High-efficiency double-auxiliary-material manufacturing process for circuit board processing

Abstract

The invention discloses a high-efficiency double-auxiliary-material manufacturing process for circuit board processing. The high-efficiency double-auxiliary-material manufacturing process comprises the following steps: step 1, material preparation and pretreatment; 2, manufacturing an inner layer pattern; step 3, laminating and pressing; fourthly, drilling machining is conducted; 5, chemical copper deposition and electroplating; step 6, resin hole plugging and secondary electroplating; 7, transferring an outer layer dry film and a pattern; step 8, solder mask printing and exposure; ninthly, surface treatment and forming are conducted; and step 10, detecting and packaging. And through mixed arrangement pressing, segmented drilling and automatic alignment, manual intervention is reduced, and the single-batch production period is shortened by 30%. Through target hole optimization, solder mask blocking point improvement and equipment adaptation, the AVI yield is improved from 79.3% to 85% or above, and the overall yield is larger than or equal to 95%. The key process positioning precision is less than or equal to + / -15 microns, the size coefficient fluctuation is less than or equal to + / -0.1%, and the requirement of a high-precision circuit board Through the adaptive design of the technology and the equipment, the compatibility problem of the large-size substrate and the existing small and medium-sized equipment is solved, and the equipment purchase cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and specifically provides a high-efficiency double auxiliary material manufacturing process for circuit board processing. Background Art

[0002] In the production of circuit boards, the processing of large-size double auxiliary material circuit boards (such as 600mm×726mm specifications) faces many challenges. In the prior art, although the segmented drilling technology for large-size substrates (such as patent CN201110293137.7) proposes a method for manufacturing metallized half holes, it is only applicable to medium and small-size substrates and cannot meet the processing requirements of 600mm×726mm specifications, and the positioning accuracy is insufficient (error > ±50μm). In terms of lamination layout, the traditional process (such as patent CN201320879704.1) adopts a fixed layout method, with low utilization rate of the press (only 1-2 substrates can be processed in a single batch), and the equipment tabletop limit is not considered, resulting in low production efficiency.

[0003] In the solder mask printing process, the prior art (such as patent CN201110417588.7) controls the ink overflow through the method of filling holes with green oil, but does not solve the problem of ink flow at the edges of large-size substrates, resulting in solder mask pattern deviation (error > ±20μm) and large fluctuations in the yield rate (the AVI yield rate is only 79.3%). In terms of exposure alignment, traditional semi-automatic exposure machines (such as patent CN201110426959.8) rely on manual-assisted positioning, with a positioning error as high as ±25μm, which cannot meet the requirements of high-precision circuit boards.

[0004] The existing processes have defects such as low automation level, excessive manual intervention, and fluctuating yield rates. For example, in segmented drilling, manual repositioning is required, increasing the single processing time by 30%; the solder mask printing ink flow results in a rework rate as high as 15%; and insufficient equipment adaptation leads to an overall yield rate of only about 85%. Therefore, it is urgent to improve the production efficiency through process innovation and equipment improvement. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-efficiency double auxiliary material manufacturing process for circuit board processing to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A high-efficiency double auxiliary material manufacturing process for circuit board processing, including the following manufacturing steps:

[0007] Step 1. Material preparation and pretreatment: including material selection and inner layer substrate treatment;

[0008] Step 2. Inner layer pattern manufacturing: including exposure and development, and etching and detection;

[0009] Step 3. Laminating: Using the mixed layout technology for typesetting, and after optimizing through the target holes, use a vacuum press for lamination;

[0010] Step 4. Drilling: Adopt horizontal segmented drilling, divide the substrate into left and right parts, use a double-table drilling machine, first punch positioning pins on the left side of the substrate, and after completing the drilling of the left half, reposition the right half and enable 3 spindles to operate synchronously;

[0011] Step 5. Electroless copper plating and electroplating: Use an extended electroless copper plating frame, place the substrate horizontally on the barrel plating line to ensure that the electroless copper plating solution completely covers the board edge area, and perform full-board primary electroplating with an acidic copper plating solution;

