Flexible heat dissipation structure of controller, preparation method and controller

Abstract

The invention relates to the technical field of heat dissipation, and discloses a flexible heat dissipation structure of a controller, a preparation method and the controller, the flexible heat dissipation structure of the controller comprises a flexible heat dissipation film and a first heat conduction piece, the flexible heat dissipation film comprises a first plane area, a bending area and a second plane area which are sequentially connected in the length direction, the second plane area is suitable for abutting against a shell, and the first heat conduction piece is arranged in the first plane area; the bending angle of the bending area is 0-180 degrees, and the first heat conduction piece is arranged between the first plane area and the heat source. The flexible heat dissipation film structure is adopted, heat dissipation channels from the chips to the flexible heat dissipation film to the shell can be established for the chips with different thicknesses, it is ensured that all the chips can effectively dissipate heat, the flexible bending area can be bent to any needed angle, the heat dissipation channels are established between the shell and the chips in different directions, and the heat dissipation efficiency is improved. Therefore, the application range of the flexible heat dissipation structure of the controller is widened.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly to a flexible heat dissipation structure for a controller, a preparation method thereof, and a controller. Background Art

[0002] With the development of industrial automation technology and the continuous improvement of equipment integration, the heat flux density inside each module of industrial controllers has also increased accordingly. The power consumption and heat generation problems of chips have become increasingly prominent. Especially in multi-chip systems, how to effectively manage heat and ensure the stable operation of each chip under high load has become an urgent problem to be solved.

[0003] In the prior art, heat conducting components are usually arranged inside the controller housing, and the heat generated by the chip during operation is transferred to the housing through the heat conducting components to achieve heat dissipation. Among them, flexible heat conducting components such as heat conducting foam are sensitive to the ambient temperature and have weak heat conducting performance, so the heat dissipation effect is limited. In addition, traditional heat conducting components can only be applied to the situation where the chip and the housing are relatively arranged, and it is difficult to meet the requirements of complex chip layouts, so the application scope is limited. Summary of the Invention

[0004] In view of this, the present invention provides a flexible heat dissipation structure for a controller, a preparation method thereof, and a controller, so as to solve the problems in the prior art that the heat dissipation effect of setting rigid heat dissipation bosses or heat conducting foam inside the controller housing is limited, and the applicable situations of traditional heat conducting components are limited.

[0005] In a first aspect, the present invention provides a flexible heat dissipation structure for a controller, including a flexible heat dissipation film and a first heat conducting member. The flexible heat dissipation film includes a first planar region, a bending region, and a second planar region that are sequentially connected along the length direction. The second planar region is adapted to abut against the housing, the bending angle of the bending region is 0 to 180°, and the first heat conducting member is arranged between the first planar region and the heat source.

[0006] Beneficial effects: The present invention adopts a flexible heat dissipation film structure, and different thicknesses of the first heat conducting member are arranged between the first planar region and the chip, so as to establish a heat dissipation channel from the chip to the flexible heat dissipation film and then to the housing for chips of different thicknesses, ensuring that all chips can dissipate heat effectively. The flexible bending region can be bent into any required angle to establish a heat dissipation channel between the housing and the chip in different orientations, thereby improving the applicable range of the flexible heat dissipation structure of the controller; at the same time, compared with the traditional rigid boss heat dissipation structure, it can better resist the influence of external stress, significantly reduce the stress borne by the chip, and thus effectively improve the reliability of the chip and extend its service life.

[0007] In an optional embodiment, the flexible heat dissipation structure of the controller further includes a second heat conducting member, and the second heat conducting member is arranged between the first planar region and the second planar region.

[0008] Beneficial effect: According to the actual distance between the chip and the shell, the present invention sets a second heat-conducting member of different thicknesses between the first plane area and the second plane area, establishes a heat dissipation channel that adapts to different spacings, solves the problem of limited thickness of a traditional single flexible heat dissipation film, and improves the overall adjustable thickness range of the controller's flexible heat dissipation structure.

[0009] In an optional embodiment, the first planar region, the bending region and the second planar region include a substrate, a graphene layer and a release film, the graphene layer is arranged on both sides of the substrate, and the release film is arranged on the graphene layer.

