Pasting film preparation method, pasting film pasting method and pasting film pasting system
By applying the target film on a large-size, curved body device and dividing it into polygons, the problem of film folds in the coating process is solved, and higher flatness and denseness are achieved.
Patent Information
- Application Number
- CN202510346735.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2025-06-24
AI Technical Summary
When the existing coating process faces large-size and curved body devices, it is difficult to ensure the wrinkle-free bonding of the film, resulting in degradation of functional performance and film falloff.
By applying the target film to the intermediate media film with scalability and self-adhesion and dividing it into multiple target polygons, the expansion of the intermediate media film is used for stretching and covering it to reduce the generation of wrinkles.
The flatness and density of the target film covering on large-size, large-curvature and multi-curvature surfaces is improved, the wrinkle phenomenon of the film is reduced, and the service life of the film is extended.
Smart Images
Figure CN120199694A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of thin film preparation. Specifically, it relates to a method for preparing a laminated thin film, a method and a system for laminating the laminated thin film. Background Art
[0002] With the diversified development of technology, the market demand for large-size and curved surface devices is increasing day by day. These devices are widely used in various fields, such as consumer electronics, aerospace, and automotive manufacturing. The surface design of these devices has become increasingly complex, no longer limited to simple planar structures, but incorporating diverse curvatures and arcs to meet higher-level functional and aesthetic requirements. However, this increase in surface complexity has brought unprecedented challenges to the laminated thin film process.
[0003] As an effective surface treatment technology, the laminated thin film can significantly improve the performance of the device, such as enhancing protection, improving wear resistance, and increasing optical effects, thereby modifying the device. However, when facing these complex surfaces, the existing lamination processes often struggle to ensure wrinkle-free lamination of the thin film. Wrinkles not only affect the aesthetics but may also damage the functionality of the thin film, such as optical performance and electromagnetic shielding effect. In severe cases, it may even cause the thin film to fall off, affecting the overall performance and lifespan of the device. Summary of the Invention
[0004] In view of this, the purpose of the embodiments of the present application is to provide a method for preparing a laminated thin film, a method and a system for laminating the laminated thin film, which can improve the flatness and compactness of the target thin film lamination on large-size, large-curvature, and multi-curvature surfaces.
[0005] In a first aspect, the embodiments of the present application provide a method for preparing a laminated thin film, including: laminating a target thin film on an intermediate medium thin film; wherein, the intermediate medium thin film has stretchability and self-adhesiveness; dividing the target thin film laminated on the intermediate medium thin film into a plurality of target polygons, and the plurality of target polygons are kept on the intermediate medium thin film; wherein, the intermediate medium thin film and the target thin film form a laminated thin film, and the laminated thin film is configured to be laminated on the surface of a target device.
[0006] In the above implementation process, by attaching the target film to the intermediate dielectric film to form a laminated film, the stretchability of the intermediate dielectric film can be utilized to attach the stretched laminated film to the surface of the target device. Since the laminated film attached to the surface of the target device is in a stretched state, the possibility of multiple layers of the laminated film overlapping at the same position on the surface of the target device is relatively low, thus reducing the wrinkles generated during the attachment of the target film. Additionally, by cutting the target film in the laminated film into multiple target polygons, gaps can be generated between the respective target polygons when stretching the laminated film. When attaching the target film to the surface of a relatively complex target device, due to the gaps between the respective target polygons, a certain amount of shrinkage space can be provided for the laminated film, and the area of the target polygon is small, enabling full conformity according to the shape of the surface of the target device, thereby further reducing the generation of attachment wrinkles and improving the flatness and density of the attachment of the target film.
[0007] In one embodiment, before attaching the target film to the intermediate dielectric film, the method further includes: preparing a functional film layer on the surface of a film substrate to form the target film; and attaching the target film to the intermediate dielectric film includes: attaching one side of the functional film layer of the target film to the intermediate dielectric film.
[0008] In the above implementation process, for a functional film layer with relatively brittle material itself, by preparing a functional film layer on the surface of a film substrate to form the target film, the toughness of the target film can be improved, avoiding the fracture of the target film during preparation or attachment, and extending the service life of the target film.
[0009] In one embodiment, the target polygon is a regular hexagon; the regular hexagon is obtained based on an etching process.
[0010] In the above implementation process, regular hexagons are closely arranged, which can effectively cover the spherical surface and reduce voids. By cutting the target film into regular hexagons, the density of the target film attached to the surface of the target device can be improved, and at the same time, the generation of wrinkles during the overall attachment of the target film can be reduced.
[0011] In one embodiment, the target film is configured as a layered film composed of multiple materials; and the thickness of the target film is less than or equal to 5 μm.
[0012] In one embodiment, after dividing the target film attached to the intermediate dielectric film into multiple target polygons, keeping the laminated film in a stretched state, metal powder is filled in each gap between the multiple target polygons.
