Device for thermal control of a wafer

Abstract

An apparatus with wafer temperature control capability is presented. The apparatus includes: a plate configured to control a temperature of a wafer placed thereon; the cold tank and the hot tank are used for storing cold fluid and hot fluid respectively; the cooling and heating device is used for cooling and heating fluid in the cold tank and the hot tank respectively; an outlet switching valve configured to control a direction of fluid flowing out of the plate; an input switching valve configured to control a direction of fluid entering the plate, the first fluid line, the second fluid line, the third fluid line, and the fourth fluid line; a pump configured to pump the fluid in the input path into the plate; and a controller configured to control an open state of the outlet switching valve and the input switching valve.

Description

Technical Field

[0001] The present invention relates to a substrate support device, and more particularly, to a device having the ability to control the temperature of a substrate placed thereon. Background Art

[0002] In semiconductor manufacturing and / or processing, substrates need to be cooled and heated in different steps.

[0003] However, the plate for cooling the substrate has a high heat capacity, and the change of the heat mode, that is, from heating to cooling or from cooling to heating, takes a lot of time. In addition, when the mode changes from cooling to heating, the coolant may easily evaporate.

[0004] Therefore, the present disclosure proposes a rather simple and easy system and method for heating and / or cooling wafers in the same space. Summary of the Invention

[0005] The Summary of the Invention is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the detailed description of the exemplary embodiments disclosed below. The Summary of the Invention is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0006] According to one embodiment, a device for thermal control of a wafer can be provided. The device includes: a plate configured to control the temperature of a wafer placed thereon; a cold tank configured to store a fluid; a cooling device configured to cool the fluid in the cold tank to a temperature lower than a first threshold; a hot tank configured to store a fluid; a heating device configured to heat the fluid in the hot tank to another temperature higher than a second threshold; an outlet switching valve configured to control the direction of the fluid flowing out of the plate; an inlet switching valve configured to control the direction of the fluid entering the plate; a first fluid pipeline provided between the outlet switching valve and the hot tank and configured to fluidly connect the outlet switching valve and the hot tank; a second fluid pipeline provided between the outlet switching valve and the cold tank and configured to fluidly connect the outlet switching valve and the cold tank; a third fluid pipeline provided between the hot tank and the inlet switching valve and configured to fluidly connect the hot tank and the inlet switching valve; a fourth fluid pipeline provided between the cold tank and the inlet switching valve and configured to fluidly connect the cold tank and the inlet switching valve; a pump provided on the input path and configured to pump the fluid in the input path into the plate; and a controller electrically coupled to the outlet switching valve and the inlet switching valve and configured to control the open states of the outlet switching valve and the inlet switching valve.

[0007] In at least one aspect, the plate further includes a first portion and a second portion, wherein a fluid path is engraved on the first portion, and the engraved fluid path is a long continuous route without overlap, and wherein a first end of the fluid path and a second end of the fluid path are exposed to the outside of the plate, and the first portion and the second portion are configured to seal the fluid path.

[0008] In at least one aspect, the device further includes an input path, which is disposed between the input switching valve and the first end of the fluid path and is configured to fluidly connect the input switching valve and the first end of the fluid path; and an output path, which is disposed between the second end of the fluid path and the output switching valve and is configured to fluidly connect the second end of the fluid path and the output switching valve.

[0009] In at least one aspect, the device further includes a first joint, which is disposed at the first end of the fluid path and is configured to seal the contact area between the first end of the fluid path and the input path; and a second joint, which is disposed at the second end of the fluid path and is configured to seal the contact area between the second end of the fluid path and the output path.

[0010] In at least one aspect, the plate further includes a first portion, a second portion, and a fluid tube, wherein the fluid tube is a long continuous route covering the plate, and wherein a first end of the fluid tube and a second end of the fluid tube are exposed to the outside of the plate, and the fluid tube is disposed between the first portion and the second portion.

[0011] In at least one aspect, the device further includes: an input path, which is disposed between the input switching valve and the first end of the fluid tube and is configured to fluidly connect the input switching valve and the first end of the fluid tube; and an output path, which is disposed between the second end of the fluid tube and the output switching valve and is configured to fluidly connect the second end of the fluid tube and the output switching valve.

[0012] In at least one aspect, the device further includes: a first joint, which is disposed at the first end of the fluid tube and is configured to seal the contact area between the first end of the fluid tube and the input path; and a second joint, which is disposed at the second end of the fluid tube and is configured to seal the contact area between the second end of the fluid tube and the output path.

