Micro-channel heat dissipation device and laser

Abstract

The invention relates to the technical field of lasers, in particular to a micro-channel heat dissipation device and a laser. The micro-channel heat dissipation device comprises a micro-channel layer, the micro-channel layer is provided with a water inlet, a water outlet and a heat dissipation micro-channel, and the water inlet is communicated with the water outlet through the heat dissipation micro-channel; and the heating layer is connected to the micro-channel layer and can heat the micro-channel layer. The laser comprises the micro-channel heat dissipation device. The invention provides a micro-channel heat dissipation device and a laser, so as to reduce the influence of temperature fluctuation on the laser and improve the use reliability of the laser.

Description

Technical Field

[0001] The present invention relates to the technical field of lasers, and in particular, to a microchannel heat dissipation device and a laser. Background Art

[0002] Lasers have the advantages of small size, long life, high electro-optical conversion efficiency, wide wavelength tunable range, and good reliability, and are widely used in fields such as material processing, laser navigation, and medical beauty. Usually, the electro-optical conversion efficiency of a laser is about 50%, and the remaining energy is converted into heat and dissipated. To increase the output power of the chip, the chips of lasers usually adopt the way of bar array or stack array. If the heat dissipation effect of the bar is not good, it will seriously affect the beam quality and output power of the array or stack array, and reduce the life and reliability of the laser. Therefore, with the rapid development of high-power lasers, the heat dissipation problem of the chip has become increasingly prominent.

[0003] At present, the heat dissipation methods of laser chips mainly include convective heat dissipation, semiconductor refrigeration heat dissipation, liquid cooling heat dissipation, etc. Among them, the microchannel heat dissipation device is an efficient liquid cooling heat dissipation method. The microchannel heat dissipation device is generally processed by etching and other processes on multiple layers of plates to form flow channels, and then welded and combined.

[0004] In the process of implementing the present invention, the inventors found that there are at least the following technical problems in the prior art: the existing microchannel heat dissipation device cannot preheat the laser when it is used at low temperature, and even less can control the temperature of the laser in a changing environment to adjust the optimal wavelength of the laser. Especially for lasers that need to be frequently started and stopped under complex working conditions, the temperature fluctuations generated during their operation will cause fluctuations in the wavelength of the laser, affecting the use effect of the laser.

[0005] Therefore, the present application provides a new microchannel heat dissipation device and a laser for the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a microchannel heat dissipation device to reduce the influence of temperature fluctuations on the laser, thereby improving the reliability of the laser in use.

[0007] The purpose of the present invention is also to provide a laser to further reduce the influence of temperature fluctuations on the laser, thereby improving the reliability of the laser in use.

[0008] Based on the above first purpose, the present invention provides a microchannel heat dissipation device, which includes:

[0009] A microchannel layer, the microchannel layer is provided with a water inlet, a water outlet and heat dissipation microchannels, and the water inlet is communicated with the water outlet through the heat dissipation microchannels; and

[0010] A heating layer, which is connected to the microchannel layer and can heat the microchannel layer.

[0011] Further, the microchannel heat dissipation device further includes a temperature measurement layer disposed between the microchannel layer and the heating layer. The temperature measurement layer is used to monitor the temperature of the microchannel layer, and the temperature measurement layer is electrically connected to the heating layer.

[0012] Further, the substrates of the microchannel layer, the heating layer, and the temperature measurement layer are all ceramic chips.

[0013] Further, the temperature measurement layer includes a temperature measurement plate and a temperature measurement circuit disposed on the temperature measurement plate. Both ends of the circuit of the temperature measurement circuit are connected with temperature measurement cables.

[0014] Further, the temperature measurement circuit is evenly distributed on the temperature measurement plate in a serpentine or planar spiral shape;

[0015] And / or, a plurality of the temperature measurement circuits are provided, and the plurality of temperature measurement circuits are spaced apart on the temperature measurement plate.

[0016] Further, the heating layer includes a heating plate connected to the microchannel layer and a heating circuit disposed on the heating plate. Both ends of the circuit of the heating circuit are connected with heating cables.

[0017] Further, the heating circuit is evenly distributed on the heating plate in a serpentine or planar spiral shape.

