LED dispensing equipment
By using a fence device to collect overflowing glue in the LED dispensing equipment, the short circuit problem caused by the overflow of conductive glue and the problem of unsolid bonding of the LED chip is solved, and a more efficient and reliable dispensing process is achieved.
Patent Information
- Application Number
- CN202510606224.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-12
- Publication Date
- 2025-06-27
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the LED dispensing process, conductive glue is prone to overflow when dispensing to the substrate, resulting in overflow, which may cause short-circuit problems. At the same time, reducing the amount of dispensing will affect the firm adhesion of the LED chip.
An LED dispensing device is designed, and a fence device includes a moving assembly and a receiving groove body. The receiving groove body is arranged at the mobile end of the moving assembly to accommodate the overflowing glue in the dispensing area to ensure that the glue does not overflow to other pads.
Through this equipment, the overflow of the dispensing area is effectively collected, avoiding short circuit problems, and ensuring firm adhesion between the LED chip and the substrate, improving the reliability of the process.
Smart Images
Figure CN120205391A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of glue dispensing, and in particular to an LED glue dispensing device. Background Art
[0002] Glue dispensing is a process, also known as gluing, coating, filling and dripping. It is to apply, fill or drip electronic glue, oil or other liquids onto the product to make the product stick, fill, insulate, fix or smooth the surface.
[0003] In the process of LED glue dispensing, conductive glue is generally used to stick the LED chip to the substrate, fix the LED chip and the substrate, and ensure the stability of the LED chip position. Then the electrodes of the LED chip are electrically connected to the electrodes of the substrate, and then the surface and surrounding of the LED chip are filled with encapsulation glue, such as epoxy resin, to protect the LED chip and reduce the impact of physical impact and environmental factors (such as moisture, temperature changes, etc.). Finally, the encapsulation glue is cured to harden into a solid state to form a protective layer.
[0004] When the LED dispensing equipment dispenses the conductive glue onto the substrate, the conductive glue is in a spherical or teardrop shape, while the LED chip is square. When the LED chip moves downward to squeeze the conductive glue, the conductive glue will overflow from around the LED chip, i.e., glue overflow occurs. During fine wiring, it may overflow to other pads and cause a short circuit. If the amount of glue dispensed is reduced, it is easy to cause the LED chip to fail to be firmly bonded to the substrate. Therefore, the LED dispensing equipment in the related art needs to be improved. Summary of the invention
[0005] In order to improve the situation of glue overflow around LED chips, the present application provides an LED glue dispensing device.
[0006] The present application provides an LED dispensing device, which adopts the following technical solution: An LED glue dispensing device comprises a frame, a carrying platform, a material taking component, a glue dispensing component and a blocking device; the carrying platform is arranged on the frame, and the carrying platform is used to hold a substrate; the glue dispensing component injects glue into a glue dispensing area of the substrate, and the material taking component installs an LED chip in the glue dispensing area; The enclosure device includes a moving component and a receiving groove body, the receiving groove body is arranged at the moving end of the moving component, and the moving component drives the receiving groove body to move; the receiving groove body is arranged on the peripheral side of the glue dispensing area, and the receiving groove body is used to accommodate glue overflowing from the glue dispensing area.
[0007] By adopting the above technical solution, first place the substrate on the carrier table, and then the moving component drives the accommodating groove body to move to the periphery of the dispensing area. The dispensing component injects conductive glue into the dispensing area of the substrate, and the picking component installs the LED chip in the dispensing area. The installation of the LED chip causes the glue in the dispensing area to overflow to the periphery, and the overflowing glue flows into the accommodating groove body for collection, thereby improving the situation of glue overflow around the LED chip.
[0008] Optionally, there are four of the accommodating groove bodies, and the accommodating groove bodies surround the periphery of the dispensing area.