[0013] In the above implementation process, by filling metal powder into each gap between multiple target polygons, the overall optical, electrical, or electromagnetic properties of the surface can be improved. In addition, the metal powder can be used to isolate the adhesive and the intermediate dielectric film coated on the surface of the target device, prevent the intermediate dielectric film from adhering to the surface of the target device, and reduce the difficulty of removing the intermediate dielectric film.
[0014] In a second aspect, an embodiment of the present application further provides a method for attaching a thin film, including: attaching a target thin film to an intermediate dielectric film; wherein, the intermediate dielectric film has stretchability and self-adhesiveness; dividing the target thin film attached to the intermediate dielectric film into multiple target polygons, and the multiple target polygons remain on the intermediate dielectric film; wherein, the intermediate dielectric film and the target thin film form an attached thin film, and the attached thin film is configured to be attached to the surface of a target device; applying an adhesive to the surface of the target device; stretching the attached thin film; attaching the target thin film side of the attached thin film to the surface of the target device; and removing the intermediate dielectric film.
[0015] In the above implementation process, by attaching the target thin film to the intermediate dielectric film to form an attached thin film, the stretchability of the intermediate dielectric film can be utilized to attach the stretched attached thin film to the surface of the target device. Since the attached thin film attached to the surface of the target device is in a stretched state, the possibility of multiple layers of the attached thin film overlapping at the same position on the surface of the target device is relatively low, so the wrinkles generated by attaching the target thin film are reduced. In addition, by cutting the target thin film in the attached thin film into multiple target polygons, gaps can be generated between the respective target polygons when stretching the attached thin film. When attaching the attached thin film to the surface of a relatively complex target device, since there are gaps between the respective target polygons, a certain contraction space can be provided for the attached thin film, and the area of the target polygon is small, so it can be fully attached according to the shape of the surface of the target device, further reducing the generation of attachment wrinkles and improving the flatness and density of attaching the target thin film.
[0016] In one embodiment, the adhesiveness between the intermediate dielectric film and the target thin film is less than the adhesiveness between the target thin film and the surface of the target device.
[0017] In the above implementation process, by setting the adhesiveness between the intermediate dielectric film and the target thin film to be less than the adhesiveness between the target thin film and the surface of the target device, when removing the intermediate dielectric film, since the adhesiveness between the target thin film and the surface of the target device is stronger, the target thin film will not be carried away by the intermediate dielectric, thereby improving the attachment stability of the target thin film and reducing the difficulty of removing the intermediate dielectric.
[0018] In one embodiment, after dividing the target film attached to the intermediate dielectric film into a plurality of target polygons, the intermediate dielectric film is kept in a stretched state, and metal powder is filled in each gap between the plurality of target polygons.
[0019] In the above implementation process, by filling metal powder in each gap between the plurality of target polygons, the overall optical, electrical, or electromagnetic properties of the surface can be improved. In addition, the metal powder can be used to isolate the adhesive coated on the surface of the target device and the intermediate dielectric film, prevent the intermediate dielectric film from adhering to the surface of the target device, and reduce the difficulty of removing the intermediate dielectric film.
[0020] In one embodiment, the degree of stretching the attached film is determined by the maximum curvature of the surface of the target device.
[0021] In the above implementation process, since the area with the maximum curvature of the target device is usually the area where the most wrinkles appear, by setting the degree of stretching the attached film to be determined by the maximum curvature of the target device, fewer wrinkles can be generated in each area of the attached film on the surface of the target device, and then a flat and dense attached film can be attached to the surface of the target device, improving the flatness of the attachment.
[0022] In a third aspect, an embodiment of the present application further provides a film attachment system, including: a first attachment device for attaching a target film to an intermediate dielectric film; wherein, the intermediate dielectric film has stretchability and self-adhesiveness; a first segmentation device for dividing the target film attached to the intermediate dielectric film into a plurality of target polygons, and the plurality of target polygons are kept on the intermediate dielectric film; wherein, the intermediate dielectric film and the target film form an attached film, and the attached film is configured to be attached to the surface of a target device; a processing device for applying an adhesive to the surface of the target device; a stretching device for stretching the attached film; a second attachment device for attaching the target film side of the attached film to the surface of the target device; and a removal device for removing the intermediate dielectric film.
[0023] In a fourth aspect, an embodiment of the present application further provides an electronic device, including: a processor and a memory, the memory stores machine-readable instructions executable by the processor, and when the electronic device runs, when the machine-readable instructions are executed by the processor, the steps of the method for preparing an attached film in the first aspect, or any possible implementation manner of the first aspect, or the method for attaching a film in the second aspect, or any possible implementation manner of the second aspect are executed.
[0024] Fifth aspect, the embodiments of the present application further provide a computer-readable storage medium, on which a computer program is stored. When the computer program is run by a processor, it executes the method for preparing a pasted film in the above first aspect, or any possible implementation manner of the first aspect, or the method for pasting a film in the above second aspect, or the steps of the film pasting method in any possible implementation manner of the second aspect.
[0025] To make the above objects, features, and advantages of the present application more obvious and understandable, specific embodiments are hereinafter given and described in detail in conjunction with the accompanying drawings. Description of the Drawings
[0026] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.
