Casting equipment and method for semiconductor product

Abstract

The invention relates to the technical field of semiconductor manufacturing, and discloses semiconductor product casting equipment and a semiconductor product casting method. The transition cabin is provided with a first cabin door and a second cabin door, the first cabin door is arranged outside the glove operation box, and the second cabin door is arranged in the glove operation box; the heating assembly is arranged in the glove operation box and used for heating the raw materials into molten liquid; the mold assembly is arranged in the glove operation box and used for casting molding of the molten liquid; the vacuum assembly is used for vacuumizing the glove operation box and the transition cabin; and the inert gas source is communicated with the glove operation box and is used for injecting inert gas into the glove operation box. The method has the beneficial effects that the influence of the atmospheric environment can be isolated, gas and moisture residues of semiconductor products in the casting process are avoided, the purity of the semiconductor products is improved, the stability of the semiconductor products is ensured, and the performance of finished products is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and particularly to a casting device and method for semiconductor products. Background Art

[0002] With the continuous progress of semiconductor technology, the requirement for material purity has indeed reached an unprecedented height. High-purity semiconductor products play a crucial role in ensuring the stability and reliability of electronic devices such as high-performance integrated circuits and transistors.

[0003] In the prior art, the common casting process is used to prepare semiconductor products. During the casting process of semiconductor products, the casting device is generally connected to the atmospheric environment. The semiconductor products are prone to contact with the gas and moisture in the atmospheric environment during the casting process, resulting in the residual gas and moisture in the semiconductor products, uneven internal particle distribution of the semiconductor products, and a decrease in the purity of the semiconductor products, leading to poor stability of the semiconductor products and affecting the stable use and performance of the finished products. Summary of the Invention

[0004] The object of the present invention is to provide a casting device and method for semiconductor products, which can isolate the influence of the atmospheric environment, avoid the residual gas and moisture in the semiconductor products during the casting process, improve the purity of the semiconductor products, ensure the stability of the semiconductor products, and improve the performance of the finished products.

[0005] To achieve the above object, the present invention provides a casting device for semiconductor products, including

[0006] A glove operation box;

[0007] A transfer chamber, the transfer chamber is provided with a first hatch and a second hatch, the first hatch is arranged outside the glove operation box, and the second hatch is arranged inside the glove operation box;

[0008] A heating component, arranged inside the glove operation box, for heating the raw material to a molten liquid;

[0009] A mold component, arranged inside the glove operation box, for casting and molding the molten liquid; a vacuum component, for performing vacuum treatment on the glove operation box and the transfer chamber; and

[0010] An inert gas source, communicated with the glove operation box, for injecting inert gas into the glove operation box.

[0011] Further, the heating component includes a base, a flipping mechanism, and a heating furnace. The base is fixedly connected to the bottom plate of the glove operation box. A flipping mechanism is provided on the base, and the output end of the flipping mechanism is provided with the heating furnace, which is used to drive the heating furnace to flip by a preset angle to pour the molten liquid into the mold component.

[0012] Further, the mold component includes a cooling plate and a mold body. A cooling cavity is provided inside the cooling plate and is communicated with a cooling pipeline. The cooling pipeline extends outside the glove operation box and is connected to an external cold source. The mold body is arranged above the cooling plate and below the discharge port of the heating furnace. A cavity is provided on the mold body.

[0013] Further, a heat exchange device is further included. The heat exchange device includes a second circulation pump, a heat exchanger, and a second circulation pipeline. The second circulation pump is communicated with the heat exchanger. The heat exchanger is communicated with the glove operation box through the second circulation pipeline. The cooling pipeline is provided inside the heat exchanger.

[0014] Further, the flipping mechanism includes a driving unit, a rotating shaft, and a mounting seat. The mounting seats are symmetrically provided on the base. Two ends of the rotating shaft are respectively rotatably connected to the mounting seats. Connecting plates are symmetrically provided on the outer wall of the heating furnace, and the connecting plates are sleeved and fixed on the rotating shaft. The driving unit is arranged at the bottom of the heating furnace;

[0015] Wherein, when the driving unit acts, it pushes the heating furnace to move upward and rotate around the axis of the rotating shaft, so as to flip the heating furnace by a preset angle to pour the molten liquid into the mold component.

