Wafer bonding equipment, wafer bonding methods and storage media

Abstract

This invention provides a wafer bonding apparatus, a wafer bonding method, and a computer-readable storage medium. The wafer bonding apparatus includes a pre-processing module and a bonding module. The pre-processing module performs pre-processing on a first sample and / or a second sample to be bonded. The bonding module is connected to the output of the pre-processing module via a transfer port to perform wafer bonding on the first sample and the second sample output from the pre-processing module. The transfer port is equipped with a baffle. The baffle opens the transfer port when the first sample and the second sample are obtained from the pre-processing module and closes the transfer port when the first sample and the second sample are bonded. By using a baffle to close the transfer port, this invention can effectively reduce the impact of airflow disturbances, ensuring the micro-nano level stability of the equipment and bonding accuracy, thereby improving the wafer bonding quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device fabrication, and more particularly to a wafer bonding apparatus, a wafer bonding method, and a computer-readable storage medium. Background Technology

[0002] Chip stacking technology is a crucial trend in the future development of the semiconductor industry, with wafer bonding being a key process for achieving this. However, as the density of connection points on the wafer bonding surface increases and the spacing decreases, the requirements for wafer bonding precision become increasingly stringent. Existing wafer bonding equipment lacks stability and bonding precision at the nanometer level, which in turn affects the alignment accuracy of the upper and lower wafers during bonding and the final bonding precision, thus impacting the overall wafer bonding quality.

[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved wafer bonding technology to reduce the impact of airflow disturbance, so as to ensure the stability and bonding accuracy of the equipment at the micro-nano level, thereby improving the bonding quality of the wafer. Summary of the Invention

[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0005] To overcome the aforementioned deficiencies in the prior art, the present invention provides a wafer bonding apparatus, a wafer bonding method, and a computer-readable storage medium. By setting up a vibration damping module, the impact of airflow disturbance is reduced to ensure the stability of the apparatus at the micro-nano level and the bonding accuracy, thereby improving the bonding quality of the wafer.

[0006] Specifically, the wafer bonding apparatus provided according to the first aspect of the present invention includes a pre-processing module and a bonding module. The pre-processing module is used to pre-process a first sample and / or a second sample to be bonded. The bonding module is connected to the output terminal of the pre-processing module via a wafer transfer port to perform wafer bonding on the first sample and the second sample output therefrom. The wafer transfer port is provided with a baffle. The baffle opens the wafer transfer port when the first sample and the second sample are obtained from the pre-processing module, and closes the wafer transfer port when the first sample and the second sample are bonded.

[0007] Furthermore, in some embodiments of the present invention, the bonding module includes the baffle and a baffle driving mechanism. The baffle driving mechanism includes a slide rail and a cylinder. The slide rail is disposed on one side of the transfer port and extends along the edge of the side of the transfer port. The cylinder is disposed on the other side of the transfer port. A first side of the baffle is connected to the slide rail, and a second side is connected to the moving end of the cylinder, and moves along the slide rail under the drive of the moving end to open or close the transfer port.

[0008] Furthermore, in some embodiments of the present invention, the bonding module includes a filtering unit. The filtering unit is connected to an independent working gas source to provide clean working gas to the bonding module during the bonding of the first sample and the second sample.

[0009] Furthermore, in some embodiments of the present invention, the bonding module includes a machine body, a vibration damping module, and a machine base for bonding the first sample and the second sample. The machine body is mounted on the machine base via the vibration damping module to reduce the impact of ground vibration and / or the movement of auxiliary units mounted on the machine base on the machine body.

[0010] Furthermore, in some embodiments of the present invention, the bonding module further includes a pneumatic control cabinet and / or an electrical control cabinet. At least one hook is provided on the edge of the machine body. The pneumatic control cabinet and / or the electrical control cabinet are disposed on the side of the machine body via the at least one hook and remain separate from the machine body.

