Double-sided imprint method and apparatus

Abstract

The invention relates to a double-sided imprinting method and equipment, and the method comprises the steps: controlling a grabbing mechanism to grab a to-be-imprinted wafer, placing the to-be-imprinted wafer on a first imprinting template, enabling imprinting glue on the first surface of the to-be-imprinted wafer to be in contact with the first imprinting template, and enabling the first imprinting template to be arranged on a first supporting plate; the grabbing mechanism is controlled to grab a second imprinting template, the second imprinting template is placed on the to-be-imprinted wafer, imprinting glue on the second surface of the to-be-imprinted wafer makes contact with the second imprinting template, and the first surface is parallel to the second surface; the first roller mechanism is controlled to roll on the second imprinting template, and first imprinting is completed; under the condition that the first supporting plate is moved away and the second supporting plate is moved to be attached to the second impressing template, the second roller mechanism is controlled to roll on the first impressing template, and second-time impressing is completed; and controlling the imprinting glue curing device to cure the imprinting glue on the first surface and the second surface.

Description

Technical Field

[0001] The present disclosure relates to imprinting equipment technology, and more particularly, to a double-sided imprinting method and equipment. Background Art

[0002] A wafer is a key material in semiconductor manufacturing and is used to produce integrated circuits and other electronic components.

[0003] In the prior art, circuit patterns are usually formed on one side of a wafer. For the need to form circuit patterns on both sides of the wafer, an automatic and efficient technical solution is required. Summary of the Invention

[0004] An object of the present invention is to provide a new technical solution for a double-sided imprinting method.

[0005] According to a first aspect of the present invention, there is provided a double-sided imprinting method,

[0006] Controlling a gripping mechanism to grip a wafer to be imprinted and place the wafer to be imprinted on a first imprinting template, wherein an imprinting adhesive on a first surface of the wafer to be imprinted is in contact with the first imprinting template, and the first imprinting template is disposed on the first support plate;

[0007] Controlling the gripping mechanism to grip a second imprinting template and place the second imprinting template on the wafer to be imprinted, wherein an imprinting adhesive on a second surface of the wafer to be imprinted is in contact with the second imprinting template, and the first surface and the second surface are parallel and opposite planes;

[0008] Controlling a first roller mechanism to roll on the second imprinting template to complete the first imprinting;

[0009] In a case where the first support plate is removed and a second support plate is moved to be attached to the second imprinting template, controlling a second roller mechanism to roll on the first imprinting template to complete the second imprinting;

[0010] Controlling an imprinting adhesive curing device to cure the imprinting adhesive on the first surface and the imprinting adhesive on the second surface to complete double-sided imprinting of the wafer to be imprinted.

[0011] Optionally, a first mark is provided on a first surface of the wafer to be imprinted, and a second mark is provided on the first imprinting template. Before placing the wafer to be imprinted on the first imprinting template, the method further includes:

[0012] Controlling the gripping mechanism to move so that the positions of the first mark and the second mark are aligned.

[0013] Optionally, the second imprinting template is provided with a third mark. Before placing the second imprinting template on the wafer to be imprinted, the method further includes:

[0014] Controlling the movement of the grasping mechanism to align the position of the first mark and the position of the third mark.

[0015] Optionally, the grasping mechanism is provided with a camera. The method further includes:

[0016] Obtaining a first image captured by the camera, where the first image includes the first mark and the second mark;

[0017] Determining whether the first mark and the second mark are aligned along the stacking direction of the wafer to be imprinted and the first imprinting template according to the first image;

[0018] Performing the operation of placing the wafer to be imprinted on the first imprinting template only when it is determined that the first mark and the second mark are aligned;

[0019] Obtaining a second image captured by the camera, where the second image includes the first mark and the third mark;

[0020] Determining whether the first mark and the third mark are aligned along the stacking direction of the wafer to be imprinted and the second imprinting template according to the second image;

[0021] Performing the operation of placing the second imprinting template on the wafer to be imprinted only when it is determined that the first mark and the third mark are aligned.

[0022] Optionally, a first mark is provided on the first surface of the wafer to be imprinted, and the grasping mechanism is provided with a camera. The method further includes:

[0023] Determining whether the center point of the field of view of the camera is aligned with the center point of the first mark;

[0024] Performing the operation of controlling the grasping mechanism to grasp the wafer to be imprinted only when the center point of the field of view of the camera is aligned with the center point of the first mark; and,

[0025] The second imprinting template is provided with a third mark. The method further includes:

[0026] Determining whether the center point of the field of view of the camera is aligned with the center point of the third mark;

[0027] Performing the operation of controlling the grasping mechanism to grasp the second imprinting template only when the center point of the field of view of the camera is aligned with the center point of the third mark.

