Magnetic core bonding process and device thereof

Abstract

The invention relates to a magnetic core bonding process and a magnetic core bonding device. The magnetic core bonding process comprises the steps that S1, a first carrier is fixed to a first moving assembly; a second carrier is horizontally placed on the second moving assembly, and the first bonding face faces upwards; a plurality of magnetic cores are placed on a third moving assembly; s2, a second moving assembly is horizontally moved, a gluing assembly is moved, and the first bonding surface is coated with first mucilage glue; s3, the first moving assembly and the first carrier are moved from top to bottom, and the first carrier is bonded with the first adhesive; s4, the first moving assembly, the first carrier and the second carrier are moved from bottom to top, the second bonding face faces downwards, the gluing assembly is moved, the second bonding face is coated with second glue, and the viscosity loss temperature of the first glue is lower than the viscosity loss temperature of the second glue; and S5, a third moving assembly is horizontally moved to enable the magnetic core to be located on the lower side of the second carrier, the first moving assembly, the first carrier and the second carrier are moved from top to bottom, the second mucilage glue is bonded with the magnetic core, and damage caused by separation of the magnetic core is avoided.

Description

Technical Field

[0001] The present invention relates to the field of magnetic core equipment, and particularly to a magnetic core bonding process and its device. Background Art

[0002] In the production and manufacturing process of magnetic cores, after the magnetic cores are formed, they need to be bonded to a bonding plate first and then subjected to a silver dipping process. In the existing process, a placement groove is usually provided on the magnetic core bonding plate, and an adhesive is provided in the placement groove, and the magnetic cores are directly bonded in the placement groove. Therefore, when the magnetic cores are directly detached from the bonding plate after silver dipping, the magnetic cores may be damaged, and the magnetic cores are in a mess, which is not conducive to subsequent process treatment. Summary of the Invention

[0003] The purpose of the present invention is to provide a magnetic core bonding process, which has the characteristics that the magnetic cores are not easily damaged, etc., and has good applicability.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions: A magnetic core bonding process includes: S1, fixing a first carrier to a first moving component; horizontally placing a second carrier on a second moving component, and the first bonding surface of the second carrier faces upward; placing a plurality of magnetic cores on a third moving component; S2, horizontally moving the second moving component so that the second carrier is located below the first carrier, moving a glue coating component, and coating a first adhesive on the first bonding surface; S3, moving the first moving component and the first carrier from top to bottom, and the first carrier is bonded to the first adhesive; S4, moving the first moving component, the first carrier and the second carrier from bottom to top, the second bonding surface of the second carrier faces downward, moving the glue coating component, and coating a second adhesive on the second bonding surface, and the temperature at which the first adhesive loses its viscosity is lower than the temperature at which the second adhesive loses its viscosity; S5, horizontally moving the third moving component so that the magnetic cores are located below the second carrier, moving the first moving component, the first carrier and the second carrier from top to bottom, and the second adhesive is bonded to the magnetic cores.

[0005] Preferably, in step S2, the glue coating component moves at a constant speed; in step S4, the glue coating component moves at a variable speed.

[0006] Preferably, in step S4, when the glue coating component is located below the limiting groove of the second bonding surface, the moving speed of the glue coating component is reduced by 40%-60%.

[0007] Preferably, in step S5, the magnetic core is an H-shaped magnetic core, and a part of the magnetic core is inserted into the limiting groove of the second bonding surface.

[0008] Preferably, the first adhesive and the second adhesive are pyrolytic adhesives. The first adhesive loses its viscosity at a temperature above 100°C, and the second adhesive loses its viscosity at a temperature above 600°C; the first carrier is a glass fiber board, and the second carrier is a glass fiber cloth.

[0009] A magnetic core bonding device for bonding a magnetic core, the magnetic core having a silver dipping groove, comprising: A workbench; A first moving component, which is fixed with a first carrier; A second moving component, on which a second carrier is placed; A glue application component, which is movably arranged on the workbench and is located between the first moving component and the second moving component. The glue application component includes a glue application cylinder, and the glue application cylinder has a first accommodation cavity and a second accommodation cavity that are separated from each other. The first accommodation cavity is located below the second accommodation cavity. The first accommodation cavity contains a first adhesive, and the second accommodation cavity contains a second adhesive; the glue application cylinder is also provided with a first channel and a second channel. The inlet of the first channel is communicated with the first accommodation cavity, the outlet of the first channel faces the second carrier and is along the vertical direction, and the inlet of the first channel can be higher than the liquid level of the first adhesive; the inlet of the second channel is communicated with the second accommodation cavity, and the outlet of the second channel faces the first carrier; A third moving component, which is located below the second moving component. The third moving component has a plurality of limiting convex strips arranged at intervals, and the limiting convex strips are clamped in the silver dipping groove.

