Manufacturing device for removing gold finger lead and manufacturing method thereof

Abstract

The invention provides a device and a method for manufacturing and removing a golden finger lead, which are used for the manufacturing process of cutting the golden finger lead of a printed circuit board by a laser cutting machine and comprise a data conversion device and a positioning device. The data conversion device is used for converting gold finger lead position data and customer demand size data from a GEBER file into a DXF file and selecting a plurality of positioning optical points. And the positioning device is used for positioning the laser cutting machine at a to-be-cut position of the printed circuit board according to the plurality of optical points and removing the golden finger lead.

Description

Technical Field

[0001] A manufacturing device and method for removing gold finger leads, especially a manufacturing device and method for laser cutting gold finger leads. Background Art

[0002] For some types of gold fingers in the application part of a printed circuit board (PCB), the leads do not need to be retained during shipment. The traditional processing flow requires adding an anti-etching material after gold plating and then etching to remove the wires.

[0003] There was once a technical process for removing wires: 1. wet film / dry film, 2. exposure, 3. gold plating fingers, 4. film removal, 5. outer layer lamination, 6. etching, 7. film removal.

[0004] However, the traditional process has a series of problems, including a long process, low efficiency, and high cost. In the traditional process, when choosing to use chemical ink or dry film, the high temperature after gold plating may cause the film to fall off, and then the metal layer may also fall off. At the same time, due to possible offset problems, copper leakage may also occur in the gold finger area. These adverse factors not only affect the efficiency of the manufacturing process but may also have an adverse impact on the quality and reliability of the final product.

[0005] Therefore, how to develop a manufacturing device and method for gold finger leads that can solve the above problems has become an issue to be solved in the relevant technical field. Summary of the Invention

[0006] To solve the above problems, according to one embodiment, the present invention provides a manufacturing method for removing gold finger leads for a printed circuit board manufacturing process, including the following steps: converting the gold finger lead position data and customer required dimension data from a GEBERR file to a DXF file and selecting multiple positioning optical points. Setting the cutting speed of a laser cutting machine to 700 - 1500 m / s and a related specific condition. And using a laser to cut the gold finger leads.

[0007] According to another embodiment, at least three of the above-mentioned multiple positioning optical points are selected from the DXF file.

[0008] According to another embodiment, the above-mentioned laser cutting machine is an ultraviolet picosecond laser cutting machine.

[0009] According to another embodiment, the above-mentioned related specific condition is a cutting frequency of 100 - 140 KHZ or a current of 6 - 10 A.

[0010] According to one embodiment, the present invention provides a device for manufacturing a gold finger lead removal, for a laser cutting machine to cut the gold finger leads of a printed circuit board manufacturing process, including a data conversion device and a positioning device.

[0011] The above data conversion device is used to convert the data of the gold finger lead position and the customer required dimension data from a GEB file into a DXF file and select a plurality of positioning optical points. The above positioning device positions the above laser cutting machine at the position to be cut on the above printed circuit board according to a plurality of optical points. Among them, the cutting speed of the above laser cutting machine is 700 - 1500 m / s.

[0012] According to another embodiment, the cutting frequency of the above laser cutting machine is 100 - 140 KHZ and the current is 6 - 10 A.

[0013] According to another embodiment, the above plurality of optical points are at least three.

[0014] In summary, the efficacy of the manufacturing device and the manufacturing method of the gold finger lead of the present invention lies in the short process, high production efficiency, and relatively low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To make the above technologies, other purposes, features, and advantages of the present invention and the embodiments more obvious and understandable, the descriptions of the attached drawings are as follows:

[0016] Figure 1 Schematic diagram of a printed circuit board before laser cutting the gold finger lead according to an embodiment of the present invention.

[0017] Figure 2 Schematic diagram of laser cutting the gold finger lead according to an embodiment of the present invention.

[0018] Figure 3A Schematic diagram of a printed circuit board after laser cutting the gold finger lead according to an embodiment of the present invention.

[0019] Figure 3B Front view of a printed circuit board after laser cutting the gold finger lead according to an embodiment of the present invention.

[0020] Figure 3C Front view of a printed circuit board after laser cutting the gold finger lead according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Now, reference will be made in detail to the exemplary embodiments of the present invention, which will be illustrated in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout the drawings and the description to refer to the same or like parts. Additionally, the practices of the exemplary embodiments are only one of the implementation manners of the design concept of the present invention, and the following examples are not used to limit the present invention.

