Dispensing reinforcement method and system for electronic component

Abstract

The invention relates to the technical field of component packaging, and particularly discloses an electronic component dispensing reinforcement method and system, and the method comprises the steps: determining four corners of a housing of an electronic component and at least two symmetrically distributed preset positions at the bottom of the housing as target point locations; wherein a PCB (Printed Circuit Board) of the electronic component is connected with the shell through positioning holes formed in the four corners; layered dispensing reinforcement is carried out between the PCB and each target point location, and the electronic component after dispensing reinforcement is obtained; wherein the layered dispensing reinforcement process comprises the following steps: firstly, coating a contact surface of a target point location and the PCB with a high-elasticity buffer glue layer, and after the high-elasticity buffer glue layer is cured, coating the outer surface of the high-elasticity buffer glue layer with a rigid support glue layer. According to the invention, the stress distribution of the electronic component can be optimized, the risk of device failure caused by stress concentration is reduced, and the reliability and stability of the electronic component are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of component packaging, and particularly to a method and system for dispensing and strengthening electronic components. Background Art

[0002] At present, multi-lead ceramic quad flat pack digital signal processors (hereinafter referred to as "devices") are widely used in the field of high reliability. However, when the device is subjected to external actions such as high-intensity vibration, shock, or temperature cycling, stress will concentrate on the pins of the device housing, resulting in pin fracture and failure of the device. Using silicone or epoxy glue to dispense and strengthen between the four corners of the device housing and the printed circuit board (hereinafter referred to as "PCB board") cannot provide sufficient protection for the device.

[0003] Therefore, there is an urgent need to provide a technical solution to solve the above problems. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a method and system for dispensing and strengthening electronic components.

[0005] In a first aspect, the present invention provides a method for dispensing and strengthening electronic components. The technical solution of this method is as follows: Determine the four corners of the housing of the electronic component and at least two symmetrically distributed preset positions at the bottom of the housing as target points; wherein, the PCB board of the electronic component is connected to the housing through positioning holes provided at the four corners. Perform hierarchical dispensing and strengthening between the PCB board and each target point to obtain an electronic component after dispensing and strengthening; wherein, the process of hierarchical dispensing and strengthening is: first coat a high-elastic buffer glue layer on the contact surface between the target point and the PCB board, and after the high-elastic buffer glue layer is cured, coat a rigid support glue layer on the outer surface of the high-elastic buffer glue layer.

[0006] The beneficial effects of a method for dispensing and strengthening electronic components of the present invention are as follows: The method of the present invention can optimize the stress distribution of electronic components, reduce the risk of device failure caused by stress concentration, and improve the reliability and stability of electronic components.

[0007] On the basis of the above solution, a method for dispensing and strengthening electronic components of the present invention can also be improved as follows.

[0008] In an optional manner, the at least two symmetrically distributed preset positions include: the center point at the bottom of the housing and preset points symmetrically distributed at the edge of the middle area at the bottom of the housing.

[0009] In an alternative approach, the step of performing hierarchical dispensing reinforcement between the PCB board and each target point to obtain the electronically component after dispensing reinforcement includes: Using a dual-channel dispensing device, perform hierarchical dispensing reinforcement between the PCB board and each target point to obtain the electronically component after dispensing reinforcement; wherein, the first channel of the dual-channel dispensing device outputs a highly elastic colloid with a colloid temperature within a first temperature range to form the highly elastic buffer glue layer; the second channel of the dual-channel dispensing device outputs a rigid colloid with a colloid temperature within a second temperature range to form the rigid support glue layer in a manner that covers the highly elastic buffer glue layer.

[0010] In an alternative approach, the dispensing material of the dual-channel dispensing device is silicone or epoxy glue, and the elastic modulus of the highly elastic buffer glue layer is less than the elastic modulus of the rigid support glue layer.

[0011] In an alternative approach, the first temperature range is: 25 - 35°C; the second temperature range is 45 - 60°C.