[0027] Figure 1 It is a flowchart of the method for preparing a pasted film provided by the embodiments of the present application;
[0028] Figure 2 It is a flowchart of the film pasting method provided by the embodiments of the present application;
[0029] Figure 3 It is a schematic diagram of pasting a target film on the surface of an ellipsoid provided by the embodiments of the present application.
[0030] Description of the Drawings: 800 - surface of the ellipsoid, 900 - target film. Detailed Embodiments
[0031] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.
[0032] It should be noted that: similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, terms such as "first" and "second" are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.
[0033] At present, the research on photonic crystal thin film materials mainly focuses on the exploration of the functional properties of the thin films, as well as the preparation and testing on planar substrates, and has not yet entered the stage of practical application. In practical applications, the target device is often a combination composed of complex shapes and multi-curved surfaces. The existing processes cannot directly deposit a film layer with uniform thickness on a large-sized and complex-shaped target device. The film layer with non-uniform thickness will directly affect the absorption effect of the photonic crystal thin film in a specific frequency band, thereby affecting the performance of the film layer. In addition, when the material of the target device is non-metallic, the electroplating process cannot be used to process the film layer on its surface. Even when transferring the prepared film layer to the surface of a large-sized complex component, the film layer needs to be closely attached to the surface of the target device without wrinkles in order to exert its good performance. In addition, since the layered film layer composed of inorganic substances such as silicon and alumina is brittle and cannot undergo large deformations, it undoubtedly increases the difficulty of processing thin films on complex curved surfaces.
[0034] In view of this, the present application proposes a method for preparing a coated thin film. By coating a target thin film on an intermediate dielectric thin film to form a coated thin film, the stretchability of the intermediate dielectric thin film can be utilized to coat the stretched coated thin film on the surface of the target device. Since the coated thin film coated on the surface of the target device is in a stretched state, the possibility of multiple layers of the coated thin film overlapping at the same position on the surface of the target device is relatively low, thus reducing the wrinkles generated during the coating of the target thin film. In addition, by cutting the target thin film in the coated thin film into multiple target polygons, gaps can be generated between the respective target polygons when stretching the coated thin film. When the coated thin film is coated on the surface of a relatively complex target device, due to the gaps between the respective target polygons, a certain contraction space can be provided for the coated thin film, and the area of the target polygon is small, which can be fully fitted according to the shape of the surface of the target device, further reducing the generation of coating wrinkles and improving the flatness and compactness of the coating of the target thin film.
[0035] Please refer to Figure 1 , which is a flowchart of the method for preparing a coated thin film provided by an embodiment of the present application. The following will elaborate in detail on Figure 1 the specific process shown.
[0036] Step S201: Coat the target thin film on the intermediate dielectric thin film.
[0037] Among them, the target thin film refers to the thin film that needs to be coated on the surface of the target device. The target thin film can be an infrared photonic crystal thin film, an optical thin film, an infrared antireflection film, an infrared reflection film, etc., and the target thin film can be selected according to the actual application scenario.
[0038] The target device can be a wafer, a chip, a display screen, an optical lens, a mechanical device, etc., and the surface of the target device that needs to be coated with the target thin film can be a curved surface, a planar surface or an irregular surface, etc.
[0039] The intermediate medium film here has stretchability and self - adhesiveness. As an intermediate medium for the target film to adhere to the surface of the target device, the intermediate medium film can be removed after the target film is adhered to the surface of the target device. The intermediate medium film can be a silica gel film, a rubber film, a thermoplastic polyurethane film, etc., and can be selected according to the actual situation.
[0040] In one embodiment, the thickness of the intermediate medium film is between 0.1 and 1 mm.
[0041] Step S202: Divide the target film adhered to the intermediate medium film into multiple target polygons, and the multiple target polygons remain on the intermediate medium film.
[0042] The target polygon here can be a regular polygon. For example, a regular hexagon, an equilateral triangle, a regular pentagon, etc., and can be selected according to the actual situation.
[0043] Among them, the intermediate medium film and the target film form an adhered film, and the adhered film is configured to adhere to the surface of the target device. One side of the target film in the adhered film adheres to the surface of the target device.
[0044] Since the target film is divided into multiple target polygons, that is, the multiple target polygons adhere to the surface of the target device.
[0045] It can be understood that if the target film is adhered to the surface of a large - sized and / or complex target device, due to the complex shape of the surface of the target device, the target film adhered to its surface may have wrinkles, that is, two or more layers of the target film overlap at the same position on the surface of the target device, thereby affecting the performance of the target film in terms of optics, electricity, magnetism, etc.
[0046] By adhering the target film to the intermediate medium film first, and then when adhering the target film to the surface of the target device, by pulling the intermediate medium film, a distance can be opened between the multiple target polygons into which the target film is divided, and the stretched target film is adhered to the surface of the target device, and no overlap occurs between the multiple target polygons, which can reduce the wrinkles of the target film adhered to the surface of the target device.
