Circuit board assembly, electronic equipment, welding equipment and welding method

Abstract

The embodiment of the invention provides a circuit board assembly, electronic equipment, welding equipment and a welding method, and the circuit board assembly comprises a first circuit board and a second circuit board. The first circuit board is provided with a central area and a first surrounding area arranged around the central area; the central area is used for arranging electronic parts or structural parts; the first surrounding area is used for arranging a plurality of first bonding pads, and the plurality of first bonding pads are used for being electrically connected with an electronic part and a second circuit board; the second circuit board is provided with a central hollow area, a second surrounding area surrounding the central hollow area and an interface area arranged at the edge of the second surrounding area; the central hollow area is arranged corresponding to the central area and is used for avoiding electronic parts or structural parts arranged in the central area; the second peripheral area is used for arranging a plurality of second bonding pads, and the plurality of second bonding pads are used for being electrically connected with the first circuit board and the interface device; the plurality of first bonding pads and the plurality of second bonding pads are welded and fixed in one-to-one correspondence, so that the size of the circuit board assembly is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and particularly to a circuit board assembly, an electronic device, a welding device and a welding method. Background Art

[0002] With the development of electronic devices, more and more functions need to be implemented in electronic devices. Correspondingly, more and more electronic components are arranged inside the electronic devices; accordingly, the occupied space of the circuit board assembly in the electronic device is getting larger and larger. In the circuit board assembly of the related art, BTB (Board-to-Board) connectors are usually used to connect different circuit boards, or FOB (FPC on Board) laser welding technology is used to connect different circuit boards; the BTB connectors occupy too much space; the solder pads in the FOB laser welding technology are concentrated on one side or both sides of the circuit board, with unreasonable layout and large occupied space. Therefore, it is necessary to optimize the structure of the circuit board assembly to reduce the space occupied by the circuit board assembly in the electronic device. Summary of the Invention

[0003] The purpose of the embodiments of the present application is to provide a circuit board assembly, an electronic device, a welding device and a welding method to reduce the space occupied by the circuit board assembly in the electronic device. The specific technical solutions are as follows:

[0004] The embodiments of the present application propose a circuit board assembly, which includes a first circuit board and a second circuit board; the first circuit board has a central area and a first surrounding area arranged around the central area; the central area is used to arrange electronic components or structural components; the first surrounding area is used to arrange a plurality of first solder pads, and the plurality of first solder pads are used for electrical connection with the electronic components and the second circuit board; the second circuit board has a central hollow area, a second surrounding area around the central hollow area and an interface area arranged at the edge of the second surrounding area; the central hollow area is correspondingly arranged with the central area for avoiding the electronic components or the structural components arranged in the central area; the interface area is used to arrange interface devices; the second surrounding area is used to arrange a plurality of second solder pads, and the plurality of second solder pads are used for electrical connection with the first circuit board and the interface devices; the plurality of first solder pads and the plurality of second solder pads are welded and fixed in one-to-one correspondence.

[0005] As can be seen from the above, in the circuit board assembly according to the embodiment of the present application, electronic components or structural components can be arranged in the central area of the first circuit board, and a plurality of first pads are arranged in the first peripheral area surrounding the central area; the central hollow area of the second circuit board corresponds to the central area of the first circuit board to avoid electronic components or structural components when the first circuit board and the second circuit board are assembled; the second peripheral area of the second circuit board surrounds its central hollow area and is provided with a plurality of second pads; the first pads and the second pads are welded and fixed in one-to-one correspondence, and the electronic components are electrically connected to the first pads, thereby realizing the electrical connection between the electronic components and the second circuit board; the second circuit board has an interface area arranged at the edge of the second peripheral area, and an interface device is arranged in the interface area, thereby realizing the connection between the second circuit board and an external circuit. After the first circuit board and the second circuit board are welded and fixed, the plurality of first pads and the plurality of second pads are distributed around the electronic components or structural components. Compared with the related art in which the pads are arranged on one side or both sides of the circuit board, the circuit board assembly according to the embodiment of the present application makes full use of the space between the plurality of first pads and the space between the plurality of second pads to increase the layout area, make the layout compact, and fix the first circuit board and the second circuit board by welding, without using a connector to connect the first circuit board and the second circuit board, so that the volume is smaller and the space occupied by the circuit board assembly in the electronic device is reduced.

[0006] In some embodiments of the present application, the plurality of first pads and the plurality of second pads are all distributed in a complete ring shape, a ring shape with a notch or a concave shape;

[0007] The plurality of first pads and the plurality of second pads are arranged in one-to-one correspondence.

[0008] As can be seen from the above, the plurality of first pads and the plurality of second pads are arranged in one-to-one correspondence. The first electronic component can be arranged in the area surrounded by the solder joints of the first pads and the second pads distributed in a ring shape, which saves space and is conducive to the connection of the traces between the first electronic component and the first pads.

[0009] In some embodiments of the present application, at least one third pad and at least one first electronic component are arranged in the central area of the first circuit board;

[0010] Each of the first electronic components and the first pads electrically connected thereto are electrically connected through the third pads.

[0011] As can be seen from the above, the first electronic component is arranged in the central area and is electrically connected to the first circuit board through the third pad, which saves space and has high connection reliability.

[0012] In some embodiments of the present application, no solder penetration holes are provided on each of the first pads;

[0013] One or two solder-penetrating holes are provided on at least a part of the second pad.

[0014] As can be seen from the above, such a design facilitates the subsequent FOB laser welding process.

[0015] In some embodiments of the present application, fiducial mark points for welding and positioning are provided on both the first circuit board and the second circuit board;

[0016] The fiducial mark points on the first circuit board are correspondingly arranged with the fiducial mark points on the second circuit board.

[0017] As can be seen from the above, in production, the fiducial mark points provide common measurable points for all steps in the assembly process, so each device used in the assembly can accurately position the circuit pattern to achieve accuracy.

[0018] In some embodiments of the present application, the shapes of the first pad and the second pad are circular or rectangular.

[0019] As can be seen from the above, the circular or rectangular first pad and second pad are convenient for processing.

[0020] In some embodiments of the present application, the first circuit board is a printed circuit board, and the second circuit board is a flexible circuit board.

[0021] As can be seen from the above, the processes of the printed circuit board and the flexible circuit board are mature, which is conducive to improving the reliability of the circuit board assembly.

[0022] In some embodiments of the present application, the first circuit board is rectangular;

[0023] The central hollowed-out area and the second surrounding area of the second circuit board together form a rectangular area;

[0024] The number of the interface areas is one, extending from one side of the rectangular area in a direction away from the central hollowed-out area; or, the number of the interface areas is two, respectively arranged on opposite sides of the rectangular area, and each interface area extends from the corresponding side of the rectangular area in a direction away from the central hollowed-out area.

[0025] As can be seen from the above, such a setting is convenient for processing and for the alignment between the first circuit board and the second circuit board.

[0026] In some embodiments of the present application, both the first circuit board and the second circuit board have a convex structure and / or a concave structure.

[0027] As can be seen from the above, such a setting makes the setting method more flexible, and can enable the circuit board assembly to be applied to more application scenarios.

[0028] An embodiment of the present application provides an electronic device, which includes a first device body, and the first device body includes the circuit board assembly of any of the above embodiments.

[0029] As can be seen from the above, the electronic device of the embodiment of the present application includes the circuit board assembly of any of the above embodiments. After the first circuit board and the second circuit board are welded and fixed, a plurality of first pads and a plurality of second pads are distributed around the electronic components or structural components. Compared with the related art where the pads are arranged on one side or both sides of the circuit board, the circuit board assembly of the embodiment of the present application makes full use of the space between the plurality of first pads and the space between the plurality of second pads to increase the layout area, make the layout compact, and use the welding method to fix the first circuit board and the second circuit board without using a connector to connect the first circuit board and the second circuit board, resulting in a smaller volume and reducing the space occupied by the circuit board assembly in the electronic device, thus facilitating the miniaturization design of the electronic device.

[0030] In some embodiments of the present application, the electronic device further includes a first display screen;

[0031] The first device body further includes: a first main board, a first middle frame, a first rear case, a secondary board, and a first battery;

[0032] The first middle frame and the first rear case are fixedly connected to form a first accommodation space;

[0033] The circuit board assembly, the first main board, the secondary board, and the first battery are arranged in the first accommodation space;

[0034] Wherein, the circuit board assembly is mounted on one side of the first main board facing the first rear case; and the circuit board assembly is electrically connected to the first main board through the interface device;

[0035] The first main board is also electrically connected to the first display screen, the first battery, and the secondary board respectively;

[0036] The first display screen is arranged on one side of the first middle frame away from the first rear case and is fixedly connected to the first middle frame.

[0037] As can be seen from the above, the first middle frame and the first rear case are fixedly connected to form a first accommodation space; the circuit board assembly, the first main board, the secondary board, and the first battery are arranged in the first accommodation space, and the first middle frame and the first rear case play a protective role for the devices arranged in the first accommodation space.

[0038] In some embodiments of the present application, the electronic device further includes: a camera assembly and a decorative piece;

[0039] A first through hole is provided on the surface of the first rear case away from the first middle frame;

[0040] The decorative member covers the first through hole and is located on the side of the first rear case away from the first middle frame;

[0041] A hollowed-out camera mounting area is provided on the first main board, and the camera assembly is disposed in the camera mounting area;

[0042] The orthographic projection of the decorative member on the first main board covers the orthographic projection of the camera assembly on the first main board.

[0043] As can be seen from the above, the camera assembly can be mounted on the first middle frame, at least part of the camera assembly protrudes from the first rear case through the first through hole, the decorative member covers the first through hole, and the camera assembly is located between the decorative member and the first middle frame. In this way, the thickness at the DECO of the mobile phone is greater than that of other areas, making full use of the space at the DECO of the mobile phone and at the same time facilitating the reduction of the thickness of other areas of the electronic device.

[0044] In some embodiments of the present application, second electronic components are disposed on the first surface of the first main board, and third electronic components are disposed on the second surface;

[0045] A first shielding cover is further disposed between the first main board and the first middle frame, and the first shielding cover and the first main board together form a second accommodation space; the second electronic components are accommodated in the second accommodation space;

[0046] A second shielding cover is further disposed between the first main board and the circuit board assembly, and the second shielding cover and the first main board together form a sealed third accommodation space; the third electronic components are accommodated in the third accommodation space;

[0047] The circuit board assembly is mounted on the second shielding cover.

[0048] As can be seen from the above, the shielding cover can shield the influence of external electromagnetic waves on the internal circuit and the radiation of the electromagnetic waves generated inside to the outside; by providing the first shielding cover and the second shielding cover, electromagnetic shielding can be achieved between the second electronic components and the third electronic components and other electronic components in the first main board or electronic components in other circuit boards. At the same time, the wear of the second electronic components and the third electronic components during installation or use can be reduced.

[0049] In some embodiments of the present application, a second through hole is provided at a position on the first middle frame corresponding to the second electronic components, a third through hole is provided at a position on the first shielding cover corresponding to the second through hole, and a first heat dissipation member is disposed in the second through hole and the third through hole, and the first heat dissipation member is in contact with the second electronic components;

[0050] On a side of the first middle frame away from the first main board, a second heat dissipation member is provided, and the second heat dissipation member is in contact with the first heat dissipation member.

[0051] As can be seen from the above, the heat dissipated by the second electronic component can be dissipated through the first heat dissipation member and the second heat dissipation member. The first display screen can be in contact with the second heat dissipation member, and the heat is transferred to the second heat dissipation member by contact. The second electronic component and the first display screen are simultaneously cooled by the first heat dissipation member and the second heat dissipation member, which is beneficial to improving the heat dissipation efficiency.

[0052] In some embodiments of the present application, the electronic device further includes: a second display screen, a second device body, and a rotating shaft mechanism;

[0053] The second device body includes: a second main board, a second middle frame, a second rear case, and a second battery;

[0054] The second middle frame and the second rear case are fixedly connected to form a fourth accommodation space;

[0055] The second main board and the second battery are arranged in the fourth accommodation space;

[0056] The rotating shaft mechanism is located between the first middle frame and the second middle frame and is respectively rotatably connected to the two, so that the second device body and the first device body can be folded relative to the rotating shaft mechanism;

[0057] The second display screen is a foldable display screen and covers the first middle frame, the rotating shaft mechanism, and the second middle frame; the first display screen is located on a side of the first middle frame that does not cover the second display screen;

[0058] The first main board and the second main board are electrically connected through a through-axis connecting member, and the through-axis connecting member enters the fourth accommodation space from the first accommodation space through the rotating shaft mechanism.

[0059] As can be seen from the above, the rotating shaft mechanism is used to make the first middle frame and the second middle frame rotate relative to each other, so as to realize the folding and flattening of the electronic device.

[0060] The present application provides a welding device, which includes: a laser, a device body, a galvanometer scanner, a glass pressing head, and a workbench;

[0061] The galvanometer scanner is arranged on the device body for scanning the laser emitted by the laser;

[0062] The glass pressing head is installed on the device body and is suspended above the workbench in a liftable manner for fixing the circuit board to be welded on the workbench during welding;

[0063] The glass pressing head has a central light-transmitting area and a surrounding light-transmitting area arranged around the central light-transmitting area; the central light-transmitting area is used to cooperate with the galvanometer so that the laser emitted by the laser is directed to the central area of the circuit board to be welded; the surrounding light-transmitting area is used to press the surrounding area of the circuit board to be welded and cooperate with the galvanometer so that the laser emitted by the laser is directed to the surrounding area of the circuit board to be welded; wherein, the central area of the circuit board to be welded is used to arrange electronic components or structural components, and the surrounding area of the circuit board to be welded is provided with solder pads.

