Printed substrate heat exchanger having improved durability, hydrogen

Abstract

The present invention relates to a printed substrate heat exchanger in which a plurality of plates are stacked and heat of a first fluid and a second fluid is exchanged through mutually different flow channels, and a hydrogen storage device including the same. A printed board heat exchanger for improving durability according to an embodiment of the present invention comprises: a first plate in which a first flow path through which a first fluid passes is formed; and a second plate overlapped with the first plate and formed with a second flow path through which a second fluid passes, the first plate including: a first fluid supply hole for supplying the first fluid to the first flow path; a first fluid discharge hole for discharging the first fluid passing through the first flow path; the first flow channel merging holes are positioned at one end of the first flow channel or are respectively positioned at two ends of the first flow channel, and are used for merging and connecting channels of the first flow channel so as to supply a first fluid to the first flow channel or discharge the first fluid from the first flow channel; and a first fluid dispersion part connecting the first fluid supply hole or the first fluid discharge hole at a position corresponding to the first flow path merging hole and the first flow path merging hole to each other so that the first fluid disperses and moves. Thus, a high volume of the first fluid can be quickly heat exchanged and treated.

Description

Technical Field

[0001] The present invention relates to a printed circuit board type heat exchanger that stacks multiple plates and exchanges heat of a first fluid and a second fluid through flow channels different from each other, a hydrogen storage device including the same, and a hydrogen compression device. Background Art

[0002] Generally, a heat exchanger is a device for heat exchange between a first fluid and a second fluid, and is configured in a form in which flow channels through which the first fluid and the second fluid can pass without mixing with each other are processed on a plate using a press and stacked.

[0003] Since such a plate type heat exchanger has a protruding shape because the flow channels are pressed by a press, it not only has a large volume, but also has a problem of easy leakage in the case of supplying a relatively high-pressure fluid.

[0004] To solve such a problem, "Heat Exchanger" of Japanese Laid-Open Patent Publication No. 2000-161889 (published on June 16, 2000) has been previously disclosed.

[0005] The above heat exchanger is configured in a form in which grooves are formed on the stacked plates without protruding flow channels, and the plates are fully joined, so that leakage can be prevented while supplying a high-pressure fluid.

[0006] However, in the case of a conventional heat exchanger for heat exchanging a high-pressure fluid, since the diameter of the fluid supply channel needs to be reduced, a large amount of fluid cannot be supplied. This not only requires a long heat exchange time, but also has problems of increased weight and volume due to the need to thicken the end plate for finally sealing the fluid supply channel while maintaining the size of the fluid supply channel and supplying a high-pressure fluid.

[0007] In addition, in order to increase the path of the flow channels through which the fluid passes, the flow channels need to be formed in a zigzag shape, and there is a problem of a decrease in heat exchange performance due to heat conduction of the fluid when passing through adjacent flow channels. Summary of the Invention

[0008] (I) Technical Problems to be Solved

[0009] The present invention is proposed to solve the above problems, and the problem to be solved by the present invention is to provide a printed circuit board type heat exchanger with improved durability, a hydrogen storage device including the same, and a hydrogen compression device. Since the first fluid flowing into the first fluid supply hole is dispersed by the fluid dispersion part and moves to the first flow channel merging hole, the first fluid supplied to the first fluid supply hole is dispersed, so that a large amount of the first fluid can be quickly heat-exchanged.

[0010] In addition, an object thereof is to provide a printed circuit board type heat exchanger with improved durability, a hydrogen storage device including the same, and a hydrogen compression device. The diameter of the first flow path merging hole is formed to be larger than the diameter of the first fluid supply hole to increase the connection area of the first flow path, so that a large amount of the first fluid can be supplied to the first flow path.

[0011] In addition, an object thereof is to provide a printed circuit board type heat exchanger with improved durability, a hydrogen storage device including the same, and a hydrogen compression device. Since the first fluid dispersion part and the communication dispersion part are joined to each other and are located at the center of the first fluid supply passage for supplying the first fluid, an effect similar to that of an upright support column is generated at the center of the first fluid supply passage, so that the pressure resistance of the first fluid supply passage can be increased to improve durability.

[0012] In addition, an object thereof is to provide a printed circuit board type heat exchanger with improved durability, a hydrogen storage device including the same, and a hydrogen compression device. The first fluid dispersion part and the communication dispersion part are joined to the end plate so that the central part of the first fluid supply passage is joined to the end plate, preventing the end plate from expanding due to the pressure of the first fluid, so that the volume can be reduced while minimizing the thickness of the end plate for weight reduction.

[0013] In addition, an object thereof is to provide a printed circuit board type heat exchanger with improved durability, a hydrogen storage device including the same, and a hydrogen compression device. A heat insulating part is formed between the first direction part and the second direction part where the flow direction of the first fluid changes in the first flow path to prevent heat conduction between the first fluids, so that the heat exchange performance can be improved.

[0014] In addition, an object thereof is to provide a printed circuit board type heat exchanger with improved durability, a hydrogen storage device including the same, and a hydrogen compression device. A merging hole reinforcing part protrudes in the second flow path merging hole connected to the second flow path and is joined to the first plate, so that the rigidity affected by the formation of the second flow path merging hole with a relatively wide width can be enhanced. Moreover, the second fluid moves between layers through the interlayer connection part of the second fluid through hole, and since the second fluid moves in each second flow path merging hole of the second fluid supply hole and the second fluid discharge hole, a large amount of the second fluid can be easily supplied.

[0015] (II) Technical Solution

[0016] To achieve the above object, a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention includes: a first plate formed with a first flow path through which a first fluid passes; and a second plate overlapping the first plate and formed with a second flow path through which a second fluid passes. The first plate includes: a first fluid supply hole for supplying the first fluid to the first flow path; a first fluid discharge hole for discharging the first fluid that has passed through the first flow path; a first flow path merging hole located at one end of the first flow path or at both ends of the first flow path respectively, for merging and connecting the channels of the first flow path to supply the first fluid to the first flow path or discharge the first fluid from the first flow path; and a first fluid dispersion part for connecting the first fluid supply hole or the first fluid discharge hole at a position corresponding to the first flow path merging hole to the first flow path merging hole, so that the first fluid disperses and moves.

[0017] The diameter of the first flow path merging hole may be larger than the diameter of the first fluid supply hole or the first fluid discharge hole, so that more channels of the first flow path are connected to the first fluid supply hole or the first fluid discharge hole.

[0018] The second plate may include: a communication merging hole overlapping at a position corresponding to the first flow path merging hole, so that the first fluid in the first flow path merging hole passes through the second plate and moves, and the communication merging hole is formed through.

[0019] The first flow path merging hole and the communication merging hole may be located in directions opposite to each other with the first fluid supply hole or the first fluid discharge hole as the center, so that when the first fluid moves through the first plate and the second plate in the stacking direction of the first plate and the second plate, it alternately passes through both sides with the first fluid supply hole or the first fluid discharge hole as the center and moves.

[0020] The second plate may include: a first fluid through hole penetrating the second plate in the stacking direction at positions corresponding to the first fluid supply hole and the first fluid discharge hole, and the first fluid passes through the first fluid through hole; and a communication dispersion part formed between the first fluid through hole and the communication merging hole, so that the first fluid disperses and moves between the first fluid through hole and the communication merging hole.

[0021] The first fluid dispersion part may include: a peripheral dispersion flow path located between the first fluid supply hole and the flow path merging hole or between the first fluid discharge hole and the flow path merging hole, the periphery of the peripheral dispersion flow path being larger than the periphery of the first fluid supply hole or the first fluid discharge hole; an inner connecting flow path connected to the first fluid supply hole or the first fluid discharge hole corresponding to the peripheral dispersion flow path; and an outer connecting flow path connected to the flow path merging hole corresponding to the peripheral dispersion flow path.

