Laser light source device of VCSEL chip

Abstract

The invention provides a laser light source device of a VCSEL chip. The laser light source device comprises a light source chip, a packaging support, a structural support and an optical lens. The structural support is an integrally-formed non-metal support and is provided with a hollow channel extending in the axial direction, a first port and a second port, and the first port and the second port are oppositely arranged. The light source chip is a VCSEL chip, the packaging support packages the light source chip and then is fixedly arranged at the first port of the structural support, the optical lens is fixedly arranged at the second port of the structural support, and light emitted by the light source chip passes through the hollow channel and penetrates through the optical lens to be emitted out, so that the manufacturing cost can be remarkably saved, and the manufacturing difficulty can be reduced.

Description

Technical Field

[0001] This application belongs to the technical field of light sources, and particularly relates to a laser light source device for a VCSEL chip. Background Art

[0002] This section aims to provide background or context for the embodiments of this application described in the claims. The description herein is not admitted to be prior art merely by virtue of being included in this section.

[0003] LiDAR is widely used in fields such as machine vision, industrial inspection, and autonomous driving. With the increasingly wide range of application scenarios, the demand for LiDAR has increased significantly, and the requirements for improving the performance and reducing the cost of the key component laser in LiDAR are also getting higher and higher.

[0004] Generally speaking, the lasers in consumer-grade LiDAR modules are mainly divided into two categories: dot lasers and line lasers. At present, the two types of lasers on the market adopt the same type of chip packaging and structural assembly solutions, which are relatively high in both material costs and production efficiency, and it is difficult to meet the growing application requirements.

[0005] Application Content

[0006] In view of the problems of complex packaging structure and high cost of the laser light source device in the above-mentioned prior art, a laser light source device for a VCSEL chip is proposed. By using this laser light source device for a VCSEL chip, the above problems can be solved.

[0007] This application provides the following solutions.

[0008] In a first aspect, a laser light source device is provided, including: a light source chip, a packaging bracket, a structural bracket, and an optical lens; wherein, the structural bracket is formed as an integrally molded non-metallic bracket, having a hollow channel extending axially and opposite first and second ports; the light source chip is a VCSEL chip, the packaging bracket encapsulates the light source chip and is fixedly arranged at the first port of the structural bracket, the optical lens is fixedly arranged at the second port of the structural bracket, and the light emitted by the light source chip passes through the hollow channel and exits through the optical lens.

[0009] Preferably, the optical lens is integrally formed with the structural bracket by two-shot injection molding and / or in-mold injection molding processes.

[0010] Preferably, the optical lens is formed as an independent optical lens, the second port of the structural bracket is provided with a fitting portion for accommodating the optical lens, and the fitting portion is provided with a groove at the installation and cooperation position with the optical lens, and the groove is filled with glue.

[0011] Preferably, corresponding snap structures are provided at the installation and mating positions of the optical lens and the structural bracket, and they are fixed through the snap structures.

[0012] Preferably, an installation mechanism is integrally injection-molded on the outer wall of the structural bracket, and the laser light source device is installed on the external device through the installation mechanism.

[0013] Preferably, the installation mechanism is formed as a threaded installation mechanism, and the laser light source device is axially installed on the external device through the threaded installation structure.

[0014] Preferably, the installation mechanism is formed as a wing-shaped installation mechanism, so that the laser light source device is installed on the concave installation seat of the external device through the wing-shaped installation mechanism.

[0015] Preferably, the encapsulation bracket is formed as any one of a TO (Transmitter Outline) bracket, an injection-molded bracket, a rigid substrate bracket, or a rigid-flex board bracket.

[0016] Preferably, the encapsulation bracket is provided with electrical connection lines and / or pins and / or electrical connection pieces outward for external electrical connection.

[0017] Preferably, the encapsulation bracket and the structural bracket are movably coupled in the axial direction of the hollow channel and are closely fitted in the non-axial direction.

[0018] Preferably, the optical axis of the light source chip and the optical axis of the optical lens are offset at the position of the light source chip, and the optical axis of the light source chip and the optical axis of the optical lens are set at an eccentric angle.

[0019] Preferably, the preset offset range of the above offset setting is 0um to 300um, and the offset accuracy is ±30um.