[0011] Further, in some embodiments of the present invention, the bonding module includes a first camera, a second camera, a first moving platform, a second moving platform, and a controller. The first camera is used to capture a first image of the first sample. The second camera is used to capture a second image of the second sample. The first moving platform is disposed between the first camera and the second camera, used to carry the first sample and move the first sample between preset bonding positions and transfer positions. The second moving platform is disposed between the first camera and the second camera, used to carry the second sample and move the second sample between the bonding position and the transfer position. The controller is configured to: move the first moving platform carrying the first sample to the bonding position and move the second moving platform to the transfer position so that the first camera can acquire the first image; move the first moving platform to the transfer position and move the second moving platform carrying the second sample to the bonding position so that the second camera can acquire the second image; determine the positional deviation between the first sample and the second sample based on the first image and the second image; and adjust the position of the first moving platform and / or the second moving platform according to the positional deviation to align the first sample and the second sample.

[0012] Furthermore, in some embodiments of the present invention, the bonding module further includes a coaxial calibration plate and a C-frame. The coaxial calibration plate is located between the first camera and the second camera during the camera calibration stage before aligning and bonding the first and second samples. The C-frame includes a first mounting end, a second mounting end, and a camera position adjustment mechanism. The first camera is mounted on the first mounting end. The second camera is mounted on the second mounting end. The camera position adjustment mechanism connects the first mounting end and / or the second mounting end, and is used to adjust the position of the first camera and / or the second camera according to the coaxial calibration plate image acquired by the first camera and the second camera, so as to eliminate coaxial errors between the first camera and the second camera.

[0013] Furthermore, in some embodiments of the present invention, the bonding module further includes a multicolor light source and a light source adjustment component. The multicolor light source is used to provide illumination beams of multiple wavelengths. The light source adjustment component is used to adjust the illumination position and / or wavelength of the illumination beams according to the coating composition of the bonding surfaces of the first sample and / or the second sample, so as to improve the imaging quality of the first image and / or the second image.

[0014] Furthermore, in some embodiments of the present invention, a first chuck is provided on the upper first moving platform, and a second chuck is provided on the lower second moving platform. The second moving platform further includes a lower fixing plate, an upper fixing plate, a vacuum pump, and a positive pressure gas source. The lower part of the lower fixing plate is fixedly connected to the body of the second moving platform, while its upper surface maintains an inflation gap with the back of the second chuck. The upper fixing plate is used to cooperate with the lower fixing plate to fix the edge of the second chuck. The vacuum pump is connected to the second chuck and is used to provide a vacuum negative pressure to the second sample carried by the second chuck to adsorb and fix the second sample. The positive pressure gas source is used to fill the inflation gap with gas so that the second chuck causes the central area of ​​the second sample carried by it to deform upward.

[0015] Furthermore, in some embodiments of the present invention, the second chuck is designed to be arc-shaped so that when the positive pressure gas source fills the gas filling gap with gas, it causes the central region of the second sample to undergo uniform upward deformation.

[0016] Furthermore, in some embodiments of the present invention, the first mobile platform further includes a wafer pressing mechanism. The wafer pressing mechanism is used to provide a downward uniform pressure to the back side of the first sample carried by the first mobile platform to bond the lower surface of the first sample to the upper surface of the second sample.

[0017] Furthermore, in some embodiments of the present invention, the first moving platform further includes a longitudinal moving component. The controller is also configured to: after aligning the first sample and the second sample, adjust the distance between the first sample and the second sample to a preset distance via the longitudinal moving component of the first moving platform; inject gas into the inflation gap via the positive pressure gas source to cause the central region of the second sample carried by the second chuck to deform upward; press down the first sample via the wafer pressing mechanism to bond the first surface on the lower side of the first sample downward to the second surface on the upper side of the second sample; and release vacuum in the first chuck and / or the second chuck via the vacuum pump to complete the bonding of the first sample and the second sample.

[0018] Furthermore, in some embodiments of the present invention, the first moving platform further includes a micro-motion platform. The micro-motion platform is used to adjust the lateral position of the first moving platform and / or the second moving platform according to the lateral position deviation after both the first moving platform and the second moving platform have moved to the bonding site, so as to align the first sample and the second sample.

[0019] Furthermore, in some embodiments of the present invention, at least one of the first sample and the second sample is a wafer.

[0020] Furthermore, the wafer bonding method provided by the second aspect of the present invention includes the following steps: performing pre-processing on a first sample and / or a second sample to be bonded via a pre-processing module of a wafer bonding apparatus; in response to completing the pre-processing, controlling a baffle to open the transfer port of the bonding module at the rear end and the pre-processing module to transfer the first sample and the second sample into the bonding module; and controlling the baffle to close the transfer port, and then bonding the first sample and the second sample via the bonding module.