[0022] The first flow path or the second flow path may include: a first direction part and a second direction part, which are arranged adjacent to each other and the flow directions of the first fluid or the second fluid are different from each other, and the printed circuit board type heat exchanger includes a heat insulation part that penetrates between the first direction part and the second direction part to block heat between the first direction part and the second direction part.

[0023] The heat insulation part may include: a connection strengthening part formed across the heat insulation part to enhance the rigidity weakened due to the formation of the heat insulation part by penetration.

[0024] The first plate and the second plate may be joined by full surface diffusion bonding with each other.

[0025] One of the first fluid and the second fluid may be a refrigerant, and the other fluid may contain hydrogen cooled by the refrigerant.

[0026] The first flow path or the second flow path may be formed by chemical etching or mechanical grinding on the first plate or the second plate.

[0027] The printed circuit board type heat exchanger with improved durability may include: an end plate that overlaps with the outermost first plate or second plate in a state where the first plate and the second plate overlap to seal the fluid supply hole and the fluid discharge hole, and the end plate may be joined to the first fluid dispersion part to improve the durability of the end plate part corresponding to the first fluid supply hole or the first fluid discharge hole.

[0028] The first plate or the second plate may include perforated weight reduction holes to reduce weight.

[0029] The first plate and the second plate may include: rod mounting holes, and in a state where the first plate and the second plate are stacked on each other, a fixing rod is inserted and fixed in the rod mounting holes.

[0030] The printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention includes: a first plate formed with a first flow path through which a first fluid passes; and a second plate overlapping the first plate and formed with a second flow path through which a second fluid passes. The second plate includes: a second flow path merging hole communicating and connecting the channels of the second flow path; a second fluid supply hole for supplying the second fluid and a second fluid discharge hole for discharging the second fluid, which are separately provided at the second flow path merging holes located at both ends of the second flow path, the second fluid supply hole for supplying the second fluid, and the second fluid discharge hole for discharging the second fluid; and a merging hole reinforcing portion protruding toward the second flow path merging hole and engaging with the first plate to enhance the rigidity affected by the formation of the second flow path merging hole. The first plate includes: second fluid through holes respectively located at positions corresponding to the second fluid supply hole and the second fluid discharge hole, and the second fluid passes through the second fluid through holes; and an interlayer connection portion extending from the second fluid through holes, connecting to the second flow path merging hole corresponding to the second fluid supply hole, and connecting to the second flow path merging hole corresponding to the second fluid discharge hole, so that the second fluid moves between layers and passes through in large quantities.

[0031] The hydrogen storage device including the printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention includes: the printed circuit board type heat exchanger with improved durability according to the above embodiment; and a hydrogen tank, where hydrogen is cooled by the printed circuit board type heat exchanger and filled into the hydrogen tank, or the filled hydrogen is supplied to be cooled by the printed circuit board type heat exchanger.

[0032] The hydrogen compression device including the printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention includes: the printed circuit board type heat exchanger with improved durability according to the above embodiment; and a compressor that receives and compresses hydrogen cooled by the printed circuit board type heat exchanger, or compresses and supplies hydrogen to the printed circuit board type heat exchanger.

[0033] (III) Advantageous Effects

[0034] According to the present invention, the first fluid supplied to the first fluid supply hole is provided to the first flow path merging hole through the fluid dispersion portion, so as to disperse the first fluid to the fluid supply hole and the first flow path merging hole for supply, thereby enabling a large amount of rapid heat exchange of the first fluid.

[0035] In addition, the diameter of the first flow path merging hole connected to the first flow path is formed to be larger than the diameter of the first fluid supply hole to increase the connection area with the first flow path, so that rapid heat exchange can be performed by supplying a large amount of the first fluid to the first flow path.

[0036] In addition, in the central portion of the first fluid supply passage, a first fluid dispersion portion or a communication dispersion portion is joined to produce an effect like an upright support column in the center of the first fluid supply passage, thereby improving the durability of the first fluid supply passage.

[0037] In addition, the first fluid dispersion portion or the communication dispersion portion is joined to the end plate such that the central portion of the first fluid supply passage is joined to the end plate to prevent the end plate from expanding due to the pressure of the first fluid, thereby enabling weight reduction and volume reduction by reducing the thickness of the end portion.

[0038] In addition, a heat insulation portion is formed through between a first direction portion and a second direction portion where the flow direction of the first fluid changes in the first flow passage to prevent heat conduction between the first fluids passing adjacent to each other in the first flow passage, thereby improving heat exchange performance.

[0039] In addition, a merging hole reinforcing portion is formed to protrude in a second flow passage merging hole connected to the second flow passage and joined to the first plate. Thus, not only can the rigidity affected by the formation of the second flow passage merging hole with a relatively wide width be enhanced, but also the second fluid moves between layers through the interlayer connection portion of the second fluid through holes, and since the second fluid moves in each second flow passage merging hole of the second fluid supply hole and the second fluid discharge hole, a large amount of the second fluid can be easily supplied. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is an exploded perspective view of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention, partially disassembled.

[0041] Figure 2 is a plan view of a first plate of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention.

[0042] Figure 3 is a plan view of a second plate of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention.

[0043] Figure 4 is a perspective view showing a portion where a first fluid supply hole and a first fluid through hole of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention are located.

[0044] Figure 5 is a plan view showing a portion where a first fluid supply hole and a first fluid through hole of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention are located.

[0045] Figure 6 is a side cross-sectional view showing a portion where a first fluid supply hole and a first fluid through hole of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention are located.

[0046] Figure 7 It is a plan view showing a portion where a second fluid supply hole and a second fluid through-hole of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention are located.

[0047] Figure 8 It is a side sectional view showing a portion where a second fluid supply hole and a second fluid through-hole of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention are located. Detailed Description

[0048] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0049] As Figure 1 and Figure 2 shown, a printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention may include a first plate 110.

[0050] The first plate 110 and the second plate 120 may be alternately laminated with each other to form the heat exchanger 100, and an intermediate plate for expanding the area of the first flow path 111 or the second flow path 121 formed respectively may be further provided between the first plate 110 and the second plate 120.

[0051] The first plate 110 is formed as a flat plate, and a first flow path 111 through which a first fluid passes may be formed.

[0052] Among them, the first fluid or the second fluid may be a gas or a liquid. In the embodiment, although it is described that the first fluid is hydrogen and the second fluid is a heat medium for cooling hydrogen, it may also be that the first fluid is a heat medium and the second fluid is hydrogen.

[0053] Of course, the heat medium can cool or heat hydrogen according to the temperature.

[0054] The first plate 110 may be formed of a metal material having excellent heat exchange properties, and the first plate 110 may be formed of a material having excellent heat exchange properties and having tolerance such as corrosion resistance and hydrogen embrittlement resistance to the fluid passing through the first flow path 111.

[0055] The first flow path 111 formed in the first plate 110 may be formed in a shape of a groove formed on one surface of the first plate 110, and the flow path of the first plate 110 may be formed by chemical etching or mechanical polishing.

[0056] Among them, when the first flow path 111 is formed in the first plate 110 by chemical etching or mechanical polishing, since relatively fine flow paths can be formed, the heat exchange property between the fluids exchanging heat with each other can be improved.

[0057] The first flow channel 111 can be configured in a form where multiple channels are arranged side by side, enabling the first fluid to move dispersedly along multiple paths.

[0058] In the first plate 110, the first flow channel 111 can be formed in a zigzag shape to increase the distance that the first fluid passes through and undergoes heat exchange. Moreover, the first flow channel 111 can be continuously and alternately formed with a first direction portion 111a and a second direction portion 111b that are formed in a zigzag shape and have relatively different flow directions of the first fluid.

[0059] In the first plate 110, a heat-insulating heat insulation portion 119 can be formed to penetrate between the first direction portion 111a and the second direction portion 111b, so as to block the temperature of the first fluid passing through the first direction portion 111a from being transferred to the first fluid passing through the adjacent second direction portion 111b.

