A multi-channel audio processor based on DSP

Abstract

The present invention discloses a DSP-based multi-channel audio processor, which relates to the field of audio processing technology. The multi-channel audio processor comprises a shell and a processor body, wherein the processor body is arranged on the inner side of the shell, a connecting seat is installed on the surface of the shell, a heat dissipation mechanism and a limiting mechanism are both provided on the connecting seat and the surface of the shell, a supporting mechanism is provided on the bottom end of the shell, and a supporting frame is slidably connected to the top end of the shell, and an adjustment mechanism is installed on the top end of the supporting frame, thereby achieving better heat dissipation performance. The heat generated by the processor body is first discharged from the heat dissipation net, the protective net and the ventilation holes through the heat dissipation fan, and the shell reserves space for heat discharge through the support of the bottom soft pad and the top support frame, thereby improving the heat dissipation performance of the audio processor after stacking, and avoiding the problem in the prior art that the heat dissipation performance is poor due to the close distance between devices.

Description

Technical Field

[0001] The present invention relates to the technical field of audio processing, in particular to a multi-channel audio processor based on DSP. Background Art

[0002] An audio processor is a device used to process and optimize audio signals. It can perform various processing on audio signals, such as adjustment, enhancement, mixing, filtering, compression, and effect addition, etc., aiming to improve audio quality, control the dynamic range of audio output, and achieve specific sound effects. A DSP audio processor is a digital audio signal processing device. It first converts the analog signal of multi-channel input into a digital signal, and then applies a series of tunable algorithms to process the digital signal to achieve sound quality optimization, matrix mixing, noise suppression, echo cancellation, feedback suppression and other functions, and then outputs the processed signal as a multi-channel analog signal through digital-to-analog conversion.

[0003] During the broadcasting process, a DSP audio processor is needed. First, connect the microphone and other audio devices to the input of the DSP audio processor, configure multiple audio channels for processing as needed, and then connect the audio output to the speaker or recording device.

[0004] However, existing audio processors have the following deficiencies:

[0005] 1) In the prior art, when using an audio processor, multiple devices need to be connected through a signal link to perform different audio processing tasks. To save space and facilitate equipment layout, multiple devices are often stacked. However, the close distance between multiple devices can easily deteriorate the heat dissipation of the devices, affecting their working performance. In addition, the devices are usually connected to the heat dissipation network in an integrated manner. When dust accumulates on the heat dissipation network and causes blockage, the entire device needs to be disassembled and the heat dissipation network needs to be cleaned, which is inconvenient for audio processor maintenance.

[0006] 2) When stacking multiple devices, they are placed directly on top of each other without any restraints. If a worker accidentally bumps into a device stacked on top, it could shift or even fall, damaging the device and posing a safety hazard. Furthermore, the devices are of different sizes, so placing them directly would affect the stability of the stack.

[0007] 3) Because the audio processor is placed directly on the desktop in the existing technology, if the desktop is uneven or the table is not placed flat, the audio processor will be placed unevenly, resulting in poor contact or failure of internal components. In addition, some components will generate slight electrical noise or distortion when placed unevenly, resulting in reduced audio signal quality and affecting the normal use of the audio processor.

[0008] Therefore, we propose a multi-channel audio processor based on DSP to solve the above problems. Summary of the Invention

[0009] The purpose of the present invention is to provide a DSP-based multi-channel audio processor to achieve better heat dissipation performance and simpler maintenance. The heat generated by the processor body is first discharged from the heat dissipation net, protective net and ventilation holes through a heat dissipation fan, and the outer shell reserves space for heat discharge through the support of the bottom soft pad and the top support frame, thereby improving the heat dissipation of the audio processor after stacking. At the same time, the heat dissipation net and the connecting seat at the top of the outer shell are limited by the insertion block and the limit block, which provides convenience for the maintenance of the audio processor, thereby solving the problems raised by the above-mentioned background technology.

[0010] To achieve the above objectives, the present invention provides the following technical solution: a DSP-based multi-channel audio processor, comprising a housing and a processor body, the processor body being disposed inside the housing, a connection seat being mounted on the surface of the housing, a heat dissipation mechanism and a limit mechanism being mounted on both the connection seat and the surface of the housing, a support mechanism being disposed at the bottom end of the housing, and a support frame being slidably connected to the top end of the housing, with an adjustment mechanism being mounted on the top end of the support frame;

[0011] The heat dissipation mechanism includes a movable groove, which is opened at both ends of the inner side of the shell, and the inner side of the movable groove is slidably connected with a heat dissipation net, the bottom end of the connecting seat is opened with a ventilation hole, and the inner surface of the connecting seat is installed with a cooling fan and a protective net, the four corners of the protective net are clamped to the top of the connecting seat, and the bottom end of the support frame is fixedly installed with a card block.