[0016] Further, a purification device is further included. The purification device includes a first circulation pump, a first circulation pipeline, and a purification and reduction tank. The circulation pump is connected to the purification and reduction tank. The purification and reduction tank is communicated with the glove operation box through the first circulation pipeline.

[0017] Further, a reducing gas source communicated with the purification and reduction tank is further included.

[0018] Further, an intake valve and an exhaust valve are provided inside the glove operation box, and the intake valve is connected to the inert gas source.

[0019] Further, a dust purifier communicated with the glove operation box is further included.

[0020] The present invention also provides a casting method for semiconductor products. Based on the casting equipment for semiconductor products described in any one of the above, the method includes the following steps:

[0021] S1. Put the raw materials into the transition chamber.

[0022] S2. Vacuumize the glove operation box and the transfer chamber, and introduce inert gas into the glove operation box.

[0023] S3. Transfer the raw materials from the transfer chamber into the glove operation box and place them in the heating component to be heated into a molten liquid.

[0024] S4. Pour the molten liquid into the mold component, and take it out after the product cools and forms.

[0025] Compared with the prior art, the casting equipment and method for semiconductor products in the embodiments of the present invention have the beneficial effects that: there are a glove operation box and a transfer chamber. The transfer chamber is provided with a first hatch and a second hatch. The first hatch is arranged outside the glove operation box, and the second hatch is arranged inside the glove operation box. During the casting process, the raw materials enter the transfer chamber. At this time, the transfer chamber is isolated from the glove operation box. The transfer chamber is vacuumized by the vacuum component, and at the same time, the glove operation box is vacuumized, and inert gas is introduced into the glove operation box, so as to exclude the influence of gas and moisture in the atmospheric environment on the casting of semiconductor products during the heating and melting and casting forming processes, avoid gas and moisture residues in the semiconductor products during the casting process, improve the purity of semiconductor products, ensure the stability of semiconductor products, and improve the performance of finished products. Description of the Drawings

[0026] Figure 1 is a schematic structural diagram of the casting equipment for semiconductor products in the embodiments of the present invention;

[0027] Figure 2 is a schematic internal view of the glove operation box of the casting equipment for semiconductor products in the embodiments of the present invention;

[0028] Figure 3 is a schematic structural diagram of the casting equipment for semiconductor products in the embodiments of the present invention from another perspective;

[0029] Figure 4 is a side view of the casting equipment for semiconductor products in the embodiments of the present invention;

[0030] Figure 5 is a schematic structural diagram of the heating component of the casting equipment for semiconductor products in the embodiments of the present invention;

[0031] Figure 6 is a schematic structural diagram of the cooling plate of the casting equipment for semiconductor products in the embodiments of the present invention.

[0032] In the figure, 1 is a glove operation box; 2 is a transition chamber; 21 is a first hatch; 22 is a second hatch; 3 is a heating assembly; 31 is a base; 32 is a flipping mechanism; 321 is a rotating shaft; 322 is a mounting seat; 33 is a heating furnace; 331 is a connecting plate; 4 is a mold assembly; 41 is a cooling plate; 411 is a cooling cavity; 42 is a mold body; 43 is a cooling pipe; 44 is an external cold source; 45 is a magneto-fluid seal; 5 is a vacuum assembly; 6 is a purification device; 7 is a heat exchange device; 71 is a second circulation pump; 72 is a heat exchanger; 8 is a dust purifier; 81 is a third circulation pump; 82 is a purification tank; 83 is a dust removal tank. Detailed implementation manners

[0033] The following combines the drawings and embodiments to further describe in detail the specific implementation manners of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0034] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "front", "rear", "inner", "outer", etc. in the present invention are based on the positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the devices and elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0035] In the description of the present invention, it should be understood that the present invention uses terms such as "first" and "second" to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information can also be called "second" information, and similarly, "second" information can also be called "first" information.