[0020] Preferably, the light source chip is electrically connected to the die bonding platform of the encapsulation bracket by means of planar die bonding. By adjusting the die bonding position of the light source chip on the die bonding platform, the optical axis of the light source chip and the optical axis of the optical lens are offset within the preset offset range.

[0021] Preferably, the non-metallic material of the structural bracket is one or more of the following: polyphenylene sulfide PPS, polycarbonate PC.

[0022] Preferably, glass fiber material is mixed into the non-metallic material of the structural bracket.

[0023] One of the advantages of the above embodiments is to provide a laser light source device with a simple structure. Among them, an integrally formed non-metallic bracket is used as the structural bracket, and the encapsulation bracket encapsulating the light source chip and the optical lens are respectively installed on both port sides of the hollow channel of the structural bracket, which can significantly save manufacturing costs and reduce manufacturing difficulty.

[0024] Other advantages of the present application will be explained in more detail in conjunction with the following description and drawings.

[0025] It should be understood that the above description is only an overview of the technical solution of the present application, so as to more clearly understand the technical means of the present application, and thus it can be implemented in accordance with the content of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specifically illustrates the specific implementation manners of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] By reading the following detailed description of the exemplary embodiments, those of ordinary skill in the art will understand the advantages and benefits herein, as well as other advantages and benefits. The drawings are only for the purpose of illustrating the exemplary embodiments and are not considered to be a limitation of the present application. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0027] Figure 1 is an exploded view of a laser light source device provided by an embodiment of the present application;

[0028] Figure 2 is a partial structural view of a laser light source device provided by an embodiment of the present application;

[0029] Figure 3 is a structural view of a laser light source device provided by an embodiment of the present application;

[0030] Figure 4 is a structural view of a laser light source device provided by an embodiment of the present application;

[0031] Figure 5 is a structural view of a laser light source device provided by an embodiment of the present application;

[0032] Figure 6 is a structural view of a laser light source device provided by an embodiment of the present application;

[0033] Figure 7 is an installation structure view of a laser light source device provided by an embodiment of the present application;

[0034] Figure 8 is an installation structure view of a laser light source device provided by an embodiment of the present application;

[0035] Figure 9 is an installation structure view of a laser light source device provided by an embodiment of the present application;

[0036] Figure 10 is an operation view of a laser light source device provided by an embodiment of the present application;

[0037] In the accompanying drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0038] Reference numerals: laser light source device 10, light source chip 11, packaging bracket 12, pins 121, structural bracket 13, hollow channel 131, first port 132, second port 133, fitting portion 134, groove 135, threaded mounting structure 136, wing-shaped mounting mechanism 137, optical lens 14, external device 20, mounting base 21. Detailed implementation manners

[0039] Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present application can be more thoroughly understood and the scope of the present application can be fully conveyed to those skilled in the art.

[0040] In the description of the embodiments of the present application, it should be understood that terms such as "including" or "having" are intended to indicate the presence of the disclosed features, numbers, steps, actions, components, parts, or combinations thereof in this specification, and do not exclude the possibility of the presence of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0041] Unless otherwise specified, " / " means "or". For example, A / B can mean A or B; herein, "and / or" is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0042] Terms such as "first", "second", etc. are only used for convenience of description to distinguish the same or similar technical features, and cannot be understood as indicating or implying the relative importance or quantity of these technical features. Thus, the features defined by "first", "second", etc. may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of the term "plurality" is two or more than two.

[0043] In addition, it should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0044] Reference Figure 1, this application provides a laser light source device 10 for a VCSEL chip, including: a light source chip 11, a packaging bracket 12, a structural bracket 13, and an optical lens 14; wherein, the structural bracket 13 is formed as an integrally molded non-metallic bracket, which has a hollow channel 131 extending axially, and the structural bracket 13 is provided with opposite first ports 132 and second ports 133 on both sides of the hollow channel 131.

[0045] The light source chip 11 is a VCSEL chip, and the packaging bracket 12 fixes the packaged light source chip 11 at the first port 132 of the structural bracket 13. The optical lens 14 is fixedly arranged at the second port 133 of the structural bracket 13, so that the light emitted by the light source chip 11 can pass through the axial hollow channel 131 and then pass through the optical lens 11 to emit from the laser light source device 10.