[0047] In order to further reduce the wrinkles of the target thin film on the surface of the target device, by controlling the areas of multiple target polygons formed by cutting the target thin film attached to the intermediate medium thin film, before attaching the attached thin film to the surface of the target device, the intermediate medium thin film in the attached thin film can be stretched first. During the stretching process of the intermediate medium thin film, gaps are generated between the respective target polygons, so that the multiple target polygons corresponding to the position with the largest surface curvature of the target device can also be completely attached to the surface of the target device because the area of the target polygon is small enough or the gap is large enough, avoiding warping of the target thin film on the surface of the target device. It can be seen that since the surface curvature of the target device is not completely the same, target polygons with different areas can be set at different positions, and the areas of the target polygons at different positions of the target thin film can be selected according to the actual situation.
[0048] In the above implementation process, by attaching the target thin film to the intermediate medium thin film to form an attached thin film, the stretchability of the intermediate medium thin film can be utilized to attach the stretched attached thin film to the surface of the target device. Since the attached thin film attached to the surface of the target device is in a stretched state, the possibility of multiple layers of the attached thin film overlapping at the same position on the surface of the target device is relatively low. Therefore, the wrinkles generated by attaching the target thin film are reduced. In addition, by cutting the target thin film in the attached thin film into multiple target polygons, gaps can be generated between the respective target polygons when the attached thin film is stretched. When attaching the attached thin film to the surface of a relatively complex target device, since there are gaps between the respective target polygons, a certain contraction space can be provided for the attached thin film, and the area of the target polygon is small, so it can be fully attached according to the shape of the surface of the target device, further reducing the generation of attachment wrinkles and improving the flatness and density of the attachment of the target thin film.
[0049] In a possible implementation manner, before step S201, the method further includes: preparing a functional film layer on the surface of the film substrate to form a target thin film.
[0050] For different surfaces of the target device, the corresponding attached target thin films may be different. The materials of some target thin films may be relatively brittle and easy to break, while the materials of other target thin films may be more ductile and not easy to break.
[0051] In order to expand the application range of the method for preparing the attached thin film, the method for preparing the attached thin film can be used not only for the preparation of converting a single-layer target thin film into an attached thin film, but also for the preparation of converting a multi-layer target thin film with a film substrate, etc. into an attached thin film.
[0052] The functional film layer here refers to a film layer with specific functions. For example, the functional film layer can be a film layer with wave-transmitting function, or a film layer with light-reflecting function, etc., and the functional film layer can be selected according to the actual situation.
[0053] For a target thin film with excellent mechanical properties that can function with a single layer (e.g., an optical thin film), it is not necessary to fabricate it on a thin film substrate, and the target thin film can be directly attached to the intermediate dielectric thin film.
[0054] In one embodiment, attaching the target thin film to the intermediate dielectric thin film includes attaching one side of the functional film layer of the target thin film to the intermediate dielectric thin film.
[0055] Among them, when attaching the attached thin film to the surface of the target device, the thin film substrate can be attached to the surface of the target device.
[0056] In the above implementation process, for a functional film layer with relatively brittle material itself, forming the target thin film by preparing the functional film layer on the surface of the thin film substrate can improve the toughness of the target thin film, avoid the target thin film from breaking during preparation or attachment, and extend the service life of the target thin film.
[0057] In one possible implementation, the target polygon is a regular hexagon.
[0058] Among them, the regular hexagon is obtained based on an etching process.
[0059] The etching process here can be realized by etching methods such as laser etching and chemical mechanical polishing.
[0060] Exemplarily, if the target thin film is a low-emissivity infrared photonic crystal thin film, the low-emissivity infrared photonic crystal thin film can be cut into regular hexagons of a certain size through a laser etching process.
[0061] It should be understood that since the ratio of the area to the side length of a regular hexagon is relatively high, the wire length of the regular hexagon grid is relatively short under the same area, and it is easier to attach on a curved surface. Therefore, the regular hexagon thin film has less warping and deformation compared to other shapes (such as triangles and quadrilaterals). In addition, cutting the target thin film into regular hexagons can make more effective use of the target thin film. Compared with other shapes, regular hexagons can fit more closely together during arrangement, reducing material waste.
[0062] In the above implementation process, the regular hexagons are closely arranged, which can effectively cover the spherical surface and reduce voids. By cutting the target thin film into regular hexagons, the compactness of the target thin film attached to the surface of the target device can be improved, and at the same time, the generation of wrinkles during the overall attachment of the target thin film can be reduced.
[0063] In one possible implementation, among them, the target thin film is configured as a layered thin film composed of multiple materials.
[0064] Among them, the thickness of the target thin film is less than or equal to 5 μm.
[0065] In one embodiment, the target film may be a low-emissivity infrared photonic crystal film. The low-emissivity infrared photonic crystal film is a layered composite material composed of at least two or more materials, and is grown on a polymer film through a film growth process.
[0066] Exemplarily, the low-emissivity infrared photonic crystal film is a multi-layer spacer film layer made of materials such as Ge and ZnS, and the total thickness is less than or equal to 5 μm.
