and connected to the first external electrode 131; and a first dummy electrode 121b spaced apart from the first inner electrode 121a, exposed to the third surface 3, and connected to the first external electrode 131. The second inner electrode layer 122 may include: a second inner electrode 122a including a second main portion 122a-1 and a second lead portion 122a-2 extending from the second main portion 122a-1, exposed to the fourth surface 4, and connected to the second external electrode 132; and a second dummy electrode 122b spaced apart from the second inner electrode 122a, exposed to the fourth surface 4, and connected to the second external electrode 132. The size of at least a part of the first lead portion 121a-2 in the third direction may be smaller than the size of the first main portion 121a-1 in the third direction, and the size of at least a part of the second lead portion 122a-2 in the third direction may be smaller than the size of the second main portion 122a-1 in the third direction. The first dummy electrode 121b may not overlap the second inner electrode 122a in the first direction, and the second dummy electrode 122b may not overlap the first inner electrode 121a in the first direction. At least a part of the first dummy electrode 121b may overlap the first inner electrode 121a in the second direction, and at least a part of the second dummy electrode 122b may overlap the second inner electrode 122a in the second direction.

[0026] In the main body 110, the dielectric layer 111 and the inner electrode layers 121 and 122 may be alternately laminated.

[0027] More specifically, the main body 110 may include a capacitance forming portion provided in the main body 110 and forming a capacitance by including the first inner electrode layer 121 and the second inner electrode layer 122 alternately disposed opposite to each other and the dielectric layer 111 interposed therebetween. However, the embodiment is not limited thereto, and the inner electrode layer may further include a third inner electrode layer and a fourth inner electrode layer, which will be described in more detail later.

[0028] The shape of the main body 110 is not limited to any specific shape, but as Figure 1 shown, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder included in the main body 110 during the firing process, the main body 110 may not have an exact hexahedral shape formed by straight lines, but may have a substantially hexahedral shape.

[0029] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0030] The plurality of dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that it is difficult to identify the boundary between them without using a scanning electron microscope (SEM).

[0031] There is no limitation on the raw material for forming the dielectric layer 111 as long as sufficient capacitance can be obtained therefrom. Generally, perovskite (ABO3)-based materials can be used, and for example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material may include BaTiO3-based ceramic particles, and examples of the BaTiO3-based ceramic particles may include BaTiO3 or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1- y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0032] In addition, according to the purpose in the embodiments, various ceramic additives, organic solvents, binders, and dispersants may be added to particles such as barium titanate (BaTiO3) as the raw material for forming the dielectric layer 111.

[0033] The thickness of the dielectric layer 111 is not limited to any specific example.

[0034] To ensure the reliability of the multilayer electronic component 100 in a high-voltage environment, the thickness of the dielectric layer 111 may be less than or equal to 10.0 μm. In addition, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 may be less than or equal to 3.0 μm. To easily achieve ultra-miniaturization and high capacitance, the thickness of the dielectric layer 111 may be less than or equal to 1.0 μm, preferably less than or equal to 0.6 μm, and more preferably less than or equal to 0.4 μm.

[0035] Here, the thickness of the dielectric layer 111 may refer to the thickness of the dielectric layer 111 disposed between the adjacent first inner electrode layer 121 and the second inner electrode layer 122.

[0036] The thickness of the dielectric layer 111 may refer to the dimension of the dielectric layer 111 in the first direction. In addition, the thickness of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111, and may refer to the average dimension of the dielectric layer 111 in the first direction.

[0037] The average dimension of the dielectric layer 111 in the first direction may be measured by using an image obtained by scanning a cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) having a magnification of 10,000 times. More specifically, the average dimension of a dielectric layer 111 in the first direction may represent an average value calculated by measuring the dimensions in the first direction at 10 points spaced apart from each other at equal distances in the second direction of a dielectric layer 111 in the scanned image. The 10 points spaced apart from each other at equal distances may be specified in the capacitance forming portion. In addition, when the average dimension measurement is extended to 10 dielectric layers 111 to obtain an average value, the average dimension of the dielectric layer 111 in the first direction may be more generalized.

[0038] The inner electrode layers 121 and 122 may be alternately stacked with the dielectric layer 111.

[0039] The inner electrode layers 121 and 122 may include inner electrodes 121a and 122a and dummy electrodes 121b and 122b that are spaced apart from the inner electrodes 121a and 122a and do not form a capacitance.

[0040] In an embodiment, unless otherwise specified, the description of the inner electrode layers 121 and 122 may include the description of the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b.

[0041] The inner electrode layers 121 and 122 may include a first inner electrode layer 121 and a second inner electrode layer 122. However, the embodiments are not limited thereto, and the inner electrode layer may further include a third inner electrode layer and a fourth inner electrode layer, which will be described in more detail later.

[0042] The inner electrode layers 121 and 122 may include inner electrodes 121a and 122a and dummy electrodes 121b and 122b spaced apart from the inner electrodes 121a and 122a. More specifically, the first inner electrode layer 121 may include a first inner electrode 121a and a first dummy electrode 121b spaced apart from the first inner electrode 121a, and the second inner electrode layer 122 may include a second inner electrode 122a and a second dummy electrode 122b spaced apart from the second inner electrode 122a.

[0043] In other words, the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b may be electrically insulated from each other. That is, the first inner electrode 121a may be electrically insulated from the first dummy electrode 121b, and the second inner electrode 122a may be electrically insulated from the second dummy electrode 122b.

[0044] More specifically, the first inner electrode layer 121 may be spaced apart from the fourth surface 4 and may be exposed to the third surface 3, and the second inner electrode layer 122 may be spaced apart from the third surface 3 and may be exposed to the fourth surface 4. In other words, the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b may be exposed to at least the same surface of the main body 110. That is, the first inner electrode 121a and the first dummy electrode 121b may be exposed to the same surface of the main body 110, and the second inner electrode 122a and the second dummy electrode 122b may be exposed to the same surface of the main body 110.

[0045] The inner electrodes 121a and 122a may include main portions 121a-1 and 122a-1 and lead portions 121a-2 and 122a-2. The main portions 121a-1 and 122a-1 form a capacitance, and the lead portions 121a-2 and 122a-2 do not form a capacitance. They extend from the main portions 121a-1 and 122a-1, are exposed to one surface of the main body 110 in the second direction, and are connected to the outer electrodes 131 and 132.

[0046] More specifically, the first inner electrode 121a may include a first main portion 121a-1 and a first lead portion 121a-2. The first main portion 121a-1 forms a capacitance, the first lead portion 121a-2 does not form a capacitance and extends from the first main portion 121a-1, is exposed to the third surface 3 and is connected to the first outer electrode 131. The second inner electrode 122a may include a second main portion 122a-1 and a second lead portion 122a-2. The second main portion 122a-1 forms a capacitance, the second lead portion 122a-2 does not form a capacitance and extends from the second main portion 122a-1, is exposed to the fourth surface 4 and is connected to the second outer electrode 132.

[0047] The lead portions 121a-2 and 122a-2 may be disposed adjacent to one surface of the fifth surface 5 and the sixth surface 6, respectively.

[0048] More specifically, the first lead-out portion 121a-2 may be disposed adjacent to the sixth surface 6, and the second lead-out portion 122a-2 may be disposed adjacent to the fifth surface 5. However, embodiments thereof are not limited thereto, and the first lead-out portion 121a-2 and the second lead-out portion 122a-2 may be disposed adjacent to the fifth surface 5, or the first lead-out portion 121a-2 may be disposed adjacent to the sixth surface 6, the second lead-out portion 122a-2 may be disposed adjacent to the fifth surface 5, or the first lead-out portion 121a-2 and the second lead-out portion 122a-2 may be disposed adjacent to the sixth surface 6, or the first lead-out portion 121a-2 may be disposed adjacent to the fifth surface 5, the second lead-out portion 122a-2 may be disposed adjacent to the sixth surface 6.

