Substrate processing apparatus and substrate processing method

Abstract

The invention provides a substrate processing apparatus and a substrate processing method capable of determining abnormal shape of a wafer. A substrate processing apparatus includes a shape detection module that detects a signal corresponding to a surface shape of a substrate, and a control device that determines a shape abnormality of the substrate.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. Background Art

[0002] There are known substrate processing apparatuses for processing substrates such as wafers. In such a substrate processing apparatus, a wafer is transported to various processing modules and processed by each processing module.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Laid-Open No. 11-251401

[0006] Patent Document 2: Japanese Patent Laid-Open No. 2016-92330

[0007] Patent Document 3: Japanese Patent Laid-Open No. 2018-3085

[0008] Problems to be Solved by the Invention

[0009] A wafer may have shape abnormalities such as notches and deformations (e.g., warpage, twist) on its surface. By processing the wafer by each processing module, shape abnormalities may occur on the surface of the wafer.

[0010] If a wafer having such shape abnormalities is transported, the transfer robot cannot properly transport the wafer, and a transfer error of the wafer may occur. If a wafer having shape abnormalities is processed by a processing module, the wafer may be broken due to the shape abnormalities of the wafer. In the case where such a problem occurs, it is necessary to temporarily stop the substrate processing apparatus, and as a result, the production capacity of the wafer is significantly reduced. Summary of the Invention

[0011] Therefore, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of determining shape abnormalities of a wafer.

[0012] Technical Means for Solving the Technical Problem

[0013] In one aspect, there is provided a substrate processing apparatus including: a processing module that processes a substrate; a transfer robot that transfers the substrate to the processing module; a shape detection module that detects a signal corresponding to the surface shape of the substrate held by the transfer robot; and a control device that determines the shape abnormality of the substrate based on the signal detected by the shape detection module. The shape detection module is configured to be connected to the transfer robot and detect the signal above the transfer robot.

[0014] In one mode, the shape detection module includes: a detection sensor disposed above the substrate held by the transfer robot; and a sensor moving actuator that moves the detection sensor along a movement locus on the surface of the substrate.

[0015] In one mode, the transfer robot is configured to rotate the substrate, and the shape detection module includes: a fixed sensor disposed above a peripheral portion of the substrate held by the transfer robot; a movable sensor capable of moving in a direction parallel to the substrate held by the transfer robot; and a sensor moving actuator that reciprocates the movable sensor from the peripheral portion to the center of the substrate.

[0016] In one mode, the shape detection module is configured to detect the signal when the transfer robot transfers the substrate.

[0017] In one mode, when the shape detection module is defined as a first shape detection module and the transfer robot is defined as a first transfer robot, the first transfer robot is configured to transfer the substrate to a grinding module, and the substrate processing apparatus includes: a second transfer robot that transfers the substrate that has been ground in the grinding module to a cleaning module; and a second shape detection module that is connected to the second transfer robot and detects a signal corresponding to the surface shape of the substrate held by the second transfer robot.

[0018] In one mode, the first shape detection module and the second shape detection module are configured to detect the shape of the same surface of the substrate.

[0019] In one mode, the substrate processing apparatus includes a fluid ejection device disposed on the transfer path of the substrate between the grinding module and the cleaning module, and the fluid ejection device includes a fluid ejection nozzle that ejects compressed fluid onto the surface of the substrate that is the detection target of the second shape detection module.

[0020] In one mode, the control device obtains shape information of the substrate that is the determination target of the shape abnormality based on the signal acquired from the shape detection module, and the control device compares the acquired shape information with a specified determination criterion to determine the shape abnormality.

[0021] In one mode, the control device creates a normal distribution based on a plurality of values calculated from a plurality of signals obtained from the shape detection module in the past, and the control device determines a range of ±Xσ from the average value of the normal distribution as the determination criterion.

[0022] In one mode, a substrate processing method is provided, in which a shape detection module connected to a transfer robot that transfers a substrate to a processing module detects a signal corresponding to the surface shape of the substrate held by the transfer robot above the transfer robot, and determines the shape abnormality of the substrate based on the signal detected by the shape detection module.

[0023] In one mode, the shape detection module includes: a detection sensor; and a sensor moving actuator that moves the detection sensor, and the sensor moving actuator moves the detection sensor disposed above the substrate held by the transfer robot along a movement locus on the surface of the substrate.

[0024] In one mode, the shape detection module includes: a fixed sensor and a movable sensor; and a sensor moving actuator that reciprocates the movable sensor from the peripheral portion to the center of the substrate, and in a state where the substrate is rotated by the transfer robot, the sensor moving actuator reciprocates the movable sensor from the peripheral portion to the center.

[0025] In one mode, when the transfer robot transfers the substrate, the shape detection module detects the signal.

[0026] In one mode, when the shape detection module is defined as a first shape detection module and the transfer robot is defined as a first transfer robot, the substrate is transferred to a polishing module by the first transfer robot, the substrate that has been polished in the polishing module is transferred to a cleaning module by a second transfer robot, and a second shape detection module connected to the second transfer robot detects a signal corresponding to the surface shape of the substrate held by the second transfer robot.

[0027] In one mode, the first shape detection module and the second shape detection module detect the shape of the same surface of the substrate.

[0028] In one mode, a compressed fluid is sprayed onto the surface of the substrate that is the detection object of the second shape detection module by a fluid spraying device, and the fluid spraying device is disposed on the transfer path of the substrate between the polishing module and the cleaning module.

[0029] In one mode, shape information of the substrate that is the object of determination of the shape abnormality is obtained based on the signal acquired from the shape detection module, and the acquired shape information is compared with a predetermined determination criterion to determine the shape abnormality.

[0030] In one mode, a normal distribution is created based on a plurality of values calculated from a plurality of signals acquired from the shape detection module in the past, and a range of ±Xσ from the average value of the normal distribution is determined as the determination criterion.

[0031] Effects of the Invention

[0032] The shape detection module detects a signal corresponding to the shape of the substrate, and the control device determines the shape abnormality of the substrate based on this signal. Therefore, the substrate processing apparatus does not temporarily stop due to problems such as misfeeding of the substrate, and as a result, the production capacity of the wafer can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a top view showing one embodiment of a substrate processing apparatus.

[0034] Figure 2 In Figure 2 (a) is a top view showing the cleaning unit, Figure 2 and (b) is a side view showing the cleaning unit.

[0035] Figure 3 is a perspective view showing one embodiment of the shape detection module.

[0036] Figure 4 is a diagram showing the movement locus of the detection sensor.

[0037] Figure 5 is a diagram showing the process of determining the shape abnormality of the wafer by the control device.

[0038] Figure 6 is a perspective view showing the shape detection module connected to the transfer robot.

[0039] Figure 7 is Figure 6 a top view.

[0040] Figure 8 is a diagram showing the detection locus of the movable sensor.

[0041] Figure 9 is a diagram showing the process of determining the shape abnormality of the wafer by the control device.