[0009] By adopting the above technical solution, the dispensing component injects glue into the dispensing area, and the picking component causes the LED chip to squeeze the glue, so that the glue overflows from the four sides of the dispensing area, and the four accommodating groove bodies surround the dispensing area and can respectively accommodate the glue overflowing from the four sides of the dispensing area.
[0010] Optionally, the enclosing device further includes a baffle, the moving component drives the baffle to move, and the baffle and the accommodating groove body surround the periphery of the dispensing area.
[0011] By adopting the above technical solution, the baffle and the accommodating groove body surround the periphery of the dispensing area. When the LED chip squeezes the glue, the glue flows towards the accommodating groove body, and the accommodating groove body can collect it centrally. Moreover, the baffle has a simple structure and can reduce the equipment cost.
[0012] Optionally, there are three of the baffles, adjacent baffles are connected, and the three baffles surround three sides of the dispensing area; there is one of the accommodating groove bodies, and the accommodating groove body surrounds the other side of the dispensing area.
[0013] By adopting the above technical solution, the glue in the dispensing area is spherical or water droplet-shaped, and the top of the glue is generally arc-shaped. During the process of the LED chip squeezing the glue, the situation of position deviation may occur. The three baffles can play a role in limiting the side of the LED chip during the downward movement of the LED chip, reducing the situation of position deviation of the LED chip during the process of squeezing the glue. The three baffles and one accommodating groove body surround the four sides of the dispensing area. When the LED chip squeezes the glue, the glue flows towards the accommodating groove body in a directional manner.
[0014] Optionally, the moving component includes an enclosing driving source and extension rods. There are two extension rods. One of the extension rods is connected to the accommodating groove body, and the other extension rod is connected to the baffle; the two extension rods are arranged on the moving end of the enclosing driving source, and the enclosing driving source is used to make the accommodating groove body and the baffle approach each other.
[0015] By adopting the above technical solution, start the enclosure driving source, and the enclosure driving source drives the two extension rods to approach each other, so that the accommodating groove body and the baffle approach each other, thereby enclosing the periphery of the dispensing area.
[0016] Optionally, the material taking assembly includes a three-axis moving module, a support table, a proximity driving source and a material taking head; the three-axis moving module is arranged on the frame, the support table is connected to the moving end of the three-axis moving module, and the three-axis moving module is used to drive the support table to move; The proximity driving source is connected to the support table, the material taking head is connected to the output end of the proximity driving source, the proximity driving source is used to drive the material taking head to move, and the material taking head is used to suck the LED chips.
[0017] By adopting the above technical solution, start the three-axis moving module, the three-axis moving module drives the support table to move, and the support table drives the proximity driving source to move. Start the proximity driving source, and the proximity driving source drives the material taking head to move, so that the material taking head approaches the LED chips located in the material taking area, thereby facilitating the material taking head to suck the LED chips; or the material taking head approaches the glue in the dispensing area, so that the material taking head can press the LED chips against the glue.
[0018] Optionally, an extraction assembly is arranged on the accommodating groove body, and the extraction assembly is used to extract the glue in the accommodating groove body.
[0019] By adopting the above technical solution, after installing multiple LED chips, the accommodating groove body stores a large amount of glue. At this time, start the extraction assembly, and the extraction assembly pumps out the glue in the accommodating groove body, which is convenient for the accommodating groove body to continue storing glue.
[0020] Optionally, the extraction assembly includes an extraction pipe and an extraction pump, and the extraction pipe is respectively communicated with the accommodating groove body and the extraction pump.
[0021] By adopting the above technical solution, start the extraction pump, so that the glue in the accommodating groove body is pumped away through the extraction pipe.
[0022] Optionally, the dispensing assembly includes a support bracket, a pushing driving source and a dispensing head. The pushing driving source is arranged on the support bracket, the dispensing head is connected to the moving end of the pushing driving source, and the pushing driving source is used to drive the dispensing head to extend to the dispensing area.