[0049] Here, the configuration in which the lead-out portions 121a-2 and 122a-2 are disposed adjacent to one of the fifth surface 5 and the sixth surface 6 may represent a case where the center of the lead-out portions 121a-2 and 122a-2 in the third direction may be set closer to one of the fifth surface 5 and the sixth surface 6 than the center of the main portions 121a-1 and 122a-1 in the third direction, or a case where the center of the lead-out portions 121a-2 and 122a-2 in the third direction may be set closer to one of the fifth surface 5 and the sixth surface 6 than the center of the dielectric layer 111 in the third direction. However, embodiments thereof are not limited thereto. The "center of the lead-out portion" may represent the center of the lead-out portions 121a-2 and 122a-2 in the third direction, and when it is difficult to clearly determine the center, the "center" may represent the area center of the lead-out portions 121a-2 and 122a-2.

[0050] Here, the dimensions of the main portions 121a-1 and 122a-1 in the second direction and the third direction may be substantially constant.

[0051] More specifically, the dimension of the first main portion 121a-1 in the second direction may be substantially constant, and the dimension of the first main portion 121a-1 in the third direction may be substantially constant. The dimension of the second main portion 122a-1 in the second direction may be substantially constant, and the dimension of the second main portion 122a-1 in the third direction may be substantially constant.

[0052] In an embodiment, the configuration in which the dimensions are substantially constant may represent that the maximum dimension and the minimum dimension may have values within an error range of plus or minus 10% of their average value, and the "dimension" may include the dimension of the component in the first direction (i.e., thickness), the dimension of the component in the second direction (i.e., length), and the dimension of the component in the third direction (i.e., width).

[0053] The dimension of at least a part of the lead portions 121a-2 and 122a-2 in the third direction may be smaller than the dimension of the main portions 121a-1 and 122a-1 in the third direction.

[0054] In other words, the dimension of at least a part of the first lead portion 121a-2 in the third direction may be smaller than the dimension of the first main portion 121a-1 in the third direction, and the dimension of at least a part of the second lead portion 122a-2 in the third direction may be smaller than the dimension of the second main portion 122a-1 in the third direction.

[0055] For example, the lead portions 121a-2 and 122a-2 may include at least a part having a dimension smaller than the dimension of the main portions 121a-1 and 122a-1 in the third direction. For example, the lead portions 121a-2 and 122a-2 may include at least a part whose dimension in the third direction gradually decreases in a direction away from the main portions 121a-1 and 122a-1 along the second direction, or may include at least a part whose dimension in the third direction gradually increases in a direction away from the surfaces of the third surface 3 and the fourth surface 4 that expose the lead portions 121a-2 and 122a-2 along the second direction.

[0056] Therefore, the lead portions 121a-2 and 122a-2 may be exposed to one of the third surface 3 and the fourth surface 4 at a position adjacent to one of the fifth surface 5 and the sixth surface 6.

[0057] More specifically, the first lead portion 121a-2 may be exposed to the third surface 3 at a position adjacent to the fifth surface 5, and the second lead portion 122a-2 may be exposed to the fourth surface 4 at a position adjacent to the sixth surface 6.

[0058] The dummy electrodes 121b and 122b may be spaced apart from one of the third surface 3 and the fourth surface 4 and may be exposed to the other surface, and are respectively connected to the external electrodes 131 and 132.

[0059] More specifically, the first dummy electrode 121b may be spaced apart from the fourth surface 4, exposed to the third surface 3 and connected to the first external electrode 131, and the second dummy electrode 122b may be spaced apart from the third surface 3, exposed to the fourth surface 4 and connected to the second external electrode 132.

[0060] In this case, at least a part of the dummy electrodes 121b and 122b may overlap with the internal electrodes 121a and 122a in the second direction.

[0061] More specifically, at least a part of the first dummy electrode 121b may overlap with the first internal electrode 121a in the second direction, and at least a part of the second dummy electrode 122b may overlap with the second internal electrode 122a in the second direction.

[0062] For example, dummy electrodes 121b and 122b may be provided in at least a part of a region where the dimensions of lead portions 121a-2 and 122a-2 in a third direction are smaller than the dimensions of main portions 121a-1 and 122a-1 in the third direction, such that at least a part of the dummy electrodes 121b and 122b may overlap with the inner electrodes 121a and 122a in a second direction, and more specifically, at least a part of the dummy electrodes 121b and 122b may overlap with the main portions 121a-1 and 122a-1 in the second direction.

[0063] Since at least a part of the dummy electrodes 121b and 122b overlaps with the inner electrodes 121a and 122a in the second direction, the warpage strength reduced due to the reduction in the dimensions of the lead portions 121a-2 and 122a-2 in the third direction can be compensated, and the step difference can be reduced, thereby improving the mechanical strength of the multilayer electronic component 100.

[0064] The dummy electrodes 121b and 122b of one inner electrode layer 121 and 122 may not overlap with the inner electrodes 121a and 122a of the other inner electrode layer 121 and 122 in a first direction.

[0065] More specifically, the first dummy electrode 121b may not overlap with the second inner electrode 122a in the first direction, and the second dummy electrode 122b may not overlap with the first inner electrode 121a in the first direction. More specifically, the first dummy electrode 121b may not overlap with the second main portion 122a-1 in the first direction, and the second dummy electrode 122b may not overlap with the first main portion 121a-1 in the first direction.

[0066] Since the dummy electrodes 121b and 122b of one inner electrode layer 121 and 122 do not overlap with the inner electrodes 121a and 122a of the other inner electrode layer 121 and 122 in the first direction, even when the moisture-proof reliability of the dummy electrodes 121b and 122b deteriorates due to external moisture penetration, the capacitance or reliability of the multilayer electronic component 100 may not be reduced.

[0067] That is, when the lead portions 121a-2 and 122a-2 are exposed to one of the third surface 3 and the fourth surface 4 at a position adjacent to one of the fifth surface 5 and the sixth surface 6, the dummy electrodes 121b and 122b may be exposed to one of the third surface 3 and the fourth surface 4 at a position adjacent to one of the sixth surface 6 and the fifth surface 5 where the lead portions 121a-2 and 122a-2 are not provided.

[0068] For example, the first lead portion 121a-2 may be exposed to the third surface 3 at a position adjacent to the fifth surface 5, and the first dummy electrode 121b may be exposed to the third surface 3 at a position adjacent to the sixth surface 6. The second lead portion 122a-2 may be exposed to the fourth surface 4 at a position adjacent to the fifth surface 5, and the second dummy electrode 122b may be exposed to the fourth surface 4 at a position adjacent to the sixth surface 6.

[0069] Each of the dummy electrodes 121b and 122b may be disposed on one of two opposite sides of the corresponding one of the lead portions 121a-2 and 122a-2 in the third direction.

[0070] More specifically, the first dummy electrode 121b may be disposed on one of two opposite sides of the first lead portion 121a-2 in the third direction, and the second dummy electrode 122b may be disposed on one of two opposite sides of the second lead portion 122a-2 in the third direction.

[0071] For example, when the first lead portion 121a-2 is disposed at a position adjacent to the fifth surface 5 and exposed to the third surface 3, the first dummy electrode 121b may be disposed at a position closer to the sixth surface 6 than the first lead portion 121a-2 and exposed to the third surface 3, and may not be disposed at a position closer to the fifth surface 5 than the first lead portion 121a-2.

