Heterogeneous integrated circuit packaging structure

Abstract

The invention discloses a heterogeneous integrated circuit packaging structure, which comprises a packaging main body, a chip unit is packaged in the packaging main body, a contact is arranged on the lower surface of the packaging main body, and the contact is electrically connected with the chip unit in the packaging main body; an adapter is detachably arranged below the packaging main body, and a contact pin is arranged on the adapter; the pins and the contacts are connected in a one-to-one manner. According to the packaging structure, the detachable adapter is arranged below the packaging main body, and the patch contact is connected with the contact pin, so that surface mounting can be converted into welding mounting which is performed by being inserted into the PCB, and the packaging structure can adapt to different mounting environments and meet different mounting requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and specifically relates to a heterogeneous integrated circuit packaging structure. Background Art

[0002] An integrated circuit refers to first integrating transistors to manufacture a die with a specific function, and then integrating the die into a chip through semiconductor technology according to application requirements. Among them, a die refers to a pre-manufactured wafer (Die) with a specific function and capable of being combined and integrated, also known as a "chiplet", and its functions can include a general-purpose processor, a memory, a graphics processor, an encryption engine, a network interface, etc.

[0003] In the prior art, the packaged structure usually has two forms. One is a surface-mounted component without pins, and the other is a long-pin structure, which is welded and installed by plugging into a PCB board. Due to the different installation methods of the two structures, a single-form packaging structure cannot meet different installation requirements. Summary of the Invention

[0004] The present invention provides a heterogeneous integrated circuit packaging structure to solve the problems raised in the background art.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions:

[0006] A heterogeneous integrated circuit packaging structure includes a packaging body, the packaging body encapsulates a chip unit, a contact is provided on the lower surface of the packaging body, and the contact is electrically connected to the chip unit inside the packaging body;

[0007] A detachable adapter is provided below the packaging body, and pins are provided on the adapter;

[0008] The pins are connected to the contacts one by one.

[0009] Preferably, the adapter includes an upper housing and a lower housing, the pins penetrate through the upper housing and the lower housing, and fixing sliders are provided inside the upper housing and the lower housing, and the fixing sliders are used to fix the pins.

[0010] Preferably, a chute is provided inside the upper housing, a rebound groove is provided on one side of the chute, a fixing slider is slidably connected inside the chute, one end of the fixing slider is located outside the upper housing, the other end of the fixing slider is located inside the rebound groove, and a first elastic member is connected to the end of the fixing slider located in the rebound groove, and the end of the first elastic member away from the fixing slider is fixedly connected to the rebound groove.

[0011] Preferably, through holes and clamping holes are provided on the fixed sliding piece. The through holes and the clamping holes are arranged alternately. The inner diameter of the through holes is larger than the diameter of the pin, and the inner diameter of the clamping holes is smaller than the diameter of the pin.

[0012] A concave ring is provided on the pin, and the diameter of the pin at the concave ring is equal to the inner diameter of the clamping hole.

[0013] Preferably, positioning holes are provided on the upper shell. The positioning holes are arranged on both sides of the sliding groove, and positioning protrusions adapted to the positioning holes are provided on the lower shell.

[0014] Preferably, a connection hole is provided on the upper shell, and a pin hole is provided on the lower shell. Both the pin hole and the connection hole can allow the pin to pass through, and the axes of the pin hole and the connection hole are on the same straight line.

[0015] Preferably, a stable component is provided in the connection hole. The stable component is used to connect the pin and the contact.

[0016] The stable component includes a first contact frame in contact with the contact, a second contact frame in contact with the pin, and a stable plate provided between the first contact frame and the second contact frame.

[0017] The first contact frame is electrically connected to the second contact frame.

[0018] The diameter of the stable plate is smaller than the diameters of the first contact frame and the second contact frame.

[0019] A fixing frame is fixedly connected to the outside of the stable plate. The fixing frame on the outside of the stable plate is fixedly connected to the inner wall of the connection hole. The second contact frame is located inside the connection hole, and the first contact frame is located outside the connection hole.

[0020] Preferably, a retraction sleeve is fixedly connected to the center of the lower side of the stable plate. An opening is provided at the lower end of the retraction sleeve. A retraction rod is slidably connected in the opening of the retraction sleeve. Connecting plates are provided at both the upper and lower ends of the retraction rod. The connecting plate at the upper end of the retraction rod is slidably connected inside the retraction sleeve, and the connecting plate at the lower end of the retraction rod is fixedly connected to the second contact frame.

