A high-speed feeding device for diode processing

Abstract

The present invention relates to a feeding device, and provides a high-speed feeding device for diode processing, comprising: a bottom mounting plate; a support frame, evenly spaced and mounted on the bottom mounting plate; a feed channel, mounted on one side of the top of the support frame; a discharge channel, mounted on the other side of the top of the support frame; a guide frame, mounted on the feed channel; a feed ejector, mounted inside the support frame and below the feed channel; a pressing wheel assembly, arranged between the gaps left between the feed channel and the discharge channel; a thumbwheel, coaxially mounted on one of the wheels of the pressing wheel assembly; a sliding middle piece, mounted on the support frame, wherein the movable portion of the sliding middle piece is connected to the feed ejector. In the present invention, during the process of the pressing wheel assembly rolling the adhesive tape and the material tape together, the feed ejector will be pushed by the sliding middle piece, thereby clamping the chip diode in the feed channel onto the material tape. The faster the rotation speed of the pressing wheel assembly, the faster the placement speed.

Description

Technical Field

[0001] The present invention relates to a feeding device, in particular to a high-speed feeding device for diode processing. Background Art

[0002] When the production of SMD diodes is nearing the end, in order to make the SMD diodes better able to complete subsequent processing and easy to package after production, the SMD diodes will be evenly spaced and placed one by one on a strip.

[0003] like Figure 1 As shown, the material strip has evenly spaced notches that fit the SMD diodes perfectly. Once the SMD diodes are secured, tape is applied to the bottom of the diodes, placing the diode pins between the material strip and the tape, securing the diodes. Existing equipment requires a gripper to pick up the SMD diodes one by one from a hopper and insert them into the material strip. This extremely slow feeding process severely restricts production efficiency. Summary of the Invention

[0004] The present invention aims to solve the technical problems existing in the above-mentioned prior art. To this end, the present invention provides a high-speed feeding device for diode processing.

[0005] To achieve the above-mentioned object, the present invention provides a high-speed feeding device for diode processing, comprising: a bottom mounting plate; a support frame, which is provided with a plurality of support frames and is evenly spaced and mounted on the bottom mounting plate; a feeding channel, which is installed on one side of the top of the support frame; a discharging channel, which is installed on the other side of the top of the support frame; a first auxiliary material feeding area, which is provided on the upper part of the support frame for providing material tape; a second auxiliary material feeding area, which is provided on the lower part of the support frame for providing adhesive tape; a guide frame, which is installed on the feeding channel, and the first auxiliary material feeding area is provided with a guide wheel for guiding the material tape to the guide frame, the material tape is pulled out from the first auxiliary material feeding area, passes through the guide wheel, and enters the guide frame, and the material tape is guided by the guide frame and adheres to the surface of the feeding channel; a lifting member, which is installed inside the support frame and is located below the feeding channel; A gap is left between the feeding channel and the discharging channel; a pressing wheel group is arranged between the gap left between the feeding channel and the discharging channel; a thumb wheel is provided with a plurality of toggling teeth along the circumference, and the thumb wheel is coaxially mounted on one of the wheels of the pressing wheel group; a sliding middle piece is mounted on the support frame, and the movable part of the sliding middle piece is connected to the lifting piece, and the toggling teeth of the thumb wheel are in cooperative contact with the sliding middle piece; the material belt and the adhesive tape are pulled through the pressing wheel group, and the pressing wheel group rotates to pull the material belt and the adhesive tape to move, and the thumb wheel follows the rotation and the toggling teeth intermittently toggle the sliding middle piece, thereby causing the lifting piece to push the material in the feeding channel onto the material belt; a power output mechanism is arranged on the bottom mounting plate and drives the pressing wheel groups on the multiple support frames to rotate.

[0006] As a further improvement of the solution, the power output mechanism includes: a commutator, which is arranged on the bottom mounting plate to match the number of the support frames; a transmission shaft, which is connected in series with each of the commutators; and a drive motor, which is installed on the bottom mounting plate to drive one of the transmission shafts to rotate.

[0007] As a further improvement of the solution, the lifting member includes: an installation chamber, which is opened on the support frame; a movable top block, which slides out of the installation chamber and into the feeding channel; a guide rod, which is installed in the installation chamber, and the bottom of the movable top block is slidably connected to the guide rod; and a spring, which is mounted on the guide rod to keep the top of the movable top block at the bottom of the feeding channel.