[0046] Compared with the prior art, the laser light source device provided by the embodiment of this application uses an integrally molded non-metallic bracket as the structural bracket 13 that mainly supports the laser light source device, and installs the packaging bracket 12 and the optical lens 14 encapsulating the light source chip 11 at the two side ports of the structural bracket 13 respectively, significantly saving costs and reducing manufacturing difficulty.

[0047] In one embodiment, the non-metallic material of the structural bracket 13 can be polyphenylene sulfide PPS, polycarbonate PC, etc. That is, the structural bracket 13 is formed as a plastic structural bracket, and thus can be obtained by an integrally injection molding process.

[0048] Preferably, in order to increase the overall structural strength of the device, glass fiber material can be mixed into the non-metallic material (such as polyphenylene sulfide PPS, polycarbonate PC) of the structural bracket 13.

[0049] Reference Figure 2 , the optical lens 14 can be formed as an independent optical lens and tightly installed on the second port 132 of the structural bracket 13. Specifically, in order to improve the installation tightness, the second port 132 of the structural bracket 13 can be provided with a fitting portion 134 for accommodating the optical lens 14. The inner contour of the fitting portion 134 and the outer contour of the optical lens 14 are in an installation fit relationship, so that the optical lens 14 can be more tightly embedded on the structural bracket 13. Further, in order to improve the sealing performance, the fitting portion 134 is provided with a groove 135 at the installation fit position with the optical lens, and an adhesive is filled therein. It can be understood that simply filling the colloid in the installation gap between the fitting portion 134 and the optical lens 14, if less is filled, it is easy to cause the lack of colloid filling in the gap, and if too much is filled, it is easy to overflow. By setting the groove 135, the colloid filling can be more evenly and fully realized. Thus, the sealing performance can be improved, effectively isolating the intrusion of water vapor, and also avoiding the overflow of too much colloid.

[0050] Reference Figure 2 The fitting portion 134 can be formed into a stepped structure that fits with the outer edge of the optical lens 14, so that the optical lens 14 can be fixedly mounted on the stepped structure. Preferably, a groove 135 can be provided around the step of the stepped structure at a position away from the hollow channel to fill the colloid, so as to further prevent the colloid from overflowing into the hollow channel 131.

[0051] Optionally, the fitting portion 134 can also be formed into an internal thread structure that mates with the outer thread of the optical lens 14. Optionally, the fitting portion 134 can also be formed into a snap structure, in which the optical lens 14 and the structural bracket are provided with corresponding snap structures at the installation and mating positions and are fixed by the snap structures.

[0052] It can be understood that any structure of the fitting portion 134 that can be in an installation and mating relationship with the outer contour of the optical lens 14 can be applied in this application, and this application will not elaborate one by one.

[0053] In another embodiment, in order to further improve the sealing effect between the optical lens 14 and the structural bracket 13, it is not necessary to additionally install and embed the optical lens into the structural bracket, but the optical lens 14 and the structural bracket 13 can be directly integrally formed. Specifically, the optical lens 14 and the structural bracket 13 can be integrally formed by two-shot injection molding or in-mold injection molding process. The optical lens 14 can be made of a transparent plastic material, such as polycarbonate PC, polymethyl methacrylate PMMA, etc., so that the optical lens 14 can be directly formed at the second port 132 of the structural bracket 13 through the injection molding process. Thus, the assembly process can be further reduced, and better sealing effect and installation and mating accuracy can be achieved.

[0054] Reference Figure 3 and Figure 4 , on one side of the encapsulation bracket 12 facing the optical lens 14, the light source chip 11 is fixedly encapsulated, and on the side of the encapsulation bracket away from the optical lens, there are electrical pins 121 for external electrical connection.

[0055] Optionally, the above electrical pins 121 can be formed into needle-shaped metal pins, as shown in Figure 3 . The above electrical pins 121 can also be formed into sheet-shaped metal pins, as shown in Figure 4 . The above electrical pins 121 can also be formed into metal flexible wires, etc., and this application does not make specific restrictions on this.

[0056] In one embodiment, the encapsulation bracket 12 is movably coupled to the structural bracket 13 in the axial direction of the hollow channel 131 and is in close fit in the non-axial direction. Thereby, the installation error between the encapsulation bracket 12 and the structural bracket 13 in the non-axial direction is reduced, and further, the deviation error of the optical axis of the light source chip 11 in the non-axial direction is reduced.