[0036] As Figures 1 to 6 shown, a casting device for semiconductor products in a preferred embodiment of the present invention includes a glove operation box 1, a transition chamber 2, a heating assembly 3, a mold assembly 4, a vacuum assembly 5 and an inert gas source. Among them, the glove operation box 1 serves as the working area for heating semiconductor raw materials and casting them into shape, and it can be separated from the external environment. The glove operation box 1 is as Figure 1As shown in the figure, the side plate of the glove operation box 1 is made of transparent material, which is conducive to observing the inside of the glove operation box 1 and facilitating operation. At the same time, four openings for installing gloves are provided on the side plate of the glove operation box 1, which is convenient for workers to operate. The transition chamber 2 is provided with a first hatch 21 and a second hatch 22. Among them, the first hatch 21 is arranged outside the glove operation box 1, and the second hatch 22 is arranged inside the glove operation box 1. The transition chamber 2 is used for temporarily storing raw materials. The heating component 3 is arranged inside the glove operation box 1 and is used to heat the raw materials to molten liquid. The mold component 4 is arranged inside the glove operation box 1 and is used for casting the molten liquid into a mold. The vacuum component 5 is used to evacuate the glove operation box 1 and the transition chamber 2; the inert gas source is connected to the glove operation box 1 and is used to inject inert gas into the glove operation box 1.

[0037] When casting semiconductor products, the raw materials need to be first placed in the transition chamber 2, and the transition chamber 2 and the glove operation box 1 are evacuated by the vacuum component 5, and inert gas is injected into the glove operation box 1 through the inert gas source, so as to avoid the influence of gases and moisture in the external environment on the casting and molding of semiconductor products. Subsequently, the raw materials are placed in the heating component 3 to be heated and melted, and the molten liquid is poured into the mold component 4 for casting and molding.

[0038] Furthermore, in order to facilitate the automatic pouring of the molten liquid formed by melting the raw materials into the mold component 4 after melting, in this embodiment, the heating component 3 includes a base 31, a flipping mechanism 32, and a heating furnace 33. Refer to Figure 2 、 Figure 5 , the base 31 is fixedly connected to the bottom plate of the glove operation box 1. A flipping mechanism 32 is provided on the base 31. The output end of the flipping mechanism 32 is provided with a heating furnace 33, which is used to drive the heating furnace 33 to flip by a preset angle to pour the molten liquid into the mold component 4, so as to avoid manual operation by workers, resulting in an uncontrollable rate during the pouring process of the molten liquid and affecting the consistency of the molding of semiconductor products.

[0039] Specifically, in this embodiment, in order to facilitate the arrangement of the flipping mechanism 32 and simplify the structure at the same time, the flipping mechanism 32 includes a driving unit, a rotating shaft 321, and a mounting seat 322. The mounting seats 322 are symmetrically provided on the base 31. The two ends of the rotating shaft 321 are respectively rotatably connected to the mounting seats 322. Connecting plates 331 are symmetrically provided on the outer wall of the heating furnace 33, and the connecting plates 331 are sleeved and fixed to the rotating shaft 321. The driving unit is arranged at the bottom of the heating furnace 33 (not shown in the figure). Refer to Figure 5, the driving unit operates to push the heating furnace 33 upward and rotate around the axis of the rotating shaft 321, so that the heating furnace 33 is flipped by a preset angle to pour the molten liquid into the mold assembly 4. In this embodiment, the driving unit can be a reduction motor, which is beneficial to accurately control the flipping angle of the heating furnace 33 and the pouring rate of the molten liquid, and improve the stability of the semiconductor product casting process.

