Electrostatic adsorption microprobe and preparation method thereof

Abstract

The invention provides an electrostatic adsorption microprobe and a preparation method thereof, the electrostatic adsorption microprobe can be applied to the technical field of nano material processing, the electrostatic adsorption microprobe comprises a needle tip, the needle tip comprises a sheet-shaped metal electrode group, the sheet-shaped metal electrode group forms an electric field after being electrified, and the electric field is used for adsorbing a target material; the electrical connection interface is used for being connected with an external power supply, and the external power supply is used for controlling the voltage of the sheet metal electrode group to form an electric field at the needle point. According to the electrostatic adsorption microprobe provided by the embodiment of the invention, the nano material with the size being smaller than micron can be accurately controlled and positioned, the manufacturing requirement of a high-precision nano device is met, the nano material can be accurately transferred and assembled, and the accuracy and stability of material transferring and assembling are improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of nanomaterial processing, and more specifically, to an electrostatic adsorption microprobe and a preparation method thereof. Background Art

[0002] With the rapid development of nanotechnology, nanomaterials have shown great application potential in the fields of electronics, energy, biomedicine, etc. These applications often require precisely transferring nanomaterials to specific substrates or assembling them with other materials to achieve specific functions and performances. Currently, methods for transferring and assembling nanomaterials include mechanical transfer, optical tweezers, electrostatic adsorption, etc. Among them, the electrostatic adsorption technology has received wide attention due to its advantages such as simple operation, low cost, and wide application range.

[0003] However, existing devices or methods based on the principle of electrostatic adsorption still have some problems and deficiencies. Existing electrostatic adsorption devices often have difficulty in precisely controlling and positioning nanomaterials, resulting in low assembly accuracy and unable to meet the manufacturing requirements of some high-precision nanodevices. Summary of the Invention

[0004] (I) Technical Problems to be Solved

[0005] The present disclosure provides an electrostatic adsorption microprobe and a preparation method thereof, which are used to at least partially solve one of the above technical problems.

[0006] (II) Technical Solutions

[0007] According to the first aspect of the present disclosure, there is provided an electrostatic adsorption microprobe, including: a tip, including a sheet-like metal electrode group, and an electric field is formed after the sheet-like metal electrode group is energized, and the electric field is used to adsorb a target material; an electrical connection interface, which is used to connect an external power supply, and the external power supply is used to control the voltage of the sheet-like metal electrode group to form an electric field at the tip.

[0008] Optionally, the sheet-like metal electrode group is composed of 3 metal electrodes, the 3 metal electrodes are arranged in parallel, and the widths of the metal electrodes are the same.

[0009] Optionally, the number of electrical connection interfaces is the same as the number of metal electrodes, each metal electrode corresponds to an electrical connection interface, and different voltages are applied to the 3 metal electrodes to form an electric field for adsorbing the target material.

[0010] Optionally, a high voltage is applied to the metal electrode located in the middle position in the sheet-like metal electrode group, and low voltages are applied to other metal electrodes in the sheet-like metal electrode group to form an electric field between the electrodes.

[0011] Optionally, the energized tip is brought close to the target material, and an electrostatic adsorption force is generated between the electric field and the target material to adsorb the target material on the tip.

[0012] Optionally, it further includes an insulating layer for wrapping the sheet-like metal electrode group.

[0013] Optionally, the metal electrodes are arranged in parallel. The width of the metal electrode is 1.8 μm to 2.2 μm, and the thicknesses of the metal electrodes are different. The thickness of the metal electrode at the middle position is 0.4 μm to 0.6 μm, and the thicknesses of the remaining metal electrodes are 0.1 μm to 0.3 μm.

[0014] Optionally, the material of the metal electrode is copper.

[0015] Optionally, the material of the insulating layer is silicon dioxide or silicon nitride.

[0016] According to the second aspect of the present disclosure, there is provided a method for preparing an electrostatic adsorption microprobe, including: growing an insulating layer based on plasma enhanced chemical vapor deposition technology; preparing a first metal electrode on the surface of the insulating layer; depositing an insulating layer on the surface of the first metal electrode, and repeating the above steps until a sheet-like metal electrode group is obtained; depositing an insulating layer on the surface of the sheet-like metal electrode group to cover the sheet-like metal electrode group; and etching the insulating layer using photolithographic patterning technology to obtain the electrostatic adsorption microprobe.

