A semiconductor wafer backside cleaning apparatus for semiconductor production

Abstract

The application belongs to the technical field of semiconductor processing, and discloses a semiconductor wafer back cleaning equipment for semiconductor production, which comprises two first mounting frames, second mounting frames symmetrically fixed and mounted on the upper and lower sides of the middle parts of the two first mounting frames, first telescopic rods fixed and mounted on the middle parts of the two second mounting frames, middle holes formed in the middle parts of the first telescopic rod telescopic shafts, and clamping mechanisms arranged on the middle parts of the two first mounting frames. The curved surface of the wafer drives the wafer to rotate, so that the dirt on the wafer surface falls off from the wafer surface under the action of centrifugal force, and the liquid cleaning liquid reduces the vibration of the rotating wafer, and avoids the direct contact between the rotating wafer and the inner curved surface of the middle sleeve shell, so as to prevent the wafer from being vibrated and the edge of the wafer from being abraded, thereby solving the problem that the existing clamping device causes the wafer to be bent and deformed when clamping and flushing the edge of the wafer.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor wafer back cleaning equipment for semiconductor production. BACKGROUND

[0002] In the process of semiconductor production, the cleanliness of the wafer is crucial to ensure the quality and performance of the final product, although most cleaning steps are mainly concentrated on the side of the wafer with the circuit pattern, the cleaning of the back of the wafer is also important, especially in advanced manufacturing processes.

[0003] In the prior art, when the edge of the wafer is clamped and washed, the wafer is easily deformed due to the impact of the cleaning liquid on the wafer surface, which not only affects the cleaning effect, but also may cause damage to the wafer, thereby reducing the production yield; secondly, it is difficult to clamp different sizes of wafers in the back etching cavity, which requires frequent adjustment of equipment settings or replacement of clamps when replacing wafers, greatly reducing the wafer replacement efficiency, increasing the process complexity and downtime; in addition, the existing device usually needs to support the upper and lower parts of the wafer, which inevitably causes damage to the wafer surface, affecting the quality and performance of the final product, the existence of these problems makes the current wafer cleaning and processing technology unable to meet the growing demand for high precision and high performance manufacturing, therefore, it is urgent to provide a new type of wafer back cleaning device to overcome the above-mentioned shortcomings, improve the cleaning quality, reduce the damage to the wafer, and improve the adaptability of the equipment to different sizes of wafers, so as to improve the overall production efficiency and product reliability. SUMMARY

[0004] The application aims to provide a semiconductor wafer back cleaning equipment for semiconductor production to solve the problems in the background.

[0005] In order to achieve the above object, the present application provides the following technical scheme: a semiconductor wafer back cleaning equipment for semiconductor production, comprising two first mounting frames, two second mounting frames are symmetrically fixed and installed on the upper and lower sides of the middle parts of the two first mounting frames, a first telescopic rod is fixed and installed in the middle part of each of the two second mounting frames, a middle hole is formed in the middle part of the telescopic shaft of the first telescopic rod, a clamping mechanism is arranged in the middle part of each of the two first mounting frames, the clamping mechanism comprises a driving member, the driving member is fixedly installed in the middle part of the side of the first mounting frame away from the first telescopic rod, the output shaft of the driving member is movably sleeved with the first mounting frame, a sleeve block is fixedly installed on the side of the output end of the driving member close to the first telescopic rod, a sliding rod is slidably sleeved with the side of the sleeve block away from the first telescopic rod, the contact surface between the sliding rod and the sleeve block is a smooth surface, a second telescopic rod is fixedly sleeved with the side of the sleeve block close to the first telescopic rod, the telescopic end of the second telescopic rod is fixedly connected with the sliding rod, a top cover mechanism is arranged on the upper part of each of the two clamping mechanisms, a bottom sleeve mechanism is arranged on the bottom part of each of the two clamping mechanisms, an outer ring mechanism is arranged in the middle part of each of the two clamping mechanisms, a middle ring mechanism is arranged in the middle part of the outer ring mechanism, and the inner ring mechanism is sleeved with the outer side of the top cover mechanism.