[0072] The dummy electrodes 121b and 122b may be spaced apart from the inner electrodes 121a and 122a and may include regions formed along the inner electrodes 121a and 122a.

[0073] Referring to Figure 3A and Figure 3B as an example, it is shown that when the lead portions 121a-2 and 122a-2 extend from the main portions 121a-1 and 122a-1 and are exposed to one of the third surface 3 and the fourth surface 4, the dimensions of the lead portions 121a-2 and 122a-2 in the third direction may gradually decrease in a direction away from the main portions 121a-1 and 122a-1 along the second direction, and the dimensions of the lead portions 121a-2 and 122a-2 in the third direction may gradually increase in a direction away from the one of the third surface 3 and the fourth surface 4 along the second direction. In this case, it is shown that the dimensions of the dummy electrodes 121b and 122b in the third direction may gradually increase in a direction away from the one of the third surface 3 and the fourth surface 4 (i.e., the surface exposing the dummy electrodes 121b and 122b) along the second direction, and the dummy electrodes 121b and 122b may include regions having a substantially constant spacing distance from the inner electrodes 121a and 122a and regions where the dummy electrodes 121b and 122b are formed along the inner electrodes 121a and 122a.

[0074] As described above, by providing dummy electrodes 121b and 122b in regions where the sizes of the inner electrodes 121a and 122a are reduced, the reduced warpage strength of these regions can be compensated, and by reducing the step difference, the mechanical properties of the multilayer electronic component 100 can be improved and the reliability of the multilayer electronic component 100 can be improved.

[0075] At least a part of the region where the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b are spaced apart from each other may have a substantially constant size, and preferably, the size of the region where the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b are spaced apart from each other may be substantially constant.

[0076] As used herein, the expression "substantially constant size" may mean that the gap between the inner electrode and the dummy electrode is constant as would be understood by those skilled in the art, and allows for approximations, inaccuracies, and limitations in measurements in relevant cases. In one or more aspects, the terms "substantially", "about", and "approximate" may provide an industry-recognized tolerance for the correlation between their corresponding terms and / or items, such as a tolerance of ±1%, ±5%, or ±10% of the actual value, or other suitable tolerances.

[0077] The region where the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b are spaced apart from each other may be in contact with at least one of the third surface 3 and the fourth surface 4, and the size of the portion of the region where the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b are spaced apart from each other that is in contact with at least one of the third surface 3 and the fourth surface 4 may be 0.004 times or more and 0.15 times or less the size of the main portions 121a-1 and 122a-1 in the third direction. For example, when the average size of the main portions 121a-1 and 122a-1 in the third direction is defined as W1, and the size of the portion of the region where the inner electrodes 121a and 122a and the dummy electrodes 121b and 122b are spaced apart from each other that is in contact with at least one of the third surface 3 and the fourth surface 4 is defined as W4, 0.004×W1≤W4≤0.15×W1 can be satisfied, which will be described in more detail later.

[0078] In an embodiment, as Figure 5A and Figure 5B shown in, the dummy electrodes 321b and 322b may be further exposed to at least one of the fifth surface 5 and the sixth surface 6.

[0079] For example, the first dummy electrode 321b may be further exposed to the sixth surface 6, and the second dummy electrode 322b may be further exposed to the sixth surface 6. However, embodiments are not limited thereto, and the first dummy electrode may be further exposed to the fifth surface 5, and the second dummy electrode may be further exposed to the fifth surface 5; or the first dummy electrode may be further exposed to the sixth surface 6, and the second dummy electrode may be further exposed to the fifth surface 5; or the first dummy electrode may be further exposed to the fifth surface 5, and the second dummy electrode may be further exposed to the sixth surface 6.

[0080] In this case, the outer electrode may be provided to cover the exposed portions of the dummy electrodes 321b and 322b.

[0081] More specifically, when the first dummy electrode 321b is exposed to the third surface 3 and one of the fifth surface 5 and the sixth surface 6, the first outer electrode may be provided on the third surface 3 and may extend from the third surface 3 to at least one of the fifth surface 5 and the sixth surface 6, and may cover the exposed portion of the first dummy electrode 321b. When the second dummy electrode 322b is exposed to the fourth surface 4 and one of the fifth surface 5 and the sixth surface 6, the second outer electrode may be provided on the fourth surface 4 and may extend from the fourth surface 4 to at least one of the fifth surface 5 and the sixth surface 6, and may cover the exposed portion of the second dummy electrode 322b.

[0082] Here, the configuration in which the outer electrode covers the exposed portions of the dummy electrodes 321b and 322b may mean that the outer electrode may completely cover the dummy electrodes 321b and 332b exposed to one of the fifth surface 5 and the sixth surface 6 of the main body, and when the multilayer electronic component is observed with the naked eye, the exposed portions of the dummy electrodes 321b and 322b may not be visible. However, embodiments are not limited thereto. For example, when the length in the second direction of the region where the second dummy electrode 322b is exposed to the sixth surface 6 is defined as L1, the length of the portion of the second outer electrode provided on the sixth surface 6 and covering the second dummy electrode 322b exposed to the sixth surface 6 may be greater than L1, and preferably, may be greater than or equal to 1.05×L1.

[0083] Since the outer electrode is provided to cover the exposed portions of the dummy electrodes 321b and 322b, external moisture penetration can be effectively prevented, and the moisture-proof reliability of the multilayer electronic component can be improved.

[0084] Reference will be made to Figure 7The second inner electrode layer 322 according to the embodiment will be described in more detail by way of example, but the embodiment is not limited thereto, and the description of the second inner electrode layer can be equally applied to the first inner electrode layer, and in the case where a third inner electrode layer and a fourth inner electrode layer are included, the description can be equally applied to the third inner electrode layer and the fourth inner electrode layer.

[0085] First, the average size of the main body in the second direction may be defined as L, and the average size of the main body in the third direction may be defined as W. Here, the average sizes of the main body in the second and third directions may correspond to the average sizes of the dielectric layer in the second and third directions.

[0086] In this case, when the average size of the second main portion 322a-1 in the third direction is defined as W1, the average size W1 of the second main portion 322a-1 in the third direction may satisfy 0.4×W ≤ W1 ≤ 0.95×W. By having the above dimensions, sufficient capacitance can be achieved, and deterioration of reliability caused by external moisture penetration or external stress may not occur.

[0087] When the size of the region of the second lead portion 322a-2 exposed to the fourth surface 4 in the third direction is defined as W2, the size W2 of the region of the second lead portion 322a-2 exposed to the fourth surface 4 in the third direction may satisfy 0.5×W1 ≤ W2 ≤ 0.76×W1. By having the above dimensions, sufficient electrical connectivity between the second lead portion 322a-2 and the second outer electrode can be ensured, and deterioration of reliability caused by a reduction in warpage strength may not occur.

[0088] When the size of the region of the second dummy electrode 322b exposed to the fourth surface 4 in the third direction is defined as W3, the size W3 of the region of the second dummy electrode 322b exposed to the fourth surface 4 in the third direction may satisfy 0.28×W ≤ W3 ≤ 0.5×W. By having the above dimensions, mechanical properties may not be deteriorated due to a reduction in warpage strength, and thus cracks or delamination are less likely to occur.

