Multi-channel array light source and its manufacturing method

Abstract

The present invention provides a multi-channel array light source and a manufacturing method thereof. The multi-channel array light source includes at least two types of light-emitting units and a light source substrate. The light-emitting units and the light source substrate adopt a matching design. The light-emitting units are mounted on one side of the light source substrate. Different types of the light-emitting units are arranged alternately, and the gap between two adjacent light-emitting units is less than or equal to 0.12 mm, so as to be closely arranged on one side of the light source substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of lighting, and particularly to a multi-channel array light source and a manufacturing method thereof. Background Art

[0002] With the continuous development of LED lighting technology, while people meet traditional lighting needs, diverse requirements for lighting effects are also put forward. In response to this demand, lamps that can produce various lighting effects have been introduced on the market, such as two-color temperature lamps, multi-channel lamps, etc. Users can select appropriate lighting effects according to different application scenarios, personal preferences and other factors.

[0003] Reference Figure 1A As shown, an existing two-color temperature light source 10P is schematically shown. Corresponding Figure 1A As shown, this two-color temperature light source has two types of LED chips 11P and 12P. The LED chips 11P and 12P are arranged in regions and covered with phosphor glue, and can produce lighting light of different color temperatures. However, this design leads to extremely high difficulty in secondary optical light distribution in subsequent applications. Reference Figure 1B As shown, another existing two-color temperature light source 20P is schematically shown. Corresponding Figure 1B As shown, this two-color temperature light source 20P has two types of LED chips 21P and 22P. The LED chips 21P and 22P are alternately arranged in a checkerboard pattern and covered with phosphor glue, so as to be able to produce lighting light of different color temperatures. However, it is extremely difficult to control the parameter consistency of each LED chip 21P and 22P of this two-color temperature light source 20P, and the yield is difficult to control.

[0004] Reference Figure 1C As shown, an existing two-color temperature light source 30P is schematically shown. This two-color temperature light source 30P adopts a design scheme different from the above two light sources. This two-color temperature light source 30P has two types of LED chips 31P and 32P. The LED chips 31P and 32P are first pre-coated with a phosphor film as independent lamp beads, and then the lamp beads are alternately arranged and welded on the substrate, which improves the consistency of the light source to a certain extent. However, a wiring space needs to be reserved between the lamp beads, resulting in that the lamp beads cannot be closely arranged, and the wiring is complex. At the same time, there will be different numbers of jumpers based on the complexity of the wiring, such as setting a 0-ohm resistor. Therefore, the overall design complexity is high and the production is complex.

[0005] And with the continuous development of LED lighting technology and the popularization of health concepts, people's requirements for healthy lighting are also increasing. However, the above three types of light sources are limited by the structural design and are difficult to achieve a spectrum similar to sunlight, and cannot meet people's needs for pursuing higher light quality. Summary of the Invention

[0006] One object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the multi-channel array light source includes at least one first light-emitting unit and at least one second light-emitting unit, and each of the light-emitting units is closely arranged, which is beneficial to the optical design of subsequent applications.

[0007] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the light-emitting units of the multi-channel array light source are closely arranged with the gap between two adjacent light-emitting units being less than or equal to 0.12 mm, which is beneficial to the optical design of subsequent applications.

[0008] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the multi-channel array light source includes a light source substrate, wherein each of the light-emitting units is mounted on one side of the light source substrate, wherein the circuits of the multi-channel array light source are layered on the light source substrate, and the light-emitting units are connected to the circuits of the multi-channel array light source by being mounted on the light source substrate, without reserving wiring space between each of the light-emitting units, so that each of the light-emitting units can be arranged closely.

[0009] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the light-emitting units and the light source substrate are designed to match each other, so that each light-emitting unit can be closely arranged on the light source substrate and connected to the circuit, which is conducive to reducing the complexity of wiring.

[0010] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the light-emitting unit can form a light-emitting spectrum that is similar to the sunlight spectrum, thereby achieving a healthy lighting effect of the multi-channel array light source.

[0011] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof. The light-emitting unit includes at least one LED chip and a chip substrate. One side of the chip substrate is provided with a first pad and a second pad, and the other side of the chip substrate is provided with a first mounting pad and a second mounting pad. The first pad is electrically connected to the first mounting pad through a metallized hole passing through the chip substrate, and the second pad is electrically connected to the second mounting pad through a metallized hole passing through the chip substrate. The LED chip is disposed on the chip substrate in a state of being electrically connected to the first pad and the second pad. The light-emitting path of the LED chip is provided with a fluorescent glue layer. The fluorescent glue layers of the first light-emitting unit and the second light-emitting unit are different and are used as independent units. The light-emitting unit is mounted on the light source substrate with the other side, and is electrically connected to the circuit on the light source substrate based on the first mounting pad and the second mounting pad, so that each light-emitting unit can be closely arranged on the light source substrate.

[0012] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof. One side of the light source substrate carries at least one first LED pad pair and at least one second LED pad pair that match the first mounting pad and the second mounting pad. The first light-emitting unit is fixedly soldered to the light source substrate in a state where the first mounting pad and the second mounting pad are correspondingly soldered to the first LED pad pair, and the second light-emitting unit is fixedly soldered to the light source substrate in a state where the first mounting pad and the second mounting pad are correspondingly soldered to the second LED pad pair. The light source substrate carries a first channel pad pair and a second channel pad pair. The first LED pad pair is electrically connected to the first channel pad pair, and the second LED pad pair is electrically connected to the second channel pad pair to achieve electrical connection with the circuit in a state where the light-emitting unit is mounted on the light source substrate without wire bonding. Each light-emitting unit can be closely arranged in a state where the gap is less than or equal to 0.12 mm, and power is supplied to the first light-emitting unit based on the power supply to the first channel pad pair, and power is supplied to the second light-emitting unit based on the power supply to the second channel pad pair.

[0013] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof. The first channel pad pair includes a first channel positive pad and a first channel negative pad. The first LED pad pair includes a first LED positive pad and a first LED negative pad. The first LED positive pad is electrically connected to the first channel positive pad, and the first LED negative pad is electrically connected to the first channel negative pad. When the number of the first LED pad pairs is multiple, the first LED positive pad of one pair of the first LED pad pairs is electrically connected to the first channel positive pad, and this pair of the first LED pad pairs is correspondingly defined as the first pair of the first LED pad pairs. Each pair of the first LED pad pairs is connected in series in such a state that the first LED negative pad of the previous pair of the first LED pad pairs is electrically connected to the first LED positive pad of the next pair of the first LED pad pairs. The first LED negative pad of the last pair of the first LED pad pairs is electrically connected to the first channel negative pad. Thus, by connecting each pair of the first LED pad pairs in series, a state is formed in which the first LED positive pad is electrically connected to the first channel positive pad and the first LED negative pad is electrically connected to the first channel negative pad, simplifying the wiring.