[0008] As a further improvement of the solution, it also includes: a bracket installed on the feeding channel; a rubber wheel rotatably arranged on the bracket and in rolling contact with the material on the feeding channel; and a drive motor installed on the bracket to drive the rubber wheel to rotate.

[0009] As a further improvement of the scheme, the pressing wheel group includes: roller wheels, which are connected in pairs to form a group with a total of two groups, and the spacing distance between the roller wheels in each group is at least greater than the material width. The roller wheels are symmetrically arranged in two groups up and down and are rotatably installed on the support frame between the feed channel and the discharge channel. The gap between the upper and lower roller wheels is flush with the feed channel. The roller wheels are provided with protruding convex teeth at intervals along the circumferential direction, and the convex teeth of the upper and lower groups of roller wheels are staggered with each other; gears are coaxially installed on the roller wheels and mesh with each other to keep the two groups of roller wheels rotating towards each other.

[0010] As a further improvement of the solution, it also includes: a protective ring, which is installed on the support frame and wraps the lower roller in a semi-wrapped state. The protective ring is provided with a guide channel that is curved toward the gap between the two groups of rollers to guide the tape to pass into the gap between the two groups of rollers.

[0011] As a further improvement of the scheme, the feed channel includes: a first base plate, fixedly mounted on one side of the top of the support frame; a constraint plate, symmetrically arranged on both sides of the first base plate, and the opposite end faces of the two constraint plates are provided with sunken through grooves to allow the pins of the chip diode to be placed in; a top material opening is provided on the first base plate to allow the top material piece to slide out; one side of the constraint plate eliminates part of the through groove to form a release area that allows the chip diode to move upward under the clamping action of the two constraint plates; a blocking protrusion is provided on the first base plate to limit the chip diode from moving to the area of the top material opening and then stopping.

[0012] As a further improvement of the solution, the discharge channel includes: a second bottom plate, installed on the other side of the top of the support frame; a limiting plate, symmetrically installed on the second bottom plate; an anti-slip cover plate, jointly installed on the limiting plates on both sides, and an entry channel is formed between the anti-slip cover plate and the limiting plate to allow materials, tapes and material strips to pass through.

[0013] As a further improvement of the solution, the guide frame includes: a first bent plate, fixedly mounted on the constraint plate; a second bent plate, attached to the first bent plate and mounted on the constraint plate; the first bent plate is provided with a belt groove for allowing the material belt to be placed in, and the first bent plate is provided with a notch in an area close to the release area; the notch set on the first bent plate does not exceed the width of the material belt.

[0014] As a further improvement of the solution, the sliding middle piece includes: a fixed plate, which is covered and installed on the installation chamber; a sliding rail, which is symmetrically installed on the fixed plate; a first connecting block, which is slidably installed on the sliding rail and passes through the fixed plate to be connected to the movable top block; a second connecting block, which is connected to the first connecting block, and the end of the second connecting block is provided with a protruding contact portion that cooperates with the toggle teeth of the dial wheel.

[0015] The present invention brings the following effects:

[0016] 1. In the process of the pressing wheel group rolling the adhesive tape and the material tape together, the present invention pushes the top material piece through the sliding middle piece every time the material tape is pulled a certain distance, thereby clamping the chip diode in the feed channel onto the material tape, and the adhesive tape sticks to the material tape under the rolling pressure of the pressing wheel group, thereby fixing the chip diode. As the rotation speed of the pressing wheel group increases, the placement speed of the chip diode will also increase, thereby effectively improving the processing efficiency.

[0017] 2. The through grooves provided on the feeding channel can limit the pins on the SMD diodes, so that the SMD diodes will not slip out of the feeding channel during the transportation process; the guide frame provided can constrain the direction of the material belt, so that the material belt can slide more smoothly along the upper surface of the feeding channel, will not easily leave the feeding channel, and effectively align with the SMD diodes.

[0018] 3. The drive motor drives the rubber wheel to rotate, which allows the chip diode in the feeding channel to slide continuously toward the top material port; the protective ring can guide and protect the tape to correctly guide the tape into the gap between the two rollers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram for reference of the prior art.

[0020] Figure 2 It is a complete schematic diagram of the present invention.

[0021] Figure 3 For the present invention Figure 2 Schematic diagram from another perspective.

