Vibration suppression device for hybrid bonding equipment and hybrid bonding method

Abstract

The invention relates to the technical field of semiconductors, in particular to a vibration suppression device for hybrid bonding equipment and a hybrid bonding method. The vibration suppression device is installed between a placing mechanism front end and a placing mechanism tail end of the hybrid bonding equipment. The vibration suppression device comprises a first vibration assembly, a second vibration assembly and a piezoelectric vibration driving device. The first vibration assembly and the second vibration assembly are arranged in a stacked mode. The piezoelectric vibration driving device comprises a first piezoelectric motor and a second piezoelectric motor; the first vibration assembly and the second vibration assembly can drive the tail end of the containing mechanism to vibrate in the first direction and the second direction correspondingly. According to the method, the vibration generated in the movement of the placing mechanism can be actively counteracted, and the vibration does not need to be automatically attenuated to the target precision requirement, so that the time of placing the chip to the target position by the hybrid bonding equipment is shortened, and the production efficiency of the hybrid bonding equipment is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular, to a vibration suppression device and a hybrid bonding method for a hybrid bonding device. Background Art

[0002] In emerging fields such as artificial intelligence, 5G communication, and the Internet of Things, higher requirements are put forward for the performance, power consumption, and size of chips. As the semiconductor process size continues to shrink, according to the traditional planar integration method, it is increasingly difficult to improve chip performance, and the cost also increases sharply. In order to continue to improve chip performance, integration density, and functional diversity, new integration methods need to be sought, and 3D integration technology has emerged, and hybrid bonding is one of the key technologies to achieve 3D integration.

[0003] Hybrid bonding is a technology that combines two or more different bonding mechanisms to achieve high-precision and high-performance connections between materials. Commonly, metal bonding and dielectric bonding are combined. Metal-metal bonding is used to achieve good electrical connection, and dielectric-dielectric bonding is used to provide mechanical stability and insulation performance. In order to achieve a high-precision and high-quality bonding process, a hybrid bonding device usually includes wafer pretreatment, bonding material coating, alignment bonding, inspection and quality control, post-processing, and other links.

[0004] In the alignment bonding link, the chip needs to be placed at an accurate position to ensure bonding quality, and the position accuracy requirement needs to reach the micron level or even the nanometer level. However, when the placement mechanism moves the chip at high speed, affected by factors such as vibration, impact, and inertia, there will still be slight vibrations at the end of the placement mechanism after it reaches the placement position. It is necessary to wait for a period of time or reduce the placement speed until the vibration stabilizes within the process requirements before the next process can be carried out. This has an impact on the production efficiency of the hybrid bonding device.

[0005] How to improve the placement speed and reduce the waiting time while ensuring the placement accuracy, and thus improve the production efficiency is a major problem. The prior art uses the method of adding active or passive vibration isolation pads to the device to reduce the vibration and impact of the machine table, but this method can only reduce the overall vibration and impact of the device and cannot eliminate the vibration caused by the movement inertia at the end of the placement mechanism. The prior art also uses the method of reducing the weight of the placement mechanism to reduce the influence of inertia, but reducing the weight may affect the structural strength and rigidity of the placement mechanism and exacerbate the vibration. How to balance the weight and structural strength and rigidity is also a major problem.

[0006] In addition, in the prior art, after a sensor measures the vibration at the end of the placement mechanism, a specific motion control algorithm is used to optimize the motion parameters of the placement mechanism to reduce the motion impact, and further reduce the vibration at the end of the placement mechanism. However, how to ensure the accuracy and stability of the sensor detection data is also a major problem. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a vibration suppression device and a hybrid bonding method for a hybrid bonding device.

[0008] The technical solution of the present invention for solving the above technical problems is as follows: The present invention provides a vibration suppression device for a hybrid bonding device. The vibration suppression device is installed between the front end and the end of the placement mechanism of the hybrid bonding device. The vibration suppression device includes a first vibration component, a second vibration component, and a piezoelectric vibration driving device. The first vibration component and the second vibration component are arranged in a stacked manner. The piezoelectric vibration driving device includes a first piezoelectric motor and a second piezoelectric motor. The first vibration component and the second vibration component can drive the end of the placement mechanism to vibrate along a first direction and a second direction respectively.