[0014] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof. The second channel pad pair includes a second channel positive pad and a second channel negative pad. The second LED pad pair includes a second LED positive pad and a second LED negative pad. The second LED positive pad is electrically connected to the second channel positive pad, and the second LED negative pad is electrically connected to the second channel negative pad. When the number of the second LED pad pairs is multiple, the second LED positive pad of one pair of the second LED pad pairs is electrically connected to the second channel positive pad, and this pair of the second LED pad pairs is correspondingly defined as the first pair of the second LED pad pairs. Each pair of the second LED pad pairs is connected in series in such a state that the second LED negative pad of the previous pair of the second LED pad pairs is electrically connected to the second LED positive pad of the next pair of the second LED pad pairs. The second LED negative pad of the last pair of the second LED pad pairs is electrically connected to the second channel negative pad. Thus, by connecting each of the second LED pad pairs in series, a state is formed in which the second LED positive pad is electrically connected to the second channel positive pad and the second LED negative pad is electrically connected to the second channel negative pad, simplifying the wiring.

[0015] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the first channel pad pair and the second channel pad pair are carried on the other side of the light source substrate and are electrically connected to each LED pad through metallization holes, and the connection lines between each LED pad pair and each LED pad are arranged on two opposite sides of the light source substrate and are electrically connected to each LED pad through metallization holes, so that no connection lines need to be arranged on the side of the light source substrate carrying each LED pad, and thus each of the light-emitting units can be closely arranged on this side of the light source substrate.

[0016] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the connection lines between each LED pad pair are arranged in multiple layers on one side of the light source substrate, and complex routing is achieved through the multi-layer design. Therefore, even when the number of channels of the multi-channel array light source is relatively large, no connection lines need to be arranged on the side of the light source substrate carrying each LED pad, and thus each of the light-emitting units can be closely arranged on this side of the light source substrate.

[0017] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein based on the design of mutual matching between the light-emitting units and the light source substrate, when each of the light-emitting units is mounted on the corresponding pads of the light source substrate, the corresponding electrical connections are completed accordingly, thereby simplifying the production process of the multi-channel array light source and facilitating the close arrangement between each of the light-emitting units.

[0018] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the LED chip is fixedly soldered to the chip substrate in a state of being soldered to the second pad. The second pad not only realizes the electrical connection between the LED chip and the corresponding electrode but also realizes the heat dissipation of the LED chip. It is used as a thermal buffer heat sink for the LED chip and can quickly dissipate the heat generated by the LED chip to ensure the performance and stability of the LED chip.

[0019] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein a white wall adhesive is filled between each of the light-emitting units, thereby ensuring the light source consistency of the light-emitting units after each of the light-emitting units is mounted on the light source substrate and reducing the mutual influence between the light-emitting units.

[0020] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein at least one metal heat sink is further provided on the other side of the light source substrate to enhance the heat dissipation of the light-emitting units and ensure the performance and stability of the light-emitting units.

[0021] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein each of the light emitting units has at least two peaks in the wavelength range of 300nm - 500nm, and the light emitting units of the same type emit light simultaneously to correspondingly form the emission spectrum of the corresponding light emitting channel.

[0022] Another object of the present invention is to provide a multi-channel array light source and a manufacturing method thereof, wherein the LED chip is preferably a double quantum well chip, each of the light emitting units includes two of the LED chips, and the two LED chips of the same light emitting unit have different emission peak wavelengths, so that the light emitting unit can form multiple peaks based on the LED chips, and the light emitting unit can form an emission spectrum approximate to the sunlight spectrum.

[0023] According to one aspect of the present invention, the present invention provides a multi-channel array light source, wherein the multi-channel array light source includes:

[0024] At least one first light emitting unit and at least one second light emitting unit, wherein the light emitting unit includes at least one LED chip and a chip substrate, one side of the chip substrate is provided with a first pad and a second pad isolated from each other at intervals, the other side of the chip substrate is provided with a first mounting pad and a second mounting pad, wherein the first pad is electrically connected to the first mounting pad through a metallized hole passing through the chip substrate, the second pad is electrically connected to the second mounting pad through a metallized hole passing through the chip substrate, wherein the LED chip is disposed on the chip substrate in a state of being electrically connected to the first pad and the second pad, the light emitting path of the LED chip is provided with a fluorescent glue layer, and the fluorescent glue layers of different types of the light emitting units are different; and

[0025] A light source substrate, on one side of which there are carried at least one pair of first LED pads and at least one pair of second LED pads. The first light-emitting unit is mounted on the light source substrate in a state where the first mounting pad and the second mounting pad are correspondingly soldered to the first pair of LED pads. The second light-emitting unit is mounted on the light source substrate in a state where the first mounting pad and the second mounting pad are correspondingly soldered to the second pair of LED pads. The first light-emitting unit and the second light-emitting unit are arranged alternately, and the gap between two adjacent light-emitting units is less than or equal to 0.12 mm. The light source substrate carries a pair of first channel pads and a pair of second channel pads. The first pair of LED pads is electrically connected to the first pair of channel pads, and the second pair of LED pads is electrically connected to the second pair of channel pads, so as to supply power to the first light-emitting unit based on the power supply to the first pair of channel pads and supply power to the second light-emitting unit based on the power supply to the second pair of channel pads.

[0026] In an embodiment, the first pair of channel pads includes a first channel positive pad and a first channel negative pad. The first pair of LED pads includes a first LED positive pad and a first LED negative pad. The first LED positive pad is electrically connected to the first channel positive pad, and the first LED negative pad is electrically connected to the first channel negative pad. The second pair of channel pads includes a second channel positive pad and a second channel negative pad. The second pair of LED pads includes a second LED positive pad and a second LED negative pad. The second LED positive pad is electrically connected to the second channel positive pad, and the second LED negative pad is electrically connected to the second channel negative pad.

[0027] In one embodiment, the number of the first light-emitting units and the second light-emitting units is at least two, and the number of the corresponding first LED pad pairs and the number of the second LED pad pairs is at least two pairs. One of the first LED positive pads of one pair of the first LED pad pairs is electrically connected to the first channel positive pad, and correspondingly, this pair of the first LED pad pairs is defined as the first pair of the first LED pad pairs. Each pair of the first LED pad pairs is connected in series in a state that the first LED negative pad of the previous pair of the first LED pad pairs is electrically connected to the first LED positive pad of the next pair of the first LED pad pairs, and the first LED negative pad of the last pair of the first LED pad pairs is electrically connected to the first channel negative pad. One of the second LED positive pads of one pair of the second LED pad pairs is electrically connected to the second channel positive pad, and correspondingly, this pair of the second LED pad pairs is defined as the first pair of the second LED pad pairs. Each pair of the second LED pad pairs is connected in series in a state that the second LED negative pad of the previous pair of the second LED pad pairs is electrically connected to the second LED positive pad of the next pair of the second LED pad pairs, and the second LED negative pad of the last pair of the second LED pad pairs is electrically connected to the second channel negative pad.