[0006] Preferably, the top cover mechanism comprises a top shell, the top shell is fixedly connected with the upper parts of the two sliding rods, a first sleeve seat is fixedly sleeved with the upper part of the inner curved surface of the top shell, a first one-way valve is fixedly sleeved with the middle part of the first sleeve seat, the output port of the first one-way valve faces the outer ring mechanism, the telescopic end of the upper first telescopic rod is slidably sleeved with the top shell, an electromagnetic seat is fixedly installed on the upper part of the outer curved surface of the top shell, two electromagnetic coils with different diameters are fixedly sleeved with the bottom part of the electromagnetic seat, and one of the electromagnetic coils is located on the inner side of the other electromagnetic coil.

[0007] Preferably, the bottom sleeve mechanism comprises a bottom shell, the bottom shell is fixedly connected with the bottom of the two sliding rods, the inner curved surface of the bottom shell is fixedly sleeved with a second sleeve, the middle part of the second sleeve is fixedly sleeved with a second one-way valve, the output port of the second one-way valve faces the outer ring mechanism, the outer curved surface of the bottom shell is equally and circumferentially provided with a plurality of first guide grooves, the top end of the first guide groove is provided with a first mounting groove, the middle part of the first guide groove is slidably sleeved with a first sliding block, the bottom of the inner cavity of the first sliding block is fixedly installed with a first elastic piece, the top end of the first elastic piece is fixedly connected with the top end of the first mounting groove, the outer curved surface of the bottom shell is slidably sleeved with a first bottom sleeve, the contact surface between the bottom shell and the first bottom sleeve is a smooth surface, the first sliding block is fixedly connected with the bottom of the inner curved surface of the first bottom sleeve, the outer curved surface of the first bottom sleeve is equally and circumferentially provided with a plurality of second guide grooves, the top end of the second guide groove is provided with a second mounting groove, the middle part of the second guide groove is slidably sleeved with a second sliding block, the bottom of the inner cavity of the second sliding block is fixedly installed with a second elastic piece, the top end of the second elastic piece is fixedly connected with the top end of the second mounting groove, the outer curved surface of the first bottom sleeve is slidably sleeved with a second bottom sleeve, and the second sliding block is fixedly connected with the bottom of the inner curved surface of the second bottom sleeve.

[0008] Preferably, the outer ring mechanism comprises an outer sleeve shell, the outer sleeve shell is fixedly installed in the middle part of the two sleeve blocks, the upper and lower sides of the inner curved surface of the outer sleeve shell are symmetrically provided with first guide grooves, the upper and lower sides of the inner curved surface of the outer sleeve shell are symmetrically provided with first magnetic rings, and the magnetic direction of the side adjacent to the second magnetic ring of the first magnetic ring is opposite.

[0009] Preferably, the middle ring mechanism comprises a middle sleeve shell, the middle sleeve shell is slidably sleeved in the middle part of the outer sleeve shell, the upper and lower sides of the inner curved surface of the middle sleeve shell are symmetrically provided with second guide grooves, the upper and lower sides of the outer curved surface of the middle sleeve shell are symmetrically fixedly sleeved with second magnetic rings, the upper and lower sides of the inner curved surface of the middle sleeve shell are symmetrically fixedly sleeved with third magnetic rings, and the magnetic direction of the side adjacent to the fourth magnetic ring of the third magnetic ring is opposite.

[0010] Preferably, the inner ring mechanism comprises an inner sleeve shell, the inner sleeve shell is slidably sleeved at the bottom of the outer curved surface of the top shell, the upper and lower sides of the inner curved surface of the inner sleeve shell are symmetrically provided with third guide grooves, the upper and lower sides of the outer curved surface of the inner sleeve shell are symmetrically fixedly installed with two fourth magnetic rings, and the outer curved surface of the inner sleeve shell and the inner curved surface of the middle sleeve shell are smooth surfaces.

