Intelligent ultra-thin multifunctional support monitoring device and assembling method

Abstract

This invention discloses an intelligent ultra-thin multifunctional bearing monitoring device and its assembly method. The device includes a main bearing layer, a circuit layer on top of which has a wiring through-hole along its radial direction, a connecting plate on top of which has a circular through-hole between the circuit layer and the connecting plate, and a sensor module in the center of the through-hole. A rectangular groove is formed along the radial direction of the main bearing layer, and an external jacking adjustment module is located within the groove. A step is provided at one end of the inner side of the external jacking adjustment module, with a sloped bottom. A matching sensor lifting module is located at the top of the step. This invention achieves comprehensive intelligent real-time monitoring of the bearing and bridge health status through the sensor module, reducing the possibility of accidents. The height of the sensor module can be adjusted and it can be quickly replaced through the external jacking adjustment module, sensor lifting module, and fixing module, solving the problem of inconvenient adjustment and replacement of traditional sensor modules.

Description

Technical Field

[0001] This invention belongs to the technical field of bridge bearing monitoring devices, and more specifically, relates to an intelligent ultra-thin multifunctional bearing monitoring device and its assembly method. Background Technology

[0002] Traditional monitoring methods often rely on periodic manual inspections and limited data collection means, which are not only inefficient and costly, but also make it difficult to achieve real-time monitoring of structural conditions, especially in extreme environments or hard-to-reach locations.

[0003] Traditional monitoring equipment is typically large in size, complex to install, and can easily affect the performance of the original structure; existing systems have limited monitoring functions and cannot integrate multiple types of sensors to provide comprehensive data support; they lack intelligent and automated functions, such as automatic calibration, remote diagnostics, and troubleshooting, resulting in high maintenance costs and slow response times; energy supply issues limit the long-term stable operation of the system, especially in remote areas or places where it is difficult to lay power lines.

[0004] There is a strong market demand for efficient, reliable, and low-cost structural health monitoring solutions, especially those technologies that can reduce human intervention, improve early warning accuracy, and lower operating costs. With the development of emerging technologies such as the Internet of Things and artificial intelligence, more and more industries are seeking to apply these advanced technologies to the field of structural health monitoring to improve management efficiency and service quality. The demand for safety protection measures such as seismic reinforcement is particularly evident in earthquake-prone areas to ensure that the integrity and functionality of the structure can be maintained under extreme conditions. Summary of the Invention

[0005] To address the aforementioned deficiencies or improvement needs of existing technologies, this invention provides an intelligent ultra-thin multifunctional bearing monitoring device and assembly method. By integrating multiple types of sensors into a sensor module, the sensor module can transmit the collected data to the monitoring center for analysis and processing in real time. This enables comprehensive intelligent real-time monitoring of the bearing and bridge health status, predicting potential problems and issuing early warning signals, thus improving the accuracy and timeliness of early warnings. This allows maintenance personnel to react more quickly and take necessary measures, thereby reducing the possibility of accidents. Through an external jacking adjustment module, a sensor lifting module, and a fixing module set in the groove of the main bearing layer, the sensor module can be replaced without lifting the beam during bridge operation. The replaced sensor module can maintain the accuracy of the measurement data, solving the problem of inconvenient installation and disassembly during traditional sensor replacement.

[0006] To achieve the above objectives, according to one aspect of the present invention, an intelligent ultra-thin multifunctional support monitoring device is provided, comprising a main bearing layer having a circular or square shape, a circuit layer on top of the main bearing layer, and a connecting plate on top of the circuit layer for connecting and integrating different functional modules and providing mechanical support for the upper structure.

[0007] A circular through hole is provided between the circuit layer and the connecting plate. A sensor module is provided in the middle of the through hole to detect physical quantities and convert this information into electrical signals for output, so as to realize all-round monitoring of the support.

[0008] The main bearing layer has a rectangular groove along its radial direction. The end of the groove near the center of the main bearing layer is semi-circular. An external push adjustment module is provided in the groove. One end of the external push adjustment module is arc-shaped, and the radius of the arc is the same as the radius of the sensor module. A step is provided on the inner side of the external push adjustment module. The bottom of the step is sloping. A matching sensor lifting module is provided on the top of the step to adjust the height of the sensor module and ensure that the sensor module can accurately contact the support to obtain more accurate data.