[0064] As can be seen from the above, the welding device of the embodiment of the present application is used to prepare the circuit board assembly of any one of the above embodiments. By setting different glass pressing heads, separate welding of the first solder pad and the second solder pad can be achieved to weld the first circuit board and the second circuit board, separate welding of the first electronic component and the first circuit board can also be achieved, and simultaneous welding of the first circuit board and the second circuit board, as well as the first electronic component and the first circuit board can be achieved. The application scenarios are diverse, and in the welded circuit board assembly, multiple first solder pads and multiple second solder pads are distributed around the first electronic component. Compared with the related art where the solder pads are arranged on one side or both sides of the circuit board, the circuit board assembly of the embodiment of the present application makes full use of the space between multiple first solder pads and the space between multiple second solder pads to increase the layout area, with a compact layout. And by using the welding method to fix the first circuit board and the second circuit board, there is no need to use a connector to connect the first circuit board and the second circuit board, resulting in a smaller volume and reducing the space occupied by the circuit board assembly in the electronic device.

[0065] In some embodiments of the present application, the central light-transmitting area of the glass pressing head is a through-hole area; or, the central light-transmitting area of the glass pressing head is a groove area; the groove area is formed by the surface of the glass pressing head close to the workbench recessing away from the workbench.

[0066] The circuit board to be welded is a circuit board assembly including a first circuit board and a second circuit board;

[0067] The first circuit board has a central area and a first surrounding area arranged around the central area; the central area is provided with a first electronic component; the first surrounding area is provided with multiple first solder pads; the second circuit board has a central hollow area and a second surrounding area arranged around the central hollow area; the central hollow area is correspondingly arranged with the central area, and the second surrounding area is provided with multiple second solder pads; the first solder pads and the second solder pads are in one-to-one correspondence in position.

[0068] During welding, the first circuit board and the second circuit board are stacked on the workbench, with the first circuit board located between the second circuit board and the workbench; the glass pressing head is located on the side of the second circuit board away from the first circuit board; the central light-transmitting area of the glass pressing head corresponds to the position of the first electronic component; the surrounding light-transmitting area of the glass pressing head presses on a plurality of second solder pads of the second circuit board, so that the first circuit board and the second circuit board are in close contact.

[0069] As can be seen from the above, the welding device according to the embodiment of the present application can simultaneously realize the welding of the first circuit board and the second circuit board, as well as the first electronic component and the first circuit board, with high welding efficiency. Moreover, for the welded circuit board assembly, a plurality of first solder pads and a plurality of second solder pads are distributed around the first electronic component, and the layout is compact.

[0070] In some embodiments of the present application, the circuit board to be welded is a circuit board assembly including a first circuit board;

[0071] The first circuit board has a central area and a first surrounding area arranged around the central area; the central area is provided with a third solder pad and a first electronic component; a plurality of first solder pads are arranged in the first surrounding area; the first electronic component is electrically connected to the first solder pad through the third solder pad;

[0072] The central light-transmitting area of the glass pressing head is a groove area provided with a refraction part inside; the groove area is formed by the surface of the glass pressing head close to the workbench recessing away from the workbench;

[0073] The refraction part is annular and is arranged at the junction of the bottom wall and the side wall of the groove area; the refraction part has three surfaces, two of which are respectively in contact with the bottom wall and the side wall of the groove area, and the remaining one surface is an inclined surface facing the third solder pad; the cross-section of the refraction part in its width direction is triangular;

[0074] During welding, the first circuit board is placed on the workbench; the central light-transmitting area of the glass pressing head corresponds to the position of the first electronic component; the surrounding light-transmitting area of the glass pressing head presses on a plurality of first solder pads of the first circuit board; at least part of the laser emitted by the laser emitter is refracted by the refraction part towards the central area.

[0075] As can be seen from the above, the welding device according to the embodiment of the present application can realize the separate welding of the first electronic component and the first circuit board. The laser emitted by the laser device can be scanned by the galvanometer and then directed to the glass pressing head. Under the action of the refraction part, it is directed to the third pad, so that the laser is concentrated on the central light-transmitting area of the glass pressing head, making the welding device more suitable for welding the first electronic component and the first circuit board located in the central area. The laser is more concentrated, which is beneficial to improving the production efficiency. Moreover, for the welded circuit board assembly, multiple first pads are distributed around the first electronic component, and the layout is compact.

[0076] In some embodiments of the present application, a self-focusing lens is further provided in the groove area of the glass pressing head;

[0077] The planar side of the self-focusing lens is in contact with the bottom wall of the groove area, and the convex side faces the central area; the self-focusing lens is surrounded by the annular refraction part; the self-focusing lens is used to converge the laser passing through it into a beam of laser during welding and emit it from its convex side to the central area.

[0078] As can be seen from the above, the welding device according to the embodiment of the present application can realize the separate welding of the first electronic component and the first circuit board. The laser emitted by the laser device can be scanned by the galvanometer and then directed to the glass pressing head. Under the action of the refraction part, it is directed to the third pad. Under the action of a single self-focusing lens, multiple beams of laser are converged into a beam of laser, so that the laser is concentrated on the central light-transmitting area of the glass pressing head, making the welding device more suitable for welding the first electronic component and the first circuit board located in the central area. The laser is more concentrated, further improving the production efficiency. Moreover, for the welded circuit board assembly, multiple first pads are distributed around the first electronic component, and the layout is compact.

[0079] In some embodiments of the present application, the circuit board to be welded is a circuit board assembly including a first circuit board and a second circuit board;

[0080] The first circuit board has a central area and a first peripheral area surrounding the central area; multiple first pads are arranged in the first peripheral area; the second circuit board has a central hollow area and a second peripheral area surrounding the central hollow area; the central hollow area corresponds to the central area, and multiple second pads are arranged in the second peripheral area; the first pads and the second pads are in one-to-one correspondence in position;

[0081] The central light-transmitting area of the glass pressing head is a groove area internally provided with a first reflector; the groove area is recessed from the surface of the glass pressing head close to the workbench in a direction away from the workbench; the first reflector is arranged at the junction of the bottom wall and the side wall of the groove area and is inclined;

[0082] A second reflector is provided on the outer wall of the light-transmitting area around the glass pressing head; the reflecting surfaces of the second reflector and the first reflector are arranged opposite to each other in a one-to-one correspondence; the first reflector and the second reflector are used to reflect at least part of the laser emitted by the laser emitter towards the first surrounding area and the second surrounding area during welding;

[0083] During welding, the first circuit board and the second circuit board are stacked on the workbench, with the first circuit board located between the second circuit board and the workbench; the glass pressing head is located on the side of the second circuit board away from the first circuit board; the central light-transmitting area of the glass pressing head corresponds to the central area; the light-transmitting area around the glass pressing head presses on multiple second pads of the second circuit board, causing the first circuit board and the second circuit board to be in close contact.

[0084] As can be seen from the above, the welding device according to the embodiments of the present application can achieve separate welding of the first pads and the second pads. The laser emitted by the laser can be scanned by the galvanometer and shot towards the glass pressing head, and under the action of the first reflector and the second reflector, it is shot towards the first pads and the second pads, thereby concentrating the laser on the light-transmitting area around the glass pressing head, making the welding device more suitable for welding the first pads located in the first surrounding area and the second pads located in the second surrounding area, with the laser being more concentrated, further improving production efficiency; and for the welded circuit board assembly, multiple first pads are distributed around the first electronic component, with a compact layout.

[0085] In some embodiments of the present application, the device body includes: a gripper and a cylinder;

[0086] The cylinder is suspended above the workbench;

[0087] The galvanometer is arranged at the light incident end of the cylinder;

[0088] The gripper is arranged at the light output end of the cylinder for gripping the glass pressing head.

[0089] As can be seen from the above, the device body and the glass pressing head are fixed by using the gripper to grip the glass pressing head, with a simple structure and reliable connection.

[0090] In some embodiments of the present application, the glass pressing head includes: a pressing head main body and a connecting structure;

[0091] The connecting structure is formed on the outer wall of the glass pressing head; the shape of the connecting structure is adapted to the shape of the gripper.

[0092] As can be seen from the above, the connecting structure is formed on the outer wall of the glass pressing head, which is conducive to its cooperation with the gripper.

[0093] In some embodiments of the present application, the number of the connection structures is two, which are respectively arranged on two opposite outer walls of the indenter body;

[0094] The connection structure has a first inclined surface; in the first direction, the cross-section of the connection structure is triangular;

[0095] The gripper has two oppositely arranged jaws, and each jaw is provided with a second inclined surface adapted to the first inclined surface;

[0096] When the glass indenter is clamped by the gripper, the two jaws are respectively located on both sides of the glass indenter; the first inclined surface and the second inclined surface are in contact, the first inclined surface is arranged in a direction away from the cylinder body, and the second inclined surface is arranged towards the cylinder body.

[0097] As can be seen from the above, since the connection structure of the glass indenter and the jaws of the gripper are matched through inclined surfaces, the gripper can be adapted to glass indenters of more sizes to process circuit board assemblies of different sizes, and the versatility of the equipment is better.

[0098] In some embodiments of the present application, the number of the connection structures is two, which are respectively arranged on two opposite outer walls of the indenter body;

[0099] On one side of each connection structure away from the indenter body, a first arc surface is formed;

[0100] The gripper has two oppositely arranged jaws, and each jaw is provided with a second arc surface adapted to the first arc surface;

[0101] When the glass indenter is clamped by the gripper, the two jaws are respectively located on both sides of the glass indenter; the first arc surface and the second arc surface are in contact.

[0102] As can be seen from the above, since the connection structure of the glass indenter and the jaws of the gripper are matched through arc surfaces, the matching accuracy between the gripper and the glass indenter is higher.

[0103] An embodiment of the present application provides a welding method, which uses the welding equipment of the above embodiment, and the circuit board to be welded is a circuit board assembly including a first circuit board and a second circuit board;

[0104] The first circuit board has a central region and a first peripheral region disposed around the central region; a first electronic component is disposed in the central region; a plurality of first pads are disposed in the first peripheral region; the second circuit board has a central hollow region, a second peripheral region surrounding the central hollow region, and an interface region disposed at the edge of the second peripheral region; the central hollow region is correspondingly disposed with the central region for avoiding the first electronic component disposed in the central region; the interface region is used for disposing interface devices; a plurality of second pads are disposed in the second peripheral region;

[0105] The soldering method includes:

[0106] Place the first circuit board on the workbench;

[0107] Place the first electronic component in the central region of the first circuit board;

[0108] Place the second circuit board and the first circuit board in alignment such that the plurality of first pads and the plurality of second pads are correspondingly disposed one by one;

[0109] Press the peripheral light-transmitting region of the glass collet on the plurality of second pads on the second circuit board such that the first pads and the second pads are in close contact; the central light-transmitting region of the glass collet corresponds to the position of the first electronic component;

[0110] Solder the first pads and the second pads, as well as the first electronic component and the first circuit board.

[0111] As can be seen from the above, for the circuit board assembly prepared by the soldering method of the embodiments of the present application, a plurality of first pads and a plurality of second pads are distributed around the first electronic component. Compared with the related art where the pads are arranged on one side or both sides of the circuit board, the circuit board assembly of the embodiments of the present application makes full use of the space between the plurality of first pads and the space between the plurality of second pads, realizes an increase in the layout area, has a compact layout, improves the layout density, and uses a soldering method to fix the first circuit board and the second circuit board, without using a connector to connect the first circuit board and the second circuit board, so that the volume is smaller, reducing the space occupied by the circuit board assembly in the electronic device; and through one soldering, the soldering of the first circuit board and the second circuit board, as well as the first electronic component and the first circuit board can be realized, thereby achieving efficient soldering; at the same time, the number of times the device is heated is reduced, the thickness of the IMC is reduced, and the reliability between the pads is improved. Description of the Drawings

[0112] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other embodiments can be obtained based on these drawings.