[0021] Furthermore, the computer-readable storage medium provided according to the third aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a processor, the wafer bonding method as provided in the third aspect of the present invention is implemented. Attached Figure Description

[0022] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0023] Figure 1 A schematic diagram of the structure of a wafer bonding apparatus provided according to some embodiments of the present invention is shown.

[0024] Figure 2 A schematic diagram of the structure of a baffle driving device provided according to some embodiments of the present invention is shown.

[0025] Figure 3 A schematic diagram of the structure of a bonding module provided according to some embodiments of the present invention is shown.

[0026] Figure 4 A cross-sectional schematic diagram of a bonding module provided according to some embodiments of the present invention is shown.

[0027] Figure 5 A schematic diagram of the structure of a C-frame provided according to some embodiments of the present invention is shown.

[0028] Figure 6 A schematic diagram of the structure of a light source adjustment assembly provided according to some embodiments of the present invention is shown.

[0029] Figure 7 A schematic diagram of the structure of a second chuck provided according to some embodiments of the present invention is shown.

[0030] Figure 8 A schematic flowchart of a wafer bonding method provided according to some embodiments of the present invention is shown.

[0031] Figure 9 A schematic diagram of a wafer bonding process provided according to some embodiments of the present invention is shown.

[0032] Figure label:

[0033] 11. Front-end module

[0034] 12 Bonding Modules

[0035] 121 baffle

[0036] 1221 Slide Rail

[0037] 1222 cylinder

[0038] 13 Transmission Port

[0039] 31 Machine Body

[0040] 32 Vibration damping modules

[0041] 33 Machine base

[0042] 34 Pneumatic control cabinet

[0043] 35 Electrical control cabinet

[0044] 36 First Mobile Platform

[0045] 361 First cassette

[0046] 37 Second Mobile Platform

[0047] 371 Second chuck

[0048] 38 Wafer Pressing Mechanism

[0049] 39. Vertical movement component

[0050] 51 First Camera

[0051] 52 Second Camera

[0052] 53 Coaxial Calibration Plate

[0053] 54 C-frame

[0054] 541 First Installation End

[0055] 542 Second Installation End

[0056] 543 Camera position adjustment mechanism

[0057] 55 Light source adjustment components

[0058] 71 Lower fixing plate

[0059] 72 Upper fixing plate Detailed Implementation

[0060] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0061] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0062] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0063] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0064] As mentioned above, with the increase in the density of connection points and the reduction in the spacing on the wafer bonding surface, the requirements for wafer bonding accuracy are becoming increasingly stringent. Existing wafer bonding equipment does not have high stability and bonding accuracy at the nanometer level, which in turn affects the alignment accuracy of the upper and lower wafers during the bonding process and the bonding accuracy after bonding, thus affecting the wafer bonding quality.

[0065] To overcome the aforementioned deficiencies in the prior art, this invention provides an improved wafer bonding apparatus, a wafer bonding method, and a computer-readable storage medium. By setting a baffle to close the wafer transfer port, the impact of airflow disturbance and mechanical vibration is reduced, thereby ensuring the micro-nano level stability and bonding accuracy of the equipment and improving the bonding quality of the wafer.

[0066] In some non-limiting embodiments, the wafer bonding method provided in the second aspect of the present invention can be implemented based on the wafer bonding apparatus provided in the first aspect of the present invention. Specifically, the wafer bonding apparatus may be configured with a memory and a controller. The memory includes, but is not limited to, the computer-readable storage medium provided in the third aspect of the present invention, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the wafer bonding method provided in the second aspect of the present invention.

[0067] Please refer to the details. Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a wafer bonding apparatus provided according to some embodiments of the present invention is shown. Figure 2 A schematic diagram of the structure of a baffle driving device provided according to some embodiments of the present invention is shown.

[0068] exist Figure 1 and Figure 2 In the illustrated embodiment, the wafer bonding apparatus provided by the first aspect of the present invention includes a pre-processing module 11 and a bonding module 12. The pre-processing module 11 performs pre-processing (e.g., dust removal and filtration, bonding surface pretreatment, heating, vacuuming, etc.) on the first and / or second samples to be bonded. The bonding module 12 is connected to the output terminal of the pre-processing module 11 via a transfer port 13 to perform wafer bonding on the output first and second samples. Here, at least one of the first and second samples is a wafer.