[0018] Further, the microchannel layer includes a microchannel top plate, a microchannel flow guide plate, and a microchannel bottom plate connected in sequence. The water inlet and the water outlet are both disposed on the microchannel top plate. The heat dissipation microchannel includes a first flow channel, a second flow channel, a third flow channel, and a fourth flow channel connected in sequence. The first flow channel communicates with the water inlet, and the fourth flow channel communicates with the water outlet;

[0019] Wherein, the second flow channel is disposed on the microchannel bottom plate, the fourth flow channel is disposed on the microchannel top plate, and the first flow channel and the third flow channel both penetrate through the microchannel flow guide plate; or, the first flow channel is disposed on the microchannel top plate, the third flow channel is disposed on the microchannel bottom plate, and the second flow channel and the fourth flow channel both penetrate through the microchannel flow guide plate.

[0020] Further, a first metal layer is disposed on the side of the microchannel layer away from the heating layer, and a second metal layer is disposed on the side of the heating layer away from the microchannel layer.

[0021] Adopting the above technical solutions, the microchannel heat dissipation device of the present invention has at least the following beneficial effects:

[0022] When the microchannel heat dissipation device is in use, the laser chip is arranged in the microchannel layer. When the laser is started, the laser chip can generate heat. At this time, the cooling working fluid enters the heat dissipation microchannel from the water inlet, absorbs the heat transferred by the laser chip and then discharges from the water outlet, thereby taking away the heat of the laser chip.

[0023] Among them, the microchannel heat dissipation device of this embodiment further includes a heating layer capable of heating the microchannel layer. Therefore, when the laser is used at low temperature, on the one hand, the heating layer heats the microchannel layer to prevent the cooling working fluid from condensing and frosting in the heat dissipation microchannels of the microchannel layer, which affects the normal use of the microchannel layer. On the other hand, the heating layer heats the microchannel layer, so that the heat is conducted to the laser chip through the microchannel layer to preheat the laser chip, enabling the laser to start and operate quickly and stably.

[0024] In addition, in a variable environment or complex working conditions, when the laser chip generates heat during operation, the microchannel layer is used to dissipate heat and cool down the laser chip to reduce the temperature of the laser chip. And when the temperature of the laser chip is relatively low, the heating layer heats the microchannel layer to conduct heat to the laser chip through the microchannel layer, thereby increasing the temperature of the laser chip. With such a setting, the microchannel heat dissipation device can not only dissipate heat and cool down the laser chip, but also heat up, which is convenient for accurately controlling the temperature of the laser, enabling the laser to work at an appropriate temperature, reducing the impact of temperature fluctuations on the laser, enabling the laser to maintain the best output wavelength, ensuring the stability of the laser output power, and thus improving the reliability of laser use. Especially for lasers that need to be frequently started and stopped under complex working conditions, by reducing the impact of temperature fluctuations during their operation on the laser wavelength, the stable and reliable operation of the laser is guaranteed.

[0025] In summary, the microchannel heat dissipation device of this embodiment preheats the laser when it starts through the heating layer, and compensates for the temperature when power fluctuations are caused by changes in working conditions, reducing the impact of temperature fluctuations on the laser and improving the reliability of laser use.

[0026] Based on the above second object, the present invention provides a laser, which includes the above microchannel heat dissipation device.

[0027] Adopting the above technical solution, the laser of the present invention has at least the following beneficial effects:

[0028] By arranging the above microchannel heat dissipation device in the laser, correspondingly, the laser has all the advantages of the above microchannel heat dissipation device, which will not be elaborated here. Description of the Drawings

[0029] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and thus should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0030] Figure 1 One of the structural schematic diagrams of the microchannel heat dissipation device provided by the embodiment of the present invention;

[0031] Figure 2 For Figure 1 The enlarged partial structure diagram of part A in

[0032] Figure 3 Another structural schematic diagram of the microchannel heat dissipation device provided by the embodiment of the present invention;

[0033] Figure 4 One of the structural schematic diagrams of the microchannel layer of the microchannel heat dissipation device provided by the embodiment of the present invention (in the state of showing heat dissipation microchannels);

[0034] Figure 5 Another structural schematic diagram of the microchannel layer of the microchannel heat dissipation device provided by the embodiment of the present invention (in the state of showing heat dissipation microchannels);

[0035] Figure 6 One of the structural exploded diagrams of the microchannel layer of the microchannel heat dissipation device provided by the embodiment of the present invention;

[0036] Figure 7 Another structural exploded diagram of the microchannel layer of the microchannel heat dissipation device provided by the embodiment of the present invention;

[0037] Figure 8 is the structural schematic diagram of each layer of the microchannel heat dissipation device provided by the embodiment of the present invention;

[0038] Among them, Figure 8a The structural schematic diagram of the first metal layer of the microchannel heat dissipation device;

[0039] Figure 8b The structural schematic diagram of the microchannel top plate of the microchannel heat dissipation device;

[0040] Figure 8c The structural schematic diagram of the microchannel flow guide plate of the microchannel heat dissipation device;

[0041] Figure 8d The structural schematic diagram of the microchannel bottom plate of the microchannel heat dissipation device;

[0042] Figure 8e The structural schematic diagram of the temperature measurement layer of the microchannel heat dissipation device;

[0043] Figure 8f It is a schematic structural diagram of the heating layer of the microchannel heat dissipation device;

[0044] Figure 8g It is a schematic structural diagram of the second metal layer of the microchannel heat dissipation device.