[0010] Preferably, along the length direction of the glue application cylinder, the length of the inlet of the first channel is less than the length of the outlet of the first channel, and the length of the inlet of the second channel is less than the length of the outlet of the second channel.

[0011] Preferably, the glue application component further includes a first power component and a first pressing plate located in the first accommodation cavity. The first power component drives the first pressing plate to move along the length direction of the glue application cylinder, and the first pressing plate pushes the first adhesive into the inlet of the first channel; The glue application component further includes a second power component and a second pressing plate located in the second accommodation cavity. The second power component drives the second pressing plate to move along the length direction of the glue application cylinder, and the second pressing plate pushes the second adhesive into the inlet of the second channel.

[0012] Preferably, the second carrier has a first bonding surface and a second bonding surface. The first bonding surface is bonded to the first carrier through the first adhesive; the second bonding surface has a plurality of limiting grooves arranged at intervals, and part of the magnetic core is inserted into the limiting grooves, and the limiting grooves limit the movement of the magnetic core.

[0013] Preferably, a scraping plate is further provided on the outer side surface of the glue applicator cylinder. Along the moving direction of the glue application assembly, the scraping plate is located behind the outlet of the second channel, and the scraping plate contacts the second adhesive to control the thickness of the second adhesive.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: In the magnetic core bonding process provided by the above technical solution, first, the first adhesive is applied to the first bonding surface of the second carrier, and the second carrier is bonded to the first carrier. Then, the second adhesive is applied to the second bonding surface of the second carrier, and the magnetic core is bonded to the second carrier. And because the temperature at which the first adhesive loses its viscosity is lower than the temperature at which the second adhesive loses its viscosity, in the subsequent silver dipping and sintering process, through the increase in temperature, the first carrier and the second carrier can be separated first. At this time, the magnetic core is still on the second carrier, so as to avoid damage to the magnetic core caused by direct separation, and the magnetic core can also be kept neat, which is beneficial to subsequent process treatment. Description of the Drawings

[0015] Figure 1 Schematic diagram of the magnetic core bonding device provided by an embodiment of the present invention; Figure 2 Schematic diagram of the glue applicator cylinder provided by an embodiment of the present invention; Figure 3 Cross-sectional schematic diagram of the glue applicator cylinder provided by an embodiment of the present invention; Figure 4 Schematic diagram of the glue application assembly provided by an embodiment of the present invention; Figure 5 Schematic diagram of the second carrier provided by an embodiment of the present invention; Figure 6 Another perspective schematic diagram of the second carrier provided by an embodiment of the present invention; Figure 7 Schematic diagram of the magnetic core provided by an embodiment of the present invention.

[0016] 1. Magnetic core; 11. Silver dipping groove; 2. Workbench; 3. First moving component; 4. First carrier; 5. Second moving component; 6. Second carrier; 61. First bonding surface; 62. Second bonding surface; 63. Limiting groove; 7. Glue applying component; 71. Glue applying cylinder; 711. First accommodating cavity; 712. Second accommodating cavity; 713. First channel; 714. Second channel; 72. First power component; 73. First pressing plate; 74. Second power component; 75. Second pressing plate; 76. Scraper; 8. Third moving component; 81. Limiting rib. Detailed implementation manner

[0017] The present invention will be described in more detail below with reference to the accompanying drawings. It should be noted that the description of the present invention with reference to the accompanying drawings is only illustrative and not restrictive. Various different embodiments can be combined with each other to form other embodiments not shown in the following description.

[0018] Please refer to Figures 1 to 7 , the present invention provides a magnetic core bonding process, including: S1. Fix the first carrier 4 to the first moving component 3; horizontally place the second carrier 6 on the second moving component 5, and the first bonding surface 61 of the second carrier 6 faces upward; place a plurality of magnetic cores 1 on the third moving component 8; S2. Horizontally move the second moving component 5 so that the second carrier 6 is located below the first carrier 4, move the glue applying component 7, and apply the first adhesive on the first bonding surface 61; S3. Move the first moving component 3 and the first carrier 4 from top to bottom, and the first carrier 4 is bonded to the first adhesive; S4. Move the first moving component 3, the first carrier 4 and the second carrier 6 from bottom to top, the second bonding surface 62 of the second carrier 6 faces downward, move the glue applying component 7, and apply the second adhesive on the second bonding surface 62, and the temperature at which the first adhesive loses its viscosity is lower than the temperature at which the second adhesive loses its viscosity; S5. Horizontally move the third moving component 8 so that the magnetic core 1 is located below the second carrier 6, move the first moving component 3, the first carrier 4 and the second carrier 6 from top to bottom, and the second adhesive is bonded to the magnetic core 1.