[0089] In this case, when the second dummy electrode 322b is exposed to the sixth surface 6, and the size of the region of the second dummy electrode 322b exposed to the sixth surface 6 in the second direction is defined as L1, the size of the portion of the second outer electrode provided on the sixth surface 6 in the second direction may be greater than or equal to L1, and preferably, may be greater than or equal to 1.05×L1. In other words, the second outer electrode is provided to completely cover the second dummy electrode 322b exposed to the sixth surface 6, thereby suppressing the path of external moisture penetration, compensating for the step difference, and improving the warpage strength.

[0090] The region where the second internal electrode 322a and the second dummy electrode 322b are spaced apart from each other may have a substantially constant size. When the distance between the region where the second lead-out portion 322a-2 is exposed to the fourth surface 4 and the region where the second dummy electrode 322b is exposed to the fourth surface 4 is defined as W4, 0.004×W1≤W4≤0.15×W1 can be satisfied. By having the above size, electrical insulation can be achieved between the second internal electrode 322a and the second dummy electrode 322b, and the warpage strength can be improved.

[0091] The main body 110 can be formed by alternately laminating ceramic green sheets printed with conductive paste for the first internal electrode layer 121 and ceramic green sheets printed with conductive paste for the second internal electrode layer 122 to form a laminate, and then firing the laminate.

[0092] The materials for forming the internal electrode layers 121 and 122 are not limited to any specific examples, and materials with excellent conductivity can be used. For example, the internal electrode layers 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0093] In addition, the internal electrode layers 121 and 122 can be formed by printing conductive paste for the internal electrode (including one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys) on the ceramic green sheet. The screen printing method or the gravure printing method can be used as the method for printing the conductive paste for the internal electrode, but the embodiments are not limited thereto.

[0094] The thickness of the internal electrode layers 121 and 122 is not limited to any specific examples.

[0095] To ensure the reliability of the multilayer electronic component 100 in a high-voltage environment, the thickness of the internal electrode layers 121 and 122 can be less than or equal to 3.0 μm. In addition, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the internal electrode layers 121 and 122 can be less than or equal to 1.0 μm. To easily achieve ultra-miniaturization and high capacitance, the thickness of the internal electrode layers 121 and 122 can be less than or equal to 0.6 μm, and more preferably, less than or equal to 0.4 μm.

[0096] In addition, the thickness of the internal electrode layers 121 and 122 can represent the size of the internal electrode layers 121 and 122 in the first direction. Furthermore, the thickness of the internal electrode layers 121 and 122 can represent the average thickness of the internal electrode layers 121 and 122, and can represent the average size of the internal electrode layers 121 and 122 in the first direction.

[0097] The average size of the inner electrode layers 121 and 122 in the first direction can be measured by using an image obtained by scanning cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) having a magnification of 10,000 times. More specifically, the average size of one of the inner electrode layers 121 or 122 in the first direction can be represented as an average value calculated by measuring the size in the first direction at 10 points spaced apart from each other at equal distances in the second direction of one of the inner electrode layers 121 or 122 in the scanned image. Ten points spaced apart from each other at equal distances can be specified in the capacitance forming portion. In addition, when the average value is obtained by extending the measurement of the average size to 10 inner electrode layers 121 and 122, the average size of the inner electrode layers 121 and 122 in the first direction can be made more general.

[0098] In an embodiment, the average thickness of at least one of the plurality of dielectric layers 111 may be greater than twice the average thickness of at least one of the plurality of inner electrode layers 121 and 122.

[0099] In other words, the average thickness of one dielectric layer 111 may be greater than twice the average thickness of one of the inner electrode layers 121 or 122. Preferably, the average thickness of the plurality of dielectric layers 111 may be greater than twice the average thickness of the plurality of inner electrode layers 121 and 122.

[0100] Generally, for high-voltage electronic components, the main problem may be a reliability problem due to a reduction in the breakdown voltage (BDV) under a high-voltage environment.

[0101] Therefore, in order to prevent a reduction in the breakdown voltage under a high-voltage environment, by increasing the average thickness of the dielectric layer 111 to be greater than twice the average thickness of the inner electrode layers 121 and 122, the thickness of the dielectric layer as the distance between the inner electrode layers can be increased, thereby improving the breakdown voltage characteristics.

[0102] When the average thickness of the dielectric layer 111 is less than or equal to twice the average thickness of the inner electrode layers 121 and 122, the thickness of the dielectric layer as the distance between the inner electrode layers may be thin, the breakdown voltage may be reduced, and a short circuit may occur between the inner electrode layers.

[0103] The main body 110 may include covering portions 112 and 113 provided on two surfaces of the capacitance forming portion in the first direction.

[0104] Specifically, the main body 110 may include a first covering portion 112 disposed on one surface of the capacitor forming portion in the first direction and a second covering portion 113 disposed on the other surface of the capacitor forming portion in the first direction. More specifically, the main body 110 may include an upper covering portion 112 disposed on the upper portion of the capacitor forming portion in the first direction and a lower covering portion 113 disposed on the lower portion of the capacitor forming portion in the first direction.

[0105] The upper covering portion 112 and the lower covering portion 113 may be formed by laminating a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming portion in the first direction, respectively, and may prevent damage to the inner electrode layers 121 and 122 due to physical stress and / or chemical stress.

[0106] The upper covering portion 112 and the lower covering portion 113 do not include the inner electrode layers 121 and 122 and may include the same material as that of the dielectric layer 111. That is, the upper covering portion 112 and the lower covering portion 113 may include a ceramic material, for example, may include a barium titanate (BaTiO3)-based ceramic material.

[0107] The thicknesses of the covering portions 112 and 113 may not be limited to any specific example.

[0108] However, in order to easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the thicknesses of the covering portions 112 and 113 may be less than or equal to 100 μm, preferably less than or equal to 30 μm. More preferably, in ultra-small products, the thickness may be less than or equal to 20 μm.

[0109] Here, the thicknesses of the covering portions 112 and 113 may refer to the dimensions of the covering portions 112 and 113 in the first direction. In addition, the thicknesses of the covering portions 112 and 113 may refer to the average thicknesses of the covering portions 112 and 113 and may refer to the average dimensions of the covering portions 112 and 113 in the first direction.

[0110] The average dimensions of the covering portions 112 and 113 in the first direction may be measured by using an image obtained by scanning a cross-section of the main body 110 in the first direction and the second direction at a magnification of 10,000 times with a scanning electron microscope (SEM). More specifically, the average dimensions of the covering portions 112 and 113 in the first direction may represent an average value calculated by measuring the dimensions in the first direction at 10 points spaced apart from each other at equal distances in the second direction of one covering portion in the scanned image.

[0111] In addition, the average dimensions of the covering portions in the first direction measured by the above method may be substantially the same as the average dimensions of the covering portions in the first direction measured in a cross-section of the main body 110 in the first direction and the third direction.

[0112] In an embodiment, the multilayer electronic component 100 may have two external electrodes 131 and 132, but the number or shape of the external electrodes 131 and 132 may vary according to the form of the internal electrode layers 121 and 122 or other purposes.

[0113] The external electrodes 131 and 132 may be provided on the body 110 and may be connected to the internal electrode layers 121 and 122.

[0114] More specifically, the external electrodes 131 and 132 may be respectively provided on the third surface 3 and the fourth surface 4 of the body 110, and may include a first external electrode 131 and a second external electrode 132 respectively connected to the first internal electrode layer 121 and the second internal electrode layer 122. That is, the first external electrode 131 may be provided on the third surface 3 of the body 110 and may be connected to the first internal electrode layer 121, and the second external electrode 132 may be provided on the fourth surface 4 of the body 110 and may be connected to the second internal electrode layer 122.