[0028] Optionally, the downward pressure applied to the first roller mechanism when it rolls on the second imprinting template is less than the upward pressure applied to the second roller mechanism when it rolls on the first imprinting template.

[0029] According to a second aspect of the present invention, there is provided a double-sided imprinting device, comprising:

[0030] A control device, a grasping mechanism, a first imprinting template, a second imprinting template, a first support plate, a second support plate, and an imprinting glue curing device, wherein,

[0031] The control device is configured to control the grasping mechanism to grasp the wafer to be imprinted and place the wafer to be imprinted on the first imprinting template, wherein the imprinting glue on the first surface of the wafer to be imprinted is in contact with the first imprinting template, and the first imprinting template is disposed on the first support plate;

[0032] Control the grasping mechanism to grasp the second imprinting template and place the second imprinting template on the wafer to be imprinted, wherein the imprinting glue on the second surface of the wafer to be imprinted is in contact with the second imprinting template, and the first surface and the second surface are parallel and opposite planes;

[0033] Control the first roller mechanism to roll on the second imprinting template to complete the first imprinting;

[0034] When the first support plate is removed and the second support plate is moved to be attached to the second imprinting template, control the second roller mechanism to roll on the first imprinting template to complete the second imprinting;

[0035] Control the imprinting glue curing device to cure the imprinting glue on the first surface and the imprinting glue on the second surface to complete the double-sided imprinting of the wafer to be imprinted.

[0036] Optionally, a first mark is provided on the first surface of the wafer to be imprinted, and a second mark is provided on the first imprinting template, wherein,

[0037] Before placing the wafer to be imprinted on the first imprinting template, the control device is further configured to control the grasping mechanism to move so that the positions of the first mark and the second mark are aligned.

[0038] Optionally, a third mark is provided on the second imprinting template, wherein, before placing the second imprinting template on the wafer to be imprinted, the control device is further configured to control the grasping mechanism to move so that the position of the first mark and the position of the third mark are aligned.

[0039] Optionally, the double-sided imprinting device further includes a camera, which is disposed on the grasping mechanism, wherein,

[0040] the control device is further configured to obtain a first image captured by the camera, wherein the first image includes the first mark and the second mark; determine whether the first mark and the second mark are aligned along the stacking direction of the wafer to be imprinted and the first imprinting template according to the first image; and perform the operation of placing the wafer to be imprinted on the first imprinting template only when it is determined that the first mark and the second mark are aligned;

[0041] the control device is further configured to obtain a second image captured by the camera, wherein the second image includes the first mark and the third mark; determine whether the first mark and the third mark are aligned along the stacking direction of the wafer to be imprinted and the second imprinting template according to the second image; and perform the operation of placing the second imprinting template on the wafer to be imprinted only when it is determined that the first mark and the third mark are aligned.

[0042] Optionally, the downward pressure applied to the first roller mechanism when it rolls on the second imprinting template is less than the upward pressure applied to the second roller mechanism when it rolls on the first imprinting template.

[0043] The double-sided imprinting method provided in this embodiment realizes automatic double-sided imprinting of the wafer to be imprinted, and improves the imprinting efficiency.

[0044] The features and advantages of the embodiments of this specification will become clear through the following detailed description of the exemplary embodiments of this specification with reference to the accompanying drawings. Description of the Drawings

[0045] The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of this specification, and together with the description are used to explain the principles of the embodiments of this specification.

[0046] Figure 1 is a schematic flowchart of a double-sided imprinting method according to an embodiment of the present invention.

[0047] Figure 2 is a schematic flowchart of a double-sided imprinting method according to an embodiment of the present invention.

[0048] Figure 3 is a schematic diagram of the forming process of a double-sided imprinting method according to an embodiment of the present invention.

[0049] Figure 4It is an exploded schematic view of a double-sided imprinting device according to an embodiment of the present invention.

[0050] Figure 5 It is an exploded schematic view of a double-sided imprinting device according to an embodiment of the present invention. Detailed implementation manners

[0051] Various exemplary embodiments of the present specification will now be described in detail with reference to the accompanying drawings.

