Chip mounter binding head device, mounting method and die bonding equipment

Abstract

The invention relates to the technical field of semiconductors, in particular to a chip mounter binding head device, a mounting method and die bonding equipment, and the chip mounter binding head device comprises a mounting module, a force control module and a fixed seat; the mounting module comprises a main shaft and a main shaft seat, the main shaft rotatably penetrates through the main shaft seat, and the working end of the main shaft is exposed out of the main shaft seat; the force control module comprises a voice coil driving assembly, a force control connecting block and a guide rail assembly, the voice coil driving assembly comprises a voice coil motor and a controller, the voice coil motor is installed on the fixing base, and the controller is electrically connected with the voice coil motor; the force control connecting block is respectively connected with the voice coil motor and the bottom of the spindle seat; the guide rail assembly is arranged between the spindle seat and the fixing seat, and the spindle seat is slidably connected with the fixing seat through the guide rail assembly. The mounting method and the die bonding equipment provided by the embodiment of the invention have the same beneficial effects as the head binding device of the chip mounter.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly relates to a bonding head device for a chip mounter, a chip mounting method, and die bonding equipment. Background Art

[0002] The bonding head device of a chip mounter is an indispensable device in the integrated circuit packaging process, mainly used for picking up and mounting chips during the automatic chip mounting process in the semiconductor industry. Among them, the chip is picked up by the suction nozzle of the bonding head device from the wafer, and the chip is mounted by attaching the picked-up chip to the lead frame.

[0003] However, when the existing bonding head device of a chip mounter aligns the chip to the corresponding position of the lead frame for mounting, the magnitude of the downward pressure is generally controlled by a spring. With the continuous iterative development of the semiconductor industry, the traditional structure using a spring to control the downward pressure is difficult to meet the high-precision requirements of chip mounting. Summary of the Invention

[0004] To solve the technical problem that the existing bonding head device of a chip mounter is difficult to meet the high-precision requirements of chip mounting, the present invention provides a bonding head device for a chip mounter, a chip mounting method, and die bonding equipment.

[0005] The technical solution for the present invention to solve the technical problem is to provide a bonding head device for a chip mounter for picking up and mounting chips. The bonding head device for a chip mounter includes a mounting module, a force control module, and a fixed seat. The mounting module includes a main shaft and a main shaft seat. The main shaft is rotatably disposed through the main shaft seat, and the working end of the main shaft is exposed outside the main shaft seat. The force control module includes a voice coil driving assembly, a force control connection block, and a guide rail assembly. The voice coil driving assembly includes a voice coil motor and a controller. The voice coil motor is mounted on the fixed seat, and the controller is electrically connected to the voice coil motor. The force control connection block is respectively connected to the voice coil motor and the bottom of the main shaft seat. The guide rail assembly is disposed between the main shaft seat and the fixed seat, and the main shaft seat is slidably connected to the fixed seat through the guide rail assembly.

[0006] Preferably, the voice coil motor includes a motor body and a voice coil mover. The motor body is signal-connected to the voice coil mover, and the controller is electrically connected to the motor body. The motor body is mounted on the fixed seat, and one end of the voice coil mover can slide relative to the motor body in the vertical direction, and the other end is connected to the force control connection block.

[0007] Preferably, the motor body is mounted inside the fixed seat. A part of the voice coil mover is disposed inside the fixed seat, and the other part is exposed outside the bottom of the fixed seat. The exposed end of the voice coil mover is fixedly fitted with the force control connection block.

[0008] Preferably, the guide rail assembly includes a first guide rail and a second guide rail, the first guide rail and the second guide rail are vertically arranged between the spindle seat and the fixed seat; the first guide rail and the second guide rail can slide relative to each other to form a cross guide rail, and at least two groups of the cross guide rails are arranged between the spindle seat and the fixed seat; the first guide rail is fixedly mounted on the outer wall surface of the fixed seat, and the second guide rail is fixedly mounted on the outer wall surface of the spindle seat; when the voice coil mover slides in the vertical direction, the spindle seat is synchronously driven to move through the force control connecting block, so that the second guide rail slides relative to the first guide rail.

[0009] Preferably, two groups of cross guide rails are provided between the spindle seat and the fixed seat, the first guide rails in the two groups of cross guide rails are symmetrical to each other, the second guide rails are symmetrical to each other, and the distance between the first guide rails is smaller than the distance between the second guide rails; the second guide rails in the same group of cross guide rails can make linear motion in the vertical direction relative to the first guide rail.

[0010] Preferably, the head binding device of the placement machine also includes a driving module, and the driving module includes a driving member and a synchronous wheel assembly; the driving member is located on the side of the force control module away from the placement module, the driving member is inserted through the fixed seat, and the working end of the driving member is connected to the main shaft through the synchronous wheel assembly; the synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel and a synchronous belt, and the synchronous belt is simultaneously mounted on the first synchronous wheel and the second synchronous wheel; the first synchronous wheel is installed on the part of the main shaft exposed from the main shaft seat, and the second synchronous wheel is installed on the working end of the driving member.

[0011] Another technical solution of the present invention to solve the above technical problem is to provide a mounting method, which is applied to the above-mentioned mounting head binding device to mount the chip to the substrate. The mounting method includes the following steps: the controller determines the target current for mounting the chip to the substrate according to the type of the chip and the mounting requirements of the substrate, and the target current corresponds to the target mounting force of the mounting head binding device for mounting the chip to the substrate; the working end of the spindle picks up the chip and mounts it to the substrate, and when the chip contacts the substrate, the controller inputs current to the voice coil motor to gradually increase the real-time current of the voice coil motor, and the controller can monitor the real-time current of the voice coil motor in real time; the controller sends a control signal to the voice coil motor to adjust the real-time current of the voice coil motor, so that the force control connection block drives the spindle seat to move downward in the vertical direction until the controller monitors that the real-time current of the voice coil motor is equal to the target current.

[0012] Another technical solution for the present invention to solve the above technical problems is to provide a die bonding device, which includes a carrier table and a loading device, an unloading device, a mounting device, a glue dipping device, a transfer table device and a crystal supply device installed inside the carrier table; the loading device and the unloading device are arranged in parallel at opposite ends of the carrier table, the mounting device is arranged between the discharge end of the loading device and the feed end of the unloading device, the glue dipping device is located on one side of the loading device, and the glue dipping device and the transfer table device are respectively arranged on both sides of the mounting device, and the crystal supply device is located on the side of the transfer table device away from the mounting device; inside the carrier table, there are movable main bonding head assemblies, first bonding head assemblies and second bonding head assemblies, the main bonding head assembly is arranged on one side of the unloading device, the first bonding head assembly is arranged on one side of the loading device, and the second bonding head assembly is arranged on one side of the crystal supply device; The main bonding head assembly includes the above-mentioned die bonder bonding head device for mounting a chip onto a substrate, and includes the following steps: providing a substrate, the loading device moves the substrate into the working area of the first bonding head assembly, and the first bonding head assembly cooperates with the glue dipping device to perform dotting glue treatment on the substrate; the crystal supply device provides a chip, and the second bonding head assembly transports the chip to the transfer table device; the loading device moves the substrate onto the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chip into the working area of the main bonding head assembly; the main bonding head assembly mounts the chip on the transfer table device onto the substrate; the unloading device receives the substrate after mounting from the mounting device.

[0013] Preferably, the mounting device includes a workbench assembly and a first linear module; the workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device.

[0014] Preferably, the transfer table device includes a transfer table body and a second linear module; the transfer table body can slide in the length direction of the second linear module, so that the transfer table body can slide into the working area of the second bonding head assembly or the working area of the main bonding head assembly; the second linear module is arranged parallel to the first linear module.

[0015] Compared with the prior art, a die bonder bonding head device, a mounting method and a die bonding device provided by the present invention have the following advantages: 1. An embodiment of the present invention provides a bonding head device for a mounter, which can be used for picking and mounting chips during the automatic mounting process in the semiconductor industry. The bonding head device for the mounter includes a mounting module, a force control module, and a fixed seat. Among them, the mounting module includes a main shaft and a main shaft seat. The main shaft is rotatably passed through the main shaft seat, and the working end of the main shaft is exposed outside the main shaft seat. The working end of the main shaft can be connected to nozzles of different specifications to adsorb different types of chips; the nozzle at the working end of the main shaft reaches the picking position and the mounting position of the chip by the movement of the main shaft and the main shaft seat in the vertical direction. The nozzle is responsible for picking up, adsorbing the chip, and completing the mounting of the chip.

[0016] Understandably, the force control module includes a voice coil drive assembly, a force control connection block, and a guide rail assembly. The voice coil drive assembly includes a voice coil motor and a controller that are electrically connected. The force control connection block is respectively connected to the voice coil motor and the bottom of the main shaft seat, which can make the overall structural design of the force control module more compact. The controller can real-time monitor the real-time current of the voice coil motor and can control the current magnitude of the voice coil motor when it works; the controller drives the main shaft seat to move by controlling the current when the voice coil motor works, and thus can real-time adjust the mounting downforce of the nozzle on the chip during the mounting process, realizing precise force control of the mounting pressure.

[0017] It should be noted that the guide rail assembly is located between the main shaft seat and the fixed seat. The main shaft seat is slidably connected to the fixed seat through the guide rail assembly, which can ensure that the position of the chip does not shift during the high-speed movement of the nozzle of the mounting module when picking up and mounting the chip, avoiding damage to the chip and affecting the mounting effect; through this design, when the chip needs to be mounted to the corresponding mounting position, the voice coil drive assembly, the force control connection block, and the guide rail assembly cooperate with each other to control the magnitude of the downforce during mounting, so that the mounting accuracy can reach the micron level, improving the mounting accuracy of the bonding head device for the mounter, meeting the high-precision requirements of chip mounting, and being able to adapt to COB packaging and BOX packaging, meeting the mounting requirements of different chip mounting complex processes.