[0022] Figure 4 Schematic diagram of a single support frame of the present invention.

[0023] Figure 5 For the present invention Figure 4 The schematic diagram of the first auxiliary material supply area is hidden.

[0024] Figure 6 For the present invention Figure 4 Schematic diagram of the direction of the material tape and tape.

[0025] Figure 7 It is a schematic diagram of the specific positions of the movable top block and the guide rod of the present invention.

[0026] Figure 8 Schematic diagram of the pressing wheel assembly of the present invention.

[0027] Figure 9 It is a front view of the specific positions of the movable top block and the guide rod of the present invention.

[0028] Figure 10 It is a schematic diagram of the bracket, rubber wheel and driving motor of the present invention.

[0029] Figure 11 Schematic diagram of the first base plate and the restraining plate of the present invention.

[0030] Figure 12 It is a schematic diagram of the feed channel of the present invention.

[0031] Figure 13 Schematic diagram of the discharge channel of the present invention.

[0032] Figure 14 Schematic diagram of the guide frame of the present invention.

[0033] Figure 15 Schematic diagram of the protective ring and guide channel of the present invention.

[0034] Figure 16 Schematic diagram of the sliding middle piece of the present invention.

[0035] The corresponding relationship between the reference numerals and the names of the components in the accompanying drawings is as follows:

[0036] 300- material strip, 301- chip diode, 302- pin, 303- tape, 11- bottom mounting plate, 12- support frame, 13- feed channel, 14- discharge channel, 15- first auxiliary material supply area, 151- guide wheel, 16- second auxiliary material supply area, 17- guide frame, 18- ejector, 19- pressing wheel group, 110- dial wheel, 111- sliding middle piece, 112- power output mechanism, 21- commutator, 22- transmission shaft, 23- drive motor, 31- installation chamber, 32- movable ejector block, 33- guide rod, 34- spring, 41- roller Pressure wheel, 42-convex teeth, 43-gear, 51-first bottom plate, 52-constraint plate, 53-through groove, 54-top material port, 55-blocking protrusion, 56-release area, 61-second bottom plate, 62-limiting plate, 63-anti-drop cover plate, 64-entry channel, 71-first bent plate, 72-second bent plate, 73-groove, 74-notch, 81-protective ring, 82-guide channel, 91-bracket, 92-rubber wheel, 93-drive motor, 201-fixed plate, 202-slide rail, 203-first connecting block, 204-second connecting block, 205-contact part. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0039] The present invention specifically discloses a high-speed feeding device for diode processing, such as Figure 2-Figure 16 As shown, it includes: a bottom mounting plate 11 and a support frame 12. There are multiple support frames 12. In this embodiment, three are taken as an example. The three support frames 12 are evenly spaced and installed on the bottom mounting plate 11. Each support frame 12 has the following arrangement: a feeding channel 13 is installed on one side of the top of the support frame 12. The SMD diodes 301 that need to be processed are transported from the feeding channel 13. It should be noted that the feeding channel 13 can be set for a relatively long distance and connected to the equipment for transporting the SMD diodes 301 at the end, so as to continuously receive the SMD diodes 301. A discharging channel 14 is installed on the other side of the top of the support frame 12. The processed SMD diodes 301 are discharged through this discharging channel 14. The material belt 300 required for the processing of the SMD diodes 301 is placed in the first auxiliary material supply area 1 5, the first auxiliary material supply area 15 is arranged on the upper part of the support frame 12, the rolled material belt 300 is installed on the first auxiliary material supply area 15, and the adhesive tape 303 is placed on the second auxiliary material supply area 16, the second auxiliary material supply area 16 is arranged at the lower part of the support frame 12, and a guide frame 17 is installed on the feeding channel 13. The first auxiliary material supply area 15 is provided with a guide wheel 151 for guiding the material belt 300 to the guide frame 17. The material belt 300 is pulled out from the first auxiliary material supply area 15 and passes through the guide wheel 151 and enters the guide frame 17. The material belt 300 is guided by the guide frame 17 to slide on the surface of the feeding channel 13. Under the action of the guide wheel 151, the material belt 300 pulled out from the first auxiliary material supply area 15 directly enters the guide frame 17 without bending, and can have a better curved movement route without getting stuck at the turning point;