[0010] Beneficial effect: In the present invention, a release film is arranged on the side of the graphene layer away from the base layer to prevent the flexible film from being worn during the processing and production process. When the flexible heat dissipation structure of the controller is installed, the release film can be removed, which is easy to operate and use.

[0011] In an optional embodiment, an adhesive layer is provided between the graphene layer and the release film in the first plane region and the second plane region.

[0012] Beneficial effect: The present invention sets an adhesive layer on the side of the graphene layer facing the release film, and the adhesive layer can firmly adhere the first heat conductor to the first plane area and the second plane area, and can also firmly adhere the second heat conductor to the first plane area, and firmly adhere the shell to the second plane area.

[0013] In an optional embodiment, the adhesive layer includes a single-sided adhesive layer and a double-sided adhesive layer, the single-sided adhesive layer is arranged between the graphene layer and the release film on the side away from the first heat conductor, and the double-sided adhesive layer is arranged between the graphene layer and the release film on the side of the first heat conductor.

[0014] In an optional implementation, the edge of the flexible heat dissipation film is provided with an edge.

[0015] Beneficial effect: Graphene powder is easy to fall off the edge of the flexible heat dissipation film in the present invention, and the powder may affect the normal operation of the controller. The edge treatment can effectively prevent the graphene powder from falling and ensure the stability of the controller.

[0016] In an optional embodiment, the first plane area and the second plane area are provided with mounting holes.

[0017] In an optional implementation, a positioning mark is provided on the first plane area, and the first heat conducting member is installed on the positioning mark.

[0018] In a second aspect, the present invention further provides a method for preparing a flexible heat dissipation structure of a controller, which is applied to the flexible heat dissipation structure of the controller, comprising:

[0019] Applying a graphene oxide solution on a substrate and drying it to form a graphene oxide film;

[0020] Heat the graphene oxide film to reduce the graphene oxide film to a graphene film;

[0021] Attach the adhesive layer to both sides of the graphene film;

[0022] Attach the release film to the surface of the adhesive layer;

[0023] Cut the film material according to the drawing, perform edge wrapping treatment, open mounting holes on the film material, and set positioning marks in the first plane area;

[0024] Align the first heat conducting member with the positioning marks and fix it.

[0025] In a third aspect, the present invention further provides a controller, including the flexible heat dissipation structure of the above-mentioned controller, a housing, a chip, and a PCB board. The second plane area abuts against the inner wall of the housing. The chip is arranged inside the housing. The first heat conducting member abuts against the chip. The PCB board is installed inside the housing, and the chip is installed on the PCB board.

[0026] Since the controller of the present invention includes the flexible heat dissipation structure of the controller and has the same effect as the flexible heat dissipation structure of the controller, it will not be elaborated here. Description of the Drawings

[0027] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 A side view of the flexible heat dissipation structure of a controller according to an embodiment of the present invention;

[0029] Figure 2 A planar development view of the flexible heat dissipation film in the flexible heat dissipation structure of a controller according to an embodiment of the present invention;

[0030] Figure 3 A side view of the flexible heat dissipation film in the flexible heat dissipation structure of a controller according to an embodiment of the present invention;

[0031] Figure 4 A side view of the flexible heat dissipation structure of a second controller according to an embodiment of the present invention;

[0032] Figure 5 A side view of the flexible heat dissipation structure of a third controller according to an embodiment of the present invention;

[0033] Figure 6The side view in the flexible heat dissipation structure of the fourth controller according to the embodiment of the present invention;

[0034] Figure 7 The side view in the flexible heat dissipation structure of the fifth controller according to the embodiment of the present invention;

[0035] Figure 8 The chip temperature simulation test diagram in a controller according to the embodiment of the present invention.