[0018] 2. In the bonding head device for the mounter provided by the embodiment of the present invention, the voice coil motor includes a motor body and a voice coil mover. The motor body is signal-connected to the voice coil mover, and the controller is electrically connected to the motor body. The controller can send a control signal to the motor body to control the input current of the motor body to adjust the magnitude of the downforce when picking up and mounting the chip. The motor body sends a signal to the voice coil mover to slide in the vertical direction. One end of the voice coil mover can slide relative to the motor body in the vertical direction, and the other end of the voice coil mover is connected to the force control connection block, which can realize that when the voice coil mover slides, the voice coil mover drives the force control connection block to achieve synchronous movement. At the same time, the force control connection block also drives the main shaft seat to move; through this design, the traditional structure of using a spring to control the downforce can be replaced, ensuring the high-precision requirements for the chip mounting force.

[0019] It should be noted that one end of the voice coil mover is fixedly connected to the force control connection block, which can improve the force transmission efficiency of the downward pressure during chip picking and mounting. Compared with the method of directly driving the spindle base by the voice coil mover, the force transmission efficiency can be increased by about 15%.

[0020] 3. In the head bonding device of the mounter provided by the embodiment of the present invention, the motor body is installed inside the fixed seat, which can make the overall structure of the head bonding device of the mounter more compact, and can also prevent the motor body from being damaged, thereby extending the service life of the voice coil drive assembly.

[0021] It should be noted that a part of the voice coil mover is arranged inside the fixed seat, which can realize the signal connection between the voice coil mover and the motor body; another part of the voice coil mover is exposed at the bottom of the fixed seat, and the exposed end thereof is fixedly fitted with the force control connection block, which can realize that when the voice coil mover slides relative to the motor body, the spindle base is driven to move synchronously through the force control connection block.

[0022] 4. In the head bonding device of the mounter provided by the embodiment of the present invention, the first guide rail and the second guide rail are vertically arranged between the spindle base and the fixed seat, and the first guide rail and the second guide rail can slide relative to each other to form a cross guide rail. It can be understood that the cross guide rail between the spindle base and the fixed seat can be used as a guide to complete the actions of force control for downward chip picking and mounting, which has the advantages of low friction and high precision, and will not generate lateral force on the chip during chip picking or mounting, avoiding chip damage and affecting the yield.

[0023] Among them, the relative sliding of the second guide rail relative to the first guide rail is realized by the relative movement between the spindle base and the fixed seat. When the voice coil mover slides in the vertical direction, since the exposed end of the voice coil mover is fixedly fitted with the force control connection block, and the force control connection block is also connected to the bottom of the spindle base, therefore, when the voice coil mover slides, the spindle base is driven to move synchronously through the force control connection block.

[0024] It should be noted that by fixedly installing the first guide rail on the outer wall surface of the fixed seat and fixedly installing the second guide rail on the outer wall surface of the spindle base, it can be ensured that when the first guide rail and the second guide rail slide relative to each other, the spindle base synchronously completes a small stroke of movement along with the sliding of the first guide rail. The cross guide rail formed by the first guide rail and the second guide rail can prevent the movement distance of the spindle base from being too large and damaging the chip.

[0025] 5. In the head binding device of the placement machine provided in the embodiment of the present invention, two groups of cross guide rails are arranged between the main spindle seat and the fixed seat. In the two groups of cross guide rails, the inner first guide rails are symmetrical with each other, and the outer second guide rails are also symmetrical with each other, and the second guide rails of the same group of cross guide rails can make linear motion in the vertical direction relative to the first guide rail. Through this design, it can be ensured that the main spindle seat only moves a short stroke in the vertical direction when the second guide rail slides relative to the first guide rail, and the cross guide rails can make the movement of the main spindle seat maintain good stability, thereby ensuring high-precision placement force control of the head binding device of the placement machine during the chip placement process, effectively preventing overshoot during the placement process and causing damage to the chip, thereby improving the yield of the finished product.

[0026] 6. In the head binding device of the placement machine provided in the embodiment of the present invention, the driving member is arranged on the side of the force control module away from the placement module, and the working end of the driving member is connected to the main shaft transmission through the synchronous wheel assembly. The rotation of the driving member first drives the synchronous wheel assembly to achieve synchronous rotation, and then the synchronous wheel assembly drives the main shaft to rotate synchronously. Through this design, the friction force encountered by the main shaft when rotating is lower.

[0027] It should be noted that compared with the situation where the driving member directly drives the main shaft to rotate, the driving member and the main shaft in the embodiment of the present invention are not arranged on the same axis, but a transmission connection is achieved through a synchronous wheel assembly, which greatly improves the internal sealing of the mounting module of the head binding device of the placement machine.

[0028] It can be understood that by using a synchronous belt transmission method to realize the rotation of the main shaft when the driving part rotates, the size of the head binding device of the placement machine in its vertical direction can be reduced, and sufficient space can be reserved for installing a downward-looking camera. When the head binding device of the placement machine is working, the main shaft can achieve 360° rotation to correct the chip mounting angle, improve the accuracy of the chip mounting angle, and be compatible with replacement of suction nozzles of different sizes.

[0029] It should be noted that the synchronous belt transmission method is to install a second synchronous wheel at the working end of the driving member. When the driving member is working, the rotation of the driving member drives the second synchronous wheel to achieve synchronous rotation; the first synchronous wheel is installed on the part of the main shaft exposed to the main shaft seat, and a synchronous belt is set between the first synchronous wheel and the second synchronous wheel. Through this design, when the second synchronous wheel rotates, the first synchronous wheel is connected to the second synchronous wheel through the synchronous belt, and the rotation of the second synchronous wheel drives the first synchronous wheel to achieve synchronous rotation.

[0030] 7. An embodiment of the present invention further provides a mounting method, which is applied to the above-mentioned mounting machine head binding device to mount the chip to the substrate; it should be noted that the mounting method has the same beneficial effects as the above-mentioned mounting machine head binding device, which will not be repeated here.

[0031] 8. The embodiment of the present invention further provides a die bonding device. Among them, the main bonding head assembly includes the above-mentioned mounter bonding head device for mounting the chip onto the substrate. Specifically, the movable main bonding head assembly, the first bonding head assembly, and the second bonding head assembly are independently arranged to ensure that the main bonding head assembly can achieve high-speed mounting of the chip, and avoid the dispensing and chip picking processes of the other bonding head assemblies from affecting the mounting effect of the main bonding head assembly on the chip. The first bonding head assembly dispenses glue on the substrate located in the loading device through a glue dipping device, and the second bonding head assembly picks up the chip through a crystal feeding device and transports the chip to the transfer table device. The dispensing and chip picking processes are processed in parallel, improving the overall efficiency of die bonding. Moreover, the first bonding head assembly is used for dispensing glue on the substrate, and the second bonding head assembly is used for picking and placing the chip. Since the main bonding head assembly needs to mount the chip, it has relatively high precision requirements. Separating the working areas of the first bonding head assembly, the second bonding head assembly, and the main bonding head assembly reduces the precision requirements for the first bonding head assembly and the second bonding head assembly, playing a role in cost savings.

[0032] It can be understood that the layout inside the carrier table is compact. When the substrate after dispensing is transported to the mounting area for mounting, the loading device can receive a new substrate to be processed for dispensing again and wait for the previous substrate after dispensing to complete the mounting. After the transfer table device transports the chip to the mounting area and the main bonding head assembly takes away the chip, it can receive a new chip from the crystal feeding device again. The dispensing and chip picking processes in the embodiment of the present invention do not affect each other. Through the design of parallel pipeline, the overall efficiency of the die bonding device is further improved.

[0033] It should be noted that the main bonding head assembly in the die bonding device includes the above-mentioned mounter bonding head device, which can make the precision of mounting the chip onto the substrate reach the micron level, meet the high-precision requirements of chip mounting, and can adapt to different packaging technologies to meet the mounting requirements of different complex chip mounting processes. The precision achieved by the mounter bonding head device is coordinated with the layout inside the carrier table, which can improve the overall working efficiency of the die bonding device while ensuring the chip mounting effect.

[0034] 9. In the die bonding device provided by the embodiment of the present invention, the workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device. Through this layout, the unnecessary time occupied by the substrate during transportation can be saved, and the efficiency of mounting the chip onto the substrate can be further improved.

[0035] 10. In the die bonding equipment provided by the embodiments of the present invention, the transfer table device can quickly and stably transfer the chips, reduce the waiting time for mounting, and improve the production efficiency. It can be understood that when the transfer table body slides into the working area of the second bonding head assembly, the second bonding head assembly picks up the chips on the crystal supply device and places them on the transfer table body. When the transfer table body slides into the working area of the main bonding head assembly, the main bonding head assembly picks up the chips on the transfer table body and mounts them on the substrate. Among them, the second linear module is arranged in parallel with the first linear module, which can reduce the overall volume of the die bonding equipment while realizing parallel operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0037] Figure 1 is the overall structural schematic diagram of the bonding head device of the mounter in the embodiment of the present invention Figure 1 .

[0038] Figure 2 is the cross-sectional view including the internal structure of the bonding head device of the mounter in the embodiment of the present invention Figure 1 .

[0039] Figure 3 is the cross-sectional view including the internal structure of the bonding head device of the mounter in the embodiment of the present invention Figure 2 .

[0040] Figure 4 is the overall structural schematic diagram of the bonding head device of the mounter in the embodiment of the present invention Figure 2 .

[0041] Figure 5 is the cross-sectional view including the internal structure of the bonding head device of the mounter in the embodiment of the present invention Figure 3 .

[0042] Figure 6 is the flow schematic diagram of the mounting method in the embodiment of the present invention.