[0040] A lifting member 18 is installed inside the support frame 12. The lifting member 18 is located below the feeding channel 13. A gap is left between the feeding channel 13 and the discharging channel 14. A pressing wheel group 19 is installed in this gap. A thumbwheel 110 is installed on the shaft at the lower part of the pressing wheel group 19. The thumbwheel 110 is provided with multiple toggle teeth along the circumference. A sliding middle piece 111 is installed on the support frame 12. The movable part of the sliding middle piece 111 is connected to the lifting member 18. The toggle teeth of the thumbwheel 110 are in contact with the sliding middle piece 111. The power output mechanism 112 is arranged on the bottom mounting plate 11 and drives the pressing wheel groups 19 on multiple support frames 12 to rotate.

[0041] Specifically, the material belt 300 is first pulled out from the first auxiliary material supply area 15 and passed through the guide wheel 151, and then passed through the guide frame 17, so that the material belt 300 slides on the feeding channel 13, and continues to pull the material belt 300 through the gap of the pressing wheel group 19. At the same time, the adhesive tape 303 is pulled from the second auxiliary material supply area 16 through the pressing wheel group 19, and the adhesive side of the adhesive tape 303 is in contact with the bottom of the material belt 300 and passes through the pressing wheel group 19. Under the rolling pressure of the pressing wheel group 19, the two will be pressed together. As the pressing wheel group 19 rotates, the material belt 300 and the adhesive tape 303 move, and the dial wheel 110 will also rotate. When the dial wheel 110 rotates, the teeth are dialed. The sliding middle piece 111 is intermittently toggled, and the sliding middle piece 111 lifts up the ejecting piece 18, thereby pushing the SMD diode 301 in the feeding channel 13 into the placement opening on the material belt 300. After the toggling teeth lose contact with the sliding middle piece 111, the ejecting piece 18 falls down, and the next SMD diode 301 moves forward. As the toggling teeth lift up the sliding middle piece 111 again, the ejecting piece 18 will push the SMD diode 301 in the feeding channel 13 into the placement opening on the material belt 300 again. Therefore, as the rotation speed of the pressing wheel assembly 19 increases, the speed at which the ejecting piece 18 pushes the SMD diode 301 into the material belt 300 will also increase.

[0042] In the process of the pressing wheel group 19 rolling the adhesive tape 303 and the material tape 300 together, the present invention pushes the top material part 18 through the sliding middle part 111 every time the material tape 300 is pulled a certain distance, thereby clamping the chip diode 301 in the feeding channel 13 onto the material tape 300, and the adhesive tape 303 is adhered to the material tape 300 under the rolling pressure of the pressing wheel group 19, thereby fixing the chip diode 301. As the rotation speed of the pressing wheel group 19 increases, the placement speed of the chip diode 301 will also increase, thereby effectively improving the processing efficiency.

[0043] Reference Figure 2-Figure 4As shown, the power output mechanism 112 includes: three groups of commutators 21 are arranged on the bottom mounting plate 11 according to the number of support frames 12, and each group has three commutators 21, one of the commutators 21 is connected to the pressure wheel group 19 on the support frame 12, and the three groups of commutators 21 are connected together through a transmission shaft 22 and are connected horizontally, so as to realize the connection of the three groups of commutators 21 in series. At this time, a drive motor 23 is installed on the bottom mounting plate 11. After the drive motor 23 drives one group of commutators 21 through the transmission shaft 22, the three groups of commutators 21 can be realized to work together, so that all the pressure wheel groups 19 can rotate together at the same time.

[0044] Reference Figure 5 、 Figure 7 、 Figure 9 and Figure 10 As shown, the ejector 18 includes: an installation chamber 31 is opened on the support frame 12, a movable ejector block 32 is slidably installed in the installation chamber 31, the top of the movable ejector block 32 slides into the feeding channel 13, a guide rod 33 is fixedly installed in the installation chamber 31, the bottom of the movable ejector block 32 is slidably connected to the guide rod 33, and a spring 34 is sleeved on the guide rod 33. The function of the spring 34 is to keep the top of the movable ejector block 32 at the bottom of the feeding channel 13.