[0012] Step 6. Resin plugging and secondary electroplating: Outsource to a professional processor to use a vacuum plugging machine, use a highly fluid epoxy resin, the plugging fullness ≥ 95%, the surface flatness ≤ ±5μm, repeat the electroless copper plating process in Step 5 to ensure the conduction between the plugging hole wall and the outer layer circuit, and the cumulative thickness of the secondary electroplated copper layer reaches 50 ± 5μm;

[0013] Step 7. Outer layer dry film and pattern transfer: Use a large-size film laminating machine (effective width ≥ 750mm), the film laminating temperature is 100 ± 5°C, the speed is 2.5 - 3.0m / min. If the LDI exposure machine connected to the reel-to-reel machine cannot automatically load materials, use manual assisted alignment. Through the cooperation of the substrate edge positioning groove and the exposure table card slot, the exposure energy is 150 - 180mJ / cm 2 , after development, the accuracy of the outer layer circuit is ±15μm;

[0014] Step 8. Solder mask printing and exposure: Through improving the printing process and automatic alignment exposure, achieve that the edge of the solder mask pattern is neat and without deviation after development;

[0015] Step 9. Surface treatment and shaping: Use an outsourced professional line for chemical gold plating, use a large-table milling machine equipped with carbide cutting tools, and perform segmented cutting through the numerical control program. The shaping dimension accuracy is ±0.1mm, and the edge roughness ≤ 50μm;

[0016] Step 10. Inspection and packaging: The finished products after electrical inspection and reliability testing are packaged with anti-static packaging, and 23PNL are stored in batches.

[0017] Preferably, the material selection in Step 1 is specifically as follows: Use Shengyi S1000-2M substrate, L2-L3 layers, with a thickness of 0.71mm, a size of 600mm × 726mm, and 7628RC43% prepreg as the interlayer bonding material. Among them, 2 sheets are laminated for each of the L1-L2 layer and the L3-L4 layer, and the sizes are all 600mm × 726mm;

[0018] The specific treatment of the inner-layer substrate is as follows: the FR-4 substrate is pretreated, including chemical cleaning and surface roughening to enhance the adhesion of the dry film; the dry film is coated using an automatic coater. If the substrate size exceeds the equipment range, a high-precision laminator is used to manually press the dry film to ensure that the film thickness uniformity is ≤ ±5%.

[0019] Preferably, the exposure and development in the second step are as follows: a large-size LDI exposure machine is used, and the effective working range of the large-size LDI exposure machine is ≥ 650 mm × 750 mm. If the equipment is not yet matched, the substrate is placed horizontally on the exposure table in a manual alignment manner, and the exposure energy is set to 120 - 150 mJ / cm 2 , and the position is calibrated through a vision alignment system with an accuracy of ±5 μm; the developer is a 2.5% sodium carbonate solution, the temperature is 30 ± 2 °C, the speed is 2.0 - 2.5 m / min, and the unexposed dry film is removed to form the inner-layer circuit pattern;

[0020] The etching and detection are as follows: an acidic copper chloride etching solution is used, the etching speed is 4.0 - 4.5 m / min, and the circuit accuracy is retained at ±10 μm; the integrity of the circuit is automatically detected by AOI, and the inner-layer size coefficient is controlled at X = 100.0 ± 0.1% and Y = 100.0 ± 0.1%.

[0021] Preferably, the third step is as follows: the mixed arrangement process is adopted, the target board and other part numbers with the same procedure and the same board thickness are combined in a one-row-four manner, the effective range of the press is ≥ 1145 mm × 1295 mm, 4 positioning target holes are added on the long side of the substrate, the diameter of the positioning target holes is 1.0 mm, the spacing is 150 mm, and 2 target holes are retained on the short side to form a "long side 4 + short side 2" target hole layout, which is convenient for the automatic target machine to accurately position, and the positioning error is ≤ ±10 μm. A vacuum press is used, and the lamination parameters are: the heating rate is 2 °C / min, the peak temperature is 170 ± 5 °C, the pressure is 300 - 400 psi, and the holding pressure time is 60 min; the thickness after lamination is controlled at 58 ± 4 mil, and the size coefficient X = 100.0 ± 0.1% and Y = 100.0 ± 0.1%.