[0060] For example, when the first direction portion 111a and the second direction portion 111b in the first flow channel 111 are arranged adjacent to each other, if the heat of the first fluid passing through the first direction portion 111a is transferred to the second direction portion 111b, or the heat of the second direction portion 111b is transferred to the first direction portion 111a, since the heat exchange performance of the first fluid that needs to move a relatively long distance for heat exchange will decrease, the heat insulation portion 119 will cut between the adjacent first direction portion 111a and second direction portion 111b for heat insulation in order to minimize heat conduction between them.

[0061] A connection strengthening portion 119a can be formed across the heat insulation portion 119 to improve the durability of the first plate 110 affected by the formation of the penetrating heat insulation portion 119.

[0062] The connection strengthening portions 119a can be formed in multiple numbers on the insulation portion 119 in a form that divides the heat insulation portion 119 into multiple parts.

[0063] At each corner portion of the first plate 110, rod mounting holes 116 for inserting fixing rods for fixing the first plate 110 and the second plate 120 in a repeatedly stacked state can be formed to penetrate.

[0064] By inserting the fixing rods into the rod mounting holes 116 to press and fix the first plate 110 and the second plate 120 in the direction of stacking with each other, it is possible to prevent the first plate 110 and the second plate 120 from separating in the stacked state.

[0065] The first plate 110 can include a first fluid supply hole 112 and a first fluid discharge hole 113.

[0066] The first fluid supply hole 112 is formed through one end portion of the first flow channel 111, and can supply the first fluid to the first flow channel 111 when supplying the first fluid.

[0067] The first fluid discharge hole 113 is located at the other end of the first flow channel 111 in a direction opposite to the direction of the one end portion of the first flow channel 111 where the first fluid supply hole 112 is located, so that the first fluid supplied to the first flow channel 111 for heat exchange can be discharged.

[0068] As Figure 2 、 Figures 4 to 6 shown, the first plate 110 may include a first flow channel merging hole 114 and a first fluid dispersion part 115.

[0069] The first flow channel merging hole 114 may be formed through the first plate 110 at one end and the other end of the first flow channel 111 to disperse the first fluid and disperse it to each channel of the first flow channel 111, or may converge the first fluid passing through each channel of the first flow channel 111.

[0070] For example, the first flow channel merging hole 114 disposed near the first fluid supply hole 112 is connected to one end of the first flow channel 111, so that the first fluid supplied to the first fluid supply hole 112 moves through the first flow channel merging hole 114, and the first fluid can be dispersed and supplied from the first flow channel merging hole 114 to each channel of the first flow channel 111. The first flow channel merging hole 114 disposed near the first fluid discharge hole 113 is connected to the other end of the first flow channel 111, so that after the first fluid passing through each channel of the first flow channel 111 converges and moves to the first flow channel merging hole 114, the first fluid in the first flow channel merging hole 114 can move to the first fluid discharge hole 113 again and be discharged through the first fluid discharge hole 113.

[0071] Among them, when supplying a high-pressure first fluid to the first fluid supply hole 112, it is difficult to form a relatively large first fluid supply hole 112 for durability. Therefore, since a large amount of the first fluid cannot be supplied to the first flow channel 111, there is a problem of reduced heat exchange performance.

[0072] Therefore, in the present invention, by forming the first flow channel merging hole 114 at a position adjacent to the first fluid supply hole 112, the space capable of supplying the first fluid to the first flow channel 111 is enlarged, so that a large amount of the first fluid can be supplied to the first flow channel 111 compared with the relatively small first fluid supply hole 112, thereby improving the heat exchange performance while preventing a decrease in durability.

[0073] In addition, by increasing the impedance of the movement of the first fluid through the first fluid dispersion part 115 and the communication dispersion part 127, the pressure of the first fluid passing through the first flow path merging hole 114 and the communication merging hole 126 can be reduced, thereby improving durability.

[0074] On the other hand, the first flow path merging hole 114 may have a diameter larger than that of the first fluid supply hole 112 or the first fluid discharge hole 113 to disperse and supply more of the first fluid to the first fluid supply hole 112, or discharge more fluid in the first fluid discharge hole 113, and the first fluid discharge hole 113 may be formed in an arc shape on the concentric circle of the first fluid discharge hole 113 and the first fluid supply hole 112.

[0075] Among them, when supplying a high-pressure first fluid, since only relatively small diameters of the first fluid supply hole 112 and the first fluid discharge hole 113 can be formed, it is difficult to connect the channels of a relatively large number of first flow paths 111. However, since the diameter of the first flow path merging hole 114 is larger than that of the first fluid supply hole 112 or the first fluid discharge hole 113, the channels of a relatively large number of first flow paths 111 can be connected, thereby supplying a large amount of the first fluid.

[0076] The first fluid dispersion part 115 may be respectively formed between the first fluid supply hole 112 and the adjacent first flow path merging hole 114 and between the first fluid discharge hole 113 and the adjacent first flow path merging hole 114, so that the fluid supplied to the first fluid supply hole 112 is dispersed and supplied to the first flow path merging hole 114, or the first fluid discharged from the first flow path 111 to the first flow path merging hole 114 is converged and supplied to the first fluid discharge hole 113.

[0077] The first fluid dispersion part 115 may radially disperse the first fluid supplied to the first fluid supply hole 112 and supply it to the first flow path merging hole 114 located at one end of the first flow path 111, or may converge the first fluid that has undergone heat exchange through the first flow path 111 in the first flow path merging hole 114 located at the other end of the first flow path 111, and then converge the first fluid in the first flow path merging hole 114 again and supply it to the first fluid discharge hole 113.

[0078] In the embodiment, it is described that the first fluid dispersion part 115 is simultaneously formed between the first flow path merging hole 114 and the first fluid supply hole 112 located at one end of the first flow path 111 and between the first flow path merging hole 114 and the first fluid discharge hole 113 located at the other end of the first flow path 111, but it may also be formed only at one of the two locations.

[0079] The first fluid dispersion unit 115 can disperse at a time difference and supply the first fluid from the first fluid supply hole 112 to the first flow path merging hole 114 located at one end of the first flow path 111, or can converge the first fluid discharged from the first flow path merging hole 114 at the other end of the first flow path 111 at a time difference and supply it to the first fluid discharge hole 113.

[0080] As Figure 4 and Figure 5 shown, the first fluid dispersion unit 115 can include a peripheral dispersion flow path 115a, an inner connection flow path 115b, and an outer connection flow path 115c.

[0081] The peripheral dispersion flow path 115a can be formed in the shape of a circular groove to have a larger diameter than the first fluid supply hole 112 or the first fluid discharge hole 113.

[0082] The inner connection flow path 115b can connect the first fluid supply hole 112 or the first fluid discharge hole 113 where the peripheral dispersion flow path 115a is formed and the peripheral dispersion flow path 115a at the corresponding position to supply the fluid supplied to the first fluid discharge hole 113 to the first fluid supply hole 112, or converge the fluid in the peripheral dispersion flow path 115a and supply it to the first fluid discharge hole 113.

[0083] The inner connection flow path 115b can be formed in the shape of a plurality of straight grooves radially formed on the inner circumference of the peripheral dispersion flow path 115a.

[0084] The outer connection flow path 115c can connect the peripheral dispersion flow path 115a and the first flow path merging hole 114 adjacent to the peripheral dispersion flow path 115a to supply the first fluid dispersed from the peripheral dispersion flow path 115a to the first flow path merging hole 114, or supply the first fluid in the first flow path merging hole 114 to the peripheral dispersion flow path 115a.

[0085] The outer connection flow path 115c can also be formed in the shape of a plurality of straight grooves radially formed on the outer circumference of the peripheral dispersion flow path 115a.

[0086] At this time, a plurality of the inner connection flow path 115b or the outer connection flow path 115c can also be provided only within a preset angular range on the inner circumference or the outer circumference of the peripheral dispersion flow path 115a.

[0087] The first flow path 111 can include a connection flow path portion 111c.