[0067] The low-emissivity infrared photonic crystal film here has a low emissivity in the far infrared.
[0068] The thickness of the above-mentioned polymer film is less than or equal to 125 μm, and the material of the polymer film can be polyimide, polyethylene, polyester, etc. The material of the polymer film can be selected according to the actual situation.
[0069] In a possible implementation, after the target film attached to the intermediate dielectric film is divided into multiple target polygons, the attached film is kept in a stretched state, and metal powder is filled in each gap between the multiple target polygons.
[0070] It can be understood that since the target film is attached to the intermediate dielectric film and the target film is divided into multiple target polygons, when the attached film is in a stretched state, there will be certain gaps between the respective target polygons of the target film in the attached film. If the attached film is directly stretched and attached to the surface of the target device, there may be gaps in the target film attached to the surface of the target device, which may affect the optical, electrical or electromagnetic properties of the surface of the target device. In addition, since gaps will be generated between the target polygons, the adhesive coated on the surface of the target device may bond to the intermediate dielectric film through the gaps, thereby increasing the difficulty of removing the intermediate dielectric film.
[0071] If metal powder is filled in each gap between the multiple target polygons when the attached film is in a stretched state, the metal powder can fill each gap, improve the optical, electrical or electromagnetic properties at the gaps, and can improve the overall optical, electrical or electromagnetic characteristics of the surface. In addition, since metal powder is filled in each gap between the multiple target polygons, the metal powder can be used to isolate the adhesive coated on the surface of the target device and the intermediate dielectric film, thereby reducing the difficulty of removing the intermediate dielectric film.
[0072] In the above implementation process, by filling metal powder in each gap between the multiple target polygons, the overall optical, electrical or electromagnetic characteristics of the surface can be improved. In addition, the metal powder can be used to isolate the adhesive coated on the surface of the target device and the intermediate dielectric film, prevent the intermediate dielectric film from bonding to the surface of the target device, and reduce the difficulty of removing the intermediate dielectric film.
[0073] Please refer toFigure 2 , is a flowchart of the film laminating method provided by the embodiments of the present application. The following will Figure 2 elaborate in detail on the specific process shown below.
[0074] Step S301: Laminating the target film on the intermediate medium film.
[0075] Among them, the target film refers to the film that needs to be laminated on the surface of the target device. The target film can be an infrared photonic crystal film, an optical film, an infrared antireflection film, an infrared reflection film, etc., and the target film can be selected according to the actual application scenario.
[0076] The target device can be a wafer, a chip, a display screen, an optical lens, a mechanical device, etc., and the surface of the target device that needs to be laminated with the target film can be a curved surface, a flat surface or an irregular surface, etc.
[0077] The intermediate medium film here has stretchability and self - adhesiveness. The intermediate medium film serves as an intermediate medium for laminating the target film on the surface of the target device, and the intermediate medium film can be removed after the target film is laminated on the surface of the target device. The intermediate medium film can be a silica gel film, a rubber film, a thermoplastic polyurethane film, etc., and the intermediate medium film can be selected according to the actual situation.
[0078] In one embodiment, the thickness of the intermediate medium film is between 0.1 and 1 mm.
[0079] Step S302: Dividing the target film laminated on the intermediate medium film into multiple target polygons, and the multiple target polygons remain on the intermediate medium film.
[0080] The target polygons here can be regular polygons. For example, regular hexagons, equilateral triangles, regular pentagons, etc., and the target polygons can be selected according to the actual situation.
[0081] Among them, the intermediate medium film and the target film form a laminated film, and the laminated film is configured to be laminated on the surface of the target device. One side of the target film in the laminated film is laminated on the surface of the target device.
[0082] Since the target film is divided into multiple target polygons, that is, multiple target polygons are laminated on the surface of the target device.
[0083] Step S303: Applying an adhesive on the surface of the target device.
[0084] Among them, the adhesive can be applied on the surface of the target device by scraping, spraying or other means.
[0085] Optionally, the adhesive can be a one - component or two - component room - temperature curing type, and the adhesive can also be a pressure - sensitive adhesive. The material of the adhesive can be selected according to the actual situation.
[0086] The adhesive here is used to connect the surface of the target device and the target film.
[0087] In one embodiment, the thickness of the adhesive is less than or equal to 0.2 mm.
[0088] Step S304, stretch the covering film.
[0089] Since the covering film includes an intermediate dielectric film and the intermediate dielectric film is stretchable, the covering film is stretched by stretching the intermediate dielectric film.
[0090] During the process of stretching the intermediate dielectric film, gaps are generated between the respective target polygons.
[0091] It can be understood that if a conventional target film needs to be covered on the surface of a large-sized and / or complex target device, due to the complex shape of the surface of the target device, the target film covered on its surface may have wrinkles, that is, two or more layers of target films overlap at the same position of the target device, thereby affecting the performance of the target film in terms of optics, electricity, magnetism, etc.