[0019] In the above-mentioned magnetic core bonding process, first, a first adhesive is applied to the first bonding surface 61 of the second carrier 6, and the second carrier 6 is bonded to the first carrier 4. Then, a second adhesive is applied to the second bonding surface 62 of the second carrier 6, and the magnetic core 1 is bonded to the second carrier 6. Since the temperature at which the first adhesive loses its viscosity is lower than the temperature at which the second adhesive loses its viscosity, in the subsequent silver plating and sintering process, as the temperature increases, the first carrier 4 and the second carrier 6 can be separated first. At this time, the magnetic core 1 is still located on the second carrier 6, thus avoiding damage to the magnetic core 1 caused by direct separation, and the magnetic core 1 can also remain neat, which is beneficial to subsequent process treatment.

[0020] In step S2, the glue application assembly 7 moves at a constant speed. It can be imagined that the bonding surfaces of the first carrier 4 and the second carrier 6 are both planar. Therefore, the constant movement of the glue application assembly 7 can apply a first adhesive with a uniform thickness on the first bonding surface 61 of the second carrier 6, thereby improving the uniformity of the bonding between the first carrier 4 and the second carrier 6.

[0021] In step S4, the glue application assembly 7 moves at a variable speed. In step S4, when the glue application assembly 7 is located below the limiting groove 63 of the second bonding surface 62, the moving speed of the glue application assembly 7 is reduced by 40%-60%. It can be imagined that since the second bonding surface 62 is provided with the limiting groove 63, in order to also apply the second adhesive in the limiting groove 63, the glue application assembly 7 needs to move at a variable speed.

[0022] In step S5, the magnetic core 1 is an H-shaped magnetic core, and part of the magnetic core 1 is inserted into the limiting groove 63 of the second bonding surface 62. It can be imagined that when the second adhesive solidifies, its volume and the like will change. In order to prevent the magnetic core 1 from shifting due to the volume change of the second adhesive, part of the magnetic core 1 is inserted into the limiting groove 63, and the inner wall surface of the limiting groove 63 can limit the movement of the magnetic core 1, thereby enhancing the stability of the bonding of the magnetic core 1.

[0023] The first adhesive and the second adhesive are pyrolytic adhesives. The first adhesive loses its viscosity at a temperature higher than 100°C, and the second adhesive loses its viscosity at a temperature higher than 600°C; the first carrier 4 is a glass fiber board, and the second carrier 6 is a glass fiber cloth.

[0024] Please refer to Figures 1 to 7 , the present invention also provides a magnetic core bonding device, including a workbench 2, a first moving component 3, a first carrier 4, a second moving component 5, a second carrier 6, a glue application component 7, and a third moving component 8.

[0025] The first moving component 3 is fixed with a first carrier 4; the second moving component 5 holds a second carrier 6; the glue - applying component 7 is movably arranged on the workbench 2 and is located between the first moving component 3 and the second moving component 5. The glue - applying component 7 includes a glue - applying cylinder 71. Inside the glue - applying cylinder 71, there are a first accommodating cavity 711 and a second accommodating cavity 712 which are separated from each other. The first accommodating cavity 711 is located below the second accommodating cavity 712. The first accommodating cavity 711 holds a first adhesive, and the second accommodating cavity 712 holds a second adhesive; the glue - applying cylinder 71 is also provided with a first channel 713 and a second channel 714. The inlet of the first channel 713 is communicated with the first accommodating cavity 711, the outlet of the first channel 713 faces the second carrier 6, and along the vertical direction, the inlet of the first channel 713 can be higher than the liquid level of the first adhesive; the inlet of the second channel 714 is communicated with the second accommodating cavity 712, and the outlet of the second channel 714 faces the first carrier 4; the third moving component 8 is located below the second moving component 5, and the third moving component 8 has a plurality of spaced - apart limiting ridges 81, and the limiting ridges 81 are clamped in the silver - dipping groove 11.