[0021] A fifth elastic member is provided inside the retraction sleeve. The two ends of the fifth elastic member are respectively connected to the stable plate and the connecting plate at the upper end of the retraction rod.

[0022] The inner diameter of the opening at the lower end of the retraction sleeve is larger than the diameter of the retraction rod.

[0023] Preferably, several groups of connecting rods are rotatably connected to the edge of the second contact frame. Second elastic members are fixedly connected to the connecting rods. The ends of the second elastic members away from the connecting rods are fixedly connected to the connecting balls. The connecting balls are nested inside the ball sleeves, and the ball sleeves are fixedly connected to the edge of the stable plate.

[0024] Preferably, a limiting rod is fixedly connected to the center of the upper side of the stabilizing plate. One end of a third elastic member is connected to the outer periphery of the limiting rod, and the other end of the third elastic member is connected to the center of the first contact frame.

[0025] A plurality of groups of fourth elastic members are rotatably connected to the outer edge of the center. The other ends of the fourth elastic members are rotatably connected to the edge of the stabilizing plate.

[0026] The plurality of groups of fourth elastic members are evenly distributed.

[0027] Compared with the prior art, the present invention has at least the following beneficial effects:

[0028] In this application, by providing a detachable adapter below the encapsulation main body and connecting the patch contacts to the pins, the surface mounting can be converted into a soldering installation carried out by plugging into a PCB board, so that the encapsulation structure can adapt to different installation environments and meet different installation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the adapter structure of the present invention;

[0031] Figure 3 It is an exploded schematic diagram of the adapter structure of the present invention;

[0032] Figure 4 It is a schematic diagram of the stabilizing component structure of the present invention;

[0033] Figure 5 It is a schematic diagram of the connection structure of the second elastic member of the present invention;

[0034] Figure 6 It is a schematic diagram of the connection structure at the center of the stabilizing plate of the present invention.

[0035] In the figure: 1. Encapsulation main body; 2. Contact; 3. Adapter; 4. Pin; 5. Upper housing; 6. Lower housing; 7. Pin hole; 8. Fastening hole; 9. Stabilizing component; 10. Fixed sliding piece; 11. Through hole; 12. Clamping hole; 13. Positioning hole; 14. Chute; 15. Connection hole; 16. First elastic member; 17. Rebound groove; 18. First contact frame; 19. Stabilizing plate; 20. Second contact frame; 21. Retracting rod; 22. Second elastic member; 23. Ball sleeve; 24. Third elastic member; 25. Fourth elastic member; 26. Connecting ball; 27. Retracting sleeve; 28. Link; 29. Fifth elastic member; 30. Limiting rod. DETAILED DESCRIPTION OF THE INVENTION

[0036] In the present invention, descriptions such as "first", "second", etc. are only for descriptive purposes and do not particularly refer to the order or sequence. Nor are they used to limit the present invention. They are merely used to distinguish protection components or operations described with the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second" may explicitly or implicitly include at least one such feature. Additionally, the technical solutions and technical features between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] Embodiment 1

[0038] Please refer to Figure 1 , a heterogeneous integrated circuit package structure, including a package body 1, the package body 1 encapsulates a chip unit, a contact 2 is arranged on the lower surface of the package body 1, and the contact 2 is electrically connected to the chip unit in the package body 1;

[0039] A detachable adapter 3 is arranged below the package body 1, and pins 4 are arranged on the adapter 3;

[0040] Among them, a buckle that can be snap-connected to the adapter 3 can be arranged on the package body 1, and it is detachably connected in the form of a buckle. The adapter 3 can also wrap and connect the package body 1, or the package body 1 and the adapter 3 can be encapsulated as a whole and connected by detaching the pins 4.

[0041] The pins 4 are connected to the contacts 2 one by one.

[0042] The working principle and beneficial effects of the above solution:

[0043] In this application, by arranging a detachable adapter 3 below the package body 1 and connecting the surface mount contacts to the pins 4, the surface mount can be converted into a soldering installation by plugging into a PCB board, enabling the package structure to adapt to different installation environments and meet different installation requirements.

[0044] Embodiment 2

[0045] Please refer to Figures 2 - 3 , on the basis of Embodiment 1, the adapter 3 includes an upper housing 5 and a lower housing 6, the pins 4 penetrate through the upper housing 5 and the lower housing 6, and fixing sliders 10 are arranged in the upper housing 5 and the lower housing 6, and the fixing sliders 10 are used to fix the pins 4.