[0088] The connection flow path portion 111c can supply the fluid flowing into the first flow path merging hole 114 to each channel of the first flow path 111 with equal pressure, or can connect a plurality of channels so that the fluid discharged from each channel of the first flow path 111 can be supplied to the first flow path merging hole 114 with equal pressure.

[0089] The connecting flow path portion 111c can be formed in a shape of a groove that linearly spans multiple channels between the first flow path merging hole 114 located at one end portion of the first flow path 111 and the first flow path 111, and between the first flow path merging hole 114 located at the other end portion of the second flow path 121 and the first flow path 111.

[0090] In the first plate 110, a weight reducing hole that penetrates an unused portion of the first plate 110 to reduce weight can be formed.

[0091] When the area of the weight reducing hole is relatively wide, a reinforcing connecting portion that spans the weight reducing hole can also be formed to enhance rigidity.

[0092] As Figure 1 and Figure 3 shown, the printed circuit board type heat exchanger 100 for improving durability according to the present invention may include a second plate 200.

[0093] The second plate 200 can be formed as a flat plate having a size corresponding to that of the first plate 100, and a second flow path 121 through which a second fluid passes can be formed.

[0094] Wherein, the second fluid can be a gas or a liquid, and the second fluid can be a heat exchange medium that is preheated or cooled to cool or heat the first fluid.

[0095] The second plate 120 can be formed of a metal material having excellent heat exchange properties, and the second plate 120 can be formed of a material having excellent heat exchange properties and having tolerance such as corrosion resistance and hydrogen embrittlement resistance to the fluid passing through the second flow path 121.

[0096] The second flow path 121 formed in the second plate 120 can be formed in a shape of a groove formed on one surface of the second plate 120, and the flow path of the second plate 120 can be formed by chemical etching or mechanical polishing.

[0097] Wherein, when the second flow path 121 is formed by chemical etching or mechanical polishing on the second plate 120, since relatively fine flow paths can be formed, the heat exchange performance between the fluids exchanging heat with each other can be improved.

[0098] The second flow path 121 can be configured in a form in which multiple channels are arranged side by side, so that the second fluid can move dispersedly in multiple paths.

[0099] In the second plate 120, the second flow path 121 can be formed in a zigzag shape to increase the distance through which the second fluid passes and exchanges heat with the first fluid, and the second flow path 121 can be continuously and alternately formed with a first direction portion 121a and a second direction portion 121b that are formed in a zigzag shape and have relatively different flow directions of the second fluid.

[0100] At this time, a second flow path 121 may be formed in the second plate 120 to have a position and a corresponding path corresponding to the first flow path 111.

[0101] In the second plate 120, a thermally insulated thermal insulation portion 129 may be formed therethrough between the first direction portion 121a and the second direction portion 121b to block the temperature of the second fluid passing through the first direction portion 121a from being transferred to the second fluid passing through the adjacent second direction portion 121b.

[0102] For example, when the first direction portion 121a and the second direction portion 121b in the second flow path 121 are disposed adjacent to each other, if the heat of the first fluid passing through the first direction portion 121a is transferred to the second direction portion 121b, or the heat of the second direction portion 121b is transferred to the first direction portion 121a, since the heat exchange performance of the first fluid that needs to exchange heat by moving a relatively long distance will decrease, the thermal insulation portion 129 will cut between the adjacent first direction portion 121a and second direction portion 121b to insulate heat in order to minimize heat conduction between the adjacent first direction portion 121a and second direction portion 121b.

[0103] A connection reinforcing portion 129a may be formed across the thermal insulation portion 129 to improve the durability of the second plate 120 caused by the formation of the thermally insulated thermal insulation portion 129 formed therethrough.

[0104] The connection reinforcing portions 129a may be formed in plurality on the insulation portion 129 in a form that divides the thermal insulation portion 129 into a plurality of parts.

[0105] In each corner portion of the second plate 120, a rod mounting hole 128 through which a fixing rod for fixing the first plate 110 and the second plate 120 in a repeatedly stacked state is inserted may be formed therethrough.

[0106] By inserting the fixing rod into the rod mounting hole 128, the first plate 110 and the second plate 120 are pressed and fixed in the stacking direction of each other, thereby preventing the first plate 110 and the second plate 120 from separating in the stacked state.

[0107] The second plate 120 may include a second fluid supply hole 123 and a second fluid discharge hole 124.

[0108] The second fluid supply hole 123 is formed therethrough at one end portion of the second flow path 121, and may supply the second fluid to the second flow path 121 when supplying the second fluid.

[0109] The second fluid discharge hole 124 is located at the other end of the second flow path 121, which is in the direction opposite to that of one end portion of the second flow path 121 where the second fluid supply hole 123 is located, so that the second fluid supplied to the second flow path 121 for heat exchange can be discharged.

[0110] The second plate 120 may include a second flow path merging hole 122.

[0111] The second flow path merging holes 122 are respectively located at both ends of the second flow path 121, and may merge and connect a plurality of channels through which the second fluid passes in the second flow path 121.

[0112] At positions adjacent to the second flow path merging holes 122 located at both ends of the second flow path 121, the second fluid supply hole 123 and the second fluid discharge hole 124 may be adjacently provided.

[0113] On the other hand, at positions corresponding to the second fluid supply hole 123 and the second fluid discharge hole 124 in the first plate 110, a second fluid through hole 117 through which the second fluid passes along the stacking direction of the first plate 110 and the second plate 120 may be formed therethrough.

[0114] At this time, in the second fluid through hole 117, in a state where the second plate 120 is stacked on the first plate 110, the second flow path merging hole 122 adjacent to the second fluid supply hole 123 and the second fluid supply hole 123 are overlapped and connected, and the second flow path merging hole 122 adjacent to the second fluid discharge hole 124 and the second fluid discharge hole 124 are overlapped and connected, so that an interlayer connection portion 117a can be formed.

[0115] For example, the second fluid supplied to the second fluid supply hole 123 may enter the second flow path 121 through the interlayer connection portion 117a formed in the second fluid through hole 117 of the first plate 110 and through the second flow path merging hole 122, and the second fluid passing through the second flow path 121 may pass through the interlayer connection portion 117a formed in the second fluid through hole 117 of the first plate 110 from the second flow path merging hole 122 and be discharged through the second fluid discharge hole 124.

[0116] In this way, the fluid supplied to the second fluid supply hole 123 enters the second flow path 121 while moving between the first plate 110 and the second plate 120, and the fluid passing through the second flow path 121 moves between the first plate 110 and the second plate 120 again to be discharged from the second fluid discharge hole 124, so that a large amount of the second fluid can be supplied to the second flow path 121, and the heat loss caused by the second fluid being unable to enter the second flow path and being discarded can be minimized.

[0117] In addition, the second flow path merging hole 122 may include a merging hole reinforcing portion 122a.

[0118] The merging hole reinforcing part 122a protrudes inwardly from the second flow path merging hole 122 so that the first plate 110 and the merging hole reinforcing part 122a are joined to each other, thereby enhancing the rigidity of the second flow path merging hole 122 formed in a relatively large size through which a large amount of second fluid passes through the second flow path 121, and improving durability.

[0119] At this time, since the merging hole reinforcing part 122a forms a shape similar to forming a pillar inside the second flow path merging hole 122 when joined to the first plate 110, a second flow path merging hole 122 of a relatively large size can be manufactured through which a large amount of second fluid passes.

[0120] In addition, in the first plate 110, at positions corresponding to the second flow path merging holes 122 at both ends of the second flow path 121, an interlayer through hole 118 can be formed to directly supply the second fluid to the second flow path merging hole 122 located in an adjacent other layer without passing through the second fluid supply hole 123 or the second fluid discharge hole 124.

[0121] Among them, the interlayer through hole 118 directly transfers the second fluid to the second flow path merging hole 122 of the second plate 120 located in an adjacent layer without allowing the second fluid to pass through the second fluid supply hole 123 or the second fluid discharge hole 124, and provides paths through which the second fluid can enter the second flow path 121 in various forms, thereby improving the uniformity of the temperature to be heat-exchanged.