[0057] For example, referring to Figure 3 , the encapsulation bracket 12 is a circular bracket for TO encapsulation, and the mating dimension of the structural bracket 13 at its second port 133 is a circular hole shape with a tight fit to ensure the stability of the deviation of the light source chip in the X / Y axis directions. It only needs to be moved in a single direction along the Z-axis (i.e., the axial direction of the hollow channel) until the encapsulation bracket 12 is coupled to the structural bracket 13, which can greatly improve the coupling efficiency and also avoid the deviation error of the optical axis of the light source chip 11 caused by the installation error.

[0058] For another example, referring to Figure 4 , when the encapsulation bracket 12 is square or rectangular, the mating dimension of the structural bracket 13 at its second port 133 can be designed as a square or rectangular dimension with a tight fit, which also ensures the stability of the deviation of the light source chip in the X / Y directions. It only needs to be movably coupled in a single direction along the Z-axis (i.e., the axial direction of the hollow channel), which can greatly improve the coupling efficiency and also avoid the deviation error of the optical axis of the light source chip 11 caused by the installation error.

[0059] In one embodiment, the encapsulation bracket is formed as any one of a TO (Transmitter Outline) bracket, an injection molding bracket, a rigid substrate bracket, or a rigid-flex board bracket.

[0060] Referring to Figure 5 and Figure 6 , in order to reduce the installation complexity of the client, an installation mechanism can also be designed on the outer wall of the structural bracket 13 so that the laser light source device can be installed on an external device through the installation mechanism. Preferably, the installation mechanism is directly formed by an integral molding process of the structural bracket.

[0061] Referring to Figure 5 , in one embodiment, the installation mechanism can be formed as a threaded installation mechanism 136, and the laser light source device can be axially installed on an external device through the threaded installation structure 136. For example, an axial hole can be provided on the external device, and an internal thread structure matching the threaded installation structure is provided in the axial hole, so that the laser light source device 10 can be axially installed in the axial hole of the external device by the threaded installation structure 136.

[0062] Referring to Figure 6, the above mounting mechanism can also be formed into a wing-shaped mounting mechanism 137, so that the laser light source device 10 is mounted on the concave mounting seat 21 of the external device 20 through the wing-shaped mounting mechanism 137. For example, with reference to Figure 6 , Figure 7 and Figure 8 , a horizontal wing-shaped mounting mechanism 137 can be provided on the outer wall of the structural bracket 13, and a mounting semi-hole is opened on the wing. A concave mounting seat 21 can be provided on the external device 20. The concave mounting seat 21 cooperates with the wing-shaped mounting mechanism 137 and the outer wall of the structural bracket 13, and then the wing-shaped mounting mechanism 137 can be mounted and locked to the concave mounting seat 21 by screws.

[0063] It should be understood that compared with the structural brackets made of metal materials commonly used in the prior art, since the structural brackets of the present application are made of non-metallic materials, the foregoing various complex-structured structural brackets can be realized with less manufacturing cost and lower manufacturing difficulty.

[0064] It can be understood that other types of mounting mechanisms can also be adopted in the embodiments of the present application as long as they can be fixedly connected to the external device. By providing the foregoing mounting mechanism, the mounting accessories of the client can be reduced, which is convenient for reducing the installation complexity of the client, and at the same time, the stability after installation can also be increased.

[0065] See Figure 9 , in normal use, after the foregoing laser light source device 10 is assembled with the external device 20 of the client, generally, there needs to be a horizontal elevation angle of 0 to +1.5° between the light axis of the light source of the laser light source device 10 and the horizontal plane. However, the eccentric direction of the light axis of the light source of the laser light source device in the prior art is uncertain, and generally, it is necessary to perform rotational debugging during the assembly process of the client to achieve the desired elevation angle.

[0066] Refer to Figure 10 , in order to reduce the debugging complexity during the assembly process of the client, in an embodiment of the present application, the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 are offset within a preset offset range at the position of the light source chip 11, and the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 are set at an eccentric angle. It can be understood that by controlling the offset between the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14, the eccentric angle between the optical axis a of the light source chip and the Y-axis (i.e., the optical axis b) can be controlled. When the laser light source device 10 is fixedly mounted to the external device at a set mounting angle, the Y-axis can be flush with the horizontal plane, and this eccentric angle can be used as the horizontal elevation angle. At this time, the customer does not need to debug the pitch angle during the assembly process.