[0052] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the embodiments of the present specification, their applications, or uses.

[0053] It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof in subsequent drawings is not necessary.

[0054] In an embodiment of the present invention, a double-sided imprinting method is provided. According to Figure 1 As shown, the double-sided imprinting method includes the following steps S110 to S150.

[0055] Step S110, controlling a grasping mechanism to grasp a wafer to be imprinted and place the wafer to be imprinted on a first imprinting template, wherein an imprinting glue on a first surface of the wafer to be imprinted is in contact with the first imprinting template, and the first imprinting template is disposed on a first support plate.

[0056] The surface of the first imprinting template is engraved with an imprinting pattern.

[0057] The first imprinting template includes a soft film and a soft film support. The soft film is fixed on the soft film support. The soft film is made of transparent PT material.

[0058] The grasping mechanism can grasp the wafer to be imprinted by clamping, or can also grasp the wafer to be imprinted by suction. When the grasping mechanism sucks the wafer to be imprinted by suction, since imprinting glue is provided on both sides of the wafer to be imprinted, it is necessary to perform edge washing treatment on the imprinting glue within a preset distance from the edge position of the wafer to be imprinted to provide a suction position for the suction of the grasping mechanism.

[0059] Step S120, controlling the grasping mechanism to grasp a second imprinting template and place the second imprinting template on the wafer to be imprinted, wherein the imprinting glue on a second surface of the wafer to be imprinted is in contact with the second imprinting template, and the first surface and the second surface are parallel and opposite planes.

[0060] The second imprinting template includes a soft film and a soft film support. The soft film is fixed on the soft film support. The soft film is made of transparent PT material.

[0061] The surface of the second imprinting template is engraved with an imprinting pattern. The imprinting pattern engraved on the surface of the first imprinting template may be the same as or different from the imprinting pattern engraved on the surface of the second imprinting template.

[0062] Step S130: Control the first roller mechanism to roll on the second imprinting template to complete the first imprinting.

[0063] When the roller mechanism rolls on the second imprinting template, under the action of the gravity of the roller mechanism or the combined action of the gravity of the roller mechanism and the pressure additionally applied to the roller mechanism, the second imprinting template, the wafer to be imprinted, the first imprinting template, and the first support plate are extruded, so that the imprinting pattern engraved on the second imprinting template is pressed into the imprinting glue on the second surface of the wafer to be imprinted, and the imprinting pattern engraved on the first imprinting template is pressed into the imprinting glue on the first surface of the wafer to be imprinted, completing the first imprinting. The direction of the pressure additionally applied to the roller mechanism is perpendicular to the first surface and the second surface.

[0064] Step S140: In the case where the first support plate is removed and the second support plate is moved to be attached to the second imprinting template, control the second roller mechanism to roll on the first imprinting template to complete the second imprinting.

[0065] When the roller mechanism rolls on the first imprinting template, under the action of the pressure additionally applied to the roller mechanism, the first imprinting template, the wafer to be imprinted, the second imprinting template, and the second support plate are extruded, so that the imprinting pattern engraved on the first imprinting template continues to be pressed into the imprinting glue on the first surface of the wafer to be imprinted, and the imprinting pattern engraved on the second imprinting template continues to be pressed into the imprinting glue on the second surface of the wafer to be imprinted, completing the second imprinting. The direction of the pressure additionally applied to the roller mechanism is perpendicular to the first surface and the second surface.

[0066] The first support plate and the second support plate may be the same support plate or different support plates.

[0067] It should be noted that after the first support plate is removed, there is other support mechanism to support the first imprinting template.

[0068] Step S150: Control the imprinting glue curing device to cure the imprinting glue on the first surface and the imprinting glue on the second surface to complete the double-sided imprinting of the wafer to be imprinted.

[0069] In some embodiments, before controlling the imprinting glue curing device to move below the imprinting glue on the first surface, the first imprinting template is moved, and then the imprinting glue curing device is controlled to move to be directly opposite to the imprinting glue on the first surface, so that the imprinting glue curing device can directly cure the imprinting glue on the first surface, improving the curing efficiency. Before controlling the imprinting glue curing device to move above the imprinting glue on the second surface, the second imprinting template is moved, and then the imprinting glue curing device is controlled to move to be directly opposite to the imprinting glue on the second surface, so that the imprinting glue curing device can directly cure the imprinting glue on the second surface, improving the curing efficiency.