[0113] Figure 1 Structural schematic diagram of the electronic device according to the first embodiment of the present application;

[0114] Figure 2 For Figure 1 Exploded structural schematic diagram;

[0115] Figure 3 For Figure 1 Structural schematic diagram with the first rear shell omitted;

[0116] Figure 4 For Figure 3 N-N cross-sectional view of

[0117] Figure 5 For Figure 4 Partial enlarged schematic diagram at P of

[0118] Figure 6 Structural schematic diagram of the electronic device according to the second embodiment of the present application;

[0119] Figure 7 Structural schematic diagram of the electronic device according to the third embodiment of the present application (flattened state);

[0120] Figure 8 Structural schematic diagram of the electronic device according to the third embodiment of the present application (folded state);

[0121] Figure 9 For Figure 7 Structural schematic diagram with the first rear shell, the second rear shell, and the second display screen omitted;

[0122] Figure 10 Structural schematic diagram of the electronic device according to the fourth embodiment of the present application;

[0123] Figure 11 Structural schematic diagram of the electronic device according to the fifth embodiment of the present application;

[0124] Figure 12 Structural schematic diagram of the circuit board assembly according to the first embodiment of the present application;

[0125] Figure 13 For Figure 12 M-M cross-sectional view of

[0126] Figure 14Schematic diagram of the first circuit board in the circuit board assembly according to the first embodiment of the present application;

[0127] Figure 15 Connection relationship diagram of the first circuit board and the first electronic component in the circuit board assembly according to the first embodiment of the present application;

[0128] Figure 16 Schematic diagram of the second circuit board in the circuit board assembly according to the first embodiment of the present application;

[0129] Figure 17 Connection relationship diagram of the first circuit board and the first electronic component in the circuit board assembly according to the second embodiment of the present application;

[0130] Figure 18 Schematic diagram of the second circuit board in the circuit board assembly according to the third embodiment of the present application;

[0131] Figure 19 Cross-sectional view of the circuit board assembly according to the third embodiment of the present application;

[0132] Figure 20 Connection relationship diagram of the first circuit board and the first electronic component in the circuit board assembly according to the fourth embodiment of the present application;

[0133] Figure 21 Schematic diagram of the second circuit board in the circuit board assembly according to the fourth embodiment of the present application;

[0134] Figure 22 Cross-sectional view of the circuit board assembly according to the fourth embodiment of the present application;

[0135] Figure 23 Connection relationship diagram of the first circuit board and the first electronic component in the circuit board assembly according to the fifth embodiment of the present application;

[0136] Figure 24 Schematic diagram of the second circuit board in the circuit board assembly according to the fifth embodiment of the present application;

[0137] Figure 25 Cross-sectional view of the circuit board assembly according to the fifth embodiment of the present application;

[0138] Figure 26a Schematic diagram of the second circuit board in the circuit board assembly according to the sixth embodiment of the present application;

[0139] Figure 26b For Figure 26a Size schematic diagram of the second solder pad in;

[0140] Figure 27a Cross-sectional view of the circuit board assembly according to the seventh embodiment of the present application;

[0141] Figure 27b Cross-sectional view of the circuit board assembly according to the eighth embodiment of the present application;

[0142] Figure 28 Schematic structural diagram of the soldering device according to the first embodiment of the present application;

[0143] Figure 29 Connection relationship diagram of the soldering device and the circuit board assembly according to the first embodiment of the present application;

[0144] Figure 30 is Figure 29 partial view of;

[0145] Figure 31 Top view of the glass chuck in the soldering device according to the first embodiment of the present application;

[0146] Figure 32 Front view of the glass chuck in the soldering device according to the first embodiment of the present application;

[0147] Figure 33 Schematic structural diagram of the soldering device according to the second embodiment of the present application;

[0148] Figure 34 Connection relationship diagram of the glass chuck and the circuit board assembly in the second embodiment of the present application;

[0149] Figure 35 Top view of the glass chuck in the soldering device according to the second embodiment of the present application;

[0150] Figure 36 Connection relationship diagram of the soldering device and the circuit board assembly according to the third embodiment of the present application;

[0151] Figure 37 Top view of the glass chuck in the soldering device according to the third embodiment of the present application;

[0152] Figure 38 Front view of the glass chuck in the soldering device according to the third embodiment of the present application;

[0153] Figure 39 Connection relationship diagram of the soldering device and the circuit board assembly according to the fourth embodiment of the present application;

[0154] Figure 40 Top view of the glass chuck in the soldering device according to the fourth embodiment of the present application;

[0155] Figure 41 Front view of the glass chuck in the soldering device according to the fourth embodiment of the present application;

[0156] Figure 42Schematic diagram of light propagation of the self-focusing lens in the fourth embodiment of the present application;

[0157] Figure 43 Refractive index distribution curve of the self-focusing lens in the fourth embodiment of the present application;

[0158] Figure 44a Connection relationship diagram of the welding equipment and the circuit board assembly in the fifth embodiment of the present application;

[0159] Figure 44b Front view of the glass pressing head in the welding equipment of the fifth embodiment of the present application;

[0160] Figure 45 Connection relationship diagram of the welding equipment and the circuit board assembly in the sixth embodiment of the present application;

[0161] Figure 46 Method flowchart of the welding method in the embodiment of the present application;

[0162] Figure 47 Process flowchart of the welding method in the embodiment of the present application.

[0163] Description of reference numerals:

[0164] Circuit board assembly 100; First circuit board 110; First pad 111; Third pad 112; Central region A1; First peripheral region A2; Second circuit board 120; Second pad 121; Through-hole 1211; Four-corner pads 1212; Upper and lower row pads 1213; Left and right row pads 1214; Non-outer ring pads 1215; Central hollow region B1; Second peripheral region B2; Interface region B3; Reference marking point 101; Trace 102; Ground wire 103; Protruding structure 104; Depressed structure 105; First electronic component 130; BGA device 131; Bottom pins 1311; QFN device 132; System-on-chip 133; Flash memory 134; Interface device 140; First device body 10; First main board 11; First middle frame 12; First rear case 13; Sub-board 14; First battery 15; Second electronic component 16; Third electronic component 17; First shielding cover 18; Second shielding cover 19; First heat sink 21; Second heat sink 22; Camera module 23; Decorative piece 24; Fourth electronic component 25; USB interface 251; SIM card 252; First connector 26; Second connector 27; BTB connector 28; Male head 281; Female head 282; Solder balls 29; First through-hole H1; Second through-hole H2; Third through-hole H3; Camera mounting area H4; First display screen 30; Second display screen 40; Second device body 50; Second main board 51; Second middle frame 52; Second battery 54; Front camera 55; Third connector 56; Fourth connector 57; Rotating shaft mechanism 60; Shaft-passing connector 71; Electronic device body 80; First accommodation space G1; Second accommodation space G2; Third accommodation space G3; Galvo 930; Device body 920; Gripper 921; Claw 9211; Second inclined surface 9212; Second arc surface 9213; Cylinder 922; Glass press head 940; Press head body 9401; Connection structure 9402; First inclined surface 9403; First arc surface 9406; Central light-transmitting region D1; Peripheral light-transmitting region D2; Through-hole region 941; Groove region 942; Refraction part 943; Auto-focus lens 944; First lens 9441; Second lens 9442; Third lens 9443; Fourth lens 9444; First reflector 945; Second reflector 946; Workbench 950; Hollow structure 951. Detailed implementation manners

[0165] For a better understanding of the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0166] For the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish identical or similar items with basically the same functions and roles. For example, the first swing arm and the second swing arm are used to distinguish different swing arms, and the order between them is not limited. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and position, and "first", "second", etc. do not necessarily mean different.

[0167] It should be noted that in the present application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplarily" or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplarily" or "for example" is intended to present relevant concepts in a specific manner.

[0168] An electronic device is generally composed of multiple components. Some of these components are structural components composed of mechanical parts, and some are circuit board components composed of electronic components. With the development of electronic devices, the functions that electronic devices need to achieve are increasing. Correspondingly, the number of electronic components arranged inside the electronic device is also increasing; accordingly, the occupied space of the circuit board component in the electronic device is also getting larger and larger.

[0169] In related art electronic devices, a method of stacking multiple circuit boards is adopted to centrally arrange more electronic components to make full use of the internal space of the electronic device; usually, a BTB connector is used to connect different circuit boards, or an FOB laser welding technology is used to connect different circuit boards; the BTB connector occupies too much space; the solder pads in the FOB laser welding technology are centrally arranged on one side or both sides of the circuit board, that is, the solder pads are arranged at 180°. If the 180° welding is performed multiple times, it is necessary to avoid the solder joints, which increases the equipment cost, has a low space density, an unreasonable layout, and occupies a large space. Therefore, it is necessary to optimize the structure of the circuit board component to reduce the space occupied by the circuit board component in the electronic device.

[0170] To solve the above technical problems, the embodiments of the present application provide a circuit board component, an electronic device, a welding device and a welding method to reduce the space occupied by the circuit board component in the electronic device.

[0171] The electronic device provided by the embodiments of the present application may be a foldable mobile terminal product with a flexible screen such as a mobile phone, a tablet computer, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc. The embodiments of the present application do not limit the specific type of the electronic device.

[0172] As Figures 1 to 4 shown, taking the electronic device as a straight-bar mobile phone as an example, Figure 1 is a schematic structural diagram of the electronic device according to the first embodiment of the present application, Figure 2 is Figure 1 exploded structural diagram of Figure 3 is Figure 1 schematic structural diagram with the first rear shell 13 omitted, Figure 4 is Figure 3 N-N cross-sectional view of . The electronic device includes a first device body 10 and a first display screen 30. The first device body 10 includes a circuit board assembly 100, a first main board 11, a first middle frame 12, a first rear shell 13, a secondary board 14, and a first battery 15. The first middle frame 12 and the first rear shell 13 are fixedly connected to form a first accommodation space G1. The circuit board assembly 100, the first main board 11, the secondary board 14, and the first battery 15 are arranged in the first accommodation space G1. Among them, the circuit board assembly 100 is mounted on one side of the first main board 11 facing the first rear shell 13. And the circuit board assembly 100 is electrically connected to the first main board 11 through an interface device 140. The first main board 11 is also electrically connected to the first display screen 30, the first battery 15, and the secondary board 14 respectively. The first display screen 30 is arranged on one side of the first middle frame 12 away from the first rear shell 13 and is fixedly connected to the first middle frame 12.

[0173] A plurality of electronic components are provided on the first main board 11 and the secondary board 14. The electronic components include but are not limited to a processor, an antenna module, a Bluetooth module, a WiFi module, a GPS module, a power supply, and a charging module or a screen display and operation module. For example, the first display screen 30 and its components need to be electrically connected to the screen display and operation module on the first main board 11 so that the first display screen 30 can implement display or operation functions, and the circuit board assembly 100 can correspond to the screen display and operation module.

[0174] Specifically, as Figure 3As shown, a plurality of fourth electronic components 25 provided on the auxiliary board 14 may include a USB interface 251, a SIM card 252, etc. The USB interface 251 may adopt a type-A interface, a type-B interface, or a type-C interface according to the usage requirements, and the present application does not limit this.

[0175] In the first embodiment of the present application, as Figure 3 shown, the first main board 11 and the first battery 15 may be connected through a first connecting member 26 and a BTB connector 28, and the first main board 11 and the auxiliary board 14 may be connected through a second connecting member 27 and a BTB connector 28; the first connecting member 26 and the second connecting member 27 may be flexible printed circuits (FPCs), and the flexible printed circuits are plugged into the BTB connector 28; further, the first connecting member 26 may be a battery FPC, and the second connecting member 27 may be a charging FPC.

[0176] In the first embodiment of the present application, as Figures 2 to 4 shown, the electronic device further includes a camera module 23 (CAM) and a decorative piece 24 (DECO); a first through hole H1 is provided on the surface of the first rear case 13 away from the first middle frame 12; the decorative piece 24 covers the first through hole H1 and is located on the side of the first rear case 13 away from the first middle frame 12; a hollowed-out camera installation area H4 is provided on the first main board 11, and the camera module 23 is disposed in the camera installation area H4; the orthographic projection of the decorative piece 24 on the first main board 11 covers the orthographic projection of the camera module 23 on the first main board 11.

[0177] The camera module 23 may be installed on the first middle frame 12, at least part of the camera module 23 protrudes from the first rear case 13 through the first through hole H1, the decorative piece 24 covers the first through hole H1, and the camera module 23 is located between the decorative piece 24 and the first middle frame 12. In this way, the thickness at the DECO of the mobile phone is greater than that of other areas, making full use of the space at the DECO of the mobile phone, and at the same time facilitating the reduction of the thickness of other areas of the electronic device.

[0178] In the first embodiment of the present application, as shown in 4, a second electronic component 16 is provided on the first surface of the first main board 11, and a third electronic component 17 is provided on the second surface; a first shielding cover 18 is further provided between the first main board 11 and the first middle frame 12, and the first shielding cover 18 and the first main board 11 together form a second accommodation space G2; the second electronic component 16 is accommodated in the second accommodation space G2; a second shielding cover 19 is further provided between the first main board 11 and the circuit board assembly 100, and the second shielding cover 19 and the first main board 11 together form a sealed third accommodation space G3; the third electronic component 17 is accommodated in the third accommodation space G3; the circuit board assembly 100 is mounted on the second shielding cover 19.

[0179] Specifically, the second electronic component 16 can adopt a system-on-chip, as well as a memory chip or other electronic components connected to the system-on-chip. In this way, multiple electronic components with electrical connection relationships can be stacked to save space and facilitate the miniaturization design of electronic devices. The multiple second electronic components 16 can be connected through solder balls 29, and the second electronic component 16 can be electrically connected to the first main board 11 through the solder balls 29.

[0180] The shielding case can shield the influence of external electromagnetic waves on the internal circuit and the radiation of electromagnetic waves generated inside to the outside. By providing the first shielding case 18 and the second shielding case 19, electromagnetic shielding can be achieved between the second electronic component 16 and the third electronic component 17 and other electronic components in the first main board 11 or electronic components in other circuit boards. At the same time, the wear of the second electronic component 16 and the third electronic component 17 during installation or use can be reduced.