[0042] Figure 10 is a perspective view showing one embodiment of the fluid injection device.

[0043] Figure 11 In Figure 11 , (a) of Figure 11 and (b) of

[0044] Figure 12 are diagrams showing the ejection ports formed in the fluid ejection nozzle. Figure 12 , (a) to Figure 12 , (c) of

[0045] Figure 13 is a diagram showing the recovery window that can access the temporary placement table.

[0046] Symbol Explanation

[0047] 1 Housing, 1a, 1b Partition wall, 1c Outer wall, 2 Loading / Unloading section, 3 Grinding section, 3A - 3D Grinding module, 4 Cleaning section, 5 Control device, 5a Storage device, 5b Arithmetic device, 6 First linear transfer device, 7 Second linear transfer device, 10 Grinding pad, 11 Lift, 12 Swing transfer device, 20 Front loading section, 21 Travel mechanism, 22 Transfer robot, 30A - 30D Grinding table, 31A - 31D Top ring, 32A - 32D Grinding fluid supply nozzle, 33A - 33D Truing device, 180 Temporary placement table, 190 First cleaning chamber, 191 First transfer chamber, 192 Second cleaning chamber, 193 Second transfer chamber, 194 Drying chamber, 201A Upper primary cleaning module, 201B Lower primary cleaning module, 202A Upper secondary cleaning module, 202B Lower secondary cleaning module, 203 Temporary placement table, 205A Upper drying module, 205B Lower drying module, 207 Filter fan device, 209 First transfer robot, 210 Second transfer robot, 211, 212 Support shaft, 400 Shape detection module, 401 Detection sensor, 402 Sensor moving actuator, 410 First parallel moving actuator, 410a Moving body, 410b Guide rail, 411 Second parallel moving actuator, 411a Moving body, 411b Guide rail, 412 Vertical moving actuator, 420 Manipulator, 430 Connecting component, 500 Shape detection module, 501A Fixed sensor, 501B Movable sensor, 502 Sensor moving actuator, 510 Parallel moving actuator, 510a Moving body, 510b Guide rail, 512 Vertical moving actuator, 520 Manipulator, 530 Connecting component, 600 Fluid ejection device, 601 Fluid ejection nozzle, 602 Fluid supply line, 603, 604 Ejection port, 605 Delivery port, 606 Filter, 610 Gate, TP1 - TP7 Transfer position, W1 First surface, W2 Second surface, CP Center, PP Peripheral part. Detailed Description of the Invention

[0048] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or equivalent components are denoted by the same reference numerals and repeated descriptions are omitted. In the following-described multiple embodiments, the structure of one embodiment without special description is the same as that of other embodiments, so repeated descriptions are omitted.

[0049] Figure 1 is a top view showing an embodiment of a substrate processing apparatus. As Figure 1 shown, the substrate processing apparatus includes a rectangular housing 1. The interior of the housing 1 is divided into a loading / unloading section 2, a polishing section 3, and a cleaning section 4 by partition walls 1a and 1b.

[0050] The loading / unloading section 2, the polishing section 3, and the cleaning section 4 are assembled independently and exhausted independently. The substrate processing apparatus includes a control device 5 that controls substrate processing operations. The loading / unloading section 2 includes two or more (four in this embodiment) front loading sections 20 on which wafer cassettes (substrates) storing a plurality of wafers are placed.

[0051] The front loading sections 20 are arranged adjacent to the housing 1 and arranged along the width direction (the direction perpendicular to the long side direction) of the substrate processing apparatus. The front loading sections 20 can carry an open cassette, a SMIF (Standard Manufacturing Interface) port, or a FOUP (Front Opening Unified Pod). SMIF and FOUP are sealed containers that house a wafer cassette inside and are covered by a partition wall so as to be able to maintain an environment independent of the external space.

[0052] The loading / unloading section 2 is provided with a traveling mechanism 21 along the arrangement direction of the front loading sections 20, and two transfer robots (loaders) 22 capable of moving along the arrangement direction of the wafer cassettes are provided on the traveling mechanism 21. The transfer robot 22 can access the wafer cassettes mounted on the front loading sections 20 by moving on the traveling mechanism 21.

[0053] The polishing section 3 is an area for polishing (planarizing) wafers and includes a first polishing module 3A, a second polishing module 3B, a third polishing module 3C, and a fourth polishing module 3D. As Figure 1 shown, the first polishing module 3A, the second polishing module 3B, the third polishing module 3C, and the fourth polishing module 3D are arranged along the long side direction of the substrate processing apparatus.

[0054] As Figure 1As shown in the figure, the first grinding module 3A includes: a grinding table 30A on which a grinding pad 10 having a grinding surface is mounted, a top ring 31A for holding a wafer and pressing the wafer against the grinding pad 10 on the grinding table 30A for grinding, a grinding fluid supply nozzle 32A for supplying a grinding fluid and a dressing fluid (e.g., pure water) to the grinding pad 10, a dresser 33A for dressing the grinding surface of the grinding pad 10, and an atomizer 34A for atomizing a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen) or a liquid (e.g., pure water) and spraying it onto the grinding surface.

[0055] Similarly, the second grinding module 3B includes: a grinding table 30B on which the grinding pad 10 is mounted, a top ring 31B, a grinding fluid supply nozzle 32B, a dresser 33B, and an atomizer 34B. The third grinding module 3C includes: a grinding table 30C on which the grinding pad 10 is mounted, a top ring 31C, a grinding fluid supply nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth grinding module 3D includes: a grinding table 30D on which the grinding pad 10 is mounted, a top ring 31D, a grinding fluid supply nozzle 32D, a dresser 33D, and an atomizer 34D.

[0056] A conveyance mechanism for conveying wafers will be described. As Figure 1 shown, the substrate processing apparatus includes a first linear transfer device 6 disposed adjacent to the first grinding module 3A and the second grinding module 3B. The first linear transfer device 6 is a mechanism for conveying wafers between four conveyance positions (a first conveyance position TP1, a second conveyance position TP2, a third conveyance position TP3, and a fourth conveyance position TP4) along the arrangement direction of the grinding modules 3A and 3B.

[0057] The substrate processing apparatus includes a second linear transfer device 7 disposed adjacent to the third grinding module 3C and the fourth grinding module 3D. The second linear transfer device 7 is a mechanism for conveying wafers between three conveyance positions (a fifth conveyance position TP5, a sixth conveyance position TP6, and a seventh conveyance position TP7) along the arrangement direction of the grinding modules 3C and 3D.

[0058] The wafer is conveyed to the grinding modules 3A and 3B by the first linear transfer device 6. The top ring 31A of the first grinding module 3A moves between the grinding position and the second conveyance position TP2 by its swinging motion. Therefore, the transfer of the wafer to the top ring 31A is performed at the second conveyance position TP2.