[0115] The first external electrode 131 may be provided on the third surface 3 and may be connected to the first internal electrode 121a through a first lead-out portion 121a-2 exposed on the third surface 3, and connected to a first dummy electrode 121b exposed on the third surface 3, and the second external electrode 132 may be provided on the fourth surface 4 and may be connected to the second internal electrode 122a through a second lead-out portion 122a-2 exposed on the fourth surface 4, and connected to a second dummy electrode 122b exposed on the fourth surface 4.

[0116] In addition, the external electrodes 131 and 132 may extend to a part of the first surface 1 and a part of the second surface 2 of the body 110, and / or may extend to a part of the fifth surface 5 and a part of the sixth surface 6 of the body 110. That is, the first external electrode 131 may be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6 of the body 110 and may be provided on the third surface 3 of the body 110, and the second external electrode 132 may be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6 of the body 110 and may be provided on the fourth surface 4 of the body 110.

[0117] In this case, when the dummy electrodes 321b and 322b are exposed on at least one of the fifth surface 5 and the sixth surface 6, the first external electrode and the second external electrode may cover the dummy electrodes 321b and 322b exposed through at least one of the fifth surface 5 and the sixth surface 6.

[0118] The outer electrodes 131 and 132 can be formed of any conductive material such as metal, and the specific material can be determined considering electrical properties and structural stability, and the outer electrodes 131 and 132 can have a multilayer structure.

[0119] For example, the outer electrodes 131 and 132 can include an electrode layer provided on the main body 110 and a plating layer provided on the electrode layer.

[0120] For a more specific example of the electrode layer, the electrode layer can include a first electrode layer and / or a second electrode layer. The first electrode layer is a fired electrode including a first conductive metal and glass, and the second electrode layer is a resin-based electrode including a second conductive metal and resin.

[0121] Here, the conductive metal included in the first electrode layer can be referred to as the first conductive metal, and the conductive metal included in the second electrode layer can be referred to as the second conductive metal. In this case, the first conductive metal and the second conductive metal can be the same as or different from each other, and when the first conductive metal and the second conductive metal include multiple conductive metals, some of the multiple conductive metals can be the same as each other, but the embodiments are not limited thereto.

[0122] The electrode layer can be formed by sequentially forming a fired electrode and a resin-based electrode on the main body 110.

[0123] As an example, an electrode layer including only a resin-based electrode can be formed by transferring a sheet including a conductive metal onto the main body 110, or an electrode layer including a fired electrode and a resin-based electrode can be formed by transferring a sheet including a conductive metal onto the fired electrode.

[0124] A material having excellent electrical conductivity can be used as the conductive metal included in the electrode layer, and the conductive metal can include, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys, but the embodiments are not limited thereto.

[0125] In an embodiment, the electrode layer can have a bilayer structure including a first electrode layer and a second electrode layer. Therefore, the outer electrodes 131 and 132 can include a first electrode layer and a second electrode layer. The first electrode layer includes a first conductive metal and glass, and the second electrode layer is provided on the first electrode layer and includes a second conductive metal and resin.

[0126] The first electrode layer can improve the adhesion to the main body 110 by including glass, and the second electrode layer can improve the warpage strength by including resin.

[0127] The first conductive metal included in the first electrode layer is not limited to any specific example, as long as the material of the first conductive metal can be electrically connected to the inner electrode layers 121 and 122 to form a capacitor. For example, the first conductive metal may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0128] The first electrode layer can be formed by coating a conductive paste prepared by adding a glass frit to the first conductive metal particles and then firing the conductive paste.

[0129] The second conductive metal included in the second electrode layer can be used to electrically connect to the first electrode layer.

[0130] The second conductive metal included in the second electrode layer is not limited to any specific example, as long as the material of the second conductive metal can be electrically connected to the electrode layer, and may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0131] The second conductive metal included in the second electrode layer may include one or more of spherical particles and flaky particles. In other words, the second conductive metal may include only flaky particles or only spherical particles, or may be a mixture of flaky particles and spherical particles. Here, the spherical particles may include a shape that is not completely spherical. For example, a shape in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is less than or equal to 1.45. The flaky particles may refer to particles having a flat and elongated shape and are not limited to any specific example. For example, the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) may be greater than or equal to 1.95. The lengths of the major axis and the minor axis of the spherical particles and the flaky particles can be measured from an image obtained by scanning a cross-section in the first and second directions of the central portion in the third direction of the multilayer electronic component using a scanning electron microscope (SEM).

[0132] The resin included in the second electrode layer can ensure adhesiveness and can function to absorb shock. The resin included in the second electrode layer is not limited to any specific example, as long as the material has adhesiveness and shock absorbency and can be mixed with the second conductive metal particles to prepare a paste, and may include, for example, an epoxy resin.

[0133] In addition, the second electrode layer may include a plurality of second conductive metal particles, an intermetallic compound, and a resin. By including the intermetallic compound, the electrical connectivity with the first electrode layer can be improved. The intermetallic compound improves the electrical connectivity by connecting the plurality of second conductive metal particles, and can surround the plurality of second conductive metal particles and connect the second conductive metal particles to each other.

[0134] In this case, the intermetallic compound may include a metal having a melting point lower than the curing temperature of the resin and a high melting point metal having a melting point higher than the melting point of the metal. That is, the paste for forming the second electrode layer includes metal particles having a melting point lower than the curing temperature of the resin and high melting point metal particles having a melting point higher than the melting point of the metal particles. The metal particles having a melting point lower than the curing temperature of the resin can melt during the drying and curing process, can form an intermetallic compound with a part of the high melting point metal particles, and can surround the remaining high melting point metal particles. In this case, the intermetallic compound may include a low melting point metal, preferably, may include a low melting point metal having a melting point lower than 300 °C.

[0135] For example, the paste for forming the second electrode layer may include Sn having a melting point of 213 °C to 220 °C. During the drying and curing process, the Sn particles can melt, and the molten Sn can wet, by capillary action, the high melting point metal particles such as Ag, Ni, or Cu (included in the paste for forming the second electrode layer), can react with a part of the Ag, Ni, or Cu metal particles, and can form an intermetallic compound such as Ag3Sn, Ni3Sn4, Cu6Sn5, or Cu3Sn. The Ag, Ni, or Cu that did not participate in the reaction can be retained in the form of conductive metal particles (i.e., form the plurality of second conductive metal particles in the second electrode layer).

[0136] Therefore, the plurality of second conductive metal particles may include one or more of Ag, Ni, and Cu, and the intermetallic compound may include one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0137] The plating layer can improve the mounting characteristics.

[0138] The type of the plating layer is not limited to any specific example, and can be a single-layer plating layer including one or more of nickel (Ni), tin (Sn), palladium (Pd), and their alloys, or a plating layer that can form multiple layers.

[0139] For a more specific example of the plating layer, the plating layer can be a Ni plating layer or a Sn plating layer, or can be in a form in which a Ni plating layer and a Sn plating layer can be sequentially formed on the electrode layer, or can be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer can be sequentially formed on the electrode layer. In addition, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0140] The size of the multilayer electronic component 100 may not be limited to any specific example.

[0141] However, in order to achieve both miniaturization and high capacitance, it may be necessary to increase the number of layers by reducing the thickness of the dielectric layer and the internal electrode layer, such that the effects described in the embodiments can be significant in the multilayer electronic component 100 having a size of 3216 (length × width: 3.2 mm × 1.6 mm) or smaller.

[0142] Hereinafter, in order to facilitate the understanding of the present disclosure, embodiments will be described in more detail, but the scope of the present disclosure is not limited thereto.