[0040] Furthermore, the texture facilitates the cooling and forming of the semiconductor product after casting. Refer to Figure 3 , Figure 5 , Figure 6 , the mold assembly 4 includes a cooling plate 41 and a mold body 42. Among them, a cooling cavity 411 is provided inside the cooling plate 41 and is communicated with a cooling pipeline 43. The cooling pipeline 43 extends outside the glove operation box 1 and is connected to an external cold source 44. That is, the cooling medium provided by the external cold source 44 flows through the cooling pipeline 43 to the cooling cavity 411 and can flow back from the cooling cavity to the cooling pipeline 43 to form a circulating loop of the coolant to cool the mold body 42. Specifically, the mold body 42 is arranged above the cooling plate 41 and below the discharge port of the heating furnace 33. A cavity is provided on the mold body 42. That is, when the molten liquid in the heating furnace 33 is introduced into the cavity, the cooling medium in the cooling plate 41 absorbs heat, so as to realize the cooling and forming of the semiconductor product. In this embodiment, the cooling plate 41 is located inside the glove operation box 1, and the cooling pipeline 43 extends outside the glove operation box 1. In order to ensure the sealing effect between the cooling pipeline 43 and the glove operation box 1, a magneto - fluid seal 45 for sealing with the glove operation box 1 is sleeved outside the cooling pipeline 43.

[0041] After the inert gas is introduced into the glove operation box 1, in order to facilitate the purification of the remaining oxygen and moisture in the glove operation box 1 and further improve the purity of the semiconductor product, a purification device 6 is also included. Specifically, the purification device 6 includes a first circulation pump, a first circulation pipeline, and a purification and reduction tank. Among them, the first circulation pump is communicated with the purification and reduction tank and the first circulation pipeline, and the purification and reduction tank is communicated with the glove operation box 1 through the first circulation pipeline. When it is necessary to purify oxygen and moisture, start the first circulation pump and heat the purification and reduction tank, introduce the gas in the glove operation box 1 into the purification and reduction tank. The oxygen in the gas reacts with the copper catalyst in the purification and reduction tank 82, and at the same time, the molecular sieve in the purification and reduction tank 82 absorbs the moisture in the gas. Subsequently, the purified gas flows back to the glove operation box 1.

[0042] Specifically, the principle of the copper catalyst removing oxygen is that a chemical reaction occurs between copper and oxygen. The copper catalyst exists in a solid state. When the oxygen concentration in the chamber is relatively high, the copper catalyst reacts with oxygen to form copper oxide. This is an oxidation-reduction reaction in which copper is oxidized and oxygen is reduced. The principle of the molecular sieve removing water is mainly physical adsorption. When water molecules come into contact with the surface of the molecular sieve, due to the porous structure and surface properties of the molecular sieve, the water molecules will be adsorbed in the pores.

[0043] Further, in some embodiments, since copper oxide is formed after the reaction of the copper catalyst and the solid amount of copper decreases, in order to make the casting process proceed stably, it is necessary to regenerate the copper catalyst. At the same time, to ensure that the molecular sieve has good water removal performance, a reducing gas source is also provided. The reducing gas source is connected to the reduction purification tank 82. When the copper catalyst is regenerated, the reduction purification tank 82 is heated, and the reducing gas source provides a nitrogen-hydrogen mixed gas. Copper oxide reacts with hydrogen to form the copper catalyst and water vapor. At the same time, the water in the molecular sieve evaporates due to heat to also form water vapor. The corresponding valve is opened to discharge the water vapor, and this step is repeated multiple times to regenerate the copper catalyst.

[0044] Further, to facilitate the control of the pressure inside the glove operation box 1, an intake valve and an exhaust valve are provided inside the glove operation box 1. The intake valve is connected to an inert gas source. After the inert gas source injects inert gas into the glove operation box 1 through the intake valve to a preset pressure, the intake valve is closed. The exhaust valve is preset with a safety pressure value. When the pressure inside the glove operation box 1 exceeds the safety pressure value, it automatically exhausts.