[0045] Specifically, the movable top block 32 is connected to the sliding middle piece 111. During the rotation of the pressing wheel group 19, the thumbwheel 110 will rotate together. The driving teeth on the thumbwheel 110 will drive the sliding middle piece 111, thereby causing the movable top block 32 to lift up the patch diode 301 in the feeding channel 13. The lifted patch diode 301 will just be stuck on the material belt 300. After the driving teeth and the sliding middle piece 111 are out of contact, the movable top block 32 returns to its original position, and the next patch diode 301 will move forward and come to the top of the movable top block 32 again. During the continuous rotation of the pressing wheel group 19, the material belt 300 and the adhesive tape 303 will be continuously pulled to move. At the same time, the thumbwheel 110 will intermittently push the movable top block 32 upward, thereby blocking the patch diode 301 in the feeding channel 13 to the material belt 300.

[0046] It should be noted that the material strip 300 will be pulled and moved during the rotation of the pressing wheel group 19. Therefore, in order to ensure that the movable top block 32 and the thumbwheel 110 can effectively cooperate to clamp the chip diode 301 onto the material strip 300, the gap between the multiple toggle teeth provided on the thumbwheel 110 needs to be adjusted to maintain a consistent distance with the gap between the holes provided on the material strip 300 under actual use conditions. The specific adjustment is as follows: when the pressing wheel group 19 clamps the material strip 300 and rotates and pulls it forward for a fixed distance, the thumbwheel 110 rotates accordingly, and the toggle teeth provided on the thumbwheel 110 will also swing a distance accordingly. During the swinging process, the end of the toggle tooth contacts the movable top block 32 and lifts the movable top block 32. After the single toggle tooth reaches the limit contact angle with the movable top block 32, the movable top block 32 is at the limit height. At this time, the chip diode 301 is moved by the movable top block 32. The cam 32 is in the state of being lifted up, and the material strip 300 has been pulled by the rotation of the pressing wheel group 19 so that the holes on the material strip 300 can be aligned just above the movable top block 32; that is to say, while the pressing wheel group 19 pulls the material strip 300 to move, the toggle teeth arranged at intervals on the dial wheel 110 also push the movable top block 32 upward at the same time. When the material strip 300 is pulled to move so that the holes on the material strip 300 can be aligned with the movable top block 32, the movable top block 32 is also pushed to the highest point by the toggle teeth at this time, which can just fit the chip diode 301 onto the material strip 300. At the same time, the contact between the toggle teeth and the movable top block 32 reaches the limit contact angle. After the dial wheel 110 continues to rotate, the toggle teeth and the movable top block 32 are disengaged, and the movable top block 32 returns to its original position until the next toggle tooth lifts the movable top block 32, thereby realizing effective cooperation between the dial wheel 110 and the movable top block 32.

[0047] Reference Figure 4 and Figure 10 As shown, it also includes: a bracket 91 fixedly mounted on the feeding channel 13, a rubber wheel 92 rotatably set on the bracket 91, and rolling contact with the patch diode 301 on the feeding channel 13, so that when the rubber wheel 92 rotates, the patch diode 301 in the feeding channel 13 can actively slide toward the area of the top material 18, and a drive motor 93 is installed on the bracket 91 to drive the rubber wheel 92 to rotate.

[0048] Reference Figure 5 、 Figure 6 and Figure 8As shown, the pressing wheel group 19 includes: two groups of roller pressing wheels 41 connected to form a group in pairs, and the spacing distance between the two roller pressing wheels 41 in each group is at least greater than the width of the patch diode 301, so that the roller pressing wheels 41 will not press the patch diode 301 during rotation. The two groups of roller pressing wheels 41 are symmetrically arranged up and down, and the two groups are rotatably installed on the support frame 12 between the feeding channel 13 and the discharging channel 14. The gap between the upper and lower roller pressing wheels 41 is flush with the feeding channel 13, and the roller pressing wheels 41 are provided with protruding convex teeth 42 at intervals along the circumferential direction. The convex teeth 42 of the upper and lower groups of roller pressing wheels 41 are staggered with each other. When in use, the material belt 300 and the adhesive tape 303 are inserted into the gap between the two groups of roller pressing wheels 41, so that the material at this time The edges of the belt 300 and the adhesive tape 303 on both sides will be clamped by the upper and lower sets of rollers 41, and the two will be adhered together under the rolling of the convex teeth 42, and the pins 302 of the patch diode 301 stuck on the material belt 300 will be wrapped between the material belt 300 and the adhesive tape 303. As the roller 41 rotates, the material belt 300, the adhesive tape 303 and the fixed patch diode 301 pass through the gap of the roller 41 and finally enter the discharge channel 14 for discharge. In order to ensure that the two sets of rollers 41 can rotate stably in opposite directions, the gear 43 is coaxially installed on the roller 41 and meshes with each other to keep the two sets of rollers 41 rotating in opposite directions, so as to ensure that the two sets of rollers 41 can rotate stably in opposite directions.