[0036] Explanation of reference numerals:

[0037] 1. Flexible heat dissipation film; 101. First planar area; 102. Bending area; 103. Second planar area; 104. Substrate; 105. Graphene layer; 106. Release film; 107. Adhesive layer; 1071. Single-sided adhesive layer; 1072. Double-sided adhesive layer; 108. Mounting hole; 109. Positioning mark;

[0038] 2. First heat conducting member;

[0039] 3. Second heat conducting member;

[0040] 100. Flexible heat dissipation structure of the controller; 200. Housing; 300. Chip; 400. PCB board. Detailed implementation manners

[0041] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0042] In the related art, there is also a method of setting rigid heat conducting components for heat dissipation in the controller. It usually uses copper or aluminum materials to make heat dissipation bosses, and conducts the heat generated by the chip to the outer shell through the bosses. However, when the environmental temperature changes and the outer shell is squeezed, shear force or pressure will be generated on the chip, which easily accelerates the failure of the chip and affects the reliability and service life of the controller.

[0043] The following will be combined with Figures 1 to 8 , to describe the embodiments of the present invention.

[0044] According to the embodiments of the present invention, on the one hand, as Figures 1 to 7As shown, a flexible heat dissipation structure 100 for a controller is provided, including a flexible heat dissipation film 1 and a first heat conducting member 2. The flexible heat dissipation film 1 includes a first planar region 101, a bending region 102, and a second planar region 103 that are connected in sequence along the length direction. The second planar region 103 is adapted to abut against the housing 200, the bending angle of the bending region 102 is 0 to 180°, and the first heat conducting member 2 is disposed between the first planar region 101 and the heat source.

[0045] Specifically, as Figure 2 shown, in this embodiment, the flexible heat dissipation film 1 is not specifically limited. For example, in this embodiment, the flexible heat dissipation film 1 is rectangular, with the two ends of the flexible heat dissipation film 1 being the first planar region 101 and the second planar region 103 respectively, and the bending region 102 is connected between the first planar region 101 and the second planar region 103. After the bending region 102 is bent, the included angle between the first planar region 101 and the second planar region 103 can be any angle, and the first heat conducting member 2 is connected between the first planar region 101 and the heat source.

[0046] In this embodiment, the heat source is not specifically limited. For example, in this embodiment, the heat source is a chip 300 inside the controller housing 200.

[0047] In this embodiment, as Figure 1 shown, for the chip 300 with a relatively large distance from the housing 200, the flexible heat dissipation film 1 is bent into a "U" shape, which can increase the thickness of the flexible heat dissipation film 1, and different thicknesses of the first heat conducting member 2 are placed between the first planar region 101 and the chip 300, so that the tops of chips 300 with different heights are in the same plane, so that the flexible heat dissipation film 1 can dissipate heat from multiple different chips 300 at the same time. The heat generated when the chip 300 works is transferred from the chip 300 to the first heat conducting member 2, then from the first heat conducting member 2 to the flexible heat dissipation film 1, and finally through the housing 200 abutting against the flexible heat dissipation film 1, the heat is dissipated to the outside of the housing 200, thereby realizing the heat dissipation of the chip 300.

[0048] In this embodiment, as Figure 4 shown, multiple bending regions 102 can also be provided on the flexible heat dissipation film 1. The two sides of the bending region 102 are the first planar region 101 and the second planar region 103 respectively. For chips 300 with different distances from the housing 200, the flexible heat dissipation film 1 is bent into an "S" shape or a wavy shape. Such a structure can increase the overall thickness of the flexible heat dissipation structure 100 of the controller to meet the use in the case where the distance between the chip 300 and the housing 200 is relatively large.

[0049] In this embodiment, the sizes of the first planar region 101 and the second planar region 103 are not specifically limited. For example, the areas of the first planar region 101 and the second planar region 103 can be maximally the same as the area of the housing 200.

[0050] In this embodiment, the number of the first heat conducting members 2 is not specifically limited. For example, as Figure 1 shown, in this embodiment, the number of the first heat conducting members 2 is three. The three first heat conducting members 2 correspond to three different chips 300. The size and thickness of each first heat conducting member 2 match the corresponding chip 300, so as to ensure that one side of the three first heat conducting members 2 away from the chip 300 abuts against the first plane area 101 in the same plane.

[0051] In another embodiment, as Figure 5 shown, when the housing 200 and the chip 300 are vertically arranged, the bending area 102 can be bent by 90°. The first plane area 101 abuts against the first heat conducting member 2 on the chip 300, and the second plane area 103 abuts against the housing 200. The heat generated by the chip 300 is transferred to the flexible heat dissipation film 1 through the first heat conducting member 2, and then transferred to the housing 200 by the flexible heat dissipation film 1, and finally the heat is dissipated to the outside of the housing 200, so as to realize the heat dissipation of the chip 300.

