Vapor deposition equipment cooling system and vapor deposition equipment

Abstract

The invention provides a vapor deposition equipment cooling system and vapor deposition equipment, belongs to the field of vapor deposition processes, and aims to solve the problem of gas leakage caused by a sensor for measuring the operation condition of a cooling fan. The cooling system specifically comprises a circulating pipeline communicated with a pressure-bearing shell of the vapor deposition equipment; a fan and a heat exchanger are arranged in the circulating pipeline, and the circulating pipeline is used for circulating and cooling gas between the pressure-bearing shell and an upper cover of the vapor deposition equipment; the fan differential pressure sensor is located in a sealing box, the first end of the fan differential pressure sensor measures the pressure of the upstream of the fan, the second end of the fan differential pressure sensor measures the pressure of the downstream of the fan, and the internal pressure of the sealing box and the internal pressure of the pressure bearing shell change synchronously. And measuring the operation condition of the gas fan.

Description

Technical Field

[0001] The present invention relates to the technical field of vapor deposition processes, and particularly to a cooling system for a vapor deposition apparatus and the technical field of vapor deposition apparatuses. Background Art

[0002] During the vapor deposition process, in order to ensure the uniformity of epitaxial film formation, the control of gas flow and temperature becomes the key to improving uniformity. The reaction gas can be made to flow in a laminar manner as much as possible to improve the film formation uniformity. Corresponding hardware improvements require the lower surface of the upper cover of the chamber to be as flat as possible. At the same time, in order to ensure sufficient heat radiation transmittance, the thickness of the transparent quartz upper cover also needs to be as thin as possible. While meeting the above objectives, the mechanical strength of the upper cover also needs to be considered. Because during the process, the process environment below the upper cover is close to vacuum. If it is to withstand the pressure on both sides of the upper cover, it is necessary to reduce the pressure difference on both sides of the upper cover and lower the pressure on the upper side of the upper cover. However, gas circulation is also required on the upper side of the upper cover for cooling.

[0003] In the above technical solution, when cooling, it is necessary to monitor the working state of the fan that promotes circulation. The sensors used are located in an environment of normal atmospheric pressure. When connecting to the negative pressure environment where the upper cover is located through the gas flow pipeline, the low airtightness of the sensors themselves will cause damage to the negative pressure environment. Therefore, a solution capable of measuring the working condition of the fan in the negative pressure cooling circuit is required. Summary of the Invention

[0004] To solve the technical problem of monitoring the working state of the fan in the negative pressure air-cooling system, the present invention provides a cooling system for a vapor deposition apparatus. The vapor deposition apparatus includes an upper cover and a pressure-bearing shell above the upper cover. The cooling system further includes:

[0005] A circulation pipeline communicated with the pressure-bearing shell;

[0006] A fan and a heat exchanger are arranged in the circulation pipeline, and the circulation pipeline is used for gas circulation cooling between the pressure-bearing shell and the upper cover;

[0007] A fan differential pressure sensor, the fan differential pressure sensor is located in a sealed box, and the first end of the fan differential pressure sensor measures the pressure upstream of the fan, the second end measures the pressure downstream of the fan, and,

[0008] The internal pressure of the sealed box changes synchronously with the internal pressure of the pressure-bearing shell.

[0009] Optionally, an airtight space is formed between the upper cover and the pressure-bearing shell. The vapor deposition apparatus further includes a decompression device for making the pressure in the airtight space less than one atmospheric pressure during the process.

[0010] Optionally, the heat exchanger is located above the fan, and the first end or the second end of the fan differential pressure sensor is located between the heat exchanger and the fan.

[0011] Optionally, the circulation pipeline includes:

[0012] An upper exchange chamber, where the heat exchanger is located. During the process, the gas temperature upstream of the heat exchanger is higher than that downstream of it.

[0013] An upstream connection pipeline for connecting the gas side upstream of the upper exchange chamber with the interior of the pressure-bearing shell.

[0014] A downstream connection pipeline for connecting the gas side downstream of the upper exchange chamber with the interior of the pressure-bearing shell.

[0015] Optionally, the upstream connection pipeline and / or the downstream connection pipeline further includes a section of corrugated pipe.