[0043] Figure 7 is the overall framework schematic diagram of the die bonding equipment in the embodiment of the present invention Figure 1 .

[0044] Figure 8 is the overall framework schematic diagram of the die bonding equipment in the embodiment of the present invention Figure 2 .

[0045] Figure 9It is a schematic flowchart of the process in which the main bonding head assembly in the die bonding equipment of the embodiment of the present invention mounts the chip onto the substrate.

[0046] Figure 10 It is a schematic structural diagram of the mounting device of the die bonding equipment of the embodiment of the present invention.

[0047] Figure 11 It is a schematic structural diagram of the turntable device of the die bonding equipment of the embodiment of the present invention.

[0048] Explanation of the attached drawing reference numerals: 10. Mounting head device of the mounter; 1. Mounting module; 11. Main shaft; 111. Vacuum channel; 12. Main shaft seat; 121. Bearing assembly; 1211. First bearing group; 1212. Second bearing group; 122. Spacer ring assembly; 1221. Upper spacer ring; 1222. Lower spacer ring; 123. Elastic gasket; 13. Suction nozzle; 2. Force control module; 21. Guide rail assembly; 211. First guide rail; 212. Second guide rail; 22. Voice coil drive assembly; 221. Voice coil motor; 2211. Motor body; 2212. Voice coil mover; 222. Controller; 23. Force control connection block; 3. Fixed seat; 4. Drive module; 41. Driving part; 42. Synchronous pulley assembly; 421. First synchronous pulley; 422. Second synchronous pulley; 423. Timing belt; 5. Sealing module; 51. Sealing bearing; 52. Sealing element; 521. Bending part; 53. Air pipe; 20. Die bonding equipment; 201. Carrying platform; 2011. Main bonding head assembly; 2012. First bonding head assembly; 2013. Second bonding head assembly; 202. Loading device; 203. Unloading device; 204. Mounting device; 2041. Workbench assembly; 2042. First linear module; 2043. First drag chain; 205. Glue dipping device; 206. Turntable device; 2061. Turntable body; 2062. Second linear module; 2063. Second drag chain; 207. Crystal supply device. Detailed implementation manners

[0049] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the attached drawings and implementation examples. It should be understood that the specific implementation examples described herein are only used to explain the present invention and are not used to limit the present invention.

[0050] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0051] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention are used to distinguish different objects, rather than to describe a specific order.

[0052] In the present invention, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0053] Moreover, in addition to being able to represent an orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0054] In addition, the terms "mounted", "arranged", "provided with", "connected", "linked" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] Please refer to Figure 1 、 Figure 2 and Figure 3, an embodiment of the present invention provides a pick-and-place head device 10 for a mounter, which is used for picking and placing chips. The pick-and-place head device 10 of the mounter includes a placement module 1, a force control module 2 and a fixed seat 3; the placement module 1 includes a main shaft 11 and a main shaft seat 12, the main shaft 11 is rotatably disposed through the main shaft seat 12, and the working end of the main shaft 11 is exposed outside the main shaft seat 12; the force control module 2 includes a voice coil drive assembly 22, a force control connection block 23 and a guide rail assembly 21, the voice coil drive assembly 22 includes a voice coil motor 221 and a controller 222, the voice coil motor 221 is installed on the fixed seat 3, and the controller 222 is electrically connected to the voice coil motor 221; the force control connection block 23 is respectively connected to the voice coil motor 221 and the bottom of the main shaft seat 12; the guide rail assembly 21 is disposed between the main shaft seat 12 and the fixed seat 3, and the main shaft seat 12 is slidably connected to the fixed seat 3 through the guide rail assembly 21.

[0056] The pick-and-place head device 10 provided by the embodiment of the present invention can be used for picking and placing chips during the automatic placement process in the semiconductor industry. The pick-and-place head device 10 of the mounter is applied to occasions with high-precision placement requirements. When picking and adsorbing chips, features that need to be identified can be exposed, and during the chip placement process, a placement process of real-time alignment and placement of the upper surface of the chip and the identification points of the placement position is realized.

[0057] Specifically, the placement module 1 includes a main shaft 11 and a main shaft seat 12, and the main shaft 11 is rotatably disposed through the main shaft seat 12, and the working end of the main shaft 11 is exposed outside the main shaft seat 12. Among them, the working end of the main shaft 11 can be connected to nozzles of different specifications to adsorb different types of chips. By moving the main shaft 11 and the main shaft seat 12 in the vertical direction, the nozzle at the working end of the main shaft 11 reaches the picking position and the placement position of the chip, and the nozzle is responsible for picking, adsorbing the chip and completing the placement of the chip.

[0058] It can be understood that the force control module 2 includes a voice coil drive assembly 22, a force control connection block 23 and a guide rail assembly 21. The voice coil drive assembly 22 includes a voice coil motor 221 and a controller 222 that are electrically connected. The positive pole of the voice coil motor 221 is connected to the positive pole of the controller 222, and the negative pole of the voice coil motor 221 is connected to the negative pole of the controller 222; the force control connection block 23 is respectively connected to the voice coil motor 221 and the bottom of the main shaft seat 12. The controller 222 can monitor the real-time current of the voice coil motor 221 in real time and can control the magnitude of the current for the voice coil motor 221 to work; before placement, the controller 222 first sets a target current according to the type of the chip and the placement requirements of the substrate, that is, the placement force that the pick-and-place head device 10 needs to apply during placement.

[0059] In the embodiment of the present invention, the force control module 2 executes force control in the form of current loop force control. The controller 222 controls the current when the voice coil motor 221 works, so that the force control connection block 23 drives the spindle base 12 to move, and then the mounting down pressure of the nozzle on the chip can be adjusted in real time during the mounting process, realizing precise force control of the mounting pressure, and further meeting the force pressing requirements when using the chip mounting head device 10 of the mounter.

[0060] It should be noted that the guide rail assembly 21 is located between the spindle base 12 and the fixed base 3. The spindle base 12 is slidably connected to the fixed base 3 through the guide rail assembly 21, which can ensure that the position of the chip does not shift during the high-speed movement of the nozzle of the mounting module 1 when picking up and mounting the chip, avoiding damage to the chip and affecting the mounting effect. Through this design, when the chip needs to be mounted to the corresponding mounting position, the voice coil drive assembly 22, the force control connection block 23 and the guide rail assembly 21 cooperate with each other to control the magnitude of the mounting down pressure, so that the mounting accuracy can reach the micron level, improving the mounting accuracy of the chip mounting head device 10 of the mounter, meeting the high-precision requirements of chip mounting, and being able to adapt to COB packaging and BOX packaging, meeting the mounting requirements of different chip mounting complex processes.

[0061] Among them, COB (Chip On Board) packaging, that is, chip-on-board packaging, is a packaging method that directly mounts the laser chip on the PCB circuit board, which not only saves the area of the PCB circuit board, but also constructs a shorter interconnection path, thereby improving the overall performance. COB packaging has the characteristics of miniaturization, light weight and low cost, is suitable for large-scale production, and is applicable to short-distance application environments such as data centers, high-performance computing networks and campus networks.

[0062] BOX packaging, also known as hermetic packaging, is to encapsulate the optical device in a metal box filled with inert gas to protect the optical components from the external environment and enhance the heat dissipation performance. BOX packaging has the characteristics of high reliability, stability and easy maintenance, and is applicable to environments with large temperature and humidity fluctuations. Due to its independent packaging box body, the optical module of BOX packaging can resist external interferences such as dust and moisture, and is applicable to harsh environments or telecom environments lacking monitoring equipment.

[0063] The force control connection block 23 of the embodiment of the present invention is located at the bottom of the spindle base 12 and the fixed base 3, which can make the structure of the chip mounting head device 10 of the mounter more compact in the horizontal direction. And by connecting the voice coil motor 221 and the bottom of the spindle base 12 through the force control connection block 23, the guide rail assembly 21 only needs to carry the sliding of the spindle base 12 of the mounting module 1. Compared with the prior art that needs to realize force control for the entire head device, the accuracy is higher and it is easier to control.

[0064] The mounting process of the chip mounter bonding head device 10 in this embodiment is as follows: According to the type of the chip to be mounted and the mounting requirements of the substrate, the target current for mounting the chip to the substrate is preset in advance. The target current corresponds to the target mounting force for the chip mounter bonding head device 10 to mount the chip to the substrate, and the value of the target current is stored in the controller 222; the working end of the spindle 11 picks up the chip and mounts it to the substrate. When the chip contacts the substrate, the controller 222 inputs the real-time current to the voice coil motor 221, and the controller 222 can monitor the real-time current of the voice coil motor 221 in real time; the controller 222 sends a control signal to the voice coil motor 221 to adjust the real-time current of the voice coil motor 221, so that the force control connection block 23 drives the spindle base 12 to move downward in the vertical direction until the controller 222 monitors that the real-time current value of the voice coil motor 221 is the same as the target current, and then a mounting is completed.

[0065] In some embodiments, the controller 222 adjusts the current range for the voice coil motor 221 to work in real time from 0.1 A to 1 A. The force control method of the current loop force control is generally applicable to the mounting of micro-components. When applied to this embodiment, it can accurately control the force of the chip mounter bonding head device 10 to adsorb or mount the chip, avoid overshoot damage to the chip, and ensure the mounting accuracy. It can maintain stable force control during the high-speed movement of picking up and mounting, thereby improving the yield and mounting efficiency of the final product; in addition, the current loop force control can also quickly switch and adjust the mounting force during the high-speed mounting process to adapt to the mounting requirements of different components.

[0066] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown in, the voice coil motor 221 includes a motor body 2211 and a voice coil mover 2212. The motor body 2211 is signal-connected to the voice coil mover 2212, and the controller 222 is electrically connected to the motor body 2211; the motor body 2211 is installed on the fixed seat 3, one end of the voice coil mover 2212 can slide relative to the motor body 2211 in the vertical direction, and the other end is connected to the force control connection block 23.