[0059] Similarly, the top ring 31B of the second grinding module 3B moves between the grinding position and the third transfer position TP3, and the transfer of the wafer to the top ring 31B is performed at the third transfer position TP3. The top ring 31C of the third grinding module 3C moves between the grinding position and the sixth transfer position TP6, and the transfer of the wafer to the top ring 31C is performed at the sixth transfer position TP6. The top ring 31D of the fourth grinding module 3D moves between the grinding position and the seventh transfer position TP7, and the transfer of the wafer to the top ring 31D is performed at the seventh transfer position TP7.

[0060] An elevator 11 for receiving wafers from the transfer robot 22 is arranged at the first transfer position TP1. The wafers are transferred from the transfer robot 22 to the first linear transfer device 6 via the elevator 11.

[0061] The substrate processing apparatus is provided with a gate (not shown) disposed on the partition wall 1a. The gate is arranged between the elevator 11 and the transfer robot 22. When transferring the wafers, the gate is opened, and the wafers are transferred from the transfer robot 22 to the elevator 11. A swing transfer device 12 is arranged between the first linear transfer device 6, the second linear transfer device 7, and the cleaning unit 4.

[0062] The swing transfer device 12 has a hand that can move between the fourth transfer position TP4 and the fifth transfer position TP5. The transfer of the wafers from the first linear transfer device 6 to the second linear transfer device 7 is performed by the swing transfer device 12. The wafers are transferred by the second linear transfer device 7 to the third grinding module 3C and / or the fourth grinding module 3D. The wafers ground in the grinding unit 3 are transferred to the cleaning unit 4 via the swing transfer device 12.

[0063] Figure 2 (a) is a top view showing the cleaning unit, Figure 2 (b) is a side view showing the cleaning unit. As Figure 2 shown in (a) and Figure 2 (b), the cleaning unit 4 is divided into a first cleaning chamber 190, a first transfer chamber 191, a second cleaning chamber 192, a second transfer chamber 193, and a drying chamber 194. In the first cleaning chamber 190, an upper primary cleaning module 201A and a lower primary cleaning module 201B arranged longitudinally are provided.

[0064] The upper primary cleaning module 201A is arranged above the lower primary cleaning module 201B. Similarly, in the second cleaning chamber 192, an upper secondary cleaning module 202A and a lower secondary cleaning module 202B arranged longitudinally are provided. The upper secondary cleaning module 202A is arranged above the lower secondary cleaning module 202B. The primary and secondary cleaning modules 201A, 201B, 202A, and 202B are cleaners that use cleaning liquid to clean the wafers.

[0065] A wafer temporary placement stage 203 is provided between the upper secondary cleaning module 202A and the lower secondary cleaning module 202B. In the drying chamber 194, an upper drying module 205A and a lower drying module 205B arranged longitudinally are disposed. The upper drying module 205A and the lower drying module 205B are isolated from each other.

[0066] Above the upper drying module 205A and the lower drying module 205B, filter fan devices 207, 207 for supplying clean air to the drying modules 205A, 205B in a distributed manner are provided.

[0067] In the first transfer chamber 191, a first transfer robot 209 capable of moving up and down is disposed, and in the second transfer chamber 193, a second transfer robot 210 capable of moving up and down is disposed. The first transfer robot 209 and the second transfer robot 210 are respectively movably supported by support shafts 211, 212 extending longitudinally.

[0068] The first transfer robot 209 and the second transfer robot 210 are movable up and down along the support shafts 211, 212. The first transfer robot 209 is disposed at a position where it can access the temporary placement stage 180 as shown by the dotted line in (a) of Figure 2 When the first transfer robot 209 accesses the temporary placement stage 180, a gate 610 provided on the partition wall 1b (details will be described later) is opened.

[0069] The first transfer robot 209 operates in such a way as to transfer the wafer W between the temporary placement stage 180, the upper primary cleaning module 201A, the lower primary cleaning module 201B, the temporary placement stage 203, the upper secondary cleaning module 202A, and the lower secondary cleaning module 202B.

[0070] The second transfer robot 210 operates in such a way as to transfer the wafer W between the upper secondary cleaning module 202A, the lower secondary cleaning module 202B, the temporary placement stage 203, the upper drying module 205A, and the lower drying module 205B.

[0071] Figure 1 The transfer robot 22 as shown takes out the wafer W from the upper drying module 205A or the lower drying module 205B and returns the wafer W to the wafer cassette. When the transfer robot 22 accesses the drying modules 205A, 205B, a gate (not shown) provided on the partition wall 1a is opened. In this way, the wafer W is transferred in the order of the loading / unloading unit 2, the grinding unit 3, and the cleaning unit 4.

[0072] The wafer W may have shape irregularities such as notches, deformations (e.g., warping, twisting), etc. on its surface. In such a case, when the wafer W with shape irregularities is transported from the front loading unit 20 to the grinding unit 3, the transport robot 22 may not be able to transport the wafer W properly, resulting in a transport error of the wafer W.

[0073] By processing the wafer W in each processing module (in this embodiment, the grinding modules 3A to 3D of the grinding unit 3, the cleaning modules 201A, 201B, 202A, 202B, etc. of the cleaning unit 4), shape irregularities may occur on the surface of the wafer W. Even in such a case, the first transport robot 209 may not be able to transport the wafer W properly, resulting in a transport error of the wafer W. Such a transport error of the wafer W causes a reduction in the production capacity of the wafer W.

[0074] Therefore, the substrate processing apparatus includes a shape detection module for determining the shape irregularities of the wafer W held by the transport robot. Hereinafter, with reference to the drawings, the structure of the shape detection module will be described.

[0075] Figure 3 is a perspective view showing an embodiment of the shape detection module. In Figure 3 the embodiment shown, the shape detection module 400 is connected to the transport robot 22. The shape detection module 400 is configured to detect a signal corresponding to the shape (surface shape) of the wafer W held by the robot hand 420 of the transport robot 22. The control device 5 is configured to determine the presence or absence of shape irregularities of the wafer W based on the signal detected by the shape detection module 400.

[0076] As Figure 3 shown, the control device 5 includes a storage device 5a storing a program and an arithmetic device 5b that executes arithmetic operations according to the commands included in the program. The storage device 5a includes: a main storage device such as a RAM, an auxiliary storage device such as a hard disk drive (HDD), a solid state drive (SSD). As an example of the arithmetic device 5b, a CPU (central processing unit), a GPU (graphics processing unit) can be cited.

[0077] As Figure 3 shown, the shape detection module 400 connected to the transport robot 22 is configured to detect a signal corresponding to the shape of the wafer W above the robot hand 420 of the transport robot 22. The shape detection module 400 includes a detection sensor 401 disposed above the wafer W on the robot hand 420 and a sensor moving actuator 402 that moves the detection sensor 401.

[0078] The wafer W has a first surface W1 and a second surface W2 disposed on the opposite side of the first surface W1. The first surface W1 is, for example, the surface to be ground of the wafer W, and in this case, the second surface W2 is the back surface of the wafer W.