[0026] In the above - mentioned magnetic core bonding device, the first moving component 3 can move the first carrier 4 in the vertical direction, the second moving component 5 can drive the second carrier 6 to move in the horizontal direction, and the second carrier 6 is not fixed to the second moving component 5. The glue - applying component 7 can move in the horizontal direction to apply glue to the second carrier 6. Specifically, inside the glue - applying cylinder 71, there are a first accommodating cavity 711 and a second accommodating cavity 712 which are separated from each other. The first accommodating cavity 711 can hold a first adhesive, and the second accommodating cavity 712 can hold a second adhesive. The first adhesive can move from the first accommodating cavity 711 to the second carrier 6 through the first channel 713, and the second adhesive can move to the second carrier 6 through the second channel 714. Thus, two different adhesives can be applied to the second carrier 6 by one glue - applying component 7, greatly simplifying the complexity of the device.

[0027] Very importantly, when the first adhesive needs to be applied to the first bonding surface 61 of the second carrier 6, the second carrier 6 is located below the glue - applying component 7. To prevent the first adhesive from directly dripping due to the influence of gravity, the inlet of the first channel 713 is arranged on the side wall of the first accommodating cavity 711, and along the vertical direction, the height of the first channel 713 can be higher than the liquid level of the first adhesive.

[0028] The glue - applying component 7 further includes a first power member 72 and a first pressing plate 73 located in the first accommodating cavity 711. The first power member 72 drives the first pressing plate 73 to move along the length direction of the glue - applying cylinder 71, and the first pressing plate 73 pushes the first adhesive into the inlet of the first channel 713; The glue - applying assembly 7 further includes a second power member 74 and a second extrusion plate 75 located in the second accommodation cavity 712. The second power member 74 drives the second extrusion plate 75 to move along the length direction of the glue - applying cylinder 71, and the second extrusion plate 75 pushes the second adhesive into the entrance of the second channel 714.

[0029] It can be conceived that the first power member 72 and the second power member 74 can be cylinders, oil cylinders, etc., which can drive the first extrusion plate 73 and the second extrusion plate 75 to move along the length direction of the glue - applying cylinder 71. Taking the first power member 72 and the first extrusion plate 73 as an example, the first power member 72 and the first extrusion plate 73 are located on one side of the first accommodation cavity 711 in the length direction, while the first adhesive is located in the middle part of the first accommodation cavity 711. When the first power member 72 drives the first extrusion plate 73 to move, the first extrusion plate 73 will extrude the first adhesive, so that the liquid level of the first adhesive rises. When the liquid level of the first adhesive is higher than the entrance height of the first channel 713, the first adhesive will enter the first channel 713, and then move along the first channel 713 and finally be coated on the second carrier 6.

[0030] In addition, since the second carrier 6 is located below the glue - applying assembly 7 at this time, the outlet of the first channel 713 can be located on the lower side surface of the glue - applying cylinder 71.

[0031] The working principle of the second power member 74 and the second extrusion plate 75 is the same as above, and will not be elaborated here. It should be noted that when applying the second adhesive to the second bonding surface 62 of the second carrier 6, the second carrier 6 is located above the glue - applying assembly 7. Therefore, the entrance of the second channel 714 can be directly set on the inner wall surface of the upper wall of the glue - applying cylinder 71, and the outlet of the second channel 714 can be set on the outer wall surface of the upper wall of the glue - applying cylinder 71.

[0032] In addition, the first power member 72 and the first extrusion plate 73 can be set to two, which respectively extrude the first adhesive from both sides to the middle, and at this time, the entrance of the first channel 713 can be set in the middle part of the glue - applying cylinder 71. The second power member 74 and the second extrusion plate 75 can also be set to two, which respectively extrude the second adhesive from both sides to the middle, and at this time, the entrance of the second channel 714 can be set in the middle part of the glue - applying cylinder 71.

[0033] Along the length direction of the glue - applying cylinder 71, the length of the entrance of the first channel 713 is less than the length of the outlet of the first channel 713, and the length of the entrance of the second channel 714 is less than the length of the outlet of the second channel 714.