[0017] (III) Beneficial effects

[0018] The electrostatic adsorption microprobe provided by the present disclosure has at least the following beneficial effects:

[0019] It can accurately control and position nanomaterials with dimensions below micrometers, improve the accuracy, stability, and efficiency of nanomaterial transfer and assembly, and meet the manufacturing requirements of high-precision nanodevices. Moreover, it is applicable to various shapes and surface properties of nanomaterials, including conductive, semi-conductive, insulating materials, and non-magnetic materials, etc., expanding the application scenarios of electrostatic adsorption and meeting the transfer and assembly requirements of different nanomaterials. Description of the drawings

[0020] Through the following description of the embodiments of the present disclosure with reference to the drawings, the above and other objects, features, and advantages of the present disclosure will become clearer. In the drawings:

[0021] Figure 1 Schematically shows a structural diagram of an electrostatic adsorption microprobe provided by an embodiment of the present disclosure;

[0022] Figure 2 Schematically shows a cross-sectional structure diagram of the tip of the electrostatic adsorption microprobe provided by an embodiment of the present disclosure;

[0023] Figure 3 Schematically shows a working principle diagram of the tip of the electrostatic adsorption microprobe provided by an embodiment of the present disclosure;

[0024] Figure 4 Schematically shows a flowchart of a method for preparing an electrostatic adsorption microprobe according to an embodiment of the present disclosure;

[0025] Figure 5 Schematically shows a schematic diagram of a method for preparing an electrostatic adsorption microprobe according to an embodiment of the present disclosure.

[0026] Reference numerals:

[0027] 1 - insulating layer; 21 - second metal electrode; 22 - first metal electrode; 23 - third metal electrode. Specific embodiments

[0028] To make the objectives, technical solutions, and advantages of the present disclosure clearer and more understandable, the following further describes the present disclosure in detail with reference to specific embodiments and the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present disclosure without creative efforts fall within the scope of protection of the present disclosure.

[0029] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0030] In the present disclosure, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or indirectly connected through an intermediate medium, and can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0031] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by terms such as "longitudinal", "length", "circumferential", "front", "rear", "left", "right", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the described subsystems or components must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present disclosure.

[0032] Throughout the accompanying drawings, the same elements are denoted by the same or similar reference numerals. When it may cause confusion in the understanding of the present disclosure, conventional structures or configurations will be omitted. Moreover, the shapes, sizes, and positional relationships of the components in the drawings do not reflect the actual sizes, proportions, and actual positional relationships. Additionally, in the claims, any reference signs enclosed in parentheses shall not be construed as limiting the claims.

[0033] Similarly, in order to streamline the present disclosure and assist in understanding one or more of the various disclosed aspects, in the above description of the exemplary embodiments of the present disclosure, the various features of the present disclosure are sometimes grouped together in a single embodiment, figure, or description thereof. Descriptions with reference terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0035] Embodiments of the present disclosure provide an electrostatic adsorption microprobe and a preparation method thereof. Before introducing the technical solutions provided by the embodiments of the present disclosure, the related technologies involved in the present disclosure will be described first.

[0036] The principle of electrostatic adsorption is to utilize the force acting on charged particles in an electric field to adsorb them on an electrode or substrate with an opposite charge. However, the existing electrostatic adsorption devices are relatively large in size, and it is often difficult to achieve precise control and positioning of nanomaterials, resulting in low assembly accuracy and inability to meet the manufacturing requirements of some high-precision nanodevices. Moreover, the existing electrostatic adsorption devices do not have good adsorption effects on some special nanomaterials (such as nanomaterials with complex shapes or surface properties), and it is difficult to achieve effective transfer and assembly.

