Power adapter circuit assembling mechanism and method

Abstract

The invention relates to the technical field of power adapter production, in particular to a power adapter circuit assembling mechanism and method.The power adapter circuit assembling mechanism comprises a first conveying mechanism, a spraying mechanism, a gluing mechanism, a second conveying mechanism and a transfer assembling mechanism, and the transfer assembling mechanism is arranged between the second conveying mechanism and the first conveying mechanism; an assembling jig is conveyed on the first conveying mechanism, the assembling jig is used for fixing a shell to be conveyed on the first conveying mechanism, the first conveying mechanism drives the shell to sequentially pass through the spraying mechanism and the gluing mechanism through the assembling jig, and a plurality of sets of positioning assemblies are arranged on the first conveying mechanism and used for positioning the assembling jig; the first conveying mechanism is used for driving the assembling jig to sequentially pass through the spraying mechanism and the gluing mechanism. Through the optimized heat dissipation structure design and the efficient and accurate assembly process, the production efficiency and the product quality are improved while the heat dissipation performance of the power adapter is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of power adapter production, and particularly to a power adapter circuit assembly mechanism and method. Background Art

[0002] A power adapter, also known as an external power supply, is a device for converting the supply voltage of small portable electronic devices and electrical appliances. It is widely used in small electronic devices such as mobile phones, liquid crystal displays, and laptop computers, and is also commonly found in devices such as security cameras, set-top boxes, wireless routers, light strips, and massagers. The basic working principle of a power adapter is to convert AC input into DC output, and it usually consists of components such as a housing, a transformer, an inductor, a capacitor, a control IC, and a PCB board.

[0003] The heat dissipation structure of a power adapter is an important part of its internal design. Especially in a switching power supply operating under high voltage and large current conditions, its working load is heavy, and it is usually a fully enclosed structure without heat dissipation holes on the housing, so heat dissipation design is particularly important. The existing heat dissipation structures of power adapters are relatively single, and they cannot effectively adapt to heat dissipation during the circuit board assembly process. Therefore, new designs for the existing power adapter structures and production are needed. Summary of the Invention

[0004] To solve the above problems, the present invention provides a power adapter circuit assembly mechanism and method that, through an optimized heat dissipation structure design and an efficient and precise assembly process, improve the heat dissipation performance of the power adapter while enhancing production efficiency and product quality.

[0005] The technical solution adopted by the present invention is: a power adapter circuit assembly mechanism for assembling a circuit board onto a housing. The housing is provided with a cavity, the bottom surface of the cavity is provided with a heat-conducting substrate, the wall surface of the cavity is provided with a heat-conducting surface, the heat-conducting surface is perpendicular to the heat-conducting substrate, the outside of the housing is provided with bottom surface heat dissipation fins and side surface heat dissipation fins, the bottom surface heat dissipation fins correspond to the heat-conducting substrate, the side surface heat dissipation fins correspond to the heat-conducting surface, the heat-conducting substrate is used to connect the circuit board, one side of the circuit board is provided with a heating chip, the heating surface of the heating chip is perpendicular to the circuit board, and the heating surface of the heating chip is used to fit against the heat-conducting surface; The power adapter circuit assembly mechanism includes a first conveying mechanism, a spraying mechanism, a glue coating mechanism, a second conveying mechanism, and a transfer and assembly mechanism. The transfer and assembly mechanism is arranged between the second conveying mechanism and the first conveying mechanism. An assembly jig is conveyed on the first conveying mechanism. The assembly jig is used to fix the outer shell and convey it on the first conveying mechanism. The first conveying mechanism drives the outer shell to pass through the spraying mechanism and the glue coating mechanism in sequence through the assembly jig. Multiple groups of positioning components are arranged on the first conveying mechanism to position the assembly jig. The first conveying mechanism is used to drive the assembly jig to pass through the spraying mechanism and the glue coating mechanism in sequence. The spraying mechanism sprays heat-conducting particles on the heat-conducting surface to form a heat-conducting mixed medium. The glue coating mechanism is used to apply glue on the heat-conducting surface. The second conveying mechanism is used to convey the circuit board. The transfer and assembly mechanism is used to grab the circuit board from the second conveying mechanism and place it on the outer shell, and press and fit the heat-generating chip on the heat-conducting surface to connect it by glue bonding.

[0006] A further improvement to the above solution is that a connecting side plate is arranged on one side of the circuit board. The connecting side plate is provided with welding pins, and the welding pins are connected to the circuit board. The heat-generating chip is arranged on the connecting side plate. The heat-generating chip is provided with connecting pins, and the connecting pins are electrically connected to the welding pins. The welding pins are bow-shaped pins to provide a pressing force when the heat-generating chip is attached to the heat-conducting surface.

[0007] A further improvement to the above solution is that the first conveying mechanism includes a conveying bracket, a conveyor belt, and a conveying drive component. The conveying drive component is used to drive the conveyor belt to convey on the conveying bracket. A conveying groove is arranged on the conveying bracket, and the conveying groove is used to convey the assembly jig. The positioning component is used to position the assembly jig on the conveying groove.

[0008] A further improvement to the above solution is that two groups of positioning components are arranged. The two groups of positioning components are arranged opposite to each other to position the assembly jig. The positioning component includes a positioning lifting cylinder, a positioning drive cylinder, and a positioning block. The assembly jig is provided with a positioning card slot. The positioning lifting cylinder and the positioning drive cylinder cooperate to drive the positioning block to fit into the positioning card slot to position the assembly jig on the conveying groove.

[0009] A further improvement to the above solution is that a clamping component is arranged above the positioning component on the first conveying mechanism. The clamping component includes multiple groups of clamping cylinders. The driving end of the clamping cylinder is provided with an L-shaped plate. Multiple groups of clamping cylinders are used to clamp and fix the outer shell on the positioned assembly jig.

[0010] A further improvement to the above solution is that the spraying mechanism includes a spraying frame, a spraying robotic arm, a spraying lifting assembly, and a spraying assembly. The spraying frame is located on one side of the first conveying mechanism. The spraying robotic arm is arranged on the spraying frame. The spraying lifting assembly is arranged on the spraying robotic arm. The spraying assembly includes a spraying main machine and a spray head. The spray head is connected to the spraying main machine. The spray head is used to spray nano-scale heat-conducting powder on the heat-conducting surface. The outer shell is a die-cast aluminum shell, and the nano-scale heat-conducting powder is used to fill the inner side surface of the aluminum shell.

[0011] A further improvement to the above solution is that the nano-scale heat-conducting powder is copper powder. The particle size of the copper powder is 10 - 60 nm. Spraying is carried out three times in sequence to form a roughened layer, a dense layer, and a sealing layer in sequence.

[0012] A further improvement to the above solution is that for the roughened layer spraying, nitrogen is used for acceleration, with a speed of 550 - 650 m / s, a gas pressure of 3.8 - 4.2 MPa, a carrier gas temperature of 450 - 500 °C, a powder feeding rate of 80 - 100 g / min, a moving speed of 50 - 70 mm / s, and a spraying distance of 20 - 25 mm.