[0079] In the present embodiment, the detection sensor 401 faces the first surface W1. However, in one embodiment, the detection sensor 401 may also face the second surface W2. Hereinafter, in this specification, the first surface W1 and the second surface W2 may not be particularly limited and may be referred to as the surface.

[0080] In the present embodiment, the detection sensor 401 is an optical sensor (e.g., a laser displacement meter) that guides light to the surface of the wafer W and detects the reflected light from the wafer W. In this case, the detection sensor 401 detects a signal corresponding to the distance between the detection sensor 401 and the surface of the wafer W.

[0081] The control device 5 is electrically connected to the shape detection module 400. Therefore, the control device 5 connected to the detection sensor 401 is configured to acquire the signal detected by the detection sensor 401 and determine the presence or absence of a shape abnormality of the wafer W based on the acquired signal.

[0082] The sensor moving actuator 402 is configured to move the detection sensor 401 in a direction parallel to the surface of the wafer W held by the robot 420. Here, the direction parallel to the surface of the wafer W is the X-axis direction and the Y-axis direction that are orthogonal to each other. The direction perpendicular to the surface of the wafer W is the Z-axis direction.

[0083] The sensor moving actuator 402 includes a first translation actuator 410 and a second translation actuator 411 that move the detection sensor 401 in a direction parallel to the surface of the wafer W.

[0084] In the present embodiment, the first translation actuator 410 is configured to move the detection sensor 401 in the X-axis direction. The second translation actuator 411 is configured to move the detection sensor 401 in the Y-axis direction.

[0085] Hereinafter, in this specification, the first translation actuator 410 may be referred to as the X-axis actuator 410, and the second translation actuator 411 may be referred to as the Y-axis actuator 411.

[0086] In the present embodiment, the X-axis actuator 410 and the Y-axis actuator 411 each have a linear guide structure. More specifically, the X-axis actuator 410 includes a moving body 410a that can move in the X-axis direction and a guide rail 410b that guides the movement of the moving body 410a in the X-axis direction.

[0087] The detection sensor 401 is mounted on the moving body 410a. Therefore, when the moving body 410a moves in the X-axis direction along the guide rail 410b, the detection sensor 401 mounted on the moving body 410a moves in the X-axis direction together with the moving body 410a.

[0088] The Y-axis actuator 411 has the same structure as the X-axis actuator 410. More specifically, the Y-axis actuator 411 includes a moving body 411a that can move in the Y-axis direction and a guide rail 411b that guides the movement of the moving body 411a in the Y-axis direction.

[0089] The X-axis actuator 410 (and the detection sensor 401) is mounted on the moving body 411a. Therefore, when the moving body 411a moves in the Y-axis direction along the guide rail 411b, the X-axis actuator 410 mounted on the moving body 411a moves in the Y-axis direction together with the moving body 411a. The detection sensor 401 of the moving body 410a mounted on the X-axis actuator 410 moves in the Y-axis direction together with the moving body 411a.

[0090] The shape detection module 400 includes a connecting member 430 that connects the sensor moving actuator 402 and the transfer robot 22. The connecting member 430 extends in the Z-axis direction and is connected to the Y-axis actuator 411 (more specifically, the guide rail 411b). The sensor moving actuator 402 connected to the connecting member 430 disposes the detection sensor 401 above the surface of the wafer W.

[0091] As Figure 3 shown, the sensor moving actuator 402 includes a vertical moving actuator 412 that moves the detection sensor 401 in the Z-axis direction. Hereinafter, in this specification, the vertical moving actuator 412 will also be referred to as the Z-axis actuator (lifting actuator) 412.

[0092] Although the detailed structure of the Z-axis actuator 412 is omitted, examples of the Z-axis actuator 412 include a cylinder and a ball screw mechanism (a combination of a servo motor and a ball screw).

[0093] In the present embodiment, the Z-axis actuator 412 is supported by the guide rail 411b of the Y-axis actuator 411 so as to be movable in the Y-axis direction via the moving body 411a. The X-axis actuator 410 and the detection sensor 401 are mounted on the Z-axis actuator 412. Therefore, when the Z-axis actuator 412 operates, the detection sensor 401 and the X-axis actuator 410 move together in a direction approaching or separating from the surface of the wafer W.

[0094] In this way, the control device 5 can move the detection sensor 401 in the X-axis direction, the Y-axis direction, and the Z-axis direction by operating the sensor moving actuator 402 (that is, the parallel moving actuators 410, 411, and the vertical moving actuator 412).

[0095] When the transfer robot 22 accesses the wafer W in the cassette, and / or when the transfer robot 22 accesses the elevator 11, the detection sensor 401 may come into contact with the wafer W. Therefore, when the wafer W is transferred by the transfer robot 22, the control device 5 operates the Z-axis actuator 412 to move the detection sensor 401 to a predetermined retracted position. The retracted position is a position where the detection sensor 401 is moved away from the robot hand 420 in the Z-axis direction. With such a structure, the transfer robot 22 can prevent the detection sensor 401 from coming into contact with the wafer W when transferring the wafer W.

[0096] Figure 4 FIG. is a diagram showing the movement locus of the detection sensor. As Figure 4 shown, the sensor movement actuator 402 is configured to move the detection sensor 401 along a spiral movement locus (i.e., detection locus) on the surface of the wafer W (in Figure 4 this case, the first surface W1). In other words, the control device 5 operates the X-axis actuator 410 and the Y-axis actuator 411 to move the detection sensor 401 along the spiral movement locus. Data corresponding to the movement locus of the detection sensor 401 is stored in the storage device 5a.

[0097] The detection sensor 401 moves spirally from the peripheral portion PP of the wafer W toward the center CP of the wafer W along a predetermined movement locus, and continuously detects a signal corresponding to the distance between the detection sensor 401 and the surface of the wafer W. Thus, by moving the detection sensor 401 in a direction parallel to the surface of the wafer W, the detection sensor 401 detects a signal corresponding to the shape of the entire surface of the wafer W.

[0098] In one embodiment, the sensor movement actuator 402 may also move the detection sensor 401 spirally from the center CP toward the peripheral portion PP. In one embodiment, as long as the detection sensor 401 can detect a signal corresponding to the shape of the entire surface of the wafer W, the sensor movement actuator 402 does not necessarily have to move the detection sensor 401 spirally.

[0099] After the detection sensor 401 detects a signal corresponding to the shape of the wafer W, it outputs a signal to the control device 5. The control device 5 receives the signal detected by the detection sensor 401 and acquires (measures) the shape information of the wafer W that is the object of judgment of the shape abnormality of the wafer W based on the signal. Thereafter, the control device 5 compares the acquired shape information with a predetermined determination reference and determines the presence or absence of a shape abnormality of the wafer W.