[0067] Further, the light source chip 11 is electrically connected to the package bracket 12 by means of planar die bonding. By directly adjusting the die bonding position of the light source chip 11 on the package bracket 12, the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 are arranged with an offset within a preset offset range, so that the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 are arranged at an eccentric angle.

[0068] Preferably, the preset offset range is between 0 um and 300 um, and the accuracy of the offset can reach ±30 um. Furthermore, the deflection angle accuracy of the eccentric angle can be controlled to reach, for example, 1°±0.3°.

[0069] Preferably, the light emitting holes of the VCSEL chip can be arranged in various combinations, and various laser light patterns can be projected in cooperation with the optical lens. For example, the VCSEL chip can have a single light emitting hole and can generate a single point laser, that is, it can be a point laser light source. Another example is that the light emitting holes of the VCSEL chip are arranged in a single row along the light diffusion direction to generate a single one-dimensional light beam, that is, it can be a line laser light source. The present application does not make specific limitations in this regard.

[0070] In the description of this specification, the description made with reference to terms such as "some possible embodiments", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application, and the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples.

[0071] Although the spirit and principles of the present application have been described above with reference to several specific embodiments, it should be understood that the present application is not limited to the specific embodiments disclosed, and the division of each aspect does not mean that the features in these aspects cannot be combined. The present application aims to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A laser light source device for a VCSEL chip, characterized in that, include: Light source chip, packaging bracket, structural bracket and optical lens; wherein, The structural support is formed as an integrally formed non-metallic support having a hollow channel extending in the axial direction and a first port and a second port arranged opposite to each other; The light source chip is a VCSEL chip. The packaging bracket packages the light source chip and then fixes it on the first port of the structural bracket. The optical lens is fixed on the second port of the structural bracket. The light emitted by the light source chip passes through the hollow channel and through the optical lens.

2. The device according to claim 1, characterized in that, The optical lens is formed into one piece with the structural support through secondary injection molding and / or in-mold injection molding process.

3. The device according to claim 1, characterized in that, The second port of the structural support is provided with an engaging portion for accommodating the optical lens, and the engaging portion is provided with a groove at a mounting position for matching with the optical lens, and the groove is filled with glue.

4. The device according to claim 3, characterized in that, The optical lens and the structural support are provided with corresponding buckle structures at the installation matching positions, and are fixed together by the buckle structures. 5 . The device according to claim 1 , wherein the packaging bracket fixes and packages the light source chip on a side facing the optical lens, and an electrical pin is provided on a side of the packaging bracket away from the optical lens for external electrical connection. 6 . The device according to claim 1 , wherein the packaging support and the structural support are movably coupled in the axial direction of the hollow channel and are tightly fitted and connected in a non-axial direction. 7 . The device according to claim 1 , wherein the package bracket is formed as any one of a TO (Transmitter Outline) bracket, an injection molding bracket, a rigid substrate bracket, or a rigid-flex board bracket.

8. The device according to claim 1, characterized in that, A mounting mechanism is integrally formed by injection molding on the outer wall of the structural support, and the laser light source device is mounted to an external device via the mounting mechanism.

9. The device according to claim 8, characterized in that, The mounting mechanism is formed as a threaded mounting mechanism, and the laser light source device is axially mounted to an external device through the threaded mounting structure.

10. The device according to claim 8, characterized in that, The mounting mechanism is formed as a wing-shaped mounting mechanism, so that the laser light source device is mounted on a concave mounting seat of an external device through the wing-shaped mounting mechanism.

11. The device according to claim 1, characterized in that, The optical axis of the light source chip and the optical axis of the optical lens are offset at the position of the light source chip, and the optical axis of the light source chip and the optical axis of the optical lens are set at an eccentric angle.

12. The device according to claim 1, wherein The preset offset range of the offset setting is 0um to 300um, and the offset accuracy is ±30um.

13. The device according to claim 11, characterized in that, The light source chip is electrically connected to the packaging bracket by a planar die bonding method, and the optical axis of the light source chip and the optical axis of the optical lens are offset within a preset offset range by adjusting the die bonding position of the light source chip on the packaging bracket.

14. The device according to claim 1, wherein The non-metal material of the structural support is one or more of the following: polyphenylene sulfide PPS, polycarbonate PC.

15. The device according to claim 1, characterized in that, The non-metal material of the structural support is mixed with glass fiber material.

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