[0012] Preferably, the top of the housing and the outer surface of the top heat dissipation net are both provided with a card slot, and the inner side of the card slot is slidably connected to the surface of the card block.

[0013] Preferably, the limiting mechanism includes a socket, which is opened at the top of the shell and the outer surface of the top heat dissipation net, and the inner side of the socket is slidably connected with an insert block, the top of the insert block is fixedly installed with a pull block, and the top of the shell is opened with a placement groove, one end of the inner surface of the placement groove is fixedly installed with a first spring, and one end of the outer surface of the first spring is fixedly installed on the bottom end of the pull block.

[0014] Preferably, a limiting groove is provided on one side of the outer surface of the insert block, the inner side of the limiting groove is slidably connected to the limiting block, the outer surface of the limiting block is slidably connected to a fixed block, and the fixed blocks are fixedly installed on both sides of the outer surface of the connecting seat.

[0015] Preferably, the adjustment mechanism includes a groove, the groove is opened at the top of the shell, and the inner side of the groove is slidably connected with a baffle, the baffle is clamped to the top of the shell, and the top and one side of the outer surface of the support frame are both provided with sliding grooves.

[0016] Preferably, the inner side of the slide groove is slidably connected with the first slide rod and the second slide rod, and a stopper is fixedly installed on one end of the outer surface of the first slide rod and the second slide rod, and a second spring is fixedly installed on one end of the outer surface of the stopper, and the outer ring diameter of the stopper is larger than the inner ring diameter of one end of the inner surface of the slide groove, and the outer surface end of the second spring is fixedly installed on one end of the inner surface of the slide groove, and an adjustment frame is fixedly installed on the top end of the second slide rod, and a buffer pad is fixedly installed on one side of the outer surface of the adjustment frame and the support frame.

[0017] Preferably, the support mechanism includes a receiving groove, which is opened at the four corners of the bottom end of the shell, and the four corners of the top end of the shell are rotatably connected to a rotating rod, and the bottom surface of the rotating rod and the inner side of the shell are both provided with a threaded groove, and the bottom surface of the rotating rod is rotatably connected to the inner side of the shell through the threaded groove.

[0018] Preferably, a soft pad is fixedly mounted on the bottom end of the rotating rod, a turning handle is fixedly mounted on the top end of the rotating rod, a telescopic rod is fixedly mounted on the outer surface of the soft pad, and the soft pad is slidably connected to the inner side of the storage slot.

[0019] Preferably, a connecting ring is fixedly mounted on the top surface of the telescopic rod, an outer surface of the connecting ring is rotatably connected to a bearing, and the bearing is fixedly mounted on the inner side of the receiving groove.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention achieves better heat dissipation performance and simpler maintenance through the structural coordination of the movable slot, heat dissipation net, ventilation hole, heat dissipation fan, protective net, card block, card slot, jack, plug block, placement slot, first spring, pull block, limit slot, limit block and fixed block. The heat generated by the processor body is first discharged from the heat dissipation net, protective net and ventilation hole at the bottom of the shell, and the heat dissipation net at the top of the shell through the heat dissipation fan. The bottom of the shell is supported by the soft pad and the top of the shell is supported by the support frame to reserve space for heat discharge, thereby improving the heat dissipation of the audio processor after stacking. When the protective net and heat dissipation net need to be adjusted, the heat dissipation of the audio processor is improved. When the heat network is to be cleaned, the limiting block can be pulled away from the limiting groove so that the connecting seat can be removed from the shell, and the protective net connected to the connecting seat can be directly removed, and then the plug block is driven away from the jack by the reset of the first spring, so that the heat dissipation network can be removed from the movable groove for cleaning, and then the protective net and the heat dissipation network can be cleaned. Conversely, the heat dissipation network and the connecting seat at the top of the shell can be limited by the plug block and the limiting block. The operation is simple, which provides convenience for the maintenance of the audio processor and avoids the problem in the prior art that the heat dissipation performance is poor due to the close distance between the devices and the maintenance of the equipment is more difficult.