[0011] The beneficial effects of the application are as follows:

[0012] 1. The application adjusts the reversing valve of the external cleaning liquid, so that the cleaning liquid flows to the inner cavity of the middle sleeve through the lower first telescopic rod and the bottom sleeve mechanism, until the liquid level of the cleaning liquid in the inner cavity of the middle sleeve rises to the middle position of the second guide groove, then the wafer to be cleaned is moved to the middle of the middle sleeve through the external clamping device, so that the wafer is sleeved with the inner curved surface of the middle sleeve, at this time the cleaning liquid in the inner curved surface of the middle sleeve supports the bottom surface of the wafer, then the reversing valve is continuously adjusted, so that the cleaning liquid is sprayed to the surface of the wafer through the upper first telescopic rod and the top cover mechanism, at the same time the cleaning liquid is injected into the inner cavity of the middle sleeve through the lower first telescopic rod, so that the liquid level of the cleaning liquid in the inner cavity of the middle sleeve rises, at this time the cleaning liquid in the inner cavity of the middle sleeve flows along the second guide groove and flows out of the device from the top end of the middle sleeve, at the same time the cleaning liquid flowing to the second guide groove is guided by the second guide groove, drives the wafer to rotate through the curved surface of the wafer, so that the dirt on the surface of the wafer falls off from the surface of the wafer under the action of centrifugal force, at the same time the liquid cleaning liquid reduces the vibration of the rotating wafer, and avoids the direct contact between the rotating wafer and the inner curved surface of the middle sleeve, so as to cause the vibration and edge wear of the wafer.

[0013] 2. The application starts the second telescopic rod, the second telescopic rod drives the top cover mechanism and the bottom sleeve mechanism to move downward through the sliding rod, when the top cover mechanism drives the inner ring mechanism to move downward along the inner curved surface of the middle sleeve to contact the top end of the middle sleeve, at this time the power supply of the inner electromagnetic ring is disconnected, the electromagnetic ring stops adsorbing the inner sleeve, the third magnetic ring adsorbs the fourth magnetic ring, so that the inner sleeve is sleeved with the inner curved surface of the middle sleeve, when the second telescopic rod drives the top cover mechanism and the bottom sleeve mechanism to move upward through the sliding rod, the top cover mechanism and the inner ring mechanism are separated, at the same time the bottom sleeve mechanism moves upward, the inner sleeve compresses the first bottom sleeve to drive the second sliding block to slide downward, the second sliding block pulls the second elastic member to elongate, the bottom shell slides upward and is sleeved into the bottom of the inner curved surface of the inner sleeve, so that the wafer with small size is placed in the inner curved surface of the inner ring mechanism, and the wafer with small size is cleaned, on the contrary, the middle sleeve is sleeved with the outer curved surface of the inner sleeve, and the wafer with large size is cleaned. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall appearance structure of the application;

[0015] Figure 2 It is a schematic diagram of the inner ring mechanism structure of the application;

[0016] Figure 3 It is a schematic diagram of the bottom sleeve mechanism structure of the application;

[0017] Figure 4 It is a schematic diagram of the middle ring mechanism structure of the application;

[0018] Figure 5 It is a schematic diagram of the first sliding block structure of the application.