[0181] In the first embodiment of the present application, as shown in FIG. 4, at a position on the first middle frame 12 corresponding to the second electronic component 16, a second through hole H2 is provided. At a position on the first shielding case 18 corresponding to the second through hole H2, a third through hole H3 is provided. A first heat dissipation member 21 is disposed in the second through hole H2 and the third through hole H3, and the first heat dissipation member 21 is in contact with the second electronic component 16. A second heat dissipation member 22 is disposed on a side of the first middle frame 12 away from the first main board 11, and the second heat dissipation member 22 is in contact with the first heat dissipation member 21.

[0182] The heat dissipated by the second electronic component 16 can be dissipated through the first heat dissipation member 21 and the second heat dissipation member 22. The first display screen 30 can be in contact with the second heat dissipation member 22, and the heat is transferred to the second heat dissipation member 22 by contact. The first heat dissipation member 21 and the second heat dissipation member 22 dissipate heat from the second electronic component 16 and the first display screen 30 at the same time, which is beneficial to improving the heat dissipation efficiency.

[0183] Specifically, the first heat dissipation member 21 can be made of TIM (Thermal interface material), and the second heat dissipation member 22 can be a VC (Vapor Chambers).

[0184] In the first embodiment of the present application, as Figure 4 and Figure 5 shown, Figure 5 is Figure 4Partial enlarged schematic diagram at P. The circuit board assembly 100 can be electrically connected to the first circuit board 110 through the interface device 140. Specifically, the interface device 140 can be a BTB connector 28. The BTB connector 28 on the circuit board assembly 100 has a male head 281, and the BTB connector 28 on the first main board 11 has a female head 282, and the two are plugged and fixed.

[0185] In the second embodiment of the present application, as Figure 6 shown, Figure 6 is a schematic structural diagram of the electronic device according to the second embodiment of the present application. The difference between the electronic device according to the second embodiment of the present application and the electronic device according to the first embodiment of the present application is that the arrangement manner of the first electronic component 130 is different. The first electronic component 130 can also be a system on chip (SOC) 133 and a universal flash storage (UFS) 134.

[0186] In the third embodiment of the present application, taking the electronic device as a folding machine as an example, as shown in FIGS. 7 to Figure 9 shown, Figure 7 is a schematic structural diagram (flattened state) of the electronic device according to the third embodiment of the present application, Figure 8 is a schematic structural diagram (folded state) of the electronic device according to the third embodiment of the present application, Figure 9 is Figure 7 Schematic structural diagram after omitting the first rear shell 13, the second rear shell, and the second display screen 40. The electronic device includes the first display screen 30 and the first device body 10 in the first embodiment of the present application, and further includes a second display screen 40, a second device body 50, and a rotating shaft mechanism 60; the second device body 50 includes a second main board 51, a second middle frame 52, a second rear shell (not shown in the figure), and a second battery 54; the second middle frame 52 and the second rear shell are fixedly connected to form a fourth accommodation space (not shown in the figure); the second main board 51 and the second battery 54 are arranged in the fourth accommodation space; the rotating shaft mechanism 60 is located between the first middle frame 12 and the second middle frame 52 and is rotatably connected to the two respectively, so that the second device body 50 and the first device body 10 can be folded relative to the rotating shaft mechanism 60; the second display screen 40 is a folding display screen and covers the first middle frame 12, the rotating shaft mechanism 60, and the second middle frame 52; the first display screen 30 is located on the side of the first middle frame 12 that does not cover the second display screen 40; the first main board 11 and the second main board 51 are electrically connected through a shaft-passing connecting member 71, and the shaft-passing connecting member 71 enters the fourth accommodation space from the first accommodation space G1 through the rotating shaft mechanism 60.

[0187] The rotation shaft mechanism 60 is used to relatively rotate the first middle frame 12 and the second middle frame 52, so as to realize the folding and flattening of the electronic device. The structures of the first middle frame 12 and the second middle frame 52 may be the same or not completely the same. The specific structures of the first middle frame 12 and the second middle frame 52 may be determined according to the specific product and are not specifically limited in this article.

[0188] The second display screen 40 may be a flexible screen, including two fixing parts (not shown in the figure) and a bending part (not shown in the figure). The two fixing parts can be combined and fixed with the first middle frame 12 and the second middle frame 52. The bending part is arranged opposite to the main shaft body of the rotation shaft mechanism 60, and the two are not fixed to meet the requirement of the bending part for bending deformation during folding. When the electronic device is in the folded state, the bending part can be bent in an arc shape. In this way, the R angle of the in-folded screen is large enough and will not bear a large degree of bending. At the same time, the two side fixing parts can fit well without leaving gaps, and at the same time minimize the bending marks.

[0189] The second display screen 40 includes a display module (not shown in the figure) and a transparent cover plate (not shown in the figure). The display module can display images, videos, etc. The display module can adopt a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active matrix organic light-emitting diode or an active matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a Miniled, a MicroLed, a Micro-oLed, a quantum dot light-emitting diode (QLED), etc. The transparent cover plate covers the outside of the display module to protect the display module. The transparent cover plate can be a glass cover plate, and of course it can also be other transparent materials that can play a protective function. The second display screen 40 can also have the function of touch control, that is, the second display screen 40 can be a touch screen.

[0190] In the third embodiment of the present application, the first middle frame 12 and the second middle frame 52 can rotate towards each other or away from each other under the drive of the rotation shaft mechanism 60, so that the electronic device presents a folded state or a flattened state. Specifically, as Figure 7 and Figure 8As shown, when the rotating shaft mechanism 60 is in the flattened state, the first middle frame 12 and the second middle frame 52 on both sides of the rotating shaft mechanism 60 are also in the flattened state, making the electronic device in the flattened state; when the rotating shaft mechanism 60 is in the folded state, the first middle frame 12 and the second middle frame 52 on both sides of the rotating shaft mechanism 60 are also in the folded state, that is, the first middle frame 12 and the second middle frame 52 on both sides of the rotating shaft mechanism 60 overlap, making the electronic device in the folded state; when the rotating shaft mechanism 60 is in the intermediate state, the first middle frame 12 and the second middle frame 52 on both sides of the rotating shaft mechanism 60 form a certain included angle, making the electronic device in the intermediate state.

[0191] In the third embodiment of the present application, as Figure 9 shown, the second device body 50 may further include a front camera 55. The front camera 55 is connected to the second circuit board 120 through a third connector 56 and a BTB connector 28. The second main board 51 and the second battery 54 are connected through a fourth connector 57 and a BTB connector 28. The shaft-passing connector 71, the third connector 56, and the fourth connector 57 may be flexible circuit boards, and the flexible circuit boards are plugged into the BTB connector 28; the fourth connector 57 may be a battery FPC.

[0192] As Figure 10 shown, Figure 10 is a schematic structural diagram of an electronic device according to the fourth embodiment of the present application. The electronic device may also include three electronic device bodies 80 and two rotating shaft mechanisms 60. The middle frames (not shown in the figure) of two adjacent electronic device bodies 80 are connected through a rotating shaft mechanism 60. The decorative member 24 is disposed on the electronic device body 80 located on the left side from the perspective as Figure 10 shown.

[0193] As Figure 11 shown, Figure 11 is a schematic structural diagram of an electronic device according to the fifth embodiment of the present application. The difference between the electronic device according to the fifth embodiment of the present application and the electronic device according to the fourth embodiment of the present application is that the installation position of the decorative member 24 is different. In the fourth embodiment of the present application, the decorative member 24 is disposed on the electronic device body 80 located on the left side, and in the fifth embodiment of the present application, the decorative member 24 is disposed on the electronic device body 80 located on the right side. The position of the decorative member 24 can be set according to the actual situation; the shape of the decorative member 24 after bulging can be circular or rectangular, and the present application does not make any limitation thereto.

[0194] The present application provides a circuit board assembly 100, which is applied to an electronic device. As Figures 12 to 16 shown, Figure 12 is a schematic structural diagram of the circuit board assembly 100 according to the first embodiment of the present application. Figure 13 is Figure 12 the M-M cross-sectional view ofFigure 14 Schematic diagram of the first circuit board 110 in the circuit board assembly 100 according to the first embodiment of the present application. Figure 15 Connection relationship diagram of the first circuit board 110 and the first electronic component 130 in the circuit board assembly 100 according to the first embodiment of the present application. Figure 16 Schematic diagram of the second circuit board 120 in the circuit board assembly 100 according to the first embodiment of the present application. The circuit board assembly 100 includes a first circuit board 110 and a second circuit board 120. Specifically, the first circuit board 110 has a central region A1 and a first peripheral region A2 surrounding the central region A1. The central region A1 is used to arrange electronic components or structural components. In the first embodiment of the present application, taking the electronic component as the first electronic component 130 as an example. The first peripheral region A2 is used to arrange a plurality of first pads 111, and the plurality of first pads 111 are used for electrical connection with electronic components and the second circuit board 120. The second circuit board 120 has a central hollow region B1, a second peripheral region B2 surrounding the central hollow region B1, and an interface region B3 provided at the edge of the second peripheral region B2. The central hollow region B1 is correspondingly arranged with the central region A1 and is used to avoid the electronic components or structural components arranged in the central region A1. The interface region B3 is used to arrange the interface device 140. The second peripheral region B2 is used to arrange a plurality of second pads 121, and the plurality of second pads 121 are used for electrical connection with the first circuit board 110 and the interface device 140. The plurality of first pads 111 and the plurality of second pads 121 are welded and fixed in one-to-one correspondence.

[0195] For the circuit board assembly 100 according to the embodiment of the present application, electronic components or structural components can be arranged in the central area A1 of the first circuit board 110, and a plurality of first pads 111 are arranged in the first surrounding area A2 surrounding the central area A1; the central hollowed-out area B1 of the second circuit board 120 is correspondingly arranged with the central area A1 of the first circuit board 110 to avoid electronic components or structural components during the assembly of the first circuit board 110 and the second circuit board 120; the second surrounding area B2 of the second circuit board 120 surrounds its central hollowed-out area B1 and is provided with a plurality of second pads 121; the first pads 111 and the second pads 121 are fixedly welded in one-to-one correspondence, and the electronic components are electrically connected to the first pads 111, thereby realizing the electrical connection between the electronic components and the second circuit board 120; the second circuit board 120 has an interface area B3 arranged at the edge of the second surrounding area B2, and an interface device 140 is arranged in the interface area B3, thereby realizing the connection between the second circuit board 120 and an external circuit. After the first circuit board 110 and the second circuit board 120 are fixedly welded, the plurality of first pads 111 and the plurality of second pads 121 are distributed around the electronic components or structural components. Compared with the related art where the pads are arranged on one side or both sides of the circuit board, the circuit board assembly 100 according to the embodiment of the present application makes full use of the space between the plurality of first pads 111 and the space between the plurality of second pads 121 to increase the layout area, make the layout compact, and use the welding method to fix the first circuit board 110 and the second circuit board 120, without using a connector to connect the first circuit board 110 and the second circuit board 120, with a smaller volume, reducing the space occupied by the circuit board assembly 100 in the electronic device.

[0196] It can be understood that when the number of the first electronic components 130 is multiple, the multiple first electronic components 130 can be connected to different first pads 111, and the first pads 111 and the second pads 121 are electrically connected in one-to-one correspondence, thereby realizing the electrical connection between the first electronic components 130 and the second circuit board 120; the second pads 121 are electrically connected to the interface device 140 on the second circuit board 120, and the interface device 140 on the second circuit board 120 is connected to the interface device 140 on other circuit boards, thereby realizing the electrical connection between the circuit board assembly 100 and other circuit boards.

[0197] In the embodiments of the present application, a plurality of first pads 111 are arranged in the first peripheral area A2, and a plurality of second pads 121 are arranged in the second peripheral area B2. Then, the angular range of the solder joint surrounding area of the first pad 111 or the second pad 121 can be 180°-360°; and electronic components, such as electronic elements and circuit boards, can be arranged in the surrounding area of the first pad 111 and the second pad 121. The electronic elements and the circuit boards can be welded and fixed to the first circuit board 110; structural components or AOI (Automated Optical Inspection) can also be arranged, such as: shrapnel, surface-mounted nuts, and shielding covers, etc., to implement functions such as antennas and save space.

[0198] In the first embodiment of the present application, as Figure 15 and Figure 16 shown, a plurality of first pads 111 and a plurality of second pads 121 are both arranged in a complete annular distribution; the plurality of first pads 111 and the plurality of second pads 121 are arranged in one-to-one correspondence. The first electronic element 130 can be arranged in the solder joint surrounding area of the first pads 111 and the second pads 121 arranged in an annular distribution. While saving space, it is beneficial to connect the first electronic element 130 to the trace 102 of the first pad 111; in a complete annular distribution, the angular range of the solder joint surrounding area of the first pad 111 or the second pad 121 can be 180°-360°. It can be understood that the annular distribution refers to circular annular distribution, triangular annular distribution, rectangular annular distribution, and irregular annular distribution, etc. The present application does not limit this.