[0045] Reference numerals:

[0046] 1 - Microchannel layer; 11 - Microchannel top plate; 12 - Microchannel deflector; 13 - Microchannel bottom plate;

[0047] 21 - Water inlet; 22 - Water outlet;

[0048] 31 - First flow channel; 32 - Second flow channel; 33 - Third flow channel; 34 - Fourth flow channel;

[0049] 4 - Temperature measurement layer; 41 - Temperature measurement plate; 42 - Temperature measurement circuit; 43 - Temperature measurement cable;

[0050] 5 - Heating layer; 51 - Heating plate; 52 - Heating circuit; 53 - Heating cable;

[0051] 6 - First metal layer;

[0052] 7 - Second metal layer. Detailed implementation manners

[0053] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0054] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0055] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0056] Embodiment 1

[0057] Please refer to Figure 1 and Figure 2 in combination with Figure 8f This embodiment provides a microchannel heat dissipation device, which includes a microchannel layer 1 and a heating layer 5. The microchannel layer 1 is provided with a water inlet 21, a water outlet 22, and heat dissipation microchannels. The water inlet 21 and the water outlet 22 are communicated through the heat dissipation microchannels. The heating layer 5 is connected to the microchannel layer 1 and can heat the microchannel layer 1.

[0058] When the microchannel heat dissipation device is in use, a laser chip is connected to the microchannel layer 1. When the laser is started, the laser chip can generate heat. At this time, the cooling working fluid enters the heat dissipation microchannels from the water inlet 21, absorbs the heat transferred by the laser chip, and then discharges from the water outlet 22, thereby taking away the heat of the laser chip.

[0059] Among them, the microchannel heat dissipation device of this embodiment further includes a heating layer 5 that can heat the microchannel layer 1. Therefore, when the laser is used at a low temperature, on the one hand, the heating layer 5 heats the microchannel layer 1 to prevent the cooling working fluid from condensing and frosting in the heat dissipation microchannels of the microchannel layer 1, which affects the normal use of the microchannel layer 1. On the other hand, the heating layer 5 heats the microchannel layer 1, so that the heat is conducted to the laser chip through the microchannel layer 1 to preheat the laser chip, enabling the laser to start and operate quickly and stably.

[0060] In addition, in a variable environment or complex working conditions, when the laser chip generates heat during operation, the microchannel layer 1 is used to dissipate heat from the laser chip to lower its temperature. When the temperature of the laser chip is relatively low, the heating layer 5 is used to heat the microchannel layer 1, so as to conduct heat to the laser chip through the microchannel layer 1, thereby increasing the temperature of the laser chip. With such a setting, this microchannel heat dissipation device can not only dissipate heat and lower the temperature of the laser chip, but also heat and raise the temperature, which is convenient for precisely controlling the temperature of the laser, enabling the laser to operate at an appropriate temperature, reducing the impact of temperature fluctuations on the laser, enabling the laser to maintain the optimal output wavelength, ensuring the stability of the laser output power, and thus improving the reliability of the laser. Especially for lasers that need to be frequently started and stopped under complex working conditions, by reducing the impact of temperature fluctuations during operation on the laser wavelength, the stable and reliable operation of the laser is ensured.

[0061] In summary, for the microchannel heat dissipation device of this embodiment, the heating layer 5 is used to preheat the laser during startup and perform temperature compensation when power fluctuations occur due to changes in working conditions, reducing the impact of temperature fluctuations on the laser and improving the reliability of the laser.

[0062] Preferably, please refer to Figure 8f and Figure 3 , in this embodiment, the heating layer 5 includes a heating plate 51 connected to the microchannel layer 1 and a heating circuit 52 disposed on the heating plate 51. Both ends of the circuit of the heating circuit 52 are connected to heating cables 53.

[0063] Preferably, in this embodiment, the heating circuit 52 includes a heating resistor. With such a setting, the heating resistor generates heat by energizing the two heating cables 53.