[0045] Further, as the casting reaction proceeds stably, the temperature of the inert gas inside the glove operation box 1 is relatively high. In order to further improve the cooling and forming efficiency of the semiconductor product, it is necessary to cool down the inert gas. Therefore, in some embodiments, refer to Figure 3 , Figure 4 , it further includes a heat exchange device 7. Among them, the heat exchange device 7 includes a second circulation pump 71, a heat exchanger 72, and a second circulation pipeline. The second circulation pump 71 is connected to the heat exchanger 72, and the heat exchanger 72 is connected to the glove operation box 1 through the second circulation pipeline. A cooling pipeline 43 is provided inside the heat exchanger 72. That is, when it is necessary to cool down the inert gas inside the glove operation box 1, the second circulation pump 71 is started, and the high-temperature gas is introduced into the heat exchanger 72 through the second circulation pipeline. A cooling pipeline 43 is provided inside the heat exchanger 72. That is, the cooling medium in the cooling pipeline 43 exchanges heat with the high-temperature gas in the radiator, thereby realizing the cooling of the inert gas. After the cooling is completed, the inert gas flows back to the glove operation box 1 through the second circulation pipeline.

[0046] Further, as the casting process proceeds stably, during the melting process of the semiconductor raw material, metal vapor is formed due to local evaporation on the surface. The metal vapor may condense to form dust when it meets cold. To avoid the influence of dust on the casting process, it is necessary to remove dust from the inert gas in the glove operation box 1. Therefore, the casting equipment of the present invention further includes a dust purifier 8 communicated with the glove operation box 1. Specifically, the dust purifier 8 includes a third circulation pump 81, a purification tank 82, and a dust removal tank 83. Among them, when the third circulation pump 81 works, the inert gas in the glove operation box 1 flows into the dust removal tank 83. After the larger dust particles in the inert gas fall to the bottom of the dust removal tank 83 under the influence of gravity, they then flow into the purification tank 82. The purification tank 82 further filters the smaller particulate dust in the inert gas. The inert gas that has completed the dust removal process returns to the glove operation box 1 through the pipeline to ensure the stability of the casting process.

[0047] The present invention also provides a casting method for semiconductor products. Based on the casting equipment for semiconductor products according to any one of the above, it includes the following steps:

[0048] S1. Put the raw material into the transfer chamber 2.

[0049] S2. Evacuate the glove operation box 1 and the transfer chamber 2, and introduce inert gas into the glove operation box 1.

[0050] S3. Transfer the raw material from the transfer chamber 2 into the glove operation box 1 and place it in the heating furnace 33 to be heated to form a molten liquid.

[0051] S4. Pour the molten liquid into the mold assembly 4, and take out the product after it cools and forms.

[0052] Among them, step S1 is specifically: open the first hatch 21, put the raw material into the transfer chamber 2, and close the first hatch 21. Step S3 is specifically: open the second hatch 22, after transferring the raw material into the glove operation box 1, close the second hatch 22, and place the raw material in the heating assembly 3 through the gloves provided in the glove operation box 1 to be heated to form a molten liquid. In step S4, during the cooling process, the cooling medium in the external cold source 44 is transported to the cooling plate 41 through the cooling pipeline 43 to cool the mold body 42, and then the cooling medium flows back to the external cold source 44. The external cold source 44 refrigerates to cool the cooling medium. In this embodiment, the external cold source 44 is a chiller. During the process of taking out the product, it is necessary to open the second hatch 22 and the first hatch 21 in sequence.

[0053] In summary, the embodiments of the present invention provide a casting device and method for semiconductor products, which are provided with a glove operation box 1 and a transition chamber 2. The transition chamber 2 is provided with a first hatch 21 and a second hatch 22. The first hatch 21 is arranged outside the glove operation box 1, and the second hatch 22 is arranged inside the glove operation box 1. During the casting process, raw materials enter the transition chamber 2. At this time, the transition chamber 2 is isolated from the glove operation box 1. The transition chamber 2 is evacuated by a vacuum assembly 5, and at the same time, the glove operation box 1 is evacuated, and an inert gas is introduced into the glove operation box 1, so as to exclude the influence of gases and moisture in the atmospheric environment on the casting of semiconductor products during the heating and melting and casting forming processes of the raw materials, avoid gas and moisture residues in the semiconductor products during the casting process, improve the purity of the semiconductor products, ensure the stability of the semiconductor products, and improve the performance of the finished products.