[0009] The beneficial effects of the present invention are as follows: Through the cooperation of the piezoelectric vibration driving device and the vibration components, the vibration components can vibrate in a specified direction. By respectively arranging vibration components that can vibrate in two directions, the vibration characteristic information of the placement mechanism obtained can be decomposed, so that the vibration suppression device can better actively cancel the vibration without waiting for the vibration to decay to the target accuracy requirement by itself, effectively shortening the time for the hybrid bonding device to place the chip to the target position and improving the production efficiency of the hybrid bonding device.

[0010] On the basis of the above technical solution, the present invention can be further improved as follows.

[0011] Further, the first vibration component includes a first fixed seat and a first slider. The first slider is slidably connected to the first fixed seat and can move relative to the first fixed seat along the first direction. The second vibration component includes a second fixed seat and a second slider. The second slider is slidably connected to the second fixed seat and can move relative to the second fixed seat along the second direction. The first fixed seat is fixedly connected to the front end of the placement mechanism, the first slider is fixedly connected to the second fixed seat, and the second slider is fixedly connected to the end of the placement mechanism.

[0012] The beneficial effect of adopting the above further solution is that by setting the structure of the fixed seat and the slider, the vibration process of the vibration component can be kept stable and controllable.

[0013] Further, the upper wall of the first fixed seat is fixedly connected to the lower side of the front end of the placement mechanism; the lower wall and both side walls of the first fixed seat are open, and the open side walls are the two side walls in the first direction. A first hollow chute is provided inside the first fixed seat. The first slider is slidably connected to the first hollow chute, and the lower side of the first slider is fixedly connected to the second fixed seat. The first piezoelectric motor includes a first stator and a first mover. The first mover can reciprocate relative to the first stator along the first direction; the first stator is fixed on the first fixed seat, and the first mover is fixed on the first slider.

[0014] The beneficial effect of adopting the above further solution is that the stability of the sliding process can be further ensured through the first hollow chute. The first mover of the first piezoelectric motor is fixed on the first slider, which can directly drive the vibration of the first slider, making the driving effect better.

[0015] Further, the lower wall and both side walls of the second fixed seat are open, and the open side walls are the two side walls in the second direction. A second hollow chute is provided inside the second fixed seat. The second slider is slidably connected to the second hollow chute, and the lower side of the second slider is fixedly connected to the end of the placement mechanism. The second piezoelectric motor includes a second stator and a second mover. The second mover can reciprocate relative to the second stator along the second direction; the second stator is fixed on the second fixed seat, and the second mover is fixed on the second slider.

[0016] The beneficial effect of adopting the above further solution is that the stability of the sliding process can be further ensured through the second hollow chute. The second mover of the second piezoelectric motor is fixed on the second slider, which can directly drive the vibration of the second slider, making the driving effect better.

[0017] Further, the longitudinal cross-sections of the first hollow chute and the second hollow chute are both T-shaped.

[0018] The beneficial effect of adopting the above further solution is that it can make the sliding more stable. The two sides of the slider are included in the upper part of the T-shape. At the same time, the slider can be well fixedly connected to the second fixed seat or the end of the placement mechanism through the lower part of the T-shape.

[0019] Further, on the horizontal plane, the straight line where the first direction is located and the straight line where the second direction is located are perpendicular to each other.

[0020] The beneficial effect of adopting the above further solution is that by setting the first direction and the second direction to be orthogonal, the calculation process can be simplified, and the decomposed vibration information can be made more accurate and scientific.

[0021] The present invention also provides a hybrid bonding device, which includes the vibration suppression device as described above, and further includes a control element, and the control element is electrically connected to the piezoelectric vibration driving device.

[0022] The present invention also provides a hybrid bonding method, which uses the device as described above to perform hybrid bonding on the media of at least two materials.

[0023] The hybrid bonding method of the present invention can actively cancel the vibration generated during the movement of the placement mechanism, without waiting for the vibration to decay to the target accuracy requirement by itself, thereby shortening the time for the hybrid bonding device to place the chip to the target position and improving the production efficiency of the hybrid bonding device.

[0024] Further, it includes a step of aligning and bonding the media of two materials, and the step of aligning and bonding is as follows: The control element acquires the motion signal of the placement mechanism and processes it to obtain vibration signals along the first direction and the second direction; The control element respectively controls the first piezoelectric motor and the second piezoelectric motor to vibrate according to the vibration signals, drives the first vibration assembly and the second vibration assembly to slide, and drives the end of the placement mechanism to vibrate and cancel the vibration along the first direction and the second direction.