[0199] In the first embodiment of the present application, as Figures 13 to 15 shown, at least one third pad 112 and at least one first electronic element 130 are provided in the central area A1 of the first circuit board 110; each first electronic element 130 is electrically connected to the first pad 111 electrically connected to it through the third pad 112. That is, the first electronic element 130 is welded and fixed to the third pad 112, and the third pad 112 and the first pad 111 are electrically connected through the trace 102. The first electronic element 130 is arranged in the central area A1 and is electrically connected to the first circuit board 110 through the third pad 112, saving space and having high connection reliability. Specifically, the first electronic element 130 can be a BGA (Ball Grid Array Package) device 131, a QFN (Quad Flat No-leads Package) device 132, a resistor, a capacitor, an inductor, etc. The shape of the third pad 112 needs to be adapted to the pad shape or pins of the first electronic element 130. For example, the BGA device 131 has a plurality of bottom pins 1311, and the plurality of bottom pins 1311 are connected to the corresponding plurality of third pads 112 in one-to-one correspondence.

[0200] In the first embodiment of the present application, as Figure 13 and Figure 14 shown, no solder penetration holes 1211 are provided on each first pad 111; one solder penetration hole 1211 is provided on each second pad 121. In some other embodiments of the present application, the number of solder penetration holes 1211 on the second pad 121 may also be two, or it may not be the case that one solder penetration hole 1211 is provided on each second pad 121, but rather one or two solder penetration holes 1211 are provided on at least some of the second pads 121. The present application does not limit this. As Figure 13 shown, the second pads 121 are disposed on both sides of the second circuit board 120. One side of the second pad 121 is in direct contact with the first pad 111, and the other side is located on the side of the second circuit board 120 away from the first circuit board 110. Such a design facilitates the subsequent FOB laser welding process; during welding, solder is prefabricated on the first pad 111, and laser heating is applied. Under the extrusion of the second circuit board 120, the solder rises from the side close to the first circuit board 110 to the side away from the first circuit board 110 along the solder penetration holes 1211 and emerges from the side of the second circuit board 120 away from the first circuit board 110. After the solder solidifies, the solder is connected to the first pad 111 and the second pad 121, connecting and fixing the first circuit board 110 and the second circuit board 120, thereby achieving electrical connection therebetween.

[0201] In the first embodiment of the present application, as Figure 15 and Figure 16 shown, fiducial mark points 101 (mark points) for welding positioning are provided on both the first circuit board 110 and the second circuit board 120; the fiducial mark points 101 on the first circuit board 110 are correspondingly arranged with the fiducial mark points 101 on the second circuit board 120. The fiducial mark points 101 are also called optical positioning points and are positioning points when the mounter is used. During production, the fiducial mark points 101 provide common measurable points for all steps in the assembly process. Therefore, each device used in the assembly can accurately position the circuit pattern to achieve accuracy. Specifically, the fiducial mark points 101 on the first circuit board 110 can be provided in the first surrounding area A2, and correspondingly, the fiducial mark points 101 on the second circuit board 120 can be provided in the second surrounding area B2.

[0202] In the first embodiment of the present application, as Figure 15 and Figure 16 shown, the shapes of the first pad 111 and the second pad 121 are circular, and circular pads are convenient for processing; in some other embodiments of the present application, the shapes of the first pad 111 and the second pad 121 may also be rectangular, etc., which can be set according to the actual situation. The present application does not limit this.

[0203] In the first embodiment of the present application, the first circuit board 110 may be a printed circuit board (PCB), and the second circuit board 120 may be a flexible circuit board.

[0204] In the first embodiment of the present application, as Figure 15 and Figure 16 shown, the first circuit board 110 is rectangular; the central hollowed-out area B1 and the second surrounding area B2 of the second circuit board 120 together form a rectangular area; the number of interface areas B3 is one, and it extends from one side of the rectangular area in a direction away from the central hollowed-out area B1. Such a setting facilitates processing and the alignment between the first circuit board 110 and the second circuit board 120. Specifically, the interface device 140 may be disposed on the side of the interface area B3 away from the central hollowed-out area B1.

[0205] As Figure 17 shown, Figure 17 is a connection relationship diagram of the first circuit board 110 and the first electronic component 130 in the circuit board assembly 100 of the second embodiment of the present application. The difference between the circuit board assembly 100 of the second embodiment of the present application and the circuit board assembly 100 of the first embodiment of the present application is that the arrangement manners of the plurality of first electronic components 130 are different, and they can be set according to actual situations, and the present application does not make any limitations thereto.

[0206] As Figure 18 and Figure 19 shown, Figure 18 is a schematic structural diagram of the second circuit board 120 in the circuit board assembly 100 of the third embodiment of the present application, Figure 19 is a cross-sectional view of the circuit board assembly 100 of the third embodiment of the present application. The difference between the circuit board assembly 100 of the third embodiment of the present application and the circuit board assembly 100 of the first embodiment of the present application is that the number of interface areas B3 is different. The number of interface areas B3 of the second circuit board 120 in the first embodiment of the present application is one, and the number of interface areas B3 of the second circuit board 120 in the third embodiment of the present application is two.

[0207] In the third embodiment of the present application, as Figure 18 and Figure 19 shown, the central hollowed-out area B1 and the second surrounding area B2 of the second circuit board 120 together form a rectangular area; the number of interface areas B3 is two, and they are respectively disposed on opposite sides of the rectangular area. Each interface area B3 extends from the corresponding side of the rectangular area in a direction away from the central hollowed-out area B1. This enables the circuit board assembly 100 to be connected to more other circuit boards to achieve more functions. The number of interface areas B3 can be set according to actual situations, and the present application does not make any limitations thereto.

[0208] like Figures 20 to 22 As shown, Figure 20 1 is a connection diagram of the first circuit board 110 and the first electronic component 130 in the circuit board assembly 100 of the fourth embodiment of the present application. Figure 21 Schematic diagram of the structure of the second circuit board 120 in the circuit board assembly 100 of the fourth embodiment of the present application, Figure 22 This is a cross-sectional view of a circuit board assembly 100 of the fourth embodiment of the present application. The circuit board assembly 100 of the fourth embodiment of the present application is different from the circuit board assembly 100 of the first embodiment of the present application in that the arrangement of the first solder pad 111 and the second solder pad 121 is different. The multiple first solder pads 111 and the second solder pad 121 in the first embodiment of the present application are arranged in a complete ring, while the multiple first solder pads 111 and the second solder pads 121 in the fourth embodiment of the present application are distributed in a concave shape; the multiple first solder pads 111 and the multiple second solder pads 121 are arranged in a one-to-one correspondence to adapt to different application scenarios. If the multiple first solder pads 111 and the second solder pads 121 are distributed in a concave shape, the angle range of the solder joint enclosed area of ​​the first solder pad 111 or the second solder pad 121 can be 180°-300°.

[0209] like Figures 23 to 25 As shown, Figure 23 1 is a connection diagram of the first circuit board 110 and the first electronic component 130 in the circuit board assembly 100 of the fifth embodiment of the present application. Figure 24 1 is a schematic structural diagram of a second circuit board 120 in a circuit board assembly 100 according to a fifth embodiment of the present application. Figure 25 This is a cross-sectional view of the circuit board assembly 100 of the fifth embodiment of the present application. The circuit board assembly 100 of the fifth embodiment of the present application is different from the circuit board assembly 100 of the first embodiment of the present application in that the arrangement of the first pad 111 and the second pad 121 is different. The multiple first pads 111 and the second pads 121 in the first embodiment of the present application are arranged in a complete ring, and the multiple first pads 111 and the multiple second pads 121 in the fifth embodiment of the present application are distributed in a ring with a gap; the multiple first pads 111 and the multiple second pads 121 are arranged one by one to adapt to different application scenarios. The multiple first pads 111 and the second pads 121 are distributed in a ring with a gap, and the angle range of the solder joint enclosed area of ​​the first pad 111 or the second pad 121 can be 180°-330°. It can be understood that the ring distribution with a gap means that when the pad is distributed in a single circle, one or more pads are arbitrarily missing; when the pad is distributed in multiple circles, at least one circle lacks one or more pads, and the present application does not limit this.

[0210] like Figure 26a As shown, Figure 26aSchematic diagram of the second circuit board 120 in the circuit board assembly 100 according to the sixth embodiment of the present application. The circuit board assembly 100 according to the sixth embodiment of the present application is different from the circuit board assembly 100 according to the first embodiment of the present application in that the shapes of the first pad 111 and the second pad 121 are different. The shapes of the first pad 111 and the second pad 121 in the first embodiment of the present application are circular, and the shapes of the first pad 111 and the second pad 121 in the sixth embodiment of the present application are rectangular to adapt to different application scenarios.

[0211] As Figure 26a and Figure 26b shown, Figure 26b is Figure 26a the dimensional schematic diagram of the second pad 121 in. A plurality of second pads 121 may include outer ring pads and non-outer ring pads 1215. The outer ring pads further include upper and lower row pads 1213, left and right row pads 1214, and corner pads 1212. The design data of the second pad 121 is shown in Table 1. The second circuit board 120 designed according to the data in Table 1 has a compact and reasonable layout, which is beneficial to reducing the volume of the second circuit board 120, thereby reducing the volume of the circuit board assembly 100. A ground wire 103 may also be provided on the second circuit board 120.

[0212] The extension in Table 1 means that a certain distance can be further extended outward on the basis of the corresponding dimension. It can be understood that for the second pad 121 with one through-tin hole 1211, the center distance of the through-tin holes 1211 is the center distance between the through-tin holes 1211 of two adjacent second pads 121. For the second pad 121 with two through-tin holes 1211, the center distance of the through-tin holes 1211 also refers to the center distance between the two through-tin holes 1211 of the same second pad 121. The first pad 111 can be arranged in the same way as the second pad 121. Therefore, the pads in the following table refer to both the first pad 111 and the second pad 121.

[0213] Table 1

[0214]

[0215] Figure 27a Cross-sectional view of the circuit board assembly 100 according to the seventh embodiment of the present application. The circuit board assembly 100 according to the seventh embodiment of the present application is different from the circuit board assembly 100 according to the first embodiment of the present application in that the structure of the first circuit board 110 is different. The first circuit board 110 in the first embodiment of the present application is a flat plate, and the first circuit board 110 in the seventh embodiment of the present application has a recessed structure 105.

[0216] Figure 27bA cross-sectional view of the circuit board assembly 100 according to the eighth embodiment of the present application. The difference between the circuit board assembly 100 according to the eighth embodiment of the present application and the circuit board assembly 100 according to the first embodiment of the present application lies in the different structure of the first circuit board 110. The first circuit board 110 in the first embodiment of the present application is a flat plate, while the first circuit board 110 in the eighth embodiment of the present application has a convex structure 104.

[0217] By setting the first circuit board 110 in this way, the setting method is more flexible, which can enable the circuit board assembly 100 to be applied to more application scenarios. It can be understood that the second circuit board 120 can also have a convex structure 104 and / or a concave structure 105. The positions of the convex structure 104 and the concave structure 105 are set according to the actual situation, and the present application does not limit this.

[0218] The electronic device according to the embodiment of the present application includes the circuit board assembly 100 according to any one of the above embodiments. After the first circuit board 110 and the second circuit board 120 are welded and fixed, a plurality of first pads 111 and a plurality of second pads 121 are distributed around the electronic components or structural components. Compared with the related art where the pads are arranged on one side or both sides of the circuit board, the circuit board assembly 100 according to the embodiment of the present application makes full use of the space between the plurality of first pads 111 and the space between the plurality of second pads 121, realizes an increase in the layout area, has a compact layout, and uses a welding method to fix the first circuit board 110 and the second circuit board 120, without using a connector to connect the first circuit board 110 and the second circuit board 120, so the volume is smaller, reducing the space occupied by the circuit board assembly 100 in the electronic device, which is thus beneficial to the miniaturization design of the electronic device.

[0219] As Figures 28 to 30 shown, Figure 28 A structural schematic diagram of the welding device according to the first embodiment of the present application, Figure 29 A connection relationship diagram of the welding device and the circuit board assembly 100 according to the first embodiment of the present application, Figure 30 For Figure 29 a partial view of, the embodiment of the present application proposes a welding device. The welding device includes a laser (not shown in the figure), a device main body 920, a galvanometer 930, a glass chuck 940, and a workbench 950; the galvanometer 930 is arranged on the device main body 920 for scanning the laser emitted by the laser; the glass chuck 940 is installed on the device main body 920 and is suspended above the workbench 950 in a liftable manner for fixing the circuit board to be welded on the workbench 950 during welding, Figure 29In the illustrated embodiment, the circuit board to be welded is a circuit board assembly 100 including a first circuit board 110 and a second circuit board 120; the glass chuck 940 has a central light-transmitting area D1 and a peripheral light-transmitting area D2 disposed around the central light-transmitting area D1; the central light-transmitting area D1 is used to cooperate with the galvanometer 930 so that the laser emitted by the laser is directed to the central area of the circuit board to be welded. Figure 29 In the illustrated embodiment, the central area of the circuit board to be welded corresponds to the central area A1 of the first circuit board 110 and the central hollow area B1 of the second circuit board 120; the peripheral light-transmitting area D2 is used to press against the peripheral area of the circuit board to be welded. Figure 29 In the illustrated embodiment, the peripheral area of the circuit board to be welded corresponds to the first peripheral area A2 of the first circuit board 110 and the second peripheral area B2 of the second circuit board 120, and cooperates with the galvanometer 930 so that the laser emitted by the laser is directed to the peripheral area of the circuit board to be welded; wherein, the central area A1 of the circuit board to be welded is used to dispose electronic components or structural components. Figure 29 In the illustrated embodiment, the electronic component is a first electronic component 130, and pads are disposed in the peripheral area of the circuit board to be welded. Figure 29 In the illustrated embodiment, the pads correspond to the first pads 111 on the first circuit board 110 and the second pads 121 on the second circuit board 120.