[0070] In some embodiments, before controlling the imprinting glue curing device to move below the imprinting glue on the first surface, there is no need to move the first imprinting template, and then the imprinting glue curing device is controlled to move to be directly opposite to the first imprinting template, so that there is a first imprinting template between the imprinting glue curing device and the imprinting glue on the first surface, and then the imprinting glue curing device is controlled to cure the imprinting glue on the first surface. Before controlling the imprinting glue curing device to move above the imprinting glue on the second surface, there is no need to move the second imprinting template, and then the imprinting glue curing device is controlled to move to be directly opposite to the second imprinting template, so that there is a second imprinting template between the imprinting glue curing device and the imprinting glue on the second surface, and then the imprinting glue curing device is controlled to cure the imprinting glue on the second surface.

[0071] The curing of the imprinting glue on the first surface by the imprinting glue curing device and the curing of the imprinting glue on the second surface by the imprinting glue curing device can be carried out simultaneously or separately. When carried out simultaneously, the imprinting glue curing device includes a first curing device and a second curing device. The first curing device is used to cure the imprinting glue on the first surface, and the second curing device is used to cure the imprinting glue on the second surface.

[0072] After completing the imprinting of any surface of the wafer to be imprinted, control the corresponding imprinting template to separate from the cured imprinting glue adhered to the surface to be imprinted. Since the imprinting template itself is relatively soft, it is convenient for film peeling, ensuring the accuracy of the separation of the imprinting template from the cured imprinting glue adhered to the surface to be imprinted, and ensuring the integrity of the imprinting template and the cured imprinting glue after film peeling.

[0073] After completing the double-sided imprinting of the wafer to be imprinted, through processes such as etching or deposition, transfer the pattern on the corresponding imprinting glue to the first surface of the wafer to be imprinted, and transfer the pattern on the corresponding imprinting glue to the second surface of the wafer to be imprinted, forming a wafer with patterns on both sides.

[0074] In some embodiments, a first mark is provided on a first surface of a wafer to be imprinted, and a second mark is provided on a first imprint template. The first mark and the second mark may be the same mark or different marks. The number of the first mark and the second mark may be one or multiple. When the number of the first mark and the second mark is multiple, the number of the first mark and the second mark is equal. The first mark and the second mark are any one of a cross mark, a square mark, and a circular mark.

[0075] Before placing the wafer to be imprinted on the first imprint template, the method further includes: controlling the gripping mechanism to move so that the positions of the first mark and the second mark are aligned. This can ensure the accuracy of the imprint of the first surface of the wafer to be imprinted by the first imprint template and avoid imprint deviation.

[0076] The alignment of the positions of the first mark and the second mark is along a direction perpendicular to the first surface and the second surface. When the number of the first mark and the second mark is multiple, the first mark and the second mark are aligned one by one in position.

[0077] In some embodiments, the gripping mechanism is provided with a camera. The camera takes pictures along the superposition direction of the wafer to be imprinted and the first imprint template. The number of cameras may be one or set according to the number of the first mark and the second mark. For example, for each first mark and the corresponding second mark, a corresponding camera is provided.

[0078] The method further includes: obtaining a first image captured by the camera, where the first image includes the first mark and the second mark; determining, according to the first image, whether the first mark and the second mark are aligned along the superposition direction of the wafer to be imprinted and the first imprint template; and performing the operation of placing the wafer to be imprinted on the first imprint template only when it is determined that the first mark and the second mark are aligned. Both the wafer to be imprinted and the first imprint template are made of a transparent material.

[0079] First, determine the position information of the center of the first mark in the first image, denoted as first position information, and determine the position information of the center of the second mark in the first image, denoted as second position information. Then, according to the first position information and the second position information, determine the distance between the first position information and the second position information. When the distance between the first position information and the second position information is less than a preset threshold, it is determined that the first mark and the second mark are aligned. When the distance between the first position information and the second position information is greater than or equal to the preset threshold, it is determined that the first mark and the second mark are not aligned.

[0080] In some embodiments, the second imprint template is provided with a third mark. The first mark and the third mark may be the same mark or different marks. The number of the first mark and the third mark may be one or multiple. When the number of the first mark and the third mark is multiple, the number of the first mark and the third mark is equal. The first mark and the third mark are any one of a cross mark, a square mark, and a circular mark.