[0025] Further, the vibration signals include vibration frequency, amplitude, and attenuation law. Description of the Drawings

[0026] Figure 1 It is a schematic structural diagram of the vibration suppression device for the hybrid bonding device of the present invention; Figure 2 It is a schematic structural diagram of the second piezoelectric motor of the vibration suppression device for the hybrid bonding device of the present invention.

[0027] In the drawings, the list of components represented by each reference numeral is as follows: 1. Front end of the placement mechanism; 2. First vibration assembly; 21. First fixed seat; 22. First slider; 3. Second vibration assembly; 31. Second fixed seat; 32. Second slider; 4. End of the placement mechanism; 5. First piezoelectric motor; 51. First stator; 52. First rotor; 6. Second piezoelectric motor; 61. Second stator; 62. Second rotor; 7. Piezoelectric displacement device controller; 8. Motion control system. Detailed implementation manner

[0028] The principles and features of the present invention will be described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention.

[0029] As Figure 1 、 Figure 2 As shown, the vibration suppression device for a hybrid bonding device of the present invention is installed between the front end 1 and the end 4 of the placement mechanism of the hybrid bonding device; the vibration suppression device includes a first vibration component 2, a second vibration component 3, and a piezoelectric vibration driving device; the first vibration component 2 and the second vibration component 3 are stacked; the piezoelectric vibration driving device includes a first piezoelectric motor 5 and a second piezoelectric motor 6; the first vibration component 2 and the second vibration component 3 can drive the end 4 of the placement mechanism to vibrate along the first direction and the second direction respectively.

[0030] The vibration suppression device for a hybrid bonding device of the present invention is arranged between the front end 1 and the end 4 of the placement mechanism of the existing hybrid bonding device. Through the cooperation of the piezoelectric vibration driving device and the vibration component, the vibration component can vibrate in a specified direction; by respectively arranging vibration components that can vibrate in two directions, the vibration characteristic information of the obtained placement mechanism can be decomposed, so that the vibration suppression device can better actively cancel the vibration without waiting for the vibration to decay to the target accuracy requirement by itself, effectively shortening the time for the hybrid bonding device to place the chip to the target position and improving the production efficiency of the hybrid bonding device.

[0031] The piezoelectric vibration driving device of the present invention can obtain the motion information of the placement device through a control element, and the control element can be set independently or integrated into the motion control system of the hybrid bonding device, so that there is no need to additionally install an external sensor to check the vibration of the end mechanism, and the stability is better.

[0032] Specifically, according to the motion parameter characteristics when the motion control system of the hybrid bonding device controls the placement mechanism to move towards the target position, the control element can calculate information such as the amplitude and frequency of the vibration caused by the current actual motion, and send it to the piezoelectric vibration driving device in the form of a voltage signal, so that it generates a vibration mode opposite to the vibration displacement of the placement mechanism, thereby canceling the vibration of the placement mechanism. For different motion directions and motion speed parameters, the control element will adaptively generate different voltage signals and act on the piezoelectric vibration driving device to cancel the vibration, which can well improve the in-place accuracy of the end 4 of the placement mechanism in the hybrid bonding device and can reduce the in-place time, thereby improving the production efficiency of the hybrid bonding device.

[0033] Preferably, the first vibration assembly 2 includes a first fixed seat 21 and a first slider 22. The first slider 22 is slidably connected to the first fixed seat 21 and can move relative to the first fixed seat 21 in a first direction. The second vibration assembly 3 includes a second fixed seat 31 and a second slider 32. The second slider 32 is slidably connected to the second fixed seat 31 and can move relative to the second fixed seat 31 in a second direction. The first fixed seat 21 is fixedly connected to the front end 1 of the placement mechanism, the first slider 22 is fixedly connected to the second fixed seat 31, and the second slider 32 is fixedly connected to the end 4 of the placement mechanism. In the above structure, the slider and the fixed seat are slidably connected, which can achieve stable vibration. When the first slider 22 moves in the first direction, it can drive the second fixed seat 31, the second slider 32, and the end 4 of the placement mechanism to move in the first direction simultaneously. When the second slider 32 moves in the second direction, it can drive the end 4 of the placement mechanism to move in the second direction. In this way, the end 4 of the placement mechanism can move in the first direction and the second direction, making the suppression of vibration more accurate and flexible.

[0034] The sliding connection between the slider and the fixed seat can be specifically realized by various forms of structures, such as slide rails, chutes, etc.