[0013] A further improvement to the above solution is that for the dense layer, helium mixed gas is switched, with a speed of 800 - 950 m / s, a gas pressure of 4.5 - 5.0 MPa, a carrier gas temperature of 550 - 600 °C, a powder feeding rate of 50 - 70 g / min, a moving speed of 30 - 50 mm / s, and a spraying distance of 15 - 20 mm.

[0014] A further improvement to the above solution is that during the spraying of the sealing layer, the gas pressure is 3.5 - 4.0 MPa, the carrier gas temperature is 400 - 450 °C, the powder feeding rate is 30 - 50 g / min, the moving speed is 80 - 100 mm / s, and the spraying distance is 25 - 30 mm.

[0015] A further improvement to the above solution is that the nano-scale heat-conducting powder is graphite powder. The particle size of the graphite powder is 5 - 15 nm. Two cross-sprayings are adopted, and during the spraying process, the spray head is obliquely deposited at an angle of 45°; During the first spraying process, the pressure is controlled at 2.8 - 3.2 MPa, the temperature is 300 - 350 °C, the powder feeding rate is 40 - 60 g / min, the moving speed is 100 - 120 mm / s, and the residence time is 8 - 12 ms; During the second spraying process, the pressure is controlled at 3.5 - 4.0 MPa, the temperature is 400 - 450 °C, the powder feeding rate is 60 - 80 g / min, the moving speed is 80 - 100 mm / s, and the residence time is 15 - 20 ms; During the secondary cross-spraying process, 0.5 - 1% of nano-silane coupling agent is added to enhance the interfacial bonding. Pulse powder feeding is implemented, with a frequency of 5 - 10 Hz and a pulse width of 50 - 100 ms during the powder feeding process. The auxiliary ultrasonic vibration frequency is 28 kHz, and the amplitude is 15 - 20 μm.

[0016] A further improvement to the above solution is that it also includes a grinding mechanism. The grinding mechanism is used to grind the heat-conducting mixed medium into a flat heat-conducting surface. The grinding mechanism includes a grinding bracket, a grinding manipulator, and a grinding component. The grinding component includes a grinding drive motor, a grinding main shaft, and a grinding alloy wheel. The grinding bracket is located on one side of the first conveying mechanism. The grinding manipulator is arranged on the grinding bracket. The grinding drive motor is arranged on the grinding manipulator. The grinding main shaft is used to connect the grinding alloy wheel to the grinding drive motor. The grinding manipulator is used to drive the grinding component to grind the heat-conducting surface into a flat surface.

[0017] A further improvement to the above solution is that the transfer and assembly mechanism includes a transfer manipulator, a transfer grasping component, and an assembly vision component. The transfer grasping component is arranged on the transfer manipulator. The transfer grasping component is used to grasp the circuit board on the second conveying mechanism. The assembly vision component is arranged on the transfer grasping component to identify the position of the housing and assemble the circuit board into the housing.

[0018] A further improvement to the above solution is that the gluing mechanism includes a gluing bracket, a gluing manipulator, and a gluing component. The gluing manipulator is arranged on the gluing bracket. The gluing component is arranged on the gluing manipulator. The gluing bracket is located on one side of the first conveying mechanism. The gluing component includes a gluing cylinder, a guide glue roller, and a glue roller. The gluing cylinder is used to guide the glue material towards the guide glue roller. The guide glue roller transfers the glue material to the glue roller. The glue roller is used to coat the glue material on the heat-conducting surface. A further improvement to the above solution is that the guide glue roller uses a ceramic surface coating, and the surface roughness Ra of the ceramic surface coating is 0.2 - 0.4 μm.

[0019] A further improvement to the above solution is that the glue material is a two-component heat-conducting epoxy glue, which is composed of component A and component B mixed. Component A is resin-based, and its weight components include: Epoxy resin E-51: 45 - 55%; Nano-aluminum oxide: 18 - 22%; Flaky boron nitride (aspect ratio 50:1): 12 - 15%; Silane coupling agent KH-550: 1.5 - 2%; Thixotropic agent fumed silica: 2 - 3%; Component B is a curing agent, and its weight components include: Modified amine curing agent: 30 - 35%; Short carbon fiber filaments: 5 - 8%; Silver-coated copper powder with a particle size of 5 - 8 μm: 15 - 20%; Flame retardant aluminum hydroxide: 8 - 10%; The mixing ratio of Component A to Component B is 4:1.

[0020] A method for assembling a power adapter circuit, including the power adapter circuit assembling mechanism described above. The method includes the following steps: Step S1: Provide a housing assembly. The bottom surface of the housing cavity is provided with a heat conduction substrate, and the vertical wall surface is provided with a heat conduction surface. The bottom surface heat dissipation fins and side surface heat dissipation fins are correspondingly arranged outside. Step S2: Transmit the assembly fixture through the first conveying mechanism. The assembly fixture is double-positioned by the positioning component: first, the positioning block is driven by the positioning lifting cylinder and the positioning driving cylinder to cooperate with the positioning slot to achieve rough positioning, and then the L-shaped plate is clamped and fixed by multiple clamping cylinders of the clamping component. Step S3: Perform heat conduction surface spraying treatment: Copper powder spraying: Coarse layer spraying, dense layer spraying, and sealing layer spraying are carried out in sequence. The powder feeding rates of each layer are 80 - 100 g / min, 50 - 70 g / min, and 30 - 50 g / min respectively. Step S4: Perform the grinding process: The grinding alloy wheel is driven by the grinding manipulator to perform surface leveling treatment on the sprayed coating. The rotational speed of the grinding main shaft is controlled at 2000 - 3000 rpm, and the contact pressure is maintained at 15 - 20 N. Step S5: Coat the heat conduction adhesive: The two-component heat conduction epoxy adhesive is mixed in a ratio of 4:1 and coated by using a ceramic guide roller. The thickness of the adhesive layer is controlled at 0.1 - 0.3 mm, and the temperature of the coating roller is maintained at 40 - 60 °C. Step S6: Transfer and assemble the circuit board: The circuit board on the second conveying mechanism is transferred to the housing through the vacuum grasping component, positioned by the dual-spectrum vision system, and a pressing force of 20 - 50 N is applied to make the heating chip fit the heat conduction surface. Step S7: Curing treatment: Pre-curing at 80 °C for 2 h and final curing at 120 °C for 1 h are carried out in stages. During the curing process, the contact pressure is maintained and the deformation of the adhesive layer is monitored.