[0028] In one embodiment, the first channel pad pair and the second channel pad pair are carried on the other side of the light source substrate and are electrically connected to each LED pad through metallized holes.

[0029] In one embodiment, the connection lines between each LED pad pair and each LED pad are arranged on two opposite sides of the light source substrate and are electrically connected through metallized holes.

[0030] In one embodiment, at least one metal heat sink is further arranged on the other side of the light source substrate.

[0031] In one embodiment, the height of the connection lines between each LED pad pair is lower than the height of each channel pad and the metal heat sink, and a solder mask layer is carried on the other side of the light source substrate to cover the connection lines between each LED pad pair.

[0032] In one embodiment, the light source substrate is a multilayer board, and the connection lines between each LED pad pair are arranged in multiple layers on one side of the light source substrate.

[0033] In one embodiment, a white wall adhesive is filled between each of the light-emitting units.

[0034] In one embodiment, the first channel pad and the second channel pad and each LED pad are carried on the same side of the light source substrate.

[0035] In one embodiment, the multi-channel array light source further includes an enclosure, where the enclosure and each LED pad are disposed on the same surface of the light source substrate and surround the light-emitting unit, and the enclosure is filled with transparent silica gel to protect the light-emitting unit.

[0036] In one embodiment, the multi-channel array light source further includes at least one third light-emitting unit, and a third LED pad pair and a third channel pad pair are carried on the light source substrate corresponding thereto.

[0037] In one embodiment, the LED chip is fixedly soldered to the chip substrate in a state of being soldered to the second pad.

[0038] In one embodiment, each of the light-emitting units has at least two peaks in the wavelength range of 300 nm - 500 nm.

[0039] In one embodiment, each of the light-emitting units includes two of the LED chips, and the two LED chips of the same light-emitting unit have different emission peak wavelengths, and the LED chip is an LED chip corresponding to a light-emitting spectrum having at least two peaks.

[0040] In one embodiment, the two peaks of each of the LED chips are respectively defined as a first peak and a second peak. The emission peak wavelength of the first peak of one of the LED chips of the same light-emitting unit is 442 nm within an error range of ±2.5 nm, and the emission peak wavelength of the second peak is 455 nm within an error range of ±2.5 nm. The emission peak wavelength of the first peak of the other LED chip is 468 nm within an error range of ±2.5 nm, and the emission peak wavelength of the second peak is 480 nm within an error range of ±2.5 nm.

[0041] In one embodiment, the chip substrate and the light source substrate are made of a ceramic substrate with a thermal conductivity greater than 18 W / m·K.

[0042] According to another aspect of the present invention, the present invention also provides a manufacturing method of a multi-channel array light source, and the manufacturing method of the multi-channel array light source includes the steps:

[0043] A. Fabricating at least one first light-emitting unit and at least one second light-emitting unit, including the steps:

[0044] A1. Set at least one LED chip on one side of a chip substrate, and electrically connect the LED chip to a first pad and a second pad carried on this side of the chip substrate, wherein the first pad and the second pad are respectively electrically connected to a first mounting pad and a second mounting pad on the other side of the chip substrate through metallization holes passing through the chip substrate;

[0045] A2. Cure a fluorescent glue layer in the light-emitting path of the LED chip, wherein the fluorescent glue layers of the first light-emitting unit and the second light-emitting unit are different;

[0046] B. Manufacture a light source substrate, including the steps of:

[0047] B1. Set at least one pair of first LED pads and at least one pair of second LED pads on one side of a ceramic substrate;

[0048] B2. Set a pair of first channel pads and a pair of second channel pads on the ceramic substrate;

[0049] B3. Connect the pair of first LED pads and the pair of first channel pads, and connect the pair of second LED pads and the pair of second channel pads;

[0050] C. Weld the first mounting pad and the second mounting pad of the first light-emitting unit to the pair of first LED pads correspondingly, and weld the first mounting pad and the second mounting pad of the second light-emitting unit to the pair of second LED pads correspondingly, so as to realize the power supply to the first light-emitting unit based on the power supply to the pair of first channel pads, and realize the power supply to the second light-emitting unit based on the power supply to the pair of second channel pads.

[0051] In an embodiment, the pair of first channel pads includes a first channel positive pad and a first channel negative pad, the pair of first LED pads includes a first LED positive pad and a first LED negative pad, the pair of second channel pads includes a second channel positive pad and a second channel negative pad, the pair of second LED pads includes a second LED positive pad and a second LED negative pad, and in the step B3, the first LED positive pad is electrically connected to the first channel positive pad, the first LED negative pad is electrically connected to the first channel negative pad, the second LED positive pad is electrically connected to the second channel positive pad, and the second LED negative pad is electrically connected to the second channel negative pad.

[0052] In one embodiment, the number of the first light-emitting units and the second light-emitting units is at least two, and the number of the corresponding first LED pad pairs and the number of the second LED pad pairs is at least two pairs. In the step B3, the first LED positive electrode pad of a pair of the first LED pad pairs is electrically connected to the first channel positive electrode pad, and correspondingly, this pair of the first LED pad pairs is defined as the first pair of the first LED pad pairs. Each pair of the first LED pad pairs is connected in series in a state that the first LED negative electrode pad of the previous pair of the first LED pad pairs is electrically connected to the first LED positive electrode pad of the next pair of the first LED pad pairs, and the first LED negative electrode pad of the last pair of the first LED pad pairs is electrically connected to the first channel negative electrode pad. The second LED positive electrode pad of a pair of the second LED pad pairs is electrically connected to the second channel positive electrode pad, and correspondingly, this pair of the second LED pad pairs is defined as the first pair of the second LED pad pairs. Each pair of the second LED pad pairs is connected in series in a state that the second LED negative electrode pad of the previous pair of the second LED pad pairs is electrically connected to the second LED positive electrode pad of the next pair of the second LED pad pairs, and the second LED negative electrode pad of the last pair of the second LED pad pairs is electrically connected to the second channel negative electrode pad.

[0053] In one embodiment, in the step B2, the first channel pad pair and the second channel pad pair are disposed on the other side of the ceramic substrate, and in the step B3, the channel pads are electrically connected to the LED pads through metallized holes.

[0054] In one embodiment, the step B2 further includes a step of disposing connection lines between the LED pad pairs on a side of the ceramic substrate opposite to each LED pad. In the step B3, the connection lines are electrically connected to the LED pads through metallized holes.

[0055] In one embodiment, the step B further includes a step B4 of disposing at least one metal heat sink on the other side of the ceramic substrate.