[0012] In an alternative approach, the electronically component is: a digital signal processor.

[0013] In a second aspect, the present invention provides an electronically component dispensing reinforcement system, and the technical solution of this system is as follows: It includes: a processing module and an operation module; The processing module is used to: determine the four corners of the housing of the electronically component and at least two symmetrically distributed preset positions at the bottom of the housing as target points; wherein, the PCB board of the electronically component is connected to the housing through positioning holes provided at the four corners. The operation module is used to: perform hierarchical dispensing reinforcement between the PCB board and each target point to obtain the electronically component after dispensing reinforcement; wherein, the process of the hierarchical dispensing reinforcement is: first coat a highly elastic buffer glue layer on the contact surface between the target point and the PCB board, and after the highly elastic buffer glue layer cures, coat a rigid support glue layer on the outer surface of the highly elastic buffer glue layer.

[0014] The beneficial effects of an electronically component dispensing reinforcement system of the present invention are as follows: The system of the present invention can optimize the stress distribution of the electronically component, reduce the risk of device failure caused by stress concentration, and improve the reliability and stability of the electronically component.

[0015] Based on the above solution, an electronically component dispensing reinforcement system of the present invention can also be improved as follows.

[0016] In an alternative embodiment, the at least two symmetrically distributed preset positions include: the central point position at the bottom of the housing and the preset point positions symmetrically distributed at the edge of the middle area at the bottom of the housing.

[0017] In an alternative embodiment, the operation module is specifically configured to: Use a dual-channel dispensing device to perform hierarchical dispensing and reinforcement between the PCB board and each target point position to obtain the electronic component after dispensing and reinforcement; wherein, the first channel of the dual-channel dispensing device outputs a highly elastic colloid with a colloid temperature within a first temperature range to form the highly elastic buffer layer; the second channel of the dual-channel dispensing device outputs a rigid colloid with a colloid temperature within a second temperature range to form the rigid support layer in a manner covering the highly elastic buffer layer.

[0018] In an alternative embodiment, the dispensing material of the dual-channel dispensing device is silicone or epoxy resin, and the elastic modulus of the highly elastic buffer layer is less than that of the rigid support layer.

[0019] The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other objects, features and advantages of the present invention more obvious and understandable, the following specifically describes the embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings are only used to illustrate the embodiments and are not considered as a limitation to the present invention. And throughout the drawings, the same reference numerals are used to represent the same components. In the drawings: Figure 1 is a schematic flow chart of an embodiment of a method for dispensing and reinforcing an electronic component according to the present invention; Figure 2 is one of the schematic diagrams of the principle of dispensing and reinforcing an electronic component; Figure 3 is another schematic diagram of the principle of dispensing and reinforcing an electronic component; Figure 4 is a schematic structural diagram of an embodiment of a dispensing and reinforcing system for an electronic component according to the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The exemplary embodiments of the present invention will be described in more detail below with reference to the drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein.

[0022] Figure 1 shows a schematic flow chart of an embodiment of a method for dispensing and reinforcing an electronic component provided by the present invention. As Figure 1As shown, it includes the following steps: S1. Determine the four corners of the housing of the electronic component and at least two symmetrically distributed preset positions at the bottom of the housing as target points.

[0023] Among them, the electronic component in this embodiment is defaulted to a digital signal processor, specifically a multi-lead ceramic quad flat package digital signal processor, which can also be adjusted according to actual needs and is not limited here. The electronic component includes a housing and a PCB (printed circuit board). The PCB of the electronic component is connected to the housing through positioning holes provided at the four corners. The electronic component in this embodiment can be applied to fields such as aerospace, military equipment, and high-speed communication.

[0024] Among them, the at least two symmetrically distributed preset positions include: the central point position at the bottom of the housing and the preset point positions symmetrically distributed at the edges of the middle area at the bottom of the housing. It should be noted that the middle area at the bottom is defaulted to: the area formed by the midpoints from the central point position at the bottom to the four corners of the housing, which can also be adjusted according to the actual situation and is not limited here. As Figure 2 and Figure 3 shown, the electronic component altogether includes nine target points, namely: the four corners of the housing, one central point position at the bottom of the housing, and four preset point positions at the edges of the middle area at the bottom of the housing.