[0021] The beneficial effects of the present invention are: Compared with the existing power adapter circuit assembly, the heat-conducting substrate provided on the bottom surface of the housing cavity of the present invention is perpendicular to the heat-conducting surface of the wall surface. Cooperating with the corresponding bottom surface heat dissipation fins and side surface heat dissipation fins outside, a heat dissipation path is formed. The heat-generating surface of the heat-generating chip is perpendicular to the circuit board and adheres to the heat-conducting surface, enabling heat to quickly transfer from the heat-generating chip to the heat-conducting surface, and then conduct to the side surface heat dissipation fins through the heat-conducting surface. At the same time, part of the heat is transferred to the bottom surface heat dissipation fins through the heat-conducting substrate, achieving multi-dimensional efficient heat dissipation, greatly reducing the temperature of the power adapter during operation, and improving its stability and service life.

[0022] During the assembly process, each component played an active role. The first conveying mechanism positioned the assembly jig by setting multiple groups of positioning components, ensuring the position accuracy of the housing during the conveying process, so that the housing could accurately pass through the spraying mechanism and the glue application mechanism in sequence. The spraying mechanism sprayed heat-conducting particles on the heat-conducting surface to form a heat-conducting mixed medium, enhancing the heat-conducting performance; the glue application mechanism accurately applied glue on the heat-conducting surface to fix the heat-generating chip and make contact with the heat-conducting surface. The second conveying mechanism conveyed the circuit board, and the transfer and assembly mechanism could grab the circuit board from the second conveying mechanism and place it on the housing, and could accurately press the heat-generating chip against the heat-conducting surface, achieving a firm adhesive connection through glue application. The entire assembly process was efficient and precise, improving production efficiency and reducing the defective rate. Through the optimized heat dissipation structure design and efficient and precise assembly process, the present invention improves the heat dissipation performance of the power adapter while enhancing production efficiency and product quality. Each mechanism cooperates closely to achieve automated production, effectively control costs, and contribute to the high-quality development of the power adapter industry.

[0023] A method for assembling a power adapter circuit, which transports an assembly jig through a first conveying mechanism and uses a positioning component for double positioning. Coarse positioning is achieved by a positioning lifting cylinder and a positioning driving cylinder driving a positioning block to cooperate with a positioning slot, which can quickly determine the position of the jig; then, multiple clamping cylinders of a clamping component drive an L-shaped plate to clamp and fix, achieving precise positioning, ensuring the accuracy and stability of subsequent assembly processes, effectively improving the assembly accuracy, and reducing assembly defects caused by positioning deviation. In terms of the treatment of the heat-conducting surface, the layered process of copper powder spraying and different powder feeding rates for each layer make the sprayed coating have good structure and performance. The reasonable combination of the roughening layer, the dense layer, and the sealing layer enhances the adhesion and heat-conducting performance of the coating. The subsequent grinding process further improves the surface flatness of the sprayed coating, providing a good foundation for coating heat-conducting adhesive. When coating the heat-conducting adhesive, a ceramic glue guiding roller is used to mix two-component heat-conducting epoxy glue in a specific proportion and control the glue layer thickness and the temperature of the glue applying roller, ensuring the uniform coating and good performance of the heat-conducting glue. The transfer and assembly of the circuit board use a dual-spectrum vision system for positioning and an appropriate pressing force to make the heat-generating chip closely fit with the heat-conducting surface. Finally, the staged curing treatment can effectively control the curing effect of the glue layer, maintain the contact pressure, and monitor the deformation of the glue layer, ensuring the stability and reliability of the entire assembly structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a three-dimensional schematic diagram of the power adapter of the present invention; Figure 2 is Figure 1 a three-dimensional schematic diagram of another perspective of the power adapter in ; Figure 3 is Figure 1 a structural schematic diagram of the power adapter in ; Figure 4 is a three-dimensional schematic diagram of the power adapter circuit assembly mechanism of the present invention; Figure 5 is Figure 4 a three-dimensional schematic diagram of another perspective of the power adapter circuit assembly mechanism in ; Figure 6 is Figure 4 a top view schematic diagram of the power adapter circuit assembly mechanism in ; Figure 7 is Figure 4 a schematic diagram of a partial structure of the power adapter circuit assembly mechanism in ; Figure 8 is Figure 4 a schematic diagram of the spraying mechanism of the power adapter circuit assembly mechanism in ; Figure 9 is Figure 4 a schematic diagram of the glue applying mechanism of the power adapter circuit assembly mechanism in ; Figure 10for Figure 4 A schematic diagram of a grinding mechanism of a power adapter circuit assembly mechanism; Figure 11 for Figure 4 Schematic diagram of the transfer assembly mechanism of the power adapter circuit assembly mechanism.

[0025] Description of reference numerals: housing 10, cavity 101, heat-conducting substrate 102, bottom heat dissipation fins 103, side heat dissipation fins 104, circuit board 105, connecting side plate 1051, welding pin 1052, heating chip 106, connecting pin 1061; First conveying mechanism 1, assembly fixture 11, positioning slot 111, positioning assembly 12, positioning lifting cylinder 121, positioning drive cylinder 122, positioning block 123, conveying bracket 13, conveying trough 131, conveyor belt 14, conveying drive assembly 15, clamping assembly 16, clamping cylinder 161, L-shaped plate 162, spraying mechanism 2, spraying frame 21, spraying robot arm 22, spraying lifting assembly 23, spraying assembly 24, spraying host 241 , nozzle 242, gluing mechanism 3, gluing bracket 31, gluing robot 32, gluing assembly 33, gluing cylinder 331, glue guide roller 332, gluing roller 333, second conveying mechanism 4, transfer assembly mechanism 5, transfer robot 51, transfer grabbing assembly 52, assembly vision assembly 53, grinding mechanism 6, grinding bracket 61, grinding robot 62, grinding assembly 63, grinding drive motor 631, grinding spindle 632, grinding alloy wheel 633. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Figures 1 to 11As shown in the figure, in an embodiment of the present invention, a power adapter is involved. The housing 10 is provided with a cavity 101. The bottom surface of the cavity 101 is provided with a heat-conducting substrate 102, and the wall surface of the cavity 101 is provided with a heat-conducting surface 102. The heat-conducting surface 102 is perpendicular to the heat-conducting substrate 102. The outside of the housing 10 is provided with bottom surface heat dissipation fins 103 and side surface heat dissipation fins 104. The bottom surface heat dissipation fins 103 correspond to the heat-conducting substrate 102, and the side surface heat dissipation fins 104 correspond to the heat-conducting surface 102. The heat-conducting substrate 102 is used to connect the circuit board 105. One side of the circuit board 105 is provided with a heating chip 106. The heating surface of the heating chip 106 is perpendicular to the circuit board 105. The heating surface of the heating chip 106 is used to fit the heat-conducting surface 102. In this embodiment, the heat-conducting substrate 102 provided on the bottom surface of the cavity 101 of the housing 10 is perpendicular to the heat-conducting surface 102 on the wall surface, and cooperates with the corresponding bottom surface heat dissipation fins 103 and side surface heat dissipation fins 104 outside to form a heat dissipation path. The heating surface of the heating chip 106 is perpendicular to the circuit board 105 and fits the heat-conducting surface 102, so that heat can quickly transfer from the heating chip 106 to the heat-conducting surface 102, and then conduct to the side surface heat dissipation fins 104 through the heat-conducting surface 102. At the same time, part of the heat is transferred to the bottom surface heat dissipation fins 103 through the heat-conducting substrate 102, realizing multi-dimensional efficient heat dissipation, greatly reducing the temperature of the power adapter during operation, and improving its stability and service life.