[0022] Preferably, in the fourth step, the substrate is divided into left and right parts, and the single processing area is ≤ 300 mm × 726 mm. The parameters for the synchronous operation of 3 main shafts are: the rotation speed is 8000 - 10000 rpm, the feed speed is 0.8 - 1.2 mm / s, the hole position accuracy is ±25 μm, and the hole wall roughness is ≤ 25 μm.

[0023] Preferably, in the fifth step, the parameters for electroless copper plating are as follows: the formaldehyde concentration is 3.0 - 5.0 ml / L, the copper sulfate concentration is 2.0 - 3.0 g / L, the temperature is 30 ± 2 °C, the time is 20 - 25 min, and the copper plating thickness at the board edge is ≥ 25 μm; the parameters for the first electroplating are: the current density is 20 - 25 ASD, the time is 30 - 40 min, and the copper layer thickness reaches 35 ± 5 μm.

[0024] Preferably, the curing conditions for the high - flow epoxy resin in the sixth step are: pre - baking at 120 °C for 30 min and post - baking at 150 °C for 60 min.

[0025] Preferably, the improved printing process in the eighth step is specifically as follows: use a 1.2 m - sized screen plate, the screen mesh is 200 - 250 T, the squeegee pressure is 8 - 10 kg / cm, the angle is 45 - 60 °, the width of the edge stop - dot area of the board is increased from 14 mm to 17 mm to reduce ink overflow; after printing, pre - bake at 75 °C for 15 min, and control the film thickness at 25 - 35 μm;

[0026] The automatic alignment exposure is specifically as follows: adopt a double - auxiliary solder mask DI machine, the effective working range is ≥ 650 mm × 750 mm, adopt a laser alignment system, the positioning error is ≤ ± 15 μm, and the exposure energy is 300 - 400 mJ / cm 2 。

[0027] Preferably, in the ninth step, the thickness of the gold layer in chemical gold plating is 0.05 - 0.1 μm, the thickness of the nickel layer is 3 - 5 μm, and the surface flatness is ≤ ± 10 μm; the effective range of the large - table milling machine is ≥ 700 mm × 800 mm, the rotational speed of the cemented carbide cutting tool is 15000 - 20000 rpm, and the feed rate is 200 - 300 mm / min.

[0028] Preferably, in the tenth step, the electrical detection is specifically as follows: use a flying - probe tester for electrical testing, and the yield rate is ≥ 97%; the AVI detects the solder mask exposure offset, and automatically screens out defective products through an image recognition system;

[0029] The reliability test is specifically as follows: conduct a board curvature detection, the warpage is ≤ 1.5%; conduct a thermal shock test, 260 °C × 10 s, 3 times without delamination, to ensure that the finished product meets industry standards.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] Through processes such as mixed - layout lamination, segmented drilling, and automatic alignment, manual intervention is reduced, and the single - batch production cycle is shortened by 30%. Target - hole optimization, solder - mask dam - point improvement, and equipment adaptation increase the AVI yield from 79.3% to over 85%, and the overall yield is ≥95%. The positioning accuracy of key processes is ≤±15μm, and the size - coefficient fluctuation is ≤±0.1%, meeting the requirements of high - precision circuit boards. Through the design of process - equipment adaptation, the compatibility problem between large - size substrates and existing medium - and small - size equipment is solved, reducing equipment procurement costs. Brief Description of the Drawings

[0032] Figure 1 is the flowchart of the method of the present invention;

[0033] Figure 2 is the double - auxiliary - material layout size diagram of the present invention;

[0034] Figure 3 is the lamination stack - up diagram of the present invention;

[0035] Figure 4 is the target - hole addition diagram of the present invention. Detailed Description of the Embodiments

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0037] Please refer to Figures 1-4 , the present invention provides a high - efficiency double - auxiliary - material manufacturing process for circuit - board processing, including the following manufacturing steps:

[0038] Step 1: Material preparation and pretreatment: including material selection and inner - layer substrate treatment; specifically for material selection, use Shengyi S1000 - 2M substrate, L2 - L3 layers, with a thickness of 0.71mm, a size of 600mm×726mm, and 7628RC43% prepreg as the inter - layer bonding material, where 2 sheets are laminated for each of the L1 - L2 layer and the L3 - L4 layer, and the sizes are both 600mm×726mm;

[0039] Specifically for inner - layer substrate treatment, perform pretreatment on the FR - 4 substrate, including chemical cleaning and surface roughening to enhance the dry - film adhesion; use an automatic coater to coat the dry film. If the substrate size exceeds the equipment range, switch to a high - precision laminator to manually press the dry film to ensure that the film - thickness uniformity is ≤±5%;

[0040] Step 2. Inner layer pattern production: including exposure and development, and etching and detection; specifically for exposure and development, use a large-size LDI exposure machine with an effective working range of the large-size LDI exposure machine ≥ 650mm × 750mm. If the equipment is not yet matched, place the substrate horizontally on the exposure table in a manual alignment manner, set the exposure energy to 120 - 150mJ / cm 2 , calibrate the position through the vision alignment system with an accuracy of ±5μm; the developer is a 2.5% sodium carbonate solution, with a temperature of 30 ± 2°C and a speed of 2.0 - 2.5m / min, to remove the unexposed dry film and form the inner layer circuit pattern;

[0041] Specifically for etching and detection, use an acidic copper chloride etching solution with an etching speed of 4.0 - 4.5m / min, and retain the line accuracy of ±10μm; automatically detect the line integrity through AOI, and control the inner layer size coefficient at X = 100.0 ± 0.1%, Y = 100.0 ± 0.1%;

[0042] Step 3. Lamination: Adopt a mixed arrangement process, combine the target board with other part numbers of the same program and the same board thickness in a one-row-four manner. The effective range of the press is ≥ 1145mm × 1295mm. Add 4 positioning target holes on the long side of the substrate, with a diameter of the positioning target holes of 1.0mm and a spacing of 150mm. Retain 2 target holes on the short side to form a "long side 4 + short side 2" target hole layout for accurate positioning by the automatic target punching machine, with a positioning error ≤ ±10μm. Use a vacuum press, and the lamination parameters are: the heating rate is 2°C / min, the peak temperature is 170 ± 5°C, the pressure is 300 - 400psi, and the holding pressure time is 60min; the thickness after lamination is controlled at 58 ± 4mil, and the size coefficient X = 100.0 ± 0.1%, Y = 100.0 ± 0.1%;

[0043] Step 4. Drilling: Adopt horizontal segmented drilling. Divide the substrate into left and right parts. Use a double-table drilling machine. First, punch positioning pins on the left side of the substrate. After completing the drilling of the left half, reposition the right half and enable 3 spindles to operate synchronously; divide the substrate into left and right parts, and the single processing area ≤ 300mm × 726mm. The parameters for 3 spindles operating synchronously are: the rotational speed is 8000 - 10000rpm, the feed speed is 0.8 - 1.2mm / s, the hole position accuracy is ±25μm, and the hole wall roughness is ≤ 25μm;

[0044] Step 5. Chemical copper deposition and electroplating: Use an extended copper deposition frame, place the substrate horizontally on the barrel plating line, ensure that the copper deposition solution completely covers the board edge area, and perform one-time electroplating on the entire board with an acidic copper plating solution; The parameters for chemical copper deposition are: formaldehyde concentration is 3.0 - 5.0 ml / L, copper sulfate concentration is 2.0 - 3.0 g / L, temperature is 30 ± 2 °C, time is 20 - 25 min, and the copper deposition thickness at the board edge is ≥ 25 μm; The parameters for one-time electroplating are: current density is 20 - 25 ASD, time is 30 - 40 min, and the copper layer thickness reaches 35 ± 5 μm;