[0023] By adopting the above technical solution, start the pushing driving source, and the pushing driving source drives the dispensing head to extend to the dispensing area, thereby injecting glue into the dispensing area.
[0024] In summary, the present application includes at least one of the following beneficial effects: 1. The dispensing component injects glue into the dispensing area of the substrate, and the picking component installs the LED chip in the dispensing area. The installation of the LED chip causes the glue in the dispensing area to overflow to the periphery, and the overflowed glue flows into the receiving tank for collection, thereby improving the situation of glue overflow around the LED chip; 2. The baffle can limit the side of the LED chip during the downward movement of the LED chip, reducing the situation of position deviation of the LED chip during the process of squeezing the glue; the baffle and the receiving tank surround the four sides of the dispensing area. When the LED chip squeezes the glue, the glue flows directionally into the receiving tank; 3. After installing multiple LED chips, there is a relatively large amount of glue stored in the receiving tank. The extraction component pumps out the glue in the receiving tank to facilitate the receiving tank to continue storing glue. Description of the Drawings
[0025] Figure 1 is the overall structural schematic diagram of the LED dispensing device according to the embodiment of the present application; Figure 2 is the partial structural schematic diagram of the LED dispensing device according to the embodiment of the present application; Figure 3 is the structural schematic diagram of the dispensing component, extraction component, picking component and enclosing device according to the embodiment of the present application; Figure 4 is the structural schematic diagram of the support table and enclosing device according to the embodiment of the present application.
[0026] Description of the reference numerals: 1, frame; 2, carrier table; 3, picking component; 31, three-axis moving module; 32, support table; 33, proximity driving source; 34, picking head; 4, dispensing component; 41, support bracket; 42, pushing driving source; 43, dispensing head; 5, enclosing device; 51, moving component; 511, enclosing driving source; 512, extension rod; 52, baffle; 53, receiving tank; 6, extraction component; 61, extraction pipe; 62, extraction pump; 63, receiving tank; 100, dispensing area; 200, substrate; 300, LED chip. Detailed Embodiment
[0027] The following will Figures 1-4 further describe the present application in detail.
[0028] The embodiment of the present application provides an LED dispensing device.
[0029] Refer to Figure 1 and Figure 2, the LED dispensing equipment includes a frame 1, a carrier 2 and a material picking component 3, and the material picking component 3 includes a three-axis mobile module 31, a support table 32, a proximity drive source 33 and a material picking head 34. The carrier 2 is fixedly connected to the frame 1, and the carrier 2 is used to place the substrate 200. The body of the three-axis mobile module 31 is fixed on the frame 1, the support table 32 is fixedly connected to the mobile end of the three-axis mobile module 31, and the three-axis mobile module 31 can drive the support table 32 to move in a three-dimensional space. In this embodiment, the proximity drive source 33 specifically adopts an electric push rod, the body of the proximity drive source 33 is fixedly connected to the support table 32, the material picking head 34 is fixedly connected to the mobile end of the proximity drive source 33, and the proximity drive source 33 can drive the material picking head 34 to move in the vertical direction. A material picking area (not shown in the figure) is set on one side of the LED dispensing equipment, and an LED chip 300 is placed in the material picking area. A dispensing area 100 is set on the substrate 200. The three-axis moving module 31 and the proximity driving source 33 can drive the material picking head 34 to move, so that the material picking head 34 can place the LED chip 300 located in the material picking area in the dispensing area 100 of the substrate 200.
[0030] refer to Figure 2 and Figure 3 A glue dispensing assembly 4 is provided on the support platform 32, and the glue dispensing assembly 4 includes a support bracket 41, a driving source 42 and a glue dispensing head 43. The support bracket 41 is fixedly connected to the support platform 32, and the driving source 42 is specifically an electric push rod. The body of the driving source 42 is fixedly connected to the support bracket 41, and the moving end of the driving source 42 is fixedly connected to the glue dispensing head 43. The driving source 42 drives the glue dispensing head 43 to move, so that the glue dispensing head 43 extends into the glue dispensing area 100, and the glue dispensing head 43 can inject glue into the glue dispensing area 100. In this embodiment, the glue injected by the glue dispensing head 43 is specifically conductive glue.