[0016] Optionally, the connection ports of the upstream connection pipeline and the downstream connection pipeline with the pressure-bearing shell are oppositely arranged on the side wall of the pressure-bearing shell, and the two connection ports are arranged vertically.

[0017] Optionally, the fan is located at the downstream gas of the heat exchanger.

[0018] Optionally, the seal box is connected to a pressure regulating device for adjusting the pressure in the seal box to change synchronously with the pressure in the airtight space.

[0019] Optionally, the first end of the fan differential pressure sensor is connected to the circulation pipeline in the upstream gas area of the fan, the second end of the fan differential pressure sensor is connected to the space in the seal box, and the seal box is connected to the circulation pipeline in the downstream gas area of the fan; or

[0020] The second end of the fan differential pressure sensor is connected to the circulation pipeline in the downstream gas area of the fan, the first end of the fan differential pressure sensor is connected to the space in the seal box, and the seal box is connected to the circulation pipeline in the upstream gas area of the fan.

[0021] Optionally, it further includes:

[0022] A circulation flow rate sensor, which is located in the seal box, and the circulation flow rate sensor is connected to the circulation pipeline through an air flow pipe.

[0023] Optionally, the air flow pipe includes a parallel pipe and a vertical pipe. The opening of the parallel pipe is oppositely arranged with the air flow direction in the circulation pipeline, the opening of the vertical pipe is vertically arranged with the air flow direction in the circulation pipeline, and the circulation flow rate sensor is a differential pressure sensor, one end of which is connected to the parallel pipe and the other end is connected to the vertical pipe.

[0024] Optionally, a rectifying tube is sleeved outside the parallel tube and the vertical tube.

[0025] Optionally, the fan differential pressure sensor is electrically connected to the control system through an airtight cable passing through the sealed box for data transmission collection.

[0026] Optionally, the gas in the circulation pipeline is air, nitrogen or helium.

[0027] Optionally, the heat exchanger is a metal grid with coolant flowing inside.

[0028] The present invention further discloses a chemical vapor deposition apparatus, comprising:

[0029] A chamber frame made of a metal material;

[0030] An upper cover located on the upper side of the chamber frame and a lower cover located on the lower side of the chamber frame, and the chamber frame, the upper cover and the lower cover enclose an airtight process space for performing a chemical vapor deposition process;

[0031] A pressure-bearing housing located above the chamber frame and hermetically connected to the chamber frame, which can enclose an airtight space with the upper cover;

[0032] A base located in the process space, and its upper surface is used to carry a substrate;

[0033] The chemical vapor deposition apparatus cooling system as described in any one of the above.

[0034] Optionally, the upper cover and the lower cover are made of transparent quartz material.

[0035] Optionally, a heating lamp and a reflector located above the heating lamp are arranged in the pressure-bearing housing.

[0036] Optionally, the air inlet of the circulation pipeline is located above the heating lamp, and the air outlet is located below the heating lamp.

[0037] Optionally, air inlets and air outlets are oppositely arranged on both sides of the chamber frame for introducing process gas into the process space.

[0038] Optionally, a pressure controller is further included, so that during the process, the gas pressure in the airtight space is less than one atmospheric pressure and greater than or equal to the gas pressure in the process space.

[0039] At least one of the above technical solutions has the following advantages or beneficial effects: The present invention provides a cooling system for a vapor deposition device and a vapor deposition device. A pressure difference sensor is used to monitor the pressure difference across the fan to evaluate whether the fan is operating normally. Moreover, the fan pressure difference sensor is located in a sealed box, and the pressure inside the sealed box changes synchronously with the pressure in the space above the upper cover, thereby avoiding the out-of-control air pressure on the upper side of the upper cover caused by the airtight defect of the fan pressure difference sensor itself. In some technical solutions, the technical means for synchronous change can be an active air pressure control or can be achieved by connecting the sealed box to the pipeline of the cooling cycle. The pipeline for connection can be a measuring pipe of the fan pressure difference sensor, thereby reducing the risk of air leakage in the cooling cycle pipeline. In other technical solutions, a flow sensor is also provided in the sealed box to measure the flow rate in the cooling cycle pipeline, and together with the pressure difference across the fan, it verifies whether the airflow in the cooling cycle pipeline is operating normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0041] Figure 1 Shows a schematic structural diagram of a vapor deposition device;