[0092] By covering the target film on the intermediate dielectric film and then covering the target film on the surface of the target device, when stretching the intermediate dielectric film, the target polygons of the target film can be pulled apart from each other by a certain distance, and the stretched target film is covered on the surface of the target device, and no overlap occurs between the multiple target polygons, which can reduce the wrinkles of the target film covered on the surface of the target device.
[0093] In order to further reduce the wrinkles of the target film on the surface of the target device, by controlling the areas of the multiple target polygons formed by cutting the target film covered on the intermediate dielectric film, before covering the covering film on the surface of the target device, the intermediate dielectric film in the covering film can be stretched first. During the process of stretching the intermediate dielectric film, gaps are generated between the respective target polygons, so that the multiple target polygons corresponding to the position with the maximum curvature of the surface of the target device can also be completely fitted on the surface of the target device because the area of the target polygons is small enough or the gaps are large enough, avoiding warping of the target film on the surface of the target device. It can be seen that since the curvature of the surface of the target device is not the same, target polygons with different areas can be set at different positions, and the areas of the target polygons at different positions of the target film can be selected according to the actual situation.
[0094] Step S305, attach the target film side of the covering film to the surface of the target device.
[0095] In one embodiment, after step S305, the method further includes: compacting the target film.
[0096] It should be understood that after the target film side of the laminated film is attached to the surface of the target device, in order to ensure the bonding strength between the target film and the surface of the target device, the target film can be compacted.
[0097] Step S306, remove the intermediate medium film.
[0098] It can be understood that since the target film is a film for realizing the target function, and the intermediate medium film is an intermediate medium to ensure that the target film is pasted without wrinkles. In order to avoid the intermediate medium film affecting the function of the target film, after the laminated film is attached to the surface of the target device, the intermediate medium film attached to the target film is removed to smoothly attach the target film to the surface of the target device.
[0099] In the above implementation process, by attaching the target film to the intermediate medium film to form a laminated film, the stretchability of the intermediate medium film can be utilized to attach the stretched laminated film to the surface of the target device. Since the laminated film attached to the surface of the target device is in a stretched state, the possibility of the laminated film overlapping multiple layers at the same position on the surface of the target device is relatively low, so the wrinkles generated by the attachment of the target film are reduced. In addition, by cutting the target film in the laminated film into multiple target polygons, gaps can be generated between the respective target polygons when stretching the laminated film. When attaching the laminated film to the surface of a relatively complex target device, due to the gaps between the respective target polygons, a certain contraction space can be provided for the laminated film, and the area of the target polygon is small, which can be fully attached according to the shape of the surface of the target device, further reducing the generation of attachment wrinkles and improving the flatness and compactness of the attachment of the target film.
[0100] In a possible implementation manner, the viscosity between the intermediate medium film and the target film is less than the viscosity between the target film and the surface of the target device.
[0101] The target film here can be attached to the intermediate medium film by means of electrostatic attachment, adhesive bonding, etc.
[0102] It should be understood that when removing the intermediate medium film, since the viscosity between the intermediate medium film and the target film is less than the viscosity between the target film and the surface of the target device, the viscosity between the target film and the surface of the target device is stronger, and the target film will not be taken away by the intermediate medium, improving the attachment stability of the target film.
[0103] In the above implementation process, by setting the viscosity between the intermediate medium film and the target film to be less than the viscosity between the target film and the surface of the target device, when removing the intermediate medium film, since the viscosity between the target film and the surface of the target device is stronger, the target film will not be taken away by the intermediate medium, thereby improving the attachment stability of the target film and reducing the difficulty of removing the intermediate medium.
[0104] In a possible implementation, after dividing the target film attached to the intermediate medium film into multiple target polygons, the intermediate medium film is kept in a stretched state, and metal powder is filled in each gap between the multiple target polygons.
[0105] It can be understood that since the target film is attached to the intermediate medium film and the target film is divided into multiple target polygons, when the attached film is in a stretched state, certain gaps will be generated between the respective target polygons of the target film in the attached film. If the attached film is directly stretched and then attached to the surface of the target device, there may be gaps in the target film attached to the surface of the target device, thereby affecting the optical, electrical, and electromagnetic characteristics of the target film on the surface of the target device. In addition, since gaps will be generated between the target polygons, the adhesive coated on the surface of the target device may bond to the intermediate medium film through the gaps, thereby increasing the difficulty of removing the intermediate medium film.
[0106] If metal powder is filled in each gap between the multiple target polygons when the attached film is in a stretched state, the metal powder can fill each gap, improve the optical, electrical, or electromagnetic performance at the gaps, and can improve the overall optical, electrical, or electromagnetic characteristics of the surface. In addition, since metal powder is filled in each gap between the multiple target polygons, the metal powder can be used to isolate the adhesive coated on the surface of the target device and the intermediate medium film, thereby reducing the difficulty of removing the intermediate medium film.
[0107] In the above implementation process, by filling metal powder in each gap between the multiple target polygons, the overall optical, electrical, or electromagnetic characteristics of the surface can be improved. In addition, the metal powder can be used to isolate the adhesive coated on the surface of the target device and the intermediate medium film, prevent the intermediate medium film from bonding to the surface of the target device, and reduce the difficulty of removing the intermediate medium film.