[0056] In one embodiment, the step B further includes a step B5 of disposing a solder mask layer on the other side of the ceramic substrate to cover the connection lines between the LED pad pairs.

[0057] In one embodiment, the ceramic substrate is a multilayer board, and in the step B2, the connection lines are disposed in multiple layers on one side of the ceramic substrate.

[0058] In one embodiment, the multi-channel array light source further includes a step D of filling white wall glue between the light-emitting units.

[0059] In one embodiment, in step B2, the first channel pad and the second channel pad are disposed on the surface of the ceramic substrate where the LED pads are located.

[0060] In one embodiment, the manufacturing method of the multi-channel array light source includes step E of setting up a fence around the light-emitting unit and filling transparent silica gel within the fence to protect the light-emitting unit.

[0061] In one embodiment, in step A1, the LED chip is soldered to the second pad.

[0062] In one embodiment, in step A, the chip substrate used is a ceramic substrate with a thermal conductivity greater than 18 W / m·K, and in step B, the ceramic substrate used is also a ceramic substrate with a thermal conductivity greater than 18 W / m·K.

[0063] Through the understanding of the subsequent description and the drawings, the further objects and advantages of the present invention will be fully manifested. Description of the Drawings

[0064] Figure 1A It is a schematic structural diagram of an existing two-color temperature light source.

[0065] Figure 1B It is a schematic structural diagram of an existing two-color temperature light source.

[0066] Figure 1C It is a schematic structural diagram of an existing two-color temperature light source.

[0067] Figure 2 It is a schematic structural diagram of a multi-channel array light source according to an embodiment of the present invention.

[0068] Figure 3A It is a schematic back structure diagram of a light-emitting unit of the multi-channel array light source according to the above embodiment of the present invention.

[0069] Figure 3B It is a schematic front structure diagram of a light-emitting unit of the multi-channel array light source according to the above embodiment of the present invention.

[0070] Figure 3C It is a schematic side structure diagram of a light-emitting unit of the multi-channel array light source according to the above embodiment of the present invention.

[0071] Figure 4A It is a schematic front structure diagram of a chip substrate of the multi-channel array light source according to the above embodiment of the present invention.

[0072] Figure 4BSchematic diagram of the back structure of a chip substrate of the multi-channel array light source according to the above embodiments of the present invention.

[0073] Figure 5A Schematic diagram of the back structure of a light source substrate of the multi-channel array light source according to the above embodiments of the present invention.

[0074] Figure 5B Schematic diagram of the front structure of a light source substrate of the multi-channel array light source according to the above embodiments of the present invention.

[0075] Figure 6 Schematic diagram of a deformed structure of the light source substrate of the multi-channel array light source according to the above embodiments of the present invention.

[0076] Figure 7 Schematic diagram of the structure of a deformed embodiment of the multi-channel array light source according to the above embodiments of the present invention.

[0077] Figure 8A Schematic diagram of the structure of a deformed embodiment of the multi-channel array light source according to the above embodiments of the present invention.

[0078] Figure 8B Corresponding Figure 8A Schematic diagram of the back structure of this deformed embodiment of the multi-channel array light source shown.

[0079] Figure 9 Schematic diagram of the structure of a deformed embodiment of the multi-channel array light source according to the above embodiments of the present invention.

[0080] Figure 10 Schematic diagram of the structure of a deformed embodiment of the multi-channel array light source according to the above embodiments of the present invention. Detailed implementation manners

[0081] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description can be applied to other implementation schemes, deformation schemes, improvement schemes, equivalent schemes, and other technical schemes that do not depart from the spirit and scope of the present invention.

[0082] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on the present invention.

[0083] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "a" should not be construed as a limitation on the quantity.

[0084] Referring to Figures 2 to 5B the drawings of the specification of the present invention, a multi-channel array light source 100 according to an embodiment of the present invention is schematically shown. The multi-channel array light source 100 includes at least two types of light-emitting units and a light source substrate 20. The light-emitting units include a first light-emitting unit 101 and a second light-emitting unit 102. The first light-emitting unit 101 and the second light-emitting unit 102 are alternately and closely mounted on the light source substrate 20 in the form of independent modules. The present invention is designed based on the mutual matching of the light-emitting units and the light source substrate 20, so that each light-emitting unit can be closely arranged on the light source substrate 20 and connected to the circuit, which is beneficial to reducing the complexity of wiring.

[0085] Specifically, the first light-emitting unit 101 and the second light-emitting unit 102 include at least one LED chip 13 and a chip substrate 11. One side of the chip substrate 11 is provided with a first pad 141 and a second pad 142, and the other side of the chip substrate 11 is provided with a first mounting pad 151 and a second mounting pad 152. The first pad 141 is electrically connected to the first mounting pad 151 through a metallized hole passing through the chip substrate 11, and the second pad 142 is electrically connected to the second mounting pad 152 through a metallized hole passing through the chip substrate 11. The LED chip 13 is disposed on the chip substrate 11 in a state of being electrically connected to the first pad 141 and the second pad 142. The light-emitting path of the LED chip 13 is provided with a fluorescent glue layer 12. The fluorescent glue layers 12 of different types of the light-emitting units are different, that is, the fluorescent glue layers 12 of the first light-emitting unit 101 and the second light-emitting unit 102 are different. The difference in the fluorescent glue layers 12 can be understood as the existence of different emission peak wavelengths of the corresponding phosphors and / or different ratios of the phosphors. Thus, they are used as independent units. The light-emitting unit is mounted on the light source substrate 20 with its other side, and is electrically connected to the circuit on the light source substrate 20 based on the first mounting pad 151 and the second mounting pad 152, so that the first light-emitting units 101 and the second light-emitting units 102 can be closely arranged on the light source substrate 20.

[0086] Further, at least one first LED pad pair 211 and at least one second LED pad pair 212 that match the first mounting pad 151 and the second mounting pad 152 are carried on one side of the light source substrate 20. The first light-emitting unit 101 is fixedly soldered to the light source substrate 20 with the first mounting pad 151 and the second mounting pad 152 correspondingly soldered to the first LED pad pair 211. The second light-emitting unit 102 is fixedly soldered to the light source substrate 20 with the first mounting pad 151 and the second mounting pad 152 correspondingly soldered to the second LED pad pair 212. The light source substrate 20 carries a first channel pad pair 221 and a second channel pad pair 222. The first channel pad pair 221 and the second channel pad pair 222 are adapted to connect different driving circuits. The first LED pad pair 211 is connected to the first channel pad pair 221, and the second LED pad pair 212 is connected to the second channel pad pair 222 to achieve electrical connection to the circuit in the state where the first light-emitting unit 101 and the second light-emitting unit 102 are mounted on the light source substrate 20 without wire bonding, and the adjacent first light-emitting unit 101 and second light-emitting unit 102 can be closely arranged.