[0067] It can be understood that the controller 222 can send a control signal to the motor body 2211. Controlling the current input to the motor body 2211 can adjust the magnitude of the downward pressure when picking up and mounting the chip. The motor body 2211 sends a signal to the voice coil mover 2212 to slide in the vertical direction. Since one end of the voice coil mover 2212 can slide relative to the motor body 2211 in the vertical direction and the other end of the voice coil mover 2212 is connected to the force control connection block 23, it can be realized that when the voice coil mover 2212 slides, the voice coil mover 2212 drives the force control connection block 23 to move synchronously. At the same time, the force control connection block 23 also drives the spindle base 12 to move.

[0068] It should be noted that the motor body 2211 and the voice coil mover 2212 serve as the fixed part and the dynamic part respectively. The force control connection block 23, as a transmission connection member connected to the bottom of the spindle base 12 and one end of the voice coil mover 2212 respectively, can push or pull the bottom of the spindle base 12 to slide synchronously when the voice coil mover 2212 slides. Through this design, the traditional method of using a spring to control the downward pressure can be replaced. In this embodiment, when the bonding head device 10 of the chip mounter picks up, adsorbs or mounts a chip and needs to control the force, the controller 222 sets the current input to the motor body 2211 to adjust the adsorption force or the bonding force, and inputs a current signal to the motor body 2211 to ensure precise force control for chip mounting, preventing the chip from being damaged during mounting or adsorption.

[0069] As known to those skilled in the art, a voice coil motor is a linear motor that can convert electrical energy into linear motion mechanical energy without any mechanical transmission links, and has the characteristics of simple structure, small size, fast dynamic response speed, etc. Its working principle is that a current-carrying coil (conductor) placed in a magnetic field will generate a force, and the magnitude of the force is proportional to the current applied to the coil. Based on this principle, the motion form of the voice coil motor can be linear or circular arc. Therefore, by using the fact that the magnitude of the force is proportional to the current applied to the coil, the function of the mechanical sensor during the mounting process can be replaced, and at the same time, the structure of the bonding head device 10 of the chip mounter can be streamlined, and the process requirements for mounting different types of chips can be more effectively achieved.

[0070] Specifically, a voice coil motor mainly consists of a mover and a stator. In the embodiment of the present invention, a permanent magnet (i.e., a part of the voice coil stator) is provided on the motor body 2211, and the voice coil mover 2212 is composed of several coils, and these coils will generate electromagnetic force after being energized, which can interact with the permanent magnet on the motor body 2211, so that the coil is subjected to a thrust or a pull force.

[0071] Further, it should be noted that one end of the voice coil mover 2212 is fixedly connected to the force control connection block 23, which can improve the force transmission efficiency of the downward pressure when picking up and mounting the chip. Compared with the method of directly driving the spindle base 12 by the voice coil mover 2212, the force transmission efficiency can be increased by about 15%.

[0072] Furthermore, the motor body 2211 is installed inside the fixed seat 3, a part of the voice coil mover 2212 is arranged inside the fixed seat 3, and the other part is exposed at the bottom of the fixed seat 3. The exposed end of the voice coil mover 2212 is fixedly fitted with the force control connection block 23.

[0073] Understandably, the motor body 2211 is installed inside the fixed seat 3, which can prevent the motor body 2211 from being damaged, thereby extending the service life of the voice coil drive assembly 22; a part of the voice coil mover 2212 is arranged inside the fixed seat 3, which can realize the signal connection between the voice coil mover 2212 and the motor body 2211, and the other part of the voice coil mover 2212 is exposed at the bottom of the fixed seat 3, and the exposed end thereof is fixedly fitted with the force control connection block 23, so that when the voice coil mover 2212 slides relative to the motor body 2211, the spindle seat 12 can be driven to move synchronously through the force control connection block 23.

[0074] Please continue to refer to Figure 1 、 Figure 2 and Figure 3 , the guide rail assembly 21 includes a first guide rail 211 and a second guide rail 212, and the first guide rail 211 and the second guide rail 212 are vertically arranged between the spindle seat 12 and the fixed seat 3; the first guide rail 211 and the second guide rail 212 can slide relative to each other to form a cross guide rail, and at least two groups of cross guide rails are arranged between the spindle seat 12 and the fixed seat 3.

[0075] Understandably, the cross guide rail arranged between the spindle seat 12 and the fixed seat 3 can be used as a guide to complete the actions of force control for downward picking and chip mounting. The cross guide rail has the advantages of low friction and high precision, and will not generate a lateral force on the chip during picking or mounting the chip, avoiding chip damage and affecting the yield of the product; the cross guide rail arranged between the spindle seat 12 and the fixed seat 3 can ensure that the first guide rail 211 and the second guide rail 212 will not be easily damaged and affect the service life, and can avoid the poor relative sliding effect between the first guide rail 211 and the second guide rail 212, resulting in the influence on the accuracy during chip mounting.

[0076] In the embodiment of the present invention, when the voice coil mover 2212 slides up and down, since the force control connection block 23 is respectively connected to the bottom of the voice coil mover 2212 and the spindle seat 12, the spindle seat 12 also moves up and down as the voice coil mover 2212 slides. At this time, the spindle seat 12 can slide up and down relative to the fixed seat 3.

[0077] It should be noted that the first guide rail 211 and the second guide rail 212 are vertically arranged between the spindle seat 12 and the fixed seat 3, that is, the first guide rail 211 and the second guide rail 212 are parallel to the spindle 11; specifically, the first guide rail 211 and the second guide rail 212 in the embodiment of the present invention are located on the opposite side surfaces between the spindle seat 12 and the fixed seat 3. Arranging the first guide rail 211 and the second guide rail 212 on the side can prevent the chip position above the mounting position from shifting during the high-speed movement of the chip picking and mounting process of the tying head device 10 of the chip mounter.

[0078] As a high-precision and high-rigidity limited linear motion system, the cross-rail generally consists of two rails with V-shaped raceways, a roller cage, and cylindrical rollers. The mutually crossed cylindrical rollers reciprocate on the precisely ground V-shaped raceway surfaces, capable of bearing loads in all directions and achieving high-precision and smooth linear motion. Compared with linear rails, the cross-rail is a split structure composed of two slidable rails. Functionally, the cross-rail is generally suitable for short-stroke, high-frequency, and high-precision applications.

[0079] The main function of the cross-rail is to provide stable and efficient linear motion. It achieves smooth motion by highly precise rolling elements (such as rollers or balls) sliding between the rails. This design enables the cross-rail to maintain good smoothness and high load-bearing capacity under multi-directional loads.

[0080] Furthermore, it should be noted that the bonding head device 10 of the pick-and-place machine, as an automated equipment, can provide stable support and rapid movement through the cross-rail, ensuring high stability and accuracy during the processing, thereby improving the bonding efficiency and bonding accuracy. Additionally, compared with traditional slider rails, since the installation space of the cross-rail is smaller, setting it between the spindle base 12 and the fixed base 3 can make the overall structure of the pick-and-place machine bonding head device 10 more compact. Moreover, the energy loss caused by the rolling friction of the cross-rail is less, which can improve the overall working efficiency of the pick-and-place machine bonding head device 10.

[0081] Further, the first rail 211 is fixedly installed on the outer wall surface of the fixed base 3, and the second rail 212 is fixedly installed on the outer wall surface of the spindle base 12. Through this design, it can be ensured that when the first rail 211 and the second rail 212 slide relative to each other, the spindle base 12 moves a small stroke synchronously with the sliding of the first rail 211 to meet the high-precision requirements of chip bonding.

[0082] Further, when the voice coil mover 2212 slides in the vertical direction, it synchronously drives the spindle base 12 to move through the force control connection block 23, causing the second rail 212 to slide relative to the first rail 211.

[0083] It can be understood that the relative sliding of the second rail 212 relative to the first rail 211 is achieved through the relative movement between the spindle base 12 and the fixed base 3. When the voice coil mover 2212 slides in the vertical direction, since the exposed end of the voice coil mover 2212 is fitted and fixed with the force control connection block 23, and the force control connection block 23 is also connected to the bottom of the spindle base 12, therefore, when the voice coil mover 2212 slides, it synchronously drives the spindle base 12 to move through the force control connection block 23.

[0084] In some embodiments, two groups of cross guide rails are provided between the spindle seat 12 and the fixed seat 3, the first guide rails 211 in the two groups of cross guide rails are symmetrical with each other, the second guide rails 212 are symmetrical with each other, and the distance between the first guide rails 211 is smaller than the distance between the second guide rails 212; the second guide rails 212 in the same group of cross guide rails can make linear motion in the vertical direction relative to the first guide rails 211.

[0085] It should be noted that the provision of two sets of cross guide rails can make the spindle base 12 move more smoothly in the vertical direction, and the cooperation between the two sets of cross guide rails can prevent the spindle base 12 from being offset to a certain extent in the horizontal direction when the head binding device 10 of the placement machine picks up and mounts the chip, thereby avoiding the error between the chip and the mounting position and requiring real-time adjustment, thereby improving the mounting efficiency.

[0086] Among them, the distance between the first guide rails 211 is smaller than the distance between the second guide rails 212, that is, the first guide rails 211 in the two groups of cross guide rails are located on the inner side, and the second guide rails 212 are located on the outer side. By fixing the inner first guide rail 211 on the outer wall surface of the fixed seat 3, and fixing the outer second guide rail 212 on the outer wall surface of the spindle seat 12, the fixed fixed seat 3 is kept fixed on the inner side of the cross guide rail, and the spindle seat 12 that can slide in the vertical direction is fixed on the outer side of the cross guide rail. Through this design, the bearing capacity of the cross guide rail can be improved.