[0042] Figure 2 Shows a schematic structural diagram of a cooling system used in a vapor deposition device of the present invention;

[0043] Figure 3 Shows a schematic structural diagram of a cooling system used in a vapor deposition device of another embodiment;

[0044] Figure 4 Shows a schematic structural diagram of a cooling system used in a vapor deposition device of another embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0045] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0046] Figure 1The gas deposition equipment of the present invention specifically includes a chamber frame 110, which is made of metal material and provides a basis for assembling other components of the entire gas deposition equipment; the upper side and the lower side of the chamber frame 110 are respectively provided with openings. The opening on the upper side is used to assemble the upper cover 120, and the opening on the lower side is used to assemble the lower cover 130. The chamber frame 110, the upper cover 120 and the lower cover 130 enclose an airtight process space 140 for performing the gas deposition process; in order to maintain the airtightness of the process space 140, a sealing ring can also be provided at the contact between the upper cover 120, the lower cover 130 and the chamber frame 110.

[0047] Above the chamber frame 110, a pressure-bearing housing 150 is also provided. The pressure-bearing housing 150 covers the upper cover 120 and encloses an airtight space 160 with the upper cover 120. In some embodiments, the pressure-bearing housing 150 can be hermetically and movably connected to the upper surface of the chamber frame 110 and can be opened during chamber maintenance; the pressure-bearing housing 150 can also be movably connected to the upper surface of the upper cover 120 to achieve the same function. A base 170 is provided in the process space 140, and the upper surface of the base 170 can carry a substrate W. The gas deposition equipment cooling system 180 is connected to the pressure-bearing housing 150. The cooling system communicates with the airtight space 160 through an air-cooling cycle, takes away the excess heat in the airtight space 160, realizes the temperature control of various components in the airtight space 160, and the cooling system also has a working state feedback function, and the operation state of the fan is monitored in real time through a sensor to ensure that the temperature of components such as the upper cover 120 is within the working range, and further maintain the process of the substrate W.

[0048] As Figure 1 shown, in some other embodiments, a heating lamp 190 is provided in the airtight space 160. The material of the upper cover 120 can be quartz or other transparent materials. The heating lamp 190 can release thermal radiation outward and heat the substrate W located on the base 170 through the upper cover 120. At the same time, in order to improve the thermal efficiency, a reflector can also be provided above the heating lamp 190 to reflect the upward thermal radiation onto the substrate W. In order to increase the heating temperature, a heating lamp and a reflector can also be provided equivalently below the lower cover 130. At the same time, the lower cover 130 is also made of transparent quartz material to transmit thermal radiation.

[0049] An air inlet 111 and an air outlet 112 may also be provided on both sides of the chamber frame 110 for introducing reaction gas. The key to improving the uniformity of film formation is to make the reaction gas pass through the top of the substrate W in a plane flow field. Since the lower surface of the upper cover 120 is directly opposite to the substrate W, after the reaction gas enters from the air inlet 110, its flow field will be restricted by the lower surface of the upper cover 120 and the upper surface of the base 170. Therefore, in order to achieve a flat flow field, the closer the lower surface of the upper cover 120 is to a plane, the more it can meet the process requirements. However, because the process space 140 needs to react under low pressure during the process, if the upper surface of the upper cover 120 is in a normal atmospheric environment, the upper cover 120 needs to withstand the pressure difference on both sides. The planar upper cover 120 can only withstand the pressure by its own material hardness. At this time, if the requirements of the thermal radiation transmittance on the upper cover 120 are considered, the upper cover 120 with too thin high transmittance will not be able to withstand the pressure difference on both sides and will break. Therefore, it is necessary to reduce the pressure in the airtight space 160 to a level that the upper cover 120 that meets the above requirements can be used.