[0019] In the figure: 1, first mounting frame; 2, second mounting frame; 3, first telescopic rod; 4, clamping mechanism; 401, driving piece; 402, sleeve block; 403, sliding rod; 404, second telescopic rod; 5, top cover mechanism; 501, top shell; 502, first sleeve seat; 503, first one-way valve; 504, electromagnetic seat; 505, electromagnetic coil; 6, bottom sleeve mechanism; 601, bottom shell; 602, second sleeve seat; 603, second one-way valve; 604, first sliding block; 605, first elastic piece; 606, first bottom sleeve; 607, second sliding block; 608, second elastic piece; 609, second bottom sleeve; 7, outer ring mechanism; 701, outer sleeve shell; 702, first guide groove; 703, first magnetic ring; 8, middle ring mechanism; 801, middle sleeve shell; 802, second guide groove; 803, second magnetic ring; 804, third magnetic ring; 9, inner ring mechanism; 901, inner sleeve shell; 902, third guide groove; 903, fourth magnetic ring. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0021] As Figures 1 to 5As shown, the embodiment of the present application provides a semiconductor wafer back cleaning equipment for semiconductor production, which comprises two first mounting frames 1, two second mounting frames 2 symmetrically fixed and installed on the upper and lower sides of the middle parts of the two first mounting frames 1, a first telescopic rod 3 fixedly installed in the middle part of each of the two second mounting frames 2, a middle hole opened in the middle part of the telescopic shaft of the first telescopic rod 3, so that the subsequent cleaning liquid can flow into the inner cavity surface of the top shell 501 and the bottom shell 601 through the middle hole opened in the telescopic end of the first telescopic rod 3, and the first telescopic rod 3 can be quickly separated from the top cover mechanism 5 and the bottom sleeve mechanism 6 when the clamping mechanism 4 flips up and down the top cover mechanism 5 and the bottom sleeve mechanism 6, the middle part of each of the two first mounting frames 1 is provided with a clamping mechanism 4, the clamping mechanism 4 comprises a driving piece 401 fixedly installed in the middle part of the side of the first mounting frame 1 away from the first telescopic rod 3, the output shaft of the driving piece 401 is movably sleeved with the first mounting frame 1, a sleeve block 402 is fixedly installed on the side of the driving piece 401 close to the first telescopic rod 3, a sliding rod 403 is slidably sleeved with the side of the sleeve block 402 away from the first telescopic rod 3, the contact surface between the sliding rod 403 and the sleeve block 402 is a smooth surface, so as to reduce the friction resistance between the sliding rod 403 and the sleeve block 402, and further reduce the load of the second telescopic rod 404 when the sliding rod 403 drives the top cover mechanism 5 and the bottom sleeve mechanism 6 to move up and down, a second telescopic rod 404 is fixedly sleeved with the side of the sleeve block 402 close to the first telescopic rod 3, the telescopic end of the second telescopic rod 404 is fixedly connected with the sliding rod 403, the upper part of each of the two clamping mechanisms 4 is provided with a top cover mechanism 5, the bottom part of each of the two clamping mechanisms 4 is provided with a bottom sleeve mechanism 6, the middle part of each of the two clamping mechanisms 4 is provided with an outer ring mechanism 7, the middle part of the outer ring mechanism 7 is provided with a middle ring mechanism 8, and the outer side of the top cover mechanism 5 is sleeved with an inner ring mechanism 9.

[0022] As shown, Figures 1 to 2 The top cover mechanism 5 comprises a top shell 501, the top shell 501 is fixedly connected with the upper parts of the two sliding rods 403, a first sleeve 502 is fixedly sleeved with the upper part of the inner curved surface of the top shell 501, a first one-way valve 503 is fixedly sleeved with the middle part of the first sleeve 502, the output port of the first one-way valve 503 faces the outer ring mechanism 7, so as to avoid that the cleaning liquid in the inner curved surface of the top shell 501 flows out of the top shell 501 through the first one-way valve 503 when the clamping mechanism 4 flips the top cover mechanism 5, and the cleaning liquid input into the upper part of the first telescopic rod 3 can flow into the inner cavity of the top shell 501 through the first one-way valve 503, the telescopic end of the upper part of the first telescopic rod 3 is slidably sleeved with the top shell 501, an electromagnetic seat 504 is fixedly installed on the upper part of the outer curved surface of the top shell 501, two electromagnetic coils 505 with different diameters are fixedly sleeved with the bottom part of the electromagnetic seat 504, and one electromagnetic coil 505 is located inside the other electromagnetic coil 505.