[0220] The welding device according to the embodiment of the present application can realize the welding of two types of circuit boards, one with electronic components or structural components disposed in the central area of the circuit board to be welded and the other without electronic components or structural components, and has a diversified application scenario; and its central area can be provided with electronic components or structural components. Compared with the related art, where the pads are arranged on one side or both sides of the circuit board, the circuit board to be welded in the embodiment of the present application makes full use of the space between multiple pads, realizes an increase in the layout area, has a compact layout, and uses a welding method to fix the circuit board to be welded, without using a connector to connect the circuit board to be welded, resulting in a smaller volume and reducing the space occupied by the circuit board to be welded in the electronic device.

[0221] In the first embodiment of the present application, as Figure 31 and Figure 32 shown, Figure 31 is a top view of the glass chuck 940 in the welding device of the first embodiment of the present application. Figure 32 is a front view of the glass chuck 940 in the welding device of the first embodiment of the present application. The central light-transmitting area D1 of the glass chuck 940 is a through-hole area 941; as Figure 29 shown, the through-hole area 941 extends in a first direction, and the first direction is consistent with the stacking direction of the first circuit board 110 and the second circuit board 120. As Figure 29 and Figure 30As shown, the circuit board to be welded is a circuit board assembly 100 including a first circuit board 110 and a second circuit board 120; the first circuit board 110 has a central area A1 and a first peripheral area A2 disposed around the central area A1; a first electronic component 130 is disposed in the central area A1; a plurality of first pads 111 are disposed in the first peripheral area A2; the second circuit board 120 has a central hollow area B1 and a second peripheral area B2 surrounding the central hollow area B1; the central hollow area B1 is correspondingly disposed with the central area A1, and a plurality of second pads 121 are disposed in the second peripheral area B2; the positions of the first pads 111 and the second pads 121 correspond one by one; during welding, the first circuit board 110 and the second circuit board 120 are stacked on the workbench 950, and the first circuit board 110 is located between the second circuit board 120 and the workbench 950; the glass indenter 940 is located on the side of the second circuit board 120 away from the first circuit board 110; the central light-transmitting area D1 of the glass indenter 940 corresponds to the position of the first electronic component 130; the peripheral light-transmitting area D2 of the glass indenter 940 presses on a plurality of second pads 121 of the second circuit board 120, so that the first circuit board 110 and the second circuit board 120 are in close contact.

[0222] With such a setting, when the laser emitted by the laser device is scanned by the galvanometer 930, it can be directed to the central light-transmitting area D1 and the peripheral light-transmitting area D2 of the glass indenter 940. In this way, through one-time welding, the welding of the first electronic component 130 corresponding to the central light-transmitting area D1 and the first circuit board 110 can be achieved, and the welding of the first pads 111 and the second pads 121 corresponding to the peripheral light-transmitting area D2 can be achieved, which is beneficial to improving production efficiency, and the structure of the produced circuit board assembly 100 is compact and occupies a small space. Specifically, the laser emitted by the laser device can be a coaxial ultra-high-speed multi-sequence laser.

[0223] In the first embodiment of the present application, as Figure 29 shown, the device main body 920 includes a gripper 921 and a cylinder 922; the cylinder 922 is suspended above the workbench 950; the galvanometer 930 is disposed at the light incident end of the cylinder 922; the gripper 921 is disposed at the light exit end of the cylinder 922 for gripping the glass indenter 940. Specifically, the gripper 921 can be an adaptive glass gripper. The transmittance of the glass indenter 940 should be greater than 98% to achieve a better welding effect.

[0224] In the first embodiment of the present application, as Figure 31 and Figure 32 shown, the glass indenter 940 includes a indenter main body 9401 and a connection structure 9402; the connection structure 9402 is formed on the outer wall of the glass indenter 940; as Figure 29 shown, the shape of the connection structure 9402 is adapted to the shape of the gripper 921.

[0225] In the first embodiment of the present application, as Figure 31 and Figure 32 shown, the number of the connecting structures 9402 is two, which are respectively arranged on two opposite outer walls of the indenter main body 9401; the connecting structure 9402 has a first inclined surface 9403; as Figure 29 shown, in the first direction, the cross-section of the connecting structure 9402 is triangular; the gripper 921 has two oppositely arranged jaws 9211, and each jaw 9211 is provided with a second inclined surface 9212 adapted to the first inclined surface 9403; when the glass indenter 940 is clamped by the gripper 921, the two jaws 9211 are respectively located on both sides of the glass indenter 940; the first inclined surface 9403 and the second inclined surface 9212 are in contact with each other, the first inclined surface 9403 is arranged in a direction away from the cylinder body 922, and the second inclined surface 9212 is arranged towards the cylinder body 922.

[0226] Specifically, the two jaws 9211 of the gripper 921 are slidably connected to the cylinder body 922, and the two jaws 9211 can approach or separate from each other to clamp the glass indenter 940. Since the connecting structure 9402 of the glass indenter 940 and the jaws 9211 of the gripper 921 are matched by inclined surfaces, the gripper 921 can be adapted to glass indenters 940 of more sizes to process circuit board assemblies 100 of different sizes, and the universality of the equipment is better. The connecting structure 9402 can be an angled fixed buckle. Specifically, the connecting structure 9402 and the indenter main body 9401 can be made of the same material, both of which are glass and are integrally formed structures. Specifically, the design dimensions of the glass indenter 940 can refer to Table 2.

[0227] Table 2

[0228] Object Minimum / mm Maximum / mm <![CDATA[Minimum distance a1 from the first electronic component to the side wall of the glass indenter]]> 0.075 2 <![CDATA[Minimum width a2 of the side wall of the glass indenter]]> 5 100 <![CDATA[The distance a3 between the upper surface of the glass pressing head and the first electronic component]]> 0.075 2 <![CDATA[Total thickness of the glass indenter a4]]> 0.2 5 Clamping angle α 30° 60° <![CDATA[Thickness a5 of the connection structure]]> 0.3 8

[0229] As Figure 33 shown, Figure 33 is a schematic structural diagram of the welding equipment according to the second embodiment of the present application. The difference between the welding equipment according to the second embodiment of the present application and the welding equipment according to the first embodiment of the present application lies in the different central light-transmitting regions D1 of the glass indenter 940 and the structure of the connecting structure 9402.

[0230] In the second embodiment of the present application, as Figures 33 to 35 shown, Figure 34 is a connection relationship diagram of the glass indenter 940 and the circuit board assembly 100 according to the second embodiment of the present application, Figure 35The top view of the glass pressing head 940 in the welding device of the second embodiment of the present application. The central light-transmitting area D1 of the glass pressing head 940 is a groove area 942; the groove area 942 is formed by the surface of the glass pressing head 940 facing the workbench 950 being recessed away from the workbench 950. With such a setting, when the laser emitted by the laser device is scanned by the galvanometer 930, it can be directed to the central light-transmitting area D1 and the surrounding light-transmitting area D2 of the glass pressing head 940. In this way, through one-time welding, the welding of the first electronic component 130 and the first circuit board 110 corresponding to the central light-transmitting area D1 can be achieved, and the welding of the first pad 111 and the second pad 121 corresponding to the surrounding light-transmitting area D2 can be achieved, which is beneficial to improving production efficiency, and the structure of the produced circuit board assembly 100 is compact and occupies a small space.

[0231] In the second embodiment of the present application, as Figures 33 to 35 shown, the number of the connection structures 9402 is two, which are respectively arranged on two opposite outer walls of the pressing head main body 9401; on each connection structure 9402, a first arc surface 9406 is formed on the side away from the pressing head main body 9401; the gripper 921 has two oppositely arranged jaws 9211, and a second arc surface 9213 adapted to the first arc surface 9406 is provided on each jaw 9211; when the glass pressing head 940 is clamped by the gripper 921, the two jaws 9211 are respectively located on both sides of the glass pressing head 940; the first arc surface 9406 and the second arc surface 9213 are in contact with each other.

[0232] Since the connection structure 9402 of the glass pressing head 940 and the jaws 9211 of the gripper 921 are matched through arc surfaces, the matching accuracy between the gripper 921 and the glass pressing head 940 is higher; specifically, the design dimensions of the glass pressing head 940 can refer to Table 3.

[0233] Table 3

[0234] Object Minimum / mm Maximum / mm <![CDATA[Minimum distance b1 from the first electronic component to the side wall of the glass indenter]]> 0.075 2 <![CDATA[Minimum width b2 of the side wall of the glass indenter]]> 5 100 <![CDATA[The distance b3 between the bottom wall of the groove region and the first electronic component]]> 0.075 2 <![CDATA[Total thickness b4 of the glass indenter]]> 0.2 30 <![CDATA[The thinnest thickness b5 of the glass indenter]]> 0.05 30 <![CDATA[Thickness b6 of the connection structure]]> 0.3 8

[0235] As Figure 36 shown, Figure 36 is the connection relationship diagram of the welding device and the circuit board assembly 100 in the third embodiment of the present application. The difference between the welding device in the third embodiment of the present application and the welding device in the second embodiment of the present application is that the structure of the central light-transmitting area D1 of the glass pressing head 940 is different; the glass pressing head 940 in the third embodiment of the present application is provided with a refraction part 943 in the groove area 942 on the basis of the glass pressing head 940 in the second embodiment of the present application.

[0236] In the third embodiment of the present application, as Figures 36 to 38 shown, Figure 37Top view of the glass pressing head 940 in the welding device according to the third embodiment of the present application. Figure 38 Front view of the glass pressing head 940 in the welding device according to the third embodiment of the present application. The circuit board to be welded is the circuit board assembly 100 including the first circuit board 110; the first circuit board 110 has a central area A1 and a first peripheral area A2 arranged around the central area A1; the central area A1 is provided with a third pad 112 and a first electronic component 130; a plurality of first pads 111 are arranged in the first peripheral area A2; the first electronic component 130 is electrically connected to the first pads 111 through the third pad 112; the central light-transmitting area D1 of the glass pressing head 940 is a groove area 942 provided with a refraction part 943 inside; the groove area 942 is recessed from the side of the glass pressing head 940 facing the workbench 950 towards the side away from the workbench 950; the refraction part 943 is annular and is arranged at the junction of the bottom wall and the side wall of the groove area 942; the refraction part 943 has three faces, two of which are respectively in contact with the bottom wall and the side wall of the groove area 942, and the remaining one face is an inclined surface facing the third pad 112; the cross-section of the refraction part 943 in its width direction is triangular; during welding, the first circuit board 110 is placed on the workbench 950; the central light-transmitting area D1 of the glass pressing head 940 corresponds to the position of the first electronic component 130; the peripheral light-transmitting area D2 of the glass pressing head 940 presses on the plurality of first pads 111 of the first circuit board 110; at least part of the laser emitted by the laser emitter is refracted towards the central area A1 through the refraction part 943.

[0237] With such a setting, the laser emitted by the laser can be scanned by the galvanometer 930, shot towards the glass pressing head 940, and under the action of the refraction part 943, shot towards the third pad 112, so as to concentrate the laser on the central light-transmitting area D1 of the glass pressing head 940, making the welding device more suitable for welding the first electronic component 130 and the first circuit board 110 located in the central area A1, and the laser is more concentrated, which is beneficial to improving production efficiency. Specifically, the materials of the refraction part 943, the connection structure 9402 and the pressing head body 9401 can be the same, all of which are glass and are integrally formed structures.

[0238] Since the connection structure 9402 of the glass pressing head 940 and the jaws 9211 of the gripper 921 are in arc surface fit, the fitting accuracy between the gripper 921 and the glass pressing head 940 is higher. Specifically, the design of the glass pressing head 940 can refer to Table 4, and the numerical range of the bevel width of the refraction part 943 in Table 4 is d6×(0.8 - 3);

[0239] Table 4

[0240] Object Minimum / mm Maximum / mm <![CDATA[Minimum distance d1 from the first electronic component device to the side wall of the glass indenter]]> 0.075 2 <![CDATA[Minimum width d2 of the side wall of the glass indenter]]> 5 100 <![CDATA[The bottom wall of the groove region is at a distance d3 from the first electronic component]]> 0.075 2 <![CDATA[Total thickness d4 of the glass indenter]]> 0.2 30 <![CDATA[The thinnest thickness d5 of the glass indenter]]> 0.05 30 <![CDATA[Oblique angle width d6 of the refraction section]]> 0.15 <![CDATA[d4×0.9]]> <![CDATA[Oblique Angle Length d7 of the Refraction Portion]]> 0.15 <![CDATA[d6×3]]> <![CDATA[Thickness d8 of the connection structure]]> 0.3 8

[0241] It can be understood that the connection structure 9402 and the jaws 9211 of the glass chuck 940 in the third embodiment of the present application can also have the same structure as those in the first embodiment of the present application, and can be set according to the actual situation. The present application does not make any limitations in this regard.