[0100] Figure 5 FIG. is a diagram showing the process of determining the shape abnormality of the wafer by the control device. As Figure 5As shown in step S101, first, the control device 5 causes the transfer robot 22 to access the wafer W in the preloading unit 20 and holds the wafer W on the robot hand 420. At this time, the control device 5 operates the Z-axis actuator 412 to raise the detection sensor 401 to a specified retracted position so that the detection sensor 401 does not contact the wafer W.

[0101] After that, the control device 5 operates the Z-axis actuator 412 to lower the detection sensor 401 to a specified detection position. The detection position is a position where the detection sensor 401 approaches the wafer W on the robot hand 420.

[0102] After the control device 5 moves the detection sensor 401 to the detection position, the control device 5 operates the X-axis actuator 410 and the Y-axis actuator 411 to move the detection sensor 401 along a specified movement locus. The detection sensor 401 moving along the movement locus detects a signal corresponding to the shape of the wafer W. After the detection sensor 401 detects the signal, the control device 5 operates the Z-axis actuator 412 to move the detection sensor 401 again to the specified retracted position.

[0103] In one embodiment, when the transfer robot 22 transfers the wafer W from a specified receiving position (in this embodiment, the preloading unit 20) to a specified handover position (in this embodiment, the elevator 11), the control device 5 may also perform a signal detection operation based on the signal of the detection sensor 401.

[0104] With such a configuration, the control device 5 can improve the production capacity of the wafer W. Assuming that the shape detection module 400 is arranged at a location different from the transfer robot 22, the control device 5 needs to specifically transfer the transfer robot 22 holding the wafer W to the location where the shape detection module 400 is arranged, thus wasting time.

[0105] In this embodiment, the shape detection module 400 is connected to the transfer robot 22. Therefore, when the wafer W is transferred by the transfer robot 22, the detection sensor 401 can detect a signal corresponding to the shape of the wafer W. Thus, in this embodiment, the substrate processing device can simultaneously perform the transfer operation and the signal detection operation of the wafer W, and therefore can improve the production capacity of the wafer W.

[0106] In Figure 5 After step S101, the control device 5 obtains the shape information of the wafer W based on the signal detected by the detection sensor 401 (refer to step S102) and determines the presence or absence of an abnormal shape of the wafer W (refer to step S103).

[0107] As an example of the shape abnormality of the wafer W, a notch in the peripheral portion PP of the wafer W and deformation of the surface of the wafer W can be cited. For example, the control device 5 can determine the presence or absence of a notch at the peripheral portion PP of the wafer W based on the detection signal in the peripheral portion PP of the wafer W.

[0108] When a notch occurs in the peripheral portion PP of the wafer W, the detection sensor 401 does not detect the reflected light at the notch portion even if light is directed to the entire circumference of the peripheral portion PP. In other words, the detection sensor 401 detects different signals over the entire circumference of the peripheral portion PP. Therefore, the control device 5 can determine the notch at the peripheral portion PP of the wafer W based on the signal detected by the detection sensor 401.

[0109] When the wafer W is deformed, the detection sensor 401 moving along the movement trajectory detects signals of different magnitudes in the region between the peripheral portion PP and the center CP. Therefore, the control device 5 can determine the deformation of the wafer W based on the signal detected by the detection sensor 401.

[0110] The storage device 5a stores data representing a determination reference that is a comparison object with the shape information of the wafer W. The control device 5 compares the acquired shape information of the wafer W with a specified determination reference to determine the shape abnormality of the wafer W.

[0111] For example, the control device 5 determines whether a value calculated based on the signal detected by the detection sensor 401 as the shape information of the wafer W exceeds a threshold value as the determination reference. This calculated value is a numerical value (displacement amount) representing the difference in distance between the detection sensor 401 and the surface of the wafer W in the region between the peripheral portion PP and the center CP.

[0112] In one embodiment, before processing the wafer W as a processing object, the control device 5 calculates a plurality of displacement amounts (numerical values) based on a plurality of signals acquired from the detection sensor 401 in the past. The control device 5 can create a normal distribution based on the calculated plurality of values and determine the range of ±Xσ (standard deviation) from the average value of the normal distribution as the determination reference. Here, "X" represents a specified coefficient. For example, the control device 5 can determine the range of ±3σ (standard deviation) from the average value of the normal distribution as the determination reference (i.e., the allowable range).

[0113] The control device 5 compares the shape information of the wafer W with a specified determination reference. When it is determined that the shape of the wafer W has not changed abnormally (see "No" in step S103), the transfer robot 22 transfers the wafer W to the grinding unit 3 (see step S104).

[0114] On the other hand, when the control device 5 determines that the shape of the wafer W is abnormal (refer to "Yes" in step S103), the control device 5 returns the wafer W to the pre-loading unit 20 through the transfer robot 22 (step S105). Since the plurality of wafers W in the pre-loading unit 20 are marked, the transfer robot 22 will not receive the wafer W with a shape abnormality again.

[0115] According to the present embodiment, by connecting the shape detection module 400 to the transfer robot 22, the control device 5 can determine the shape abnormality of the wafer W immediately after the wafer W is transferred to the loading / unloading unit 2 of the substrate processing device. Therefore, the substrate processing device can minimize the risk of transferring the wafer W with a shape abnormality to the processing module.

[0116] When the control device 5 determines that the shape of the wafer W is abnormal, it can also accumulate the data related to the shape abnormality as information for determining the determination reference in the storage device 5a. By accumulating such data, the control device 5 can accurately determine the determination reference based on the accumulated data.

[0117] The wafer W transferred by the transfer robot 22 to the grinding unit 3 is ground in any one of the grinding modules 3A to 3D in the grinding unit 3 (refer to Figure 1 ), and then is transferred by the first transfer robot 209 to the cleaning unit 4. By grinding the wafer W, the shape of the wafer W may become abnormal.

[0118] Therefore, the substrate processing device is provided with a shape detection module for determining the shape abnormality of the wafer W held by the first transfer robot 209. Hereinafter, in this specification, the first transfer robot 209 will also be simply referred to as the transfer robot 209.

[0119] Figure 6 is a perspective view showing the shape detection module connected to the transfer robot. Figure 7 is Figure 6 's top view. In the Figure 6 and Figure 7 shown embodiment, the substrate processing device is provided with a shape detection module 500 connected to the transfer robot 209.

[0120] The shape detection module 500 includes: a fixed sensor 501A disposed above the peripheral portion PP of the wafer W held by the robot hand 520 of the transfer robot 209, a movable sensor 501B capable of moving in a direction parallel to the wafer W held by the transfer robot 209 (X-axis direction or Y-axis direction), and a sensor moving actuator 502 for reciprocating the movable sensor 501B from the peripheral portion PP to the center CP.

[0121] The fixed sensor 501A and the movable sensor 501B are arranged adjacent to each other at positions above the surface of the wafer W. In the present embodiment, the fixed sensor 501A and the movable sensor 501B have the same structure. For example, the fixed sensor 501A and the movable sensor 501B are respectively optical sensors (e.g., laser displacement meters) that guide light to the surface of the wafer W and detect the reflected light from the wafer W.