[0050] The airtight space 160 is controlled at a low pressure state, and a certain amount of gas needs to be retained for heat dissipation so that the heating lamp 190, the upper cover 120, etc. can be at an operating temperature, that is, the gas pressure in the airtight space 160 is less than one atmospheric pressure of the external conventional environment, and is greater than or equal to the gas pressure in the process space 140. Specifically, a pressure reducing device such as a vacuum pump 200 can be used to simultaneously control the pressure in the airtight space 160 and the process space 140, or two independent vacuum pumps can be used to control the pressure in the airtight space 160 and the process space 140 respectively. The cooling gas used for heat dissipation can be air, nitrogen or helium. Because the amount of gas in the low-pressure state is scarce, the normal operation of the cooling system 180 of the vapor deposition equipment is particularly important for whether the entire process can proceed as scheduled.

[0051] like Figure 2 The figure shows a schematic diagram of the structure of a cooling system 180 used in a vapor deposition device of the present invention, which specifically includes a circulation pipeline 181 connected to the pressure shell 150. The circulation pipeline 181 is mainly a closed cylindrical space, which is used to provide an outer wall restriction for the circulation flow of the cooling fluid. A fan 183 and a heat exchanger 182 are arranged in the circulation pipeline 181. The operation of the fan 183 provides guidance for the flow of cooling gas in the circulation pipeline 181, and the power of the fan 183 can control the flow rate of the cooling gas. The heat exchanger 182 has the function of cooling the high-temperature cooling gas. The heat transfer relying solely on the gas circulation is not enough to reduce the airtight space 160 to a suitable temperature. Active cooling is required to cool the fluid passing through the heat exchanger 182. The heat exchanger 182 can be any structure that can generate low temperature and take away the heat of the cooling gas. In this embodiment, the heat exchanger 182 is a metal grid with a coolant flowing inside. Figure 2Taking the clockwise gas cycle shown as an example (it can also be a cycle in other directions), the cooling gas is driven by the fan 183 to exchange heat with the high-temperature components in the airtight space 160, taking away the heat to the heat exchanger 182. The heat is taken out of the system through the heat exchanger 182. After the temperature of the cooling gas drops, it participates in the next cycle to complete the cooling of the airtight space 160.

[0052] In order to monitor the operating condition of the fan 183, the cooling system of this embodiment is also provided with a fan differential pressure sensor 184. The fan differential pressure sensor 184 is located in a sealed box 185. The first end of the fan differential pressure sensor 184 measures the pressure upstream of the fan, and the second end measures the pressure downstream of the fan. During the process, since the airtight space 160 will be controlled in a low-pressure state, the connected circulation pipeline 181 is basically in a low-pressure state at approximately the same level. The fan differential pressure sensor 184 needs to connect the gas regions upstream and downstream of the fan 183 to monitor whether the fan 183 is operating normally through the air pressure change brought by the flow of the cooling gas. However, the fan differential pressure sensor 184 itself has a problem of insufficient airtightness. If external gas enters the circulation pipeline 181 through the fan differential pressure sensor 184 during the long-term monitoring process, and then destroys the low-pressure state in the airtight space 160, it is very likely to cause damage to the upper cover 120. Therefore, the sealed box 185 is set so that its internal pressure changes synchronously with the internal pressure of the pressure-bearing shell 150, which not only ensures the low-pressure state of the airtight space 160 but also ensures the normal operation of the fan differential pressure sensor 184. It is worth mentioning that if the fan differential pressure sensor 184 is directly placed in the circulation pipeline, the flow and high temperature of the cooling fluid will directly impact the fan differential pressure sensor 184, affecting its reliability. Placing the fan differential pressure sensor 184 separately in the sealed box 185 and sealing all the inlets and outlets of the leads and measuring tubes is technically easier to achieve.

[0053] In some embodiments, both ends of the fan differential pressure sensor 184 are Figure 1 connected to the rigid tubes 1841 and 1842 located on the upper and lower sides of the fan 183 through two hoses as shown. The rigid tubes 1841 and 1842 can be made of metal, and the connections between them and the circulation pipeline 181 are sealed with airtight flanges. Similarly, the connections between both ends of the fan differential pressure sensor 184 and the sealed box 185 can also be sealed with airtight flanges. The air pressure control of the sealed box 185 can use an air pump 1851 to actively evacuate the air, so that the air pressure in the sealed box 185 reaches the same level as the air pressure in the circulation pipeline 181. The fan differential pressure sensor 184 is electrically connected to the control system through an airtight cable 1852 passing through the sealed box, thereby transmitting the measurement data out of the sealed box 185.