[0013] In at least one aspect, the device further includes a filler, which is configured to fill the space between the outside of the first portion, the second portion, and the fluid tube.

[0014] According to one embodiment, a device for thermal control of a wafer can be provided. The device includes: a plate configured to control the temperature of a wafer placed thereon using a fluid; a cold tank configured to store the fluid; a cooling device configured to cool the fluid in the cold tank to a temperature below a first threshold; a hot tank configured to store the fluid; a heating device configured to heat the fluid in the hot tank to a temperature above a second threshold; an outlet switching valve configured to control the direction of the fluid flowing out of the plate; an inlet switching valve configured to control the direction of the fluid entering the plate; a first fluid pipeline provided between the outlet switching valve and the hot tank and configured to fluidly connect the outlet switching valve and the hot tank; a second fluid pipeline provided between the outlet switching valve and the cold tank and configured to fluidly connect the outlet switching valve and the cold tank; a third fluid pipeline provided between the hot tank and the inlet switching valve and configured to fluidly connect the hot tank and the inlet switching valve; a fourth fluid pipeline provided between the cold tank and the inlet switching valve and configured to fluidly connect the cold tank and the inlet switching valve; a first pump configured to pump the fluid in the hot tank into the plate; a second pump configured to pump the fluid in the cold tank into the plate; and a controller electrically coupled to the outlet switching valve and the inlet switching valve and configured to control the open states of the outlet switching valve and the inlet switching valve.

[0015] In at least one aspect, the plate further includes a first part and a second part, wherein a fluid path is engraved on the first part, and the engraved fluid path is a long continuous route without overlap, and wherein a first end of the fluid path and a second end of the fluid path are exposed to the outside of the plate, and the first part and the second part are configured to seal the fluid path.

[0016] In at least one aspect, the device further includes an input path provided between the inlet switching valve and the first end of the fluid path and configured to fluidly connect the inlet switching valve and the first end of the fluid path; and an output path provided between the second end of the fluid path and the outlet switching valve and configured to fluidly connect the second end of the fluid path and the outlet switching valve.

[0017] In at least one aspect, the device further includes a first joint provided at the first end of the fluid path and configured to seal the contact area between the first end of the fluid path and the input path; and a second joint provided at the second end of the fluid path and configured to seal the contact area between the second end of the fluid path and the output path.

[0018] In at least one aspect, the plate further includes a first part, a second part, and a fluid tube, wherein the fluid tube is a long continuous route covering the plate, and wherein a first end of the fluid tube and a second end of the fluid tube are exposed to the outside of the plate, and the fluid tube is provided between the first part and the second part.

[0019] In at least one aspect, the device further comprises: an input path, which is disposed between the input switching valve and the first end of the fluid pipe, and is configured to fluidly connect the input switching valve and the first end of the fluid pipe; and an output path, which is disposed between the second end of the fluid pipe and the outlet switching valve, and is configured to fluidly connect the second end of the fluid pipe and the outlet switching valve.

[0020] In at least one aspect, the device further comprises: a first joint, which is disposed at the first end of the fluid pipe, and is configured to seal the contact area between the first end of the fluid pipe and the input path; and a second joint, which is disposed at the second end of the fluid pipe, and is configured to seal the contact area between the second end of the fluid pipe and the output path.

[0021] In at least one aspect, the device further comprises a filler, which is configured to fill the space between the first part, the second part and the outside of the fluid pipe.

[0022] In at least one aspect, the controller is further electrically coupled to the first pump and the second pump, and is further configured to control the operating states of the first pump and the second pump.

[0023] In at least one aspect, the controller is further configured to: control the input switching valve to open the third fluid pipeline and control the outlet switching valve to open the first fluid pipeline for the fluid circulation of heating, and control the input switching valve to open the fourth fluid pipeline and control the outlet switching valve to open the second fluid pipeline for the fluid circulation of cooling.

[0024] In at least one aspect, the boiling point of the fluid is higher than the third threshold temperature.

[0025] In at least one aspect, the first part and the second part are black anodized, and the thickness of the plate is equal to or less than 15 mm. Description of the Drawings

[0026] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the figures may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure.

[0027] Figure 1 A schematic diagram of the entire device according to an embodiment of the present disclosure is shown.