[0122] As Figure 4 and Figure 6 shown, the second plate 120 may include a first fluid through hole 125, a communication merging hole 126, and a communication dispersion part 127.

[0123] The first fluid through hole 125 is formed through the second plate 120 at positions corresponding to the second fluid supply hole 123 and the second fluid discharge hole 124, so that the second fluid supplied to the second fluid supply hole 123 of the second plate 120 can pass through the first plate 110 and move to the second fluid supply hole 123 of the adjacent second plate 120, and the second fluid discharged from the second fluid discharge hole 124 passes through the first plate 110 and moves to the second fluid discharge hole 124 of the adjacent second plate 120.

[0124] The communication merging hole 126 can be formed through the second plate 120 around the first fluid through hole 125, and the communication merging hole 126 partially overlaps with the first flow path merging hole 114 of the first plate 110, so that the first fluid in the first flow path merging hole 114 can directly move to the first flow path merging hole 114 of the adjacent first plate 110 through the communication merging hole 126 without passing through the first fluid supply hole 112 or the first fluid discharge hole 113.

[0125] The communication and merging holes 126 may be formed in a part of the periphery of the first fluid through-hole 125, and the communication and merging holes 126 may be formed in an arc shape on a concentric circle of the first fluid through-hole 125.

[0126] The communication and merging holes 126 may be formed in a direction opposite to the direction in which the first flow path merging hole 114 is located, centered on the first fluid supply hole 112 or the first fluid discharge hole 113, so that when the first fluid moves between the first plate 110 and the second plate 120, it moves alternately on both sides centered on the first fluid supply hole 112 or the first fluid discharge hole 113.

[0127] Among them, since the communication and merging holes 126 and the first flow path merging hole 114 are alternately located on both sides centered on the first fluid discharge hole 113 or the first fluid supply hole 112 so that the first fluid passes alternately, not only can a larger amount of the first fluid be supplied by dispersing the supply of the first fluid, but also since the first fluid can engage with its peripheral part when passing through, the durability against the pressure of the high-pressure first fluid can be improved.

[0128] At this time, the first plate 110 and the second plate 120 may be joined by diffusion bonding, or may also be joined by welding or soldering.

[0129] The communication and dispersion part 127 may disperse the first fluid passing through the first fluid through-hole 125 to the communication and merging holes 126.

[0130] Similar to the first fluid dispersion part 115 formed in the first plate 110, the communication and dispersion part 127 may include a peripheral dispersion flow path 127a, an inner connection flow path 127b, and an outer connection flow path 127c, and the peripheral dispersion flow path 127a may be located in a groove shape between the first fluid through-hole 125 and the communication and merging holes 126, the inner connection flow path 127b may be on the inner circumference of the peripheral dispersion flow path 127a and radially connect a plurality of first fluid through-holes 125 in a straight groove shape, and the outer connection flow path 127c may be on the outer circumference of the peripheral dispersion flow path 127a and a plurality of them are connected in a straight groove shape toward the communication and merging holes 126.

[0131] The first fluid in the first fluid through-hole 125 may move to the peripheral dispersion flow path 127a through the inner connection flow path 127b, and the first fluid in the peripheral dispersion flow path 127a may move to the communication and merging holes 126 through the outer connection flow path 127c, and thus move to the first flow path merging hole 114 of the first plate 110 overlapping the second plate 120, or the first fluid located in the communication and merging holes 126 may sequentially pass through the outer connection flow path 127c, the peripheral dispersion flow path 127a, and the inner connection flow path 127b and move to the first fluid through-hole 125.

[0132] In an embodiment, the communication and dispersion part 127 is respectively formed in the first fluid through-hole 125 corresponding to the first fluid supply hole 112 and the first fluid through-hole 125 corresponding to the first fluid discharge hole 113, but it may also be formed only on one of them.

[0133] In the second plate 120, a weight reduction hole may also be formed through the unused portion to reduce the weight of the second plate 120, and the weight reduction hole may be formed in a size and position corresponding to the weight reduction hole formed on the first plate 110.

[0134] As Figure 1 and Figure 6 shown, the printed circuit board type heat exchanger 100 for improving durability according to an embodiment of the present invention may include an end plate 130 and a header plate 140.

[0135] The end plate 130 may overlap with the outermost first plate 110 or second plate 120 among the plurality of alternately stacked first plates 110 and second plates 120 to seal the holes formed through the first plate 110 and the second plate 120, such as the first fluid supply hole 112, the first fluid discharge hole 113, the second fluid through-hole 117, the weight reduction holes 116a, 128a, the interlayer through-hole 118, the second fluid supply hole 123, the second fluid through-hole 117, the first fluid through-hole 125, the communication and merging hole 126, etc., and then finish.

[0136] The end plate 130 may have a size and shape corresponding to the first plate 110 and the second plate 120, and the end plate 130 may be formed of a material that is resistant to the first fluid or the second fluid.

[0137] The header plate 140 may overlap with the outside in the direction opposite to the outside where the end plate 130 is located in a state where a plurality of first plates 110 and second plates 120 are alternately stacked.

[0138] The header plate 140 may include: a first fluid supply pipe portion 141 for connecting a supply pipe that supplies the first fluid to the first fluid supply hole 112; a first fluid discharge pipe portion 142 for connecting a discharge pipe that discharges the first fluid discharged from the first fluid discharge hole to the outside; a second fluid supply pipe portion 143 for connecting a supply pipe that supplies the second fluid to the second fluid supply hole 123; and a second fluid discharge pipe portion 144 for connecting a discharge pipe that discharges the second fluid discharged from the second fluid discharge hole to the outside.

[0139] At this time, a part of the first fluid supply pipe portion 141, the first fluid discharge pipe portion 142, the second fluid supply pipe portion 143, and the second fluid discharge pipe portion 144 may be formed in the header plate 140, and the remaining part may also be formed in the end plate 130.

[0140] On the other hand, the end plate 130 and the head plate 140 can be joined in a state where a plurality of first plates 110 and second plates 120 are stacked, in a state of being stacked on the outermost sides respectively, and diffusion bonding can be used for joining.

[0141] At this time, since it is joined to the communication dispersion part 127 of the first plate 110 or the second plate 120 that is adjacent to and overlaps the end plate 130 or the head plate 140, or the first fluid dispersion part 115, even if relatively high-pressure first fluid is supplied, it is possible to improve durability by preventing the end plate 130 or the head plate 140 from expanding due to the pressure of the first fluid.

[0142] As described above, since the end plate 130 or the head plate 140 is joined to the communication dispersion part 127 located around the first fluid through-hole 125 or the first fluid dispersion part 115 located around the first fluid supply hole 112, the joining area between them increases. Therefore, even if high-pressure first fluid is supplied to the first fluid supply hole 112, it is possible to prevent the end plate 130 or the head plate 140 from deforming.

[0143] The functions and effects between the above-described respective structures will be described.

[0144] In the printed circuit board type heat exchanger 100 for improving durability according to an embodiment of the present invention, on the first plate 110, a first fluid supply hole 112 through which the first fluid flows in is formed through, and a first fluid discharge hole 113 for discharging the inflowing first fluid is formed through.

[0145] A first flow path 111 through which the first fluid passes and exchanges heat, which is bent in a zigzag shape, is formed between the first fluid supply hole 112 and the first fluid discharge hole 113, and first flow path merging holes 114 are formed at positions near the first fluid supply hole 112 and the first fluid discharge hole 113 at both ends of the first flow path 111.

[0146] Each first flow path merging hole 114 merges and connects the channels of the first flow path 111, and the first flow path merging holes 114 are formed through the first plate 110.

[0147] In the first flow path 111, between a first direction part 111a and a second direction part 111b in which the directions of the first fluid passing through are different from each other, a heat insulation part 119 that blocks heat transfer between them is formed through, and the heat insulation parts 119 are connected by a connection strengthening part 119a to prevent a decrease in durability due to the heat insulation part 119.