[0045] Step 6. Resin plugging of vias and secondary electroplating: Outsource to a professional processor to use a vacuum via plugging machine, use high-fluidity epoxy resin, the via plugging fullness is ≥ 95%, the surface flatness is ≤ ± 5 μm, repeat the chemical copper deposition process in Step 5 to ensure the conduction between the via hole wall and the outer layer circuit, and the cumulative thickness of the secondary electroplated copper layer reaches 50 ± 5 μm; The curing conditions for the high-fluidity epoxy resin are: pre-bake at 120 °C for 30 min and post-bake at 150 °C for 60 min;

[0046] Step 7. Outer layer dry film and pattern transfer: Use a large-size film laminating machine (effective width ≥ 750 mm), the film laminating temperature is 100 ± 5 °C, the speed is 2.5 - 3.0 m / min. If the LDI exposure machine connected to the reel-to-reel machine cannot automatically load the board, use manual auxiliary alignment. Through the cooperation of the positioning slots on the substrate edge and the card slots on the exposure table, the exposure energy is 150 - 180 mJ / cm 2 , and the outer layer circuit accuracy after development is ± 15 μm;

[0047] Step 8. Solder mask printing and exposure: Through improving the printing process and automatic alignment exposure, make the edge of the solder mask pattern neat and without deviation after development; The improvement of the printing process is specifically as follows: use a 1.2 m specification screen, the screen mesh is 200 - 250 T, the squeegee pressure is 8 - 10 kg / cm, the angle is 45 - 60°, the width of the board edge stop point area is increased from 14 mm to 17 mm to reduce the ink overflow; After printing, perform pre-baking at 75 °C for 15 min to control the film thickness at 25 - 35 μm;

[0048] The automatic alignment exposure is specifically as follows: Use a double-assistant solder mask DI machine, the effective working range is ≥ 650 mm × 750 mm, use a laser alignment system, the positioning error is ≤ ± 15 μm, and the exposure energy is 300 - 400 mJ / cm 2 ;

[0049] Step 9, Surface Treatment and Molding: Use an outsourced professional line for chemical gold plating. Employ a large-table gong machine equipped with cemented carbide cutting tools. Segmentally cut through a numerical control program with a forming dimensional accuracy of ±0.1 mm and an edge roughness of ≤50 μm; the thickness of the gold layer in chemical gold plating is 0.05 - 0.1 μm, the thickness of the nickel layer is 3 - 5 μm, and the surface flatness is ≤±10 μm; the effective range of the large-table gong machine is ≥700 mm × 800 mm, the rotational speed of the cemented carbide cutting tool is 15,000 - 20,000 rpm, and the feed rate is 200 - 300 mm / min;

[0050] Step 10, Inspection and Packaging: The finished products after electrical inspection and reliability testing are packaged with anti-static packaging and stored in batches of 23 PNL; specifically for electrical inspection, use a flying probe tester for electrical testing with a yield rate of ≥97%; use AVI to detect the offset of solder mask exposure and automatically screen defective products through an image recognition system;

[0051] Specifically for the reliability test, conduct board curvature detection with a warpage of ≤1.5%; perform a thermal shock test at 260°C × 10 s for 3 times without delamination to ensure that the finished products meet industry standards.

[0052] During specific implementation:

[0053] The material selection is as shown in the following table:

[0054]

[0055]

[0056] Taking the L241C4068CPX7 double - auxiliary material circuit board as an example, the specific implementation steps are as follows:

[0057] 1. Prepare the substrate and PP according to the above material preparation steps. After inner - layer pretreatment, press the dry film;

[0058] 2. Use manual alignment LDI exposure, develop and etch to form the inner - layer circuit, and detect that the size coefficient meets the standard;

[0059] 3. During lamination, mix - arrange with materials of the same specification number, use the optimized target - hole layout for automatic target punching, and complete the laminated lamination;

[0060] 4. Drill in segments, detect the hole - position accuracy after each segment of processing to ensure no deviation;

[0061] 5. Prolong the frame for electroless copper plating, perform resin plug - hole after secondary electroplating, and outsource the treatment to ensure the quality of the plug - hole;

[0062] 6. Manually align and expose the outer - layer dry film, use a 1.2 m screen for solder - mask printing, and automatically expose with a DI machine;

[0063] 7. After outsourcing immersion gold plating, use a large-table gong machine for forming, and detect electrical testing, AVI, and board curvature;

[0064] 8. Package the qualified products and store them in the warehouse, record the yield rate and process parameters, and continuously optimize the process.