[0031] refer to Figure 2 and Figure 4 The support platform 32 is provided with a fence device 5, which includes a moving assembly 51, and the moving assembly 51 includes a fence driving source 511 and an extension rod 512. The fence driving source 511 specifically adopts an electric clamp, and the body of the fence driving source 511 is fixedly connected to the support platform 32. Two extension rods 512 are provided, and the two extension rods 512 correspond to and are fixedly connected to the two clamping fingers of the fence driving source 511 one by one, respectively, and the fence driving source 511 can make the two extension rods 512 approach or move away from each other.
[0032] refer to Figure 2 and Figure 4, the enclosure device 5 further includes a baffle 52 and a receiving tank 53. The receiving tank 53 is fixedly connected to one of the extension rods 512. There are three baffles 52 provided, and adjacent baffles 52 are connected to each other. The baffle 52 is fixedly connected to the other extension rod 512. When the receiving tank 53 and the baffle 52 approach each other, the three baffles 52 and one receiving tank 53 can surround the four sides of the dispensing area 100. Specifically, the three baffles 52 surround three sides of the dispensing area 100, and the receiving tank 53 surrounds the other side of the dispensing area 100. Moreover, the three baffles 52 and one receiving tank 53 can all abut against the substrate 200, and the notch of the receiving tank 53 communicates with the dispensing area 100.
[0033] Reference Figure 2 and Figure 4 , after the dispensing assembly 4 injects glue into the dispensing area 100, the baffle 52 and the receiving tank 53 surround the four sides of the dispensing area 100. The proximity drive source 33 causes the pick-up head 34 to move downward, so that the LED chip 300 presses the glue, and the overflowing glue flows into the receiving tank 53, so that the overflowing glue can be temporarily stored. Moreover, during the downward movement of the LED chip 300, the three baffles 52 can play a role in limiting the side of the LED chip 300, reducing the situation of position deviation of the LED chip 300 during the process of pressing the glue.
[0034] In other embodiments of this embodiment, the baffle 52 may not be provided, and four receiving tanks 53 may be provided to surround the dispensing area 100, and the glue overflowing from the dispensing area 100 can also be handled. Or, the receiving tank 53 and the baffle 52 can also be set to other numbers, as long as at least one receiving tank 53 is provided, and the sum of the numbers of the receiving tank 53 and the baffle 52 is four.
[0035] Reference Figure 2 and Figure 3 , a pumping assembly 6 is provided on the receiving tank 53. The pumping assembly 6 includes a pumping pipe 61, a pumping pump 62 and a receiving tank 63. The pumping pump 62 is fixedly connected to the support platform 32. The pumping pump 62 communicates with the receiving tank 63, and the receiving tank 63 is detachably connected to the pumping pump 62. One end of the pumping pipe 61 communicates with the receiving tank 53, and the other end of the pumping pipe 61 communicates with the pumping pump 62. The pumping pump 62 can pump the glue temporarily stored in the receiving tank 53 into the receiving tank 63. When a certain amount of glue is stored in the receiving tank 63, the receiving tank 63 is disassembled and replaced with a new one.
[0036] The implementation principle of an LED dispensing device in an embodiment of the present application is as follows: The three-axis movement module 31 and the proximity drive source 33 drive the material taking head 34 to move, and the material taking head 34 sucks the LED chip 300. Subsequently, the three-axis movement module 31 drives the support table 32 to be located above the dispensing area 100, and the enclosure drive source 511 causes the accommodation tank body 53 and the baffle 52 to enclose the periphery of the dispensing area 100, and the dispensing assembly 4 injects glue into the dispensing area 100. Subsequently, the proximity drive source 33 drives the material taking head 34 to move downward, so that the LED chip 300 squeezes the glue, and the overflowing glue flows into the accommodation tank body 53. After the accommodation tank body 53 and the baffle 52 leave the dispensing area 100, the situation of glue overflow around the LED chip 300 can be reduced.