[0087] It should be further explained that, compared with the design in which the first guide rail 211 is fixedly installed on the spindle seat 12 and the second guide rail 212 is fixedly installed on the fixed seat 3, the cross guide rail in this embodiment has a stronger load-bearing capacity.

[0088] It can be understood that the first guide rails 211 are symmetrical with each other, the second guide rails 212 are symmetrical with each other, and the second guide rails 212 of the same group of cross guide rails can make linear motion in the vertical direction relative to the first guide rails 211, so that when the second guide rails 212 slide relative to the first guide rails 211, it can be ensured that the spindle seat 12 only moves in the vertical direction, thereby realizing high-precision mounting force control of the head binding device 10 of the placement machine when mounting chips, so as to meet the process requirements of chip mounting with different pressures, effectively prevent the chip from being damaged due to overshoot during the mounting process, and thereby improve the yield of the finished product.

[0089] See also Figure 1 and Figure 4 The head binding device 10 of the placement machine also includes a driving module 4, which includes a driving member 41 and a synchronous wheel assembly 42. The driving member 41 is located on the side of the force control module 2 away from the placement module 1; the driving member 41 is penetrated by the fixed seat 3, and the working end of the driving member 41 is connected to the main shaft 11 through the synchronous wheel assembly 42.

[0090] It can be understood that the driving module 4 is used to drive the head binding device 10 of the placement machine to achieve high-precision chip picking and placement, wherein the driving member 41 is arranged through the fixed seat 3, and the synchronous wheel assembly 42 is located between the working end of the driving member 41 and the working end of the main shaft 11.

[0091] The driving member 41 provided in the embodiment of the present invention is a hollow rotating motor, which can realize 360° arbitrary angle mounting correction when mounting chips, further improving the angle accuracy of chip mounting using the mounting machine head binding device 10.

[0092] Specifically, the driving member 41 is connected to the main shaft 11 through the synchronous wheel assembly 42. When the driving member 41 in the driving module 4 is working, the rotation of the driving member 41 first drives the synchronous wheel assembly 42 to achieve synchronous rotation, and then the synchronous wheel assembly 42 drives the main shaft 11 to rotate synchronously. It should be noted that, in the embodiment of the present invention, the rotation of the driving member 41 drives the rotation of the synchronous wheel assembly 42, thereby driving the main shaft 11 to rotate. Through this design, it is avoided that the driving member 41 needs to be directly connected to the end of the main shaft 11, occupying the position of the end of the main shaft 11 to drive the rotation of the main shaft 11, thereby ensuring good sealing inside the mounting module 1.

[0093] The head binding device 10 of the chip mounter provided in the embodiment of the present invention realizes the synchronous rotation of the main shaft 11 and the driving member 41 through the synchronous wheel assembly 42. Through this design, the friction force on the main shaft 11 during rotation can be reduced.

[0094] It should be noted that, compared with the situation where the driving member 41 and the main shaft 11 directly rotate synchronously on the same axis, the driving member 41 and the main shaft 11 in the embodiment of the present invention are not arranged on the same axis, and the driving member 41 is located on the side of the main shaft 11. The transmission connection between the driving member 41 and the main shaft 11 is realized through the synchronous wheel assembly 42, which greatly improves the internal sealing of the head binding device 10 of the placement machine.

[0095] Optionally, the driving member 41 is installed on the fixing seat 3 and is detachably connected to the fixing seat 3. The driving member 41 can be installed on the fixing seat 3 by bolt connection, snap connection, or other installation methods. That is to say, the specific implementation method of this embodiment cannot be used to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

[0096] Please continue reading Figure 1 and Figure 4The synchronous wheel assembly 42 includes a first synchronous wheel 421, a second synchronous wheel 422 and a synchronous belt 423, and the synchronous belt 423 is simultaneously mounted on the first synchronous wheel 421 and the second synchronous wheel 422; the first synchronous wheel 421 is installed on the part of the main shaft 11 exposed to the main shaft seat 12, and the second synchronous wheel 422 is installed on the working end of the driving member 41.

[0097] It can be understood that in the SMT head binding device 10 provided by the present invention, the main shaft 11 and the driving member 41 on the driving module 4 are arranged on different axes, and the driving member 41 is connected to the main shaft 11 through the synchronous wheel assembly 42, which is specifically achieved by synchronous belt transmission.

[0098] The transmission mode of the synchronous belt 423 is realized by a synchronous wheel structure. The synchronous wheel structure is also called a synchronous gear structure. It is a mechanical transmission device that transmits motion and power. The main function of this mechanical transmission device is to transmit motion and torque between two or more shafts to achieve synchronous operation between different-axis equipment or components; the synchronous wheel structure is widely used in engineering machinery, automation equipment, and transportation vehicles such as automobiles.

[0099] In a specific implementation of an embodiment of the present invention, the synchronous operation of the driving member 41 and the main shaft 11 can be achieved through the transmission of the synchronous belt 423. When the second synchronous wheel 422 rotates, the first synchronous wheel 421 is connected to the second synchronous wheel 422 through the synchronous belt 423. The rotation of the second synchronous wheel 422 drives the first synchronous wheel 421 to achieve synchronous rotation.

[0100] Specifically, a first synchronous wheel 421 is installed on the portion of the main shaft 11 exposed from the main shaft seat 12, and a second synchronous wheel 422 is installed on the working end of the driving member 41, and a synchronous belt 423 is arranged between the first synchronous wheel 421 and the second synchronous wheel 422, wherein both sides of the synchronous belt 423 are respectively wound around the first synchronous wheel 421 and the second synchronous wheel 422 to achieve synchronous rotation between the first synchronous wheel 421 and the second synchronous wheel 422.

[0101] Furthermore, when the driving member 41 is working, the second synchronous wheel 422 installed at the working end of the driving member 41 rotates synchronously with the rotation of the driving member 41. The rotation of the second synchronous wheel 422 drives the synchronous belt 423 to rotate, and then drives the first synchronous wheel 421 to rotate. At this time, the main shaft 11 installed with the first synchronous wheel 421 also rotates accordingly, realizing the transmission connection between the driving member 41 and the main shaft 11, so as to adjust the angle of the suction nozzle 13 to pick up the chip or mount the chip.

[0102] It should be noted that the head bonding device 10 of the mounter in this embodiment realizes the off-axis synchronous rotation of the driving member 41 and the main shaft 11 through a synchronous pulley structure. Through this design, the size of the head bonding device 10 of the mounter in its vertical direction can be reduced, so as to reserve enough space to install a downward camera. When the head bonding device 10 of the mounter works, the main shaft 11 can rotate 360° to correct the mounting angle of the chip, thereby improving the accuracy of the chip mounting angle.

[0103] In addition, reducing the size of the head bonding device 10 in its vertical direction can also reserve a certain space to provide equipment for replacing the suction nozzle 13 to meet the compatibility requirements for replacing suction nozzles 13 of different sizes.

[0104] Please refer to Figure 5 , a bearing assembly 121 is provided inside the main shaft seat 12. The bearing assembly 121 is arranged along the length direction of the main shaft 11 and sleeved on the main shaft 11. While the bearing assembly 121 of this embodiment is sleeved on the main shaft 11, it is also arranged along the length direction of the main shaft 11. Through this design, the rigidity of the main shaft 11 can be ensured.

[0105] It should be noted that the bearing assembly 121 is located inside the main shaft seat 12. During the process of the head bonding device 10 of the mounter sucking and mounting the chip, the bearing assembly 121 can support the rotation of the main shaft 11 for correcting the angle of the chip. In addition, setting the bearing assembly 121 can also reduce the friction generated during the chip mounting process and play a role in ensuring the rotational accuracy of the main shaft 11, ensuring that the head bonding device 10 rotates concentrically to meet the high-precision requirements of the chip mounting position.

[0106] Furthermore, the bearing assembly 121 includes a first bearing group 1211 and a second bearing group 1212. Among them, both the first bearing group 1211 and the second bearing group 1212 are stacked by the same number of bearings. In the first bearing group 1211 and the second bearing group 1212, the number of bearings can be one, two or more, and the specific number of bearings can be set according to the actual situation. For example, when the length of the main shaft 11 and the specific model of the bearings used change, the specific number of bearings can also be changed accordingly.

[0107] As a specific implementation manner of the embodiment of the present invention, both the first bearing group 1211 and the second bearing group 1212 are composed of two bearings connected together. By arranging two groups of bearings on both sides of the spacer ring assembly 122, it can be ensured that when the head bonding device 10 presses down to pick up and mount the chip, no lateral force is generated on the chip.

[0108] It should be further noted that for the bonding head device 10 of the mounter provided in the embodiments of the present invention, its first bearing group 1211 and second bearing group 1212 are both composed of two bearings connected to each other. This design can provide good stability during chip mounting. However, the specific implementation manner of this embodiment does not limit the present invention. For example, the number of bearings included in the first bearing group 1211 and the second bearing group 1212 can be different, and setting multiple bearings can improve the working performance of the bonding head device 10 of the mounter and reduce the friction inside the device. Therefore, any modifications, equivalent replacements, improvements, etc. made within the principles of the present invention should be included within the protection scope of the present invention.

[0109] In some embodiments, a spacer ring assembly 122 is provided between the first bearing group 1211 and the second bearing group 1212; the spacer ring assembly 122 of this embodiment is arranged between the bottom end face of the first bearing group 1211 and the top end face of the second bearing group 1212, and the bearings of the first bearing group 1211 and the second bearing group 1212 respectively press the spacer ring assembly 122.

[0110] It can be understood that the function of the spacer ring assembly 122 is to separate the axial forces received by the first bearing group 1211 and the second bearing group 1212; through this design, the inner rings of the bearings of the first bearing group 1211 and the second bearing group 1212 are connected to the main shaft 11, and the outer rings are connected to the inner wall surface of the main shaft seat 12. When the bearings press the spacer ring assembly 122, the bearings abut against the spacer ring assembly 122 and make the inner ring of the spacer ring assembly 122 abut against the main shaft 11.