[0054] In some other embodiments, the circulation pipeline 181 includes an upper exchange chamber 1811, an upstream connection pipeline 1812, and a downstream connection pipeline 1813. The heat exchanger 182 is located in the upper exchange chamber 1811. To improve the cooling effect of the cooling gas passing through the heat exchanger 182, the upper exchange chamber 1811 can be designed as a rectangular or cylindrical shell with a larger space, and the heat exchanger 182 is located at the middle position of the upper exchange chamber 1811. During the process, the gas temperature upstream of the heat exchanger 182 is higher than that downstream of it. The upstream connection pipeline 1812 and the downstream connection pipeline 1813 can be cylinders with a smaller inner diameter, which are respectively used to connect the gas side upstream of the upper exchange chamber 1811 and the gas side downstream of the upper exchange chamber with the inside of the pressure-bearing shell 150. In this embodiment, the fan 183 can be located on the downstream connection pipeline 1813, so that the cooling gas flowing through the fan 183 is at a relatively low temperature to protect the fan 183. Correspondingly, the rigid pipes 1841 and 1842 for providing gas data at both ends of the fan differential pressure sensor 184 are also located on the downstream connection pipeline 1813. In some embodiments, to reduce the cooling dead angle in the airtight space 160, as Figure 2 shown, the connection ports of the upstream connection pipeline 1812 and the downstream connection pipeline 1813 with the pressure-bearing shell 150 are oppositely arranged on the side wall of the pressure-bearing shell 150, and the two connection ports are arranged vertically, for example, they can be located above and below the plane where the heater is located. For example, when the cooling gas circulates clockwise, the connection port of the downstream connection pipeline 1813 is located below the pressure-bearing shell 150, so that the cooling gas with a lower temperature preferentially exchanges heat with the upper cover 120 and gradually flows upward from the bottom of the airtight space 160.

[0055] As Figure 3The following is a schematic structural diagram of a cooling system used in another vapor deposition device provided by the present invention. The difference between this embodiment and the above embodiment is that in order to synchronize the internal pressure of the sealing box 185 with the internal pressure of the pressure-bearing shell 150, the second end of the fan differential pressure sensor 184 is connected to the circulation pipeline in the downstream gas area of the fan 183 through a hose to obtain the gas pressure downstream of the fan 183; the first end of the fan differential pressure sensor 184 is connected to the space inside the sealing box 185, and the measured result represents the gas pressure inside the sealing box 185. And the sealing box 185 is connected to the circulation pipeline in the upstream gas area of the fan 183 through a hose. Thus, the gas pressure inside the sealing box 185 measured by the first end of the fan differential pressure sensor 184 is equal to the gas pressure in the upstream gas area of the fan 183. This embodiment can reduce the active air pressure control of the sealing box 185 and simplify the structure on the basis of satisfying the synchronous change between the sealing box 185 and the airtight space 160. According to this inventive concept, the first end of the fan differential pressure sensor 184 can also be connected to the circulation pipeline in the upstream gas area of the fan 183, the second end of the fan differential pressure sensor 184 can be connected to the space inside the sealing box 185, and the sealing box 185 is connected to the circulation pipeline in the downstream gas area of the fan 183. In some other embodiments, the upstream connecting pipeline 1812 and the downstream connecting pipeline 1813 may include bellows 1814. Since most of the structures of the upper exchange cavity 1811, the upstream connecting pipeline 1812, and the downstream connecting pipeline 1813 are rigid structures, alignment errors are inevitable during the assembly process. Through the elastic structure of the bellows 1814, the errors in structural processing can be compensated, ensuring a tight connection at the alignment position, and thus reducing gas leakage caused by misalignment.