[0148] The first runner merging hole 114 and the first fluid supply hole 112 at one end of the first runner 111 are adjacent to each other. The first runner merging hole 114 and the first fluid discharge hole 113 at the other end of the first runner 111 are arranged adjacent to each other. And between the first fluid supply hole 112 and the adjacent first runner merging hole 114 at one end of the first runner 111, or between the first fluid discharge hole 113 and the adjacent first runner merging hole 114 at the other end of the first runner 111, a first fluid dispersion part 115 for dispersing the first fluid is respectively formed.

[0149] In addition, rod mounting holes 116 can be formed through each corner part of the first plate 110. And at positions corresponding to the second fluid supply hole 123 of the second plate 120 and each position corresponding to the second fluid discharge hole 124 in the first plate 110, second fluid through holes 117 for the second fluid to pass through the layers are formed.

[0150] In the second fluid through hole 117, an interlayer connection part 117a is formed to expand the second fluid through hole 117 to overlap with the second runner merging hole 122 and connect the fluid flowing into the second fluid through hole 117 to the second runner merging hole 122 of the second plate 120.

[0151] In the first plate 110, at a position corresponding to the second runner merging hole 122 of the second plate 120, an interlayer through hole 118 through which the second fluid supplied to the second runner merging hole 122 passes through the first plate 110 is formed through.

[0152] In the first plate 110, weight reducing holes 116a for reducing the weight of the first plate 110 are formed through. And at each corner, rod mounting holes 116 for a fixing rod that penetrates and fastens to fix in a state where a plurality of first plates 110 and second plates 120 are alternately stacked are formed.

[0153] In the second plate 120, a second fluid supply hole 123 for supplying the second fluid is formed through. And a second fluid discharge hole 124 for discharging the second fluid is formed through, separated from the second fluid supply hole 123. And a zigzag second runner 121 through which the second fluid passes is formed between the second fluid supply hole 123 and the second fluid discharge hole 124.

[0154] At both ends of the second runner 121, second runner merging holes 122 for dispersedly supplying the second fluid to each channel of the second runner 121 can be provided.

[0155] Between the first direction portion 121a and the second direction portion 121b where the flow of the fluid in the second flow path 121 changes, a heat insulation portion 129 for blocking heat transfer may be formed, and a connection strengthening portion 129a for enhancing rigidity may be formed between the heat insulation portions 129.

[0156] At positions of the second plate 120 corresponding to the first fluid supply hole 112 and the second fluid discharge hole 113, first fluid through holes 125 through which the first fluid passes are formed therethrough. Communication and merging holes 126 for dispersing the first fluid are formed therethrough around each of the first fluid through holes 125, and a communication and dispersion portion 127 for dispersing the fluid in the first fluid through holes 125 and supplying it to the communication and merging holes 126, or for converging the fluid from the communication and merging holes 126 and supplying it to the first fluid through holes 125 is formed between the communication and merging holes 126 and the first fluid through holes 125.

[0157] Weight reduction holes 128a for reducing the weight of the second plate 120 are also formed therethrough in the second plate 120, and rod mounting holes 128 through which a fixing rod passes and is inserted are formed therethrough at positions corresponding to the rod mounting holes 116 of the first plate 110.

[0158] The end plate 130 may overlap with the outermost first plate 110 or second plate 120 in a state where a plurality of first plates 110 and second plates 120 are alternately stacked, so as to prevent the first fluid and the second fluid from leaking to the outside, and the head plate 140 may overlap on the outside in the opposite direction to where the end plate 130 is located.

[0159] The head plate 140 may include: a first fluid supply pipe portion 141 that selectively supplies the first fluid to the first fluid supply hole 112 as needed; a first fluid discharge pipe portion 142 that discharges the first fluid discharged from the first fluid discharge hole 113 to the outside; a second fluid supply pipe portion 143 that supplies the second fluid to the second fluid supply hole 123; and a second fluid discharge pipe portion 144 that discharges the second fluid discharged from the second fluid discharge hole 124 to the outside.

[0160] The printed circuit board type heat exchanger 100 for improving durability according to an embodiment of the present invention configured as described above alternately stacks the first plates 110 and the second plates 120, the end plate 130 is stacked on the outermost first plate 110 and second plate 120 in the stack, and the head plate 140 is stacked on the outermost first plate 110 and second plate 120 in the other outermost position.

[0161] In this state, in order to join each of the first plates 110 and the second plates 120, for example, a press or an isostatic pressing device is used to apply pressure so that the first plates 110 and the second plates 120 are diffusion bonded.

[0162] When diffusion - joining the first plate 110 and the second plate 120, diffusion - joining can be performed in a state where the head plate 140 is not stacked, and then the head plate 140 can be stacked and joined, or after stacking all the end plates 130 and the head plate 140, diffusion - joining can be performed together.

[0163] When the first plate 110 and the second plate 120 are joined, in a state where the fixing rod is passed through and inserted into the rod mounting holes 116 and 128, the first plate 110 and the second plate 120 are fixed in a stacked state in a form where a nut is tightened to the fixing rod.

[0164] Of course, the fixing rod can also pass through the end plate 130 and the head plate 140 and be fixed by the fixing rod together with the stacked first plate 110 and second plate 120.

[0165] On the other hand, when the first plate 110 and the second plate 120 are stacked, the first fluid supply holes 112 and the first fluid through - holes 125 that are alternately arranged penetrate in the overall stacking direction to form a first fluid supply channel 151 for supplying the first fluid, and the first fluid discharge holes 113 and the corresponding first fluid through - holes 125 that are alternately arranged penetrate in the overall stacking direction to form a first fluid discharge channel 152 for discharging the first fluid.

[0166] At this time, in the first fluid supply channel 151, the first fluid dispersion part 115 and the communication dispersion part 127 around the first fluid supply hole 112 are joined to each other, and around it, the first flow - path merging holes 114 and the communication merging holes 126 are alternately formed to penetrate in the stacking direction.

[0167] In addition, in the second fluid discharge channel 154, the first fluid dispersion part 115 and the communication dispersion part 127 around the first fluid discharge hole are joined to each other, and around it, the first flow - path merging holes 114 and the communication holes are alternately formed to penetrate in the stacking direction.

[0168] As described above, since the first fluid supply channel 151 and the second fluid discharge channel 154 are provided with the first fluid supply holes 112 and the first fluid discharge holes 113 in the form of columns in each channel, the durability against the high - pressure first fluid can be improved.

[0169] In addition, through the second fluid through - holes 117 corresponding to the second fluid supply holes 123, they penetrate in the overall stacking direction to form a second fluid supply channel 153 for supplying the second fluid, and through the second fluid through - holes 117 corresponding to the second fluid discharge holes 124, they penetrate in the overall stacking direction to form a second fluid discharge channel 154 for discharging the second fluid.

[0170] The durability - enhanced printed circuit board - type heat exchanger 100 according to an embodiment of the present invention configured as such, when the first fluid is supplied through the first fluid discharge pipe portion 142 formed in the header plate 140, the first fluid flows into the first fluid supply passage 151 composed of the first fluid supply holes 112 and the first fluid through - holes 125. The first fluid flowing into the first fluid supply passage 151 moves through the first fluid dispersion portion 115 in the first fluid supply holes 112 formed on each first plate 110 to the first fluid merging hole 114 connected to one end of the first flow channel 111 (refer to Figure 4 )

[0171] A part of the first fluid that has moved to the first fluid merging hole 114 moves between the first plate 110 and the second plate 120 in a form that moves through the communication merging hole 126 formed in the second plate 120 to the first flow channel merging holes 114 of the first plates 110 located above and below it for supply. The remaining first fluid disperses into each channel of the first flow channel 111 from the first flow channel merging hole 114 and enters the first flow channel 111, and the fluid passing through the first flow channel 111 is discharged from the first flow channel merging hole 114 located at the other end of the first flow channel 111.