[0029] Refer to Figures 4 to 6As shown in the figure, a power adapter circuit assembly mechanism includes a first conveying mechanism 1, a spraying mechanism 2, a glue coating mechanism 3, a second conveying mechanism 4, and a transfer and assembly mechanism 5. The transfer and assembly mechanism 5 is arranged between the second conveying mechanism 4 and the first conveying mechanism 1. There is an assembly fixture 11 transported on the first conveying mechanism 1. The assembly fixture 11 is used to fix the housing 10 and convey it on the first conveying mechanism 1. The first conveying mechanism 1 drives the housing 10 to sequentially pass through the spraying mechanism 2 and the glue coating mechanism 3 through the assembly fixture 11. There are multiple groups of positioning components 12 arranged on the first conveying mechanism 1 to position the assembly fixture 11. The first conveying mechanism 1 is used to drive the assembly fixture 11 to sequentially pass through the spraying mechanism 2 and the glue coating mechanism 3. The spraying mechanism 2 sprays heat-conducting particles on the heat-conducting surface 102 to form a heat-conducting mixed medium. The glue coating mechanism 3 is used to apply glue on the heat-conducting surface 102. The second conveying mechanism 4 is used to convey the circuit board 105. The transfer and assembly mechanism 5 is used to grab the circuit board 105 from the second conveying mechanism 4 and place it on the housing 10, and press and fit the heat-generating chip 106 onto the heat-conducting surface 102 to achieve adhesive connection through glue coating. It is used to assemble the circuit board 105 onto the housing 10. During the assembly process, each component plays an active role. The first conveying mechanism 1 positions the assembly fixture 11 through multiple groups of positioning components 12, ensuring the position accuracy of the housing 10 during transportation, so that the housing 10 can accurately pass through the spraying mechanism 2 and the glue coating mechanism 3 in sequence. The spraying mechanism 2 sprays heat-conducting particles on the heat-conducting surface 102 to form a heat-conducting mixed medium, enhancing the heat-conducting performance. The glue coating mechanism 3 accurately applies glue on the heat-conducting surface 102 to fix the heat-generating chip 106 and make it contact with the heat-conducting surface 102. The second conveying mechanism 4 conveys the circuit board 105. The transfer and assembly mechanism 5 can grab the circuit board 105 from the second conveying mechanism 4 and place it on the housing 10, and accurately press and fit the heat-generating chip 106 onto the heat-conducting surface 102, achieving a firm adhesive connection through glue coating. The entire assembly process is efficient and accurate, improving production efficiency and reducing the defective rate. Through the optimized heat-dissipating structure design and the efficient and accurate assembly process of the present invention, while improving the heat-dissipating performance of the power adapter, the production efficiency and product quality are also improved. Through the close cooperation of each mechanism of the present invention, automated production is achieved, effectively controlling costs and contributing to the high-quality development of the power adapter industry.

[0030] On one side of the circuit board 105, a connection side plate 1051 is provided. The connection side plate 1051 is provided with welding pins 1052, and the welding pins 1052 are connected to the circuit board 105. The heating chip 106 is arranged on the connection side plate 1051. The heating chip 106 is provided with connection pins 1061, and the connection pins 1061 are electrically connected to the welding pins 1052. The welding pins 1052 are bow-shaped pins, so as to provide a pressing force when the heating chip 106 is attached to the heat conducting surface 102. In this embodiment, the connection side plate 1051 and the welding pins 1052 thereon provide a stable and reliable connection for the heating chip 106. The connection between the welding pins 1052 and the circuit board 105 ensures the stability and integrity of the circuit signal transmission, reduces signal interference and transmission loss, and ensures that the power adapter can accurately and efficiently complete the power conversion and distribution. The heating chip 106 is arranged on the connection side plate 1051 and is electrically connected to the welding pins 1052 through the connection pins 1061, optimizing the layout, making the position of the heating chip 106 accurately controllable, facilitating the planning and design of the heat dissipation channel, and improving the heat dissipation efficiency. And when the heating chip 106 is attached to the heat conducting surface 102, the bow-shaped welding pins 1052 can provide an appropriate pressing force. The pressing force ensures the close contact between the heating chip 106 and the heat conducting surface 102, enhances the heat conduction effect, can quickly conduct the heat out, and prevents the performance of the chip from decreasing due to overheating.

[0031] Refer to Figure 7As shown in the figure, the first conveying mechanism 1 includes a conveying bracket 13, a conveyor belt 14 and a conveying drive assembly 15. The conveying drive assembly 15 is used to drive the conveyor belt 14 to transmit on the conveying bracket 13. A conveying groove 131 is provided on the conveying bracket 13, and the conveying groove 131 is used for the assembly jig 11 to transmit; the positioning assembly 12 is used to position the assembly jig 11 on the conveying groove 131; specifically, two groups of positioning assemblies 12 are provided, and the two groups of positioning assemblies 12 are arranged opposite to each other for positioning the assembly jig 11; the positioning assembly 12 includes a positioning lifting cylinder 121, a positioning drive cylinder 122 and a positioning block 123. The assembly jig 11 is provided with a positioning slot 111. The positioning lifting cylinder 121 and the positioning drive cylinder 122 cooperate to drive the positioning block 123 to fit into the positioning slot 111 to position the assembly jig 11 on the conveying groove 131. In this embodiment, the conveyor belt 14 of the first conveying mechanism 1 is stably transmitted on the conveying bracket 13 under the drive of the conveying drive assembly 15. The conveying groove 131 provides an accurate transmission path for the assembly jig 11, ensuring that the jig moves forward stably according to the preset route, effectively improving the transmission efficiency and stability. The two groups of positioning assemblies 12 arranged opposite to each other improve the positioning accuracy of the assembly jig 11. The coordinated cooperation of the positioning lifting cylinder 121 and the positioning drive cylinder 122 can accurately drive the positioning block 123 to be inserted into the positioning slot 111 of the assembly jig 11, ensuring the position fixation of the jig on the conveying groove 131. This makes the installation positions of the components during the assembly process of the power adapter circuit accurate, reduces the installation errors caused by the jig shaking or shifting, improves the product assembly quality, and the high efficiency of positioning helps to shorten the assembly time of a single product, further improving the overall production efficiency of the power adapter circuit assembly and reducing the defective rate.