[0009] Furthermore, an L-shaped vertical adjustment module is provided between the external push adjustment module and the sensor lifting module. There is a gap of not less than 1mm between the sides of the vertical adjustment module and the sensor lifting module, and the sensor lifting module and the vertical adjustment module can slide relative to each other.

[0010] Furthermore, the height of the sensor module is equal to the sum of the heights of the circuit layer and the connecting plate, the diameter of the sensor module is the same as the diameter of the circular through hole, and the connection lines of the sensor module are laid in the circuit layer.

[0011] Furthermore, the sensor module includes, but is not limited to, force sensors, temperature sensors, stress-strain sensors, acceleration sensors, tilt sensors, temperature and humidity sensors, or displacement sensors.

[0012] Furthermore, a fixing module is provided on the outside of the external push adjustment module, and the fixing module is fixedly connected to the main bearing layer by a snap fastener.

[0013] Furthermore, the connecting plate has a circular basin in the middle for limiting positioning.

[0014] Furthermore, the circuit layer is provided with vias in its radial direction.

[0015] Furthermore, a gap of not less than 1mm is provided between the external push adjustment module and the sensor lifting module.

[0016] According to a second aspect of the present invention, an assembly method for an intelligent ultra-thin multifunctional support monitoring device is provided, comprising the following steps:

[0017] S100: Based on the design drawings, prefabricate all components of the monitoring device in the factory, including the main bearing layer, circuit layer, connecting plate, sensor module, external jacking adjustment module and sensor lifting module, and check that the shape and function of all components meet the design requirements.

[0018] S200: Place the main support layer in the predetermined position, ensuring it is stable and level, and embed the sensor lifting module and the external pushing adjustment module into the groove of the main support layer, ensuring that the two are in close contact;

[0019] S300: Place the circuit layer on top of the main support layer, insert the sensor module into the circular through hole from the top of the circuit layer until its bottom contacts the top of the sensor lifting module, connect the connection line of the sensor module to the corresponding interface on the circuit layer, and ensure that the connection is firm and the signal transmission is normal.

[0020] S400: Place the connecting board on top of the circuit layer, ensuring that the circular through hole in the middle of the connecting board is precisely aligned with the position of the sensor module. Fix the entire device as a whole through the connecting board to ensure structural stability.

[0021] S500: Connects the external power supply to the power interface on the circuit layer to ensure that the monitoring device receives a stable power supply. It connects to the remote monitoring center through the communication interface to conduct data transmission tests and ensure that the monitoring data can be transmitted to the remote monitoring center accurately and reliably.

[0022] S600: Performs functional tests on the sensor modules, including the detection of pressure, temperature, stress and strain, acceleration, tilt angle, humidity and position. Based on the test results, it performs debugging and optimization to ensure that each sensor can work normally and output accurate signals.

[0023] Furthermore, an assembly method for an intelligent ultra-thin multifunctional support monitoring device also includes:

[0024] When the sensor module malfunctions or needs upgrading, firstly, the external jacking adjustment module is pulled out from the main support layer using the fixing module. The sensor lifting module and the sensor module will be pulled out together with the external jacking adjustment module and replaced with a new sensor module or the old module is upgraded. After replacement or upgrade, the new sensor module is placed back on top of the sensor lifting module. Then, the sensor lifting module and the sensor module are placed back onto the step of the external jacking adjustment module. Subsequently, the external jacking adjustment module, together with the sensor module, is pushed into the main support layer until the top of the sensor module contacts the support. Finally, the fixing module is fixedly connected to the main support layer using the clips.

[0025] In summary, compared with the prior art, the above-described technical solutions conceived by this invention can achieve the following beneficial effects:

[0026] 1. The present invention discloses an intelligent ultra-thin multifunctional bearing monitoring device, which can flexibly configure different functional sensor modules according to actual needs. It can integrate various types of sensors into the sensor modules, such as force sensors, temperature sensors, stress-strain sensors, acceleration sensors, tilt sensors, temperature and humidity sensors, and displacement sensors. These sensors can transmit the collected data to the monitoring center in real time for analysis and processing, realizing comprehensive intelligent real-time monitoring of the health status of the bearing and bridge, predicting potential problems and issuing early warning signals in advance, improving the accuracy and timeliness of early warning, enabling maintenance personnel to react more quickly and take necessary measures, thereby reducing the possibility of accidents.