[0035] In an embodiment of the present invention, the upper wall of the first fixed seat 21 is fixedly connected to the lower side of the front end 1 of the placement mechanism. The lower wall and both side walls of the first fixed seat 21 are open. The open side walls are the two side walls in the first direction. A first hollow chute is provided inside the first fixed seat 21, and the first slider 22 is slidably connected to the first hollow chute. The lower side of the first slider 22 is fixedly connected to the second fixed seat 31. The first slider 22 is slidably connected to the first hollow chute, which can make the first slider 22 have good stability during sliding. The lower wall of the first fixed seat 21 is open to allow the first slider 22 to be fixedly connected to the second fixed seat 31, and the two side walls of the first fixed seat 21 are open to allow the first slider 22 to expand and contract during vibration.

[0036] Preferably, the first piezoelectric motor 5 includes a first stator 51 and a first mover 52. The first mover 52 can reciprocally vibrate relative to the first stator 51 in a first direction. The first stator 51 is fixed on the first fixed seat 21, and the first mover 52 is fixed on the first slider 22. In this way, when the first mover 52 reciprocally vibrates in the first direction, it can drive the first slider 22 to reciprocally vibrate synchronously.

[0037] It should be noted that theoretically, a limiting device can be provided on the first slider 22 and / or the first fixed seat 21 to prevent the problem that the first slider 22 disengages from the first fixed seat 21 due to excessive vibration amplitude. Such a limiting device can adopt various conventional structures according to actual situations. However, in actual use, since the vibration amplitude of the placement mechanism is often very small, and the sizes of the first slider 22 and the first fixed seat 21 are large enough, even if the limiting device is not provided, the problem of sliding and disengaging will not occur. For the sake of simplifying the structure, the limiting device can also be not provided.

[0038] The specific structures of the second fixed seat 31 and the second slider 32 can be the same as or different from the specific sliding fit structures of the first fixed seat 21 and the first slider 22. In an embodiment of the present invention, the two are the same, and the specific structure is as follows: Preferably, the lower wall and two side walls of the second fixed seat 31 are open. The two open side walls are the two side walls in the second direction. A second hollow sliding groove is provided in the second fixed seat 31; the second slider 32 is slidably connected to the second hollow sliding groove, and the lower side of the second slider 32 is fixedly connected to the end 4 of the placement mechanism.

[0039] Preferably, the second piezoelectric motor 6 includes a second stator 61 and a second mover 62. The second mover 62 can reciprocally vibrate relative to the second stator 61 along the second direction; the second stator 61 is fixed on the second fixed seat 31, and the second mover 62 is fixed on the second slider 32.

[0040] The effects of the above structure are the same as those of the specific structures of the first fixed seat 21 and the first slider 22.

[0041] Preferably, the longitudinal cross-sections of the first hollow sliding groove and the second hollow sliding groove of the present invention are both T-shaped; by adopting the hollow sliding groove with this structure, more stable sliding can be achieved. The two sides of the slider are included in the upper part of the T shape. At the same time, the slider can be well fixedly connected to the second fixed seat 31 or the end 4 of the placement mechanism through the lower part of the T shape.

[0042] Preferably, in the present invention, on the horizontal plane, the straight line where the first direction is located and the straight line where the second direction is located are perpendicular to each other; setting the first direction and the second direction to be orthogonal can simplify the calculation process and make the decomposed vibration information more accurate and scientific.

[0043] The hybrid bonding device of the present invention includes the vibration suppression device as described above.

[0044] The hybrid bonding method of the present invention uses the device as described above to perform hybrid bonding on the media of at least two materials; this method includes an alignment bonding step for the media of the two materials, and the alignment bonding step is: The control element acquires the motion signal of the placement mechanism and processes it to obtain the vibration signals along the first direction and the second direction; The control element controls the vibrations of the first piezoelectric motor 5 and the second piezoelectric motor 6 respectively according to the vibration signal, drives the first vibration assembly 2 and the second vibration assembly 3 to slide, and drives the end 4 of the placement mechanism to vibrate and cancel the vibrations along the first direction and the second direction.

[0045] Preferably, the vibration signal includes a vibration frequency, an amplitude, and an attenuation law.

[0046] The end 4 of the placement mechanism located at the end in the vertical direction (Z direction) will generate a jitter after moving in place in the first direction (X direction) and the second direction (Y direction). The frequency, initial phase angle, and amplitude of this jitter can be predicted by the feedback positions of the grating scales in the X direction and Y direction on the hybrid bonding equipment collected by the motion control system 8 of the hybrid bonding equipment when calibrating the jitters in the X direction and Y direction. At the same time, the piezoelectric displacement device controller 7 drives the first piezoelectric motor 5 and the second piezoelectric motor 6 installed between the front end 1 of the placement mechanism in the Z direction and the end 4 of the placement mechanism to generate vibrations in the X direction and Y direction with a waveform having a certain phase angle difference from the aforementioned jitter respectively, so as to cancel the jitter of the end 4 of the placement mechanism (i.e., the chip mounting head), thereby improving the efficiency and accuracy of hybrid bonding.

