Heat dissipation structure and electronic package thereof

Abstract

The invention provides a heat dissipation structure and an electronic packaging part thereof, the heat dissipation structure comprises a plate body which is arranged on a heating source of the electronic packaging part, and the plate body is made of metal and non-metal composite materials.

Description

Technical Field

[0001] The present invention relates to a semiconductor package structure, and more particularly to a heat dissipation structure and an electronic package thereof. Background Art

[0002] With the increasing demands for functions and processing speeds of electronic products, semiconductor chips, as the core components of electronic products, need to have higher-density electronic components and electronic circuits. Therefore, a larger amount of heat energy will be generated when the semiconductor chips are operating.

[0003] Therefore, in order to quickly dissipate the heat energy to the outside, the industry usually disposes a heat sink (Heat Sink or Heat Spreader) in the semiconductor package. The heat sink is usually combined with the back surface of the chip through a heat dissipation body such as a thermal interface material (TIM) to dissipate the heat generated by the semiconductor chip through the heat dissipation body and the heat sink.

[0004] As Figure 1 shown, in the manufacturing method of the existing semiconductor package 1, a semiconductor chip 11 is first disposed on a package substrate 10 with its active surface 11a by means of flip-chip bonding (i.e., through conductive bumps 110 and underfill 111). Then, a heat dissipation member 13 is combined with the non-active surface 11b of the semiconductor chip 11 through a heat dissipation body 12 with its top piece 130, and the support legs 131 of the heat dissipation member 13 are erected on the package substrate 10 through an adhesive layer 14. During operation, the heat energy generated by the semiconductor chip 11 is conducted to the top piece 130 of the heat dissipation member 13 through the non-active surface 11b and the heat dissipation body 12 to dissipate heat to the outside of the semiconductor package 1.

[0005] However, with the increasing functional requirements of the semiconductor chip 11, the number of its contacts (I / O) is also increasing, and the generated heat energy is also getting higher. The heat dissipation member 13 generally made of metal copper material can no longer meet the high heat dissipation requirements.

[0006] Therefore, how to overcome the above-mentioned various problems of the prior art has actually become an urgent problem to be solved at present. Summary of the Invention

[0007] In view of the above-mentioned various deficiencies of the prior art, the present invention provides a heat dissipation structure for an electronic package. The heat dissipation structure includes: a plate body disposed on a heat source of the electronic package, and a chamber is formed inside the plate body, wherein the plate body is made of a metal and non-metal composite material; and a working fluid accommodated in the chamber, which changes between a gaseous state and a liquid state through the heat energy generated by the heat source.

[0008] In the heat dissipation structure as described above, the metal is copper, aluminum, stainless steel or a combination thereof.

[0009] In the heat dissipation structure as described above, the non-metal is graphene, diamond or a combination thereof.

[0010] In the heat dissipation structure as described above, the plate body includes an upper cover and a lower cover, and the upper cover and the lower cover are assembled with each other to form the cavity therebetween.

[0011] In the heat dissipation structure as described above, a capillary structure is further included, which is disposed on the lower cover and located in the cavity.

[0012] In the heat dissipation structure as described above, a plurality of support columns are further included, which are disposed on the upper cover and located in the cavity, and abut against the capillary structure.

[0013] In the heat dissipation structure as described above, a support leg is further included, which is coupled to the lower cover for being disposed on the electronic package.

[0014] In the heat dissipation structure as described above, the support leg is annular or columnar.

[0015] The present invention further provides an electronic package, including: a circuit structure having opposite first and second sides; an electronic component disposed on the first side of the circuit structure; and the heat dissipation structure as described above, disposed on the electronic component.

[0016] In the electronic package as described above, a conductive component is further included, which is disposed on the second side of the circuit structure.

[0017] In summary, the heat dissipation structure of the present invention is made of a metal and non-metal composite material, and can have high strength characteristics to reduce the overall thickness of the heat sink, and have low density characteristics to reduce the weight, and further have high thermal conductivity characteristics to improve the heat dissipation ability, so as to combine the heat dissipation structure on the electronic component of the package, effectively meeting the high heat dissipation requirements. Description of the Drawings

[0018] Figure 1 It is a schematic cross-sectional view of a conventional semiconductor package.

[0019] Figure 2 It is a schematic cross-sectional view of the heat dissipation structure of the present invention.

[0020] Figure 3 It is a schematic cross-sectional view of the electronic package of the present invention.

[0021] Description of the Reference Numerals

[0022] 1 Semiconductor package

[0023] 10 Package substrate

[0024] 11 Semiconductor chip

[0025] 11a, 31a Active surface

[0026] 11b, 31b Non - active surface

[0027] 110, 310 Conductive bump

[0028] 111 Underfill

[0029] 12, 32 Heat sink

[0030] 13 Heat dissipation component

[0031] 130 Top sheet

[0032] 131 Support leg

[0033] 14, 34 Adhesive layer

[0034] 2 Heat dissipation structure

[0035] 20 Plate body

[0036] 21 Lower cover

[0037] 21a, 22a Inner surface

[0038] 21b, 22b Outer surface

[0039] 22 Upper cover

[0040] 23 Chamber

[0041] 24 Capillary structure

[0042] 25 Support column

[0043] 26 Support leg

[0044] 3 Electronic package

[0045] 30 Circuit structure

[0046] 30a First side

[0047] 30b Second side

[0048] 301 Insulating layer

[0049] 302 Circuit layer

[0050] 31 Electronic component

[0051] 311 Insulating material

[0052] 33 Conductive component. Detailed implementation manner

[0053] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification.