[0111] Please continue to refer to Figure 5 , the spacer ring assembly 122 includes an upper spacer ring 1221 and a lower spacer ring 1222. Both the upper spacer ring 1221 and the lower spacer ring 1222 are sleeved on the main shaft 11, and the upper spacer ring 1221 and the lower spacer ring 1222 are symmetric with each other.

[0112] It can be understood that in the spacer ring assembly 122 provided in the embodiments of the present invention, the upper spacer ring 1221 is arranged on the side close to the first bearing group 1211, and the lower spacer ring 1222 is arranged on the side close to the second bearing group 1212. By setting the upper spacer ring 1221 and the lower spacer ring 1222, the first bearing group 1211 is separated respectively. Among them, the upper spacer ring 1221 and the lower spacer ring 1222 can separate the axial forces received by the first bearing group 1211 and the second bearing group 1212.

[0113] Furthermore, an elastic gasket 123 is provided between the upper spacer ring 1221 and the lower spacer ring 1222. With this design, the axial clearance of the elastic gasket 123 has a certain elasticity, that is, the bearings on the first bearing group 1211 and the second bearing group 1212 have elasticity. When the chip mounter head device 10 mounts the chip to achieve precise force control, the first bearing group 1211 and the second bearing group 1212 have axial buffer force, thereby making the accuracy of the bearing assembly 121 higher, the service life longer, and it is not easily damaged.

[0114] Please refer to Figure 1 and Figure 5 , the chip mounter head device 10 further includes a sealing module 5 and an air pipe 53. One end of the sealing module 5 is hermetically connected to the main shaft 11 and is arranged away from the working end of the main shaft 11. The other end of the sealing module 5 is hermetically connected to the air pipe 53.

[0115] It can be understood that by setting the sealing module 5, the chip mounter head device 10 enables the air outlet end of the air pipe 53 to communicate with the inside of the sealing module 5, and the end of the sealing module 5 away from the air pipe 53 communicates with the inside of the main shaft 11 to achieve sealing between the inside of the air pipe 53, the sealing module 5, and the main shaft 11; the sealing module 5 can ensure good vacuum tightness of the chip mounter head device 10 and high vacuum degree during chip picking and mounting, thereby ensuring that the position of the chip does not shift during the high-speed movement of picking up the chip for mounting.

[0116] It should be noted that the air inlet end of the air pipe 53 is externally connected to a pumping device. With this design, it can meet the requirements of chip manufacturing during chip mounting and avoid the influence of insufficient vacuum tightness on the quality of the chip.

[0117] Furthermore, the sealing module 5 includes a sealing bearing 51 and a seal 52. The sealing bearing 51 is sleeved on the main shaft 11. The seal 52 is fixedly connected to the outer ring of the sealing bearing 51. One side of the seal 52 is detachably covered on the main shaft seat 12, and the other side communicates with the air pipe 53. Among them, the outer ring of the sealing bearing 51 is connected to the seal 52, and the inner ring of the sealing bearing 51 is sleeved on the main shaft 11.

[0118] It can be understood that the seal 52 is fixedly connected to the outer ring of the sealing bearing 51, and the seal 52 is detachably fixed on the main shaft seat 12. Since the sealing bearing 51 is sleeved on the main shaft 11, that is, the main shaft 11 is partially sleeved by the inner ring of the sealing bearing 51. With this design, the position of the main shaft 11 can be fixed to ensure high vacuum tightness of the chip mounter head device 10 and ensure that the vacuum pressure value during chip mounting is within the deviation range.

[0119] As a specific implementation manner in the embodiments of the present invention, while the seal 52 is fixedly connected to the outer ring of the sealed bearing 51, the side of the seal 52 facing the sealed bearing 51 is also detachably fixed to the main shaft seat 12, so that the seal 52 covers the main shaft seat 12. It can be seen from this that the side of the seal 52 connected to the main shaft seat 12 is hermetically connected through the sealed bearing 51, and the side of the seal 52 communicating with the air pipe 53 is also hermetically connected.

[0120] It should be noted that through the mutual cooperation between the seal 52 and the sealed bearing 51 sleeved on the main shaft 11, among them, the part of the seal 52 abutting against the outer ring of the sealed bearing 51. When the seal 52 is detachably fixed to the main shaft seat 12, the sealed bearing 51 is fixed by the abutment of the seal 52. Since the sealed bearing 51 is sleeved on the main shaft 11, that is, the main shaft 11 is sleeved on the inner ring part of the sealed bearing 51. Through this design, the position of the main shaft 11 can be fixed to ensure that the bonding head device 10 of the mounter has high vacuum tightness.

[0121] Furthermore, it should be noted that the connection manner between the seal 52 and the main shaft seat 12 includes but is not limited to threaded connection, pin connection and snap connection, and can be specifically set according to the actual situation. As a preferred implementation manner of the embodiments of the present invention, the specific connection manner of the detachable connection between one side of the seal 52 and the main shaft seat 12 is threaded connection.

[0122] Furthermore, please refer to Figure 5 , a turning portion 521 is provided on the side of the seal 52 facing the main shaft seat 12, and the seal 52 presses the outer ring of the sealed bearing 51 through the turning portion 521; the top end face of the sealed bearing 51 is lower than the top end face of the main shaft 11.

[0123] It can be understood that the turning portion 521 is provided on the side of the seal 52 facing the main shaft 11. The turning portion 521 on the seal 52 is responsible for fixing the sealed bearing 51, so that the seal 52 is fixedly connected to the outer ring of the sealed bearing 51 to press the outer ring of the sealed bearing 51; among them, the turning portion 521 of the embodiments of the present invention abuts against the outer side surface of the sealed bearing 51.

[0124] It should be noted that the seal 52 presses the outer ring of the sealed bearing 51 through the turning portion 521, and the outer ring of the sealed bearing 51 is sleeved on the main shaft 11. Through this design, the position of the main shaft 11 is further fixed to ensure that the air pipe 53 is hermetically connected to the inside of the main shaft 11 through the seal 52, and further improve the vacuum tightness of the bonding head device 10 of the mounter.

[0125] In some embodiments, the sealing module 5 can ensure good vacuum tightness between the air pipe 53 and the inside of the main shaft 11. By setting the top end face of the sealing bearing 51 lower than the top end face of the main shaft 11, the air pipe 53, the sealing module 5 and the inside of the main shaft 11 can be connected in sequence, so as to ensure that the inside of the main shaft 11 is communicated with the output end of the air pipe 53 through the seal 52.

[0126] Please continue to refer to Figure 1 and Figure 5 , the mounting module 1 further includes a suction nozzle 13, and the suction nozzle 13 is detachably connected to the working end of the main shaft 11; a vacuum channel 111 is provided inside the main shaft 11, and the inside of the suction nozzle 13 is communicated with the vacuum channel 111.

[0127] It should be noted that the suction nozzle 13 is detachably connected to the working end of the main shaft 11, which can realize the automatic replacement of suction nozzles 13 with different sizes during the working process of the bonding head device 10 of the mounter, improve the flexibility of the device, and meet the mounting requirements of the complex process of multi-chip mounting.

[0128] In some embodiments, the detachable connection method between the suction nozzle 13 and the working end of the main shaft 11 is magnetic connection. When the suction nozzle 13 is magnetically connected to the working end of the main shaft 11, magnetic components can be respectively provided on the contact surfaces where the two are connected, or one can be provided with a magnetic component and the other with a magnetic part; among them, the magnetic component can be a magnet, and the magnetic part can be a magnetic element such as an iron sheet. Of course, the connection method between the suction nozzle 13 and the working end of the main shaft 11 is not limited to magnetic connection, and can also be plug connection, snap connection or other connection methods, as long as the sealed communication between the suction nozzle 13 and the vacuum channel 111 is ensured.

[0129] In some embodiments, an adsorption hole is provided at the working end of the suction nozzle 13, and the inside of the suction nozzle 13 is communicated with the outside atmosphere through the adsorption hole. By providing the adsorption hole, vacuum adsorption of the chip can be realized, ensuring a good picking effect of the bonding head device 10 of the mounter on the chip, meeting the picking and mounting requirements of the chip, and being able to better adjust the mounting angle when mounting the chip to improve the accuracy of the mounting angle.

[0130] Specifically, the air pipe 53 is communicated with the outside after passing through the sealing module 5, the vacuum channel 111 and the inside of the suction nozzle 13 in sequence.

[0131] As a preferred implementation of the embodiment of the present invention, the air outlet end of the air pipe 53 of this embodiment is communicated with the sealing module 5, and the air inlet end of the air pipe 53 is communicated with the pumping device, realizing the sealed connection of the pumping device, the air pipe 53 and the sealing module 5.

[0132] Further, after the nozzle 13 is connected to the working end of the main shaft 11 and the interiors thereof are in internal communication, the air extraction device is turned on to continuously extract air from the air pipe 53, so as to extract the gas in the air pipe 53, inside the sealing module 5, the vacuum channel 111 and inside the nozzle 13, so that there is an air pressure difference between the inside of the nozzle 13 and the outside atmosphere. Finally, the chip is stably attached to the working end of the nozzle 13, thereby realizing the picking and mounting of the chip. Through this design, the rigidity of the chip deep cavity mounting of the head mounting device 10 of the mounter can be ensured, and the high-precision requirements for the chip mounting position can be met.

[0133] The process of the head mounting device 10 of the mounter according to the embodiment of the present invention for specifically adsorbing the chip is as follows: when the head mounting device 10 of the mounter moves to the position where the nozzle 13 is about to attach to the chip or just contacts the chip, the air extraction device is turned on to continuously extract air from the ventilation module, so that there is an air pressure difference between the inside of the nozzle 13 and the outside atmosphere, and the chip is stably attached to the working end of the nozzle 13. At this time, the picking and mounting of the chip can be realized by the adsorption of the working end of the nozzle 13.