[0027] 2. The present invention provides an intelligent ultra-thin multifunctional support monitoring device, which includes a rectangular groove set in the radial direction of the main bearing layer, an external jacking adjustment module provided in the groove, a step provided at one end of the inner side of the external jacking adjustment module, the bottom of the step being a slope, and a matching sensor lifting module provided at the top of the step. A gap of not less than 1mm is provided between the sides of the external jacking adjustment module and the sensor lifting module to adjust the height of the sensor module, ensuring that the sensor module can accurately contact the bottom of the support and improve the accuracy of the detection data.

[0028] 3. The present invention provides an intelligent ultra-thin multifunctional bearing monitoring device. Through an external jacking adjustment module, a sensor jacking module, and a fixing module set in the groove of the main bearing layer, the sensor module can be replaced without jacking the beam during the bridge operation phase. The replaced sensor module can maintain the accuracy of the measurement data, which solves the problem of inconvenient installation and disassembly during the traditional sensor replacement process.

[0029] 4. The intelligent ultra-thin multifunctional support monitoring device of the present invention connects to the cloud platform through wireless communication, realizing remote data transmission, facilitating remote monitoring and management, reducing the need for on-site operation, improving work efficiency and management convenience, and is especially suitable for monitoring points that are remote or difficult to reach. Attached Figure Description

[0030] Figure 1 This is a cross-sectional view of an intelligent ultra-thin multifunctional support monitoring device according to an embodiment of the present invention;

[0031] Figure 2 This is a three-dimensional perspective diagram of an intelligent ultra-thin multifunctional support monitoring device according to an embodiment of the present invention;

[0032] Figure 3 This is a top view of an intelligent ultra-thin multifunctional support monitoring device according to an embodiment of the present invention;

[0033] Figure 4 This is a side view of an intelligent ultra-thin multifunctional support monitoring device according to an embodiment of the present invention;

[0034] Figure 5 This is a cross-sectional view of an intelligent ultra-thin multifunctional support monitoring device according to Embodiment 2 of the present invention;

[0035] Figure 6 This is a schematic diagram of the assembly method of an intelligent ultra-thin multifunctional support monitoring device according to an embodiment of the present invention.

[0036] In all the accompanying drawings, the same reference numerals indicate the same technical features, specifically: 1-connecting plate, 2-sensor module, 3-sensor lifting module, 4-external jacking adjustment module, 5-circuit layer, 6-main body bearing layer, 7-fixing module, 8-vertical adjustment module. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0038] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0039] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0040] In this patent, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0041] Example 1

[0042] like Figure 1-4 As shown, this embodiment of the invention provides an intelligent ultra-thin multifunctional support monitoring device, including a main bearing layer 6. The main bearing layer 6 is made of high-strength metal materials (such as alloy steel) or high-performance composite materials, capable of withstanding loads transmitted from the superstructure (such as bridges, buildings, etc.), and has sufficient strength and rigidity to meet its bearing requirements. Its shape is circular or square. The top of the main bearing layer 6 is provided with a circuit layer 5, which integrates various electronic components and is responsible for data acquisition, processing, storage, and communication functions. It has circumferential wiring grooves for establishing electrical connections between different areas. The circuit layer 5 has wiring through holes along its radial direction for connecting external devices or power supplies. The wiring through holes can also be used to install sensor leads or other components that need to penetrate the circuit layer. The circuit layer 5 should be provided with dedicated power interface and communication interface. The power interface can be in the form of a standard power plug or aviation plug, which facilitates connection with an external power source and provides a stable power supply for the monitoring device. The communication interface can be designed according to different data transmission methods, such as using an RS485 interface, an Ethernet interface, or a wireless communication module interface.

[0043] Furthermore, the circuit layer 5 integrates a wireless communication module, which can establish a connection with the cloud platform to realize remote transmission and real-time monitoring and management of monitoring data. Through the wireless communication module, data collected by the monitoring device can be directly uploaded to the cloud platform. Users can access the cloud platform via the internet to view monitoring data, receive early warning information, and perform remote management anytime, anywhere. This design not only improves the convenience and real-time performance of data transmission but also reduces on-site maintenance costs and enhances management efficiency.