[0069] Furthermore, the bonding module 12 includes a baffle 121 and a baffle driving mechanism. The baffle 121 is located at the transfer port 13 and is used to open the transfer port 13 when acquiring the first and second samples from the pre-mount module 11, and to close the transfer port 13 when bonding the first and second samples. The baffle driving mechanism includes a slide rail 1221 and a cylinder 1222. The slide rail 1221 is located on one side of the transfer port 13 and extends along the edge of one side of the transfer port 13. The cylinder 1222 is located on the other side of the transfer port 13. The first side of the baffle 121 is connected to the slide rail 1221, and its second side is connected to the moving end of the cylinder 1222. Driven by the moving end, the baffle 121 moves along the slide rail 1221 to open or close the transfer port 13. Thus, the baffle 121 can separate the bonding module 12 from the pre-mount module 11, ensuring the independence of the bonding module 12 and preventing airflow disturbances from affecting bonding accuracy.

[0070] In addition, the bonding module 12 also includes a filtration unit. This filtration unit is connected to an independent working gas source and is used to filter and control particulate matter in the airflow to provide clean working gas to the bonding module 12 during the bonding of the first and second samples.

[0071] Please refer to the reference. Figures 3-7 , Figure 3 A schematic diagram of the overall structure of a bonding module according to some embodiments of the present invention is shown. Figure 4 A schematic cross-sectional view of a bonding module according to some embodiments of the present invention is shown. Figure 5 A schematic diagram of the C-shaped frame provided according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of the structure of a light source adjustment assembly provided according to some embodiments of the present invention is shown. Figure 7 A schematic diagram of the structure of a second mobile platform provided according to some embodiments of the present invention is shown.

[0072] like Figure 3 and Figure 4 As shown, the bonding module 12 includes a machine body 31 for bonding the first sample and the second sample, a vibration damping module 32, and a machine base 33. Here, the machine body 31 is mounted on the machine base 33 via the vibration damping module 32 to reduce the impact of ground vibration and / or the movement of auxiliary units mounted on the machine base 33 on the machine body 31.

[0073] In addition, the bonding module 12 also includes a pneumatic control cabinet 34 and / or an electrical control cabinet 35. Here, at least one hook is provided on the edge of the machine body 31, and the pneumatic control cabinet 34 and / or electrical control cabinet 35 are located on the side of the machine body 31 via at least one hook and are kept separate from the machine body 31 to reduce the impact of vibrations generated by the pneumatic and electrical control components during operation on the machine body 31.

[0074] Furthermore, such as Figures 3-5 As shown, the bonding module 12 includes a first camera 51, a second camera 52, a first moving platform 36, and a second moving platform 37. The first camera 51 is used to capture a first image of a first sample. The second camera is used to capture a second image of a second sample. The first moving platform 36 is located between the first camera 51 and the second camera 52, and is used to carry the first sample and move it between a preset bonding position 56 and a transfer position 57. The second moving platform 37 is located between the first camera 51 and the second camera 52, and is used to carry the second sample and move it between the bonding position 56 and the transfer position 57. Here, a first chuck 361 is provided on the upper first moving platform 36, and a second chuck 371 is provided on the lower second moving platform 37.

[0075] In addition, the bonding module 12 also includes a coaxial calibration plate 53 and a C-frame 54. The coaxial calibration plate 53 is located between the first camera 51 and the second camera 52 during the camera calibration stage before aligning and bonding the first and second samples. The C-frame 54 includes a first mounting end 541, a second mounting end 542, and a camera position adjustment mechanism 543. Here, the first camera 51 is mounted on the first mounting end 541, the second camera 52 is mounted on the second mounting end 542, and the camera position adjustment mechanism 543 connects the first mounting end 541 and / or the second mounting end 542. It is used to adjust the position of the first camera 51 and / or the second camera 52 according to the images of the coaxial calibration plate 53 acquired by the first camera 51 and the second camera 52, thereby eliminating coaxial errors between the first camera 51 and the second camera 52. In addition, in some embodiments, the camera position adjustment mechanism 543 can also adjust the first camera 51 and / or the second camera 52 along the X direction, Y direction, Rx (rotation about the X axis) direction, and Ry (rotation about the Y axis) direction to eliminate coaxial error between the first camera 51 and the second camera 52.