[0134] Optionally, the head mounting device 10 of the mounter further includes a device for replacing the nozzle 13. The working end of the main shaft 11 can be detachably connected to nozzles 13 of different sizes, and the replacement of the nozzle 13 can be automatic replacement or manual replacement by a person, which can be specifically set according to the actual situation.

[0135] Please refer to Figure 1 and Figure 6 For the convenience of understanding, the embodiment of the present invention further provides a mounting method, which is applied to the above-mentioned head mounting device of the mounter to mount the chip on the substrate. The mounting method includes the following steps: S1: The controller determines the target current for mounting the chip on the substrate according to the type of the chip and the mounting requirements of the substrate. The target current corresponds to the target mounting force for the head mounting device of the mounter to mount the chip on the substrate. S2: The working end of the main shaft picks up the chip and mounts it on the substrate. When the chip contacts the substrate, the controller inputs a current to the voice coil motor to gradually increase the real-time current of the voice coil motor, and the controller can monitor the real-time current of the voice coil motor in real time. S3: The controller sends a control signal to the voice coil motor to adjust the real-time current of the voice coil motor, so that the force control connection block drives the main shaft seat to move downward in the vertical direction until the controller monitors that the real-time current of the voice coil motor is equal to the target current.

[0136] The mounting method of the embodiment of the present invention is applied to the above-mentioned head mounting device 10 of the mounter to mount the chip on the substrate, and has the same beneficial effects as the above-mentioned head mounting device 10 of the mounter.

[0137] Please refer to Figure 1 and Figure 7, an embodiment of the present invention further provides a die bonding device 20, which includes a carrier 201 and a loading device 202, an unloading device 203, a mounting device 204, a glue dipping device 205, a transfer table device 206 and a crystal supply device 207 installed inside the carrier 201; the loading device 202 and the unloading device 203 are arranged in parallel at opposite ends of the carrier 201, the mounting device 204 is arranged between the discharging end of the loading device 202 and the feeding end of the unloading device 203, the glue dipping device 205 is located on one side of the loading device 202, and the glue dipping device 205 and the transfer table device 206 are respectively arranged on both sides of the mounting device 204, the crystal supply device 207 is located on the side of the transfer table device 206 away from the mounting device 204; inside the carrier 201, there are movable main bonding head assemblies 2011, first bonding head assemblies 2012 and second bonding head assemblies 2013, the main bonding head assembly 2011 is arranged on one side of the unloading device 203, the first bonding head assembly 2012 is arranged on one side of the loading device 202, and the second bonding head assembly 2013 is arranged on one side of the crystal supply device 207.

[0138] The die bonding device 20 provided by the embodiment of the present invention can be used in the semiconductor industry to bond chips to the substrate after dispensing to realize the application of the glue process; the die bonding device 20 can place and mount components at high speed to complete a series of key steps such as positioning, alignment and mounting, which is an indispensable device in the integrated circuit packaging process and also the most important link in semiconductor packaging.

[0139] It should be noted that the main bonding head assembly 2011 includes the above-mentioned chip mounter bonding head device 10 for bonding the chip to the substrate; the movable main bonding head assembly 2011, the first bonding head assembly 2012 and the second bonding head assembly 2013 are independently arranged, which can ensure that the main bonding head assembly 2011 realizes the high-speed mounting of the chip and avoid the glue dipping and dispensing and chip taking processes of the other bonding heads from affecting the mounting effect of the main bonding head assembly 2011 on the chip.

[0140] Specifically, the first bonding head assembly 2012 applies glue dots to the substrate located on the loading device 202 through the glue dipping device 205. The second bonding head assembly 2013 picks up the chip through the crystal feeding device 207 and transports the chip to the transfer table device 206. The processes of glue dipping, glue dotting, and chip picking are processed in parallel, improving the overall efficiency of die bonding. By separating the first bonding head assembly 2012, the second bonding head assembly 2013 from the main bonding head assembly 2011 and arranging them in different areas, the working areas between the main bonding head assembly 2011, the first bonding head assembly 2012, and the second bonding head assembly 2013 do not overlap. With this design, on the one hand, it can avoid the mutual influence between the bonding head assemblies during operation and improve the overall efficiency of die bonding; on the other hand, the first bonding head assembly 2012 is used to apply glue dots to the substrate, and the second bonding head assembly 2013 is used to pick and place the chip. Since the main bonding head assembly 2011 has relatively high precision requirements for chip mounting, therefore, separating the working areas of the first bonding head assembly 2012, the second bonding head assembly 2013 from the main bonding head assembly 2011 has relatively low precision requirements for the first bonding head assembly 2012 and the second bonding head assembly 2013, and it also plays a role in cost saving on the premise that the precision of the main bonding head assembly 2011 is guaranteed.

[0141] It can be understood that the layout inside the carrier 201 is compact. The carrier 201 is used to install and fix the loading device 202, the unloading device 203, the mounting device 204, the glue dipping device 205, the transfer table device 206, the crystal feeding device 207, and the movable main bonding head assembly 2011, the first bonding head assembly 2012, and the second bonding head assembly 2013. Among them, the mounting device 204 of this embodiment is arranged in parallel with the transfer table device 206.

[0142] It should be noted that the main bonding head assembly 2011 in the die bonding equipment 20 includes the above-mentioned chip mounter bonding head device 10, which can achieve a chip mounting accuracy of the micron level, meet the high-precision requirements of chip mounting, and can adapt to different packaging technologies to meet the mounting requirements of different chip mounting complex processes; the accuracy achieved by the chip mounter bonding head device 10 is coordinated with the layout inside the carrier 201, which can improve the overall working efficiency of the die bonding equipment 20 while ensuring the chip mounting effect.

[0143] Specifically, Figure 8Shows the movement ranges of the first bonding head component 2012, the second bonding head component 2013, and the main bonding head component 2011; the first bonding head component 2012 is arranged on one side close to the loading device 202 and the glue dipping device 205. When the substrate is located at the loading device 202, the first bonding head component 2012 dips glue from the glue dipping device 205 and coats it on the substrate; the second bonding head component 2013 is arranged on one side close to the crystal supply device 207 and the transfer table device 206. When the chip is located at the crystal supply device 207, the second bonding head component 2013 picks up the chip and places it on the transfer table device 206, and the transfer table device 206 transports the chip to the mounting area; the main bonding head component 2011 is arranged on one side close to the mounting device 204 and the unloading device 203. After the substrate is dot-glued, it moves to the mounting device 204 through the discharge end of the loading device 202. The mounting device 204 also transports the substrate to the mounting area. The main bonding head component 2011 picks up the chip on the transfer table device 206 and bonds it to the substrate to complete the mounting step.

[0144] Inside the carrier 201, when the substrate after dot-gluing is transported to the mounting area for mounting, the loading device 202 can receive a new substrate to be processed for dot-gluing again and wait for the previous substrate after dot-gluing to complete the mounting; when the transfer table device 206 transports the chip to the mounting area and the main bonding head component 2011 takes away the chip, it can receive a new chip from the crystal supply device 207 again.

[0145] Optionally, the bonding head device 10 of the chip mounter is connected to the main body fixed on the die bonding equipment 20 by a high-flex cable. Through the high-flex cable, the stability of the cable force during the lifting movement of the bonding head device 10 of the chip mounter can be ensured, thereby improving the accuracy of force control; to reduce the load of the bonding head device 10 of the chip mounter during the lifting movement, a magnetic spring assembly can also be arranged between the bonding head device 10 of the chip mounter and the main body fixed on the die bonding equipment 20. When the force control cannot lift the bonding head device 10 of the chip mounter, the magnetic spring assembly can lift it to prevent it from falling and colliding or damaging the chip.

[0146] Further, please refer to Figure 1 、 Figure 8 and Figure 9 In the embodiments of the present invention, the main bonding head component 2011 includes the above-mentioned bonding head device 10 of the chip mounter for mounting the chip to the substrate, including the following steps: F1: Provide a substrate. The loading device moves the substrate into the working area of the first bonding head component, and the first bonding head component cooperates with the glue dipping device to perform dot-gluing treatment on the substrate; F2: The crystal supply device provides a chip, and the second bonding head component transports the chip to the transfer table device; F3: The loading device moves the substrate onto the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chip to the working area of the main bonding head assembly; F4: The main bonding head assembly mounts the chip on the transfer table device onto the substrate; F5: The unloading device receives the substrate after the mounting is completed from the mounting device.

[0147] Please refer to Figure 8 and Figure 10 As shown in FIGS. and, the mounting device 204 includes a workbench assembly 2041, a first linear module 2042 and a first drag chain 2043; the workbench assembly 2041 can slide in the length direction of the first linear module 2042, so that the workbench assembly 2041 can slide to correspond to the discharge end of the loading device 202 or the feed end of the unloading device 203, and the first drag chain 2043 is arranged on the side of the first linear module 2042.

[0148] Specifically, when the workbench assembly 2041 slides to correspond to the discharge end of the loading device 202, the workbench assembly 2041 can receive the substrate after the dispensing process is completed from the loading device 202; when the first linear module 2042 operates, it can drive the workbench assembly 2041 to slide to correspond to the feed end of the unloading device 203. After the main bonding head assembly 2011 completes the mounting operation, the unloading device 203 receives the chip after the mounting process is completed.

[0149] It can be understood that the workbench assembly 2041 can slide relative to the first linear module 2042. The first linear module 2042 serves as the center, and its two ends respectively correspond to the discharge end of the loading device 202 and the feed end of the unloading device 203. Through this layout, the unnecessary time occupied by the substrate during transportation can be saved, and the efficiency of mounting the chip onto the substrate can be further improved.