[0022] 2. The present invention realizes a wider equipment stacking range through the structural coordination of the groove, baffle, slide, first slide bar, block, second spring, second slide bar, adjustment frame and buffer pad. First, the adjustment frame is pulled to make the adjustment frame drive the second slide bar to move, and then the second slide bar drives the block to move in the slide bar at the top of the support frame, so that the block drives the second spring to be compressed. Then, another device can be placed on the support frame, and the extrusion of the device drives the block on the support frame to move in the card slot, so that the support frame moves to both sides. Subsequently, the movement of the support frame compresses the second spring on one side of its outer surface, and the block is driven to move. The outer ring diameter is larger than the inner ring diameter of one end of the inner surface of the slide groove, which can prevent the second slide bar and the first slide bar from separating from the inner side of the slide groove. When the support frame moves to a space suitable for placing the equipment, the adjustment frame can be loosened, so that the reset of the second spring drives the stopper to move, and drives the first slide bar and the second slide bar to move through the stopper, and then drives the support frames on both sides to move toward the middle and the adjustment frame downward through the first slide bar and the second slide bar, so that the support frame and the adjustment frame can limit equipment of different sizes, and the buffer pad can prevent pressure loss on the equipment, thereby improving the situation in the prior art where equipment is easily shifted and the stacking of equipment of different sizes easily affects its stability.

[0023] 3. The present invention achieves higher stability through the structural coordination of the storage groove, rotating rod, threaded groove, soft pad, rotating handle, telescopic rod, connecting ring, bearing, connecting seat and support frame. The rotating rod is first driven to move by the rotating handle, so that the rotating rod drives the soft pad to move, and then the telescopic rod is driven to move by the soft pad, so that the telescopic rod drives the connecting ring to rotate on the inner side of the bearing, and the up and down movement of the soft pad drives the telescopic rod to extend and retract, while providing auxiliary support to the soft pad without affecting its movement, and increasing its friction with the desktop through the soft pad, further improving the stability of the soft pad, and then the four corners of the shell can be leveled by adjusting the height of the soft pad, preventing the audio processor from being placed unevenly and affecting its normal use, thereby solving the problem of the audio processor being placed unevenly and affecting its normal use in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a stereoscopic diagram of the main structure of a DSP-based multi-channel audio processor of the present invention;

[0025] Figure 2 This is a side view of the structure of a DSP-based multi-channel audio processor of the present invention;

[0026] Figure 3 This is a three-dimensional diagram of the split structure of a DSP-based multi-channel audio processor of the present invention;

[0027] Figure 4 This is an enlarged perspective view of the exploded structure of a connector in a DSP-based multi-channel audio processor of the present invention;

[0028] Figure 5 This is an enlarged perspective view of the exploded structure of the housing of a DSP-based multi-channel audio processor of the present invention;

[0029] Figure 6 This invention is a multi-channel audio processor based on DSP Figure 5 A magnified stereoscopic view of the structure at center A;

[0030] Figure 7 This is an enlarged perspective view of the exploded structure of the regulating mechanism in a DSP-based multi-channel audio processor of the present invention;

[0031] Figure 8 This invention is a multi-channel audio processor based on DSP Figure 7 A magnified stereoscopic view of the structure at point B in the middle;

[0032] Figure 9 This is an enlarged perspective view of the exploded structure of the support mechanism in a DSP-based multi-channel audio processor of the present invention;

[0033] Figure 10This invention is a multi-channel audio processor based on DSP Figure 9 Enlarged stereoscopic image of the structure at point C in the middle.