[0046] A chute 14 is provided inside the upper housing 5. A resilient groove 17 is provided on one side of the chute 14. A fixed sliding piece 10 is slidably connected inside the chute 14. One end of the fixed sliding piece 10 is located outside the upper housing 5, and the other end of the fixed sliding piece 10 is located inside the resilient groove 17. And one end of the fixed sliding piece 10 located in the resilient groove 17 is connected with a first elastic member 16, and the end of the first elastic member 16 away from the fixed sliding piece 10 is fixedly connected to the resilient groove 17.

[0047] Through holes 11 and clamping holes 12 are provided on the fixed sliding piece 10. The through holes 11 and the clamping holes 12 are arranged alternately. The inner diameter of the through hole 11 is larger than the diameter of the pin 4, and the inner diameter of the clamping hole 12 is smaller than the diameter of the pin 4;

[0048] A concave ring is provided on the pin 4, and the diameter of the pin 4 at the concave ring is equal to the inner diameter of the clamping hole 12.

[0049] Positioning holes 13 are provided on the upper housing 5. The positioning holes 13 are provided on both sides of the chute 14. Positioning protrusions adapted to the positioning holes 13 are provided on the lower housing 6.

[0050] A connection hole 15 is provided on the upper housing 5. A pin hole 7 is provided on the lower housing 6. Both the pin hole 7 and the connection hole 15 can allow the pin 4 to pass through, and the axes of the pin hole 7 and the connection hole 15 are on the same straight line.

[0051] The working principle and beneficial effects of the above solution:

[0052] Since the diameter of the pin 4 is relatively thin, the pin 4 is prone to bending or breaking during use or movement, which affects the use of the chip. The existing design of integrating the chip and the pin 4 makes it very difficult to replace the pin 4. After the pin 4 breaks, the chip cannot be used, resulting in huge losses;

[0053] In this application, the pin 4 connecting the adapter 3 and the contact 2 on the package body 1 is designed to be replaceable. When the pin 4 is bent or broken, only one pin 4 can be replaced, enabling the chip to be reused, which has great use value when the package body 1 and the adapter 3 are integrally fixed;

[0054] When replacing the pin 4, it is necessary to push the fixed sliding piece 10 back, squeeze the first elastic member 16, so that the clamping hole 12 is disengaged from the groove on the pin 4, and the pin 4 enters the through hole 11, then the pin 4 can be pulled out. Then insert the intact pin 4 into the pin hole 7, so that the groove of the pin 4 exceeds the fixed sliding piece 10, release the fixed sliding piece 10, and the fixed sliding piece 10 rebounds under the action of the first elastic member 16. The intersection of the through hole 11 and the clamping hole 12 fits the surface of the pin 4. When the pin 4 is pulled outward, when the groove on the pin 4 passes through the clamping hole 12, the clamping hole 12 will be clamped in the groove on the pin 4, completing the replacement of the pin 4.

[0055] Embodiment 3

[0056] Please refer to Figures 4 - 6 , on the basis of Embodiments 1-2, a stabilizing component 9 is arranged in the connecting hole 15, and the stabilizing component 9 is used to connect the pin 4 and the contact 2;

[0057] The stabilizing component 9 includes a first contact frame 18 in contact with the contact 2, a second contact frame 20 in contact with the pin 4, and a stabilizing plate 19 arranged between the first contact frame 18 and the second contact frame 20;

[0058] The first contact frame 18 is electrically connected to the second contact frame 20;

[0059] The diameter of the stabilizing plate 19 is smaller than the diameters of the first contact frame 18 and the second contact frame 20;

[0060] A fixing frame is fixedly connected to the outside of the stabilizing plate 19, the fixing frame on the outside of the stabilizing plate 19 is fixedly connected to the inner wall of the connecting hole 15, the second contact frame 20 is located in the connecting hole 15, and the first contact frame 18 is located outside the connecting hole 15.