[0052] In some other embodiments not shown, when the angle between the housing 200 and the chip 300 is different, the bending area 102 can be bent correspondingly to establish a heat dissipation channel between the housing 200 and the chip 300 through the flexible heat dissipation film 1.

[0053] The present invention adopts the flexible heat dissipation film 1 structure, and different thicknesses of the first heat conducting members 2 are arranged between the first plane area 101 and the chip 300, so as to establish a heat dissipation channel from the chip 300 to the flexible heat dissipation film 1 and then to the housing 200 for chips 300 with different thicknesses, ensuring that all chips 300 can be effectively cooled. The flexible bending area 102 can be bent into any required angle to establish a heat dissipation channel between the housing 200 and the chip 300 in different orientations, thereby improving the application range of the flexible heat dissipation structure 100 of the controller; at the same time, compared with the traditional rigid boss heat dissipation structure, it can better resist the influence of external stress, significantly reduce the stress borne by the chip 300, and thus effectively improve the reliability of the chip 300 and extend its service life.

[0054] In an alternative embodiment, as Figure 6 and Figure 7 shown, the flexible heat dissipation structure 100 of the controller further includes a second heat conducting member 3, and the second heat conducting member 3 is arranged between the first plane area 101 and the second plane area 103.

[0055] Specifically, in this embodiment, the number of the second heat conducting members 3 is not specifically limited. For example, as Figure 6 shown, when the bending area 102 is bent by 180° to form a "U" shape, a second heat conducting member 3 is arranged between the first plane area 101 and the second plane area 103; as Figure 7As shown, when the bending area 102 is bent into an "S" shape with n layers, a second heat conducting member 3 can be provided between each corresponding first planar area 101 and second planar area 103, and a total of n - 1 second heat conducting members 3 are provided. In the appended Figure 7 n is 3.

[0056] In this embodiment, no specific limitation is imposed on the first heat conducting member 2 and the second heat conducting member 3. For example, in this embodiment, the first heat conducting member 2 and the second heat conducting member 3 are made of graphene foam, which is obtained by coating a polymer foam with a graphene heat dissipation film and has an adhesive on its own, and can be directly adhered to the flexible heat dissipation film 1.

[0057] In this embodiment, the graphene foam includes: a single-sided adhesive, a graphene heat dissipation film, a double-sided adhesive, a polymer foam, a double-sided adhesive, and a release film, which are arranged in sequence. It has high resilience and high compressibility, a thermal conductivity of 6W / mk, and its thickness can be adjusted according to actual requirements, with an adjustable range of 0.5mm - 5mm.

[0058] In the present invention, by providing second heat conducting members 3 with different thicknesses between the first planar area 101 and the second planar area 103, the overall thickness of the flexible heat dissipation structure 100 of the controller can be increased and a supporting effect can be achieved, so as to provide a heat dissipation channel between chips 300 with different spacings and the housing 200.

[0059] In an alternative embodiment, as Figure 3 shown, the first planar area 101, the bending area 102, and the second planar area 103 include a substrate 104, a graphene layer 105, and a release film 106. The graphene layer 105 is disposed on both sides of the substrate 104, and the release film 106 is disposed on the graphene layer 105.

[0060] Specifically, in this embodiment, the middle part of the flexible heat dissipation film 1 is the substrate 104, graphene layers 105 are provided on both sides of the substrate 104, and a release film 106 is provided on the side of the graphene layer 105 away from the substrate 104 layer.

[0061] In this embodiment, no specific limitation is imposed on the substrate 104. For example, in this embodiment, the substrate 104 is a polyethylene terephthalate (PET) substrate 104. The PET substrate 104 has good processing performance and can be processed by cutting, bending, thermoforming, etc. Using the PET substrate 104 facilitates bending the bending area 102 in the flexible film into the desired shape.