[0172] Of course, a part of the first fluid passing through the first flow channel merging hole 114 can be dispersed through the communication dispersion portion 127 and supplied to the first flow channel merging holes 114 of the stacked first plates 110 through the communication merging hole 126.

[0173] On the other hand, the first fluid passing through the first flow channel 111 sequentially passes through the first direction portion 111a and the second direction portion 111b where the moving direction of the first fluid changes, and a heat insulation portion 119 is formed through - hole between the first direction portion 111a and the second direction portion 111b to block the heat transfer between them, so that the decrease in heat exchange performance can be prevented by preventing the temperature change of the first fluid passing through adjacent parts.

[0174] In addition, the first fluid passing through the first flow channel 111 exchanges heat with the second fluid and is discharged to the first fluid discharge hole 113. Before being discharged to the first fluid discharge hole 113, part of the fluid can move from the first fluid merging hole 114 adjacent to the first fluid discharge hole 113 to the merging communication hole of the second plate 120.

[0175] The first fluid discharged from the first flow channel merging hole 114 converges again to the first fluid discharge hole 113 through the first fluid dispersion portion 115 and moves to be discharged through the first fluid discharge passage 152, and the first fluid discharged from the first fluid discharge passage 152 is discharged to the outside through the first fluid discharge pipe portion 142 formed on the end plate 130.

[0176] On the other hand, the second fluid is supplied through the second fluid supply pipe portion 143 of the end plate 130 to the second fluid supply passage 153 composed of the second fluid supply hole 123 and the second fluid through hole 117. The second fluid supplied to the second fluid through hole 117 of the second plate 120 moves interlayer to be supplied to the second fluid through hole 117 of the first plate 110, and then moves again through the interlayer connection portion 117a of the second fluid through hole 117 to the second flow path merging hole 122 of the second plate 120 to enter the second flow path 121 (refer to Figure 7 and Figure 8 ).

[0177] At this time, since the second fluid moves interlayer between the second plate 120 and the first plate 110 and is supplied to the second flow path 121, the second fluid can be dispersed so that a large amount of the second fluid is supplied to the second flow path 121, thereby preventing a decrease in heat exchange performance.

[0178] When the second fluid passing through the second flow path 121 passes through the first direction portion 121a and the second direction portion 121b in sequence, heat insulation can be performed through the heat insulation portion 129 to prevent heat transfer between them and prevent a decrease in heat exchange performance.

[0179] In addition, before entering the second flow path 121, a part of the second fluid flowing into the second flow path merging hole 122 is supplied to the second flow path 121, but the remaining part can penetrate through the interlayer through hole 118 formed in the first plate 110 and disperse and move to the second flow path merging hole 122 of the second plate 120 located in other layers.

[0180] The second fluid that has undergone heat exchange with the first fluid in the second flow path 121 is discharged to the second flow path merging hole 122 formed at a position corresponding to the position where the second fluid discharge hole 124 is located. The second fluid discharged from the second flow path merging hole 122 moves through the interlayer connection portion 117a of the first plate 110 to the second fluid through hole 117, and passes through the second fluid discharge passage 154 composed of the second fluid discharge hole 124 and the second fluid through hole 117, and thus is discharged to the outside through the second fluid discharge pipe portion 144 formed on the end plate 130.

[0181] The hydrogen storage device including the printed circuit board type heat exchanger 100 according to the embodiment of the present invention configured as described above can store hydrogen to charge a fuel cell using hydrogen or supply hydrogen to an internal combustion engine using hydrogen as fuel.

[0182] The hydrogen storage device includes a hydrogen tank. When filling hydrogen into the hydrogen tank, hydrogen can be heat-exchanged with a refrigerant through the printed circuit board type heat exchanger 100 and stored in the hydrogen tank in a state of reduced temperature, or hydrogen filled in the hydrogen tank can be heat-exchanged with the refrigerant and supplied to a fuel cell or an internal combustion engine in a state of reduced hydrogen temperature.

[0183] Of course, the printed circuit board type heat exchanger 100 of the embodiment can also be used to supply a refrigerant to a hydrogen tank, so that the hydrogen filled in the hydrogen tank is maintained at a preset temperature.

[0184] In addition, a hydrogen compression device including the printed circuit board type heat exchanger 100 for improving durability according to an embodiment of the present invention.

[0185] In addition, the hydrogen compression device including the printed circuit board type heat exchanger 100 for improving durability according to an embodiment of the present invention may include a compressor for compressing hydrogen.

[0186] The compressor may compress the cooled hydrogen through the printed circuit board type heat exchanger 100, or may supply the hydrogen to the printed circuit board type heat exchanger 100 for cooling the compressed hydrogen after pre-compressing the hydrogen through the compressor.

[0187] The hydrogen compressed in the compressor may be supplied to a hydrogen tank, or may be sent to a fuel cell using hydrogen or a hydrogen internal combustion engine using hydrogen as fuel for use.

[0188] The compressor may compress hydrogen by mechanical drive such as a piston, or may compress hydrogen by hydraulic pressure such as a diaphragm or a bellows, and the compressor may use various known compressors.

[0189] Therefore, in the printed circuit board type heat exchanger 100 for improving durability according to an embodiment of the present invention, a hydrogen storage device including the same, and a hydrogen compression device, the first fluid flowing into the first fluid supply hole 112 is dispersed to the first fluid merging hole 114 through the first fluid dispersion unit 115, so as to increase the area for supplying the first fluid and expand the supply amount of the first fluid, thereby improving the heat exchange performance of the first fluid.

[0190] In addition, since the first fluid dispersion unit 151 and the communication dispersion unit 127 are joined to each other and are located at the center of the first fluid supply passage 151 for supplying the first fluid, an effect similar to that of an erected support column is generated at the center of the first fluid supply passage 151, thereby increasing the static pressure of the first fluid supply passage 151 to improve durability.

[0191] In addition, compared with the first fluid supply hole 112, the first flow path merging hole 114 connected to the first flow path 111 is formed to have a diameter larger than that of the first fluid supply hole 112, so as to connect the channels of a larger amount of the first flow path 111, thereby enabling rapid heat exchange of the first fluid.

[0192] In addition, the first fluid dispersion part 115 located between the first fluid supply hole 112 and the first flow path merging hole 114 through which the first fluid passes is joined not only to the end plate 130 but also between the stacked first plate 110 and second plate 120, thereby improving durability and minimizing the thickness of the end plate 130. As a result, the volume of the heat exchanger 100 can be reduced and the weight can be lightened.

[0193] In addition, heat insulation parts 119 and 129 are formed in the first flow path 111 or the second flow path 121 so that heat transfer between the first fluid and the second fluid is blocked on paths adjacent to each other, thereby improving heat exchange performance.

[0194] In addition, by diffusion-bonding the first plate 110 and the second plate 120 so that they are firmly joined, leakage of the first fluid or the second fluid between the first plate 110 and the second plate 120 can be prevented.

[0195] In addition, weight reduction holes 116a and 128a are formed through the unused portions of the first plate 110 and the second plate 120, thereby lightening the weight of the printed circuit board type heat exchanger 100.

[0196] In addition, a merging hole reinforcing part 122a is formed to protrude in the second flow path merging hole 122 connected to the second flow path 121 of the second plate 120, so that the merging hole reinforcing part 122a is joined to the first plate 110. Therefore, not only can the rigidity of the second flow path merging hole 122 be increased to improve durability, but also in the second fluid through hole 117 of the first plate 110, the second fluid of the second plate 120 moves between layers through the interlayer connection part 117a and moves to the second fluid merging hole 122 corresponding to the second fluid supply hole 123 and the second fluid discharge hole 124 respectively. Therefore, a large amount of the second fluid can be easily supplied.