[0025] S2. Perform hierarchical dispensing reinforcement between the PCB and each target point to obtain the electronic component after dispensing reinforcement.

[0026] Among them, the process of hierarchical dispensing reinforcement is: first coat a high-elastic buffer glue layer on the contact surface between the target point and the PCB. After the high-elastic buffer glue layer is cured, coat a rigid support glue layer on the outer surface of the high-elastic buffer glue layer. The thickness of the high-elastic buffer glue layer is 0.2 - 0.5 mm, and the thickness of the rigid support glue layer is 0.8 - 1.2 mm.

[0027] In an alternative manner, S2 includes: Using a dual-channel dispensing device, perform hierarchical dispensing reinforcement between the PCB and each target point to obtain the electronic component after dispensing reinforcement.

[0028] Among them, the first channel of the dual-channel dispensing device outputs a highly elastic colloid with a colloid temperature within the first temperature range to form a highly elastic buffer glue layer; the second channel of the dual-channel dispensing device outputs a rigid colloid with a colloid temperature within the second temperature range to form a rigid support glue layer in a manner that covers the highly elastic buffer glue layer. The dispensing material of the dual-channel dispensing device is silicone or epoxy glue. The elastic modulus of the highly elastic buffer glue layer is less than that of the rigid support glue layer, and a gradient modulus transition interface is formed between the two glue layers. The first temperature range is: 25 - 35 °C; the second temperature range is 45 - 60 °C. It should be noted that in addition to silicone and epoxy glue, the dispensing material of the first channel of the dual-channel dispensing device can also be silicone rubber, and its elastic modulus is 0.5 - 0.8 MPa; the dispensing material of the second channel of the dual-channel dispensing device can also be carbon fiber-reinforced epoxy resin, and its elastic modulus is 2.5 - 3.5 GPa. The dispensing material can also be adjusted according to the actual situation, and no restrictions are set here.

[0029] Specifically: ① Use the first channel of the dual-channel dispensing device to output a highly elastic colloid to the contact surface between the target point and the PCB board and control the colloid temperature at 25 - 35 °C to coat a highly elastic buffer glue layer with a thickness of 0.2 - 0.5 mm on this contact surface; ② After the highly elastic buffer glue layer is cured, use the second channel of the dual-channel dispensing device to output a rigid colloid to the outer surface of the highly elastic buffer glue layer and heat it to 45 - 60 °C to reduce the viscosity, and then form a rigid support glue layer with a thickness of 0.8 - 1.2 mm in a manner that covers the highly elastic buffer glue layer.

[0030] It should be noted that the dual-channel dispensing device includes two independently controlled channels, which are respectively used to transport different colloids (highly elastic colloid and rigid colloid). Each channel is equipped with an independent metering pump, glue bucket and temperature control module to ensure that the two colloids maintain the preset temperature during output. Each channel is integrated with a temperature adjustment device (such as a heater or cooler), which can perform independent temperature control according to the viscosity characteristics of different colloids.

[0031] It should be noted that controlling the amount of glue for dispensing reinforcement means: by adjusting the pressure control system and motion control system of the dispensing device, accurately control the amount of glue at each target point to ensure the reinforcement effect. The amount, shape, and position of the glue for dispensing reinforcement can all be adjusted according to actual needs, and no restrictions are set here.