[0028] Figure 2 Another schematic diagram of the entire device according to another embodiment of the present disclosure is shown.

[0029] Figure 3 Different perspective views of the plate according to an embodiment of the present disclosure are shown.

[0030] Figure 4Shows different settings of a control valve according to another embodiment of the present disclosure.

[0031] Figure 5 Shows different perspective views of a plate according to another embodiment of the present disclosure. Detailed Description

[0032] Although certain embodiments and examples are disclosed below, those skilled in the art will understand that the invention extends beyond the specifically disclosed embodiments and / or uses of the invention and their obvious modifications and equivalents. Accordingly, it is intended that the scope of the disclosed invention not be limited by the specifically disclosed embodiments described below.

[0033] As used herein, the term "substrate" can refer to any one or more underlying materials, including any one or more underlying materials that can be modified or on which devices, circuits, or films can be formed. A "substrate" can be continuous or discontinuous; rigid or flexible; solid or porous; and combinations thereof. The substrate can be in any form, such as powder, plate, or workpiece. Plate-like substrates can include wafers of various shapes and sizes. Substrates can be made of semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0034] For example, substrates in powder form can be used in pharmaceutical manufacturing. Porous substrates can contain polymers. Examples of workpieces can include medical devices (such as stents and syringes), jewelry, tooling equipment, components for battery manufacturing (such as anodes, cathodes, or separators), or components of photovoltaic cells, etc.

[0035] Continuous substrates can extend beyond the boundaries of the processing chamber where the deposition process occurs. In some processes, the continuous substrate can be moved through the processing chamber so that the process continues until the end of the substrate is reached. Continuous substrates can be provided from a continuous substrate feed system to allow for the manufacture and output of continuous substrates in any suitable form.

[0036] Non-limiting examples of continuous substrates can include sheets, non-woven films, rolls, foils, meshes, flexible materials, a bundle of continuous filaments or fibers (such as ceramic fibers or polymer fibers). Continuous substrates can also include a carrier or sheet on which a discontinuous substrate is mounted.

[0037] The illustrations presented herein are not meant to be actual views of any specific material, structure, or device, but are merely idealized representations for describing embodiments of the present disclosure.

[0038] The specific embodiments shown and described are illustrative of the invention and its best mode and are not intended to limit the scope of these aspects and embodiments in any way. In fact, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of the system may not be described in detail. Additionally, the connecting lines shown in the figures are intended to represent exemplary functional relationships and / or physical couplings between various elements. Many alternative or additional functional relationships or physical connections may exist in the actual system and / or may not exist in some embodiments.

[0039] It should be understood that the configurations and / or methods described herein are exemplary in nature and that these specific embodiments or examples should not be considered limiting since many variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. Accordingly, the various acts shown may be performed in the order shown, in other orders, or in some cases, omitted.

[0040] The subject matter of the present disclosure includes all novel and non - obvious combinations and sub - combinations of various processes, systems, and configurations, as well as other features, functions, acts, and / or properties disclosed herein, and any and all equivalents thereof.

[0041] Figure 1 A schematic diagram of an entire apparatus according to an embodiment of the present disclosure is shown.

[0042] Generally, substrate cooling / heating occurs inside chamber 100. In chamber 100, a plate 110 for cooling / heating (thermal control) the substrate placed thereon is shown.

[0043] To cool or heat the substrate on plate 110, fluid 10 can be used. The apparatus also includes a cold tank 120 and a hot tank 123 for storing the fluid, and cooling means 121 and heating means 124 for cooling and heating the fluid in the respective tanks 120, 123. The apparatus also includes an input switching valve 162 and an outlet switching valve 161 for switching between the tanks 120, 123 to select which operation (cooling or heating) to apply to the substrate placed on the plate. The apparatus may also include an input path 151 and an output path 152 for the fluid to enter or exit plate 110, respectively.

[0044] The interior of the plate can be Figure 3Shown in. As shown, the plate 300 may include a first portion 310 and a second portion 320. The first portion 310 will be slightly thicker than the second portion 320, and the fluid path 330 may be engraved on the first portion 310 (the thicker portion). The fluid path 330 will be a long continuous route covering all of the first portion 310 of the plate 300, and the fluid paths 330 do not overlap. The first portion 310 outside the fluid path 330, i.e., the region 311, will be a thermally conductive material such as Al and / or any other material with a high thermal conductivity. Both ends of the fluid paths 331, 332 may be exposed to the outside of the plate and may be used as fluid inlet and outlet points. When the first portion 310 and the second portion 320 can be attached, the fluid path 330 can be completely sealed so that no fluid can leak from it.