[0023] As shown, Figures 1 to 3 , Figure 5As shown, the bottom sleeve mechanism 6 comprises a bottom shell 601 fixedly connected with the bottom of the two sliding rods 403, the inner curved surface of the bottom shell 601 is fixedly sleeved with a second sleeve seat 602, the middle part of the second sleeve seat 602 is fixedly sleeved with a second one-way valve 603, the output port of the second one-way valve 603 faces the outer ring mechanism 7, so that when the clamping mechanism 4 overturns the bottom sleeve mechanism 6, the cleaning liquid on the inner curved surface of the bottom shell 601 flows out of the bottom shell 601 through the second one-way valve 603, and the cleaning liquid input into the lower first telescopic rod 3 can flow into the inner cavity of the bottom shell 601 through the second one-way valve 603, a plurality of first guide grooves are equidistantly arranged on the outer curved surface of the bottom shell 601, a first mounting groove is arranged at the top end of the first guide groove, a first sliding block 604 is slidably sleeved with the middle part of the first guide groove, a first elastic member 605 is fixedly installed at the bottom of the inner cavity of the first sliding block 604, the top end of the first elastic member 605 is fixedly connected with the top end of the first mounting groove, a first bottom sleeve 606 is slidably sleeved with the outer curved surface of the bottom shell 601, the contact surface between the bottom shell 601 and the first bottom sleeve 606 is a smooth surface, so as to improve the sealing property between the bottom shell 601 and the first bottom sleeve 606, avoid the cleaning liquid on the inner curved surface of the middle sleeve shell 801 leaking along the contact gap between the bottom shell 601 and the first bottom sleeve 606, the first sliding block 604 is fixedly connected with the bottom of the inner curved surface of the first bottom sleeve 606, a plurality of second guide grooves are equidistantly arranged on the outer curved surface of the first bottom sleeve 606, a second mounting groove is arranged at the top end of the second guide groove, a second sliding block 607 is slidably sleeved with the middle part of the second guide groove, a second elastic member 608 is fixedly installed at the bottom of the inner cavity of the second sliding block 607, the top end of the second elastic member 608 is fixedly connected with the top end of the second mounting groove, a second bottom sleeve 609 is slidably sleeved with the outer curved surface of the first bottom sleeve 606, the second sliding block 607 is fixedly connected with the bottom of the inner curved surface of the second bottom sleeve 609.

[0024] As shown in the figure, Figures 1 to 3 The outer ring mechanism 7 comprises an outer sleeve shell 701 fixedly installed at the middle part of the two sleeve blocks 402, the upper and lower sides of the inner curved surface of the outer sleeve shell 701 are symmetrically provided with a first guide groove 702, the upper and lower sides of the inner curved surface of the outer sleeve shell 701 are symmetrically provided with a first magnetic ring 703, the side of the first magnetic ring 703 adjacent to the second magnetic ring 803 is opposite in magnetic direction, so that when the middle sleeve shell 801 is slidably sleeved with the inner curved surface of the outer sleeve shell 701, the first magnetic ring 703 adsorbs the second magnetic ring 803, so that the middle sleeve shell 801 is tightly sleeved with the inner cavity of the outer sleeve shell 701, and the middle sleeve shell 801 is prevented from sliding downward along the inner curved surface of the outer sleeve shell 701.

[0025] As shown in the figure, Figure 1 , Figure 2 , Figure 4As shown, the middle ring mechanism 8 comprises a middle sleeve 801 which is slidingly sleeved in the middle of the outer sleeve 701, the upper and lower sides of the inner curved surface of the middle sleeve 801 are symmetrically provided with second guide grooves 802, the upper and lower sides of the outer curved surface of the middle sleeve 801 are symmetrically fixedly sleeved with second magnetic rings 803, the upper and lower sides of the inner curved surface of the middle sleeve 801 are symmetrically fixedly sleeved with third magnetic rings 804, one side of the third magnetic ring 804 adjacent to the fourth magnetic ring 903 is opposite in magnetic direction, so that when the inner sleeve 901 is slidingly sleeved in the inner curved surface of the middle sleeve 801, the third magnetic ring 804 adsorbs the fourth magnetic ring 903, the inner sleeve 901 is tightly sleeved in the inner cavity of the middle sleeve 801, and the inner sleeve 901 is prevented from sliding downward along the inner curved surface of the middle sleeve 801.

[0026] As shown in the figure, Figures 1 to 2 The inner ring mechanism 9 comprises an inner sleeve 901 which is slidingly sleeved at the bottom of the outer curved surface of the top shell 501, the upper and lower sides of the inner curved surface of the inner sleeve 901 are symmetrically provided with third guide grooves 902, the upper and lower sides of the outer curved surface of the inner sleeve 901 are symmetrically fixedly provided with two fourth magnetic rings 903, and the outer curved surface of the inner sleeve 901 and the inner curved surface of the middle sleeve 801 are both smooth surfaces, so that the sealing property between the inner sleeve 901 and the middle sleeve 801 is improved, the clear liquid on the inner curved surface of the middle sleeve 801 is prevented from leaking along the contact gap between the middle sleeve 801 and the inner sleeve 901 when the inner sleeve 901 is slidingly sleeved on the inner curved surface of the middle sleeve 801, and the wafer is prevented from being in contact with the top end of the top shell 501 after the clamping mechanism 4 drives the top cover mechanism 5 to overturn, so that the top surface of the wafer is prevented from being abraded.