[0049] Reference Figure 7 and Figure 15 As shown, it also includes: a protective ring 81 fixedly mounted on the support frame 12, the protective ring 81 wraps the lower roller 41 in a semi-wrapped state, wherein the height of the top of the protective ring 81 is lower than the height of the channel opening of the feed channel 13, the purpose of doing this is to avoid the protective ring 81 from interfering with the passing material belt 300, and the protective ring 81 is provided with a guide channel 82 curved toward the gap between the two sets of rollers 41. After the tape 303 is pulled out from the second auxiliary material supply area 16, it can be inserted from the guide channel 82 to better allow the tape 303 to penetrate into the gap between the two sets of rollers 41, and at the same time, it can also avoid the friction between the roller 41 and the tape 303 causing the tape 303 to break.

[0050] Reference Figure 6 、 Figure 10-12As shown, the feeding channel 13 includes: a first bottom plate 51 fixedly mounted on one side of the top of the support frame 12, and constraint plates 52 are symmetrically mounted on the first bottom plate 51. The material strip 300 slides centrally along the surfaces of the two constraint plates 52 under the action of the guide frame 17. The two constraint plates 52 leave a gap to allow the SMD diode 301 to pass through, and the opposite end faces of the two constraint plates 52 are provided with a sunken through groove 53. After the SMD diode 301 is in the gap between the two constraint plates 52, the pin 302 of the SMD diode 301 will be placed in the through groove 53. In this way, when the SMD diode 301 slides on the two constraint plates 52, the pin 302 is restricted by the through groove 53 and the SMD diode 301 will not be allowed to pass out of the constraint plate 52. The plate 52 is detached, and a ejection port 54 is provided on the first bottom plate 51 to allow the movable top block 32 to slide out, and the movable top block 32 is in the gap between the two constraint plates 52. After the chip diode 301 slides to the top of the movable top block 32, the movable top block 32 is pushed upward. Since the pin 302 is restricted by the through groove 53, it cannot move upward. At this time, the through groove 53 on the constraint plate 52 near the movable top block 32 needs to be eliminated to form a release area 56 that allows the chip diode 301 to move upward under the clamping action of the two constraint plates 52. In this way, the movable top block 32 can push the chip diode 301 upward, thereby getting stuck on the material strip 300 sliding on the surface of the constraint plate 52. Among them, a convex blocking protrusion 55 is provided at the end of the first base plate 51. The function of the blocking protrusion 55 is to limit the SMD diode 301 from moving to the area of the top material port 54 and then stopping the movement. In this way, it can ensure that the movable top block 32 can lift the SMD diode 301 every time, and also prevent the SMD diode 301 from sliding beyond the working area of the movable top block 32.

[0051] Reference Figure 6 and Figure 13 As shown, the discharge channel 14 includes: a second bottom plate 61 mounted on the other side of the top of the support frame 12, a certain gap is left between the first bottom plate 51 and the second bottom plate 61 for installing the pressing wheel assembly 19, and the limit plates 62 are symmetrically mounted on the second bottom plate 61. The anti-detachment cover plates 63 are jointly mounted on the limit plates 62 on both sides. The anti-detachment cover plates 63 and the limit plates 62 form an entry channel 64 that allows the SMD diodes 301, the tape 303 and the material tape 300 to pass through. Specifically, after the tape 303, the material tape 300 and the SMD diodes 301 are rolled and connected together by the pressing wheel assembly 19, they are then stuffed into the entry channel 64 and discharged to a designated location under the guidance of the entry channel 64 to avoid accumulation.