[0045] In Figure 5 In another embodiment, the plate 500 may include a first portion 510, a second portion 520, and a fluid tube 530. The fluid tube 530 is an independent bent tube, and its coverage is the same as the coverage of the engraved fluid path 330. The outside of the fluid tube 530 between the first and second portions 510, 520 may be filled with a filler 511, and the filler 511 may include a highly conductive material such as Al. Any other material other than Al may be used as long as it (or the material mixture) has high thermal conductivity.

[0046] The cooling device 121 can lower the temperature of the fluid inside the cold tank 120. A low threshold temperature can be set for the device 121 to keep the temperature of the fluid in the cold tank 120 below the low threshold.

[0047] The heating device 124 can heat the temperature of the fluid inside the hot tank 123. A high threshold temperature can be set for the heating device 124 to keep the temperature of the hot tank 123 above the high threshold. Generally, the low threshold may be equal to or lower than 20 (degrees Celsius), and the high threshold may be equal to or higher than 270 (degrees Celsius).

[0048] When the substrate on the heating plate 110 is heated, the fluid from the hot tank 123 is pumped into the plate 110 by the second pump 142 via the third fluid pipeline 156. The input switching valve 162 can be opened for the third fluid pipeline 156 (which means the fourth fluid pipeline 155 is closed), and the hot fluid heated to a temperature higher than the high threshold enters the first end of the fluid path 331 (or fluid pipe 531) through the input path 151. The hot fluid flows along the fluid path 330 (or fluid pipe 530), and heats the substrate placed on the plate 110, and the temperature of the fluid may drop. The cooled fluid can leave the plate 110 from the second end of the fluid path 332 (or fluid pipe 532). The fluid 10 then reaches the outlet switching valve 161 through the outlet path 152. The outlet switching valve 161 can open the first fluid pipeline 153 (while closing the second fluid pipeline 154) to return the cooled fluid to the hot tank 123 for reheating.

[0049] When the substrate on the cooling plate 110 is cooled, the fluid 10 from the cooling tank 120 is pumped into the plate 110 by the first pump 141 via the fourth fluid pipeline 155. The input switching valve 162 can be opened for the fourth fluid pipeline 155 (which means the third fluid pipeline 156 is closed), and the cold fluid cooled to a temperature lower than the low threshold enters the first end of the fluid path 331 (or fluid pipe 531) through the input path 151. The cold fluid flows along the fluid path 330 (or fluid pipe 530), and cools the substrate placed on the plate 110, and the temperature of the fluid 10 may rise. The slightly heated fluid can leave the plate 110 from the second end of the fluid path 332 (or fluid pipe 532). The fluid 10 then reaches the outlet switching valve 161 through the outlet path 152. The outlet switching valve 161 can open the second fluid pipeline 154 (while the first fluid pipeline 153 is closed) to return the heated fluid to the cooling tank 120 for recooling.

[0050] The opening / closing of the input switching valve 162 and the outlet switching valve 161 can be controlled by the controller 160. The controller 160 can be electrically connected to the outlet switching valve 161 and the input switching valve 162 through wired or wireless 131, 132 respectively.

[0051] The controller 160 can also be configured to control the input switching valve 162 and the outlet switching valve 161 such that when the third fluid pipeline 156 can be opened (which means the fourth fluid pipeline 155 is closed), the first fluid pipeline 153 can be opened simultaneously (which means the second fluid pipeline 154 is closed). The controller 160 can also be configured to control the input switching valve 162 and the outlet switching valve 161 such that when the fourth fluid pipeline 155 can be opened (which means the third fluid pipeline 156 is closed), the second fluid pipeline 154 can be opened simultaneously (which means the first fluid pipeline 153 is closed).

[0052] The controller 160 can also be connected to the first and second pumps 141, 142 to control operations 133, 134 respectively. When heating the substrate, the cold fluid in the cold tank 120 may not be needed, so the controller 160 can control the first pump 141 to stop while the second pump 142 operates. When cooling the substrate, the hot fluid in the hot tank 123 may not be needed, so the controller 160 can control the second pump 142 to stop while the first pump 141 operates.