[0032] The first conveying mechanism 1 is provided with a clamping assembly 16 above the positioning assembly 12. The clamping assembly 16 includes multiple groups of clamping cylinders 161. An L-shaped plate 162 is provided at the driving end of the clamping cylinder 161. The multiple groups of clamping cylinders 161 are used to clamp and fix the housing 10 on the positioned assembly jig 11. In this embodiment, the multiple groups of clamping cylinders 161 are provided to clamp and fix the housing 10 on the positioned assembly jig 11. This ensures the position accuracy of the housing 10 during the assembly process, greatly improves the assembly accuracy of the power adapter circuit, effectively avoids problems such as circuit connection deviation caused by the displacement of the housing 10, and further improves the product yield rate. Secondly, through the cooperation of the L-shaped plate 162 and the driving end of the clamping cylinder 161, a reliable clamping force is provided. In the face of various operations during the assembly process, the housing 10 can remain stable, will not shake or fall off easily, and ensures the coherence and stability of the assembly work.

[0033] Refer to Figure 8As shown in the figure, the spraying mechanism 2 includes a spraying frame 21, a spraying robotic arm 22, a spraying lifting assembly 23, and a spraying component 24. The spraying frame 21 is located on one side of the first conveying mechanism 1. The spraying robotic arm 22 is arranged on the spraying frame 21. The spraying lifting assembly 23 is arranged on the spraying robotic arm 22. The spraying component 24 includes a spraying main body 241 and a spray head 242. The spray head 242 is connected to the spraying main body 241. The spray head 242 is used to spray nano-scale heat-conducting powder on the heat-conducting surface 102. The housing 10 is a die-cast aluminum shell. The nano-scale heat-conducting powder is used to fill the inner side of the aluminum shell. In this embodiment, the spraying frame 21 is located on one side of the first conveying mechanism 1, ensuring the efficient connection between the entire spraying operation and the conveying process and improving the continuity of production. The coordinated operation of the spraying robotic arm 22 and the spraying lifting assembly 23, and the precise positioning and flexible movement ability of the spray head 242 can accurately spray specific parts of the die-cast aluminum shell of the power adapter according to its size, shape, etc., ensuring the uniformity and accuracy of the nano-scale heat-conducting powder spraying. The filling of the inner side of the aluminum shell with the nano-scale heat-conducting powder greatly enhances the heat dissipation performance of the power adapter. The die-cast aluminum shell itself has a certain heat dissipation foundation, and the filling of the nano-scale heat-conducting powder further optimizes the heat dissipation path, reduces the heat accumulation generated during the operation of the circuit, effectively extends the service life of the internal circuit components of the power adapter, reduces the probability of failures caused by overheating, and thus improves the overall stability and reliability of the power adapter.

[0034] The nano-scale heat-conducting powder is copper powder with a particle size of 10 - 60 nm. Spraying is carried out three times in sequence to form a roughened layer, a dense layer, and a sealing layer in sequence. For the roughened layer spraying, nitrogen is used for acceleration with a speed of 550 - 650 m / s, a gas pressure of 3.8 - 4.2 MPa, a carrier gas temperature of 450 - 500 °C, a powder feeding rate of 80 - 100 g / min, a moving speed of 50 - 70 mm / s, and a spraying distance of 20 - 25 mm. For the dense layer, a helium gas mixture is switched, with a speed of 800 - 950 m / s, a gas pressure of 4.5 - 5.0 MPa, a carrier gas temperature of 550 - 600 °C, a powder feeding rate of 50 - 70 g / min, a moving speed of 30 - 50 mm / s, and a spraying distance of 15 - 20 mm. During the spraying of the sealing layer, the gas pressure is 3.5 - 4.0 MPa, the carrier gas temperature is 400 - 450 °C, the powder feeding rate is 30 - 50 g / min, the moving speed is 80 - 100 mm / s, and the spraying distance is 25 - 30 mm. In this embodiment, the roughened layer is formed by nitrogen-accelerated spraying with specific parameters. Its function is to increase the adhesion area of the subsequent coating, effectively enhance the bonding force between the coating and the substrate, ensure the stability of the entire coating structure in a complex environment, and reduce the risk of peeling. The dense layer is sprayed with a helium gas mixture at a higher speed and pressure, which can greatly improve the density of the coating, reduce the thermal resistance, and improve the heat conduction efficiency, providing a strong guarantee for the efficient heat dissipation of the power adapter and avoiding performance degradation and component damage caused by heat accumulation. The sealing layer is sprayed under corresponding parameters, which can effectively fill the micropores and defects on the surface of the coating, further improve the sealing and protection of the coating, prevent the intrusion of external water vapor, dust, etc., extend the service life of the power adapter, and at the same time, the optimized parameters can make the sealing layer well connected with the previous two layers.

[0035] The nano-scale thermal conductive powder is graphite powder with a particle size of 5 - 15 nm. Two cross-sprayings are adopted, and during the spraying process, the nozzle 242 is deposited obliquely at an angle of 45°. During the first spraying process, the pressure is controlled at 2.8 - 3.2 MPa, the temperature is 300 - 350 °C, the powder feeding rate is 40 - 60 g / min, the moving speed is 100 - 120 mm / s, and the residence time is 8 - 12 ms. During the second spraying process, the pressure is controlled at 3.5 - 4.0 MPa, the temperature is 400 - 450 °C, the powder feeding rate is 60 - 80 g / min, the moving speed is 80 - 100 mm / s, and the residence time is 15 - 20 ms. During the two cross-spraying processes, 0.5 - 1% nano-silane coupling agent is added to enhance the interfacial bonding. Pulse powder feeding is implemented, and during the powder feeding process, the frequency is 5 - 10 Hz and the pulse width is 50 - 100 ms. The auxiliary ultrasonic vibration frequency is 28 kHz and the amplitude is 15 - 20 μm. In this embodiment, the nano-scale graphite powder (with a particle size of 5 - 15 nm) combined with two cross-sprayings and the 45° oblique deposition of the nozzle 242 can form a uniform and dense thermal conductive coating on the surface of the circuit component, effectively improving the heat conduction efficiency, reducing the risk of local overheating, and ensuring the stable operation of the power adapter. The precisely controlled spraying pressure, temperature, powder feeding rate, moving speed, and residence time endow the coating with good physical properties and adhesion. The differential settings of the two spraying parameters further optimize the coating structure and enhance the thermal conductivity. Adding 0.5 - 1% nano-silane coupling agent improves the interfacial bonding force, ensuring that the coating is tightly bonded to the circuit component and not easily detached. Pulse powder feeding and ultrasonic vibration assistance help the powder to be evenly distributed, refine the coating particles, improve the overall thermal conductivity and quality, and thus extend the service life of the power adapter.