[0081] Before placing the second imprint template on the wafer to be imprinted, the method further includes: controlling the gripper mechanism to move so that the positions of the first mark and the third mark are aligned. This can ensure the accuracy of the imprint of the second imprint template on the second surface of the wafer to be imprinted and avoid imprint deviation.

[0082] The alignment of the positions of the first mark and the third mark is along a direction perpendicular to the first surface and the second surface. When the number of the first mark and the third mark is multiple, the first mark and the third mark are aligned one by one in position.

[0083] In some embodiments, the gripper mechanism is provided with a camera. The camera takes pictures along the superposition direction of the second imprint template and the wafer to be imprinted. The number of the cameras may be one or set according to the number of the first mark and the third mark. For example, based on each first mark and the corresponding third mark, a corresponding camera is provided.

[0084] The method further includes: obtaining a second image captured by the camera, where the second image includes the first mark and the third mark; determining, according to the second image, whether the first mark and the third mark are aligned along the superposition direction of the wafer to be imprinted and the second imprint template; and performing the operation of placing the second imprint template on the wafer to be imprinted only when it is determined that the first mark and the third mark are aligned. Both the wafer to be imprinted and the second imprint template are made of a transparent material.

[0085] First, determine the position information of the center of the first mark in the second image, denoted as the third position information, and determine the position information of the center of the third mark in the second image, denoted as the fourth position information. Then, according to the third position information and the fourth position information, determine the distance between the third position information and the fourth position information. When the distance between the third position information and the fourth position information is less than a preset threshold, it is determined that the first mark and the third mark are aligned. When the distance between the third position information and the fourth position information is greater than or equal to the preset threshold, it is determined that the first mark and the third mark are not aligned.

[0086] It should be noted that the position where the first camera is set on the grasping mechanism, the position where the first mark is set on the first surface of the wafer to be imprinted, the position where the second mark is set on the first imprint template, and the position where the third mark is set on the second imprint template are preset. When setting these four positions, the following conditions need to be met: when the first mark is aligned with the second mark, the center point of the first surface of the wafer to be imprinted and the center point of the first imprint template are substantially coincident; when the first mark is aligned with the third mark, the center point of the first surface of the wafer to be imprinted and the center point of the second imprint template are substantially coincident.

[0087] In some embodiments, a first mark is provided on the first surface of the wafer to be imprinted, and a camera is provided on the grasping mechanism. The method further includes: determining whether the center point of the field of view of the camera is aligned with the center point of the first mark; and performing the operation of controlling the grasping mechanism to grasp the wafer to be imprinted only when the center point of the field of view of the camera is aligned with the center point of the first mark. This provides a basis for the subsequent alignment of the wafer to be imprinted with the first imprint template, and avoids the situation where the wafer to be imprinted cannot be aligned with the first imprint template due to the non-alignment of the center point of the field of view of the camera and the center point of the first mark.

[0088] Specifically, an image including the first mark captured by the camera is obtained; based on the image including the first mark, it is determined whether the center point of the first mark is aligned with the center point of the field of view of the camera.

[0089] In this embodiment, a third mark is provided on the second imprint template. The method further includes: determining whether the center point of the field of view of the camera is aligned with the center point of the third mark; and performing the operation of controlling the grasping mechanism to grasp the second imprint template only when the center point of the field of view of the camera is aligned with the center point of the third mark. This provides a basis for the subsequent alignment of the wafer to be imprinted with the second imprint template, and avoids the situation where the wafer to be imprinted cannot be aligned with the second imprint template due to the non-alignment of the center point of the field of view of the camera and the center point of the third mark.

[0090] Specifically, an image including the third mark captured by the camera is obtained; based on the image including the third mark, it is determined whether the center point of the third mark is aligned with the center point of the field of view of the camera.

[0091] In some embodiments, the downward pressure exerted on the first roller mechanism when the first roller mechanism rolls on the second imprint template is less than the upward pressure exerted on the second roller mechanism when the second roller mechanism rolls on the first imprint template. This is because when the second roller mechanism rolls on the first imprint template, it needs to overcome its own gravity.

[0092] Figure 2It is a schematic flow chart of a double-sided imprinting method according to an embodiment of the present invention. In this embodiment, imprinting adhesives are uniformly provided on both the first surface and the second surface of the wafer to be imprinted. Specifically, it can be combined with Figure 3 The schematic diagram of the imprinting process shown.

[0093] According to Figure 2 As shown, the double-sided imprinting method includes the following steps S201 to S209.