[0062] In this embodiment, no specific limitation is imposed on the graphene layer 105. For example, in this embodiment, the overall thickness of the graphene layer 105 is 0.2mm, and the transverse thermal conductivity is 1200W / mk. The graphene layer 105 has good thermal conductivity and good flexibility.

[0063] In this embodiment, the release film 106 is not specifically limited. For example, in this embodiment, the release film 106 is made of a plastic film. To increase the release force of the plastic film, the plastic film can be subjected to plasma treatment, fluorine coating treatment, or silicon release agent coating on the surface layer of the film material.

[0064] In the present invention, a release film 106 is provided on the side of the graphene layer 105 away from the substrate 104 layer, which can prevent the flexible heat dissipation film 1 from being worn during the processing and production process. When installing the flexible heat dissipation structure 100 of the controller, the release film 106 can be removed, which is easy to operate and use.

[0065] In an alternative embodiment, as Figure 3 shown, in the first planar region 101 and the second planar region 103, an adhesive layer 107 is provided between the graphene layer 105 and the release film 106.

[0066] In the present invention, an adhesive layer 107 is provided on the side of the graphene layer 105 facing the release film 106. The adhesive layer 107 can firmly bond the first heat conducting member 2 to the first planar region 101 and the second planar region 103, and can also firmly bond the second heat conducting member 3 to the first planar region 101 and the housing 200 to the second planar region 103.

[0067] In an alternative embodiment, as Figure 3 shown, the adhesive layer 107 includes a single-sided adhesive layer 1071 and a double-sided adhesive layer 1072. The single-sided adhesive layer 1071 is provided between the graphene layer 105 and the release film 106 on the side away from the second heat conducting member 3, and the double-sided adhesive layer 1072 is provided between the graphene layer 105 and the release film 106 on the side of the second heat conducting member 3.

[0068] Specifically, in this embodiment, the single-sided adhesive layer 1071 is used to bond the graphene layer 105 on the side away from the second heat conducting member 3 to the substrate 104, and the double-sided adhesive layer 1072 is used to bond the graphene layer 105 on the side of the second heat conducting member 3 to the substrate 104 and can bond and connect the graphene layer 105 and the second heat conducting member 3.

[0069] In an alternative embodiment, the edge of the flexible heat dissipation film 1 is provided with a border.

[0070] Specifically, in this embodiment, a border is provided at the four edges of the rectangular flexible heat dissipation film 1.

[0071] In the present invention, graphene powder is likely to fall off from the edge of the flexible heat dissipation film 1, and these powders may affect the normal operation of the controller. The border treatment can effectively prevent the falling of graphene powder and ensure the stability of the controller.

[0072] In an alternative embodiment, asFigure 2 As shown, mounting holes 108 are provided in the first planar region 101 and the second planar region 103.

[0073] Specifically, in this embodiment, screws are installed in the mounting holes 108 provided in the first planar region 101 and the second planar region 103, for firmly mounting the flexible heat dissipation structure 100 of the controller on the housing 200.

[0074] In an alternative embodiment, as Figure 2 shown, the first planar region 101 is provided with positioning markings 109, and the first heat conducting member 2 is installed on the positioning markings 109.

[0075] Specifically, in this embodiment, a plurality of positioning markings 109 are provided on both sides of the first planar region 101. The outer shapes of the positioning markings 109 match the outer shapes of the corresponding first heat conducting member 2 and second heat conducting member 3. Installing the first heat conducting member 2 and the second heat conducting member 3 on each of the positioning markings 109 facilitates accurate installation of the first heat conducting member 2 and the second heat conducting member 3 in place.

[0076] According to an embodiment of the present invention, on the other hand, a method for manufacturing a flexible heat dissipation structure 100 of a controller is also provided, which is applied to the flexible heat dissipation structure 100 of the above-mentioned controller, and includes:

[0077] Applying a graphene oxide solution onto the substrate 104 and drying it to form a graphene oxide film;

[0078] Heating the graphene oxide film to reduce the graphene oxide film to a graphene film;

[0079] Attaching the adhesive layer 107 to both sides of the graphene film;

[0080] Attaching the release film 106 to the surface of the adhesive layer 107;

[0081] Cutting the film material according to the drawing and performing edge wrapping treatment, opening mounting holes 108 in the film material, and setting positioning markings 109 in the first planar region 101;

[0082] Aligning the first heat conducting member 2 with the positioning markings 109 and fixing it.