[0036] Refer to Figure 10As shown, it further includes a grinding mechanism 6. The grinding mechanism 6 is used to grind the thermally conductive mixed medium into a flat thermally conductive surface 102. The grinding mechanism 6 includes a grinding bracket 61, a grinding manipulator 62, and a grinding assembly 63. The grinding assembly 63 includes a grinding drive motor 631, a grinding main shaft 632, and a grinding alloy wheel 633. The grinding bracket 61 is located on one side of the first conveying mechanism 1. The grinding manipulator 62 is arranged on the grinding bracket 61. The grinding drive motor 631 is arranged on the grinding manipulator 62. The grinding main shaft 632 is used to connect the grinding alloy wheel 633 and the grinding drive motor 631. The grinding manipulator 62 is used to drive the grinding assembly 63 to grind the thermally conductive surface 102 into a flat surface. In this embodiment, by grinding the thermally conductive mixed medium into a flat thermally conductive surface 102, the flat thermally conductive surface 102 can increase the contact area with the heating element, conduct heat more efficiently, effectively reduce the temperature during the operation of the device, and extend the service life of the internal electronic components of the power adapter. The precise operation of the grinding mechanism 6 ensures the flatness of the thermally conductive surface 102, reduces the local overheating phenomenon caused by surface unevenness, and improves the stability and reliability of the entire power adapter circuit. The grinding manipulator 62 can flexibly drive the grinding assembly 63, and can perform precise grinding operations according to different specifications of power adapters, enhancing the versatility and adaptability of the assembly process, helping to improve production efficiency, reduce production costs, and providing a strong guarantee for the large-scale and high-quality production of power adapters.

[0037] Refer to Figure 11 As shown, the transfer and assembly mechanism 5 includes a transfer manipulator 51, a transfer grasping component 52, and an assembly vision component 53. The transfer grasping component 52 is arranged on the transfer manipulator 51. The transfer grasping component 52 is used to grasp the circuit board 105 on the second conveying mechanism 4. The assembly vision component 53 is arranged on the transfer grasping component 52 to identify the position of the housing 10 and assemble the circuit board 105 into the housing 10. In this embodiment, the transfer manipulator 51 can quickly and stably drive the transfer grasping component 52 to reach the designated position, improving the efficiency and accuracy of grasping and transferring the circuit board 105 and shortening the assembly cycle. The transfer grasping component 52 precisely grasps the circuit board 105 on the second conveying mechanism 4, ensuring that the grasping force is appropriate, neither damaging the circuit board 105 nor firmly grasping it, laying a foundation for subsequent accurate assembly. The assembly vision component 53 plays a key positioning role and can quickly and accurately identify the position of the housing 10. Based on this, the transfer grasping component 52 can accurately assemble the circuit board 105 into the housing 10, greatly improving the assembly accuracy and the yield rate of good products.

[0038] Refer to Figure 9As shown in the figure, the gluing mechanism 3 includes a gluing support 31, a gluing manipulator 32, and a gluing component 33. The gluing manipulator 32 is arranged on the gluing support 31, and the gluing component 33 is arranged on the gluing manipulator 32. The gluing support 31 is located on one side of the first conveying mechanism 1. The gluing component 33 includes a gluing cylinder 331, a guide roller 332, and a gluing roller 333. The gluing cylinder 331 is used to guide the glue material towards the guide roller 332, the guide roller 332 transfers the glue material to the gluing roller 333, and the gluing roller 333 is used to coat the glue material on the heat-conducting surface 102. In this embodiment, the gluing support 31 is located on one side of the first conveying mechanism 1, ensuring that the gluing operation is closely connected with the conveying process, facilitating the accurate arrival of the power adapter circuit components to be processed at the gluing position, and improving the overall assembly efficiency. The gluing manipulator 32 can flexibly control the position and movement trajectory of the gluing component 33, accurately positioning to the gluing part of the heat-conducting surface 102, greatly improving the position accuracy of gluing, and avoiding the influence of glue coating deviation on the circuit performance. The glue material is guided to the guide roller 332 through the gluing cylinder 331, the guide roller 332 evenly transfers the glue material to the gluing roller 333, and finally the gluing roller 333 evenly and moderately coats the glue material on the heat-conducting surface 102. This ensures the uniformity and stability of the glue layer, enables good bonding performance and heat-conducting performance between the heat-conducting surface 102 and other components, and effectively improves the reliability and heat dissipation effect of the power adapter circuit assembly.

[0039] The guide roller 332 adopts a ceramic surface coating with a surface roughness Ra of 0.2 - 0.4 μm. The glue material is a two-component heat-conducting epoxy glue, which is composed of component A and component B. The guide roller 332 with a ceramic surface coating of a specific roughness can ensure the uniform and stable coating of the glue material, effectively avoiding uneven glue layer thickness, providing a reliable basis for the bonding of subsequent circuit components, and greatly improving the consistency and stability of the assembly process. The use of the two-component heat-conducting epoxy glue brings good heat-conducting performance to the power adapter.

[0040] Component A is resin-based, and its weight components include: epoxy resin E-51: 45 - 55%; nano-aluminum oxide: 18 - 22%; flaky boron nitride (aspect ratio 50:1): 12 - 15%; silane coupling agent KH-550: 1.5 - 2%; thixotropic agent fumed silica: 2 - 3%. The epoxy resin E-51 in component A provides reliable bonding strength, and nano-aluminum oxide and flaky boron nitride enhance the heat-conducting ability. The silane coupling agent KH-550 improves the interfacial bonding, and the thixotropic agent fumed silica adjusts the rheological properties of the glue material.

[0041] Component B is a curing agent, and its weight components include: modified amine curing agent: 30-35%; short carbon fiber filaments: 5-8%; silver-coated copper powder with a particle size of 5-8 μm: 15-20%; flame retardant aluminum hydroxide: 8-10%. The modified amine curing agent in Component B ensures the curing effect of the rubber compound. The short carbon fiber filaments and silver-coated copper powder improve the electrical conductivity and heat dissipation of the rubber compound, and the flame retardant aluminum hydroxide enhances the fire safety of the product.

[0042] The mixing ratio of Component A and Component B is 4:1. Component A and Component B mixed at a ratio of 4:1 optimize the comprehensive performance of heat conduction, electrical conductivity, and fire prevention of the power adapter while ensuring good bonding performance.