[0044] Furthermore, the top of the circuit layer 5 is provided with a connecting plate 1, which is used to connect and integrate different functional modules and provide mechanical support for the support. The connecting plate 1 has a circular basin in the middle, and the side wall of the basin can act as a protective block to prevent the detection device from shifting relative to the support. This ensures that the monitoring device remains in a stable position even under vibration or external force, avoiding inaccurate data or equipment damage caused by displacement. The shape and size of the circular basin can match the connecting parts of the support, providing clear guidance for the installation process. During installation, the operator can easily align the basin of the detection device with the connecting parts of the support, quickly and accurately complete the installation positioning, improve installation efficiency, and reduce installation difficulty and error rate. It is especially suitable for installation operations in complex environments such as high altitudes or narrow spaces.

[0045] Furthermore, a circular through-hole is provided between the circuit layer 5 and the connecting plate 1, and a sensor module 2 is positioned in the center of the through-hole. The height of the sensor module 2 is equal to the sum of the heights of the circuit layer 5 and the connecting plate 1, and the diameter of the sensor module 2 is the same as the diameter of the circular through-hole. This ensures that the sensor module 2 can be tightly and securely embedded, providing a precise and fixed mounting point for the sensor module 2, while avoiding any unnecessary loosening or displacement. This ensures that the sensor module remains stable during installation and avoids data deviations caused by displacement or vibration. The diameter of the through-hole is the same as the outer diameter of the sensor module 2, ensuring that the sensor module can be tightly embedded. It not only provides physical fixation but also reduces the impact of the external environment (such as dust and moisture); the height of sensor module 2 is equal to the sum of the heights of circuit layer 5 and connecting plate 1, completely filling the space between them to form a flat surface, which improves the mechanical strength and stability of the entire monitoring device; the connection lines of sensor module 2 are laid in circuit layer 5 and transmit signals through preset wiring channels, which not only simplifies the installation process but also enhances the reliability and aesthetics of the system. The built-in connection lines are protected by the circuit layer, avoiding damage to the lines from external factors (such as moisture, dust, and mechanical damage), and also facilitates maintenance and troubleshooting.

[0046] Furthermore, in circuit layer 5, in addition to laying connecting lines, signal conditioning and conversion circuits are also integrated. These circuits amplify, filter, and perform analog-to-digital conversion on the signals output by sensor module 2, converting the analog signals of the sensor into digital signals suitable for transmission and analysis. For example, the weak voltage signal output by the stress strain sensor is amplified by an operational amplifier, then noise is removed by a low-pass filter, and finally converted into a digital signal by an analog-to-digital converter. This integrated signal processing circuit improves the efficiency and accuracy of signal processing and reduces the impact of external interference on the signal processing process.

[0047] Furthermore, the sensor module 2 includes, but is not limited to, force sensors, temperature sensors, stress-strain sensors, acceleration sensors, tilt sensors, temperature and humidity sensors, or displacement sensors, used to detect physical quantities (such as pressure, temperature, position, etc.) and convert this information into electrical signals for output, so as to achieve comprehensive monitoring of the support; the force sensor is used to measure the magnitude of the force borne by the support, and can monitor the vertical load (such as the self-weight of buildings, bridges, and other structures and external loads) and horizontal load (such as wind force, seismic force, etc.) experienced by the support during use in real time; the temperature sensor is used to monitor the temperature change of the environment in which the support is located; it can measure the air temperature around the support, and can also measure the internal temperature of the support material; the stress-strain sensor is used to measure the stress distribution inside the support and the degree of deformation of the support; the acceleration sensor is used to monitor the vibration of the support and determine whether there is an abnormal vibration mode; the tilt sensor is used to measure the tilt angle of the support. It can monitor the tilt changes of the support in the horizontal direction in real time. Changes in the tilt angle may indicate structural instability. Temperature and humidity sensors are used to monitor the temperature and humidity of the environment in which the support is located, as these environmental factors can affect the performance of the support material and the accuracy of the monitoring data. Displacement sensors are used to measure the displacement changes of the support, which can monitor the displacement of the support in the horizontal direction (X, Y axis) and the vertical direction (Z axis). In order to integrate more sensors in a limited space, a miniaturization and integration design concept is adopted. The size of each sensor is minimized as much as possible, and they are packaged together by advanced packaging technology to form a compact module, which not only saves space but also improves the overall performance and reliability of sensor module 2.

[0048] Furthermore, the testing device can be equipped with a dedicated external power interface as needed. When it is necessary to test the health status of the supports and bridge, an external power source can be connected through the dedicated power interface to ensure stable operation of the equipment without a built-in power supply.