[0150] During the operation of the first linear module 2042, cables and pipelines are required for connection to transmit power and data. In the embodiment of the present invention, the cables and pipelines of the first linear module 2042 are fixed in the first drag chain 2043. It can be understood that the drag chain can orderly wrap these cables and pipelines to play a protective role, preventing the cables and pipelines from being pulled, damaged or exposed to the external environment during the movement of the first linear module 2042, causing potential safety hazards.

[0151] It should be noted that using a drag chain can significantly improve the operating stability of the first linear module 2042. By fixing the cables and pipelines in the first drag chain 2043, the interference and resistance that may be generated during their movement can also be reduced, so that the movement of the first linear module 2042 is more stable and reliable.

[0152] The first linear module 2042 of the embodiment of the present invention is a key component of the automated equipment, and its performance will directly affect the operation efficiency and stability of the entire die bonding equipment 20. By using the first linear module 2042 in combination with the first cable carrier 2043, not only can the cables and pipelines be protected, but also foreign objects can be blocked from entering, thereby improving the safety of the die bonding equipment 20, extending the service life of the first linear module 2042. In addition, energy loss can be reduced and the overall performance of the die bonding equipment 20 can be improved.

[0153] Please refer to Figure 8 、 Figure 10 and Figure 11 , the turntable device 206 includes a turntable body 2061, a second linear module 2062 and a second cable carrier 2063; the turntable body 2061 can slide in the length direction of the second linear module 2062, so that the turntable body 2061 can slide into the working area of the second tying head assembly 2013 or the working area of the main tying head assembly 2011; the second linear module 2062 is arranged in parallel with the first linear module 2042, and the second cable carrier 2063 is arranged on the side of the second linear module 2062.

[0154] It should be noted that in the turntable device 206 of the embodiment of the present invention, the turntable body 2061 is provided with vacuum adsorption holes for fixing the chip when the second tying head assembly 2013 picks up and places the chip on the turntable body 2061. By using the turntable device 206, the die bonding equipment 20 can quickly and stably transfer the chip, reduce the waiting time for mounting, and improve the production efficiency.

[0155] Specifically, when the turntable body 2061 slides into the working area of the second tying head assembly 2013, the turntable body 2061 can receive the chip from the crystal supply device 207; when the second linear module 2062 operates, it can drive the turntable body 2061 to slide into the working area of the main tying head assembly 2011, and the main tying head assembly 2011 picks up the chip on the turntable body 2061 for mounting.

[0156] It can be understood that when the turntable body 2061 slides into the working area of the second tying head assembly 2013, the second tying head assembly 2013 picks up the chip on the crystal supply device 207 and places it on the turntable body 2061. When the turntable body 2061 slides into the working area of the main tying head assembly 2011, the main tying head assembly 2011 picks up the chip on the turntable body 2061 and mounts it on the substrate; the second linear module 2062 is arranged in parallel with the first linear module 2042, which can improve the overall working efficiency while reducing the overall volume of the die bonding equipment 20.

[0157] Similar to the first linear module 2042, during operation, the second linear module 2062 also needs to be connected by cables and pipelines to transmit power and data. In the embodiments of the present invention, the cables and pipelines of the second linear module 2062 are also fixed within the second cable carrier 2063. By providing the second cable carrier 2063, the cables and pipelines of the second linear module 2062 can be protected, significantly improving the operating stability of the second linear module 2062 and extending its service life. The beneficial effects achieved in cooperation with the first linear module 2042 and the first cable carrier 2043 are the same and will not be elaborated herein.

[0158] Cable carriers are widely used in various automated devices and play an indispensable role, such as in technical fields like industrial robots, numerical control equipment, and automated production lines. Cable carriers can not only protect the safe operation of circuits but also improve the reliability and service life of automated devices; by reasonably selecting the materials and installation methods of cable carriers, the requirements of different automated devices can be met, and the efficiency and safety of the entire mechanical system can be improved.

[0159] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A head binding device for a chip mounter, used for picking up and mounting chips, characterized in that: The head binding device of the chip placement machine includes a placement module, a force control module and a fixing seat; The mounting module comprises a spindle and a spindle seat, wherein the spindle is rotatably arranged in the spindle seat, and the working end of the spindle is exposed outside the spindle seat; The force control module includes a voice coil drive assembly, a force control connection block and a guide rail assembly, the voice coil drive assembly includes a voice coil motor and a controller, the voice coil motor is installed on the fixing seat, and the controller is electrically connected to the voice coil motor; The force control connection block is connected to the voice coil motor and the bottom of the spindle seat respectively; the guide rail assembly is arranged between the spindle seat and the fixed seat, and the spindle seat is slidably connected to the fixed seat through the guide rail assembly.

2. The head binding device for a chip mounter according to claim 1, characterized in that: The voice coil motor comprises a motor body and a voice coil mover, the motor body is signal-connected to the voice coil mover, and the controller is electrically connected to the motor body; The motor body is mounted on the fixing seat, one end of the voice coil mover can slide in a vertical direction relative to the motor body, and the other end is connected to the force control connection block.

3. The head binding device for a chip mounter according to claim 2, characterized in that: The motor body is installed inside the fixing seat, a part of the voice coil mover is arranged inside the fixing seat, and the other part is exposed at the bottom of the fixing seat, and the exposed end of the voice coil mover is engaged and fixed with the force control connecting block.

4. The head binding device for a chip mounter according to claim 3, characterized in that: The guide rail assembly comprises a first guide rail and a second guide rail, wherein the first guide rail and the second guide rail are vertically arranged between the spindle seat and the fixed seat; the first guide rail and the second guide rail can slide relative to each other to form a cross guide rail, and at least two groups of the cross guide rails are arranged between the spindle seat and the fixed seat; The first guide rail is fixedly mounted on the outer wall surface of the fixing seat, and the second guide rail is fixedly mounted on the outer wall surface of the spindle seat; When the voice coil mover slides in the vertical direction, the main shaft seat is driven to move synchronously through the force control connection block, so that the second guide rail slides relative to the first guide rail.

5. The head binding device for a chip mounter as claimed in claim 4, characterized in that: Two groups of cross guide rails are arranged between the spindle seat and the fixed seat, the first guide rails in the two groups of cross guide rails are symmetrical to each other, the second guide rails are symmetrical to each other, and the distance between the first guide rails is smaller than the distance between the second guide rails; The second guide rail of the same set of the cross guide rails can perform linear movement in the vertical direction relative to the first guide rail.

6. The head binding device for a chip mounter according to claim 1, characterized in that: The head binding device of the placement machine also includes a driving module, and the driving module includes a driving member and a synchronous wheel assembly; The driving member is located at a side of the force control module away from the mounting module, the driving member is passed through the fixing seat, and the working end of the driving member is connected to the main shaft through the synchronous wheel assembly; The synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel and a synchronous belt. The synchronous belt is simultaneously mounted on the first synchronous wheel and the second synchronous wheel. The first synchronous wheel is mounted on the part of the main shaft exposed from the main shaft seat, and the second synchronous wheel is mounted on the working end of the driving member.

7. A mounting method, applied to the head binding device of a chip mounter according to any one of claims 1 to 6, to mount a chip to a substrate, characterized in that: The mounting method comprises the following steps: The controller determines a target current for mounting the chip on the substrate according to the type of the chip and the mounting requirements of the substrate, and the target current corresponds to a target mounting force for mounting the chip on the substrate by the head binding device of the chip mounter; The working end of the spindle picks up the chip and mounts it on the substrate. When the chip contacts the substrate, the controller inputs current to the voice coil motor to gradually increase the real-time current of the voice coil motor, and the controller can monitor the real-time current of the voice coil motor in real time. The controller sends a control signal to the voice coil motor to adjust the real-time current of the voice coil motor so that the force control connection block drives the spindle seat to move downward in the vertical direction until the controller detects that the real-time current of the voice coil motor is equal to the target current.

8. A die bonding device, characterized in that: The crystal bonding equipment includes a carrier platform and a loading device, a unloading device, a mounting device, a glue dipping device, a transfer table device and a crystal supply device installed inside the carrier platform; the loading device and the unloading device are arranged parallel to each other at opposite ends of the carrier platform, the mounting device is arranged between the discharge end of the loading device and the feed end of the unloading device, the glue dipping device is located on one side of the loading device, and the glue dipping device and the transfer table device are respectively arranged on both sides of the mounting device, and the crystal supply device is located on a side of the transfer table device away from the mounting device; A movable main head-binding assembly, a first head-binding assembly and a second head-binding assembly are provided inside the carrier, wherein the main head-binding assembly is arranged on one side of the unloading device, the first head-binding assembly is arranged on one side of the loading device, and the second head-binding assembly is arranged on one side of the crystal supply device; The main head-binding assembly comprises a head-binding device for a chip mounter according to any one of claims 1 to 6, and is used to mount a chip to a substrate, comprising the following steps: Providing a substrate, the loading device moves the substrate into the working area of ​​the first head binding assembly, and the first head binding assembly cooperates with the glue dipping device to perform glue dispensing on the substrate; The wafer supply device provides chips, and the second binding head assembly transports the chips to the transfer table device; The loading device moves the substrate to the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chip to the working area of ​​the main binding head assembly; The main head assembly mounts the chip on the transfer table device to the substrate; The unloading device receives the substrate after mounting from the mounting device.

9. The die bonding device according to claim 8, characterized in that: The mounting device comprises a workbench assembly and a first linear module; The workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device.

10. The die bonding device according to claim 9, characterized in that: The transfer table device includes a transfer table body and a second linear module; The transfer table body can slide in the length direction of the second linear module, so that the transfer table body can slide into the working area of ​​the second head binding assembly or the working area of ​​the main head binding assembly; the second linear module is arranged parallel to the first linear module.

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