[0143] <First Embodiment> Reference will be made to Figure 1 , Figure 3A and Figure 3BA multi-layer electronic component 100 according to the first embodiment will be described in more detail. The multi-layer electronic component 100 according to the first embodiment may include: a main body 110 including a dielectric layer 111 and inner electrode layers 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, and including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in a third direction; and first and second external electrodes 131 and 132 respectively provided on the third surface 3 and the fourth surface 4. The inner electrode layers 121 and 122 may include a first inner electrode layer 121 and a second inner electrode layer 122. The first inner electrode layer 121 may include: a first inner electrode 121a including a first main portion 121a-1 and a first lead portion 121a-2 extending from the first main portion 121a-1, exposed to the third surface 3 and connected to the first external electrode 131; and a first dummy electrode 121b spaced apart from the first inner electrode 121a, exposed to the third surface 3 and connected to the first external electrode 131. The second inner electrode layer 122 may include: a second inner electrode 122a including a second main portion 122a-1 and a second lead portion 122a-2 extending from the second main portion 122a-1, exposed to the fourth surface 4 and connected to the second external electrode 132; and a second dummy electrode 122b spaced apart from the second inner electrode 122a, exposed to the fourth surface 4 and connected to the second external electrode 132. The size of at least a part of the first lead portion 121a-2 in the third direction may be smaller than the size of the first main portion 121a-1 in the third direction, and the size of at least a part of the second lead portion 122a-2 in the third direction may be smaller than the size of the second main portion 122a-1 in the third direction. The first dummy electrode 121b may not overlap the second inner electrode 122a in the first direction, and the second dummy electrode 122b may not overlap the first inner electrode 121a in the first direction. At least a part of the first dummy electrode 121b may overlap the first inner electrode 121a in the second direction, and at least a part of the second dummy electrode 122b may overlap the second inner electrode 122a in the second direction.

[0144] In addition, the first lead portion 121a-2 may be disposed adjacent to the fifth surface 5, and the second lead portion 122a-2 may be disposed adjacent to the fifth surface 5.

[0145] In addition, the first dummy electrode 121b may be disposed closer to the sixth surface 6 than the first lead portion 121a-2, and the second dummy electrode 122b may be disposed closer to the sixth surface 6 than the second lead portion 122a-2.

[0146] In addition, the dimensions of the first main portion 121a-1 and the second main portion 122a-1 in the second direction and the third direction may be substantially constant.

[0147] In addition, the dimensions in the third direction of the exposed portions of the first lead portion 121a-2 and the exposed portions of the second lead portion 122a-2 may be smaller than the average dimensions in the third direction of the first main portion 121a-1 and the second main portion 122a-1, respectively.

[0148] In addition, at least a part of the regions where the first internal electrode 121a and the second internal electrode 122a are spaced apart from the first dummy electrode 121b and the second dummy electrode 122b, respectively, may have substantially constant dimensions.

[0149] The description of the multilayer electronic component 100 according to the first embodiment may be the same as the description indicated above.

[0150] <Variant Example of the First Embodiment> Hereinafter, reference will be made to Figure 5A and Figure 5B to describe a multilayer electronic component according to a variant example of the first embodiment. Descriptions of components identical to those of the multilayer electronic component 100 according to the first embodiment will not be provided, and it will be apparent to those skilled in the art that the omitted descriptions can be easily understood.

[0151] The first internal electrode layer 321 may include a first internal electrode 321a having a first main portion 321a-1 and a first lead portion 321a-2 and a first dummy electrode 321b, and the second internal electrode layer 322 may include a second internal electrode 322a having a second main portion 322a-1 and a second lead portion 322a-2 and a second dummy electrode 322b.

[0152] In the multilayer electronic component according to the variant example of the first embodiment, the first dummy electrode 321b may be further exposed to the sixth surface 6, may be connected to the first external electrode, and may be covered by the first external electrode, and the second dummy electrode 322b may be further exposed to the sixth surface 6, may be connected to the second external electrode, and may be covered by the second external electrode.

[0153] In the multilayer electronic component in the embodiment, since the dummy electrodes 321b and 322b extend in the third direction to be more exposed to the sixth surface 6, the warpage strength of the multilayer electronic component can be improved.

[0154] In addition, the external electrodes cover the exposed dummy electrodes 321b and 322b, thereby improving the moisture-proof reliability.

[0155] <Second Embodiment> Hereinafter, reference will be made to Figure 4A 、 Figure 4B, Figure 4C and Figure 4D Describe a multi-layer electronic component according to a second embodiment. In addition, a description of components that are the same as those of the multi-layer electronic component 100 according to the first embodiment will not be provided, and it will be apparent to those skilled in the art that the omitted description can be easily understood.

[0156] In the multi-layer electronic component according to the second embodiment, the inner electrode layers 221, 222, 223, and 224 may include, in addition to the first inner electrode layer 221 (including the first inner electrode 221a having the first main portion 221a-1 and the first lead portion 221a-2 and the first dummy electrode 221b) and the second inner electrode layer 222 (including the second inner electrode 222a having the second main portion 222a-1 and the second lead portion 222a-2 and the second dummy electrode 222b), a third inner electrode layer 223 and a fourth inner electrode layer 224. The third inner electrode layer 223 may include a third inner electrode 223a and a third dummy electrode 223b. The third inner electrode 223a includes a third main portion 223a-1 and a third lead portion 223a-2 that extends from the third main portion 223a-1 and is exposed to the third surface 3 and connected to the first external electrode. The third dummy electrode 223b is spaced apart from the third inner electrode 223a and is exposed to the third surface 3 and connected to the first external electrode. The fourth inner electrode layer 224 may include a fourth inner electrode 224a and a fourth dummy electrode 224b. The fourth inner electrode 224a includes a fourth main portion 224a-1 and a fourth lead portion 224a-2 that extends from the fourth main portion 224a-1 and is exposed to the fourth surface 4 and connected to the second external electrode. The fourth dummy electrode 224b is spaced apart from the fourth inner electrode 224a and is exposed to the fourth surface 4 and connected to the second external electrode. The dimension of at least a part of the third lead portion 223a-2 in the third direction may be smaller than the dimension of the third main portion 223a-1 in the third direction. The dimension of at least a part of the fourth lead portion 224a-2 in the third direction may be smaller than the dimension of the fourth main portion 224a-1 in the third direction. The third dummy electrode 223b may not overlap with the fourth inner electrode 224a in the first direction, and the fourth dummy electrode 224b may not overlap with the third inner electrode 223a in the first direction. At least a part of the third dummy electrode 223b may overlap with the third inner electrode 223a in the second direction, and at least a part of the fourth dummy electrode 224b may overlap with the fourth inner electrode 224a in the second direction. The first lead portion 221a-2 may be disposed closer to the fifth surface 5 than the third lead portion 223a-2, and the second lead portion 222a-2 may be disposed closer to the fifth surface 5 than the fourth lead portion 224a-2.

[0157] In this case, the first inner electrode layer 221 and the third inner electrode layer 223 may be symmetric with respect to an axis along the second direction in the third direction, and the second inner electrode layer 222 and the fourth inner electrode layer 224 may be symmetric with respect to an axis along the second direction in the third direction.

[0158] Here, a configuration in which a component is symmetric with respect to an axis along the second direction in the third direction may indicate that, based on the center in the third direction, the component is symmetric with respect to an axis along the second direction in the third direction, and may also indicate that, based on a point in the third direction, the component is symmetric with respect to an axis along the second direction in the third direction.

[0159] In addition, the first lead portion 221a-2 may be disposed adjacent to the fifth surface 5, the second lead portion 222a-2 may be disposed adjacent to the fifth surface 5, the third lead portion 223a-2 may be disposed adjacent to the sixth surface 6, and the fourth lead portion 224a-2 may be disposed adjacent to the sixth surface 6.