[0197] The embodiments of the present invention have been described above, but the scope of the rights of the present invention is not limited thereto, and should include all changes and modifications within the range that can be easily changed by those of ordinary skill in the art through the embodiments of the present invention and are considered equivalent.

[0198] Description of Reference Numerals

[0199] 100: Printed circuit board type heat exchanger 110: First plate

[0200] 111: First flow path 111a, 121a: First direction part

[0201] 111b, 121b: Second direction part 111c: Connecting flow path part

[0202] 112: First fluid supply hole 113: First fluid discharge hole

[0203] 114: First flow path merging hole 115: First fluid dispersion part

[0204] 115a, 127a: Peripheral dispersion flow paths 115b, 127b: Inner dispersion flow paths

[0205] 115c, 127c: Outer dispersion flow paths 116, 128: Rod mounting holes

[0206] 116a, 128a: Weight reduction holes 117: Second fluid through hole

[0207] 117a: Interlayer connection part 118: Interlayer through hole

[0208] 119, 129: Thermal insulation parts 119a, 129a: Connection strengthening parts

[0209] 120: Second plate 121: Second flow path

[0210] 122: Second flow path merging hole 122a: Merging hole strengthening part

[0211] 123: Second fluid supply hole 124: Second fluid discharge hole

[0212] 125: First fluid through hole 126: Communication merging hole

[0213] 127: Communication dispersion part 130: End plate

[0214] 140: Head plate 141: First fluid supply pipe part

[0215] 142: First fluid discharge pipe part 143: Second fluid supply pipe part

[0216] 144: Second fluid discharge pipe part 151: First fluid supply channel

[0217] 152: First fluid discharge channel 153: Second fluid supply channel

[0218] 154: Second fluid discharge channel

Claims

1. A printed circuit board type heat exchanger for improving durability, comprising: The first plate is formed with a first flow channel through which a first fluid passes; and a second plate, overlapping with the first plate, is formed with a second flow channel through which a second fluid passes, characterized in that the first plate includes: a first fluid supply hole for supplying the first fluid to the first flow channel; a first fluid discharge hole for discharging the first fluid that has passed through the first flow channel; a first flow channel merging hole, located at one end of the first flow channel or respectively at both ends of the first flow channel, connecting and merging the channels of the first flow channel to supply the first fluid to the first flow channel or discharge the first fluid from the first flow channel; and a first fluid dispersion part that connects the first fluid supply hole or the first fluid discharge hole at a position corresponding to the first flow channel merging hole with the first flow channel merging hole, so that the first fluid disperses and moves.

2. The printed circuit board type heat exchanger for improving durability according to claim 1, wherein, The diameter of the first flow channel merging hole is larger than the diameter of the first fluid supply hole or the first fluid discharge hole, so that more channels of the first flow channel are connected to the first fluid supply hole or the first fluid discharge hole.

3. The printed circuit board type heat exchanger for improving durability according to claim 1, wherein, The second plate includes: a communication and merging hole, overlapping at a position corresponding to the first flow channel merging hole, so that the first fluid in the first flow channel merging hole passes through the second plate and moves, and the communication and merging hole is formed through.

4. The printed circuit board type heat exchanger for improving durability according to claim 2, wherein, The first flow channel merging hole and the communication and merging hole are located in directions opposite to each other with the first fluid supply hole or the first fluid discharge hole as the center, so that when the first fluid moves through the first plate and the second plate in the stacking direction of the first plate and the second plate, it alternately passes through both sides with the first fluid supply hole or the first fluid discharge hole as the center and moves.

5. The printed circuit board type heat exchanger for improving durability according to claim 2, wherein, The second plate includes: a first fluid through hole, at positions corresponding to the first fluid supply hole and the first fluid discharge hole, penetrating the second plate in the stacking direction, and the first fluid passes through the first fluid through hole; and a communication and dispersion part, formed between the first fluid through hole and the communication and merging hole, so that the first fluid disperses and moves between the first fluid through hole and the communication and merging hole.

6. The printed circuit board type heat exchanger for improving durability according to claim 1, wherein, The first fluid dispersion part includes: a peripheral dispersion flow channel, located between the first fluid supply hole and the flow channel merging hole or between the first fluid discharge hole and the flow channel merging hole, and the perimeter of the peripheral dispersion flow channel is larger than the perimeter of the first fluid supply hole or the first fluid discharge hole; an inner connection flow channel, connected to the first fluid supply hole or the first fluid discharge hole corresponding to the peripheral dispersion flow channel; and an outer connection flow channel, connected to the flow channel merging hole corresponding to the peripheral dispersion flow channel.

7. The printed circuit board type heat exchanger for improving durability according to claim 1, wherein, The first flow channel or the second flow channel includes: a first direction part and a second direction part, arranged adjacent to each other, and the flow directions of the first fluid or the second fluid are different from each other, The printed circuit board type heat exchanger includes a heat insulation part, and the heat insulation part penetrates between the first direction part and the second direction part to block the heat between the first direction part and the second direction part.

8. The printed circuit board type heat exchanger for improving durability according to claim 7, wherein, The heat insulation part includes: A connection reinforcing portion is formed across the heat insulating portion to reinforce the rigidity weakened due to the formation of the heat insulating portion through penetration.

9. The printed circuit board type heat exchanger for improving durability according to claim 1, wherein, The first plate and the second plate are joined by full surface diffusion bonding with each other.

10. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein, One of the first fluid and the second fluid is a refrigerant, and the other fluid contains hydrogen cooled by the refrigerant.

11. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein, The first flow channel or the second flow channel is formed by chemical etching or mechanical grinding on the first plate or the second plate.

12. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein, Comprising: An end plate, which overlaps with the outermost first plate or second plate in a state where the first plate and the second plate overlap, to seal the fluid supply hole and the fluid discharge hole. The end plate is joined to the first fluid dispersion portion to improve the durability of the end plate portion corresponding to the first fluid supply hole or the first fluid discharge hole.

13. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein, The first plate or the second plate includes perforated weight reducing holes to reduce the weight.

14. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein, The first plate and the second plate include: Rod mounting holes, in a state where the first plate and the second plate are stacked on each other, a fixing rod is inserted and fixed in the rod mounting holes.

15. A printed circuit board type heat exchanger with improved durability, comprising: A first plate, formed with a first flow channel through which a first fluid passes; And a second plate, overlapping with the first plate, formed with a second flow channel through which a second fluid passes, characterized in that The second plate includes: A second flow channel merging hole for communicating and connecting the channels of the second flow channel; A second fluid supply hole and a second fluid discharge hole, which are respectively and separately provided in the second flow channel merging holes located at both ends of the second flow channel, the second fluid supply hole is for supplying the second fluid, and the second fluid discharge hole is for discharging the second fluid; and A merging hole reinforcing portion, protruding toward the second flow channel merging hole and joined to the first plate to reinforce the rigidity affected due to the formation of the second flow channel merging hole. The first plate includes: Second fluid through holes, respectively located at positions corresponding to the second fluid supply hole and the second fluid discharge hole, and the second fluid passes through the second fluid through holes; and An interlayer connection portion, extending from the second fluid through hole, connecting to the second flow channel merging hole corresponding to the second fluid supply hole, and connecting to the second flow channel merging hole corresponding to the second fluid discharge hole, such that the second fluid moves between layers and passes through in large quantities.

16. A hydrogen storage device comprising a printed circuit board type heat exchanger with improved durability, wherein, Comprising: The printed circuit board type heat exchanger with improved durability according to claim 1; And A hydrogen tank, hydrogen is cooled by the printed circuit board type heat exchanger and filled into the hydrogen tank, or the filled hydrogen is supplied to be cooled by the printed circuit board type heat exchanger.

17. A hydrogen compression device comprising a printed circuit board type heat exchanger with improved durability, comprising: The printed circuit board type heat exchanger with improved durability according to claim 1; And A compressor, which receives and compresses hydrogen cooled by the printed circuit board type heat exchanger, or compresses and supplies hydrogen to the printed circuit board type heat exchanger.

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