[0053] In some applications, additional fluid seals may be required. As Figure 1 , 3 shown in and 5, the first and second ends of the fluid paths 331, 332 (or fluid tubes 531, 532) can be connected to the input path 151 and the output path 152, and the first joint 111 can seal the contact area between the input path 151 and the first end of the fluid path 331 (or fluid tube 531), and the second joint 112 can seal the contact area between the output path 152 and the second end of the fluid path 332.

[0054] In some applications, the input path 151 and / or the output path 152 may not be needed.

[0055] In Figure 4 , the plate 410 can be set to be directly connected to the input switching valve 461 and the output switching valve 462. In this case, the first joint 111 and the second joint 112 may not be needed.

[0056] In another embodiment, there may be 1 (one) pump instead of 2 (two) pumps.

[0057] In Figure 2 , a plate 210 for cooling / heating (thermal control) the substrate placed thereon is shown.

[0058] To cool or heat the substrate on the plate 210, the fluid 11 can be used. The device also includes a cold tank 220 and a hot tank 223 for storing the fluid 11, and a cooling device 221 and a heating device 224 for cooling and heating the fluid in the corresponding tanks 220, 223. The device also includes an input switching valve 262 and an outlet switching valve 261 for switching between the tanks 220, 223 to select which operation (cooling or heating) to apply to the substrate placed on the plate 210. The device can also include an input path 251 and an output path 252 for the fluid 11 to enter or flow out of the plate 210 respectively.

[0059] The cooling device 221 can reduce the temperature of the fluid 11 inside the cold tank 220. A low threshold temperature can be set for the device 221 to keep the fluid temperature in the cold tank 220 below the low threshold.

[0060] The heating device 224 can heat the temperature of the fluid 11 inside the hot tank 223. A high threshold temperature can be set for the heating device 224 to keep the temperature of the hot tank 223 above the high threshold.

[0061] When the substrate on the heating plate 210 is heated, the fluid 11 from the hot tank 223 is pumped by the pump 242 through the third fluid pipeline 256 into the plate 210. The input switching valve 262 can be opened for the third fluid pipeline 256 (which means the fourth fluid pipeline 255 is closed), and the hot fluid heated to above the high threshold can enter the first end of the fluid path 331 (or fluid pipe 531) through the input path 251. The hot fluid flows along the fluid path 330 (or fluid pipe 530) and heats the substrate placed on the plate 210, and the temperature of the fluid 11 may drop. The cooled fluid can leave the plate 210 from the second end of the fluid path 332 (or fluid pipe 532). The fluid 11 then reaches the outlet switching valve 261 through the outlet path 252. The outlet switching valve 261 can open the first fluid pipeline 253 (while the second fluid pipeline 254 is closed) to return the cooled fluid to the hot tank 223 for reheating.

[0062] When the substrate on the cooling plate 210 is cooled, the fluid 11 from the cooling tank 220 is pumped by the pump 142 through the fourth fluid pipeline 255 into the plate 210. The input switching valve 262 can be opened for the fourth fluid pipeline 255 (which means the third fluid pipeline 256 is closed), and the cold fluid cooled to below the low threshold can enter the first end of the fluid path 331 (or fluid pipe 531) through the input path 251. The cold fluid flows along the fluid path 330 (or fluid pipe 530) and cools the substrate placed on the plate 210, and the temperature of the fluid 11 may rise. The slightly heated fluid can leave the plate 210 from the second end of the fluid path 332 (or fluid pipe 532). The fluid 11 then reaches the outlet switching valve 261 through the outlet path 252. The outlet switching valve 261 can be controlled to open the second fluid pipeline 254 (while the first fluid pipeline 253 is closed) to return the heated fluid to the cooling tank 220 for recooling.

[0063] The opening / closing of the input switching valve 262 and the outlet switching valve 261 can be controlled by the controller 260. The controller 260 can be electrically connected to the outlet switching valve 261 and the input switching valve 262 through wired or wireless 231, 232 respectively.

[0064] The controller 260 can also be configured to control the input switching valve 262 and the outlet switching valve 261 such that when the third fluid line 256 can be opened (which means the fourth fluid line 255 is closed), the first fluid line 253 can be opened simultaneously (which means the second fluid line 254 is closed). The controller 260 can also be configured to control the input switching valve 262 and the outlet switching valve 261 such that when the fourth fluid line 255 can be opened (which means the third fluid line 256 is closed), the second fluid line 254 can be opened simultaneously (which means the first fluid line 253 is closed).