[0160] The first dummy electrode 221b may be disposed closer to the sixth surface 6 than the first lead portion 221a-2, the second dummy electrode 222b may be disposed closer to the sixth surface 6 than the second lead portion 222a-2, the third dummy electrode 223b may be disposed closer to the fifth surface 5 than the third lead portion 223a-2, and the fourth dummy electrode 224b may be disposed closer to the fifth surface 5 than the fourth lead portion 224a-2.

[0161] Similarly, the dimensions of the third main portion 223a-1 in the second direction and the third direction and the dimensions of the fourth main portion 224a-1 in the second direction and the third direction may be substantially constant.

[0162] In addition, the dimension of the exposed portion of the third lead portion 223a-2 in the third direction may be smaller than the dimension of the third main portion 223a-1 in the third direction, and the dimension of the exposed portion of the fourth lead portion 224a-2 in the third direction may be smaller than the dimension of the fourth main portion 224a-1 in the third direction.

[0163] In addition, at least a part of the region where the third inner electrode 223a and the third dummy electrode 223b are spaced apart from each other may have a substantially constant dimension, and at least a part of the region where the fourth inner electrode 224a and the fourth dummy electrode 224b are spaced apart from each other may have a substantially constant dimension.

[0164] <Variant Example of the Second Embodiment> Hereinafter, reference will be made to Figure 6A 、 Figure 6B 、 Figure 6C and Figure 6DA multilayer electronic component according to a modified example of the second embodiment is described. In addition, descriptions of components identical to those of the multilayer electronic component according to the modified example of the first embodiment and descriptions of components identical to those of the multilayer electronic component according to the second embodiment will not be provided, and it is obvious that those skilled in the art can easily understand the omitted descriptions.

[0165] The internal electrode layers 421, 422, 423 and 424 include: a first internal electrode layer 421, including a first internal electrode 421a having a first main portion 421a-1 and a first lead portion 421a-2 and a first dummy electrode 421b; a second internal electrode layer 422, including a second internal electrode 422a having a second main portion 422a-1 and a second lead portion 422a-2 and a second dummy electrode 422b; a third internal electrode layer 423, including a third internal electrode 423a having a third main portion 423a-1 and a third lead portion 423a-2 and a third dummy electrode 423b; and a fourth internal electrode layer 424, including a fourth internal electrode 424a having a fourth main portion 424a-1 and a fourth lead portion 424a-2 and a fourth dummy electrode 424b.

[0166] In a multilayer electronic component according to a variant example of the second embodiment, the third dummy electrode 423b may be further exposed to the fifth surface 5, may be connected to the first external electrode and may be covered by the first external electrode, and the fourth dummy electrode 424b may be further exposed to the fifth surface 5, may be connected to the second external electrode and may be covered by the second external electrode.

[0167] In the multilayer electronic component in the embodiment, the third dummy electrode 423 b and the fourth dummy electrode 424 b may extend in the third direction to be further exposed to at least one of the fifth surface 5 and the sixth surface 6 , thereby improving the warpage strength of the multilayer electronic component.

[0168] In addition, since the external electrode covers the exposed third dummy electrode 423 b and the exposed fourth dummy electrode 424 b , moisture-proof reliability may be improved.

[0169] <Various Modifications of the First and Second Embodiments> In the following, reference will be made to Figure 8A , Figure 8B and Figure 8C A multilayer electronic component according to the first and second embodiments or a modified example of the first and second embodiments is described. In addition, a description of components that are the same as those of the multilayer electronic component according to the first and second embodiments or a modified example of the first and second embodiments will not be provided, and it is obvious that those skilled in the art can easily understand the omitted description.

[0170] The second inner electrode layers 522, 622, and 722 will be described below.

[0171] First, as Figure 8A shown, the dimension of the second lead-out portion 522a-2 in the third direction may be smaller than the dimension of the second main portion 522a-1 in the third direction. In this case, the dimensions of the second lead-out portion 522a-2 in the second and third directions may be substantially constant. The distance between the second dummy electrode 522b and the second inner electrode 522a may be substantially constant. Therefore, the dimensions of the second dummy electrode 522b in the second and third directions may be substantially constant.

[0172] As another variant example, as Figure 8B shown, the dimension of the second lead-out portion 622a-2 in the third direction may gradually decrease in a direction away from the second main portion 622a-1 along the second direction. However, in a region where the second main portion 622a-1 and the second lead-out portion 622a-2 are in contact with each other, the dimension of the second main portion 622a-1 in the third direction may be larger than the dimension of the second lead-out portion 622a-2 in the third direction. Therefore, the second lead-out portion 622a-2 may include an inclined region, or may include an inclined side. In addition, the second lead-out portion 622a-2 and the second dummy electrode 622b may have inclined edges facing each other. Here, a configuration in which the second lead-out portion 622a-2 and the second dummy electrode 622b have inclined portions may indicate that the inclined portions are substantially not parallel to the third to sixth surfaces. The distance between the second dummy electrode 622b and the second inner electrode 622a may be substantially constant. Therefore, the dimension of the second dummy electrode 622b in the third direction may gradually decrease in a direction away from the fourth surface 4 along the second direction.

[0173] As another variant example, as Figure 8CAs shown, the size of the second lead-out portion 722a-2 in the third direction may be smaller than the size of the second main portion 722a-1 in the third direction. In this case, the second lead-out portion 722a-2 may include a first region and a second region. The size of the first region in the third direction is constant and its size in the third direction is smaller than the size of the second main portion 722a-1 in the third direction. The size of the second region in the third direction is constant and its size in the third direction is smaller than the size of the first region in the third direction. In other words, the second lead-out portion 722a-2 may have a stepped shape, so that its size in the third direction can be reduced. The distance between the second dummy electrode 722b and the second inner electrode 722a may be substantially constant. Therefore, the second dummy electrode 722b may have a stepped shape. The second lead-out portion 722a-2 may have two stepped portions starting from the side edge of the second main portion 722a-1 and the size in the third direction decreases along the second direction. The second dummy electrode 722b may have two stepped portions matching the two stepped portions of the second lead-out portion 722a-2 and the size in the third direction increases along the second direction.

[0174] This variant example is described by taking the second inner electrode layer as an example, and this description can be equally applied to the shape of the first inner electrode layer or the third inner electrode layer and the fourth inner electrode layer.

[0175] According to the foregoing embodiments, the multi-layer electronic component may have improved moisture-proof reliability.

[0176] In addition, the multi-layer electronic component may have improved warpage strength.

[0177] In addition, the multi-layer electronic component may have improved reliability.

[0178] The scope of the present disclosure is not limited to the specific embodiments. More precisely, variants, equivalents, and alternatives included in the disclosed concept and technical scope of this specification can be adopted. Throughout the specification, similar reference numerals are used for similar elements.

[0179] In the embodiments, the term "embodiment" does not refer to the same embodiment and can be provided to describe and emphasize the different features of each embodiment. The proposed embodiments can be implemented without excluding the possibility of combining the features of other embodiments. For example, even if the features described in an embodiment are not described in another embodiment, unless otherwise stated, this description can also be understood as being related to another embodiment.

[0180] The terms used in this disclosure are only used to explain the embodiments and do not limit the embodiments. Unless explicitly described to the contrary, in this disclosure, the singular meaning may include the plural meaning.