[0034] It is very important to take the first channel 713 as an example for illustration. If the entrance of the first channel 713 is too long, during the glue application process, due to the continuous movement of the first pressing plate 73, it may cause part of the entrance of the first channel 713 to be located behind the first pressing plate 73. At this time, since the first pressing plate 73 presses the first adhesive, it may cause the first adhesive to overflow from the entrance of the first channel 713 located behind the first pressing plate 73, thus affecting the normal operation of the first power component 72. To avoid this situation, the present invention shortens the length of the entrance of the first channel 713, and the moving distance of the first pressing plate 73 can be controlled by setting a control board. For example, when the first pressing plate 73 moves a certain distance and approaches the entrance of the first channel 713, at this time, the control board controls the first pressing plate 73 to stop moving, and can issue a warning to notify the staff to add the first adhesive. At the same time, the control board can also control the first pressing plate 73 to retreat, facilitating the staff to add the first adhesive.

[0035] The working principle of the second channel 714 is the same as above and will not be elaborated here.

[0036] The second carrier 6 has a first bonding surface 61 and a second bonding surface 62. The first bonding surface 61 is bonded to the first carrier 4 through the first adhesive; the second bonding surface 62 has a plurality of spaced-apart limiting grooves 63, and part of the magnetic core 1 is inserted into the limiting grooves 63, and the limiting grooves 63 limit the movement of the magnetic core 1.

[0037] Specifically, a plurality of limiting grooves 63 are provided and are spaced apart. The magnetic core 1 of the present invention is an H-shaped magnetic core, and the two protruding edges of the magnetic core 1 can be inserted into the limiting grooves 63, so that during the bonding process, the limiting grooves 63 can prevent the magnetic core 1 from shifting and other situations.

[0038] In addition, the magnetic core 1 of the present invention has a silver dipping groove 11 during molding. In the subsequent silver dipping process, a silver layer can be formed in the silver dipping groove 11. The present invention utilizes the characteristic that the magnetic core 1 has a silver dipping groove 11. By having a limiting rib 81 on the third moving component 8, the limiting rib 81 can be clamped in the silver dipping groove 11, thereby further restricting the movement of the magnetic core 1.

[0039] As can be seen from the above, the present invention utilizes the characteristic that the magnetic core 1 has a silver dipping groove 11. First, the movement of the magnetic core 1 is restricted by the limiting rib 81, and then the movement of the magnetic core 1 after bonding is restricted by the limiting groove 63, so as to ensure that the magnetic core 1 has accurate positioning before and after bonding. In this way, in the silver dipping process, the magnetic core 1 with accurate position contacts the silver paste, and thus a silver layer with accurate size can be formed in the silver dipping groove 11.

[0040] A squeegee 76 is further provided on the outer side surface of the glue application cylinder 71. Along the moving direction of the glue application assembly 7, the squeegee 76 is located at the rear side of the outlet of the second channel 714. The squeegee 76 contacts the second adhesive to control the thickness of the second adhesive. It can be conceived that when applying the second adhesive to the second bonding surface 62, the second carrier 6 is located above the glue application assembly 7. And since the second bonding surface 62 also has a limiting groove 63, in order to prevent uneven thickness of the second adhesive and to prevent the lack of the second adhesive in the limiting groove 63, the present invention controls the thickness of the second adhesive through the squeegee 76.

[0041] In addition, one end of the glue application cylinder 71 in the length direction can be provided with an opening, which is convenient for installing the first power member 72, the second power member 74, the first pressing plate 73, and the second pressing plate 75. In addition, a cover plate can be provided to close the opening. The glue application cylinder 71 can also be provided with two glue filling ports for adding the first adhesive and the second adhesive to the first accommodating cavity 711 and the second accommodating cavity 712 respectively.

[0042] The above embodiments are only the preferred embodiments of the present invention, and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention belong to the scope of protection required by the present invention.

Claims

1. A magnetic core bonding process, characterized in that, Including: S1. Fix the first carrier (4) to the first moving component (3); horizontally place the second carrier (6) on the second moving component (5), and the first bonding surface (61) of the second carrier (6) faces upward; place a plurality of magnetic cores (1) on the third moving component (8). S2. Horizontally move the second moving component (5) so that the second carrier (6) is located below the first carrier (4), move the glue application component (7), and apply the first adhesive on the first bonding surface (61). S3. Move the first moving component (3) and the first carrier (4) from top to bottom, and the first carrier (4) adheres to the first adhesive. S4. Move the first moving component (3), the first carrier (4) and the second carrier (6) from bottom to top, the second bonding surface (62) of the second carrier (6) faces downward, move the glue application component (7), and apply the second adhesive on the second bonding surface (62), and the temperature at which the first adhesive loses its viscosity is lower than the temperature at which the second adhesive loses its viscosity. S5. Horizontally move the third moving component (8) so that the magnetic core (1) is located below the second carrier (6), move the first moving component (3), the first carrier (4) and the second carrier (6) from top to bottom, and the second adhesive adheres to the magnetic core (1).