[0034] In the figure: 1. Housing; 2. Heat dissipation mechanism; 201. Moving slot; 202. Heat dissipation net; 203. Ventilation hole; 204. Cooling fan; 205. Protective net; 206. Block; 207. Slot; 3. Limiting mechanism; 301. Insertion hole; 302. Insertion block; 303. Placement slot; 304. First spring; 305. Pulling block; 306. Limiting slot; 307. Limiting block; 308. Fixed block; 4. Adjusting mechanism; 401. Groove ; 402, baffle; 403, slide; 404, first slide; 405, block; 406, second spring; 407, second slide; 408, adjustment frame; 409, buffer pad; 5, support mechanism; 501, storage slot; 502, rotating rod; 503, threaded groove; 504, cushion; 505, turning handle; 506, telescopic rod; 507, connecting ring; 508, bearing; 6, connecting seat; 7, support frame; 8, processor body. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] Please see the attached Figure 1 -Attached Figure 10 As shown, the present invention provides a technical solution: a DSP-based multi-channel audio processor, comprising a shell and a processor body, wherein the processor body is arranged on the inner side of the shell, a connecting seat is installed on the surface of the shell, a heat dissipation mechanism and a limiting mechanism are provided on the surface of the connecting seat and the shell, a supporting mechanism is provided at the bottom end of the shell, and a supporting frame is slidably connected to the top end of the shell, and an adjustment mechanism is installed on the top end of the supporting frame.

[0037] Example 1, according to Figures 1-6As shown, the heat dissipation mechanism 2 includes a movable groove 201, which is opened at both ends of the inner side of the shell 1, and the inner side of the movable groove 201 is slidably connected to the heat dissipation net 202, the bottom end of the connecting seat 6 is provided with a ventilation hole 203, and the inner surface of the connecting seat 6 is installed with a heat dissipation fan 204 and a protective net 205, the four corners of the protective net 205 are connected to the top of the connecting seat 6, and the bottom end of the support frame 7 is fixedly installed with a card block 206. The top of the shell 1 and the outer surface of the top heat dissipation net 202 are both provided with a card slot 207, and the inner side of the card slot 207 is slidably connected to the surface of the card block 206. The limiting mechanism 3 includes a socket 301, and the socket 301 is opened on the outside. The top of the shell 1 and the outer surface of its top heat dissipation net 202, and the inner side of the socket 301 are slidably connected with an insert block 302, and the top of the insert block 302 is fixedly installed with a pull block 305. A placement groove 303 is provided at the top of the shell 1, and a first spring 304 is fixedly installed at one end of the inner surface of the placement groove 303. One end of the outer surface of the first spring 304 is fixedly installed at the bottom end of the pull block 305. A limiting groove 306 is provided on one side of the outer surface of the insert block 302, and the inner side of the limiting groove 306 is slidably connected to the limiting block 307. The outer surface of the limiting block 307 is slidably connected with a fixed block 308, and the fixed block 308 is fixedly installed on both sides of the outer surface of the connecting seat 6.

[0038] The effects achieved by the entire embodiment 1 are: achieving better heat dissipation performance and simpler maintenance work, firstly, the heat generated by the processor body 8 is discharged from the heat dissipation net 202, the protective net 205 and the ventilation holes 203 at the bottom of the shell 1, and the heat dissipation net 202 at the top of the shell 1 through the heat dissipation fan 204, and the shell 1 reserves space for heat discharge through the support of the bottom soft pad 504 and the top support frame 7, thereby improving the heat dissipation of the audio processor after stacking, and when it is necessary to clean the protective net 205 and the heat dissipation net 202, the limit block 307 can be pulled away from the limit slot 306 to make the connection seat 6 can be removed from the housing 1, and the protective net 205 connected to the connecting seat 6 can be directly removed, and then the first spring 304 is reset to drive the plug block 302 away from the socket 301, so that the heat dissipation net 202 can be removed from the movable groove 201 for cleaning, and then the protective net 205 and the heat dissipation net 202 can be cleaned. Conversely, the heat dissipation net 202 at the top of the housing 1 and the connecting seat 6 can be limited by the plug block 302 and the limiting block 307, and the movement of the heat dissipation net 202 and the protective net 205 at the bottom of the housing 1 can be limited by the connection between the connecting seat 6 and the housing 1. The operation is simple and the maintenance of the audio processor is convenient.

[0039] Example 2, according to Figure 5 、 Figure 7 and Figure 8As shown, the adjustment mechanism 4 includes a groove 401, which is opened at the top of the shell 1, and the inner side of the groove 401 is slidably connected to a baffle 402, which is clamped to the top of the shell 1, and a sliding groove 403 is opened at the top and one side of the outer surface of the support frame 7, and the inner side of the sliding groove 403 is slidably connected to a first sliding rod 404 and a second sliding rod 407, and one end of the outer surface of the first sliding rod 404 and the second sliding rod 407 is fixedly installed, and one end of the outer surface of the stopper 405 is fixedly installed with a second spring 406, and the outer ring diameter of the stopper 405 is larger than the inner ring diameter of one end of the inner surface of the sliding groove 403, and one end of the outer surface of the second spring 406 is fixedly installed at one end of the inner surface of the sliding groove 403, and an adjusting frame 408 is fixedly installed on the top of the second sliding rod 407, and a buffer pad 409 is fixedly installed on one side of the outer surface of the adjusting frame 408 and the support frame 7.