[0032] The technical solution of this embodiment can optimize the stress distribution of electronic components, reduce the risk of device failure caused by stress concentration, and improve the reliability and stability of electronic components. Specifically, in this embodiment, the four corners of the housing and the preset positions symmetrically distributed at the bottom are jointly used as target points, and combined with the hierarchical dispensing process, a composite structure of first coating a high-elastic buffer glue layer and then covering a rigid support glue layer is realized, achieving the optimization of stress distribution and the synergistic enhancement of mechanical properties. The elastic glue layer effectively absorbs vibration and shock energy and compensates for thermal expansion differences, and the rigid glue layer provides stable support to suppress the deformation of the housing. The combination of the two forms a gradient mechanical transition, significantly reducing the stress concentration at the root of the pins and enhancing the anti-fatigue performance of the device under complex loads. At the same time, the symmetrically distributed reinforcement points construct a multi-directional support network, enhancing the overall connection rigidity between the housing and the PCB board, avoiding the risk of single-point failure, and improving the reliability and stability of electronic components.

[0033] Figure 4 FIG. shows a schematic structural diagram of an embodiment of a dispensing and reinforcement system 200 for electronic components provided by the present invention. As Figure 4 shown, the system 200 includes: a processing module 210 and an operating module 220; The processing module 210 is configured to: determine the four corners of the housing of the electronic component and at least two preset positions symmetrically distributed at the bottom of the housing as target points; wherein, the PCB board of the electronic component is connected to the housing through positioning holes provided at the four corners; The operating module 220 is configured to: perform hierarchical dispensing and reinforcement between the PCB board and each target point to obtain the electronic component after dispensing and reinforcement; wherein, the process of the hierarchical dispensing and reinforcement is: first coat a high-elastic buffer glue layer on the contact surface between the target point and the PCB board, and after the high-elastic buffer glue layer is cured, cover a rigid support glue layer on the outer surface of the high-elastic buffer glue layer.

[0034] In an optional manner, the at least two preset positions symmetrically distributed include: the center point at the bottom of the housing and preset points symmetrically distributed at the edge of the middle area at the bottom of the housing.

[0035] In an optional manner, the operating module 220 is specifically configured to: Use a dual-channel dispensing device to perform hierarchical dispensing and reinforcement between the PCB board and each target point to obtain the electronic component after dispensing and reinforcement; wherein, the first channel of the dual-channel dispensing device outputs a high-elastic colloid with a colloid temperature within a first temperature range to form the high-elastic buffer glue layer; the second channel of the dual-channel dispensing device outputs a rigid colloid with a colloid temperature within a second temperature range to form the rigid support glue layer in a manner of covering the high-elastic buffer glue layer.

[0036] In an alternative manner, the dispensing material of the dual-channel dispensing device is silicone or epoxy glue, and the elastic modulus of the highly elastic buffer glue layer is less than that of the rigid support glue layer.

[0037] In an alternative manner, the first temperature range is: 25 - 35 °C; the second temperature range is 45 - 60 °C.

[0038] In an alternative manner, the electronic component is: a digital signal processor.

[0039] It should be noted that the beneficial effects of the electronic component dispensing and strengthening system 200 provided in the above embodiments are the same as those of the above electronic component dispensing and strengthening method, and will not be elaborated here. In addition, when the system provided in the above embodiments realizes its functions, only the division of the above functional modules is used for illustration. In actual applications, the above functions can be allocated to different functional modules according to needs, that is, the system can be divided into different functional modules according to actual situations to complete all or part of the functions described above. In addition, the system and method embodiments provided in the above embodiments belong to the same concept, and the specific implementation process can be seen in the method embodiments, which will not be elaborated here.

[0040] In the specification provided here, a large number of specific details are described. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. Similarly, in order to streamline the present invention and help understand one or more of the various aspects of the present invention, in the above description of the exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Among them, the claims following the specific implementation manner are hereby expressly incorporated into the specific implementation manner, and each claim itself is used as a separate embodiment of the present invention.

[0041] It should be noted that the above embodiments illustrate the present invention rather than limit the present invention, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention can be implemented by means of hardware including several different elements and by means of a suitably programmed computer. In the unit claims listing several devices, several of these devices can be embodied by the same hardware item. The use of the words first, second, and third, etc. does not denote any order. These words can be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be construed as limiting the order of execution.