[0054] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present invention.

Claims

1. A casting device for semiconductor products, characterized in that: include Glove box; A transition cabin, wherein the transition cabin is provided with a first cabin door and a second cabin door, wherein the first cabin door is provided outside the glove operation box, and the second cabin door is provided inside the glove operation box; A heating component, disposed in the glove box, for heating the raw material to a molten liquid; A mold assembly, arranged in the glove box, for casting and molding the molten liquid; A vacuum component, used for performing vacuum treatment on the glove box and the transition chamber; as well as An inert gas source is connected to the glove box and is used to inject inert gas into the glove box.

2. The casting device for semiconductor products according to claim 1, characterized in that: The heating assembly includes a base, a flipping mechanism, and a heating furnace. The base is fixedly connected to the bottom plate of the glove operating box. The base is provided with a flipping mechanism. The output end of the flipping mechanism is provided with the heating furnace, which is used to drive the heating furnace to flip at a preset angle to pour the molten liquid into the mold assembly.

3. The casting device for semiconductor products according to claim 2, characterized in that: The mold assembly includes a cooling plate and a mold body. A cooling cavity is provided inside the cooling plate and is connected to a cooling pipe. The cooling pipe extends outside the glove operating box and is connected to an external cold source. The mold body is arranged above the cooling plate and below the discharge port of the heating furnace. A cavity is opened on the mold body.

4. The casting device for semiconductor products according to claim 3, characterized in that: It also includes a heat exchange device, which includes a second circulation pump, a heat exchanger, and a second circulation pipeline. The second circulation pump is connected to the heat exchanger, and the heat exchanger is connected to the glove operation box through the second circulation pipeline. The cooling pipeline is provided inside the heat exchanger.

5. The casting device for semiconductor products according to claim 2, characterized in that: The flip mechanism includes a driving unit, a rotating shaft, and a mounting seat. The mounting seat is symmetrically arranged on the base, and both ends of the rotating shaft are rotatably connected to the mounting seat respectively. The outer wall of the heating furnace is symmetrically provided with connecting plates, and the connecting plates are sleeved and fixed with the rotating shaft. The driving unit is arranged at the bottom of the heating furnace. The driving unit is activated to push the heating furnace to move upward and rotate around the axis of the rotating shaft, thereby causing the heating furnace to flip at a preset angle to pour the molten liquid into the mold assembly.

6. The casting device for semiconductor products according to claim 1, characterized in that: It also includes a purification device, which includes a first circulation pump, a first circulation pipeline, and a purification reduction tank. The circulation pump is connected to the purification reduction tank, and the purification reduction tank is connected to the glove operation box through the first circulation pipeline.

7. The casting device for semiconductor products according to claim 6, characterized in that: It also includes a reducing gas source communicated with the purification reduction tank.

8. The casting device for semiconductor products according to claim 1, characterized in that: An air inlet valve and an air exhaust valve are provided in the glove operation box, and the air inlet valve is connected to the inert gas source.

9. The casting device for semiconductor products according to claim 1, characterized in that: Also included is a dust purifier communicated with the glove box.

10. A method for casting a semiconductor product, based on the casting equipment for a semiconductor product according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Put the raw materials into the transition cabin. S2, evacuating the glove box and the transition chamber, and introducing an inert gas into the glove box; S3, moving the raw material from the transition chamber into the glove box, and placing it in the heating assembly to heat it to form a molten liquid; S4, pouring the molten liquid into the mold assembly, and taking out the product after it is cooled and formed.

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