[0049] Furthermore, in areas where data acquisition is difficult, the detection device can reduce its dependence on external power sources by integrating self-powered technologies such as solar panels or piezoelectric materials, ensuring that the equipment can operate independently and provide continuous and reliable monitoring services.

[0050] like Figure 1As shown, the main bearing layer 6 has a rectangular groove along its radial direction. One end of the groove near the center of the main bearing layer 6 is semi-circular. An external push-adjustment module 4 is installed within the groove. One end of the external push-adjustment module 4 is arc-shaped, with a radius matching that of the sensor module 2. A step is provided on the inner side of the external push-adjustment module 4, with a sloping bottom. A matching sensor lifting module 3 is installed at the top of the step. A gap of at least 1mm is provided between the external push-adjustment module 4 and the sensor lifting module 3, allowing the sensor lifting module 3 to slide along the bottom section of the step. This is used to adjust the height of the sensor module 2, ensuring that the sensor module 2 can accurately contact the support or maintain a certain measurement distance to obtain more accurate data. By providing a rectangular groove on the main bearing layer 6... An external push-adjustment module 4 is installed within the groove, enabling precise positioning of the sensor module 2. The arc-shaped design at one end of the external push-adjustment module 4 matches the radius of the sensor module 2, ensuring a tight fit between the two and reducing errors caused by improper installation. The bottom of the step is designed with a slope, and a certain distance is provided between the external push-adjustment module 4 and the sensor lifting module 3. This facilitates a smooth transition between the external push-adjustment module 4 and the sensor lifting module 3 when moving through it, allowing the sensor module 2 to be finely adjusted up and down as needed. This structural design makes the sensor module 2 easy to disassemble and replace. When the sensor module 2 malfunctions or needs upgrading, it can be easily removed and replaced with a new sensor module 2, reducing maintenance costs and time.

[0051] Furthermore, the external push adjustment module 4 is provided with a fixing module 7 on its outer side. The fixing module 7 is fixedly connected to the main support layer 6 by a snap fastener, which can effectively prevent the external push adjustment module 4 from loosening or shifting due to external forces (such as vibration or impact) during operation, causing the sensor module 2 to detach from the support, thereby improving the accuracy of the detection data. The snap fastener connection design makes the installation and disassembly between the fixing module 7 and the main support layer 6 simple and quick. Users can complete the installation and maintenance of the components without complicated tools or operations.

[0052] The monitoring device of this invention can flexibly configure different functional sensor modules 2 according to actual needs, and can integrate various types of sensors into the sensor module 2, such as force sensors, temperature sensors, stress-strain sensors, acceleration sensors, tilt sensors, temperature and humidity sensors, and displacement sensors. These sensors can transmit the collected data to the monitoring center in real time for analysis and processing, realizing comprehensive intelligent real-time monitoring of the health status of the bearings and bridges, predicting potential problems and issuing early warning signals, improving the accuracy and timeliness of early warnings, enabling maintenance personnel to react more quickly and take necessary measures, thereby reducing the possibility of accidents; by setting a rectangular groove along the radial direction of the main bearing layer 6, an external jacking adjustment module 4 is provided in the groove, and a step is provided on one end of the inner side of the external jacking adjustment module 4. The bottom of the step is inclined, and the top of the step is provided with The sensor lifting module 3, the external jacking adjustment module 4, and the sensor lifting module 3 are provided with a gap of not less than 1mm between their sides to adjust the height of the sensor module 2, ensuring that the sensor module 2 can accurately contact the bottom of the support and improve the accuracy of the detection data. Through the external jacking adjustment module 4, the sensor lifting module 3, and the fixing module 7 set in the groove of the main bearing layer 6, the sensor module 2 can be replaced without jacking the beam during the bridge operation phase. The replaced sensor module 2 can maintain the accuracy of the measurement data, solving the problem of inconvenient installation and disassembly during the replacement of the traditional sensor module 2. Through wireless communication and connection with the cloud platform, the monitoring device realizes remote data transmission, which facilitates remote monitoring and management, reduces the need for on-site operation, improves work efficiency and management convenience, and is especially suitable for remote or hard-to-reach monitoring points.