[0087] Specifically, the first channel pad pair 221 includes a first channel positive pad 2211 and a first channel negative pad 2212. The first LED pad pair 211 includes a first LED positive pad 2111 and a first LED negative pad 2112. The first LED positive pad 2111 is electrically connected to the first channel positive pad 2211, and the first LED negative pad 2112 is electrically connected to the first channel negative pad 2212. The second channel pad pair 222 includes a second channel positive pad 2221 and a second channel negative pad 2222. The second LED pad pair 212 includes a second LED positive pad 2121 and a second LED negative pad 2122. The second LED positive pad 2121 is electrically connected to the second channel positive pad 2221, and the second LED negative pad 2122 is electrically connected to the second channel negative pad 2222.

[0088] It is worth mentioning that the number of the first light-emitting units 101 and the second light-emitting units 102 is set to be at least two. Correspondingly, the number of the first LED pad pairs 211 and the second LED pad pairs 212 is at least two pairs. The connection relationship between each pair of LED pad pairs and the corresponding channel pads is as follows: the first LED positive pad 2111 of one pair of the first LED pad pairs 211 is electrically connected to the first channel positive pad 2211, and this pair of the first LED pad pairs 211 is defined as the first pair of the first LED pad pairs. Each pair of the first LED pad pairs 211 is connected in series in a state where the first LED negative pad 2112 of the previous pair of the first LED pad pairs 211 is electrically connected to the first LED positive pad 2111 of the next pair of the first LED pad pairs. The first LED negative pad 2112 of the last pair of the first LED pad pairs 211 is electrically connected to the first channel negative pad 2212, so as to form a structural form in which the first LED positive pad 2111 is electrically connected to the first channel positive pad 2211 and the first LED negative pad 2112 is electrically connected to the first channel negative pad 2212.

[0089] Further, the second LED positive electrode pad 2121 of one pair of the second LED pad pairs 212 is electrically connected to the second channel positive electrode pad 2221. Correspondingly, this pair of the second LED pad pairs 212 is defined as the first pair of second LED pad pairs. Each pair of the second LED pad pairs 212 is connected in series in a state where the second LED negative electrode pad 2122 of the previous pair of the second LED pad pairs 212 is electrically connected to the second LED positive electrode pad 2121 of the next pair of the second LED pad pairs 212. The second LED negative electrode pad 2122 of the last pair of the second LED pad pairs 212 is electrically connected to the second channel negative electrode pad 2222. In this way, a structural form is formed in which the second LED positive electrode pad 2121 is electrically connected to the second channel positive electrode pad 2221, and the second LED negative electrode pad 2122 is electrically connected to the second channel negative electrode pad 2222.

[0090] Reference Figure 5A and Figure 5B , where the first and second LED pad pairs 211 and 212 and the first and second channel pad pairs 221 and 222 are disposed on two opposite surfaces of the light source substrate 20, and corresponding electrical connections are completed through metallization holes. The connection lines between the same type of LED pad pairs 211 or 212 and each LED pad are carried on two opposite sides of the light source substrate 20 and through metallization holes. In this way, no connection lines need to be arranged on the surface of the light source substrate 20 where each LED pad is carried, and thus each of the light emitting units can be closely arranged on this surface of the light source substrate 20.

[0091] It is worth mentioning that when the light source substrate 20 is a double-sided board, the connection lines between the same type of LED pad pairs 211 or 212 and each LED pad are carried on two opposite surfaces of the light source substrate 20 and are electrically connected through metallization holes. That is, each LED pad is disposed on the TOP layer of the light source substrate 20, and the connection lines are disposed on the BOT layer of the light source substrate 20. The BOT layer and the TOP layer are electrically connected through vias. Then, no connection lines need to be arranged on the surface of the light source substrate 20 where each LED pad is carried.

[0092] In particular, the light source substrate 20 is preferably a multi-layer board, wherein each LED solder pad is arranged on a surface layer (TOP layer) of the light source substrate 20, and the connection lines between the same type of LED solder pad pairs 211 or 212 are arranged in multiple layers on one side of the light source substrate 20 (BOT layer and middle layer). Complex routing is achieved through multi-layer circuit design. Therefore, even when the multi-channel array light source 100 has a large number of channels, there is no need to arrange connection lines on the side of the light source substrate 20 that carries the LED solder pads, so that each of the light-emitting units can be closely arranged on this surface of the light source substrate 20.

[0093] Specifically, in the present invention, the first light emitting units 101 and the second light emitting units 102 are alternately arranged and the gap between two adjacent light emitting units is less than or equal to 0.12 mm, so that they are closely arranged on the light source substrate 20 to form a good light mixing effect.

[0094] That is to say, the present invention is based on the design of mutual matching between the light-emitting unit and the light source substrate 20. When each light-emitting unit is mounted on the corresponding pad on the light source substrate 20, the corresponding electrical connection is completed, thereby simplifying the production process of the multi-channel array light source 100 and facilitating the close arrangement of the light-emitting units.

[0095] In addition, the light-emitting units are mounted on corresponding LED pads, and heat dissipation transfer can be formed for the light-emitting units based on the larger area of the LED pads, and the heat of the light-emitting units can be transferred to the light source substrate 20. While the light-emitting units are closely arranged, good heat dissipation performance can be guaranteed, thereby ensuring the working stability of the light-emitting units.

[0096] During the production process, the light-emitting unit and the light source substrate 20 are produced independently, and then the light-emitting unit is mounted on the light source substrate 20, so as to ensure the consistency of each light-emitting unit of the same type and simplify the production process. In other words, the LED chip 13 undergoes secondary packaging. The LED chip 13 is first soldered to the chip substrate 11 and bonded to the first solder pad 141 and the second solder pad 142 based on the corresponding wires. Then, the light-emitting unit is mounted as a whole on the light source substrate 20 to form a secondary package.