[0056] As Figure 3 The following is a schematic structural diagram of a cooling system used in another embodiment of the vapor deposition device of the present invention. The difference between this embodiment and the above embodiment is that in order to strictly monitor the gas circulation condition in the circulation pipeline 181 and assist in determining the operating condition of the fan 183, a circulation flow rate sensor 186 is further provided in the sealing box 185. The circulation flow rate sensor 186 is connected to the circulation pipeline through an air flow pipe, and the circulation condition of the cooling gas is assisted in being evaluated by measuring the gas flow rate in the circulation pipeline. The circulation flow rate sensor 186 can select all devices that can measure the flow rate by introducing gas, such as a thermal gas flow meter, a differential pressure flow meter, etc. This embodiment is described by taking a differential pressure sensor as an example. For the purpose of comparison, as Figure 3As shown, the blower differential pressure sensor 184 measures the upstream and downstream pressures of the blower at the downstream connecting pipeline 1813, while the circulating flow rate sensor 186 measures the gas flow rate at the upstream connecting pipeline 1812. In other embodiments, it can also be located on the same side to measure different physical quantities as a reference. In this embodiment, the air flow pipe includes a parallel pipe 1861 and a vertical pipe 1862. One end of the circulating flow rate sensor 186 communicates with the parallel pipe 1861, and the other end communicates with the vertical pipe 1862. The opening of the parallel pipe 1861 is arranged opposite to the air flow direction in the circulating pipeline, that is, when the cooling gas circulates, it directly flows into the parallel pipe 1861 through the opening of the parallel pipe 1861 to reach a section of the circulating flow rate sensor 186. The opening of the vertical pipe 1862 is arranged perpendicular to the air flow direction in the circulating pipeline, that is, the opening of the vertical pipe 1862 is opened on its side wall, so that when the cooling gas flows as shown in Figure 3 upward through the opening of the vertical pipe 1862 as the air pressure reference point of the circulating flow rate sensor 186. According to the principle of measuring the flow rate by the differential pressure sensor, when the gas density is known, according to the formula v 2 = 2(P t - P s ) / r, the flow rate can be obtained, where v is the gas flow rate, P t is the data obtained by the parallel pipe 1861, P s is the data obtained by the vertical pipe 1862, and r is the gas density.

[0057] In some other embodiments, there is a corner at the connection between the upstream connecting pipeline 1812 and the pressure-bearing shell 150, resulting in turbulence in the gas flowing through the corner and upward into the parallel pipe 1861 or the vertical pipe 1862, causing measurement errors. Therefore, in this embodiment, a flow rectifying pipe 1863 is sleeved outside the parallel pipe 1861 and the vertical pipe 1862. The inner diameter of the flow rectifying pipe 1863 just surrounds the parallel pipe 1861 and the vertical pipe 1862, and has a certain length extending downward, so that the cooling gas can be constrained by the side wall of the flow rectifying pipe 1863 to become a gas flow in a basically single direction, improving the accuracy of the flow rate measurement.

[0058] The cooling system of the vapor deposition equipment disclosed in the present invention is not limited to being applied to the above-mentioned epitaxial processing equipment, and can also be applicable to other vapor deposition systems with differential pressure requirements, which will not be elaborated here.

[0059] Although the content of the present invention has been introduced in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art read the above content, various modifications and substitutions to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A cooling system for a vapor deposition device, the vapor deposition device comprising an upper cover and a pressure-bearing shell above the upper cover, characterized in that, The cooling system further includes: A circulation pipeline communicated with the pressure-bearing shell; A fan and a heat exchanger are arranged in the circulation pipeline, and the circulation pipeline is used for gas circulation cooling between the pressure-bearing shell and the upper cover; A fan differential pressure sensor, the fan differential pressure sensor is located in a sealed box, and a first end of the fan differential pressure sensor measures the pressure upstream of the fan, a second end measures the pressure downstream of the fan, and, The internal pressure of the sealed box changes synchronously with the internal pressure of the pressure-bearing shell.

2. The gas deposition equipment cooling system according to claim 1, wherein, An airtight space is formed between the upper cover and the pressure-bearing shell, and the chemical vapor deposition equipment further includes a decompression device for making the pressure in the airtight space less than one atmospheric pressure during the process.

3. The gas deposition equipment cooling system according to claim 1, characterized in that, The heat exchanger is located above the fan, and the first end or the second end of the fan differential pressure sensor is located between the heat exchanger and the fan.

4. The gas deposition equipment cooling system according to claim 3, wherein, The circulation pipeline includes: An upper exchange chamber, the heat exchanger is located in the upper exchange chamber, and during the process, the gas temperature upstream of the heat exchanger is greater than the gas temperature downstream of it; An upstream connecting pipeline for connecting the upstream gas side of the upper exchange chamber with the inside of the pressure-bearing shell; a downstream connecting pipeline for connecting the downstream gas side of the upper exchange chamber with the inside of the pressure-bearing shell.