[0108] In a possible implementation, the degree of stretching the attached film is determined by the maximum curvature of the surface of the target device.
[0109] Among them, the degree of stretching the attached film may include one or more of the following: the force of stretching the attached film, the direction of stretching the attached film, the length of stretching the attached film, etc.
[0110] It can be understood that when the target device is not a flat surface but a curved surface or other irregular surface, these curved surfaces or irregular surfaces usually have a certain curvature. When attaching the target film to surfaces with different curvatures, the fitting conditions of the attached film may be different.
[0111] At the location of the maximum curvature on the surface of the target device, the conforming film in a stretched state will experience the maximum degree of shrinkage at the maximum curvature. Therefore, the area of the maximum curvature is usually the region where the conforming film has the worst adhesion or the region with the most wrinkles. By setting the degree of stretching the conforming film to be determined by the maximum curvature of the surface of the target device, a flat and dense conforming film can be adhered to the surface of the target device. The conforming film in a stretched state will not form wrinkles or warping at the maximum curvature, so there will be no wrinkles or warping at other positions on the surface of the target device either.
[0112] Optionally, the corresponding relationship between the degree of stretching the conforming film and the maximum curvature can be set, and the corresponding degree of stretching the conforming film can be matched through the maximum curvature; alternatively, the corresponding relationship between the degree of stretching the conforming film and the maximum curvature can be set with a calculation formula, and the corresponding degree of stretching the conforming film can be calculated through the maximum curvature and this set calculation formula; or a corresponding neural network model can be set, and by inputting the maximum curvature into this neural network model, the corresponding degree of stretching the conforming film can be determined, etc. The determination method of the degree of stretching the conforming film can be selected according to the actual situation.
[0113] For the convenience of understanding, the following takes the surface of an ellipsoid with a major diameter of 110 mm and a minor diameter of 80 mm as an example of the surface of the target device to show the specific implementation process of the conforming film adhering method proposed in the embodiments of the present application:
[0114] Apply a layer of pressure adhesive (such as, pressure-sensitive adhesive) on the surface 800 of the ellipsoid and wait for the solvent to completely volatilize for later use. Stretch the conforming film including the intermediate medium film and the target film 900 cut into multiple target polygons so that the conforming film does not form wrinkles. Then, cover the stretched conforming film on the surface 800 of the ellipsoid. After the target film 900 is closely adhered to the surface 800 of the ellipsoid, tear off the intermediate medium film. Since the adhesiveness of the adhesive to the target film is greater than the adsorption force of the intermediate medium film to the target film 900, the target film 900 including multiple target polygons will remain on the surface 800 of the ellipsoid. In addition, due to the pulling of the intermediate medium film during the adhering process, there will be a certain gap between the target polygons, and the physical effect is as Figure 3 shown. Therefore, the target film 900 adhered to the surface 800 of the ellipsoid is relatively flat, and there are no or only very few wrinkles on the surface 800 of the ellipsoid.
[0115] The infrared test results of the surface of the ellipsoid after adhering the conforming film in the above manner are as follows: Under the same environment, in the far-infrared band range of 8 - 14 μm, the highest temperature of the surface of the non-adhered ellipsoid is 46 °C, the highest temperature of the surface of the ordinary adhered film (with wrinkles) is 31 °C at the wrinkled area, and the highest temperature of the surface after adhering using the method described in the embodiments of the present application is 24.7 °C.
[0116] Through the above tests, it can be further verified that the film pasting method proposed in the embodiments of the present application can effectively avoid damaging the performance of the infrared device of the target device during the pasting process.
[0117] In the above implementation process, since the area with the largest curvature of the target device is usually the area where the most wrinkles occur, by setting the degree of stretching the pasting film to be determined by the largest curvature of the target device, it can be ensured that fewer wrinkles are generated in each area of the surface of the target device, and then a flat and dense pasting film is pasted on the surface of the target device, improving the flatness of the film pasting.
[0118] To facilitate the understanding of this embodiment, a film pasting system disclosed in the embodiments of the present application will be introduced in detail below. The film pasting system includes: a first pasting device, a first cutting device, a processing device, a stretching device, a second pasting device, and a removing device.
[0119] Among them, the first pasting device is used to paste the target film on the intermediate medium film; the second pasting device is used to attach the target film side of the pasting film to the surface of the target device. The first pasting device and the second pasting device can be devices such as robots and robotic arms. The first pasting device and the second pasting device can be the same device or two independent devices. The first pasting device and the second pasting device can be selected according to actual needs.
[0120] In one embodiment, the intermediate medium film has stretchability and self-adhesion.
[0121] The processing device here is used to apply an adhesive on the surface of the target device. The processing device can be a rubber coating machine, a glue coating machine, etc., or a robotic arm, a robot, etc., and the processing device can be selected according to actual needs.
[0122] The above-mentioned first cutting device is used to cut the target film pasted on the intermediate medium film into multiple target polygons, and the multiple target polygons remain on the intermediate medium film. The first cutting device can be a laser cutting device, a film slitter, etc., and the first cutting device can be selected according to actual needs.