[0076] In addition, such as Figure 6 As shown, the bonding module 12 also includes, optionally, a multicolor light source and a light source adjustment component 55. The multicolor light source is used to provide illumination beams of multiple wavelengths. The light source adjustment component 55 is used to adjust the illumination position and / or wavelength of the illumination beam according to the coating composition of the bonding surfaces of the first sample and / or the second sample, so as to improve the imaging quality of the first image and / or the second image.

[0077] Furthermore, such as Figure 7As shown, the second chuck 371 includes a lower fixing plate 71, an upper fixing plate 72, a vacuum pump, and a positive pressure gas source. The lower part of the lower fixing plate 71 is fixedly connected to the body of the second moving platform 37, while its upper surface maintains an inflation gap with the back of the second chuck 371. The upper fixing plate 72 is used to cooperate with the lower fixing plate 71 to fix the edge of the second chuck 371. The vacuum pump is connected to the second chuck 371 and is used to provide a vacuum negative pressure to the second sample carried by the second chuck 371 to adsorb and fix the second sample. The positive pressure gas source is used to fill the inflation gap with gas, so that the second chuck 371 causes the central area of ​​the second sample carried by it to deform upward. Here, the second chuck 371 is designed to be arc-shaped to facilitate uniform upward deformation of the central area of ​​the second sample when the positive pressure gas source fills the inflation gap with gas.

[0078] Furthermore, the first moving platform 36 also includes a wafer pressing mechanism 38, which provides downward uniform pressure to the back side of the first sample carried by the first moving platform 36 to bond the lower first surface of the first sample to the upper second surface of the second sample. Thus, during the bonding process, the central region of the first sample undergoes uniform downward deformation, and the central region of the second sample undergoes uniform upward deformation. The lower first surface of the first sample and the upper second surface of the second sample begin bonding in a point-contact manner, and the resulting bonding wave propagates uniformly, reaching the edges of both the first and second samples simultaneously, thereby enhancing the bonding effect and improving the bonding quality.

[0079] In addition, the first moving platform also includes a longitudinal moving component 39 and a micro-motion platform. The micro-motion platform is used to adjust the lateral position of the first moving platform 36 and / or the second moving platform 37 according to the lateral position deviation after both the first moving platform 36 and the second moving platform 37 have moved to the bonding position 56, so as to align the first sample and the second sample. The longitudinal moving component 39 is used to adjust the first moving platform 36 and / or the second moving platform 37 along the Z direction, the Rx (rotation around the X-axis) direction, and the Ry (rotation around the Y-axis) direction.

[0080] The working principle of the wafer bonding equipment described above will be described below with reference to some embodiments of wafer bonding methods. Those skilled in the art will understand that these embodiments of bonding methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concepts of the invention and provide specific solutions convenient for public implementation, rather than limiting all functions or operating methods of the wafer bonding equipment. Similarly, the wafer bonding equipment is also only one non-limiting implementation provided by the present invention, and does not limit the executing entity or execution order of the steps in these wafer bonding methods.

[0081] Please refer to the details. Figure 8 , Figure 8A schematic flowchart of a wafer bonding method provided according to some embodiments of the present invention is shown.

[0082] like Figure 8 As shown, during wafer bonding, the controller of the wafer bonding equipment can first perform pre-processing on the first sample and / or the second sample to be bonded via the pre-processing module 11. Then, in response to the completion of the pre-processing, the controller can control the baffle 121 to open the transfer port between the rear bonding module 12 and the pre-processing module 11, so as to transfer the first sample and the second sample into the bonding module 12. Afterwards, the controller can control the baffle 121 to close the transfer port 13, and then bond the first sample and the second sample via the bonding module 12 to avoid the influence of gas disturbance and mechanical vibration on the bonding process.