[0054] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have technical essential significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed by the present invention can cover. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope under which the present invention can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present invention can be implemented.

[0055] Figure 2 It is a schematic cross-sectional view of the heat dissipation structure 2 of the present invention. The heat dissipation structure 2 can be in the form of a vapor chamber, and it includes a plate body 20, a chamber 23, a capillary structure 24, and a plurality of support columns 25.

[0056] The plate body 20 includes a lower cover 21 and an upper cover 22. The lower cover 21 has opposite inner surface 21a and outer surface 21b, and the upper cover 22 has opposite inner surface 22a and outer surface 22b. The lower cover 21 and the upper cover 22 can be assembled with each other in a direction corresponding to the inner surfaces 21a and 22a, and after being combined, a chamber 23 is formed between the lower cover 21 and the upper cover 22.

[0057] In this embodiment, after the chamber 23 is evacuated, a working fluid is injected and contained therein. The working fluid can be water, coolant, methanol, acetone, mercury, etc. It can be phase-changed into a gaseous state after absorbing heat energy and can be phase-changed into a liquid state after cooling. During actual operation, the working liquid can simultaneously present a situation of coexistence of gaseous and liquid states in the chamber 23.

[0058] In this embodiment, the plate body 20 is made of a metal and non-metal composite material.

[0059] In one embodiment, the metal is copper (Young's modulus 0.13 TPa, density 8.9 g / cm 3 , thermal conductivity 400 W / m.k), aluminum (Young's modulus 0.07 TPa, density 2.7 g / cm 3 , thermal conductivity 315 W / m.k), stainless steel (Young's modulus 0.19 TPa, density 7.9 g / cm 3, a thermal conductivity of 16.3 W / m·K) or a combination thereof, and the non-metal is graphene (Young's modulus of 1 TPa, density of 0.22 g / cm 3 , a thermal conductivity of 5300 W / m·K), diamond (Young's modulus of 1.2 TPa, density of 3.5 g / cm 3 , a thermal conductivity of 2300 W / m·K) or a combination thereof, but the present invention is not limited thereto.

[0060] The capillary structure 24 is disposed on the inner surface 21a of the lower cover 21 and is located in the chamber 23 for adsorbing the liquid working fluid.

[0061] In this embodiment, the capillary structure 24 can be a fiber, a sintered body of particles, or a metal mesh. Among them, the sintered body of particles refers to a structure or tissue formed by sintering metal powders (such as copper) and having a plurality of capillary pores or connected through holes, and the metal mesh refers to a woven mesh formed by weaving a metal (such as copper) with a plurality of meshes, but the present invention is not limited thereto.

[0062] A plurality of support columns 25 are disposed on the inner surface 22a of the upper cover 22 and are spaced apart from each other, and are located in the chamber 23. When the lower cover 21 and the upper cover 22 are assembled with each other, the plurality of support columns 25 abut against the capillary structure 24.

[0063] In this embodiment, the plurality of support columns 25 are formed on the inner surface 22a of the upper cover 22 in an evenly distributed manner, and there is a certain distance between them to evenly support the upper cover 22 and prevent the central portion of the upper cover 22 from being recessed.

[0064] In one embodiment, the plurality of support columns 25 can be cylinders. In other embodiments, the plurality of support columns 25 can also be square columns or long strips. The plurality of support columns 25 can also be formed on the inner surface 22a of the upper cover 22 in an irregular distribution manner, for example, the support columns 25 are concentratedly arranged for the pressure concentration area.

[0065] In one embodiment, the upper cover 22 and the plurality of support columns 25 can be integrally formed, that is, the material of the plurality of support columns 25 can be the same as that of the upper cover 22.

[0066] Figure 3 is a cross-sectional schematic view of the electronic package 3 of the present invention. The electronic package 3 includes the above-mentioned Figure 2 heat dissipation structure 2, circuit structure 30, electronic component 31 and conductive component 33.

[0067] The circuit structure 30 is, for example, a substrate in the form of having a core layer or a coreless form, which includes at least one insulating layer 301 and at least one circuit layer 302 combined with the insulating layer 301, and has opposite first side 30a and second side 30b.

[0068] In addition, the material forming the circuit layer 302 is copper, and the material forming the insulating layer 301 is, for example, dielectric materials such as polybenzoxazole (PBO for short), polyimide (PI for short), prepreg (PP for short), etc., or the outermost layer can be a solder mask material with green paint.