[0064] Optionally, the heating resistor is prepared by thick film or thin film technology, and the process methods can be screen printing, magnetron sputtering, chemical vapor deposition, etc. In addition, the material of the heating resistor can be a metal such as nickel, chromium, copper, platinum, tungsten, molybdenum, gold, iron, and manganese, or a composite alloy composed of multiple of them, or a ceramic such as silicon carbide, tungsten carbide, molybdenum silicide, or tantalum nitride.

[0065] Preferably, please refer to Figure 8f , the heating circuit 52 is evenly distributed on the heating plate 51 in a serpentine or planar spiral shape.

[0066] With such a setting, the heating of the microchannel layer 1 by the heating layer 5 is uniform, which to a certain extent prevents local overheating of the microchannel layer 1 or the laser chip and affects the normal use of the laser.

[0067] Preferably, please refer to Figure 2 and in combination with Figure 8e, in this embodiment, the microchannel heat dissipation device further includes a temperature measurement layer 4 disposed between the microchannel layer 1 and the heating layer 5. The temperature measurement layer 4 is used to monitor the temperature of the microchannel layer 1, and the temperature measurement layer 4 is electrically connected to the heating layer 5.

[0068] With such a setting, through the electrical connection between the temperature measurement layer 4 and the heating layer 5, the closed-loop control of the temperature of the laser chip is jointly achieved.

[0069] Specifically, the temperature measurement layer 4 monitors the temperature of the microchannel layer 1. Since the microchannel layer 1 is used to dissipate heat and cool the laser chip, the microchannel layer 1 and the laser chip are co-heated, and their temperatures are the same. Thus, the temperature of the microchannel layer 1 monitored by the temperature measurement layer 4 is simultaneously the temperature of the laser chip, and the heating of the heating layer 5 is controlled by the temperature of the laser chip. For example, when the temperature measurement layer 4 monitors that the temperature of the laser chip reaches the preset maximum temperature, the heating layer 5 is turned off to stop heating the laser chip, for example, by cutting off the power between the heating cables 53 at both ends of the heating circuit 52. At this time, under the action of the microchannel layer 1, the temperature of the laser chip decreases; when the temperature measurement layer 4 monitors that the temperature of the laser chip drops to the preset minimum temperature, the heating layer 5 is turned on to continue heating the laser chip, for example, by energizing between the heating cables 53 at both ends of the heating circuit 52. At this time, the temperature of the laser chip increases.

[0070] In summary, the microchannel heat dissipation device jointly performs closed-loop control on the temperature of the laser chip through the temperature measurement layer 4 and the heating layer 5, so that the temperature of the laser is always controlled between the preset maximum temperature and the preset minimum temperature, achieving the effect of precise temperature control of the laser, enabling the laser to always work at the best and stable temperature point, reducing the influence of temperature fluctuations on the laser, enabling the laser to maintain the best output wavelength, and thus improving the reliability of the laser use.

[0071] Preferably, please refer to Figure 8e and Figure 3 , in this embodiment, the temperature measurement layer 4 includes a temperature measurement board 41 and a temperature measurement circuit 42 disposed on the temperature measurement board 41. Temperature measurement cables 43 are connected to both ends of the circuit of the temperature measurement circuit 42.

[0072] Preferably, in this embodiment, the temperature measurement circuit 42 includes a temperature measurement resistor. With such a setting, the resistance values of the temperature measurement resistor are monitored through the two temperature measurement cables 43. Among them, the temperature measurement layer 4 utilizes the characteristic that the resistance value of the temperature-sensitive material of the temperature measurement resistor changes with temperature, detects the resistance values at both ends of the temperature measurement resistor and converts them into temperature values to achieve temperature detection.

[0073] Optionally, the temperature measuring resistor is prepared by a thick film or thin film process, and the process method can be screen printing, magnetron sputtering, chemical vapor deposition, etc. In addition, the material of the temperature measuring resistor can be a metal of one of nickel, chromium, copper, platinum, tungsten, molybdenum, gold, iron, and manganese or a composite alloy composed of multiple kinds, or can be a ceramic such as silicon carbide, tungsten carbide, molybdenum silicide, or tantalum nitride.

[0074] Optionally, the temperature measuring circuit 42 is uniformly distributed on the temperature measuring plate 41 in a serpentine or planar spiral shape; or, a plurality of temperature measuring circuits 42 are provided, and the plurality of temperature measuring circuits 42 are arranged at intervals on the temperature measuring plate 41.