[0097] To facilitate further understanding of the present invention, the present invention also provides a method for manufacturing the multi-channel array light source 100, wherein the manufacturing method includes the steps of manufacturing the light-emitting unit, manufacturing the light source substrate 20, and mounting the light-emitting unit on the light source substrate 20, specifically including:

[0098] A. Fabricate at least one first light-emitting unit 101 and at least one second light-emitting unit 102, including the steps of:

[0099] A1. Dispose at least one LED chip 13 on one side of a chip substrate 11, and electrically connect the LED chip 13 to a first pad 141 and a second pad 142 carried on this side of the chip substrate 11, wherein the first pad 141 and the second pad 142 are respectively electrically connected to a first mounting pad 151 and a second mounting pad 152 on the other side of the chip substrate 11 through metallized holes passing through the chip substrate 11;

[0100] A2. Cure a phosphor layer 12 in the light-emitting path of the LED chip 13, wherein the phosphor layers 12 of the first light-emitting unit 101 and the second light-emitting unit 102 are different;

[0101] B. Fabricate a light source substrate 20, including the steps of:

[0102] B1. Dispose at least one first LED pad pair 211 and at least one second LED pad pair 212 on one side of a ceramic substrate;

[0103] B2. Dispose a first channel pad pair 221 and a second channel pad pair 222 on the ceramic substrate;

[0104] B3. Connect the first LED pad pair 211 and the first channel pad pair 221, and connect the second LED pad pair 212 and the second channel pad pair 222;

[0105] C. Weld the first mounting pad 151 and the second mounting pad 152 of the first light-emitting unit 101 to the first LED pad pair 211 correspondingly, and weld the first mounting pad 151 and the second mounting pad 152 of the second light-emitting unit 102 to the second LED pad pair 212 correspondingly, so as to supply power to the first light-emitting unit 101 based on the power supply to the first channel pad pair 221, and supply power to the second light-emitting unit 102 based on the power supply to the second channel pad pair 222.

[0106] In particular, the ceramic substrate is preferably a high thermal conductivity ceramic, such as, but not limited to, oxides, nitrides, carbides, borides, preferably aluminum nitride ceramic, to improve the heat dissipation effect on the light-emitting unit. The chip substrate 11 is also made of a high thermal conductivity ceramic, such as, but not limited to, oxides, nitrides, carbides, borides, preferably aluminum nitride ceramic, to improve the heat dissipation effect on the LED chip 13.

[0107] It is worth mentioning that the thermal conductivity of the light source substrate 20 and the chip substrate 11 is greater than 18 W / m·K, which is beneficial to ensuring the heat conduction and dissipation performance of the multi-channel array light source 100, ensuring the heat dissipation performance when the light-emitting units are closely arranged, and ensuring that each light-emitting unit can operate stably in the closely arranged state.

[0108] Particularly, in the step A, different types of the light-emitting units can be independently produced on different production lines, so as to ensure the consistency of the light-emitting units of the same type. Therefore, the step A can further include a step A3 of sorting each type of the light-emitting units as required to ensure the consistency of the light-emitting units.

[0109] It is worth mentioning that the size of each light-emitting unit is less than or equal to 2 mm×2 mm. And in this embodiment, after each light-emitting unit is mounted on the light source substrate 20, the difference between the area of the light-emitting surface formed by the whole light-emitting units and the area of the light source substrate 20 is less than 0.1 mm, that is, the light-emitting surface of the multi-channel array light source 100 tends to be equal to the area of the light source substrate 20.

[0110] Furthermore, in the present invention, preferably, the LED chip 13 is fixedly soldered to the chip substrate 11 in a state of being soldered to the second solder pad 142. That is to say, the second solder pad 142 not only realizes the electrical connection between the LED chip 13 and the corresponding electrode, but also realizes the heat dissipation of the LED chip 13. As a thermal buffer heat sink for the LED chip 13, it can quickly dissipate the heat generated by the LED chip 13 to ensure the performance and stability of the LED chip 13.

[0111] Particularly, on the side of the light source substrate 20 carrying the first channel solder pad pair 221 and the second channel solder pad pair 222, at least one metal heat sink 23 is further provided to enhance the heat dissipation of the light-emitting units and ensure the performance and stability of the light-emitting units.

[0112] It is worth mentioning that each light-emitting unit has at least two wave peaks in the wavelength range of 300 nm - 500 nm to ensure the continuity of the corresponding emission spectra of each light-emitting unit.

[0113] Preferably, in the present invention, each of the light-emitting units includes two of the LED chips 13, namely a first LED chip 131 and a second LED chip 132, and the first LED chip 131 and the second LED chip 132 of the same light-emitting unit have different emission peak wavelengths. The first LED chip 131 and the second LED chip 132 are LED chips corresponding to a light-emitting spectrum having at least two peaks. Then, each of the light-emitting units can generate at least four peaks in the wavelength range of 300 nm - 500 nm, and based on the excitation of the fluorescent glue layer 12, can generate a light-emitting spectrum approaching the sunlight spectrum. The first LED chip 131 and the second LED chip 132 are connected in series.

[0114] Specifically, two peaks of each of the LED chips 13 are respectively defined as a first peak and a second peak. The emission peak wavelength of the first peak of one of the LED chips 13 in the same light-emitting unit is 442 nm within an error range of ±2.5 nm, and the emission peak wavelength of the second peak is 455 nm within an error range of ±2.5 nm. The emission peak wavelength of the first peak of the other LED chip 13 is 468 nm within an error range of ±2.5 nm, and the emission peak wavelength of the second peak is 480 nm within an error range of ±2.5 nm, so as to form a light-emitting spectrum approaching the sunlight spectrum.

[0115] That is to say, in the present invention, the corresponding light-emitting spectrum of a single light-emitting unit approaches the sunlight spectrum. And based on the modular design of each of the light-emitting units, the light-emitting unit is mutually matched with the light source substrate 20, and corresponding electrical connection can be achieved when the light-emitting unit is mounted on the light source substrate 20. Therefore, while achieving the healthy lighting effect of the multi-channel array light source, without increasing the circuit complexity on the light source substrate 20, the circuits and pads on the light source substrate 20 only need to be double-sidedly laid out, and at the same time, a light-emitting spectrum approaching the sunlight spectrum can be generated.

[0116] Further, referring to Figure 6 of the specification drawings of the present invention, a solder mask layer 23 is further provided on one side of the light source substrate 20 that bears the connection lines of the first channel pad pair 221, the second channel pad pair 222, and each LED pad pair, so as to cover the connection lines between each LED pad pair and achieve protection of the lines.

[0117] Specifically, the height of the connection lines on the other side (BOT layer) of the light source substrate 20 is lower than that of the first channel pad pair 221, the second channel pad pair 222, and the metal heat sink 23, and is covered by the solder mask layer 23 to achieve insulation protection of the lines.

[0118] Further reference is made to Figure 7 wherein a white wall adhesive 30 is filled between the light-emitting units, thereby ensuring the light source consistency of the light-emitting units after the light-emitting units are mounted on the light source substrate 20, reducing the mutual influence between the light-emitting units, reducing the probability that the light emitted by the light-emitting units excites the fluorescent glue layer 12 of the adjacent light-emitting units, and ensuring the light source consistency.

[0119] In particular, based on the filling of the gaps between the light-emitting units with the white wall adhesive 30, the structural stability of the light-emitting units mounted on the light source substrate 20 can also be improved.

[0120] It is worth mentioning that in the above structure, the types of the light-emitting units are set to two, namely the first light-emitting unit 101 and the second light-emitting unit 102, wherein the first light-emitting unit 101 and the second light-emitting unit 102 are arranged alternately, that is, the light-emitting unit adjacent to the first light-emitting unit 101 is the second light-emitting unit 102, and the gap between two adjacent light-emitting units is less than or equal to 0.12 mm, so as to form a good light mixing effect.