[0094] Step S201, control the grasping mechanism to grasp the wafer to be imprinted.

[0095] Step S202, obtain the first image captured by the camera. Among them, the first image includes a first mark and a second mark.

[0096] According to Figure 3 As shown, two first marks are provided on the first surface of the wafer to be imprinted, both of which are cross marks. Two second marks are provided on the first imprinting template, both of which are square marks.

[0097] Step S203, according to the first image, determine whether each first mark and the corresponding second mark are aligned along the superposition direction of the wafer to be imprinted and the first imprinting template; when it is determined that each first mark and the corresponding second mark are both aligned, control the grasping mechanism to place the wafer to be imprinted on the first imprinting template.

[0098] Step S204, control the grasping mechanism to grasp the second imprinting template.

[0099] Step S205, obtain the second image captured by the camera. Among them, the first image includes a first mark and a third mark.

[0100] According to Figure 3 As shown, two first marks are provided on the first surface of the wafer to be imprinted, both of which are cross marks. Two third marks are provided on the second imprinting template, both of which are square marks.

[0101] Step S206, according to the second image, determine whether each first mark and the corresponding third mark are aligned along the superposition direction of the wafer to be imprinted and the second imprinting template; when it is determined that each first mark and the corresponding third mark are both aligned, control the grasping mechanism to place the second imprinting template on the wafer to be imprinted.

[0102] Step S207, control the first roller mechanism to roll on the second imprinting template to complete the first imprinting.

[0103] Step S208, when the first support plate is removed and the second support plate is moved to be attached to the second imprinting template, control the second roller mechanism to roll on the first imprinting template to complete the second imprinting.

[0104] Step S209, control the first imprinting glue curing device to cure the imprinting glue on the first surface, and control the second imprinting glue curing device to cure the imprinting glue on the second surface, thereby completing the double-sided imprinting of the wafer to be imprinted.

[0105] It should be noted that Figure 3 In the schematic diagram shown, during the double-sided imprinting process, the second imprinting template, the wafer to be imprinted, and the first imprinting template are not shown in contact in the figure. This is to better show the positional relationship among the three. In fact, the three are in close contact.

[0106] The double-sided imprinting method provided in this embodiment realizes the automatic double-sided imprinting of the wafer to be imprinted, improving the imprinting efficiency.

[0107] An embodiment of the present invention provides a double-sided imprinting device. According to Figure 4 as shown, the double-sided imprinting device includes: a control device ( Figure 4 not shown), a grasping mechanism, a first imprinting template, a second imprinting template, a first support plate, a second support plate, and an imprinting glue curing device. The first support plate and the second support plate can be transparent glass plates.

[0108] The control device is used to control the grasping mechanism to grasp the wafer to be imprinted and place the wafer to be imprinted on the first imprinting template. Among them, the imprinting glue on the first surface of the wafer to be imprinted is in contact with the first imprinting template, and the first imprinting template is arranged on the first support plate; control the grasping mechanism to grasp the second imprinting template and place the second imprinting template on the wafer to be imprinted. Among them, the imprinting glue on the second surface of the wafer to be imprinted is in contact with the second imprinting template, and the first surface and the second surface are parallel planes; control the first roller mechanism to roll on the second imprinting template to complete the first imprinting; in the case where the first support plate is removed and the second support plate is moved to be in contact with the second imprinting template, control the second roller mechanism to roll on the first imprinting template to complete the second imprinting; control the imprinting glue curing device to cure the imprinting glue on the first surface and the imprinting glue on the second surface, thereby completing the double-sided imprinting of the wafer to be imprinted.

[0109] In some embodiments, a first mark is provided on the first surface of the wafer to be imprinted, and a second mark is provided on the first imprinting template. The control device is further used to control the grasping mechanism to move before placing the wafer to be imprinted on the first imprinting template, so that the positions of the first mark and the second mark are aligned.

[0110] In some embodiments, a third mark is provided on the second imprinting template. The control device is further used to control the grasping mechanism to move before placing the second imprinting template on the wafer to be imprinted, so that the position of the first mark and the position of the third mark are aligned.

[0111] In some embodiments, according to Figure 4 as shown, the double-sided imprinting device further includes a camera, and the camera is disposed on the grasping mechanism. The control device is further configured to obtain a first image captured by the camera, where the first image includes a first mark and a second mark; determine, according to the first image, whether the first mark and the second mark are aligned along the superimposing direction of the wafer to be imprinted and the first imprinting template; and perform the operation of placing the wafer to be imprinted on the first imprinting template only when it is determined that the first mark and the second mark are aligned.