[0040] The effect achieved by the entire embodiment 2 is as follows: a wider range of equipment stacking is achieved. First, the adjustment frame 408 is pulled so that the adjustment frame 408 drives the second slide bar 407 to move, and then the second slide bar 407 drives the stopper 405 to move in the slide groove 403 at the top of the support frame 7, so that the stopper 405 drives the second spring 406 to be compressed. Then, another equipment can be placed on the support frame 7, and the block 206 on the support frame 7 is driven to move in the slot 207 by the squeezing of the equipment, so that the support frame 7 moves to both sides. Subsequently, the second spring 406 on one side of the outer surface of the support frame 7 is compressed by the movement of the support frame 7, and the outer ring diameter of the stopper 405 is larger than the inner ring diameter of one end of the inner surface of the slide groove 403, which can prevent the second slide bar 407 and the first slide bar 404 from being separated from the inner side of the slide groove 403. When the support frame 7 moves to a space suitable for placing the equipment, the adjustment frame 408 can be released, so that the reset of the second spring 406 drives the stopper 405 to move, and the stopper 405 drives the first slide bar 404 and the second slide bar 407 to move, and then the first slide bar 404 and the second slide bar 407 drive the support frames 7 on both sides to move toward the middle and the adjustment frame 408 to move downward, so that the support frame 7 and the adjustment frame 408 can limit equipment of different sizes, and the buffer pad 409 can prevent pressure loss on the equipment, thereby improving the stability of equipment stacking. Then, after removing the baffle 402 from the groove 401, the support frame 7 can be removed from the card slot 207 to stack the equipment, and the support frame 7 will move above the baffle 402 when in use, and the baffle 402 can be limited by the groove 401 and the support frame 7.

[0041] Example 3, according to Figure 3 、 Figure 9 and Figure 10As shown, the support mechanism 5 includes a storage groove 501, which is opened at the four corners of the bottom end of the shell 1, and the four corners of the top end of the shell 1 are rotatably connected to the rotating rod 502, and the bottom surface of the rotating rod 502 and the inner side of the shell 1 are opened with a threaded groove 503, and the bottom surface of the rotating rod 502 is rotatably connected to the inner side of the shell 1 through the threaded groove 503, and the bottom end of the rotating rod 502 is fixedly installed with a soft pad 504, and the top end of the rotating rod 502 is fixedly installed with a turning handle 505, and the outer surface of the soft pad 504 is fixedly installed with a telescopic rod 506, and the soft pad 504 is slidably connected to the inner side of the storage groove 501, and the top surface of the telescopic rod 506 is fixedly installed with a connecting ring 507, and the outer surface of the connecting ring 507 is rotatably connected with a bearing 508, and the bearing 508 is fixedly installed on the inner side of the storage groove 501.

[0042] The effect achieved by the entire embodiment 3 is: achieving higher stability, firstly driving the rotating rod 502 to move by the rotating handle 505, so that the rotating rod 502 drives the soft pad 504 to move, and then driving the telescopic rod 506 to move by the soft pad 504, so that the telescopic rod 506 drives the connecting ring 507 to rotate on the inner side of the bearing 508, and the up and down movement of the soft pad 504 will drive the telescopic rod 506 to retract, while not affecting the movement of the soft pad 504. The soft pad 504 increases its friction with the desktop, further improving the stability of the soft pad 504, and then the height of the soft pad 504 can be adjusted to level the four corners of the shell 1, preventing the audio processor from being placed unevenly and affecting its normal use. At the same time, the soft pad 504 can be driven by the rotating rod 502 to retract into the inner side of the storage slot 501, so that the audio processor can also be stacked on top of another device, which is convenient for the placement of the audio processor.