[0083] Specifically, in this embodiment, the method for manufacturing and installing the flexible heat dissipation structure 100 of the controller is as follows:

[0084] S1: Applying the graphene oxide solution to the upper and lower sides of the substrate 104 and drying it to form a graphene oxide film;

[0085] S2: After subjecting the graphene oxide film to high temperature heat treatment at 2000 °C to 3000 °C for 1 hour, reducing the graphene oxide film to a graphene film;

[0086] S3: In a dust-free environment, evenly adhere the single-sided adhesive layer 1071 to the graphene layer 105 on the side away from the first heat conducting member 2, and evenly adhere the double-sided adhesive layer 1072 to the graphene layer 105 on the side of the first heat conducting member 2;

[0087] S4: The release film 106 is attached to the surface of the double-sided adhesive layer 1072 and physically pressed with a roller to expel air to ensure a tight fit;

[0088] S5: cutting the flexible heat dissipation film 1 according to the drawing and performing hemming processing, then opening four mounting holes 108 on the flexible heat dissipation film 1, and setting positioning marks 109 for pasting the first positioning member 2 on the first plane area 101;

[0089] S6: Align the first heat-conducting member 2 with the positioning mark 109 and stick it to the positioning mark 109 .

[0090] According to an embodiment of the present invention, on the other hand, Figure 1 , Figures 4 to 7 As shown, a controller is also provided, including the flexible heat dissipation structure 100, shell 200, chip 300 and PCB board 400 of the above-mentioned controller, the second planar area 103 is abutted against the inner wall of the shell 200, the chip 300 is arranged in the shell 200, the first flat heat conductive member 2 is abutted against the chip 300, the PCB board 400 is installed in the shell 200, and the chip 300 is installed on the PCB board 400.

[0091] Specifically, the controller in this embodiment is an industrial controller.

[0092] The present invention sets a flexible heat dissipation structure 100 of the controller between the chip 300 and the shell 200. Compared with traditional rigid heat-conducting components, the flexible heat dissipation structure 100 of the controller can better resist the influence of external stress and significantly reduce the stress borne by the chip 300, thereby effectively improving the reliability of the chip 300 and extending its service life.

[0093] Since the bending area 102 in the flexible heat dissipation structure 100 of the controller can be flexibly bent, a heat conduction channel can be established from the chip 300 to the shell 200, without limiting the layout position of the chip 300 on the PCB board 400. By bending the bending area 102, the bent flexible heat dissipation film 1 can span the distance between the chip 300 and the shell, thereby solving the problem of limited layout position of the chip 300 and limited thickness of the single-layer flexible heat dissipation film 1, and by superimposing the second heat conductive member 3 in the bending area, the adjustable thickness range of the flexible heat dissipation structure 100 of the controller is further improved.

[0094] In the present invention, the flexible heat dissipation structure 100 of the controller is formed by stacking first heat conducting members 2 with different thicknesses on the area of the chip 300 mounted on the PCB board 400. The thickness of the first heat conducting member 2 is customized according to the distance from the chip 300 to the housing 200. A heat dissipation channel from the chip 300 to the flexible heat dissipation structure 100 of the controller and then to the housing 200 can be established for multiple chips 300 with different thicknesses, ensuring that all chips 300 can dissipate heat effectively and solving the limitation that the single-layer flexible heat dissipation film 1 can only provide effective heat dissipation for chips 300 with the same thickness.

[0095] The flexible heat dissipation film 1 uses highly efficient graphene as the heat dissipation material, and its thermal conductivity is 3 to 6 times that of traditional heat dissipation materials such as ordinary copper and aluminum, greatly improving the heat conduction efficiency and ensuring the stable operation of the controller under high load.

[0096] Verified by simulation, as Figure 8 shown in Table 1, the flexible heat dissipation structure 100 of the controller of the present invention can improve the heat dissipation capacity of the controller. The specific parameters are as follows: after adding the flexible heat dissipation structure 100 of the controller, the temperature of Chip 1 drops from 123.0 °C to 65.8 °C, a temperature decrease of 46.5%. Compared with the prior art method of directly setting heat conducting foam, the temperature of Chip 1 drops from 72.5 °C to 65.8 °C, with a temperature gain of 6.7 °C.