[0043] A method for assembling a power adapter circuit, including the power adapter circuit assembly mechanism, the method comprising the following steps: Step S1, providing a housing 10 assembly, wherein the bottom surface of the cavity 101 of the housing 10 is provided with a heat-conducting substrate 102, and the vertical wall surface is provided with a heat-conducting surface 102, and a bottom surface heat sink fin 103 and a side surface heat sink fin 104 are correspondingly arranged outside; Step S2, transporting the assembly jig 11 through the first conveying mechanism 1, and the assembly jig 11 is double-positioned by the positioning assembly 12: First, the positioning lifting cylinder 121 and the positioning driving cylinder 122 drive the positioning block 123 to cooperate with the positioning slot 111 to achieve rough positioning, and then multiple clamping cylinders 161 of the clamping assembly 16 drive the L-shaped plate 162 to clamp and fix; Step S3, implementing the spraying treatment on the heat-conducting surface 102: Copper powder spraying: Coarse layer spraying, dense layer spraying, and sealing layer spraying are carried out in sequence, and the powder feeding rates of each layer are 80-100 g / min, 50-70 g / min, and 30-50 g / min respectively; Step S4, performing a grinding process: Driving a grinding alloy wheel 633 by a grinding manipulator 62 to perform surface leveling on the sprayed coating, and the rotation speed of the grinding main shaft 632 is controlled at 2000-3000 rpm, and the contact pressure is maintained at 15-20 N; Step S5, coating a heat-conducting adhesive: Using a ceramic guide roller 332 to coat the two-component heat-conducting epoxy adhesive after mixing in a ratio of 4:1, and the thickness of the adhesive layer is controlled at 0.1-0.3 mm, and the temperature of the coating roller 333 is maintained at 40-60 °C; Step S6, transferring and assembling the circuit board 105: Transferring the circuit board 105 on the second conveying mechanism 4 to the housing 10 through a vacuum gripping assembly, positioning by using a dual-spectrum vision system, and applying a pressing force of 20-50 N to make the heat-generating chip 106 fit the heat-conducting surface 102; Step S7, curing treatment: Carrying out pre-curing at 80 °C for 2 h and final curing at 120 °C for 1 h in stages, maintaining the contact pressure during the curing process and monitoring the deformation of the adhesive layer. In this embodiment, the assembly jig 11 is transported through the first conveying mechanism 1, and double-positioning is carried out by using the positioning assembly 12. The rough positioning is achieved by the positioning lifting cylinder 121 and the positioning driving cylinder 122 driving the positioning block 123 to cooperate with the positioning slot 111, which can quickly determine the position of the jig; then multiple clamping cylinders 161 of the clamping assembly 16 drive the L-shaped plate to clamp and fix, achieving precise positioning, ensuring the accuracy and stability of the subsequent assembly process, effectively improving the assembly accuracy, and reducing the assembly defects caused by positioning deviation. In the treatment of the heat-conducting surface 102, the layered process of copper powder spraying and the different powder feeding rates of each layer make the sprayed coating have good structure and performance. The reasonable combination of the coarse layer, the dense layer, and the sealing layer enhances the adhesion and heat-conducting performance of the coating. The subsequent grinding process further improves the surface flatness of the sprayed coating, providing a good basis for coating the heat-conducting adhesive. When coating the heat-conducting adhesive, a ceramic guide roller 332 is used to mix the two-component heat-conducting epoxy adhesive in a specific ratio and control the thickness of the adhesive layer and the temperature of the coating roller 333, ensuring the uniform coating and good performance of the heat-conducting adhesive.The transfer assembly circuit board 105 uses a dual-spectrum vision system to position and apply an appropriate pressing force, enabling the heat-generating chip 106 to closely adhere to the heat-conducting surface 102. Finally, the staged curing process can effectively control the curing effect of the adhesive layer, maintain the contact pressure, and monitor the deformation of the adhesive layer, ensuring the stability and reliability of the entire assembly structure.

[0044] The above embodiments only illustrate several implementation manners of the present invention, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims

1. A power adapter circuit assembly mechanism, used to assemble a circuit board onto a housing, characterized in that: The shell is provided with a cavity, the bottom surface of the cavity is provided with a heat-conducting substrate, the wall surface of the cavity is provided with a heat-conducting surface, the heat-conducting surface and the heat-conducting substrate are perpendicular to each other, the outside of the shell is provided with bottom heat-dissipating fins and side heat-dissipating fins, the bottom heat-dissipating fins correspond to the heat-conducting substrate, the side heat-dissipating fins correspond to the heat-conducting surface, the heat-conducting substrate is used to connect the circuit board, a heating chip is provided on one side of the circuit board, the heating surface of the heating chip is perpendicular to the circuit board, and the heating surface of the heating chip is used to fit the heat-conducting surface; The power adapter circuit assembly mechanism includes a first conveying mechanism, a spraying mechanism, a gluing mechanism, a second conveying mechanism and a transfer assembly mechanism, wherein the transfer assembly mechanism is arranged between the second conveying mechanism and the first conveying mechanism; the first conveying mechanism is provided with an assembly jig, wherein the assembly jig is used to fix the shell and convey it on the first conveying mechanism, and the first conveying mechanism drives the shell to pass through the spraying mechanism and the gluing mechanism in sequence through the assembly jig, and the first conveying mechanism is provided with multiple groups of positioning components for positioning the assembly jig; the first conveying mechanism is used to drive the assembly jig to pass through the spraying mechanism and the gluing mechanism in sequence, and the spraying mechanism sprays thermal conductive particles on the thermal conductive surface to form a thermal conductive mixed medium, and the gluing mechanism is used to glue on the thermal conductive surface; the second conveying mechanism is used for circuit board conveying, and the transfer assembly mechanism is used to grab the circuit board from the second conveying mechanism and place it on the shell, and press the heat-generating chip tightly against the thermal conductive surface to connect it by gluing.

2. The power adapter circuit assembly mechanism according to claim 1, characterized in that: A connecting side plate is provided on one side of the circuit board, and the connecting side plate is provided with welding pins, and the welding pins are connected to the circuit board. The heating chip is provided on the connecting side plate, and the heating chip is provided with connecting pins, and the connecting pins are electrically connected to the welding pins; the welding pins are bow-shaped pins, so as to provide a pressing force when the heating chip is in contact with the heat-conducting surface.

3. The power adapter circuit assembly mechanism according to claim 1, characterized in that: The first conveying mechanism includes a conveying support, a conveying belt and a conveying drive assembly, wherein the conveying drive assembly is used to drive the conveying belt to convey on the conveying support, and the conveying support is provided with a conveying trough, and the conveying trough is used for assembling the jig for conveying; the positioning assembly is used to position the assembly jig on the conveying trough; The positioning components are provided with two groups, and the two groups of positioning components are arranged opposite to each other for positioning the assembly jig; the positioning components include a positioning lifting cylinder, a positioning drive cylinder and a positioning block, and the assembly jig is provided with a positioning slot, and the positioning lifting cylinder and the positioning drive cylinder cooperate to drive the positioning block to cooperate with the positioning slot to position the assembly jig on the conveying trough.

4. The power adapter circuit assembly mechanism according to claim 1, characterized in that: The first conveying mechanism is located on the upper side of the positioning assembly and is provided with a clamping assembly, the clamping assembly includes multiple groups of clamping cylinders, the driving end of the clamping cylinders is provided with an L-shaped plate, and the multiple groups of clamping cylinders are used to clamp and fix the outer shell on the assembly fixture after positioning.

5. The power adapter circuit assembly mechanism according to claim 1, characterized in that: The spraying mechanism includes a spraying frame, a spraying robot arm, a spraying lifting assembly and a spraying assembly. The spraying frame is located on one side of the first conveying mechanism. The spraying robot arm is arranged on the spraying frame. The spraying lifting assembly is arranged on the spraying robot arm. The spraying assembly includes a spraying host and a spray head. The spray head is connected to the spraying host. The spray head is used to spray nano-scale thermal conductive powder on the thermal conductive surface. The outer shell is a die-cast aluminum shell, and the nano-scale thermal conductive powder is used to fill the inner side of the aluminum shell.