[0043] The working principle of the entire device is as follows: when placing the audio processor, first place the audio processor on the desktop, then use the turning handle 505 to drive the rotating rod 502 to move, so that the rotating rod 502 drives the soft pad 504 to move, and then the soft pad 504 drives the telescopic rod 506 to move, so that the telescopic rod 506 drives the connecting ring 507 to rotate on the inner side of the bearing 508, and the up and down movement of the soft pad 504 will drive the telescopic rod 506 to retract, while not affecting the movement of the soft pad 504. At the same time, the soft pad 504 increases its friction with the desktop, further improving the stability of the soft pad 504. Subsequently, the four corners of the shell 1 can be leveled by adjusting the height of the soft pad 504, so that the shell 1 is stable. The audio processor can be placed on the desktop to prevent it from being unevenly placed and affecting its normal use. At the same time, the soft pad 504 can be driven by the rotating rod 502 to be retracted into the inner side of the storage groove 501, so that the audio processor can also be stacked on top of another device. Then, the adjustment frame 408 is pulled to make the adjustment frame 408 drive the second slide bar 407 to move, and then the second slide bar 407 drives the stopper 405 to move in the slide groove 403 at the top of the support frame 7, so that the stopper 405 drives the second spring 406 to be compressed, and then another device can be placed on the support frame 7, and the squeezing of the device drives the block 206 on the support frame 7 to move in the card groove 207, so that the support frame 7 moves to both sides, and then the movement of the support frame 7 makes The second spring 406 on one side of its outer surface is compressed, and the outer ring diameter of the stopper 405 is larger than the diameter of one end of the inner surface of the slide groove 403 to prevent the second slide bar 407 and the first slide bar 404 from disengaging from the inner side of the slide groove 403. When the support frame 7 moves to a space suitable for the equipment to be placed, the adjustment frame 408 can be released, so that the reset of the second spring 406 drives the stopper 405 to move, and drives the first slide bar 404 and the second slide bar 407 to move through the stopper 405, and then drives the support frames 7 on both sides to move toward the middle and the adjustment frame 408 to move downward through the first slide bar 404 and the second slide bar 407, so that the support frame 7 and the adjustment frame 408 can limit equipment of different sizes, thereby increasing the stacking range of the equipment and improving its The stacking stability is ensured, and the buffer pad 409 can prevent the device from being damaged by pressure. When the device needs to be stacked on another device, the baffle 402 can be removed from the groove 401, and then the support frame 7 can be removed from the card slot 207 to stack the devices. Since the support frame 7 will move above the baffle 402 when in use, the baffle 402 can be limited by the groove 401 and the support frame 7. During the operation of the audio processor, the heat generated by the processor body 8 can be discharged from the heat dissipation net 202, the protective net 205 and the ventilation hole 203 at the bottom of the shell 1, and the heat dissipation net 202 at the top of the shell 1 through the cooling fan 204, and the bottom of the shell 1 is supported by the cushion 504 to reserve space for heat discharge.The top of the shell 1 is supported by the support frame 7 to reserve space for heat discharge, thereby improving the heat dissipation of the audio processor after stacking. When the heat dissipation net 202 is covered with dust and needs to be cleaned, since the first spring 304 is in a compressed state, the limiting block 307 can be pulled away from the limiting groove 306, so that the connecting seat 6 can be removed from the shell 1, and the protective net 205 connected to the connecting seat 6 can be directly removed. Subsequently, the plug-in block 302 is driven away from the jack 301 by the reset of the first spring 304, so that the heat dissipation net 202 can be removed from the movable groove 201, and then the protective net 205 and the heat dissipation net 202 can be cleaned. Conversely, the cleaned heat dissipation net 202 and the protective net 205 can be separated. 05 is moved back to its original position, and then the pull block 305 is pressed down, so that the pull block 305 drives the plug block 302 to be inserted into the jack 301 and drives the first spring 304 to be compressed. Then, the connecting seat 6 is placed on the surface of the shell 1, and then the limit block 307 can be inserted into the limit groove 306. The reset of the first spring 304 applies an upward force to the pull block 305, and the limit block 307 is firmly connected to the plug block 302, so that the plug block 302 and the limit block 307 limit the heat dissipation net 202 at the top of the shell 1 and the connecting seat 6. Then, the connection between the connecting seat 6 and the shell 1 limits the movement of the heat dissipation net 202 and the protective net 205 at the bottom of the shell 1. The operation is simple, which provides convenient maintenance for the audio processor.