5. The cooling system of the vapor deposition apparatus according to claim 4, characterized in that, The upstream connecting pipeline and / or the downstream connecting pipeline further includes a section of corrugated pipe.

6. The cooling system of the vapor deposition equipment according to claim 4, wherein, The connection ports of the upstream connecting pipeline and the downstream connecting pipeline with the pressure-bearing shell are oppositely arranged on the side wall of the pressure-bearing shell, and the two connection ports are arranged vertically.

7. The cooling system of the vapor deposition apparatus according to claim 4, characterized in that, The fan is located at the downstream gas of the heat exchanger.

8. The cooling system of the vapor deposition apparatus according to claim 2, wherein The sealed box is communicated with a pressure regulating device for regulating the pressure in the sealed box to change synchronously with the pressure in the airtight space.

9. The gas deposition equipment cooling system according to claim 2, wherein, The first end of the fan differential pressure sensor is communicated with the circulation pipeline in the upstream gas area of the fan, the second end of the fan differential pressure sensor is communicated with the space in the sealed box, and the sealed box is communicated with the circulation pipeline in the downstream gas area of the fan; or The second end of the fan differential pressure sensor is communicated with the circulation pipeline in the downstream gas area of the fan, the first end of the fan differential pressure sensor is communicated with the space in the sealed box, and the sealed box is communicated with the circulation pipeline in the upstream gas area of the fan.

10. The gas deposition equipment cooling system according to claim 1, characterized in that, It further includes: A circulation flow rate sensor, which is located in the sealed box, and the circulation flow rate sensor is communicated with the circulation pipeline through an air flow pipe.

11. The gas deposition equipment cooling system according to claim 10, characterized in that, The air flow pipe includes a parallel pipe and a vertical pipe, the opening of the parallel pipe is oppositely arranged to the air flow direction in the circulation pipeline, the opening of the vertical pipe is perpendicular to the air flow direction in the circulation pipeline, and the circulation flow rate sensor is a differential pressure sensor, one end of which is communicated with the parallel pipe and the other end is communicated with the vertical pipe.

12. The gas deposition equipment cooling system according to claim 11, characterized in that, A rectifying pipe is sleeved outside the parallel pipe and the vertical pipe.

13. The cooling system of the vapor deposition equipment according to claim 1, wherein, The fan differential pressure sensor is electrically connected with the control system through an airtight cable passing through the sealed box for data transmission of acquisition.

14. The gas deposition equipment cooling system according to claim 1, wherein, The gas in the circulation pipeline is air, nitrogen or helium.

15. The cooling system of the vapor deposition apparatus according to claim 1, characterized in that, The heat exchanger is a metal grid with coolant flowing inside.

16. A vapor deposition device, characterized in that, It includes: A chamber frame, which is made of metal material; An upper cover located on the upper side of the chamber frame and a lower cover located on the lower side of the chamber frame, and the chamber frame, the upper cover and the lower cover enclose an airtight process space for performing a chemical vapor deposition process; A pressure-bearing housing, which is located above the chamber frame and is airtightly connected to the chamber frame, and can enclose an airtight space with the upper cover; A susceptor located in the process space, and its upper surface is used to carry a substrate; The chemical vapor deposition equipment cooling system according to any one of claims 1-15.

17. The vapor deposition apparatus according to claim 15, wherein The upper cover and the lower cover are made of transparent quartz material.

18. The vapor deposition apparatus according to claim 17, wherein A heating lamp and a reflector located above the heating lamp are arranged in the pressure-bearing housing.

19. The vapor deposition apparatus according to claim 18, wherein, The air inlet of the circulation pipeline is located above the heating lamp, and the air outlet is located below the heating lamp.

20. The vapor deposition apparatus according to claim 19, characterized in that, Air inlets and air outlets are oppositely arranged on both sides of the chamber frame for introducing process gases into the process space.

21. The vapor deposition apparatus according to claim 16, wherein A pressure controller is further included to make the gas pressure in the airtight space less than one atmospheric pressure and greater than or equal to the gas pressure in the process space during the process.

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