[0242] As Figure 39 shown, Figure 39 FIG. is a connection relationship diagram of the welding device and the circuit board assembly 100 according to the fourth embodiment of the present application. The difference between the welding device according to the fourth embodiment of the present application and the welding device according to the third embodiment of the present application lies in the different structure of the central light-transmitting region D1 of the glass chuck 940. The glass chuck 940 in the fourth embodiment of the present application is provided with a self-focusing lens 944 in the groove region 942 and between the refraction portions 943 on the basis of the glass chuck 940 in the third embodiment of the present application.

[0243] In the fourth embodiment of the present application, as Figures 39 to 41 shown, Figure 40 FIG. is a top view of the glass chuck 940 in the welding device according to the fourth embodiment of the present application. Figure 41 FIG. is a front view of the glass chuck 940 in the welding device according to the fourth embodiment of the present application. A self-focusing lens 944 is further provided in the groove region 942 of the glass chuck 940. The planar side of the self-focusing lens 944 is in contact with the bottom wall of the groove region 942, and the convex side faces the central region A1. The self-focusing lens 944 is surrounded by an annular refraction portion 943. The self-focusing lens 944 is used to converge the laser passing through it into a beam of laser during welding and emit it from its convex side to the central region A1.

[0244] With such a setting, the laser emitted by the laser device can be scanned by the galvanometer 930, directed to the glass chuck 940, and under the action of the refraction portion 943, directed to the third pad 112. Under the action of a single self-focusing lens 944, multiple beams of laser are converged into a beam of laser, so that the laser is concentrated in the central light-transmitting region D1 of the glass chuck 940, making the welding device more suitable for welding the first electronic component 130 and the first circuit board 110 located in the central region A1, and the laser is more concentrated, further improving the production efficiency. Specifically, the materials of the refraction portion 943, the self-focusing lens 944, the connection structure 9402, and the chuck body 9401 can be the same, all made of glass and integrally formed.

[0245] Further, in order to achieve a better focusing effect, multiple self-focusing lenses 944 can be provided, and the multiple self-focusing lenses 944 cover the blank space on the bottom wall of the groove region 942; as Figure 40As shown in the figure, a total of 12 self-focusing lenses 944 are provided. The 12 self-focusing lenses 944 are divided into three rows, and each row includes a first lens 9441, a second lens 9442, a third lens 9443, and a fourth lens 9444 arranged in sequence.

[0246] The self-focusing lens 944 is a columnar optical lens with a refractive index distribution that gradually changes radially, and has the functions of focusing and imaging; the refractive index distribution of the material of the self-focusing lens 944 gradually decreases radially, which can cause the light transmitted along the axis to generate continuous refraction, so as to realize the smooth and continuous convergence of the outgoing light to a point, as Figure 42 shown in the figure. Figure 42 This is a schematic diagram of the light propagation of the self-focusing lens 944 in the fourth embodiment of the present application, and its refractive index change formula is:

[0247]

[0248] Among them, N (0) is the refractive index at the center of the self-focusing lens 944, r is the radius of the self-focusing lens 944, is the refractive index distribution constant of the self-focusing lens 944, and the refractive index distribution curve of the self-focusing lens refers to Figure 43 , Figure 43 This is the refractive index distribution curve of the self-focusing lens 944 in the fourth embodiment of the present application.

[0249] Since between the connection structure 9402 of the glass indenter 940 and the jaws 9211 of the holder 921, it is through arc surface fitting, the fitting accuracy between the holder 921 and the glass indenter 940 is higher. Specifically, the design dimensions of the glass indenter 940 refer to Table 5, and the numerical range of the bevel width of the refraction part 943 in Table 5 is e6×(0.8 - 3);

[0250] Table 5

[0251]

[0252]

[0253] It can be understood that the connection structure 9402 of the glass indenter 940 and the jaws 9211 in the fourth embodiment of the present application can also be the same as the structure in the first embodiment of the present application, and can be set according to the actual situation, and the present application does not make any limitations in this regard.

[0254] As Figure 44a shown in the figure. Figure 44aConnection diagram of the welding device and the circuit board assembly 100 according to the fifth embodiment of the present application. The difference between the welding device according to the fifth embodiment of the present application and the welding device according to the first embodiment of the present application lies in the different structure of the glass collet 940; in the glass collet 940 according to the fifth embodiment of the present application, a first mirror 945 and a second mirror 946 are provided.

[0255] In the fifth embodiment of the present application, as Figure 44a and Figure 44b shown, Figure 44b is the front view of the glass collet 940 in the welding device according to the fifth embodiment of the present application. The circuit board to be welded is the circuit board assembly 100 including a first circuit board 110 and a second circuit board 120; the first circuit board 110 has a central region A1 and a first peripheral region A2 arranged around the central region A1; a plurality of first pads 111 are provided in the first peripheral region A2; the second circuit board 120 has a central hollow region B1 and a second peripheral region B2 surrounding the central hollow region B1; the central hollow region B1 is correspondingly arranged with the central region A1, and a plurality of second pads 121 are provided in the second peripheral region B2; the positions of the first pads 111 and the second pads 121 correspond one by one.

[0256] The central light-transmitting region D1 of the glass collet 940 is a groove region 942 with a first mirror 945 provided inside; the groove region 942 is recessed from the side of the glass collet 940 close to the workbench 950 towards the side away from the workbench 950; the first mirror 945 is arranged at the junction of the bottom wall and the side wall of the groove region 942 and is inclined; a second mirror 946 is provided on the outer wall of the peripheral light-transmitting region D2 of the glass collet 940, and the reflecting surface of the second mirror 946 is arranged opposite to the reflecting surface of the first mirror 945 in a one-to-one correspondence; the first mirror 945 and the second mirror 946 are used to reflect at least part of the laser emitted by the laser emitter towards the first peripheral region A2 and the second peripheral region B2 during welding; during welding, the first circuit board 110 and the second circuit board 120 are stacked on the workbench 950, and the first circuit board 110 is located between the second circuit board 120 and the workbench 950; the glass collet 940 is located on the side of the second circuit board 120 away from the first circuit board 110; the central light-transmitting region D1 of the glass collet 940 corresponds to the central region A1; the peripheral light-transmitting region D2 of the glass collet 940 presses on a plurality of second pads 121 of the second circuit board 120, so that the first circuit board 110 and the second circuit board 120 are in close contact.

[0257] With such a setting, the laser emitted by the laser can be scanned by the galvanometer 930 and directed towards the glass tip 940. Under the action of the first mirror 945 and the second mirror 946, it is directed towards the first pad 111 and the second pad 121, thereby concentrating the laser on the light-transmitting area around the glass tip 940, making the welding device more suitable for welding the first pad 111 located in the first peripheral area and the second pad 121 located in the second peripheral area. The laser is more concentrated, further improving the production efficiency.

[0258] It can be understood that although the welding device of the fifth embodiment of the present application is suitable for welding the first pad 111 located in the first peripheral area and the second pad 121 located in the second peripheral area, a third pad 112 and a first electronic component 130 can be provided in the central area A1 of the first circuit board 110, or not provided. The present application does not make any limitations in this regard.

[0259] Since the connection structure 9402 of the glass tip 940 and the jaws 9211 of the gripper 921 are in arc surface cooperation, the cooperation accuracy between the gripper 921 and the glass tip 940 is higher. Specifically, the design dimensions of the glass tip 940 refer to Table 6. The numerical range of the oblique angle width of the first mirror 945 in Table 6 is f6×(0.8 - 3); the first mirror 945 and the second mirror 946 can have a single-sided mirror surface, and the mirror surface can be achieved by other coating methods such as mercury for total reflection; the size of the second mirror 946 can be the same as or different from the size of the first mirror 945. The present application does not make any limitations in this regard; preferably, the first mirror 945 and the second mirror 946 are symmetrically designed.

[0260] Table 6

[0261]

[0262]

[0263] As Figure 45 shown, Figure 45 is the connection relationship diagram of the welding device and the circuit board assembly 100 of the sixth embodiment of the present application; the difference between the welding device of the sixth embodiment of the present application and the welding device of the fifth embodiment of the present application is that the structure of the workbench 950 is different. The workbench 950 in the fifth embodiment of the present application is a complete structure, and the workbench 950 in the sixth embodiment of the present application has a hollow structure 951.

[0264] In the circuit board assembly 100 of some embodiments of the present application, third pads 112 are provided on both sides of the central area A1 of the first circuit board 110 to enable the first electronic components 130 to be provided on both sides of the first circuit board 110, making the structure of the circuit board assembly 100 more compact and having more functions.

[0265] The soldering device according to the embodiment of the present application is used to prepare the circuit board assembly 100 of any of the above embodiments. By setting different glass tips 940, separate soldering of the first pad 111 and the second pad 121 can be achieved to solder the first circuit board 110 and the second circuit board 120, or separate soldering of the first electronic component 130 and the first circuit board 110 can also be achieved. Moreover, simultaneous soldering of the first circuit board 110 and the second circuit board 120, as well as the first electronic component 130 and the first circuit board 110 can be realized. The application scenarios are diverse, and for the circuit board assembly 100 soldered, multiple first pads 111 and multiple second pads 121 are distributed around the first electronic component 130. Compared with the related art where pads are arranged on one side or both sides of the circuit board, in the circuit board assembly 100 of the embodiment of the present application, the space between multiple first pads 111 and the space between multiple second pads 121 are fully utilized to increase the layout area, making the layout compact. And by using the soldering method to fix the first circuit board 110 and the second circuit board 120, there is no need to use a connector to connect the first circuit board 110 and the second circuit board 120, resulting in a smaller volume and reducing the space occupied by the circuit board assembly 100 in the electronic device.

[0266] As Figure 46 and Figure 47 shown, Figure 46 is the flowchart of the soldering method according to the embodiment of the present application, Figure 47 is the process flowchart of the soldering method according to the embodiment of the present application. The embodiment of the present application proposes a soldering method, which applies the soldering device of the above embodiment. The circuit board to be soldered is the circuit board assembly 100 including the first circuit board 110 and the second circuit board 120; the first circuit board 110 has a central area A1 and a first surrounding area A2 arranged around the central area A1; a first electronic component 130 is arranged in the central area A1; multiple first pads 111 are arranged in the first surrounding area A2; the second circuit board 120 has a central hollow area B1, a second surrounding area B2 surrounding the central hollow area B1, and an interface area B3 arranged at the edge of the second surrounding area B2; the central hollow area B1 is correspondingly arranged with the central area A1 for avoiding the first electronic component 130 arranged in the central area A1; the interface area B3 is used to arrange the interface device 140; multiple second pads 121 are arranged in the second surrounding area B2; the soldering method includes:

[0267] S1. Place the first circuit board 110 on a workbench (not shown in the figure);

[0268] Between S1 and S2, pre-tinning is also included, and then flux is sprayed; the flux can help and promote the soldering process, and at the same time is a chemical substance with a protective effect and can prevent oxidation reaction;

[0269] S2. Place the first electronic component 130 in the central area A1 of the first circuit board 110;

[0270] S3. Place the second circuit board 120 and the first circuit board 110 in alignment so that a plurality of first pads 111 and a plurality of second pads 121 are arranged in one-to-one correspondence;

[0271] S4. Press the peripheral light-transmitting area D2 of the glass chuck 940 onto the plurality of second pads 121 on the second circuit board 120 so that the first pads 111 and the second pads 121 are in close contact; the central light-transmitting area D1 of the glass chuck 940 corresponds to the position of the first electronic component 130;

[0272] S5. Solder the first pads 111 and the second pads 121, and the first electronic component 130 and the first circuit board 110.

[0273] It can be understood that the glass chuck 940 can be pressed onto the second circuit board 120 first, and then the device body 920 of the welding device is connected to the glass chuck 940, or the device body 920 of the welding device is connected to the glass chuck 940 first, and then the glass chuck 940 is pressed onto the second circuit board 120, and both methods are acceptable; for the circuit board assembly 100 without the first electronic component 130, S2 can be omitted during the welding process.

[0274] For the circuit board assembly 100 prepared by the welding method of the embodiment of the present application, a plurality of first pads 111 and a plurality of second pads 121 are distributed around the first electronic component 130. Compared with the related art where the pads are arranged on one side or both sides of the circuit board, the circuit board assembly 100 of the embodiment of the present application makes full use of the space between the plurality of first pads 111 and the space between the plurality of second pads 121, realizes an increase in the layout area, has a compact layout, improves the layout density, and uses welding to fix the first circuit board 110 and the second circuit board 120, without using a connector to connect the first circuit board 110 and the second circuit board 120, has a smaller volume, and reduces the space occupied by the circuit board assembly 100 in the electronic device; and can realize the welding of the first circuit board 110 and the second circuit board 120 and the welding of the first electronic component 130 and the first circuit board 110 through one-time welding, thereby realizing efficient welding; at the same time, it reduces the number of times the device is heated, reduces the thickness of the IMC (Intermetallic compound), and improves the reliability between the pads.

[0275] It should be noted that in the examples and the description of this patent, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one" does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0276] Although this application has been illustrated and described by reference to certain preferred embodiments thereof, those of ordinary skill in the art should understand that various changes may be made therein in form and detail without departing from the spirit and scope of this application.