[0022] To more specifically illustrate the embodiments of the present invention, the following is accompanied by drawings for illustration. It should be understood that when a component is referred to as being "connected" or "disposed" on another component, it may mean that the component is directly located on the other component, or there may also be an intermediate component through which the component is connected to the other component. Conversely, when a component is referred to as being "directly on another component" or "directly connected to another component", it can be understood that there is no intermediate component defined at this time.

[0023] The decision not to retain the leads when shipping the PCB application part type of gold fingers may depend on the requirements of a specific application, design requirements, and manufacturing processes, and removing the gold finger leads does not affect its efficacy. The following are some possible reasons for not retaining the gold finger leads:

[0024] 1. Specific application requirements: In some applications, the gold fingers may only be used to connect to a specific interface or port, and no additional leads are required. For example, in some products, the gold fingers may only be used to provide power or data connections, and no leads are needed to reduce the size and complexity of the device.

[0025] 2. Design simplification: Removing the leads of the gold fingers may help simplify the PCB design, reduce manufacturing costs, and improve production efficiency at the same time.

[0026] 3. Cost savings: Retaining the leads and performing additional process steps may increase production costs. If the leads are not necessary in a specific application, omitting these steps can save manufacturing costs and improve the competitiveness of the product.

[0027] 4. Consideration of device volume: In some products, the device volume is limited, and eliminating the leads may make the PCB more compact.

[0028] When the present invention removes the gold finger lead 201, a laser cutting machine is directly used to cut the gold finger lead 201, and the process is shorter compared to the traditional process of manufacturing gold fingers 20 without lead residues, as shown in Table 1 below.

[0029] Table 1

[0030] Traditional process Process of the present invention Panel cutting Panel cutting Inner layer Inner layer AOI1 AOI1 Lamination Lamination Drilling Drilling Electroplating Electroplating Outer layer Outer layer In - process inspection In - process inspection 1. Selective chemical solder mask Cancel 2. Gold finger plating Cancel 3. Strip and wash selective chemical ink Cancel 4. Second outer layer Cancel Solder mask Solder mask Legend Legend Shaping Gold finger plating Electrical test Laser cutting of gold finger leads Final inspection Shaping Surface treatment Electrical test Shipping Final inspection Surface treatment Shipping

[0031] It can be seen from Table 1 above that the manufacturing process of the present invention is the same as the traditional manufacturing process before and after, except for the process (marked in bold in Table 1 above) and means of removing the gold finger lead 201.

[0032] The specific implementation method of the traditional process of removing the gold finger lead 201 is as follows.

[0033] 1. Selective solder mask:

[0034] (1) Screen printing of selective chemical oil:

[0035] Printing oil range: +5 mm above the finger, down to the midline of the thick lead, avoiding all holes (including VIA).

[0036] Exposure: Only expose the gold fingers, with the range being +4 mil above the gold fingers and flush with the mid-value of the hypotenuse below. After intermediate inspection, send for gold plating and use separator paper.

[0037] (2) Process of printing selective chemical oil:

[0038] Pretreatment: Includes brushing and sandblasting operations, and other parameters are operated according to PMP.

[0039] Printing: Select selective chemical oil of the model Sun PPR-50EB02, with the ink viscosity of 200±30 dpa.s, and use a 43T screen.

[0040] Pre-baking time: Temperature is 73℃±2, time is 48 minutes, and the standing time is 15 minutes after pre-baking.

[0041] (3) Exposure:

[0042] The required exposure energy is 10 - 11 grids, and other parameters are operated according to PMP.

[0043] (4) Development process:

[0044] The reference line speed of the development line is 3.8 - 4.5 m / min.

[0045] After development, attention should be paid to preventing scratches when collecting the boards. Each board needs to be inserted into a frame to check whether there is unclean development. If necessary, send it back for rework, but the number of rework times is not allowed to exceed two.

[0046] Gloves must be worn during operation to prevent oxidation of the board surface.

[0047] During inspection, it is necessary to confirm the cross alignment marks below the gold fingers within the PCS, and confirm whether the solder mask printing is offset, and the offset standard is ±2 mil.

[0048] 2. Gold plating of gold fingers: Press blue glue on the empty area of the whole board, and gold plate the gold fingers (164 in total, 0.609 * 3.00 mm for the Top layer and Bot layer of a single PCS).

[0049] 3. Stripping and washing selective chemical ink:

[0050] (1) Etching leads: Remove selective chemical oil

[0051] 4. Second outer layer

[0052] (1) Use dry film exposure and development (special dry film, Changchun dry film FF-9075S, thickness 3.0 mil, cover the entire board with dry film, only expose the gold finger leads for etching, and the etching area ranges from the median of the gold finger bevel + 2 mil to more than 10 outside the molding).

[0053] (2) Alkaline etching.