[0083] Please continue to refer to this. Figure 3 When aligning the first and second samples, the controller can first move the first moving platform 36 carrying the first sample to the bonding position and move the second moving platform 37 to the transfer position so that the first camera 51 can acquire the first image. Then, the controller can move the first moving platform 36 to the transfer position and move the second moving platform 37 carrying the second sample to the bonding position so that the second camera 52 can acquire the second image. Next, the controller can determine the positional deviation between the first and second samples (including but not limited to positional deviations along the X, Y, Rx (rotation around the X-axis), and Ry (rotation around the Y-axis) directions based on the first and second images. Finally, the controller can adjust the positions of the first moving platform 36 and / or the second moving platform 37 according to the positional deviation to align the first and second samples.

[0084] Please refer to further information. Figure 9 , Figure 9 A schematic diagram of a wafer bonding process provided according to some embodiments of the present invention is shown.

[0085] like Figure 9 As shown, after aligning the first and second samples, the wafer bonding equipment can bond the first and second samples. Specifically, the controller can first adjust the distance between the first and second samples to a preset distance via the longitudinal moving component 39 of the first moving platform 36, and then inject gas into the gas filling gap via a positive pressure gas source, so that the second chuck 371 causes the central area of ​​the second sample it carries to deform upwards uniformly. Then, the controller can press down the first sample via the wafer pressing mechanism 38, so that the central area of ​​the first sample deforms downwards uniformly, thereby bonding the lower first surface of the first sample downwards to the upper second surface of the second sample. Finally, the vacuum is released by the vacuum pump in the first chuck 361 and / or the second chuck 371 to complete the bonding of the first and second samples.

[0086] In summary, the wafer bonding equipment, wafer bonding method, and computer-readable storage medium provided by the present invention can all close the wafer transfer port by setting a baffle, thereby reducing the impact of airflow disturbance and mechanical vibration, ensuring the stability and bonding accuracy of the machine at the micro-nano level, and thus improving the bonding quality of the wafer.

[0087] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0088] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer bonding apparatus, characterized in that, include: The pre-processing module is used to perform pre-processing on the first and / or second samples to be bonded; as well as A bonding module is connected to the output of the front-end module via a wafer transfer port to perform wafer bonding on the first and second samples output by the front-end module. The bonding module includes a baffle and a baffle driving mechanism disposed at the wafer transfer port. The baffle opens the wafer transfer port when the first and second samples are obtained from the front-end module and closes the wafer transfer port when bonding the first and second samples. The baffle driving mechanism includes a slide rail and a cylinder. The slide rail is disposed on one side of the wafer transfer port and extends along the edge of the side of the wafer transfer port. The cylinder is disposed on the other side of the wafer transfer port. A first side of the baffle is connected to the slide rail, and a second side of the baffle is connected to the moving end of the cylinder. The baffle moves along the slide rail under the drive of the moving end to open or close the wafer transfer port.

2. The wafer bonding equipment as described in claim 1, characterized in that, The bonding module includes: A filtration unit, wherein the filtration unit is connected to an independent working gas source to provide clean working gas to the bonding module when bonding the first sample and the second sample.

3. The wafer bonding equipment as described in claim 1, characterized in that, The bonding module includes a machine body, a vibration damping module, and a machine base for bonding the first sample and the second sample. The machine body is mounted on the machine base via the vibration damping module to reduce the impact of ground vibration and / or the movement of auxiliary units mounted on the machine base on the machine body.

4. The wafer bonding equipment as described in claim 3, characterized in that, The bonding module further includes a pneumatic control cabinet and / or an electrical control cabinet, wherein at least one hook is provided on the edge of the machine body, and the pneumatic control cabinet and / or the electrical control cabinet are disposed on the side of the machine body via the at least one hook and remain separate from the machine body.

5. The wafer bonding equipment as described in claim 1, characterized in that, The bonding module includes: A first camera is used to capture a first image of the first sample; A second camera is used to capture a second image of the second sample; A first mobile platform is located between the first camera and the second camera, used to carry the first sample and drive the first sample to move between preset bonding sites and transfer sites. A second mobile platform, located between the first camera and the second camera, is used to carry the second sample and move the second sample between the bonding site and the transfer site; and The controller is configured to: move a first moving platform carrying the first sample to the bonding position and move a second moving platform to the transfer position for the first camera to acquire the first image; move the first moving platform to the transfer position and move a second moving platform carrying the second sample to the bonding position for the second camera to acquire the second image; determine a positional deviation between the first sample and the second sample based on the first image and the second image; and adjust the position of the first moving platform and / or the second moving platform based on the positional deviation to align the first sample and the second sample.