[0121] It can be understood that the types of the light-emitting units are not limited to only two, and the number of types of the light-emitting units can be designed according to the actual product requirements. Refer to Figure 8A and Figure 8B as shown, wherein the multi-channel array light source 100 further includes a third light-emitting unit 103. Corresponding to the light source substrate 20, a third channel pad pair 223 and an LED pad pair electrically connected to the third channel pad pair 223 for mounting the third light-emitting unit 103 are further provided, and three types of light-emitting units: the first light-emitting unit 101, the second light-emitting unit 102, and the third light-emitting unit 103 are arranged alternately and closely.

[0122] In particular, further reference is made to Figure 9 and Figure 10 wherein the channel pad pair and the LED pad pair are arranged on the same surface of the light source substrate 20. That is to say, according to the actual design requirements, the channel pad pair can be arranged on the same surface of the light source substrate 20 as the LED pad pair, or can be arranged on two opposite surfaces of the light source substrate 20 as the LED pad pair.

[0123] It is worth mentioning that refer to Figure 9, wherein the multi-channel array light source 100 further includes a wall 40 surrounding the light-emitting units, wherein the wall 40 and each LED pad are disposed on the same surface of the light source substrate 20 and surround each light-emitting unit, and the interior of the wall 40 is filled with transparent silica gel to protect the light-emitting units.

[0124] In the description of the present specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In the present specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of different embodiments or examples.

[0125] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and described in the embodiments, and the embodiments of the present invention can have any deformation or modification without departing from the principle.

Claims

1. Multi-channel array light source, characterized in that Comprising: At least one first light-emitting unit and at least one second light-emitting unit, wherein the light-emitting unit comprises at least one LED chip and a chip substrate, one side of the chip substrate is provided with a first pad and a second pad isolated from each other at intervals, the other side of the chip substrate is provided with a first mounting pad and a second mounting pad, wherein the first pad is electrically connected to the first mounting pad through a metallized hole passing through the chip substrate, the second pad is electrically connected to the second mounting pad through a metallized hole passing through the chip substrate, wherein the LED chip is disposed on the chip substrate in a state of being electrically connected to the first pad and the second pad, wherein the light-emitting path of the LED chip is provided with a fluorescent glue layer, and the fluorescent glue layers of different types of the light-emitting units are different; and A light source substrate, on one side of which at least one pair of first LED pads and at least one pair of second LED pads are carried. The first light-emitting unit is mounted on the light source substrate in a state where the first mounting pad and the second mounting pad are correspondingly welded to the first pair of LED pads, and the second light-emitting unit is mounted on the light source substrate in a state where the first mounting pad and the second mounting pad are correspondingly welded to the second pair of LED pads. The first light-emitting unit and the second light-emitting unit are alternately arranged and the gap between two adjacent light-emitting units is less than or equal to 0.12 mm, wherein the light source substrate carries a first channel pad pair and a second channel pad pair, wherein the first LED pad pair is electrically connected to the first channel pad pair, and the second LED pad pair is electrically connected to the second channel pad pair, so as to supply power to the first light-emitting unit based on the power supply to the first channel pad pair, and supply power to the second light-emitting unit based on the power supply to the second channel pad pair. The first channel pad pair includes a first channel positive pad and a first channel negative pad. The first LED pad pair includes a first LED positive pad and a first LED negative pad. The first LED positive pad is electrically connected to the first channel positive pad, and the first LED negative pad is electrically connected to the first channel negative pad. The second channel pad pair includes a second channel positive pad and a second channel negative pad. The second LED pad pair includes a second LED positive pad and a second LED negative pad. The second LED positive pad is electrically connected to the second channel positive pad, and the second LED negative pad is electrically connected to the second channel negative pad. The number of the first light-emitting unit and the second light-emitting unit is at least two, and the number of the corresponding first LED pad pairs and the second LED pad pairs is at least two pairs. The first LED positive pad of a pair of the first LED pad pairs is electrically connected to the first channel positive pad, and correspondingly, this pair of the first LED pad pairs is defined as the first pair of the first LED pad pairs. Each pair of the first LED pad pairs is connected in series in a state that the first LED negative pad of the previous pair of the first LED pad pairs is electrically connected to the first LED positive pad of the next pair of the first LED pad pairs, and the first LED negative pad of the last pair of the first LED pad pairs is electrically connected to the first channel negative pad. The second LED positive pad of a pair of the second LED pad pairs is electrically connected to the second channel positive pad, and correspondingly, this pair of the second LED pad pairs is defined as the first pair of the second LED pad pairs. Each pair of the second LED pad pairs is connected in series in a state that the second LED negative pad of the previous pair of the second LED pad pairs is electrically connected to the second LED positive pad of the next pair of the second LED pad pairs, and the second LED negative pad of the last pair of the second LED pad pairs is electrically connected to the second channel negative pad.

2. The multi-channel array light source according to claim 1, wherein Wherein the first channel pad pair and the second channel pad pair are carried on the other side of the light source substrate and are electrically connected to each LED pad through metallized holes.

3. The multi-channel array light source according to claim 2, wherein Wherein the connection lines between each LED pad pair and each LED pad are disposed on two opposite sides of the light source substrate and are electrically connected through metallized holes.

4. The multi-channel array light source according to claim 3, wherein Wherein the other side of the light source substrate is further provided with at least one metal heat sink.

5. The multi-channel array light source according to claim 4, characterized in that Wherein the height of the connection lines between each LED pad pair is lower than the height of each channel pad and the metal heat sink, and the other side of the light source substrate carries a solder mask layer to cover the connection lines between each LED pad pair.

6. The multi-channel array light source according to claim 5, wherein Wherein the light source substrate is a multi-layer board, and the connection lines between each LED pad pair are multi-layered on one side of the light source substrate.

7. The multi-channel array light source according to claim 5, characterized in that, Wherein a white wall glue is filled between each of the light-emitting units.

8. The multi-channel array light source according to claim 1, wherein Wherein the first channel pad and the second channel pad and each LED pad are carried on the same side of the light source substrate.

9. The multi-channel array light source according to claim 7, characterized in that, Wherein the multi-channel array light source further comprises a fence, and the fence and each LED pad are disposed on the same side of the light source substrate and surround the light-emitting unit, and transparent silica gel is filled inside the fence to protect the light-emitting unit.

10. The multi-channel array light source according to claim 1, characterized in that, Wherein the multi-channel array light source further comprises at least one third light-emitting unit, and a third LED pad pair and a third channel pad pair are carried on the corresponding light source substrate.

11. The multi-channel array light source according to any one of claims 1 to 10, characterized in that, Wherein the LED chip is fixedly soldered to the chip substrate in a state of being soldered to the second pad.