[0037] It has been discovered by the inventors of the present disclosure that the poor adsorption effect of existing electrostatic adsorption devices may be related to the electrode structure employed. Existing electrostatic adsorption devices typically use annular electrodes for adsorption. Due to the structural problems of annular electrodes, the electric field distribution is usually uneven (i.e., weaker in the middle and stronger at the edges). For complex-shaped nanomaterials, if the contact area is small, the shape is irregular, or the surface conductivity is poor, it may be difficult to continuously adsorb during movement, resulting in an unsatisfactory adsorption effect.

[0038] Therefore, the present disclosure proposes an electrostatic adsorption microprobe to effectively improve the accuracy and stability of electrostatic adsorption.

[0039] An embodiment of the present disclosure provides an electrostatic adsorption microprobe, including: a tip, comprising a sheet metal electrode group, which forms an electric field after being energized, and the electric field is used to adsorb the target material; an electrical connection interface, used to connect to an external power source, and the external power source is used to control the voltage of the sheet metal electrode group to form an electric field at the tip.

[0040] Figure 1 Schematically shows a structural schematic diagram of an electrostatic adsorption microprobe provided by an embodiment of the present disclosure. Figure 2 Schematically shows a cross-sectional structural schematic diagram of the tip of the electrostatic adsorption microprobe provided by an embodiment of the present disclosure.

[0041] As Figure 1 、 Figure 2 shown, the electrostatic adsorption microprobe of the embodiment of the present disclosure includes: a tip, an electrical connection interface, and an insulating layer.

[0042] The tip is disposed on one side of the electrostatic adsorption microprobe and includes a sheet metal electrode group, which forms an electric field for adsorbing the target material after being energized. Among them, the sheet metal electrode group is composed of three metal electrodes, these three metal electrodes are arranged in parallel, and the width of each metal electrode is the same.

[0043] On the other side of the electrostatic adsorption probe far from the tip, an electrical connection interface is provided, which is used to connect to an external power source or other electrical devices, and the voltage of the sheet metal electrode group is controlled by the external power source to form an electric field at the tip.

[0044] The insulating layer is used to wrap the metal electrodes of the tip, and the insulating layer material can be, for example, silicon dioxide or silicon nitride, etc.

[0045] The diameter of the needle body obtained by wrapping the metal electrodes with the insulating layer is 2μm to 4μm. Referring to Figure 2 , the cross-section of the needle body of the electrostatic adsorption microprobe provided by the embodiment of the present disclosure is square, and the side length of the square is 2μm to 4μm. The metal electrode near the tip is coated with an insulating layer with a thickness of 100nm to 200nm.

[0046] In some embodiments, the number of electrical connection interfaces is the same as the number of metal electrodes in the sheet-like metal electrode group, and each metal electrode is correspondingly connected to an electrical connection interface. By applying different voltages to the metal electrodes in the sheet-like metal electrode group, an electric field for adsorbing the target material is formed.

[0047] Specifically, a high voltage can be applied to the metal electrode located in the middle position of the sheet-like electrode group, and a low voltage can be applied to the other metal electrodes in the sheet-like metal electrode group to create a potential difference between the middle electrode and the adjacent electrodes, thereby generating an electric field. Metal electrodes are arranged on both sides of the middle metal electrode, which can effectively avoid the bias of the field distribution and improve the electric field stability.

[0048] See Figure 2 , in some embodiments, the sheet-like metal electrode group includes a first metal electrode 22, a second metal electrode 21, and a third metal electrode 23. Among them, the second metal electrode 21 is disposed between the first metal electrode 22 and the third metal electrode 23, and the three are arranged in parallel. Among them. The material of the metal electrode can be copper (Cu). The distance between the first metal electrode 22, the second metal electrode 21, and the third metal electrode 23 is 700 nm to 900 nm, and the distances between the first metal electrode 22, the third metal electrode 23, and the second metal electrode 21 are equal.

[0049] Optionally, the first metal electrode 22, the second metal electrode 21, and the third metal electrode 23 have the same width, which is 1.8 μm to 2.2 μm.