2. The magnetic core bonding process according to claim 1, wherein In step S2, the glue application component (7) moves at a constant speed; in step S4, the glue application component (7) moves at a variable speed.

3. The magnetic core bonding process according to claim 2, characterized in that, In step S4, when the glue application component (7) is located below the limiting groove (63) of the second bonding surface (62), the moving speed of the glue application component (7) is reduced by 40%-60%.

4. The magnetic core bonding process according to claim 1, wherein, In step S5, the magnetic core (1) is an H-shaped magnetic core, and part of the magnetic core (1) is inserted into the limiting groove (63) of the second bonding surface (62).

5. The magnetic core bonding process according to claim 1, characterized in that, The first adhesive and the second adhesive are pyrolytic adhesives. The first adhesive loses its viscosity at a temperature higher than 100°C, and the second adhesive loses its viscosity at a temperature higher than 600°C; the first carrier (4) is a glass fiber board, and the second carrier (6) is a glass fiber cloth.

6. A magnetic core bonding device for bonding a magnetic core (1), the magnetic core (1) having a silver dipping groove (11), characterized in that, Including: Workbench (2); The first moving component (3) with the first carrier (4) fixed thereto; The second moving component (5) with the second carrier (6) placed thereon; The glue - applying assembly (7) is movably arranged on the workbench (2) and is located between the first moving assembly (3) and the second moving assembly (5). The glue - applying assembly (7) includes a glue - applying cylinder (71). There are a first accommodating cavity (711) and a second accommodating cavity (712) separated from each other in the glue - applying cylinder (71). The first accommodating cavity (711) is located below the second accommodating cavity (712). The first accommodating cavity (711) contains a first adhesive, and the second accommodating cavity (712) contains a second adhesive. The glue - applying cylinder (71) is also provided with a first channel (713) and a second channel (714). The inlet of the first channel (713) is communicated with the first accommodating cavity (711). The outlet of the first channel (713) is arranged towards the second carrier (6) and is along the vertical direction. The inlet of the first channel (713) can be higher than the liquid level of the first adhesive. The inlet of the second channel (714) is communicated with the second accommodating cavity (712). The outlet of the second channel (714) is arranged towards the first carrier (4). The third moving assembly (8) is located below the second moving assembly (5). The third moving assembly (8) has a plurality of spaced - apart limiting ridges (81). The limiting ridges (81) are clamped in the silver - dipping groove (11).

7. The magnetic core bonding device according to claim 6, wherein, Along the length direction of the glue - applying cylinder (71), the length of the inlet of the first channel (713) is less than the length of the outlet of the first channel (713), and the length of the inlet of the second channel (714) is less than the length of the outlet of the second channel (714).

8. The magnetic core bonding device according to claim 6, characterized in that, The glue - applying assembly (7) further includes a first power member (72) and a first extrusion plate (73) located in the first accommodating cavity (711). The first power member (72) drives the first extrusion plate (73) to move along the length direction of the glue - applying cylinder (71). The first extrusion plate (73) pushes the first adhesive into the inlet of the first channel (713). The glue - applying assembly (7) further includes a second power member (74) and a second extrusion plate (75) located in the second accommodating cavity (712). The second power member (74) drives the second extrusion plate (75) to move along the length direction of the glue - applying cylinder (71). The second extrusion plate (75) pushes the second adhesive into the inlet of the second channel (714).

9. The magnetic core bonding device according to claim 6, characterized in that, The second carrier (6) has a first bonding surface (61) and a second bonding surface (62). The first bonding surface (61) is bonded to the first carrier (4) through the first adhesive. The second bonding surface (62) has a plurality of spaced - apart limiting grooves (63). Part of the magnetic core (1) is inserted into the limiting grooves (63). The limiting grooves (63) limit the movement of the magnetic core (1).

10. The magnetic core bonding device according to claim 6, characterized in that, A scraper (76) is further provided on the outer side surface of the glue application cylinder (71). Along the moving direction of the glue application assembly (7), the scraper (76) is located at the rear side of the outlet of the second channel (714), and the scraper (76) contacts the second adhesive to control the thickness of the second adhesive.

Images