[0075] Preferably, the temperature measuring circuit 42 is uniformly distributed on the temperature measuring plate 41 in a serpentine or planar spiral shape; and a plurality of temperature measuring circuits 42 are provided, and the plurality of temperature measuring circuits 42 are arranged at intervals on the temperature measuring plate 41. For example, two, three, or four temperature measuring circuits 42 are provided, etc.

[0076] In this embodiment, please refer to Figure 8e , two temperature measuring circuits 42 are provided to achieve more accurate temperature detection of the microchannel layer 1. It should be noted that in the function simplification scheme, one temperature measuring circuit 42 can also be used.

[0077] Preferably, in this embodiment, the substrates of the microchannel layer 1, the heating layer 5, and the temperature measuring layer 4 are all ceramic chips. That is to say, the heating plate 51, the temperature measuring plate 41, the microchannel top plate 11, the microchannel diversion plate 12, and the microchannel bottom plate 13 are all ceramic chips. Among them, the main component of the ceramic chip is one or more composites of aluminum nitride, boron nitride, silicon nitride, beryllium oxide, and aluminum oxide, that is, one ceramic material can be used for all, or the above-mentioned multiple materials can be used for some functional layers.

[0078] In addition, the microchannel top plate 11, the microchannel diversion plate 12, the microchannel bottom plate 13, the temperature measuring plate 41, and the heating plate 51 are all ceramic chips, so that multiple ceramic chips are stacked and welded or integrally sintered to form a microchannel heat dissipation device, and the microchannel heat dissipation device as a whole is a flat structure.

[0079] It should be noted that in the prior art, most microchannel heat dissipation devices use pure copper plates as substrates, and there is a large difference in the thermal expansion coefficient between the laser chip and pure copper, which easily causes the laser to fail due to thermal stress problems.

[0080] In the microchannel heat dissipation device of this embodiment, each substrate is a ceramic chip. Compared with pure copper, the difference in the thermal expansion coefficient between the ceramic chip and the laser chip is greatly reduced, and the matching degree with the thermal expansion coefficient of the laser chip is significantly improved, improving the output power, conversion efficiency, and reliability of the laser chip.

[0081] Preferably, please refer to Figure 2 , and in combination withFigure 6 And Figure 7 In this embodiment, the microchannel layer 1 includes a microchannel top plate 11, a microchannel flow guide plate 12, and a microchannel bottom plate 13 that are connected in sequence. The water inlet 21 and the water outlet 22 are both arranged on the microchannel top plate 11. The heat dissipation microchannel includes a first flow channel 31, a second flow channel 32, a third flow channel 33, and a fourth flow channel 34 that are connected in sequence. The first flow channel 31 communicates with the water inlet 21, and the fourth flow channel 34 communicates with the water outlet 22.

[0082] Among them, please refer to Figure 4 , and in combination with Figure 8b , Figure 8c And Figure 8d , the second flow channel 32 is arranged on the microchannel bottom plate 13, the fourth flow channel 34 is arranged on the microchannel top plate 11, and the first flow channel 31 and the third flow channel 33 both penetrate through the microchannel flow guide plate 12; or, please refer to Figure 5 , the first flow channel 31 is arranged on the microchannel top plate 11, the third flow channel 33 is arranged on the microchannel bottom plate 13, and the second flow channel 32 and the fourth flow channel 34 both penetrate through the microchannel flow guide plate 12.

[0083] With such a setting, the microchannel top plate 11 is used to layout the water inlet 21 and the water outlet 22 of the cooling working fluid. The microchannel flow guide plate 12 is used to separate the inlet and outlet channels, so that the cooling working fluid enters from the water inlet 21, flows through the heat dissipation microchannel, and then is discharged from the water outlet 22, realizing the unidirectional flow of the cooling working fluid and enhancing the heat exchange effect.

[0084] Among them, the three ceramic sheets of the microchannel top plate 11, the microchannel flow guide plate 12, and the microchannel bottom plate 13 can be used to prepare ceramic single sheets with specific shapes by laser cutting, or ceramic sheets can be prepared by gel casting or injection molding.

[0085] Preferably, please refer to Figure 8a And Figure 8g , in this embodiment, a first metal layer 6 is arranged on the side of the microchannel layer 1 away from the heating layer 5, and a second metal layer 7 is arranged on the side of the heating layer 5 away from the microchannel layer 1.

[0086] The setting of the first metal layer 6 and the second metal layer 7 serves as the welding circuit of the laser chip, facilitating the electrical connection of the laser chip and other devices.