[0054] (3) Remove the dry film.

[0055] (4) Etch the leads: Remove the selected chemical oil → Brush and cover the film → Exposure → Development → Etching → Remove the film.

[0056] After completing the removal of the gold finger leads, continue with steps such as solder mask, text (text printing, impedance testing), molding (bevel required), electrical testing, final inspection, surface treatment, etc.

[0057] Please refer to Figures 1 to 3C . The present invention provides a device for manufacturing the removal of gold finger leads, which is used in the process of laser cutting the gold finger leads 201 of the printed circuit board 10, and includes a data conversion device 110 and a positioning device 120.

[0058] The specific manufacturing method for removing the gold finger leads 201 of the present invention:

[0059] 1. Use the data conversion device 110 to convert the gold finger lead position data and customer required dimension data from GEBERT file to DXF file.

[0060] 2. Set the cutting speed of the laser cutting machine 30 to 700 - 1500 m / s, the cutting frequency to 100 - 140 KHZ, and the current to 6 - 10 A.

[0061] 3. Through the positioning device 120, according to a plurality of optical points, position the laser cutting machine 30 at the position to be cut on the printed circuit board 10, and use the laser to cut the gold finger leads 201.

[0062] After completing the cutting of the gold finger leads 201 (as Figures 3A to 3C shown), continue with steps such as electrical testing, final inspection, surface treatment, etc.

[0063] Among them, the DXF file includes at least three optical points for positioning, and the function of these optical points is to provide position reference to ensure that the laser cutting machine 30 can accurately position and cut the gold finger leads 201. And the laser cutting machine 30 is an ultraviolet picosecond laser cutting machine.

[0064] Among them, the cutting speed, cutting frequency, and operating current of the above-mentioned laser cutting machine 30 are the results of multiple experiments. Table 2 below shows the test results of various laser devices for cutting the gold finger 20 leads.

[0065] Table 2

[0066]

[0067] The above - cited manufacturer's equipment is only an example for testing the relevant specific conditions of the present invention, and is not used to limit the present invention.

[0068] According to the experimental results, the cutting speed of the laser cutting machine of the present invention is set to 700 - 1500 m / s, the cutting frequency is set to 100 - 140 KHZ, and the current is set to 6 - 10 A.

[0069] As described above, compared with the prior art, the present invention has made obvious improvements in the manufacturing process. It not only significantly shortens the process steps, improves the production efficiency, but also is expected to reduce the overall production cost. These advantages make this patent more competitive and are expected to achieve more significant market advantages in the relevant fields.

[0070] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover non - exclusive inclusion, such that a process, method, commodity or equipment comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, commodity or equipment. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, commodity or equipment comprising the said element.

[0071] It should be understood that the examples and embodiments described herein are for illustrative purposes only, and various modifications or changes thereto will be suggested to those skilled in the art and will be included within the spirit and scope of this application and the scope of the appended claims.

Claims

1. A manufacturing method for removing gold finger leads, which is used in the process of printed circuit boards, characterized in that the position data of the gold finger leads and the customer required dimension data of the printed circuit board are converted from a GEBERT file to a DXF file and a plurality of positioning optical points are selected; based on the positioning optical points, the cutting speed of the laser cutting machine is set to 700 - 1500 m / s and related specific conditions; and the gold finger leads are cut using a laser.

2. The manufacturing method for removing the gold finger leads according to claim 1, wherein At least three of the plurality of positioning optical points are selected from the DXF file.

3. The manufacturing method for removing the gold finger leads according to claim 1, characterized in that, The laser cutting machine is an ultraviolet picosecond laser cutting machine.

4. The manufacturing method for removing the finger leads as claimed in claim 1, wherein The related specific conditions are a cutting frequency of 100 - 140 KHZ or a current of 6 - 10 A.

5. A device for manufacturing a printed circuit board with gold finger leads removed, which is used in the process of a laser cutting machine cutting the gold finger leads of a printed circuit board, characterized in that: a data conversion device for converting the position data of the gold finger leads and the customer required dimension data of the printed circuit board from a GEBERT file to a DXF file and selecting a plurality of positioning optical points; and a positioning device for positioning the laser cutting machine at the starting position to be cut on the printed circuit board according to the plurality of positioning optical points; wherein the cutting speed of the laser cutting machine is 700 - 1500 m / s.

6. The device for manufacturing a gold finger lead removal according to claim 5, wherein The cutting frequency of the laser cutting machine is 100 - 140 KHZ and the current is 6 - 10 A.

7. The device for manufacturing a lead for removing a gold finger according to claim 5, characterized in that, The positioning optical points are at least three.

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