[0122] In Figure 7 In the illustrated embodiment, the fixed sensor 501A and the movable sensor 501B are arranged close to each other near the peripheral portion PP. In one embodiment, the movable sensor 501B may also be arranged away from the fixed sensor 501A. In this case, the movable sensor 501B is configured not to contact the fixed sensor 501A and to be able to move to the outermost periphery (including the peripheral portion PP) of the wafer W.

[0123] The sensor moving actuator 502 includes: a translation actuator 510 that moves the movable sensor 501B in a direction parallel to the surface of the wafer W, and a vertical moving actuator (i.e., a Z-axis actuator) 512 that moves the fixed sensor 501A and the movable sensor 501B together with the translation actuator 510 in the Z-axis direction.

[0124] In the present embodiment, the horizontal moving actuator 510 has a linear guiding structure and is configured to move the movable sensor 501B in the X-axis direction. Therefore, hereinafter, in this specification, the horizontal moving actuator 510 will also be referred to as the X-axis actuator 510. In one embodiment, the horizontal moving actuator 510 may also be configured to move the movable sensor 501B in the Y-axis direction.

[0125] The Z-axis actuator 512 has the same structure as the Z-axis actuator 412. As the Z-axis actuator 512, for example, a cylinder, a ball screw mechanism (a combination of a servo motor and a ball screw) can be cited.

[0126] The X-axis actuator 510 includes a moving body 510a that can move in the X-axis direction (i.e., a direction parallel to the surface of the wafer W) and a guide rail 510b that guides the movement of the moving body 510a in the X-axis direction.

[0127] The movable sensor 501B is mounted on the moving body 510a. Therefore, when the moving body 510a moves in the X-axis direction along the guide rail 510b, the movable sensor 501B mounted on the moving body 510a moves in the X-axis direction together with the moving body 510a.

[0128] The shape detection module 500 includes a connection component 530 that connects the sensor moving actuator 502 and the transfer robot 209. Similar to the connection component 430, the connection component 530 extends in the Z-axis direction and is connected to the Z-axis actuator 512. The sensor moving actuator 502 connected to the connection component 530 can arrange the fixed sensor 501A and the movable sensor 501B above the surface of the wafer W.

[0129] When the Z-axis actuator 512 operates, the fixed sensor 501A, the movable sensor 501B, and the X-axis actuator 510 move in a direction approaching or departing from the surface of the wafer W.

[0130] The control device 5 is electrically connected to the shape detection module 500. Therefore, the control device 5 can move the fixed sensor 501A and the movable sensor 501B in the Z-axis direction by operating the Z-axis actuator 512, and can move the movable sensor 501B in the X-axis direction by operating the X-axis actuator 510.

[0131] Figure 8 It is a diagram showing the detection locus of the movable sensor. In the present embodiment, the transfer robot 209 is configured to rotate the wafer W held by the robot hand 520. Therefore, in a state where the transfer robot 209 rotates the wafer W, when the X-axis actuator 510 linearly moves the movable sensor 501B from the peripheral portion PP to the center CP of the wafer W, the movable sensor 501B detects a signal corresponding to the shape of the wafer W along a spiral detection locus.

[0132] The fixed sensor 501A is arranged above the peripheral portion PP of the wafer W. Therefore, when the transfer robot 209 rotates the wafer W, the fixed sensor 501A does not move and detects a signal corresponding to the shape of the peripheral portion PP.

[0133] In this way, the control device 5 obtains the shape information of the wafer W that is the object of judgment of the shape abnormality of the wafer W based on the signals detected by the fixed sensor 501A and the movable sensor 501B, and compares the obtained shape information with a prescribed judgment reference to determine the shape abnormality of the wafer W.

[0134] Figure 9 It is a diagram showing the process of determining the shape abnormality of the wafer by the control device. First, the wafer W that has been polished is placed on the temporary placement table 180. The first transfer robot 209 accesses the wafer W on the temporary placement table 180 and transfers the wafer W to the cleaning unit 4 (refer to step S201).

[0135] The surface of the polished wafer W may be wetted by the liquid used during the polishing process of the wafer W. In the present embodiment, the fixed sensor 501A and the movable sensor 501B are respectively optical sensors. Therefore, when the surface of the wafer W is wetted, the fixed sensor 501A and the movable sensor 501B may not be able to accurately detect the signals corresponding to the shape of the wafer W. Therefore, the substrate processing apparatus includes a fluid ejection device that removes the liquid adhering to the surface of the wafer W conveyed to the cleaning unit 4. Hereinafter, with reference to the drawings, the structure of the fluid ejection device will be described.

[0136] Figure 10 is a perspective view showing an embodiment of the fluid ejection device. As Figure 10 shown, the substrate processing apparatus includes a fluid ejection device 600 disposed in the conveyance path of the wafer W between the polishing unit 3 and the cleaning unit 4.

[0137] The fluid ejection device 600 includes a fluid ejection nozzle 601 that ejects compressed fluid onto the surface of the wafer W (more specifically, the surface that is the detection object of the shape detection module 500), and a fluid supply line 602 connected to the fluid ejection nozzle 601.

[0138] The fluid supply line 602 is connected to a compressed fluid supply source (not shown), and the compressed fluid supplied from the compressed fluid supply source is introduced into the fluid ejection nozzle 601 through the fluid supply line 602. As an example of the compressed fluid, compressed air, compressed gas (for example, an inert gas such as nitrogen) can be cited.

[0139] In one embodiment, the fluid ejection device 600 may also include a filter 606 disposed upstream of the fluid ejection nozzle 601 in the flow direction of the compressed fluid. In Figure 10 the embodiment shown, the filter 606 is installed on the fluid supply line 602. The filter 606 is configured to remove foreign matter contained in the compressed fluid flowing through the fluid supply line 602. With such a structure, clean compressed fluid can be ejected onto the surface of the wafer W through the fluid ejection nozzle 601.

[0140] As Figure 10 shown, the fluid ejection nozzle 601 is disposed above the conveyance port 605 formed in the partition wall 1b. The fluid ejection nozzle 601 has a cylindrical shape and extends along the long side direction of the conveyance port 605.

[0141] Figure 11 of (a) and Figure 11 of (b) are diagrams showing the ejection ports formed in the fluid ejection nozzle. In Figure 11In the embodiment shown in (a), the fluid injection nozzle 601 has a plurality of injection ports 603 arranged along its long side direction. The plurality of injection ports 603 are arranged opposite to the surface of the wafer W (in Figure 11 (a), the first surface W1). Therefore, the compressed fluid introduced into the fluid injection nozzle 601 is ejected onto the surface of the wafer W through the plurality of injection ports 603.