Claims

1. A circuit board assembly, characterized in that, Comprising: A first circuit board and a second circuit board; The first circuit board has a central region and a first peripheral region disposed around the central region; the central region is for disposing electronic components or structural components; the first peripheral region is for disposing a plurality of first pads, and the plurality of first pads are for electrically connecting with the electronic components and the second circuit board; The second circuit board has a central hollow region, a second peripheral region surrounding the central hollow region, and an interface region disposed at the edge of the second peripheral region; the central hollow region is correspondingly disposed with the central region for avoiding the electronic components or the structural components disposed in the central region; the interface region is for disposing interface devices; the second peripheral region is for disposing a plurality of second pads, and the plurality of second pads are for electrically connecting with the first circuit board and the interface devices; The plurality of first pads and the plurality of second pads are welded and fixed in one-to-one correspondence.

2. The circuit board assembly according to claim 1, characterized in that, The plurality of first pads and the plurality of second pads are all distributed in a complete ring shape, a ring shape with a notch, or a concave shape; The plurality of first pads and the plurality of second pads are arranged in one-to-one correspondence.

3. The circuit board assembly according to claim 1, characterized in that, At least one third pad and at least one first electronic component are disposed in the central region of the first circuit board; Each of the first electronic components and the first pads electrically connected thereto are electrically connected through the third pads.

4. The circuit board assembly according to claim 1, characterized in that, No solder through holes are provided on each of the first pads; One or two solder through holes are provided on at least part of the second pads.

5. The circuit board assembly according to claim 1, characterized in that, Reference marking points for welding positioning are provided on both the first circuit board and the second circuit board; The reference marking points on the first circuit board are correspondingly disposed with the reference marking points on the second circuit board.

6. The circuit board assembly according to claim 1, characterized in that, The shapes of the first pads and the second pads are circular or rectangular.

7. The circuit board assembly according to claim 1, characterized in that, The first circuit board is a printed circuit board, and the second circuit board is a flexible circuit board.

8. The circuit board assembly according to claim 1, characterized in that, The first circuit board is rectangular; The central hollow region and the second peripheral region of the second circuit board together form a rectangular area; The number of the interface regions is one, extending from one side of the rectangular area in a direction away from the central hollow region; or, the number of the interface regions is two, respectively disposed on opposite sides of the rectangular area, and each interface region extends from the corresponding side of the rectangular area in a direction away from the central hollow region.

9. The circuit board assembly according to claim 1, characterized in that, Both the first circuit board and the second circuit board have convex structures and / or concave structures.

10. An electronic device, characterized in that, Comprising: A first device body, and the first device body includes the circuit board assembly according to any one of claims 1 to 9.

11. The electronic device according to claim 10, characterized in that, The electronic device further includes a first display screen; The first device body further includes: a first main board, a first middle frame, a first rear case, a secondary board, and a first battery; The first middle frame and the first rear case are fixedly connected to form a first accommodation space; The circuit board assembly, the first main board, the secondary board, and the first battery are disposed in the first accommodation space; Wherein, the circuit board assembly is mounted on one side of the first main board facing the first rear case; and the circuit board assembly is electrically connected to the first main board through the interface devices; The first main board is also electrically connected to the first display screen, the first battery, and the secondary board respectively; The first display screen is disposed on a side of the first middle frame away from the first rear case and is fixedly connected to the first middle frame.

12. The electronic device according to claim 11, characterized in that,The electronic device further includes: a camera assembly and a decorative member; A first through hole is provided on a surface of the first rear case away from the first middle frame; The decorative member covers the first through hole and is located on a side of the first rear case away from the first middle frame; A hollow camera mounting area is provided on the first main board, and the camera assembly is disposed in the camera mounting area; The orthographic projection of the decorative member on the first main board covers the orthographic projection of the camera assembly on the first main board.

13. The electronic device according to claim 12, wherein, Second electronic components are disposed on a first surface of the first main board, and third electronic components are disposed on a second surface of the first main board; A first shielding cover is further disposed between the first main board and the first middle frame. The first shielding cover and the first main board together form a second accommodation space; the second electronic components are accommodated in the second accommodation space; A second shielding cover is further disposed between the first main board and the circuit board assembly. The second shielding cover and the first main board together form a sealed third accommodation space; the third electronic components are accommodated in the third accommodation space; The circuit board assembly is mounted on the second shielding cover.

14. The electronic device according to claim 13, wherein, At a position on the first middle frame corresponding to the second electronic components, a second through hole is provided. At a position on the first shielding cover corresponding to the second through hole, a third through hole is provided. A first heat dissipation member is disposed in the second through hole and the third through hole, and the first heat dissipation member is in contact with the second electronic components; A second heat dissipation member is disposed on a side of the first middle frame away from the first main board, and the second heat dissipation member is in contact with the first heat dissipation member.

15. The electronic device according to claim 11, wherein, The electronic device further includes: a second display screen, a second device body, and a rotating shaft mechanism; The second device body includes: a second main board, a second middle frame, a second rear case, and a second battery; The second middle frame and the second rear case are fixedly connected to form a fourth accommodation space; The second main board and the second battery are disposed in the fourth accommodation space; The rotating shaft mechanism is located between the first middle frame and the second middle frame and is respectively rotatably connected to the two, so that the second device body and the first device body can be folded relative to the rotating shaft mechanism; The second display screen is a foldable display screen and covers the first middle frame, the rotating shaft mechanism, and the second middle frame; the first display screen is located on a surface of the first middle frame that does not cover the second display screen; The first main board and the second main board are electrically connected through a shaft-passing connecting member, and the shaft-passing connecting member enters the fourth accommodation space from the first accommodation space through the rotating shaft mechanism.

16. A welding device, wherein, The welding device includes: a laser, a device body, a galvanometer scanner, a glass chuck, and a workbench; The galvanometer scanner is disposed on the device body for scanning the laser emitted by the laser; The glass pressing head is mounted on the device body and is suspended above the workbench in a liftable manner, and is used to fix the circuit board to be welded on the workbench during welding; The glass pressing head has a central light-transmitting area and a surrounding light-transmitting area arranged around the central light-transmitting area; the central light-transmitting area is used to cooperate with the galvanometer scanner so that the laser emitted by the laser device is directed to the central area of the circuit board to be welded; the surrounding light-transmitting area is used to press the surrounding area of the circuit board to be welded and cooperate with the galvanometer scanner so that the laser emitted by the laser device is directed to the surrounding area of the circuit board to be welded; wherein, the central area of the circuit board to be welded is used to arrange electronic components or structural components, and the surrounding area of the circuit board to be welded is provided with solder pads.

17. The welding device according to claim 16, wherein, The central light-transmitting area of the glass pressing head is a through-hole area; or, the central light-transmitting area of the glass pressing head is a groove area; the groove area is formed by the surface of the glass pressing head close to the workbench being recessed away from the workbench; The circuit board to be welded is a circuit board assembly including a first circuit board and a second circuit board; The first circuit board has a central area and a first surrounding area arranged around the central area; the central area is provided with a first electronic component; the first surrounding area is provided with a plurality of first solder pads; the second circuit board has a central hollow area and a second surrounding area arranged around the central hollow area; the central hollow area is correspondingly arranged with the central area, and the second surrounding area is provided with a plurality of second solder pads; the first solder pads and the second solder pads are in one-to-one correspondence in position; During welding, the first circuit board and the second circuit board are stacked on the workbench, and the first circuit board is located between the second circuit board and the workbench; the glass pressing head is located on the side of the second circuit board away from the first circuit board; the central light-transmitting area of the glass pressing head corresponds to the position of the first electronic component; the surrounding light-transmitting area of the glass pressing head presses on the plurality of second solder pads of the second circuit board, so that the first circuit board and the second circuit board are in close contact.

18. The welding device according to claim 16, wherein, The circuit board to be welded is a circuit board assembly including a first circuit board; The first circuit board has a central area and a first surrounding area arranged around the central area; the central area is provided with a third solder pad and a first electronic component; the first surrounding area is provided with a plurality of first solder pads; the first electronic component is electrically connected to the first solder pad through the third solder pad; The central light-transmitting area of the glass pressing head is a groove area provided with a refraction part inside; the groove area is formed by the surface of the glass pressing head close to the workbench being recessed away from the workbench; The refraction part is annular and is arranged at the junction of the bottom wall and the side wall of the groove area; the refraction part has three surfaces, two of which are respectively in contact with the bottom wall and the side wall of the groove area, and the remaining one surface is an inclined surface facing the third solder pad; the cross-section of the refraction part in its width direction is triangular; During welding, the first circuit board is placed on the workbench; the central light-transmitting area of the glass pressing head corresponds to the position of the first electronic component; the surrounding light-transmitting area of the glass pressing head presses on a plurality of first pads of the first circuit board; at least part of the laser emitted by the laser emitter is refracted by the refraction part towards the central area.

19. The welding equipment according to claim 18, characterized in that A self-focusing lens is further provided in the groove area of the glass pressing head; The planar side of the self-focusing lens is in contact with the bottom wall of the groove area, and the convex side faces the central area; the self-focusing lens is surrounded by the annular refraction part; the self-focusing lens is used to converge the laser passing through it into a beam of laser during welding and emit it from its convex side towards the central area.

20. The welding equipment according to claim 16, characterized in that The circuit board to be welded is a circuit board assembly including a first circuit board and a second circuit board; The first circuit board has a central area and a first surrounding area arranged around the central area; a plurality of first pads are arranged in the first surrounding area; the second circuit board has a central hollow area and a second surrounding area arranged around the central hollow area; the central hollow area corresponds to the central area, and a plurality of second pads are arranged in the second surrounding area; the positions of the first pads and the second pads correspond one by one; The central light-transmitting area of the glass pressing head is a groove area internally provided with a first mirror; the groove area is formed by the surface of the glass pressing head close to the workbench recessing away from the workbench; the first mirror is arranged at the junction of the bottom wall and the side wall of the groove area and is inclined; A second mirror is provided on the outer wall of the surrounding light-transmitting area of the glass pressing head; the reflecting surface of the second mirror and the reflecting surface of the first mirror are arranged opposite to each other in a corresponding manner; the first mirror and the second mirror are used to reflect at least part of the laser emitted by the laser emitter towards the first surrounding area and the second surrounding area during welding; During welding, the first circuit board and the second circuit board are stacked on the workbench, and the first circuit board is located between the second circuit board and the workbench; the glass pressing head is located on the side of the second circuit board away from the first circuit board; the central light-transmitting area of the glass pressing head corresponds to the central area; the surrounding light-transmitting area of the glass pressing head presses on a plurality of second pads of the second circuit board, so that the first circuit board and the second circuit board are in close contact.

21. The welding equipment according to any one of claims 16 to 20, characterized in that The equipment main body includes: a gripper and a cylinder; The cylinder is suspended above the workbench; The galvanometer is arranged at the light incident end of the cylinder; The gripper is arranged at the light emitting end of the cylinder to grip the glass pressing head.

22. The welding equipment according to claim 21, characterized in that The glass pressing head includes: a pressing head main body and a connecting structure; The connecting structure is formed on the outer wall of the glass pressing head; the shape of the connecting structure is adapted to the shape of the gripper.

23. The welding equipment according to claim 22, characterized in that The number of the connecting structures is two, which are respectively arranged on two opposite outer walls of the pressing head main body; The connecting structure has a first inclined surface; in the first direction, the cross section of the connecting structure is triangular; The gripper has two oppositely arranged jaws, and each of the jaws is provided with a second inclined surface adapted to the first inclined surface; When the glass press head is gripped by the gripper, the two jaws are respectively located on both sides of the glass press head; the first inclined surface and the second inclined surface are in contact with each other, the first inclined surface is arranged in a direction away from the cylinder body, and the second inclined surface is arranged towards the cylinder body.

24. The welding equipment according to claim 22, characterized in that The number of the connecting structures is two, which are respectively arranged on two opposite outer walls of the press head body; On each of the connecting structures, a first arc surface is formed on a side away from the press head body; The gripper has two oppositely arranged jaws, and each of the jaws is provided with a second arc surface adapted to the first arc surface; When the glass press head is gripped by the gripper, the two jaws are respectively located on both sides of the glass press head; the first arc surface and the second arc surface are in contact with each other.

25. A welding method, characterized in that Applying the welding device according to claim 16, the circuit board to be welded is a circuit board assembly including a first circuit board and a second circuit board; The first circuit board has a central region and a first peripheral region arranged around the central region; a first electronic component is arranged in the central region; a plurality of first pads are arranged in the first peripheral region; the second circuit board has a central hollow region, a second peripheral region surrounding the central hollow region, and an interface region arranged at the edge of the second peripheral region; the central hollow region is correspondingly arranged with the central region for avoiding the first electronic component arranged in the central region; The interface region is used for arranging interface devices; A plurality of second pads are arranged in the second peripheral region; The welding method includes: Placing the first circuit board on the workbench; Placing the first electronic component in the central region of the first circuit board; Placing the second circuit board and the first circuit board in alignment so that the plurality of first pads and the plurality of second pads are arranged in one-to-one correspondence; Pressing the peripheral light-transmitting region of the glass press head on the plurality of second pads on the second circuit board so that the first pads and the second pads are in close contact; the central light-transmitting region of the glass press head corresponds to the position of the first electronic component; Welding the first pads and the second pads, and the first electronic component and the first circuit board.

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