[0053] Example 2

[0054] like Figure 5As shown, this embodiment of the invention provides another intelligent ultra-thin multifunctional support monitoring device. In this embodiment, other contents are the same as those in Embodiment 1, except that: the main bearing layer 6 is provided with a rectangular groove along its radial direction, the end of the groove near the center of the main bearing layer 6 is semi-circular, an external push adjustment module 4 is provided in the groove, one end of the external push adjustment module 4 is arc-shaped, the radius of the arc is the same as the radius of the sensor module 2, a step is provided at the end of the arc, the bottom of the step is inclined, a matching sensor lifting module 3 is provided at the top of the step, an L-shaped vertical adjustment module 8 is provided between the external push adjustment module 4 and the sensor lifting module 3, and a gap of not less than 1mm is provided between the vertical adjustment module (8) and the side of the sensor lifting module (3), allowing the sensor lifting module 3 and the vertical adjustment module (8) to slide relative to each other, used to adjust the height of the sensor module 2, ensuring that the sensor module 2 can accurately contact the support, or maintain a certain measurement distance to obtain more accurate data.

[0055] Example 3

[0056] Combination Figure 1-5 ,like Figure 6 As shown, the present invention provides an assembly method for an intelligent ultra-thin multifunctional support monitoring device, comprising the following steps:

[0057] S100: Based on the design drawings, prefabricate the various components of the monitoring device in the factory, including the main bearing layer 6, circuit layer 5, connecting plate 1, sensor module 2, external jacking adjustment module 4 and sensor lifting module 3, and check that the shape and function of all components meet the design requirements.

[0058] S200: Place the main support layer 6 in the predetermined position, ensuring that it is stable and horizontal, and embed the sensor lifting module 3 and the external pushing adjustment module 4 into the groove of the main support layer 6, ensuring that the two are in close contact.

[0059] S300: Place the circuit layer 5 on top of the main support layer 6, insert the sensor module 2 from the top of the circuit layer 5 into the circular through hole until its bottom contacts the top of the sensor lifting module 3, connect the connection line of the sensor module 2 to the corresponding interface on the circuit layer 5, and ensure that the connection is firm and the signal transmission is normal.

[0060] S400: Place the connecting plate 1 on top of the circuit layer 5, ensuring that the circular through hole in the middle of the connecting plate 1 is precisely aligned with the position of the sensor module 2. Fix the entire device as a whole through the connecting plate 1 to ensure structural stability.

[0061] S500: Connects the external power supply to the power interface on circuit layer 5 to ensure that the monitoring device receives a stable power supply. It connects to the remote monitoring center through the communication interface to conduct data transmission tests and ensure that the monitoring data can be transmitted to the remote monitoring center accurately and reliably.

[0062] S600: Perform functional tests on sensor module 2, including the detection of pressure, temperature, stress and strain, acceleration, tilt angle, humidity and position. Based on the test results, perform debugging and optimization to ensure that each sensor can work normally and output accurate signals.

[0063] Furthermore, an assembly method for an intelligent ultra-thin multifunctional support monitoring device is characterized by further comprising:

[0064] When sensor module 2 malfunctions or needs upgrading, firstly, the external jacking adjustment module 4 is pulled out from the main support layer 6 through the fixing module 7. Sensor lifting module 3 and sensor module 2 will be pulled out together with the external jacking adjustment module 4 and replaced with a new sensor module 2 or the old module is upgraded. After replacement or upgrade, the new sensor module 2 is placed back on top of sensor lifting module 3. Then, sensor lifting module 3 and sensor module 2 are placed back onto the step of external jacking adjustment module 4. Subsequently, external jacking adjustment module 4, together with sensor module 2, is pushed into the main support layer 6 until the top of sensor module 2 contacts the support. Finally, the fixing module 7 is fixedly connected to the main support layer 6 through the buckle.