[0044] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A DSP-based multi-channel audio processor, comprising a housing (1) and a processor body (8), characterized in that: The processor body (8) is arranged on the inner side of the housing (1), a connection seat (6) is installed on the surface of the housing (1), a heat dissipation mechanism (2) and a limit mechanism (3) are provided on the surface of the connection seat (6) and the housing (1), a support mechanism (5) is provided at the bottom end of the housing (1), and a support frame (7) is slidably connected to the top end of the housing (1), and an adjustment mechanism (4) is installed on the top end of the support frame (7); The heat dissipation mechanism (2) includes a movable groove (201), the movable groove (201) is provided at both ends of the inner side of the housing (1), and the inner side of the movable groove (201) is slidably connected to a heat dissipation net (202), the bottom end of the connecting seat (6) is provided with a ventilation hole (203), and the inner surface of the connecting seat (6) is installed with a heat dissipation fan (204) and a protective net (205), the four corners of the protective net (205) are clamped to the top of the connecting seat (6), and the bottom end of the support frame (7) is fixedly installed with a clamping block (206); The limiting mechanism (3) includes a socket (301), the socket (301) is provided at the top of the housing (1) and the outer surface of the top heat dissipation net (202), and the inner side of the socket (301) is slidably connected to an insert block (302), the top of the insert block (302) is fixedly mounted with a pull block (305), the top of the housing (1) is provided with a placement groove (303), one end of the inner surface of the placement groove (303) is fixedly mounted with a first spring (304), and one end of the outer surface of the first spring (304) is fixedly mounted on the bottom end of the pull block (305); A limiting groove (306) is provided on one side of the outer surface of the insert block (302); the inner side of the limiting groove (306) is slidably connected to a limiting block (307); the outer surface of the limiting block (307) is slidably connected to a fixing block (308); the fixing block (308) is fixedly mounted on both sides of the outer surface of the connecting seat (6).

2. The DSP-based multi-channel audio processor according to claim 1, wherein: The top of the housing (1) and the outer surface of the top heat dissipation net (202) are both provided with a card slot (207), and the inner side of the card slot (207) is slidably connected to the surface of the card block (206).

3. The DSP-based multi-channel audio processor according to claim 1, wherein: The adjusting mechanism (4) includes a groove (401), the groove (401) is provided at the top end of the housing (1), and a baffle (402) is slidably connected to the inner side of the groove (401), and the baffle (402) is clamped to the top end of the housing (1). The top end and one side of the outer surface of the support frame (7) are both provided with a sliding groove (403).

4. The DSP-based multi-channel audio processor according to claim 3, wherein: The inner side of the slide groove (403) is slidably connected to a first slide bar (404) and a second slide bar (407), and one end of the outer surface of the first slide bar (404) and the second slide bar (407) is fixedly installed with a stopper (405), and one end of the outer surface of the stopper (405) is fixedly installed with a second spring (406), and the outer ring diameter of the stopper (405) is larger than the inner ring diameter of one end of the inner surface of the slide groove (403), and one end of the outer surface of the second spring (406) is fixedly installed on one end of the inner surface of the slide groove (403), and an adjustment frame (408) is fixedly installed on the top end of the second slide bar (407), and a buffer pad (409) is fixedly installed on one side of the outer surface of the adjustment frame (408) and the support frame (7).

5. The DSP-based multi-channel audio processor according to claim 1, wherein: The support mechanism (5) comprises a receiving groove (501), the receiving groove (501) being provided at the four corners of the bottom end of the housing (1), the four corners of the top end of the housing (1) being rotatably connected to a rotating rod (502), the bottom surface of the rotating rod (502) and the inner side of the housing (1) being provided with a threaded groove (503), and the bottom surface of the rotating rod (502) being rotatably connected to the inner side of the housing (1) via the threaded groove (503).

6. The DSP-based multi-channel audio processor according to claim 5, characterized in that: A soft pad (504) is fixedly mounted on the bottom end of the rotating rod (502), a turning handle (505) is fixedly mounted on the top end of the rotating rod (502), a telescopic rod (506) is fixedly mounted on the outer surface of the soft pad (504), and the soft pad (504) is slidably connected to the inner side of the storage slot (501).

7. The DSP-based multi-channel audio processor according to claim 6, characterized in that: A connecting ring (507) is fixedly mounted on the top surface of the telescopic rod (506), and a bearing (508) is rotatably connected to the outer surface of the connecting ring (507), and the bearing (508) is fixedly mounted on the inner side of the receiving groove (501).

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