[0047] Among them, "calibration" is a professional term or idiom in motion control science, which refers to the final stage when the motion control system controls the motion device to move towards the theoretically specified position. The motion device will not immediately reach the position and precisely stop at the theoretically specified position. There will be a certain error (i.e., the in-position error) between the actual position of the motion device and the theoretically specified position. At this time, the motion control system will enter the error correction stage (i.e., the calibration stage), and use control principles such as PID control to adjust the in-position error to the target range.

[0048] Generally, there will be a position feedback device such as a grating scale to detect the actual position of the motion device, and adjust it when the feedback position is different from the theoretically specified position. Specifically, when the feedback position is farther than the theoretically specified position, the motion control system 8 controls the motion device to callback. When the feedback position has not reached the theoretically specified position, the motion control system 8 controls the motion device to continue moving. If it exceeds the theoretically specified position after continuing to move, it will continue to callback. After such repeated adjustments, the error is finally adjusted to the required range.

[0049] However, the error during the above "calibration" only reflects the error at the position where the grating scale is located. Even after the calibration is completed, the end 4 of the placement mechanism may still vibrate due to reasons such as structural rigidity. The error caused by this vibration is still relatively large and will also have a greater impact on the processing accuracy of the equipment. Moreover, this vibration cannot be adjusted during the above calibration process. In the prior art, it is necessary to wait for the end 4 of the placement mechanism to naturally stabilize. In addition, the initial vibration generated when moving into place will also affect the calibration process and increase the calibration time.

[0050] In the hybrid bonding method of the present invention, the piezoelectric displacement device controller 7 can drive two motors to actively cancel the vibration of the end 4 of the placement mechanism generated after reaching the position, without waiting for the vibration to naturally decay to the target accuracy requirement. Thus, the time for the hybrid bonding equipment to place the chip to the target position is shortened, and the production efficiency of the hybrid bonding equipment is improved.

[0051] The following specifically describes the device and method of the present invention through specific embodiments.

[0052] Embodiment

[0053] In this embodiment, the straight line in the first direction and the straight line in the second direction are perpendicular to each other and are respectively defined as the X direction and the Y direction. The control element is the piezoelectric displacement device controller 7.

[0054] The first piezoelectric motor 5 and the second piezoelectric motor 6 are respectively connected to the piezoelectric displacement device controller 7 through wires. The piezoelectric displacement device controller 7 is integrated into the motion control system 8 of the hybrid bonding equipment by means of EtherCAT industrial bus communication through a network cable.

[0055] The specific working process of this embodiment is as follows: When the motion control system of the hybrid bonding equipment controls the placement mechanism of the hybrid bonding equipment to perform the placement motion of the chip, the piezoelectric displacement device controller 7 obtains motion parameters such as acceleration feedforward when the placement mechanism reaches the position from the motion control system, and calculates the frequency, amplitude, and attenuation law of the vibration that will be generated after the placement mechanism moves to the position in combination with empirical parameters.

[0056] Then, according to the motion direction, the piezoelectric displacement device controller 7 decomposes the vibration into vibrations in the X and Y directions, thereby respectively generating two voltage signals with the same frequency as the vibration, opposite amplitudes, and the same attenuation law in a certain proportion, and respectively outputting them to the piezoelectric motor in the X direction and the piezoelectric motor in the Y direction.

[0057] After the first piezoelectric motor 5 receives a voltage signal, the first mover 52 will generate a corresponding displacement in the X direction, thereby driving the first slider 22 to generate a corresponding displacement. The first slider 22 drives the second fixed seat 31, the second slider 32, and the end 4 of the placement mechanism to generate corresponding displacements in the X direction as a whole.

[0058] After the second piezoelectric motor 6 receives a voltage signal, the second mover 62 will generate a corresponding displacement in the Y direction, thereby driving the second slider 32 to generate a corresponding displacement. The second slider 32 drives the end 4 of the placement mechanism to generate a corresponding displacement in the Y direction.