[0037] The above are all preferred embodiments of the present application. Without limiting the protection scope of the present application accordingly, therefore: All equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.
Claims
1. An LED dispensing device, characterized in that: The device comprises a frame (1), a carrying platform (2), a material taking component (3), a glue dispensing component (4) and a blocking device (5); the carrying platform (2) is arranged on the frame (1), and the carrying platform (2) is used to hold a substrate (200); the glue dispensing component (4) injects glue into a glue dispensing area (100) of the substrate (200), and the material taking component (3) installs an LED chip (300) in the glue dispensing area (100); The enclosure device (5) comprises a moving component (51) and a receiving groove (53); the receiving groove (53) is arranged at the moving end of the moving component (51); the moving component (51) drives the receiving groove (53) to move; the receiving groove (53) is arranged on the periphery of the glue dispensing area (100); the receiving groove (53) is used to accommodate glue overflowing from the glue dispensing area (100).
2. The LED dispensing device according to claim 1, characterized in that: Four containing grooves (53) are provided, and the containing grooves (53) surround the periphery of the glue dispensing area (100).
3. The LED dispensing device according to claim 1, characterized in that: The enclosure device (5) further comprises a baffle (52), the moving assembly (51) drives the baffle (52) to move, and the baffle (52) and the containing groove body (53) enclose the periphery of the glue dispensing area (100).
4. The LED dispensing device according to claim 3, characterized in that: Three baffles (52) are provided, and adjacent baffles (52) are connected, and the three baffles (52) enclose three side surfaces of the glue dispensing area (100); one accommodating tank body (53) is provided, and the accommodating tank body (53) encloses another side surface of the glue dispensing area (100).
5. The LED dispensing device according to claim 3, characterized in that: The moving assembly (51) comprises an enclosure drive source (511) and an extension rod (512), wherein two extension rods (512) are provided, wherein one of the extension rods (512) is connected to the containing tank body (53), and the other of the extension rods (512) is connected to the baffle plate (52); the two extension rods (512) are provided at the moving end of the enclosure drive source (511), and the enclosure drive source (511) is used to bring the containing tank body (53) and the baffle plate (52) closer to each other.
6. The LED dispensing device according to claim 1, characterized in that: The material taking assembly (3) comprises a three-axis moving module (31), a support platform (32), an approach driving source (33) and a material taking head (34); the three-axis moving module (31) is arranged on the frame (1), the support platform (32) is connected to the moving end of the three-axis moving module (31), and the three-axis moving module (31) is used to drive the support platform (32) to move; The approach driving source (33) is connected to the support platform (32), and the material taking head (34) is connected to the output end of the approach driving source (33). The approach driving source (33) is used to drive the material taking head (34) to move, and the material taking head (34) is used to absorb the LED chip (300).
7. The LED dispensing device according to claim 1, characterized in that: An extraction component (6) is provided on the containing tank body (53), and the extraction component (6) is used to extract glue in the containing tank body (53).
8. The LED dispensing device according to claim 7, characterized in that: The extraction assembly (6) comprises an extraction pipe (61) and an extraction pump (62), wherein the extraction pipe (61) is respectively connected to the containing tank body (53) and the extraction pump (62).
9. The LED dispensing device according to claim 1, characterized in that: The glue dispensing component (4) comprises a support bracket (41), a driving source (42) and a glue dispensing head (43); the driving source (42) is arranged on the support bracket (41); the glue dispensing head (43) is connected to a movable end of the driving source (42); and the driving source (42) is used to drive the glue dispensing head (43) to extend to the glue dispensing area (100).