6. The power adapter circuit assembly mechanism according to claim 5, characterized in that: The nano-scale thermally conductive powder is copper powder, the particle size of the copper powder is 10-60 nm, and the powder is sprayed three times in sequence to form a coarsening layer, a dense layer and a sealing layer in sequence; The roughening layer spraying is accelerated by nitrogen, with a speed of 550-650m / s, a gas pressure of 3.8-4.2MPa, a carrier gas temperature of 450-500℃, a powder feeding rate of 80-100g / min, a moving speed of 50-70mm / s, and a spraying distance of 20-25mm; The dense layer switches to helium mixed gas, with a speed of 800-950m / s, a gas pressure of 4.5-5.0MPa, a carrier gas temperature of 550-600℃, a powder feeding rate of 50-70g / min, a moving speed of 30-50mm / s, and a spraying distance of 15-20mm; During the spraying process of the sealing layer, the gas pressure is 3.5-4.0MPa, the carrier gas temperature is 400-450°C, the powder feeding rate is 30-50g / min, the moving speed is 80-100mm / s, and the spraying distance is 25-30mm.

7. The power adapter circuit assembly mechanism according to claim 5, characterized in that: The nano-scale thermally conductive powder is graphite powder, the particle size of the graphite powder is 5-15nm, and two cross-sprayings are adopted, and the nozzle is inclined at 45° during the spraying process for oblique deposition; During one spraying process, the pressure is controlled at 2.8-3.2MPa, the temperature is 300-350℃, the powder feeding rate is 40-60g / min, the moving speed is 100-120mm / s, and the residence time is 8-12ms; During the second spraying process, the pressure is controlled at 3.5-4.0MPa, the temperature is 400-450℃, the powder feeding rate is 60-80g / min, the moving speed is 80-100mm / s, and the residence time is 15-20ms; During the two cross-spraying processes, 0.5-1% nano-silane coupling agent is added to enhance interface bonding. Pulse powder feeding is implemented with a frequency of 5-10 Hz and a pulse width of 50-100 ms. The auxiliary ultrasonic vibration frequency is 28 kHz and the amplitude is 15-20 μm.

8. The power adapter circuit assembly mechanism according to claim 1, characterized in that: It also includes a grinding mechanism, which is used to grind the heat-conducting mixed medium into a flat heat-conducting surface. The grinding mechanism includes a grinding bracket, a grinding manipulator and a grinding assembly. The grinding assembly includes a grinding drive motor, a grinding spindle and a grinding alloy wheel. The grinding bracket is located on one side of the first conveying mechanism. The grinding manipulator is arranged on the grinding bracket. The grinding drive motor is arranged on the grinding manipulator. The grinding spindle is used to connect the grinding alloy wheel with the grinding drive motor. The grinding manipulator is used to drive the grinding assembly to grind the heat-conducting surface into a flat surface. The transfer assembly mechanism includes a transfer robot, a transfer grabbing component and an assembly vision component. The transfer grabbing component is arranged on the transfer robot. The transfer grabbing component is used to grab the circuit board on the second conveying mechanism. The assembly vision component is arranged on the transfer grabbing component to identify the position of the shell and assemble the circuit board into the shell.

9. The power adapter circuit assembly mechanism according to claim 1, characterized in that: The glue coating mechanism comprises a glue coating support, a glue coating manipulator and a glue coating assembly, wherein the glue coating manipulator is arranged on the glue coating support, the glue coating assembly is arranged on the glue coating manipulator, and the glue coating support is located on one side of the first conveying mechanism; the glue coating assembly comprises a glue coating cylinder, a glue guide roller and a glue coating roller, wherein the glue coating cylinder is used to guide the glue material toward the glue guide roller, the glue guide roller transfers the glue material to the glue coating roller, and the glue coating roller is used to coat the glue material on the heat conducting surface; The rubber guide roller adopts ceramic surface coating, and the surface roughness of the ceramic surface coating is Ra0.2-0.4μm; The adhesive is a two-component thermally conductive epoxy adhesive, which is composed of a mixture of component A and component B; The component A is a resin base, and its weight components include: Epoxy resin E-51: 45-55%; Nano-alumina: 18-22%; Flake boron nitride (diameter-to-thickness ratio 50:1): 12-15%; Silane coupling agent KH-550: 1.5-2%; Thixotropic agent fumed silica: 2-3%; The component B is a curing agent, and its weight components include: Modified amine curing agent: 30-35%; Carbon fiber chopped strands: 5-8%; Silver-coated copper powder particle size 5-8μm: 15-20%; Flame retardant aluminum hydroxide: 8-10%; The mixing ratio of component A to component B is 4:

1.

10. A method for assembling a power adapter circuit, characterized in that: The method comprises the power adapter circuit assembly mechanism according to any one of claims 1 to 9, and the method comprises the following steps: Step S1, providing a housing assembly, wherein the bottom surface of the housing cavity is provided with a heat-conducting substrate, the vertical wall surface is provided with a heat-conducting surface, and the outside is provided with bottom heat dissipation fins and side heat dissipation fins correspondingly; Step S2, the assembly jig is transported by the first conveying mechanism, and the assembly jig is double-positioned by the positioning assembly: first, the positioning lifting cylinder and the positioning driving cylinder drive the positioning block to cooperate with the positioning slot to achieve rough positioning, and then the multiple clamping cylinders of the clamping assembly drive the L-shaped plate to clamp and fix; Step S3, performing thermal conductive surface spraying treatment: Copper powder spraying: spray the roughening layer, dense layer and sealing layer in sequence, with the powder feeding rates of each layer being 80-100g / min, 50-70g / min and 30-50g / min respectively; Step S4, performing a grinding process: the grinding alloy wheel is driven by a grinding manipulator to perform surface flattening treatment on the sprayed layer, the grinding spindle speed is controlled at 2000-3000 rpm, and the contact pressure is maintained at 15-20N; Step S5, coating thermally conductive adhesive: using a ceramic adhesive roller to mix the two-component thermally conductive epoxy adhesive in a ratio of 4:1 and then coating, the adhesive layer thickness is controlled at 0.1-0.3 mm, and the coating roller temperature is maintained at 40-60° C.; Step S6, transferring the assembled circuit board: transferring the circuit board on the second conveying mechanism to the housing through the vacuum gripping assembly, positioning it using the dual-spectrum vision system, and applying a 20-50N pressing force to make the heat-generating chip fit the heat-conducting surface; Step S7, curing treatment: pre-curing at 80°C for 2 hours and final curing at 120°C for 1 hour are performed in stages, and during the curing process, the contact pressure is maintained and the deformation of the adhesive layer is monitored.

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