[0050] Optionally, the first metal electrode 22, the second metal electrode 21, and the third metal electrode 23 have different thicknesses, and the thickness of the second metal electrode 21 is slightly thicker than that of the first metal electrode 22 and the third metal electrode 23. Among them, the thickness of the second metal electrode 21 located in the middle position is 0.4 μm to 0.6 μm, and the thicknesses of the first metal electrode 22 and the third metal electrode 23 are 0.1 μm to 0.3 μm, and the thicknesses of the first metal electrode 22 and the third metal electrode 23 are the same. Since the external voltage of the second metal electrode 21 in the middle position is a high voltage, the second metal electrode needs to be set with a higher thickness to avoid breakdown of the metal electrode. The thicknesses of the first metal electrode 22 and the third metal electrode 23 on both sides are slightly thinner, which can effectively reduce the structural depth in the vertical direction and reduce the volume of the electrostatic adsorption microprobe, thereby further improving the adsorption accuracy of the electrostatic adsorption microprobe.

[0051] It should be noted that Figure 1 the connection between the electrical connection interface and the metal electrode in is only schematic, and its size has no reference value. The electrodes on the actual electrical connection interface are much larger than the size in the figure

[0052] Figure 3Schematically shows the working principle diagram of the tip of the electrostatic adsorption microprobe provided by the embodiments of the present disclosure.

[0053] As Figure 3 shown, a high voltage is connected to the second metal electrode 21 of the electrostatic adsorption microprobe through an electrical connection interface, and low voltages are connected to both side metal electrodes (i.e., the first metal electrode 22 and the third metal electrode 23). An electric field is formed between the metal electrodes. After the tip is energized, it is brought close to the target material (such as nanomaterials, etc.), causing the charges of the approaching target material to transfer or polarize. Thus, an electrostatic adsorption force is generated between the electric field and the target material, adsorbing the target material on the tip to achieve the transfer or assembly of the target material. During desorption, the voltage applied to the metal electrodes is disconnected through the electrical connection interface. At this time, the electrostatic adsorption force disappears, and the target material falls off the tip.

[0054] In some embodiments, two metal electrodes (i.e., the first metal electrode 22 and the third metal electrode 23) are symmetrically distributed on both sides of the middle metal electrode (i.e., the second metal electrode 21). Among them, the voltages applied to both side metal electrodes (i.e., the first metal electrode 22 and the third metal electrode 23) are the same to form a uniformly distributed electric field at the tip.

[0055] On the one hand, compared with the annular electrode, the electric field distribution of the sheet metal electrode is more uniform, which helps to improve the stability of electrostatic adsorption. The electric field of the annular electrode is usually weaker in the central region of the ring and stronger at the edge, and the electric field gradient is discontinuous. Some nanomaterials with complex shapes cannot be effectively adsorbed in the weak electric field region. The large planar structure of the sheet metal electrode can form a relatively uniform electric field to reduce the electric field gradient picture, thereby effectively improving the stability of electrostatic adsorption.

[0056] On the other hand, in order to further improve the adsorption stability of the electrostatic adsorption microprobe of the present disclosure, the present disclosure also proposes that the first metal electrode 22 and the third metal electrode 23 are symmetrically distributed on both sides of the second metal electrode 21, which can introduce symmetric boundary conditions, making the electric field lines diverge or converge uniformly along the symmetry axis in the middle region to form a uniformly distributed electric field, effectively avoiding the field distribution skew caused by the unilateral electrode (such as edge effect or field local distortion).

[0057] The electrostatic adsorption force is driven by the electric field gradient (or surface charge density). When the electric field is uniform, the surface charge distribution is more consistent, and the electrostatic adsorption force is also more uniformly distributed. It can effectively avoid the situation of excessive or too small local force, and can effectively keep the adsorbed material under uniform force and maintain the stability of the adsorbed material (such as some fragile or materials that require precise placement).

[0058] Moreover, providing a metal electrode on each side of the central metal electrode helps to finely adjust the electric field distribution by separately adjusting the voltages of the metal electrodes on both sides. For example, it can balance the direction of the electric field lines, adjust the distribution of the electric field strength in different regions, etc., to achieve flexible adjustment of the electric field. The dynamic adsorption effect on the target material can also be optimized by adjusting the voltage amplitude and frequency. For example, for nanomaterials with a low dielectric constant (such as polymers or oxides), a higher electric field strength can be used to induce polarization of the material, thereby generating a stronger electrostatic adsorption force.