[0142] The fluid injection nozzle 601 has a length longer than the diameter of the wafer W. The length of the plurality of injection ports 603 extending along the long side direction of the fluid injection nozzle 601 (that is, the distance between the injection port 603 on one end side and the injection port 603 on the other end side) is longer than the diameter of the wafer W. Therefore, the compressed fluid supplied from the plurality of injection ports 603 is ejected onto the entire surface of the wafer W.

[0143] As Figure 11 shown in (b), the fluid injection nozzle 601 may also have a single slit-shaped injection port 604 extending along its long side direction. With such a structure, the injection port 604 is also arranged opposite to the surface of the wafer W. Even in this case, the length of the injection port 604 is longer than the diameter of the wafer W. Therefore, the compressed fluid supplied from the injection port 604 is ejected onto the entire surface of the wafer W.

[0144] Figure 12 (a) to Figure 12 (c) are diagrams showing the wafer transported from the grinding unit to the cleaning unit. As Figure 12 shown in (a), before the wafer W is transported to the cleaning unit 4, the transport port 605 is closed by the gate 610.

[0145] As Figure 12 shown in (b), when the wafer W is transported from the grinding unit 3 to the cleaning unit 4, the gate 610 is opened, and the wafer W passes through the transport port 605 and is transported from the grinding unit 3 to the cleaning unit 4. At this time, the fluid injection device 600 ejects the compressed fluid onto the surface of the wafer W through the injection port 603 (or injection port 604) of the fluid injection nozzle 601. The fluid injection device 600 completely removes the liquid attached to the surface of the wafer W by ejecting the compressed fluid.

[0146] After that, as Figure 12 shown in (c), after the wafer W passes through the transport port 605, the gate 610 is closed, and the fluid injection device 600 stops supplying the compressed fluid from the fluid injection nozzle 601. In this way, through Figure 12 (a) to Figure 12 (c) series of processes, the wafer W that has been ground in the grinding unit 3 is transported to the cleaning unit 4 in a state where the liquid attached to its surface has been removed.

[0147] In this embodiment, when the transfer robot 209 accesses the wafer W on the temporary placement table 180, the control device 5 operates the Z-axis actuator 512 to move the fixed sensor 501A and the movable sensor 501B to a specified retracted position so that the fixed sensor 501A and the movable sensor 501B do not contact the wafer W.

[0148] After that, the control device 5 operates the Z-axis actuator 512 to move the fixed sensor 501A and the movable sensor 501B to a specified detection position close to the wafer W on the robot hand 520. The fixed sensor 501A and the movable sensor 501B that have moved to the detection position detect signals corresponding to the shape of the wafer W in a state where the wafer W is rotated by the transfer robot 209.

[0149] More specifically, in a state where the transfer robot 209 rotates the wafer W, the control device 5 operates the X-axis actuator 510 to move the movable sensor 501B from the peripheral portion PP of the wafer W toward the center CP of the wafer W. The movable sensor 501B detects signals along a spiral detection trajectory through its linear movement.

[0150] The fixed sensor 501A detects signals corresponding to the shape of the peripheral portion PP of the wafer W through the rotation of the wafer W. After the fixed sensor 501A and the movable sensor 501B detect signals, the control device 5 operates the Z-axis actuator 512 to move the fixed sensor 501A and the movable sensor 501B to the specified retracted position again.

[0151] In one embodiment, the control device 5 may also perform signal detection operations based on the fixed sensor 501A and the movable sensor 501B when the transfer robot 209 transports the wafer W from a specified receiving position (in this embodiment, the temporary placement table 180) to a specified handover position (in this embodiment, the cleaning modules 201A, 201B, 202A, 202B, etc.).

[0152] In this embodiment, the shape detection module 500 is also connected to the transfer robot 209. Therefore, the transfer operation of the wafer W and the signal detection operation can be performed simultaneously, and the production capacity of the wafer W can be improved.

[0153] As Figure 9 shown in step S202 of, the control device 5 obtains the shape information of the wafer W based on the signals detected by the fixed sensor 501A and the movable sensor 501B, and determines the presence or absence of a shape abnormality of the wafer W (refer to step S203). The process of determining the shape abnormality of the wafer W is the same as the process described with reference to the above-described embodiment, so the specific description is omitted.

[0154] The control device 5 compares the shape information of the wafer W with a specified determination criterion, and when it is determined that the shape of the wafer W is normal (refer to "No" in step S203), the wafer W is transported to any one of the cleaning modules 201A, 201B, 202A, and 202B by the transfer robot 209 (refer to step S204).

[0155] On the other hand, when the control device 5 determines that the shape of the wafer W is abnormal (refer to "Yes" in step S203), the control device 5 transports the wafer W to the temporary placement stage 203 by the transfer robot 209.

[0156] Figure 13 It is a diagram showing the recovery window that can access the temporary placement stage. As Figure 13 shown, the substrate processing apparatus has a recovery window 700 formed on the outer wall 1c of the housing 1. The recovery window 700 is disposed opposite to the temporary placement stage 203, and the operator can access the temporary placement stage 203 through the recovery window 700.

[0157] As described above, the control device 5 transports the wafer W with a shape abnormality to the temporary placement stage 203. Therefore, the operator can recover the wafer W on the temporary placement stage 203 through the recovery window 700 (refer to step S205). When the control device 5 determines that the shape of the wafer W is abnormal, it issues an alarm to notify the operator of the abnormality.

[0158] As described with reference to the above-described embodiment, the substrate processing apparatus includes a shape detection module 400 connected to the transfer robot 22 and a shape detection module 500 connected to the transfer robot 209. In one embodiment, the substrate processing apparatus may also include a new shape detection module (not shown) connected to the transfer robot 210. The new shape detection module has the same structure as the shape detection module 500 (or the shape detection module 400). With such a structure, the control device 5 can determine the shape abnormality of the wafer W being cleaned in the cleaning unit 4.

[0159] In one embodiment, the shape detection modules 400 and 500 may also be configured to detect the shape of the same surface of the wafer W (i.e., the first surface W1 or the second surface W2). With such a structure, the reliability of the determination of the shape abnormality can be improved.

[0160] When it is assumed that the first surface W1 is deformed upward (or downward), the second surface W2 is deformed downward (or upward). In this case, when the shape detection modules 400 and 500 detect the shapes of different surfaces of the wafer W, the control device 5 must calculate the displacement amount of the wafer W deformed in different directions. In this case, the control device 5 may not be able to accurately determine the shape abnormality of the wafer W.

[0161] Therefore, by detecting the shape of the same surface of the wafer W by the shape detection modules 400 and 500, the control device can calculate the displacement amount of the wafer W deformed in the same direction. As a result, the control device 5 can accurately determine the shape abnormality of the wafer W.

[0162] In the above-described embodiment, the transfer robot 22 does not have a structure for rotating the wafer W. Therefore, the shape detection module 400 is configured to detect the shape abnormality of the entire surface of the non-rotating wafer W by the detection sensor 401.