[0065] The controller 160 can also be connected to the pump 242 for controlling its operation 233, such as accelerating / decelerating, turning on / off.

[0066] For effective thermal control, the fluids 10, 11 can have a high boiling point. The boiling point may be higher than a high threshold at which they do not evaporate when heated. The boiling point of the fluid can be another threshold higher than the boiling threshold, and the boiling threshold can be higher than the high threshold.

[0067] For effective thermal control, the thicknesses of the plates 110, 210 may need to be thin enough. Preferably, the thicknesses of the plates 110, 210 can be equal to or less than 15 mm.

[0068] The plates, namely the first part, the second part, the fluid tubes, and the filler can be black anodized to obtain maximum thermal conductivity and can be made of materials including aluminum (Al), copper (Cu), and other high - thermal - conductivity materials or alloys, as well as mixtures of two or more of them. The plates and fluid lines can also be made of materials resistant to electrolytic corrosion.

[0069] The arrangement of the above - described device is merely illustrative of the application of the principles of the present invention, and many other embodiments and modifications can be made without departing from the spirit and scope of the present invention as defined in the claims. Therefore, the scope of the present invention should not be determined with reference to the above description, but should be determined with reference to the full scope of the appended claims and their equivalents.

Claims

1. An apparatus for thermal control of a wafer, the apparatus comprising: fluid; a plate configured to control the temperature of a wafer placed thereon using a fluid; a cold tank and a hot tank configured to store a fluid; a cooling device configured to cool the fluid in the cold tank to a first temperature below a first threshold; a heating device configured to heat the fluid in the hot tank to a second temperature above a second threshold; an outlet switch valve configured to control the direction of fluid flow out of the plate; an input switch valve configured to control the direction of fluid entering the plate; a first fluid line disposed between the outlet switch valve and the hot tank and configured to fluidly connect the outlet switch valve and the hot tank; a second fluid pipeline disposed between the outlet switch valve and the cold tank and configured to fluidly connect the outlet switch valve and the cold tank; a third fluid line disposed between the hot tank and the input switch valve and configured to fluidly connect the hot tank and the input switch valve; a fourth fluid line disposed between the cold tank and the input switch valve and configured to fluidly connect the cold tank and the input switch valve; a pump configured to pump a fluid into the plate; as well as The controller is electrically coupled to the outlet switch valve and the input switch valve and is configured to control the opening states of the outlet switch valve and the input switch valve.

2. The device according to claim 1, wherein the plate further comprises a first portion and a second portion, wherein: A fluid path is engraved on the first portion, and the fluid path is a long continuous route with no overlap, and The first end of the fluid path and the second end of the fluid path are exposed to the outside of the plate, and the first portion and the second portion are configured to seal the fluid path.

3. The apparatus according to claim 2, further comprising: an input path disposed between the input switch valve and the first end of the fluid path and configured to fluidly connect the input switch valve and the first end of the fluid path; The output path is disposed between the second end of the fluid path and the outlet switch valve and is configured to fluidically connect the second end of the fluid path and the outlet switch valve.

4. The apparatus according to claim 3, further comprising: a first joint portion disposed at the first end of the fluid path and configured to seal a contact area between the first end of the fluid path and the input path; as well as The second joint portion is disposed at the second end of the fluid path and is configured to seal a contact area between the second end of the fluid path and the output path.

5. The device of claim 1, wherein the plate further comprises a first portion and a second portion and a fluid tube, wherein: The fluid tube is a long continuous course covering the plate, and The first end of the fluid tube and the second end of the fluid tube are exposed to the outside of the plate, and the fluid tube is arranged between the first part and the second part.

6. The apparatus according to claim 5, further comprising: an input path disposed between the input switch valve and the first end of the fluid tube and configured to fluidically connect the input switch valve and the first end of the fluid tube; The output path is disposed between the second end of the fluid tube and the outlet switch valve and is configured to fluidically connect the second end of the fluid tube and the outlet switch valve.

7. The apparatus according to claim 6, further comprising: a first joint portion disposed at the first end of the fluid tube and configured to seal a contact area between the first end of the fluid tube and the input path; as well as The second joint portion is disposed at the second end of the fluid tube and is configured to seal a contact area between the second end of the fluid tube and the output path.