Claims

1. A method for dispensing and strengthening electronic components, characterized in that Including: Determine the four corners of the housing of the electronic component and at least two symmetrically distributed preset positions at the bottom of the housing as target points; wherein, the PCB board of the electronic component is connected to the housing through positioning holes provided at the four corners; Perform hierarchical dispensing reinforcement between the PCB board and each target point to obtain the electronic component after dispensing reinforcement; wherein, the process of hierarchical dispensing reinforcement is: first coat a high-elastic buffer glue layer on the contact surface between the target point and the PCB board, and after the high-elastic buffer glue layer cures, coat a rigid support glue layer on the outer surface of the high-elastic buffer glue layer.

2. The dispensing and reinforcement method for electronic components according to claim 1, wherein The at least two symmetrically distributed preset positions include: the center point position at the bottom of the housing and preset point positions symmetrically distributed at the edge of the middle area at the bottom of the housing.

3. The dispensing and reinforcement method for electronic components according to claim 1, characterized in that, The step of performing hierarchical dispensing reinforcement between the PCB board and each target point to obtain the electronic component after dispensing reinforcement includes: Using a dual-channel dispensing device, perform hierarchical dispensing reinforcement between the PCB board and each target point to obtain the electronic component after dispensing reinforcement; wherein, the first channel of the dual-channel dispensing device outputs a high-elastic colloid with a colloid temperature within a first temperature range to form the high-elastic buffer glue layer; the second channel of the dual-channel dispensing device outputs a rigid colloid with a colloid temperature within a second temperature range to form the rigid support glue layer in a manner of covering the high-elastic buffer glue layer.

4. The dispensing and reinforcement method for electronic components according to claim 3, characterized in that, The dispensing material of the dual-channel dispensing device is silicone glue or epoxy glue, and the elastic modulus of the high-elastic buffer glue layer is less than the elastic modulus of the rigid support glue layer.

5. The method for dispensing and strengthening electronic components according to claim 3, wherein The first temperature range is: 25 - 35 °C; the second temperature range is 45 - 60 °C.

6. The method for dispensing and strengthening electronic components according to any one of claims 1 to 5, characterized in that, The electronic component is: a digital signal processor.

7. An electronic component dispensing and strengthening system, characterized in that, Including: A processing module and an operation module; The processing module is used for: determining the four corners of the housing of the electronic component and at least two symmetrically distributed preset positions at the bottom of the housing as target points; wherein, the PCB board of the electronic component is connected to the housing through positioning holes provided at the four corners; The operation module is used for: performing hierarchical dispensing reinforcement between the PCB board and each target point to obtain the electronic component after dispensing reinforcement; wherein, the process of hierarchical dispensing reinforcement is: first coat a high-elastic buffer glue layer on the contact surface between the target point and the PCB board, and after the high-elastic buffer glue layer cures, coat a rigid support glue layer on the outer surface of the high-elastic buffer glue layer.

8. The electronic component dispensing and reinforcement system according to claim 7, wherein The at least two symmetrically distributed preset positions include: the center point position at the bottom of the housing and preset point positions symmetrically distributed at the edge of the middle area at the bottom of the housing.

9. The dispensing and reinforcement system for electronic components according to claim 7, wherein The operation module is specifically used for: Using a dual-channel dispensing device, perform hierarchical dispensing and reinforcement between the PCB board and each target point to obtain the electronic component after dispensing and reinforcement; wherein, the first channel of the dual-channel dispensing device outputs a highly elastic colloid with a colloid temperature within a first temperature range to form the highly elastic buffer glue layer; the second channel of the dual-channel dispensing device outputs a rigid colloid with a colloid temperature within a second temperature range to form the rigid support glue layer in a manner that covers the highly elastic buffer glue layer.

10. The electronic component dispensing and reinforcement system according to claim 9, wherein, The dispensing material of the dual-channel dispensing device is silicone glue or epoxy glue, and the elastic modulus of the highly elastic buffer glue layer is less than the elastic modulus of the rigid support glue layer.

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