[0059] In addition, compared with the annular electrode, the geometric structure of the sheet electrode is simple, the processing complexity is lower, and it is easy to realize the preparation of small-sized electrodes to meet the requirements of microprobes. In addition to the unstable electric field, the preparation process of the annular electrode is more complex, and it is difficult to prepare small-sized annular electrodes to meet the requirements of microprobes or for large-scale mass production.

[0060] Based on the above electrostatic adsorption microprobe, the present disclosure also provides a method for preparing an electrostatic adsorption microprobe. The following will be combined with Figure 4 、 Figure 5 to describe this preparation method in detail.

[0061] Figure 4 Schematically shows a flowchart of a method for preparing an electrostatic adsorption microprobe according to an embodiment of the present disclosure. Figure 5 Schematically shows a schematic diagram of a method for preparing an electrostatic adsorption microprobe according to an embodiment of the present disclosure.

[0062] As Figure 4 、 Figure 5 shown, this preparation method may include operations S410 to S450, for example.

[0063] In operation S410, an insulating layer is grown based on plasma-enhanced chemical vapor deposition technology.

[0064] In some embodiments, an insulating layer is deposited on the surface of a 4-inch silicon wafer using plasma-enhanced chemical vapor deposition technology. The material of this insulating layer is preferably silicon nitride or silicon dioxide, and the thickness can be 300 nm to 500 nm.

[0065] In operation S420, a first metal electrode is prepared on the surface of the insulating layer.

[0066] In some embodiments, a metal layer is deposited on the surface of the insulating layer using magnetron sputtering technology. The material of this metal layer can be copper, and the thickness is 100 to 300 nm. A positive photoresist is spin-coated on the surface of the deposited metal layer, and the metal electrode is defined by photolithography patterning technology. Subsequently, using the positive photoresist as a hard mask, the excess metal layer on the insulating layer is removed by reactive ion etching technology to form the first layer of electrode structure (i.e., the first metal electrode).

[0067] In operation S430, an insulating layer is deposited on the surface of the first metal electrode, and the above steps are repeated until a sheet-like metal electrode group is obtained.

[0068] In some embodiments, operation S430 may include operations S431 to S432, for example.

[0069] In operation S431, an insulating layer is deposited on the surface of the first metal electrode, and a second metal electrode is fabricated on the surface of the deposited insulating layer.

[0070] In some embodiments, an insulating layer with a thickness of 700 nm to 900 nm is deposited on the surface of the first metal electrode by plasma enhanced chemical vapor deposition. A metal layer with a thickness of 400 nm to 600 nm is deposited on the surface of the deposited insulating layer. Subsequently, positive photoresist is spin-coated, and the metal electrode is defined using photolithography patterning technology. Using the positive photoresist as a hard mask, the excess metal layer on the insulating layer is removed by reactive ion etching to obtain the second layer of electrode (i.e., the second metal electrode).

[0071] In operation S432, an insulating layer is deposited on the surface of the second metal electrode, and a third metal electrode is fabricated on the surface of the deposited insulating layer to obtain a sheet-like metal electrode group.

[0072] In some embodiments, an insulating layer with a thickness of 700 nm to 900 nm is deposited on the surface of the second metal electrode. A metal layer with a thickness of 100 nm to 300 nm is deposited on the surface of the deposited insulating layer. Subsequently, positive photoresist is spin-coated, and the metal electrode is defined using photolithography patterning technology. Using the positive photoresist as a hard mask, the excess metal layer on the insulating layer is removed by reactive ion etching to obtain the third layer of electrode (i.e., the third metal electrode). The thickness of the third metal electrode is the same as that of the first metal electrode, and the thickness of the insulating layer deposited on the surface of the second metal electrode is the same as that of the insulating layer deposited on the surface of the first metal electrode. The first metal electrode, the second metal electrode, and the third metal electrode form a sheet-like metal electrode group.

[0073] In the specific implementation process, for the specific process of depositing the insulating layer and the material of the insulating layer, please refer to operation S410. For the specific process of fabricating the second metal electrode and the third metal electrode and the materials of the first metal electrode and the third metal electrode, please refer to operation S420, which will not be elaborated here.