[0061] A retraction sleeve 27 is fixedly connected to the center of the lower side of the stabilizing plate 19. An opening is arranged at the lower end of the retraction sleeve 27. A retraction rod 21 is slidably connected in the opening of the retraction sleeve 27. Connecting plates are arranged at both the upper and lower ends of the retraction rod 21. The connecting plate at the upper end of the retraction rod 21 is slidably connected in the retraction sleeve 27, and the connecting plate at the lower end of the retraction rod 21 is fixedly connected to the second contact frame 20;

[0062] A fifth elastic member 29 is arranged in the retraction sleeve 27, and both ends of the fifth elastic member 29 are respectively connected to the stabilizing plate 19 and the connecting plate at the upper end of the retraction rod 21;

[0063] The inner diameter of the opening at the lower end of the retraction sleeve 27 is larger than the diameter of the retraction rod 21.

[0064] A plurality of sets of connecting rods 28 are rotatably connected to the edge of the second contact holder 20. A second elastic member 22 is fixedly connected to the connecting rod 28. One end of the second elastic member 22 away from the connecting rod 28 is fixedly connected to the connecting ball 26. The connecting ball 26 is nested in the ball socket 23. The ball socket 23 is fixedly connected to the edge of the stabilizing plate 19.

[0065] A limiting rod 30 is fixedly connected to the center of the upper side of the stabilizing plate 19. One end of a third elastic member 24 is connected to the outer periphery of the limiting rod 30. The other end of the third elastic member 24 is connected to the center of the first contact holder 18.

[0066] A plurality of sets of fourth elastic members 25 are rotatably connected to the outer edge of the center. The other ends of the fourth elastic members 25 are rotatably connected to the edge of the stabilizing plate 19.

[0067] The plurality of sets of fourth elastic members 25 are evenly distributed.

[0068] The working principle and beneficial effects of the above solution:

[0069] When installing the adapter 3 on the encapsulation main body 1, in order to ensure good contact between the contact 2 and the pin 4, a stabilizing assembly 9 is provided to connect the contact 2 and the pin 4. By the contact 2 and the pin 4 squeezing the stabilizing assembly 9, both the contact 2 and the pin 4 can be stably connected to the stabilizing assembly 9, that is, the connection stability between the contact 2 and the pin 4 is ensured.

[0070] When installing the adapter 3, the contact 2 on the encapsulation main body 1 squeezes the first contact holder 18, causing the third elastic member 24 and the fourth elastic member 25 to contract. The third elastic member 24 and the fourth elastic member 25 act on the first contact holder 18 to apply pressure to the contact 2 on the encapsulation main body 1, ensuring the connection stability between the contact 2 and the stabilizing assembly 9.

[0071] When installing the pin 4, the pin 4 extends into the connection hole 15 and squeezes the second contact holder 20, causing the second elastic member 22 and the fifth elastic member 29 to retract. The second elastic member 22 and the fifth elastic member 29 act on the second contact holder 20 to apply pressure to the pin 4, ensuring the connection stability between the pin 4 and the stabilizing assembly 9. And when inserting the pin 4, the elastic force of the second elastic member 22 and the fifth elastic member 29 will cause the pin 4 to pop out automatically, so that the groove on the pin 4 cooperates with the clamping hole 12, reducing the step of manually pulling outwards.

[0072] Moreover, the second elastic member 22, the third elastic member 24, and the fourth elastic member 25 are rotationally arranged, enabling the first contact holder 18 and the second contact holder 20 to deflect. When installing the adapter 3, even if there is a slight misalignment between the encapsulation main body 1 and the adapter 3, it will not affect the conduction between the contact 2 and the pin 4.

[0073] It is obvious to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A heterogeneous integrated circuit packaging structure, characterized in that: It comprises a packaging body (1), the packaging body (1) packaging a chip unit, the lower surface of the packaging body (1) is provided with a contact (2), and the contact (2) is electrically connected to the chip unit in the packaging body (1); An adapter (3) is detachably provided below the packaging body (1), and a plug pin (4) is provided on the adapter (3); The plug pins (4) are connected to the contacts (2) in a one-to-one manner.

2. The heterogeneous integrated circuit packaging structure according to claim 1, characterized in that: The adapter (3) comprises an upper shell (5) and a lower shell (6), the plug pin (4) passes through the upper shell (5) and the lower shell (6), and a fixing slide (10) is arranged inside the upper shell (5) and the lower shell (6), and the fixing slide (10) is used to fix the plug pin (4).

3. The heterogeneous integrated circuit packaging structure according to claim 2, characterized in that: A slide groove (14) is provided in the upper shell (5), a rebound groove (17) is provided on one side of the slide groove (14), a fixed slide plate (10) is slidably connected in the slide groove (14), one end of the fixed slide plate (10) is located outside the upper shell (5), and the other end of the fixed slide plate (10) is located in the rebound groove (17), and one end of the fixed slide plate (10) located in the rebound groove (17) is connected to a first elastic member (16), and one end of the first elastic member (16) away from the fixed slide plate (10) is fixedly connected to the rebound groove (17).