[0027] Working principle:

[0028] Before use, the output pipe of the external cleaning liquid is connected with the telescopic ends of the upper and lower first telescopic rods 3, so that the cleaning liquid can flow into the inner cavities of the top shell 501 and the bottom shell 601 through the middle part of the telescopic end of the upper first telescopic rod 3 and the second one-way valve 603 and the middle part of the telescopic end of the lower first telescopic rod 3 and the second one-way valve 603.

[0029] In use, first, by adjusting the reversing valve of the external cleaning liquid, the cleaning liquid is made to flow into the inner cavity of the bottom shell 601 through the middle part of the lower end of the first telescopic rod 3 and the second one-way valve 603, and to flow into the inner cavity of the middle sleeve shell 801 through the micropores on the upper part of the bottom shell 601, until the liquid level of the cleaning liquid in the inner cavity of the middle sleeve shell 801 rises to the middle part of the second guide groove 802, then the wafer to be cleaned is moved to the middle part of the middle sleeve shell 801 by the external clamping device, so that the wafer is in sliding sleeve connection with the inner curved surface of the middle sleeve shell 801, at this time the cleaning liquid on the inner curved surface of the middle sleeve shell 801 supports the bottom surface of the wafer, then the reversing valve is continuously adjusted, so that the cleaning liquid flows into the inner cavity of the top shell 501 through the middle part of the upper end of the first telescopic rod 3 and the first one-way valve 503, and is sprayed onto the surface of the wafer through the micropores on the bottom of the top shell 501, at the same time, the cleaning liquid is continuously injected into the inner cavity of the middle sleeve shell 801 through the lower first telescopic rod 3, so that the liquid level of the cleaning liquid in the inner cavity of the middle sleeve shell 801 rises, at this time the cleaning liquid in the inner cavity of the middle sleeve shell 801 flows along the second guide groove 802 and flows out of the device from the top end of the middle sleeve shell 801, at the same time, the cleaning liquid flowing towards the second guide groove 802 is guided by the second guide groove 802, and drives the wafer to rotate through the curved surface of the wafer, so that the dirt on the surface of the wafer falls off from the surface of the wafer under the action of centrifugal force, at the same time, the liquid cleaning liquid reduces the vibration of the rotating wafer, and avoids the direct contact between the rotating wafer and the inner curved surface of the middle sleeve shell 801, so as to prevent the vibration and edge wear of the wafer;

[0030] In addition, when the back of the wafer needs to be cleaned, adjust the reversing valve, the cleaning liquid stops flowing to the bottom first telescopic rod 3, continues to flow to the upper first telescopic rod 3, then start the second telescopic rod 404, the telescopic end of the second telescopic rod 404 moves downward, the second telescopic rod 404 drives the sliding rod 403 to move downward, the sliding rod 403 drives the top cover mechanism 5 and the bottom sleeve mechanism 6 to move downward, at this time the first bottom sleeve 606 moves downward along the inner curved surface of the middle sleeve shell 801, the cleaning liquid level in the inner cavity of the middle sleeve shell 801 is lowered, and the wafer in the inner cavity of the middle sleeve shell 801 moves downward with the cleaning liquid level. At this time, the inner sleeve shell 901 moves downward and is slidably connected with the inner curved surface of the middle sleeve shell 801, and fills the cleaning liquid above the wafer on the inner curved surface of the middle sleeve shell 801, so that the wafer is located in the middle of the cleaning liquid in the inner cavity of the middle sleeve shell 801. Then start the first telescopic rod 3, so that the telescopic ends of the upper and lower first telescopic rods 3 are separated from the top shell 501 and the bottom shell 601, and then start the driving part 401. The output end of the driving part 401 drives the top cover mechanism 5, the bottom sleeve mechanism 6 and the outer ring mechanism 7 to flip up and down through the sleeve block 402 and the second telescopic rod 404, and the outer ring mechanism 7 drives the middle ring mechanism 8 to flip up and down. At this time, the second telescopic rod 404 is started again, and the second telescopic rod 404 continues to drive the top cover mechanism 5 and the bottom sleeve mechanism 6 upward through the sliding rod 403. The top cover mechanism 5 drives the inner ring mechanism 9 to move upward along the inner curved surface of the middle sleeve shell 801. The top cover mechanism 5 and the inner ring mechanism 9 push the wafer again to the upper side of the inner curved surface of the middle sleeve shell 801 through the cleaning liquid in the inner cavity of the middle sleeve shell 801, and the first telescopic rod 3 is started. At this time, the telescopic end of the upper first telescopic rod 3 is slidably connected with the bottom shell 601, and the telescopic end of the lower first telescopic rod 3 is slidably connected with the top shell 501. At this time, the top cover mechanism 5 cleans the upper surface of the wafer, so as to realize the flipping of the wafer.