[0074] In operation S440, an insulating layer is deposited on the surface of the sheet-like metal electrode group to cover the sheet-like metal electrode group.

[0075] In some embodiments, an insulating layer with a thickness of 300 nm to 500 nm is deposited on the surface of the third metal electrode to cover the sheet-like metal electrode group.

[0076] In operation S450, the insulating layer is etched using a photolithography patterning technique to obtain an electrostatic adsorption microprobe.

[0077] In some embodiments, a positive photoresist is spin-coated on the surface of the insulating layer, and a microprobe structure is defined using a photolithography patterning technique. Subsequently, the excess insulating layer is etched away using a reactive ion etching technique to form the microprobe structure, and the wafer with the microprobes on its surface is placed in a tetramethylammonium hydroxide (TMHA) solution for wet etching, etching the silicon under the microprobes to release the microprobes from the wafer, thereby obtaining an electrostatic adsorption microprobe.

[0078] The embodiments of the present disclosure have been described above. However, these embodiments are merely for illustrative purposes and not for limiting the scope of the present disclosure. Although the embodiments have been described separately above, this does not mean that the measures in each embodiment cannot be used advantageously in combination. Without departing from the scope of the present disclosure, those skilled in the art can make various substitutions and modifications, and these substitutions and modifications should all be included within the protection scope of the present disclosure.

Claims

1. An electrostatic adsorption microprobe, characterized in that: include: The needle tip includes a sheet metal electrode group, which forms an electric field when powered, and the electric field is used to adsorb the target material; The electrical connection interface is used to connect an external power source, and the external power source is used to control the voltage of the sheet metal electrode group to form the electric field at the needle tip.

2. The electrostatic adsorption microprobe according to claim 1, characterized in that: The sheet-shaped metal electrode group is composed of three metal electrodes, which are arranged in parallel and have the same width.

3. The electrostatic adsorption microprobe according to claim 2, characterized in that: The number of the electrical connection interfaces is the same as the number of the metal electrodes, each metal electrode corresponds to one electrical connection interface, and different voltages are applied to the three metal electrodes to form an electric field for adsorbing the target material.

4. The electrostatic adsorption microprobe according to claim 3, characterized in that: A high voltage is applied to the metal electrode located in the middle of the sheet-shaped metal electrode group, and a low voltage is applied to the other metal electrodes in the sheet-shaped metal electrode group, so as to form an electric field between the electrodes. 5 . The electrostatic adsorption microprobe according to claim 1 , wherein the needle tip after being energized is brought close to the target material, an electrostatic adsorption force is generated between the electric field and the target material, and the target material is adsorbed on the needle tip.

6. The electrostatic adsorption microprobe according to claim 1, further comprising: An insulating layer is used to wrap the sheet-shaped metal electrode group.

7. The electrostatic adsorption microprobe according to claim 2, wherein the metal electrodes are arranged in parallel, the width of the metal electrodes is 1.8 μm to 2.2 μm, the thickness of the metal electrodes is different, the thickness of the metal electrode in the middle is 0.4 μm to 0.6 μm, and the thickness of the other metal electrodes is 0.1 μm to 0.3 μm.

8. The electrostatic adsorption microprobe according to claim 7, characterized in that: The material of the metal electrode is copper.

9. The electrostatic adsorption microprobe according to claim 6, characterized in that: The insulating layer is made of silicon dioxide or silicon nitride.

10. A method for preparing an electrostatic adsorption microprobe, for preparing the electrostatic adsorption microprobe according to any one of claims 1 to 9, characterized in that: The method comprises: Growing an insulating layer based on plasma enhanced chemical vapor deposition technology; Preparing a first metal electrode on the surface of the insulating layer; Depositing an insulating layer on the surface of the first metal electrode, and repeating the above steps until a sheet-shaped metal electrode group is obtained; Depositing an insulating layer on the surface of the sheet-shaped metal electrode group so that the insulating layer covers the sheet-shaped metal electrode group; The insulating layer is etched by photolithography patterning technology to obtain the electrostatic adsorption microprobe.

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