[0112] In some embodiments, the control device is further configured to obtain a second image captured by the camera, where the second image includes the first mark and a third mark; determine, according to the second image, whether the first mark and the third mark are aligned along the superimposing direction of the wafer to be imprinted and the second imprinting template; and perform the operation of placing the second imprinting template on the wafer to be imprinted only when it is determined that the first mark and the third mark are aligned.

[0113] The downward pressure applied to the first roller mechanism when the first roller mechanism rolls on the second imprinting template is less than the upward pressure applied to the second roller mechanism when the second roller mechanism rolls on the first imprinting template.

[0114] According to Figure 5 as shown, the double-sided imprinting device further includes a carrier. The carrier is an annular structure for placing the wafer to be imprinted, and serves to support the wafer to be imprinted when imprinting the imprinting glue on the corresponding surface of the wafer to be imprinted by using the first imprinting template and when imprinting the imprinting glue on the corresponding surface of the wafer to be printed by using the second imprinting template.

[0115] The embodiments in this specification are all described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments.

[0116] The specific embodiments of this specification have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require the particular order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0117] The embodiments of this specification may be a system, a method, and / or a computer program product. The computer program product may include a computer-readable storage medium having computer instructions thereon for causing a processor to implement various aspects of the embodiments of this specification.

[0118] A computer-readable storage medium can be a tangible device that can hold and store computer instructions for use by a computer instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (non-exhaustive list) of computer-readable storage media include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disk read-only memory (CD-ROM), digital versatile disks (DVDs), memory sticks, floppy disks, mechanically encoded devices such as punch cards or raised structures in grooves having computer instructions stored thereon, and any suitable combination of the foregoing. The computer-readable storage medium as used herein is not construed to be a transitory signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., an optical pulse through an optical fiber cable), or an electrical signal transmitted through a wire.

[0119] The computer instructions described herein can be downloaded from a computer-readable storage medium to various computing / processing devices, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network may include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer instructions from the network and forwards the computer instructions for storage in a computer-readable storage medium in each computing / processing device.

[0120] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present specification. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a portion of computer instructions, which contains one or more executable computer instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the blocks may occur in a different order than noted in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions. As is well known to those skilled in the art, implementation by hardware, implementation by software, and implementation by a combination of software and hardware are equivalent.

[0121] The embodiments of the present specification have been described above. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art in the technical field without departing from the scope of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or the improvement of the technology in the market, or to enable other ordinary skilled persons in the technical field to understand the embodiments disclosed herein.

Claims

1. A double-sided imprinting method, characterized in that: include: Controlling the grasping mechanism to grasp the wafer to be imprinted, and placing the wafer to be imprinted on the first imprinting template, wherein the imprinting glue on the first surface of the wafer to be imprinted contacts the first imprinting template, and the first imprinting template is arranged on the first supporting plate; Controlling the grasping mechanism to grasp the second imprint template, and placing the second imprint template on the wafer to be imprinted, wherein the imprint glue on the second surface of the wafer to be imprinted contacts the second imprint template, and the first surface and the second surface are parallel and opposite planes to each other; Controlling the first roller mechanism to roll on the second embossing template to complete the first embossing; When the first support plate is removed and the second support plate is moved to be in contact with the second embossing template, the second roller mechanism is controlled to roll on the first embossing template to complete the second embossing; The embossing adhesive curing device is controlled to cure the embossing adhesive on the first surface and the embossing adhesive on the second surface, so as to complete double-sided embossing of the wafer to be embossed.

2. The method according to claim 1, characterized in that The first surface of the wafer to be imprinted is provided with a first mark, and the first imprint template is provided with a second mark, wherein before placing the wafer to be imprinted on the first imprint template, the method further comprises: The gripping mechanism is controlled to move so that the positions of the first mark and the second mark are aligned.

3. The method according to claim 2, characterized in that The second imprint template is provided with a third mark, wherein before placing the second imprint template on the wafer to be imprinted, the method further comprises: The gripping mechanism is controlled to move so that the position of the first mark is aligned with the position of the third mark.