[0181] Although the embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and an inner electrode layer alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; as well as The first external electrode and the second external electrode are respectively arranged on the third surface and the fourth surface, Wherein, the inner electrode layer comprises a first inner electrode layer and a second inner electrode layer, The first inner electrode layer includes a first inner electrode and a first dummy electrode, the first inner electrode includes a first main portion and a first lead portion extending from the first main portion, exposed to the third surface and connected to the first outer electrode, the first dummy electrode is spaced apart from the first inner electrode, exposed to the third surface and connected to the first outer electrode, wherein the second inner electrode layer comprises a second inner electrode and a second dummy electrode, the second inner electrode comprises a second main portion and a second lead portion extending from the second main portion, exposed to the fourth surface and connected to the second outer electrode, the second dummy electrode is spaced apart from the second inner electrode, exposed to the fourth surface and connected to the second outer electrode, wherein the size of at least a portion of the first lead portion in the third direction is smaller than the size of the first main portion in the third direction, and the size of at least a portion of the second lead portion in the third direction is smaller than the size of the second main portion in the third direction, wherein the first dummy electrode does not overlap with the second inner electrode in the first direction, and the second dummy electrode does not overlap with the first inner electrode in the first direction, and At least a portion of the first dummy electrode overlaps the first internal electrode in the second direction, and at least a portion of the second dummy electrode overlaps the second internal electrode in the second direction.

2. The multilayer electronic component according to claim 1, wherein The first lead-out portion is disposed adjacent to one of the fifth surface and the sixth surface, and the second lead-out portion is disposed adjacent to one of the fifth surface and the sixth surface.

3. The multilayer electronic component according to claim 1, wherein: The first dummy electrode is provided in one of two opposite sides of the first lead-out portion in the third direction, and The second dummy electrode is provided in one of two opposite sides of the second lead-out portion in the third direction.

4. The multilayer electronic component according to claim 1, wherein: The size of the exposed portion of the first lead portion in the third direction is smaller than the average size of the first main portion in the third direction, and the size of the exposed portion of the second lead portion in the third direction is smaller than the average size of the second main portion in the third direction.

5. The multilayer electronic component according to claim 1, wherein A size of at least a portion of a region where the first internal electrode and the first dummy electrode are spaced apart from each other is substantially constant, and a size of at least a portion of a region where the second internal electrode and the second dummy electrode are spaced apart from each other is substantially constant.

6. The multilayer electronic component according to claim 1, wherein: The first dummy electrode and the second dummy electrode are further exposed to one of the fifth surface and the sixth surface.

7. The multilayer electronic component according to claim 6, wherein: The first external electrode is disposed to cover the exposed portion of the first dummy electrode, and the second external electrode is disposed to cover the exposed portion of the second dummy electrode.

8. The multilayer electronic component according to claim 1, in, The inner electrode layer further comprises a third inner electrode layer and a fourth inner electrode layer, The third inner electrode layer includes a third inner electrode and a third dummy electrode, the third inner electrode includes a third main portion and a third lead portion extending from the third main portion, exposed to the third surface and connected to the first outer electrode, the third dummy electrode is spaced apart from the third inner electrode, exposed to the third surface and connected to the first outer electrode, The fourth inner electrode layer includes a fourth inner electrode and a fourth dummy electrode, the fourth inner electrode includes a fourth main portion and a fourth lead portion extending from the fourth main portion, exposed to the fourth surface and connected to the second outer electrode, the fourth dummy electrode is spaced apart from the fourth inner electrode, exposed to the fourth surface and connected to the second outer electrode, wherein a size of at least a portion of the third lead portion in the third direction is smaller than a size of the third main portion in the third direction, and a size of at least a portion of the fourth lead portion in the third direction is smaller than a size of the fourth main portion in the third direction, wherein the third dummy electrode does not overlap with the fourth internal electrode in the first direction, and the fourth dummy electrode does not overlap with the third internal electrode in the first direction, wherein at least a portion of the third dummy electrode overlaps the third internal electrode in the second direction, and at least a portion of the fourth dummy electrode overlaps the fourth internal electrode in the second direction, and The first lead-out portion is disposed closer to the fifth surface than the third lead-out portion, and the second lead-out portion is disposed closer to the fifth surface than the fourth lead-out portion.

9. The multilayer electronic component according to claim 8, in, The first internal electrode layer and the third internal electrode layer are symmetrical in the third direction with respect to the axis along the second direction, and The second internal electrode layer and the fourth internal electrode layer are symmetrical in the third direction relative to the axis along the second direction.

10. The multilayer electronic component according to claim 8, wherein The first lead-out portion and the second lead-out portion are disposed adjacent to the fifth surface, and the third lead-out portion and the fourth lead-out portion are disposed adjacent to the sixth surface.

11. The multilayer electronic component according to claim 8, wherein Each of the first, second, third, and fourth dummy electrodes is disposed in one side of two opposite sides of a corresponding one of the first, second, third, and fourth lead-out portions in the third direction.

12. The multilayer electronic component according to claim 8, wherein The size of the exposed portion of the first lead portion in the third direction is smaller than the average size of the first main portion in the third direction, the size of the exposed portion of the second lead portion in the third direction is smaller than the average size of the second main portion in the third direction, the size of the exposed portion of the third lead portion in the third direction is smaller than the average size of the third main portion in the third direction, and the size of the exposed portion of the fourth lead portion in the third direction is smaller than the average size of the fourth main portion in the third direction.

13. The multilayer electronic component according to claim 8, wherein: The size of at least a portion of the area where the first inner electrode and the first dummy electrode are spaced apart from each other is substantially constant, the size of at least a portion of the area where the second inner electrode and the second dummy electrode are spaced apart from each other is substantially constant, the size of at least a portion of the area where the third inner electrode and the third dummy electrode are spaced apart from each other is substantially constant, and the size of at least a portion of the area where the fourth inner electrode and the fourth dummy electrode are spaced apart from each other is substantially constant.

14. The multilayer electronic component according to claim 8, wherein The first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode are further exposed to one of the fifth surface and the sixth surface.

15. The multilayer electronic component according to claim 14, wherein The first external electrode is disposed to cover the exposed portion of the first dummy electrode and the exposed portion of the third dummy electrode, and the second external electrode is disposed to cover the exposed portion of the second dummy electrode and the exposed portion of the fourth dummy electrode.

16. The multilayer electronic component according to claim 1, wherein: A size of at least one of the first lead-out portion and the second lead-out portion in the third direction is substantially constant, and a size of at least one of the first dummy electrode and the second dummy electrode in the third direction is substantially constant.

17. The multilayer electronic component according to claim 1, wherein: A size of at least one of the first lead-out portion and the second lead-out portion in the third direction gradually decreases along the second direction in a direction away from the corresponding main portion of the first main portion and the second main portion, and a size of at least one of the first dummy electrode and the second dummy electrode in the third direction gradually increases along the second direction in a direction away from the corresponding main portion of the first main portion and the second main portion, and The first lead portion and the first dummy electrode have inclined edges facing each other.

18. The multilayer electronic component according to claim 1, wherein At least one of the first lead-out portion and the second lead-out portion has two step portions starting from a side edge of a corresponding main portion of the first main portion and the second main portion and having a dimension in the third direction decreasing along a second direction, and At least one of the first dummy electrode and the second dummy electrode has two step portions that match the two step portions of the corresponding one of the first lead-out portion and the second lead-out portion and whose dimension in the third direction increases along the second direction.

19. The multilayer electronic component according to claim 8, wherein: The first and second dummy electrodes are disposed closer to the sixth surface than the first and second lead portions, respectively, and the third and fourth dummy electrodes are disposed closer to the fifth surface than the third and fourth lead portions, respectively.

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