4. The heterogeneous integrated circuit packaging structure according to claim 2, characterized in that: The fixed slide (10) is provided with a through hole (11) and a snap-fit ​​hole (12), the through hole (11) and the snap-fit ​​hole (12) are arranged alternately, the inner diameter of the through hole (11) is larger than the diameter of the plug pin (4), and the inner diameter of the snap-fit ​​hole (12) is smaller than the diameter of the plug pin (4); The plug pin (4) is provided with a concave ring, and the diameter of the concave ring on the plug pin (4) is equal to the inner diameter of the clamping hole (12).

5. The heterogeneous integrated circuit packaging structure according to claim 2, characterized in that: The upper shell (5) is provided with a positioning hole (13), the positioning hole (13) is arranged on both sides of the slide groove (14), and the lower shell (6) is provided with a positioning protrusion adapted to the positioning hole (13).

6. The heterogeneous integrated circuit packaging structure according to claim 2, characterized in that: The upper shell (5) is provided with a connecting hole (15), and the lower shell (6) is provided with a pin insertion hole (7), and both the pin insertion hole (7) and the connecting hole (15) are capable of allowing the pin (4) to pass through, and the axes of the pin insertion hole (7) and the connecting hole (15) are in the same straight line.

7. The heterogeneous integrated circuit packaging structure according to claim 6, characterized in that: A stabilizing component (9) is arranged in the connecting hole (15), and the stabilizing component (9) is used to connect the plug pin (4) and the contact point (2); The stabilizing assembly (9) comprises a first contact frame (18) in contact with the contact point (2), a second contact frame (20) in contact with the plug pin (4), and a stabilizing plate (19) arranged between the first contact frame (18) and the second contact frame (20); The first contact frame (18) is electrically connected to the second contact frame (20); The diameter of the stabilizing plate (19) is smaller than the diameters of the first contact frame (18) and the second contact frame (20); A fixing frame is fixedly connected to the outside of the stabilizing plate (19), the fixing frame on the outside of the stabilizing plate (19) is fixedly connected to the inner wall of the connecting hole (15), the second contact frame (20) is located inside the connecting hole (15), and the first contact frame (18) is located outside the connecting hole (15).

8. The heterogeneous integrated circuit packaging structure according to claim 7, characterized in that: A retractable sleeve (27) is fixedly connected to the center of the lower side of the stabilizing plate (19), an opening is provided at the lower end of the retractable sleeve (27), a retractable rod (21) is slidably connected in the opening of the retractable sleeve (27), connecting plates are provided at both upper and lower ends of the retractable rod (21), the connecting plate at the upper end of the retractable rod (21) is slidably connected in the retractable sleeve (27), and the connecting plate at the lower end of the retractable rod (21) is fixedly connected to the second contact frame (20); A fifth elastic member (29) is disposed in the retractable sleeve (27), and two ends of the fifth elastic member (29) are respectively connected to the stabilizing plate (19) and the connecting plate at the upper end of the retractable rod (21); The inner diameter of the opening at the lower end of the retractable sleeve (27) is greater than the diameter of the retractable rod (21).

9. The heterogeneous integrated circuit packaging structure according to claim 8, characterized in that: A plurality of connecting rods (28) are rotatably connected to the edge of the second contact frame (20), and a second elastic member (22) is fixedly connected to the connecting rod (28). One end of the second elastic member (22) away from the connecting rod (28) is fixedly connected to a connecting ball (26), and the connecting ball (26) is nested in a ball sleeve (23), and the ball sleeve (23) is fixedly connected to the edge of the stabilizing plate (19).

10. The heterogeneous integrated circuit packaging structure according to claim 7, characterized in that: A limiting rod (30) is fixedly connected to the center of the upper side of the stabilizing plate (19), one end of a third elastic member (24) is connected to the outer periphery of the limiting rod (30), and the other end of the third elastic member (24) is connected to the center of the first contact frame (18); A plurality of groups of fourth elastic members (25) are rotatably connected to the outer edge of the center, and the other end of the fourth elastic member (25) is rotatably connected to the edge of the stabilizing plate (19); A plurality of groups of fourth elastic members (25) are evenly distributed.

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