6. The wafer bonding apparatus as described in claim 5, characterized in that, The bonding module also includes: A coaxial calibration plate, located between the first and second cameras during the camera calibration stage prior to alignment and bonding of the first and second samples; and The C-frame includes a first mounting end, a second mounting end, and a camera position adjustment mechanism. The first camera is mounted on the first mounting end, and the second camera is mounted on the second mounting end. The camera position adjustment mechanism is connected to the first mounting end and / or the second mounting end and is used to adjust the position of the first camera and / or the second camera according to the coaxial calibration plate images acquired by the first camera and the second camera, so as to eliminate the coaxial error between the first camera and the second camera.

7. The wafer bonding apparatus as described in claim 6, characterized in that, The bonding module also includes: Multicolor light sources are used to provide illumination beams of multiple wavelengths; and A light source adjustment component is used to adjust the illumination position and / or wavelength of the illumination beam according to the coating composition of the bonding surface of the first sample and / or the second sample, so as to improve the imaging quality of the first image and / or the second image.

8. The wafer bonding equipment as described in claim 5, characterized in that, A first chuck is provided on a first moving platform located above, and a second chuck is provided on a second moving platform located below. The second moving platform further includes: The lower fixed plate is fixedly connected to the body of the second moving platform at its lower part, while its upper surface maintains an inflation gap with the back of the second chuck. The upper fixing plate is used to cooperate with the lower fixing plate to fix the edge of the second chuck; A vacuum pump, connected to the second chuck, is used to provide a vacuum negative pressure to the second sample carried thereon via the second chuck, so as to adsorb and fix the second sample; and A positive pressure gas source is used to fill the gas gap with gas so that the second chuck can cause the central region of the second sample it carries to deform upward.

9. The wafer bonding equipment as described in claim 8, characterized in that, The second chuck is designed to be arc-shaped so that when the positive pressure gas source fills the gas gap with gas, it causes the central region of the second sample to deform upward uniformly.

10. The wafer bonding apparatus as described in claim 8, characterized in that, The first mobile platform also includes: A wafer pressing mechanism is used to provide uniform downward pressure to the back side of a first sample carried by the first moving platform to bond a first surface on the underside of the first sample to a second surface on the upper side of the second sample.

11. The wafer bonding apparatus as described in claim 10, characterized in that, The first mobile platform also includes a longitudinal movement component, and the controller is further configured to: After aligning the first sample and the second sample, the distance between the first sample and the second sample is adjusted to a preset distance via the longitudinal movement component of the first moving platform; Gas is injected into the inflation gap via the positive pressure gas source, so that the central region of the second sample carried by the second chuck is deformed upward. The first sample is pressed down by the wafer pressing mechanism to bond the first surface on the lower side of the first sample downward to the second surface on the upper side of the second sample; as well as The vacuum is released in the first chuck and / or the second chuck via the vacuum pump to complete the bonding of the first sample and the second sample.

12. The wafer bonding apparatus as described in claim 8, characterized in that, The first mobile platform also includes: A micro-motion platform is used to adjust the lateral position of the first moving platform and / or the second moving platform according to the lateral position deviation after both the first moving platform and the second moving platform have moved to the bonding position, so as to align the first sample and the second sample.

13. The wafer bonding equipment as described in claim 1, characterized in that, At least one of the first sample and the second sample is a wafer.

14. A wafer bonding method, characterized in that, Includes the following steps: The first sample and / or the second sample to be bonded are pre-processed via the front-end module of the wafer bonding apparatus as described in any one of claims 1 to 13. In response to the completion of the pre-processing, the moving end of the cylinder of the baffle drive mechanism of the bonding module at the rear end drives the baffle located at the transfer port of the bonding module and the pre-processing module to move along the slide rail, so as to control the baffle to open the transfer port and transmit the first sample and the second sample into the bonding module. as well as The baffle is driven by the mobile terminal to move along the slide rail, thereby controlling the baffle to close the transfer port, and then the first sample and the second sample are bonded by the bonding module.

15. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the wafer bonding method as described in claim 14 is implemented.

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