[0123] Among them, the intermediate medium film and the target film form a pasting film, and the pasting film is configured to be pasted on the surface of the target device.
[0124] The stretching device here is used to stretch the pasting film. The stretching device can be a mechanical hand, a clamping jaw, etc. The removing device is used to remove the intermediate medium film. The removing device can be a mechanical hand, a clamping jaw, etc.
[0125] Optionally, the stretching device and the removing device can be the same device or two independent devices. The stretching device and the removing device can be selected according to actual requirements.
[0126] In one embodiment, the first coating device, the first cutting device, the processing device, the stretching device, the second coating device and the removing device in the film coating system are all connected to the electronic device. The electronic device is configured to generate control instructions according to a set program and transmit the control instructions to each device in the film coating system, so that each device in the film coating system performs corresponding actions.
[0127] Optionally, the film coating system can be used to execute the film coating method proposed in the embodiment of the present application, or can be used to execute the film preparation method proposed in the embodiment of the present application, or can be used to execute both the film coating method and the film preparation method proposed in the embodiment of the present application. The usage scenario of the film coating system can be adjusted according to the actual situation.
[0128] In one embodiment, the film coating method and the film preparation method in the embodiment of the present application can also be implemented manually.
[0129] In addition, the embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is run by a processor, it executes the steps of the film preparation and / or film coating method described in the above method embodiment.
[0130] The computer program product of the film preparation and / or film coating method provided by the embodiment of the present application includes a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the steps of the film preparation and / or film coating method described in the above method embodiment. For details, please refer to the above method embodiment and will not be elaborated here.
[0131] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.
[0132] In addition, the functional modules in each embodiment of the present application may be integrated together to form an independent part, or each module may exist alone, or two or more modules may be integrated to form an independent part.
[0133] If the above-mentioned functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks, or optical discs that can store program codes. It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device comprising the said elements.
[0134] The foregoing are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application. It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0135] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or replacements, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims
1. A method for preparing a coating film, characterized in that: include: The target film is pasted on the intermediate medium film; wherein the intermediate medium film is stretchable and self-adhesive; dividing the target film attached to the intermediate dielectric film into a plurality of target polygons, wherein the plurality of target polygons are maintained on the intermediate dielectric film; The intermediate medium film and the target film form a covering film, and the covering film is configured to be covered on the surface of the target device.
2. The method according to claim 1, characterized in that Before attaching the target film to the intermediate medium film, the method further comprises: Prepare a functional film layer on the surface of the film substrate to form the target film; The step of attaching the target film to the intermediate medium film comprises: One side of the functional film layer of the target film is attached to the intermediate dielectric film.
3. The method according to claim 1, characterized in that The target polygon is a regular hexagon; the regular hexagon is obtained based on an etching process.
4. The method according to any one of claims 1 to 3, characterized in that: in, The target film is configured as a layered film composed of multiple materials; Wherein, the thickness of the target film is less than or equal to 5 μm.
5. The method according to any one of claims 1 to 3, characterized in that: After the target film attached to the intermediate dielectric film is divided into a plurality of target polygons, the attached film is kept in a stretched state, and metal powder is filled in each gap between the plurality of target polygons.
6. A method for laminating a laminating film, characterized in that: include: The target film is pasted on the intermediate medium film; wherein the intermediate medium film is stretchable and self-adhesive; Dividing a target film attached to the intermediate dielectric film into a plurality of target polygons, wherein the plurality of target polygons are maintained on the intermediate dielectric film; wherein the intermediate dielectric film and the target film form an attached film, and the attached film is configured to be attached to a surface of a target device; applying an adhesive to the surface of the target device; stretching the coating film; Laminating the target film side of the laminating film to the surface of the target device; The intermediate dielectric film is removed.
7. The method according to claim 6, characterized in that in, The adhesion between the intermediate medium film and the target film is smaller than the adhesion between the target film and the surface of the target device.
8. The method according to claim 6, characterized in that After the target film attached to the intermediate dielectric film is divided into a plurality of target polygons, the attached film is kept in a stretched state, and metal powder is filled in each gap between the plurality of target polygons.
9. The method according to claim 6, characterized in that The extent of stretching the coating film is determined by the maximum curvature of the surface of the target device.
10. A film coating system, characterized in that: include: A first laminating device is used to laminate the target film onto the intermediate dielectric film; wherein the intermediate dielectric film is stretchable and self-adhesive; A first segmentation device is used to segment the target film attached to the intermediate dielectric film into a plurality of target polygons, and the plurality of target polygons are maintained on the intermediate dielectric film; wherein the intermediate dielectric film and the target film form an attached film, and the attached film is configured to be attached to a surface of a target device; processing equipment for applying an adhesive to the surface of the target device; A stretching device, used for stretching the coating film; A second laminating device, used to laminate the target film side of the laminating film onto the surface of the target device; A removal device is used to remove the intermediate dielectric film.