[0065] In summary, through process innovation and equipment adaptation, the present invention realizes the high-efficiency and high-precision production of large-size double auxiliary material circuit boards, significantly improving the manufacturing level of similar products in the industry.

[0066] Through processes such as mixed arrangement lamination, segmented drilling, and automatic alignment, manual intervention is reduced, and the single-batch production cycle is shortened by 30%. Optimization of target holes, improvement of solder mask blocking points, and equipment adaptation increase the AVI yield rate from 79.3% to over 85%, and the overall yield rate ≥ 95%. The positioning accuracy of key processes ≤ ±15μm, and the size coefficient fluctuation ≤ ±0.1%, meeting the requirements of high-precision circuit boards. Through the design of process and equipment adaptation, the compatibility problem between large-size substrates and existing medium and small-sized equipment is solved, reducing the equipment procurement cost.

[0067] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-efficiency double-auxiliary material manufacturing process for circuit board processing, characterized by: The production steps include: Step 1: Material preparation and pretreatment: including material selection and inner substrate processing; Step 2: Inner layer pattern production: including exposure and development, etching and testing; Step 3: Lamination and lamination: Use mixed typesetting technology for typesetting, and after target hole optimization, use a vacuum press for lamination; Step 4: Drilling: Use horizontal segmented drilling to divide the substrate into two parts, left and right. Use a double-table drilling machine to first drill a positioning pin on the left side of the substrate. After completing the drilling of the left half, reposition the right half and enable 3 spindles to work synchronously. Step 5, chemical copper deposition and electroplating: Use an extended copper deposition frame to place the substrate horizontally on the barrel plating line, ensure that the copper deposition solution completely covers the edge area of ​​the board, and use acid copper plating solution to electroplate the entire board once; Step 6: Resin plugging and secondary electroplating: The outsourced professional processor uses a vacuum plugging machine and high-flow epoxy resin. The plugging fullness is ≥95%, and the surface flatness is ≤±5μm. Repeat the chemical copper deposition process in step 5 to ensure that the plugging hole wall is conductive with the outer layer circuit. The cumulative thickness of the secondary electroplated copper layer reaches 50±5μm. Step 7, outer layer dry film and pattern transfer: use a large-size laminator, lamination temperature 100±5℃, speed 2.5-3.0m / min, if the LDI exposure machine connected to the retractable board machine cannot automatically load, use manual auxiliary alignment, through the substrate edge positioning groove and the exposure table slot, exposure energy 150-180mJ / cm2, after development, the outer layer circuit accuracy ±15μm; Step 8: Solder mask printing and exposure: By improving the printing process and automatic alignment exposure, the edges of the solder mask pattern are neat and without offset after development; Step 9, surface treatment and molding: Use an external professional line for chemical gold plating, use a large table gong machine, equipped with carbide tools, and cut in sections through CNC programs. The molding size accuracy is ±0.1mm and the edge roughness is ≤50μm; Step 10: Inspection and packaging: Finished products that have passed electrical inspection and reliability testing are packaged in anti-static packaging, and 23PNL is stored in batches.

2. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1 is characterized in that: The material selection in step 1 is specifically as follows: Shengyi S1000-2M substrate, L2-L3 layer, thickness of 0.71mm, size of 600mm×726mm, 7628RC43% prepreg as interlayer bonding material, wherein L1-L2 layer and L3-L4 layer are overlapped by 2 sheets each, and the size is 600mm×726mm; The inner layer substrate processing is specifically to pre-treat the FR-4 substrate, including chemical cleaning and surface roughening to enhance the adhesion of the dry film; an automatic coating machine is used to coat the dry film. If the substrate size exceeds the range of the equipment, a high-precision laminator is used to manually press the dry film to ensure that the film thickness uniformity is ≤±5%.

3. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1 is characterized in that: The exposure and development in step 2 are specifically as follows: a large-size LDI exposure machine is used, and the effective working range of the large-size LDI exposure machine is ≥650mm×750mm. If the equipment is temporarily not matched, the substrate is placed horizontally on the exposure table by manual alignment, and the exposure energy is set to 120-150mJ / cm2. The position is calibrated by the visual alignment system with an accuracy of ±5μm; the developer is 2.5% sodium carbonate solution, the temperature is 30±2°C, and the speed is 2.0-2.5m / min, and the unexposed dry film is removed to form the inner layer circuit pattern; The etching and detection are specifically as follows: using acidic cupric chloride etching solution, etching speed 4.0-4.5m / min, retaining line accuracy ±10μm; automatically detecting line integrity through AOI, and controlling the inner layer size coefficient at X=100.0±0.1%, Y=100.0±0.1%.

4. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1 is characterized in that: Specifically, the step three is to use a mixed row process to combine the target board with other material numbers of the same program and the same board thickness in a row of four. The effective range of the press is ≥1145mm×1295mm. Four positioning target holes are added on the long side of the substrate. The diameter of the positioning target holes is 1.0mm and the spacing is 150mm. Two target holes are reserved on the short side to form a "4 long side + 2 short side" target hole layout, which is convenient for the automatic target shooting machine to accurately position, and the positioning error is ≤±10μm. A vacuum press is used, and the pressing parameters are: the heating rate is 2℃ / min, the peak temperature is 170±5℃, the pressure is 300-400psi, and the holding time is 60min; the thickness after pressing is controlled at 58±4mil, and the dimensional coefficients X=100.0±0.1%, Y=100.0±0.1%.

5. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1 is characterized in that: In step 4, the substrate is divided into two parts, the single processing area is ≤300mm×726mm, and the parameters of the three spindles working synchronously are: the rotation speed is 8000-10000rpm, the feed speed is 0.8-1.2mm / s, the hole position accuracy is ±25μm, and the hole wall roughness is ≤25μm.

6. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1 is characterized in that: In the step 5, the chemical copper deposition parameters are: formaldehyde concentration is 3.0-5.0 ml / L, copper sulfate concentration is 2.0-3.0 g / L, temperature is 30±2°C, time is 20-25 min, and the copper deposition thickness of the board edge is ≥25 μm; the parameters of the primary electroplating are: current density is 20-25 ASD, time is 30-40 min, and the copper layer thickness reaches 35±5 μm.

7. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1 is characterized in that: The curing conditions of the high-fluidity epoxy resin in step six are: pre-baking at 120° C. for 30 minutes and post-baking at 150° C. for 60 minutes.

8. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1 is characterized in that: The improved printing process in step eight is specifically as follows: using a 1.2m screen with a mesh size of 200-250T, a scraper pressure of 8-10kg / cm, an angle of 45-60°, and increasing the width of the plate edge stop area from 14mm to 17mm to reduce ink overflow; pre-baking at 75°C×15min after printing to control the film thickness to 25-35μm; The automatic alignment exposure specifically adopts a double auxiliary material anti-welding DI machine with an effective working range of ≥650mm×750mm, a laser alignment system, a positioning error of ≤±15μm, and an exposure energy of 300-400mJ / cm2.

9. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1, characterized in that: The thickness of the gold layer of the chemical gold plating in step nine is 0.05-0.1 μm, the thickness of the nickel layer is 3-5 μm, and the surface flatness is ≤±10 μm; the effective range of the large table gong machine is ≥700mm×800mm, the rotation speed of the carbide tool is 15000-20000rpm, and the feed speed is 200-300mm / min.

10. The high-efficiency double-auxiliary material manufacturing process for circuit board processing according to claim 1, characterized in that: The electrical testing in step 10 specifically includes: using a flying probe tester to perform electrical testing, with a yield rate of ≥97%; AVI detection of solder mask exposure offset, and automatic screening of defective products through an image recognition system; The reliability test specifically includes: board curvature detection, warpage ≤1.5%; thermal shock test, 260℃×10s, 3 times without delamination, to ensure that the finished product meets industry standards.

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