8. The apparatus according to claim 5, further comprising: A filler is configured to fill the space between the first portion, the second portion and the fluid tube.

9. An apparatus for thermal control of a wafer, the apparatus comprising: fluid; a plate configured to control the temperature of a wafer placed thereon using a fluid; a cold tank and a hot tank configured to store a fluid; a cooling device configured to cool the fluid in the cold tank to a first temperature below a first threshold; a heating device configured to heat the fluid in the hot tank to a second temperature above a second threshold; an outlet switch valve configured to control the direction of fluid flow out of the plate; an input switch valve configured to control the direction of fluid entering the plate; a first fluid line disposed between the outlet switch valve and the hot tank and configured to fluidly connect the outlet switch valve and the hot tank; a second fluid pipeline disposed between the outlet switch valve and the cold tank and configured to fluidly connect the outlet switch valve and the cold tank; a third fluid line disposed between the hot tank and the input switch valve and configured to fluidly connect the hot tank and the input switch valve; a fourth fluid line disposed between the cold tank and the input switch valve and configured to fluidly connect the cold tank and the input switch valve; a first pump configured to pump fluid in the hot tank into the plate; a second pump configured to pump fluid from the cold tank into the plate; as well as The controller is electrically coupled to the outlet switch valve and the input switch valve and is configured to control the opening states of the outlet switch valve and the input switch valve.

10. The device of claim 9, the plate further comprising a first portion and a second portion, wherein: A fluid path is engraved on the first portion, and the fluid path is a long continuous route with no overlap, and The first end of the fluid path and the second end of the fluid path are exposed to the outside of the plate, and the first portion and the second portion are configured to seal the fluid path.

11. The apparatus according to claim 10, further comprising: an input path disposed between the input switch valve and the first end of the fluid path and configured to fluidly connect the input switch valve and the first end of the fluid path; The output path is disposed between the second end of the fluid path and the outlet switch valve and is configured to fluidically connect the second end of the fluid path and the outlet switch valve.

12. The apparatus according to claim 11, further comprising: a first joint portion disposed at the first end of the fluid path and configured to seal a contact area between the first end of the fluid path and the input path; as well as The second joint portion is disposed at the second end of the fluid path and is configured to seal a contact area between the second end of the fluid path and the output path.

13. The device of claim 9, the plate further comprising a first portion and a second portion and a fluid tube, wherein: The fluid tube is a long continuous course covering the plate, and The first end of the fluid tube and the second end of the fluid tube are exposed to the outside of the plate, and the fluid tube is arranged between the first part and the second part.

14. The apparatus according to claim 13, further comprising: an input path disposed between the input switch valve and the first end of the fluid tube and configured to fluidically connect the input switch valve and the first end of the fluid tube; The output path is disposed between the second end of the fluid tube and the outlet switch valve and is configured to fluidically connect the second end of the fluid tube and the outlet switch valve.

15. The apparatus according to claim 14, further comprising: a first joint portion disposed at the first end of the fluid tube and configured to seal a contact area between the first end of the fluid tube and the input path; as well as The second joint portion is disposed at the second end of the fluid tube and is configured to seal a contact area between the second end of the fluid tube and the output path.

16. The apparatus according to claim 13, further comprising: A filler is configured to fill a space formed between the first portion, the second portion and the fluid tube.

17. The device according to claim 9, wherein: The controller is further electrically coupled to the first pump and the second pump, and is further configured to control the operating state of the first pump and the second pump, and wherein the controller is further configured to: controlling the input switch valve to open the third fluid line and controlling the outlet switch valve to open the first fluid line for heated fluid flow, and The input switching valve is controlled to open the fourth fluid line and the outlet switching valve is controlled to open the second fluid line for fluid flow of cooling.

18. The device according to claim 1, wherein: The controller is further configured to: controlling the input switch valve to open the third fluid line and controlling the outlet switch valve to open the first fluid line for heated fluid flow, and The input switching valve is controlled to open the fourth fluid line and the outlet switching valve is controlled to open the second fluid line for fluid flow of cooling.

19. The device according to claim 2, wherein: The boiling point of the fluid is above a third threshold temperature, and The first portion and the second portion are black anodized, and The thickness of the plate is equal to or less than 15 mm.

20. The device according to claim 10, wherein: The boiling point of the fluid is above a third threshold temperature, and wherein the first portion and the second portion are black anodized, and The thickness of the plate is equal to or less than 15 mm.

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