[0097] Table 1 Temperatures of Each Chip in the Simulation Test

[0098]

[0099] In the present invention, through the flexible heat dissipation film 1, the first heat conducting member 2 and the second heat conducting member 3, the heat generated by the chip 300 is conducted to the housing 200, and the heat is dissipated through the housing 200, shortening the heat transfer path and increasing the heat dissipation area. Using graphene material as the heat conducting medium between the chip 300 and the housing 200, with ultra-high heat conductivity, the heat dissipation efficiency of the controller is improved. In this embodiment, a radiator can also be provided outside the housing 200 to enhance the heat dissipation between the housing 200 and the environment.

[0100] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A flexible heat dissipation structure of a controller, characterized in that: include: A flexible heat dissipation film (1), the flexible heat dissipation film (1) comprising a first plane area (101), a bending area (102) and a second plane area (103) which are sequentially connected along a length direction, the second plane area (103) being suitable for abutting against a housing (200), and the bending angle of the bending area (102) being 0 to 180°; A first heat conducting member (2), wherein the first heat conducting member (2) is arranged between the first plane area (101) and a heat source.

2. The flexible heat dissipation structure of the controller according to claim 1, characterized in that: Also includes: A second heat conducting member (3), wherein the second heat conducting member (3) is arranged between the first plane area (101) and the second plane area (103).

3. The flexible heat dissipation structure of the controller according to claim 1 or 2, characterized in that: The first plane area (101), the bending area (102) and the second plane area (103) include: substrate (104); A graphene layer (105), wherein the graphene layer (105) is disposed on both sides of the substrate (104); A release film (106), wherein the release film (106) is disposed on the graphene layer (105).

4. The flexible heat dissipation structure of the controller according to claim 3, characterized in that: In the first plane area (101) and the second plane area (103), an adhesive layer (107) is provided between the graphene layer (105) and the release film (106).

5. The flexible heat dissipation structure of the controller according to claim 4, characterized in that: The adhesive layer (107) comprises: a single-sided adhesive layer (1071), the single-sided adhesive layer (1071) being arranged between the graphene layer (105) and the release film (106) on a side facing away from the first heat conducting component (2); A double-sided adhesive layer (1072), wherein the double-sided adhesive layer (1072) is arranged between the graphene layer (105) and the release film (106) located on one side of the first heat conducting component (2).

6. The flexible heat dissipation structure of the controller according to claim 1, characterized in that: The flexible heat dissipation film (1) is provided with an edge wrapping at its edge.

7. The flexible heat dissipation structure of the controller according to claim 1, characterized in that: The first plane area (101) and the second plane area (103) are provided with mounting holes (108).

8. The flexible heat dissipation structure of the controller according to claim 1, characterized in that: The first plane area (101) is provided with a positioning mark line (109), and the first heat conducting member (2) is installed on the positioning mark line (109).

9. A method for preparing a flexible heat dissipation structure of a controller, applied to the flexible heat dissipation structure (100) of a controller according to any one of claims 1 to 8, characterized in that: include: Applying a graphene oxide solution on a substrate (104) and drying it to form a graphene oxide film; heating the graphene oxide film to reduce the graphene oxide film to a graphene film; Laminating an adhesive layer (107) to both sides of the graphene film; Laminating the release film (106) to the surface of the adhesive layer (107); Cut the membrane material according to the drawing, perform hemming treatment, open a mounting hole (108) on the membrane material, and set a positioning mark (109) on the first plane area (101); The first heat conducting member (2) is aligned with the positioning mark (109) and fixed.

10. A controller, characterized in that: include: A flexible heat dissipation structure (100) of a controller according to any one of claims 1 to 8; A housing (200), wherein the second plane area (103) abuts against an inner wall of the housing (200); A chip (300), the chip (300) being arranged in the housing (200), the first heat conducting member (2) being in abutment with the chip (300); A PCB board (400), the PCB board (400) is installed in the housing (200), and the chip (300) is installed on the PCB board (400).

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