[0087] Specifically, the first metal layer 6 is arranged on the ceramic sheet of the microchannel top plate 11. A metallization layer can be prepared by methods such as active brazing, direct bonding, or electroplating thickening, and then a circuit layer is prepared to realize the circuit connection of the laser chip.

[0088] Embodiment Two

[0089] Embodiment 2 provides a laser, which includes the microchannel heat dissipation device of Embodiment 1. The technical features of the microchannel heat dissipation device disclosed in Embodiment 1 are also applicable to this embodiment, and the technical features of the microchannel heat dissipation device already disclosed in Embodiment 1 will not be described repeatedly.

[0090] The laser provided in this embodiment includes the above microchannel heat dissipation device, which further reduces the influence of temperature fluctuations on the laser, thereby improving the reliability of the laser during use.

[0091] The laser in this embodiment has the advantages of the microchannel heat dissipation device in Embodiment 1, and these advantages have been described in detail in Embodiment 1 and will not be repeated here.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A microchannel heat dissipation device, characterized in that, Comprising: A microchannel layer (1), the microchannel layer (1) being provided with a water inlet (21), a water outlet (22) and heat dissipation microchannels, the water inlet (21) and the water outlet (22) being communicated through the heat dissipation microchannels; and A heating layer (5), the heating layer (5) being connected to the microchannel layer (1) and capable of heating the microchannel layer (1).

2. The microchannel heat dissipation device according to claim 1, characterized in that, The microchannel heat dissipation device further includes a temperature measurement layer (4) disposed between the microchannel layer (1) and the heating layer (5), the temperature measurement layer (4) being used for monitoring the temperature of the microchannel layer (1), and the temperature measurement layer (4) being electrically connected to the heating layer (5).

3. The microchannel heat dissipation device according to claim 2, wherein, The substrates of the microchannel layer (1), the heating layer (5) and the temperature measurement layer (4) are all ceramic chips.

4. The microchannel heat dissipation device according to claim 2, wherein The temperature measurement layer (4) includes a temperature measurement plate (41) and a temperature measurement circuit (42) disposed on the temperature measurement plate (41), and temperature measurement cables (43) are connected to both ends of the circuit of the temperature measurement circuit (42).

5. The microchannel heat dissipation device according to claim 4, characterized in that, The temperature measurement circuit (42) is uniformly distributed on the temperature measurement plate (41) in a serpentine or planar spiral shape; And / or, a plurality of the temperature measurement circuits (42) are provided, and the plurality of temperature measurement circuits (42) are spaced apart on the temperature measurement plate (41).

6. The microchannel heat dissipation device according to any one of claims 1-5, characterized in that, The heating layer (5) includes a heating plate (51) connected to the microchannel layer (1) and a heating circuit (52) disposed on the heating plate (51), and heating cables (53) are connected to both ends of the circuit of the heating circuit (52).

7. The microchannel heat dissipation device according to claim 6, wherein The heating circuit (52) is uniformly distributed on the heating plate (51) in a serpentine or planar spiral shape.

8. The microchannel heat dissipation device according to any one of claims 1-5, characterized in that The microchannel layer (1) includes a microchannel top plate (11), a microchannel flow guiding plate (12) and a microchannel bottom plate (13) connected in sequence, the water inlet (21) and the water outlet (22) are both disposed on the microchannel top plate (11), the heat dissipation microchannels include a first flow channel (31), a second flow channel (32), a third flow channel (33) and a fourth flow channel (34) communicated in sequence, the first flow channel (31) communicates with the water inlet (21), and the fourth flow channel (34) communicates with the water outlet (22); Wherein, the second flow channel (32) is disposed on the microchannel bottom plate (13), the fourth flow channel (34) is disposed on the microchannel top plate (11), and the first flow channel (31) and the third flow channel (33) both penetrate through the microchannel flow guiding plate (12); or, the first flow channel (31) is disposed on the microchannel top plate (11), the third flow channel (33) is disposed on the microchannel bottom plate (13), and the second flow channel (32) and the fourth flow channel (34) both penetrate through the microchannel flow guiding plate (12).

9. The microchannel heat dissipation device according to any one of claims 1-5, characterized in that, A first metal layer (6) is disposed on a surface of the microchannel layer (1) away from the heating layer (5), and a second metal layer (7) is disposed on a surface of the heating layer (5) away from the microchannel layer (1).

10. A laser, characterized in that, Comprising the microchannel heat dissipation device according to any one of claims 1-9.

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