12. The multi-channel array light source according to claim 11, wherein, Wherein each of the light-emitting units has at least two peaks in the wavelength range of 300nm - 500nm.

13. The multi-channel array light source according to claim 12, characterized in that, Wherein each of the light-emitting units comprises two of the LED chips, and the two LED chips of the same light-emitting unit have different emission peak wavelengths, and the LED chip is an LED chip corresponding to a light-emitting spectrum having at least two peaks.

14. The multi-channel array light source according to claim 13, characterized in that, The two peak wavelengths of each of the LED chips are defined as the first peak wavelength and the second peak wavelength respectively. The emission peak wavelength of the first peak of one of the LED chips in the same light-emitting unit is 442 nm within an error range of ±2.5 nm, the emission peak wavelength of the second peak is 455 nm within an error range of ±2.5 nm, the emission peak wavelength of the first peak of the other LED chip is 468 nm within an error range of ±2.5 nm, and the emission peak wavelength of the second peak is 480 nm within an error range of ±2.5 nm.

15. The multi-channel array light source according to any one of claims 1 to 10, characterized in that, The chip substrate and the light source substrate are made of ceramic substrates with a thermal conductivity greater than 18 W / m·K.

16. The manufacturing method of the multi-channel array light source according to any one of claims 1 to 15, characterized in that, Including the steps of: A. Fabricating at least one first light-emitting unit and at least one second light-emitting unit, including the steps of: A1. Disposing at least one LED chip on one side of a chip substrate, and electrically connecting the LED chip to a first pad and a second pad carried on this side of the chip substrate, wherein the first pad and the second pad are respectively electrically connected to a first mounting pad and a second mounting pad on the other side of the chip substrate through metallized holes passing through the chip substrate; A2. Curing a fluorescent glue layer in the light-emitting path of the LED chip, wherein the fluorescent glue layers of the first light-emitting unit and the second light-emitting unit are different; B. Fabricating a light source substrate, including the steps of: B1. Disposing at least one first LED pad pair and at least one second LED pad pair on one side of a ceramic substrate; B2. Disposing a first channel pad pair and a second channel pad pair on the ceramic substrate; B3. Connecting the first LED pad pair and the first channel pad pair, and connecting the second LED pad pair and the second channel pad pair; C. Welding the first mounting pad and the second mounting pad of the first light-emitting unit to the first LED pad pair correspondingly, and welding the first mounting pad and the second mounting pad of the second light-emitting unit to the second LED pad pair correspondingly, so as to supply power to the first light-emitting unit based on the power supply to the first channel pad pair, and supply power to the second light-emitting unit based on the power supply to the second channel pad pair.

17. The manufacturing method of the multi-channel array light source according to claim 16, wherein The first channel pad pair includes a first channel positive pad and a first channel negative pad, the first LED pad pair includes a first LED positive pad and a first LED negative pad, the second channel pad pair includes a second channel positive pad and a second channel negative pad, the second LED pad pair includes a second LED positive pad and a second LED negative pad. In the step B3, the first LED positive pad is electrically connected to the first channel positive pad, the first LED negative pad is electrically connected to the first channel negative pad, the second LED positive pad is electrically connected to the second channel positive pad, and the second LED negative pad is electrically connected to the second channel negative pad.

18. The manufacturing method of the multi-channel array light source according to claim 17, wherein, The number of the first light-emitting units and the second light-emitting units is at least two, and the number of the corresponding first LED pad pairs and the number of the second LED pad pairs is at least two pairs. In the step B3, the first LED positive electrode pad of a pair of the first LED pad pairs is electrically connected to the first channel positive electrode pad, and correspondingly, this pair of the first LED pad pairs is defined as the first pair of the first LED pad pairs. Each pair of the first LED pad pairs is connected in series in a state that the first LED negative electrode pad of the previous pair of the first LED pad pairs is electrically connected to the first LED positive electrode pad of the next pair of the first LED pad pairs, and the first LED negative electrode pad of the last pair of the first LED pad pairs is electrically connected to the first channel negative electrode pad. The second LED positive electrode pad of a pair of the second LED pad pairs is electrically connected to the second channel positive electrode pad, and correspondingly, this pair of the second LED pad pairs is defined as the first pair of the second LED pad pairs. Each pair of the second LED pad pairs is connected in series in a state that the second LED negative electrode pad of the previous pair of the second LED pad pairs is electrically connected to the second LED positive electrode pad of the next pair of the second LED pad pairs, and the second LED negative electrode pad of the last pair of the second LED pad pairs is electrically connected to the second channel negative electrode pad.

19. The manufacturing method of the multi-channel array light source according to claim 18, characterized in that, In the step B2, the first channel pad pair and the second channel pad pair are arranged on the other side of the ceramic substrate. In the step B3, the channel pads and the LED pads are electrically connected through metallized holes.

20. The manufacturing method of the multi-channel array light source according to claim 19, characterized in that, In the step B2, it further includes a step of arranging connection lines between the LED pad pairs on the side of the ceramic substrate opposite to each LED pad. In the step B3, the connection lines and the LED pads are electrically connected through metallized holes.

21. The manufacturing method of the multi-channel array light source according to claim 20, characterized in that, The step B further includes a step B4 of arranging at least one metal heat sink on the other side of the ceramic substrate.

22. The manufacturing method of the multi-channel array light source according to claim 21, wherein The step B further includes a step B5 of arranging a solder mask layer on the other side of the ceramic substrate to cover the connection lines between the LED pad pairs.

23. The manufacturing method of the multi-channel array light source according to claim 22, characterized in that The ceramic substrate is a multi-layer board. In the step B2, the connection lines are arranged in multiple layers on one side of the ceramic substrate.

24. The manufacturing method of the multi-channel array light source according to claim 22, characterized in that, The multi-channel array light source further includes a step D of filling white wall glue between the light-emitting units.

25. The manufacturing method of the multi-channel array light source according to claim 18, wherein In the step B2, the first channel pad and the second channel pad are arranged on the side of the ceramic substrate where the LED pads are arranged.

26. The manufacturing method of the multi-channel array light source according to claim 25, wherein, The manufacturing method of the multi-channel array light source includes a step E of arranging a fence around the light-emitting units and filling transparent silica gel inside the fence to protect the light-emitting units.

27. The manufacturing method of the multi-channel array light source according to any one of claims 16 to 26, characterized in that, In the step A1, the LED chip is soldered to the second pad.

28. The manufacturing method of the multi-channel array light source according to any one of claims 16 to 26, characterized in that, In the step A, the chip substrate used is a ceramic substrate with a thermal conductivity greater than 18 W / m·K. In the step B, the ceramic substrate used is a ceramic substrate with a thermal conductivity greater than 18 W / m·K.

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