[0031] In addition, when the device is used, the second telescopic rod 404 is started to drive the top cover mechanism 5 and the bottom sleeve mechanism 6 to move downwards through the sliding rod 403. When the top cover mechanism 5 drives the inner ring mechanism 9 to move downwards along the inner curved surface of the middle sleeve shell 801 to contact the top end of the electromagnetic seat 504, the power supply of the inner electromagnetic coil 505 is disconnected at this time, the electromagnetic coil 505 stops adsorbing the inner sleeve shell 901, the third magnetic ring 804 adsorbs the fourth magnetic ring 903, and the inner sleeve shell 901 is sleeved on the inner curved surface of the middle sleeve shell 801. When the second telescopic rod 404 drives the top cover mechanism 5 and the bottom sleeve mechanism 6 to move upwards through the sliding rod 403, the top cover mechanism 5 is separated from the inner ring mechanism 9, and at the same time, the bottom sleeve mechanism 6 moves upwards, the inner sleeve shell 901 presses the first bottom sleeve 606 to drive the second sliding block 607 to slide downwards, the second sliding block 607 pulls the second elastic member 608 to elongate, and the bottom shell 601 slides upwards to be sleeved on the bottom of the inner curved surface of the inner sleeve shell 901, so that the small-sized wafer is placed on the inner curved surface of the inner ring mechanism 9, and the small-sized wafer is cleaned. On the contrary, the middle sleeve shell 801 is sleeved on the outer curved surface of the inner sleeve shell 901 upwards, and the large-sized wafer is cleaned.

[0032] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0033] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer backside cleaning device for semiconductor production, characterized in that: The system includes two first mounting brackets (1), and two second mounting brackets (2) are symmetrically fixedly mounted on the upper and lower sides of the middle of the two first mounting brackets (1). A first telescopic rod (3) is fixedly mounted in the middle of the middle of the telescopic shaft of the first telescopic rod (3). A central hole is opened in the middle of the telescopic shaft of the first telescopic rod (3). A clamping mechanism (4) is provided in the middle of the middle of the two first mounting brackets (1). The clamping mechanism (4) includes a driving component (401). The driving component (401) is fixedly mounted in the middle of the side of the first mounting bracket (1) away from the first telescopic rod (3). The output shaft of the driving component (401) is movably sleeved with the first mounting bracket (1). A sleeve block (402) is fixedly mounted on the side of the output end of the driving component (401) close to the first telescopic rod (3). The side of the sleeve block (402) away from the first telescopic rod (3) A sliding rod (403) is slidably connected to a sleeve block (402). The contact surface between the sliding rod (403) and the sleeve block (402) is a smooth surface. A second telescopic rod (404) is fixedly connected to the side of the sleeve block (402) near the first telescopic rod (3). The telescopic end of the second telescopic rod (404) is fixedly connected to the sliding rod (403). A top cover mechanism (5) is provided on the upper part of the two clamping mechanisms (4). The top cover mechanism (5) includes a top shell (501). The top shell (501) is fixedly connected to the upper part of the two sliding rods (403). A bottom sleeve mechanism (6) is provided at the bottom of the two clamping mechanisms (4). An outer ring mechanism (7) is provided in the middle of the two clamping mechanisms (4). A middle ring mechanism (8) is provided in the middle of the outer ring mechanism (7). An inner ring mechanism (9) is sleeved on the outside of the top cover mechanism (5). The outer ring mechanism (7) includes an outer shell (701), which is fixedly installed in the middle of the two sleeve blocks (402). The upper and lower sides of the inner curved surface of the outer shell (701) are symmetrically provided with first guide grooves (702). The upper and lower sides of the inner curved surface of the outer shell (701) are symmetrically provided with first magnetic rings (703). The magnetic directions of the first magnetic ring (703) and the second magnetic ring (803) are opposite on the side adjacent to each other. The middle ring mechanism (8) includes a middle shell (801), which is slidably sleeved on the middle part of the outer shell (701). The upper and lower sides of the inner curved surface of the middle shell (801) are symmetrically provided with second guide grooves (802). The upper and lower sides of the outer curved surface of the middle shell (801) are symmetrically fixedly sleeved with second magnetic rings (803). The upper and lower sides of the inner curved surface of the middle shell (801) are symmetrically fixedly sleeved with third magnetic rings (804). The magnetic direction of the third magnetic ring (804) and the fourth magnetic ring (903) adjacent to each other is opposite. The inner ring mechanism (9) includes an inner shell (901), which is slidably sleeved on the bottom of the outer curved surface of the top shell (501). The upper and lower sides of the inner curved surface of the inner shell (901) are symmetrically provided with third guide grooves (902). The upper and lower sides of the outer curved surface of the inner shell (901) are symmetrically fixedly installed with two fourth magnetic rings (903). The outer curved surface of the inner shell (901) and the inner curved surface of the middle shell (801) are both smooth surfaces.