[0069] The electronic component 31 is placed on the first side 30a of the circuit structure 30 through a plurality of conductive bumps 310, so that the electronic component 31 is electrically connected to the circuit layer 302.

[0070] In this embodiment, the electronic component 31 is an active component, a passive component, or a combination thereof. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. For example, the electronic component 31 is a semiconductor chip, which has opposite active surfaces 31a and non-active surfaces 31b. The active surface 31a has a plurality of electrode pads, and is arranged on the circuit layer 302 on the first side 30a of the circuit structure 30 by means of flip-chip through a plurality of conductive bumps 310 such as solder materials, metal pillars, or others, and is electrically connected to the circuit layer 302, and these conductive bumps 310 are coated with insulating materials 311 such as underfill or non-conductive bottom fill film (NCF); alternatively, the electronic component 31 can be directly in electrical contact with the circuit layer 302 on the first side 30a of the circuit structure 30. Therefore, there are various ways for the electronic component 31 to be electrically connected to the circuit structure 30, and it is not limited to the above.

[0071] The heat dissipation structure 2 is disposed on the non-active surface 31b of the electronic component 31 through the outer surface 21b of its lower cover 21 via the heat dissipation body 32, so that the electronic component 31 serves as a heat source to transfer heat energy to the board body 20 and the working fluid therein, and is simultaneously combined with the first side 30a of the circuit structure 30 through the support feet 26.

[0072] In this embodiment, the heat dissipation body 32 can be, for example, a thermal interface material (TIM for short), a solder material, a metal material, or other heat-conducting materials.

[0073] In this embodiment, the support feet 26 are bonded to the first side 30a of the circuit structure 30 and the outer surface 21b of the lower cover 21 through an adhesive layer 34 and are arranged around the electronic component 31. In one embodiment, the support feet 26 can be annular, but the present invention is not limited thereto, and the support feet 26 can also be columnar. For example, two cylinders are respectively located on opposite sides of the electronic component 31, or four cylinders are respectively located at the four corners of the electronic component 31.

[0074] In one embodiment, the support feet 26 can be integrally formed with the lower cover 21, that is, the material of the support feet 26 can be the same as that of the lower cover 21.

[0075] The conductive element 33 can be, for example, a solder bump, disposed on the second side 30b of the circuit structure 30 and electrically connected to the circuit layer 302.

[0076] The operation of the heat dissipation structure 2 of the present invention is as follows. The heat energy generated by the electronic component 31 (heat source) is transferred to the lower cover 21 via the heat sink 32. The working fluid (liquid state) in the capillary structure 24 absorbs the heat energy and changes into a gaseous state, and moves towards the upper cover 22 and the chamber 23 between the plurality of support columns 25. The gaseous working fluid is cooled after exchanging heat energy with the outside, and condenses into a liquid state. The liquid working fluid will move towards the lower cover 21 and be absorbed by the capillary structure 24 to perform the next heat dissipation cycle.

[0077] In summary, the heat dissipation structure of the present invention is made of a metal and non-metal composite material, which can have high strength characteristics to reduce the overall thickness of the heat sink, and low density characteristics to reduce the weight, and more has high thermal conductivity characteristics to improve the heat dissipation ability, so as to combine the heat dissipation structure on the electronic components of the package, effectively meeting the high heat dissipation requirements.

[0078] The above embodiments are used to illustrate the principles and effects of the present invention by way of example, rather than to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the patent protection of the present invention shall be as listed in the claims.

Claims

1. A heat dissipation structure for an electronic package, the heat dissipation structure comprising: A plate body is disposed on the heat source of the electronic package, and a cavity is formed inside the plate body, wherein the plate body is made of a metal and non-metal composite material; and The working fluid is contained in the chamber and changes between gas and liquid by the heat energy generated by the heat source.

2. The heat dissipation structure according to claim 1, wherein: The metal is copper, aluminum, stainless steel or a combination thereof.

3. The heat dissipation structure according to claim 1, wherein: The non-metal is graphene, diamond or a combination thereof.

4. The heat dissipation structure according to claim 1, wherein: The plate body comprises an upper cover and a lower cover, and the upper cover and the lower cover are assembled with each other to form the chamber therebetween.

5. The heat dissipation structure according to claim 4, wherein: The heat dissipation structure also includes a capillary structure, which is arranged on the lower cover and located in the chamber.

6. The heat dissipation structure according to claim 5, wherein: The heat dissipation structure also includes a plurality of supporting columns, which are arranged on the upper cover and located in the chamber and abut against the capillary structure.

7. The heat dissipation structure according to claim 4, wherein: The heat dissipation structure also includes supporting feet, which are combined with the lower cover to be arranged on the electronic package.

8. The heat dissipation structure according to claim 7, wherein: The supporting foot is ring-shaped or column-shaped.

9. An electronic package, comprising: A circuit structure having a first side and a second side opposite to each other; An electronic component is disposed on the first side of the circuit structure; as well as The heat dissipation structure according to any one of claims 1 to 8, disposed on the electronic component.

10. The electronic package of claim 9, wherein: The electronic package also includes a conductive element disposed on the second side of the circuit structure.

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