4. The method according to claim 3, characterized in that The gripping mechanism is provided with a camera, wherein the method further comprises: Obtaining a first image captured by a camera, wherein the first image includes the first mark and the second mark; Determining, according to the first image, whether the first mark and the second mark are aligned along a superposition direction of the wafer to be imprinted and the first imprint template; Placing the wafer to be imprinted on the first imprint template is performed only when it is determined that the first mark and the second mark are aligned; Obtaining a second image captured by a camera, wherein the second image includes the first mark and the third mark; determining, according to the second image, whether the first mark and the third mark are aligned along a superposition direction of the wafer to be imprinted and the second imprint template; The operation of placing the second imprint template on the wafer to be imprinted is performed only when it is determined that the first mark and the third mark are aligned.

5. The method according to claim 1, characterized in that The first surface of the wafer to be imprinted is provided with a first mark, and the gripping mechanism is provided with a camera, wherein the method further comprises: Determining whether a center point of the field of view of the camera is aligned with a center point of the first marker; The operation of controlling the grasping mechanism to grasp the wafer to be imprinted is performed only when the center point of the field of view of the camera is aligned with the center point of the first mark; and The second imprint template is provided with a third mark, wherein the method further comprises: Determining whether a center point of the field of view of the camera is aligned with a center point of the third marker; The operation of controlling the grasping mechanism to grasp the second imprint template is performed only when the center point of the field of view of the camera is aligned with the center point of the third mark.

6. The method according to claim 1, characterized in that The downward pressure applied to the first roller mechanism when the first roller mechanism rolls on the second embossing template is smaller than the upward pressure applied to the second roller mechanism when the second roller mechanism rolls on the first embossing template.

7. A double-sided imprinting device, characterized in that: include: A control device, a gripping mechanism, a first embossing template, a second embossing template, a first support plate, a second support plate and an embossing glue curing device, wherein: The control device is used to control the grasping mechanism to grasp the wafer to be imprinted, and place the wafer to be imprinted on the first imprinting template, wherein the imprinting glue on the first surface of the wafer to be imprinted contacts with the first imprinting template, and the first imprinting template is arranged on the first supporting plate; Controlling the grasping mechanism to grasp the second imprint template, and placing the second imprint template on the wafer to be imprinted, wherein the imprint glue on the second surface of the wafer to be imprinted contacts the second imprint template, and the first surface and the second surface are parallel and opposite planes to each other; Controlling the first roller mechanism to roll on the second embossing template to complete the first embossing; When the first support plate is removed and the second support plate is moved to be in contact with the second embossing template, the second roller mechanism is controlled to roll on the first embossing template to complete the second embossing; The embossing adhesive curing device is controlled to cure the embossing adhesive on the first surface and the embossing adhesive on the second surface, so as to complete double-sided embossing of the wafer to be embossed.

8. The double-sided imprinting device according to claim 7, characterized in that: The first surface of the wafer to be imprinted is provided with a first mark, and the first imprint template is provided with a second mark, wherein: Before placing the wafer to be imprinted on the first imprint template, the control device is further used to control the movement of the gripping mechanism so that the positions of the first mark and the second mark are aligned.

9. The double-sided imprinting device according to claim 7, characterized in that: The second imprint template is provided with a third mark, wherein before placing the second imprint template on the wafer to be imprinted, the control device is further used to control the movement of the gripping mechanism to align the position of the first mark with the position of the third mark.

10. The double-sided imprinting device according to claim 9, characterized in that: The double-sided embossing device further comprises a camera, which is arranged on the gripping mechanism, wherein: The control device is also used to obtain a first image captured by a camera, wherein the first image includes the first mark and the second mark; according to the first image, determine whether the first mark and the second mark are aligned along the superposition direction of the wafer to be imprinted and the first imprint template; only when it is determined that the first mark and the second mark are aligned, perform the operation of placing the wafer to be imprinted on the first imprint template; The control device is also used to obtain a second image taken by the camera, wherein the second image includes the first mark and the third mark; based on the second image, determine whether the first mark and the third mark are aligned along the overlapping direction of the wafer to be imprinted and the second imprint template; and only when it is determined that the first mark and the third mark are aligned, perform the operation of placing the second imprint template on the wafer to be imprinted.

11. The double-sided imprinting device according to claim 7, characterized in that: The downward pressure applied to the first roller mechanism when the first roller mechanism rolls on the second embossing template is smaller than the upward pressure applied to the second roller mechanism when the second roller mechanism rolls on the first embossing template.

Images