[0065] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An intelligent ultra-thin multifunctional support monitoring device, characterized in that, The utility model relates to a kind of monitoring device for supporting structure, including main body force layer (6), it is the structure of the shape of circle or square, the main body force layer (6) top is equipped with circuit layer (5), the circuit layer (5) top is equipped with connecting plate (1), the connecting plate (1) middle part is equipped with circular pelvic cavity for limiting, for connecting and integration different function module and provide mechanical support for upper structure; The circuit layer (5) and connecting plate (1) middle part are equipped with circular through-hole, the through-hole middle part is equipped with sensor module (2), for detecting physical quantity and converting these information into electrical signal output, to realize the omnibearing monitoring of support; The main body force layer (6) is equipped with rectangular recess along its radial direction, the recess is semicircular near the end of the center of main body force layer (6), the recess is equipped with external push adjusting module (4), the external push adjusting module (4) one end is circular arc, the radius of circular arc is consistent with the radius of sensor module (2), the inboard one end of external push adjusting module (4) is equipped with step, the step bottom is inclined plane, the step top is equipped with sensor jacking module (3) matched with it, the side between external push adjusting module (4) and sensor jacking module (3) is equipped with not less than 1mm spacing, allow sensor jacking module (3) to slide along the section of step bottom, for adjusting the height of sensor module (2), ensure that sensor module (2) can accurately contact support, or maintain certain measuring distance, to obtain more accurate data. 2.The intelligent ultra-thin multifunctional support monitoring device according to claim 1, characterized in that, The side between vertical adjusting module (8) and sensor jacking module (3) is equipped with not less than 1mm spacing, and sensor jacking module (3) and vertical adjusting module (8) can slide relatively. 3.The intelligent ultra-thin multifunctional support monitoring device according to claim 1, characterized in that, The height of sensor module (2) is equal to the sum of the height of circuit layer (5) and connecting plate (1), the diameter of sensor module (2) is consistent with the diameter of the circular through-hole, and the connecting line of sensor module (2) is laid in circuit layer (5). 4.The intelligent ultra-thin multifunctional support monitoring device according to claim 1, characterized in that, The sensor module (2) includes a force sensor, a temperature sensor, a stress and strain sensor, an acceleration sensor, an inclination sensor, a temperature and humidity sensor, or a displacement sensor. 5.The intelligent ultra-thin multifunctional support monitoring device according to claim 1, characterized in that, The outside of external push adjusting module (4) is equipped with fixing module (7), and the fixing module (7) is fixedly connected with the main body force layer (6) through buckling.

6. The smart ultra-thin multi-functional support monitoring device according to any one of claims 1-4, characterized in that, The circuit layer (5) is equipped with a circuit through-hole along its radial direction.

7. A method of assembling a smart ultra-thin multi-functional support monitoring device according to any one of claims 1-6, characterized in that, The utility model includes the following steps: S100: by design drawing, precast monitoring device for each component part in workshop, including main body force layer (6), circuit layer (5), connecting plate (1), sensor module (2), external push adjusting module (4) and sensor jacking module (3), check the shape and function of all components meet the design requirements; S200: the main body force layer (6) is placed in predetermined position, ensure that it is stable and horizontal, sensor jacking module (3) and external push adjusting module (4) are embedded in the recess of main body force layer (6), ensure that the two are in close contact; S300: Place the circuit layer (5) on top of the main holding layer (6), insert the sensor module (2) into the circular hole on top of the circuit layer (5) until the bottom of the sensor module (2) is in contact with the top of the sensor lifting module (3), connect the connecting lines of the sensor module (2) to the corresponding interfaces on the circuit layer (5), and ensure that the connection is firm and the signal transmission is normal; S400: Place the connecting plate (1) on top of the circuit layer (5), ensure that the circular hole in the middle of the connecting plate (1) is accurately aligned with the position of the sensor module (2), and fix the entire device as a whole through the connecting plate (1), ensuring the stability of the structure; S500: Connect the external power supply to the power supply interface on the circuit layer (5) to ensure that the monitoring device has a stable power supply, connect the remote monitoring center through the communication interface, and test the data transmission to ensure that the monitoring data can be accurately and reliably transmitted to the remote monitoring center; S600: Perform a functional test on the sensor module (2), including pressure, temperature, stress and strain, acceleration, inclination, temperature and humidity, and position detection, and adjust and optimize according to the test results to ensure that each sensor can work normally and output accurate signals.

8. The assembling method of the intelligent ultra-thin multifunctional support monitoring device according to claim 7, characterized in that, Also includes: When the sensor module (2) fails or needs to be upgraded, first remove the external push adjustment module (4) from the main holding layer (6) through the fixing module (7), the sensor lifting module (3) and the sensor module (2) will be extracted together with the external push adjustment module (4), and a new sensor module (2) or the old module will be upgraded, after replacement or upgrade, place the new sensor module (2) on top of the sensor lifting module (3), then put the sensor lifting module (3) and the sensor module (2) back on the step of the external push adjustment module (4), then push the external push adjustment module (4) together with the sensor module (2) into the main holding layer (6) until the top of the sensor module (2) is in contact with the support, finally, fix the fixing module (7) and the main holding layer (6) by buckling.

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