2. The semiconductor wafer backside cleaning equipment for semiconductor production according to claim 1, characterized in that: The upper part of the inner curved surface of the top shell (501) is fixedly sleeved with a first sleeve (502), and the middle part of the first sleeve (502) is fixedly sleeved with a first one-way valve (503). The output port of the first one-way valve (503) faces the outer ring mechanism (7). The telescopic end of the upper first telescopic rod (3) is slidably sleeved with the top shell (501). The upper part of the outer curved surface of the top shell (501) is fixedly installed with an electromagnetic seat (504). The bottom of the electromagnetic seat (504) is fixedly sleeved with two electromagnetic coils (505) of different diameters. One electromagnetic coil (505) is located inside the other electromagnetic coil (505).

3. The semiconductor wafer backside cleaning equipment for semiconductor production according to claim 2, characterized in that: The bottom sleeve mechanism (6) includes a bottom shell (601), which is fixedly connected to the bottom of the two sliding rods (403). A second sleeve (602) is fixedly sleeved on the inner curved surface of the bottom shell (601). A second one-way valve (603) is fixedly sleeved in the middle of the second sleeve (602). The output port of the second one-way valve (603) faces the outer ring mechanism (7). A plurality of first guide grooves are equidistantly opened on the circumference of the outer curved surface of the bottom shell (601). A first mounting groove is opened at the top of the first guide groove. A first sliding block (604) is slidably sleeved in the middle of the first guide groove. A first elastic element (605) is fixedly installed at the bottom of the inner cavity of the first sliding block (604). The top of the first elastic element (605) is fixedly connected to the top of the first mounting groove. The bottom shell (601) A first base sleeve (606) is slidably fitted onto the outer curved surface. The contact surface between the base shell (601) and the first base sleeve (606) is a smooth surface. The first sliding block (604) is fixedly connected to the bottom of the inner curved surface of the first base sleeve (606). A plurality of second guide grooves are equidistantly opened on the circumference of the outer curved surface of the first base sleeve (606). A second mounting groove is opened at the top of the second guide groove. A second sliding block (607) is slidably fitted onto the middle of the second guide groove. A second elastic element (608) is fixedly installed at the bottom of the inner cavity of the second sliding block (607). The top of the second elastic element (608) is fixedly connected to the top of the second mounting groove. A second base sleeve (609) is slidably fitted onto the outer curved surface of the first base sleeve (606). The second sliding block (607) is fixedly connected to the bottom of the inner curved surface of the second base sleeve (609).

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