[0052] Reference Figure 6 and Figure 14As shown, the guide frame 17 includes: a first bent plate 71 fixedly mounted on the constraint plate 52, the first bent plate 71 is in an L-shaped shape, and the corner is an arc bend, the second bent plate 72 is attached to the first bent plate 71 and then mounted on the constraint plate 52, the first bent plate 71 is provided with a belt groove 73 for allowing the material strip 300 to be placed, the belt groove 73 is opened along the curved surface of the first bent plate 71, the material strip 300 is pulled out and inserted into the belt groove 73, and moves along the belt groove 73, and finally passes through the bottom of the first bent plate 71 along the surface of the constraint plate 52, thereby constraining the material strip 300 between the two constraint plates 52 The surface of the material strip 300 is centered and slides in the center so that the material strip 300 and the SMD diode 301 can be accurately aligned. In order to prevent the upward-pushing SMD diode 301 from being interfered with by the first bent plate 71, a gap 74 is provided on the first bent plate 71 to allow the SMD diode 301 to pass through, and the width of the gap 74 shall not exceed the width of the material strip 300. It is best to press down both sides of the material strip 300. In this way, when the SMD diode 301 is pushed upward, the material strip 300 in this area will not move upward with it, so that the SMD diode 301 can be stuck on the material strip 300.

[0053] Reference Figure 5 、 Figure 6 and Figure 16 As shown, the sliding middle piece 111 includes: a fixed plate 201 covering and installed in the installation chamber 31, and a slide rail 202 is symmetrically installed on the fixed plate 201. A first connecting block 203 is slidably installed between the two slide rails 202. The first connecting block 203 slides up and down on the fixed plate 201, and the first connecting block 203 passes through the fixed plate 201 and is connected to the movable top block 32. The second connecting block 204 is connected to the first connecting block 203. The second connecting block 204 extends toward the direction of the dial wheel 110, and is provided with a protruding contact portion 205 at the end to cooperate with the dial tooth of the dial wheel 110. Under the action of the slide rail 202, the dial wheel 110 dials the first connecting block 203, the second connecting block 204 and the movable top block 32. The lifting process will be smoother and less likely to get stuck.

[0054] The above-described embodiments merely represent preferred embodiments of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications, improvements, and substitutions without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A high-speed feeding device for diode processing, comprising: Bottom mounting plate (11); The support frame (12) is provided with a plurality of them, which are evenly spaced and mounted on the bottom mounting plate (11); a feeding channel (13) is mounted on one side of the top of the support frame (12); a discharging channel (14) is mounted on the other side of the top of the support frame (12); a first auxiliary material supply area (15) is arranged on the upper part of the support frame (12) for providing a material belt (300); a second auxiliary material supply area (16) is arranged on the lower part of the support frame (12) for providing an adhesive tape (303); and the guide frame (17) is further included, which is mounted on the feeding channel (1 3), the first auxiliary material supply area (15) is provided with a guide wheel (151) for guiding the material belt (300) to the guide frame (17), the material belt (300) is pulled out from the first auxiliary material supply area (15) and passes through the guide wheel (151) and enters the guide frame (17), and the material belt (300) is guided by the guide frame (17) to stick to the surface of the feeding channel (13); the lifting member (18) is installed inside the support frame (12) and is located below the feeding channel (13); the feeding channel (13) and the discharging channel (14) are connected to each other. ) with a gap between them; a pressing wheel group (19) arranged between the gap between the feeding channel (13) and the discharging channel (14); a thumbwheel (110) provided with a plurality of shifting teeth along the circumferential direction, the thumbwheel (110) being coaxially mounted on one of the wheels of the pressing wheel group (19); a sliding middle piece (111) mounted on the support frame (12), the movable part of the sliding middle piece (111) being connected to the ejecting piece (18), the shifting teeth of the thumbwheel (110) being in contact with the sliding middle piece (111); the material strip (3 00) and the adhesive tape (303) are pulled through the pressing wheel group (19), the pressing wheel group (19) rotates to pull the material belt (300) and the adhesive tape (303) to move, and the dial wheel (110) rotates and intermittently dials the sliding middle member (111) while the dial tooth follows the rotation, thereby causing the ejecting member (18) to eject the material in the feeding channel (13) onto the material belt (300); a power output mechanism (112) is arranged on the bottom mounting plate (11) and drives the pressing wheel groups (19) on the plurality of support frames (12) to rotate; The ejecting member (18) includes: an installation chamber (31) provided on the support frame (12); a movable ejecting block (32) slidingly extending from the installation chamber (31) into the feeding channel (13); a guide rod (33) installed in the installation chamber (31), the bottom of the movable ejecting block (32) being slidably connected to the guide rod (33); and a spring (34) sleeved on the guide rod (33) to keep the top of the movable ejecting block (32) at the bottom of the feeding channel (13).