[0163] On the other hand, the transfer robot 209 has a structure for rotating the wafer W. Therefore, the shape detection module 500 has a structure for detecting the shape abnormality of the entire surface of the rotating wafer W by the fixed sensor 501A and the movable sensor 501B.

[0164] However, as long as the shape detection modules 400 and 500 both have a mechanism for determining the shape abnormality of the wafer W, there is no particular limitation on the specific mechanism. For example, the transfer robots 22 and 209 may have the same structure, and the shape detection modules 400 and 500 may also have the same structure.

[0165] In the above-described embodiment, the shape detection module 400 includes the detection sensor 401 as an optical sensor, and the shape detection module 500 includes the fixed sensor 501A and the movable sensor 501B as optical sensors.

[0166] In one embodiment, the shape detection module 400 may include an image sensor as the detection sensor 401 instead of the optical sensor. Similarly, the shape detection module 500 may include an image sensor as the fixed sensor 501A and the movable sensor 501B instead of the optical sensor.

[0167] In this case, the control device 5 acquires the signal (image signal) detected by the image sensor, and creates image data as the shape information of the wafer W based on the acquired image signal. The storage device 5a stores the reference image data as a comparison object for comparison with the image data. As the reference image data, for example, image data including the contour of the peripheral portion PP of the wafer W and image data representing the shade of the shadow in the whole of the wafer W can be cited. The control device 5 compares the image data with the reference image data to determine the presence or absence of the shape abnormality of the wafer W.

[0168] In the above-described embodiment, the fixed sensor 501A and the movable sensor 501B are the same sensor, but the fixed sensor 501A and the movable sensor 501B may also be different sensors. For example, the outline of the wafer W including the peripheral portion PP may be detected by the fixed sensor 501A that is an image sensor, and the surface shape of the wafer W at the inside of the peripheral portion PP may be detected by the movable sensor 501B that is an optical sensor.

[0169] The above-described embodiment is described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention pertains to implement the present invention. Of course, various modifications of the above-described embodiment can be achieved by those skilled in the art, and the technical concept of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiment, but is construed to cover the broadest scope defined by the technical concept as claimed in the claims.

Claims

1. A substrate processing device, characterized in that: have: a processing module, the processing module processing the substrate; a conveying robot, the conveying robot conveying the substrate to the processing module; a shape detection module that detects a signal corresponding to a surface shape of the substrate held by the conveying robot; as well as a control device that determines that the shape of the substrate is abnormal based on the signal detected by the shape detection module, The shape detection module is connected to the transport robot and is configured to detect the signal above the transport robot.

2. The substrate processing device according to claim 1, characterized in that: The shape detection module has: a detection sensor disposed above the substrate held by the conveying robot; and A sensor moving actuator moves the detection sensor along a moving track on the surface of the substrate.

3. The substrate processing device according to claim 1, characterized in that: The conveying robot is configured to rotate the substrate. The shape detection module has: a fixed sensor disposed above a peripheral portion of the substrate held by the conveying robot; a movable sensor capable of moving in a direction parallel to the substrate held by the conveying robot; as well as A sensor moving actuator reciprocates the movable sensor from the peripheral portion to the center of the substrate.

4. The substrate processing device according to claim 1, characterized in that: The shape detection module is configured to detect the signal when the transport robot transports the substrate.

5. The substrate processing apparatus according to claim 1, wherein: In the case where the shape detection module is defined as a first shape detection module, and the conveying robot is defined as a first conveying robot, The first conveying robot is configured to convey the substrate to the polishing module. The substrate processing device comprises: a second conveying robot, configured to convey the substrate polished in the polishing module to the cleaning module; and A second shape detection module is connected to the second transport robot and detects a signal corresponding to a surface shape of the substrate held by the second transport robot.

6. The substrate processing device according to claim 5, characterized in that: The first shape detection module and the second shape detection module are configured to detect a shape of the same surface of the substrate.

7. The substrate processing device according to claim 5, characterized in that: The substrate processing device includes a fluid injection device, which is arranged in a conveying path of the substrate between the polishing module and the cleaning module. The fluid ejecting device includes a fluid ejecting nozzle configured to eject a compressed fluid toward a surface of the substrate to be detected by the second shape detection module.

8. The substrate processing apparatus according to claim 1, wherein: The control device acquires shape information of the substrate to be determined as the shape abnormality based on the signal acquired from the shape detection module, The control device compares the acquired shape information with a predetermined criterion to determine whether the shape is abnormal.

9. The substrate processing device according to claim 8, characterized in that: The control device creates a normal distribution based on a plurality of values ​​calculated based on a plurality of signals obtained from the shape detection module in the past, The control device determines a range of ±Xσ from a mean value of the normal distribution as the determination criterion.

10. A substrate processing method, characterized in that: A shape detection module connected to a conveying robot that conveys the substrate to a processing module detects a signal corresponding to the surface shape of the substrate held by the conveying robot above the conveying robot, It is determined that the shape of the substrate is abnormal based on the signal detected by the shape detection module.

11. The substrate processing method according to claim 10, characterized in that: The shape detection module has: detection sensors; and a sensor moving actuator that moves the detection sensor, The detection sensor disposed above the substrate held by the transport robot is moved along a movement trajectory on the surface of the substrate by the sensor moving actuator.

12. The substrate processing method according to claim 10, characterized in that: The shape detection module has: Fixed sensors and movable sensors; and a sensor moving actuator that reciprocates the movable sensor from the peripheral edge of the substrate to the center of the substrate, The movable sensor is reciprocated from the peripheral portion to the center by the sensor moving actuator in a state where the substrate is rotated by the transport robot.

13. The substrate processing method according to claim 10, characterized in that: When the substrate is transported by the transport robot, the signal is detected by the shape detection module.

14. The substrate processing method according to claim 10, characterized in that: In the case where the shape detection module is defined as a first shape detection module, and the conveying robot is defined as a first conveying robot, The substrate is transported to the grinding module by the first transport robot, The substrate that has been polished in the polishing module is transported to the cleaning module by a second transport robot. A signal corresponding to the surface shape of the substrate held by the second transport robot is detected by a second shape detection module connected to the second transport robot.

15. The substrate processing method according to claim 14, characterized in that: The shape of the same surface of the substrate is detected by the first shape detection module and the second shape detection module.

16. The substrate processing method according to claim 14, characterized in that: A fluid ejection device ejects compressed fluid onto a surface of the substrate to be inspected by the second shape inspection module. The fluid ejection device is disposed in a transport path of the substrate between the polishing module and the cleaning module.

17. The substrate processing method according to claim 10, characterized in that: acquiring shape information of the substrate to be determined as the shape abnormality based on the signal acquired from the shape detection module, The acquired shape information is compared with a predetermined criterion to determine whether the shape is abnormal.

18. The substrate processing method according to claim 17, characterized in that: creating a normal distribution based on a plurality of values ​​calculated based on a plurality of signals obtained from the shape detection module in the past, The range of ±Xσ from the average value of the normal distribution is determined as the judgment criterion.

Images