[0059] In this way, after the displacements of the end 4 of the placement mechanism in the X direction and the Y direction are superimposed, its displacement is exactly the same as the frequency of the vibration generated after the placement mechanism reaches its position, with the amplitude opposite and the attenuation law being the same, thereby achieving the effect of suppressing the vibration of the placement mechanism when it reaches its position.

[0060] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0061] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0062] In the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0063] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0064] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0065] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A vibration suppression device for a hybrid bonding device, characterized in that: The vibration suppression device is installed between the front end (1) of the placement mechanism and the rear end (4) of the placement mechanism of the hybrid bonding device; the vibration suppression device comprises a first vibration component (2), a second vibration component (3) and a piezoelectric vibration driving device; The first vibration component (2) and the second vibration component (3) are arranged in a stacked manner; the piezoelectric vibration driving device comprises a first piezoelectric motor (5) and a second piezoelectric motor (6); The first vibration component (2) and the second vibration component (3) can drive the placement mechanism end (4) to vibrate in a first direction and a second direction respectively.

2. A vibration suppression device for hybrid bonding equipment according to claim 1, characterized in that: The first vibration component (2) comprises a first fixed seat (21) and a first sliding block (22); the first sliding block (22) is slidably connected to the first fixed seat (21) and is movable along the first direction relative to the first fixed seat (21); The second vibration component (3) comprises a second fixed seat (31) and a second sliding block (32); the second sliding block (32) is slidably connected to the second fixed seat (31) and is movable relative to the second fixed seat (31) along the second direction; The first fixing seat (21) is fixedly connected to the front end (1) of the placement mechanism, the first sliding block (22) is fixedly connected to the second fixing seat (31), and the second sliding block (32) is fixedly connected to the rear end (4) of the placement mechanism.

3. A vibration suppression device for hybrid bonding equipment according to claim 2, characterized in that: The upper wall of the first fixing seat (21) is fixedly connected to the lower side of the front end (1) of the placement mechanism; the lower wall and two side walls of the first fixing seat (21) are open, and the open two side walls are the two side walls in the first direction; a first hollow sliding groove is provided in the first fixing seat (21); The first sliding block (22) is slidably connected to the first hollow sliding groove, and the lower side of the first sliding block (22) is fixedly connected to the second fixing seat (31); The first piezoelectric motor (5) comprises a first stator (51) and a first mover (52), wherein the first mover (52) can reciprocate relative to the first stator (51) along the first direction; the first stator (51) is fixed on the first fixing seat (21), and the first mover (52) is fixed on the first sliding block (22).

4. A vibration suppression device for hybrid bonding equipment according to claim 3, characterized in that: The lower wall and two side walls of the second fixing seat (31) are open, the open side walls are the side walls in the second direction, and a second hollow sliding groove is provided in the second fixing seat (31); The second sliding block (32) is slidably connected to the second hollow sliding groove, and the lower side of the second sliding block (32) is fixedly connected to the end (4) of the placement mechanism; The second piezoelectric motor (6) comprises a second stator (61) and a second mover (62), and the second mover (62) can reciprocate relative to the second stator (61) along the second direction; the second stator (61) is fixed on the second fixing seat (31), and the second mover (62) is fixed on the second slider (32).

5. The vibration suppression device for hybrid bonding equipment according to claim 4, characterized in that: The longitudinal sections of the first hollow chute and the second hollow chute are both T-shaped.

6. The vibration suppression device for hybrid bonding equipment according to any one of claims 1 to 5, characterized in that: On a horizontal plane, a straight line where the first direction is located and a straight line where the second direction is located are perpendicular to each other.

7. A hybrid bonding device, characterized in that: It comprises the vibration suppression device as described in any one of claims 1 to 6, and also comprises a control element, wherein the control element is connected to the piezoelectric vibration driving device circuit.

8. A hybrid bonding method, characterized in that: The device as claimed in claim 6 is used to perform mixed bonding on media of at least two materials.

9. A hybrid bonding method according to claim 8, characterized in that: The method comprises the steps of aligning and bonding the media of two materials, wherein the aligning and bonding steps are: The control element acquires and processes the motion signal of the placement mechanism to obtain vibration signals along the first direction and the second direction; The control element controls the first piezoelectric motor (5) and the second piezoelectric motor (6) to vibrate respectively according to the vibration signal, drives the first vibration component (2) and the second vibration component (3) to slide, drives the placement mechanism end (4) to vibrate and offsets the vibration along the first direction and the second direction.

10. A hybrid bonding method according to claim 9, characterized in that: The vibration signal includes vibration frequency, amplitude and attenuation law.

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