2. The high-speed feeding device for diode processing according to claim 1, characterized in that: The power output mechanism (112) includes: commutators (21) arranged on the bottom mounting plate (11) in a number matching the number of the support frames (12); a transmission shaft (22) connected in series with each of the commutators (21); and a drive motor (23) mounted on the bottom mounting plate (11) to drive one of the transmission shafts (22) to rotate.

3. The high-speed feeding device for diode processing according to claim 2, characterized in that: Also includes: A bracket (91) is mounted on the feed channel (13); a rubber wheel (92) is rotatably mounted on the bracket (91) and is in rolling contact with the material on the feed channel (13); A driving motor (93) is mounted on the bracket (91) to drive the rubber wheel (92) to rotate.

4. The high-speed feeding device for diode processing according to claim 3, characterized in that: The pressing wheel group (19) comprises: rollers (41), which are spaced apart in pairs to form a group, and a total of two groups are provided. The spacing distance between the rollers (41) in each group is at least greater than the width of the material. The rollers (41) are symmetrically arranged in two groups and are rotatably installed on the support frame (12) between the feeding channel (13) and the discharging channel (14). The gap between the rollers (41) arranged above and below is flush with the feeding channel (13). The rollers (41) are provided with protruding convex teeth (42) at intervals along the circumference, and the convex teeth (42) of the upper and lower groups of the rollers (41) are staggered with each other; and gears (43) are coaxially installed on the rollers (41) and mesh with each other to keep the two groups of the rollers (41) rotating in opposite directions.

5. The high-speed feeding device for diode processing according to claim 4, characterized in that: Also includes: A protective ring (81) is mounted on the support frame (12) and wraps the lower roller (41) in a semi-wrapped state. The protective ring (81) is provided with a guide channel (82) that is curved toward the gap between the two groups of rollers (41) to guide the tape (303) to penetrate into the gap between the two groups of rollers (41).

6. The high-speed feeding device for diode processing according to claim 5, characterized in that: The feeding channel (13) includes: a first bottom plate (51), fixedly mounted on one side of the top of the support frame (12); a constraint plate (52), symmetrically arranged on both sides of the first bottom plate (51), and the opposite end faces of the two constraint plates (52) are provided with a recessed through groove (53) to allow the pin (302) of the chip diode (301) to be placed; a top material opening (54) is provided on the first bottom plate (51) to allow the top material member (18) to slide out; one side of the constraint plate (52) eliminates part of the through groove (53) to form a release area (56) that allows the chip diode (301) to move upward under the clamping action of the two constraint plates (52); a blocking protrusion (55) is provided on the first bottom plate (51) to limit the chip diode (301) from moving to the area of the top material opening (54) and then stopping the movement.

7. The high-speed feeding device for diode processing according to claim 6, characterized in that: The discharge channel (14) comprises: a second bottom plate (61) mounted on the other side of the top of the support frame (12); a limiting plate (62) symmetrically mounted on the second bottom plate (61); and anti-slip cover plates (63) mounted on the limiting plates (62) on both sides. An entry channel (64) is formed between the anti-slip cover plates (63) and the limiting plates (62) to allow the material, the adhesive tape (303) and the material belt (300) to pass through.

8. The high-speed feeding device for diode processing according to claim 7, characterized in that: The first bent plate (71) is fixedly mounted on the restraining plate (52); the second bent plate (72) is mounted on the restraining plate (52) after being attached to the first bent plate (71); a belt groove (73) for allowing the material belt (300) to be placed is provided on the first bent plate (71), and a notch (74) is provided in the area of the first bent plate (71) close to the release area (56); the notch (74) provided on the first bent plate (71) does not exceed the width of the material belt (300).

9. The high-speed feeding device for diode processing according to claim 8, characterized in that: The sliding intermediate member (111) comprises: a fixed plate (201) mounted to cover the mounting chamber (31); a slide rail (202) symmetrically mounted on the fixed plate (201); a first connecting block (203) slidably mounted on the slide rail (202) and passing through the fixed plate (201) to be connected to the movable top block (32); and a second connecting block (204) connected to the first connecting block (203). The end of the second connecting block (204) is provided with a protruding contact portion (205) that cooperates with the toggle teeth of the thumbwheel (110).

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