Wafer glass slide thickness measuring and classifying device

Abstract

The invention discloses a wafer glass slide thickness measuring and classifying device, which relates to the technical field of wafer glass slide detection and comprises a bottom plate, a first conveying belt and a second conveying belt, the detection assembly is arranged on the bottom plate and is used for detecting the thickness of the wafer glass slide; the conveying assembly is arranged on the first conveying belt and is used for continuously conveying the wafer glass slide to be detected; and the classification assembly is arranged on the second conveying belt and is used for classifying the detected wafer glass slide. According to the wafer glass slide thickness measuring and classifying device, through the arrangement of the detection assembly and the conveying assembly, automatic detection of the thickness of the wafer glass slide is achieved, and meanwhile continuous detection of the thickness of the wafer glass slide and classification after detection are achieved under the cooperation effect of the classifying assembly and the grabbing assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer glass carrier detection, and particularly to a wafer glass carrier thickness measurement and classification device. Background Technique

[0002] A wafer glass carrier is a transparent glass plate used to support and protect wafers during semiconductor manufacturing processes for use in wafer processing. In fields such as semiconductor manufacturing, wafer glass carriers are commonly used in processes such as lithography. The uniformity and accuracy of its thickness are crucial for the quality of optical imaging. If there are significant differences in the thickness of the carriers, it will lead to different light propagation paths, causing changes in the optical path difference, and further reducing the accuracy of the lithography pattern, affecting the performance and yield of products such as chips.

[0003] Existing thickness measurement technologies use robotic arms in cooperation with thickness gauges to perform batch testing on wafer glass carriers. Although they have good detection automation, after the batch thickness detection is completed, the robotic arm needs to classify the glass carriers with thickness less than the requirement, those with thickness exceeding the requirement, and those meeting the thickness requirement before the thickness detection of the next batch of wafer glass carriers can be carried out. This results in an interruption in the thickness detection of wafer glass carriers, making it difficult to achieve the continuity of the thickness detection of wafer glass carriers, and thus affecting the efficiency of the thickness detection of wafer glass carriers. For this reason, we propose a wafer glass carrier thickness measurement and classification device. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer glass carrier thickness measurement and classification device to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A wafer glass carrier thickness measurement and classification device, including a bottom plate and a first conveyor belt and a second conveyor belt arranged on the bottom plate. The first conveyor belt and the second conveyor belt are arranged crosswise, and the conveying surface of the second conveyor belt is located below the first conveyor belt. It further includes a detection component arranged on the bottom plate for thickness detection of wafer glass carriers, a conveying component arranged on the first conveyor belt for continuously conveying the wafer glass carriers to be detected, a classification component arranged on the second conveyor belt for classifying the wafer glass carriers after detection, and a grasping component arranged on the bottom plate for grasping the wafer glass carriers to be detected and the wafer glass carriers after classification.

[0006] Preferably, the detection component includes a U-shaped plate fixedly connected to one side of the bottom plate close to the first conveyor belt. The U-shaped plate straddles the first conveyor belt. A first mounting plate is slidably connected to one side of the U-shaped plate close to the first conveyor belt. The first mounting plate is provided with a laser scanner. The U-shaped plate is provided with a moving component for moving the laser scanner. A signal control cabinet is provided on one side of the U-shaped plate away from the first conveyor belt.

[0007] Preferably, the moving component is a threaded rod and a moving rod arranged between opposite inner walls of the U-shaped plate. One side of the first mounting plate is threadedly connected to the threaded rod, and the other side of the first mounting plate is slidably connected to the moving rod. A motor is provided on one side of the U-shaped plate, and the output end of the motor is connected to the threaded rod.

[0008] Preferably, the conveying component includes a plurality of first mounting holes formed in the first conveyor belt. Each of the first mounting holes is provided with a first mounting frame in a matching manner. One end of the first mounting frame away from the bottom plate is fixedly connected to a first baffle. The first mounting frame is connected to a conveying plate through a rotating component. A plurality of placement holes arranged in a rectangular array are formed on one side of the conveying plate close to the laser scanner. The conveying plate is provided with a limiting component for limiting the wafer glass carrier placed in the placement holes.

[0009] Preferably, the limiting component includes a mounting cavity formed in the conveying plate. A plurality of alternately arranged mounting tubes are provided on the inner wall of the mounting cavity. One side of each mounting tube close to the placement hole is fixedly connected to a connecting tube. Each connecting tube is concentric with the placement hole. One end of each connecting tube away from the mounting tube is fixedly connected to a conical cover. The large end of the conical shape of each conical cover abuts against the inner wall of the mounting cavity. A plurality of air holes arranged in an annular array are formed on the bottom wall of each placement hole. An air extraction pump is provided on one side of the conveying plate away from the placement hole. The working end of the air extraction pump is connected to one of the mounting tubes through a fixed tube.

[0010] Preferably, an electric control valve is provided on the side wall of each connecting tube. Each electric control valve is connected to the signal control cabinet through a wireless controller.

[0011] Preferably, the rotating component includes a first rotating rod and a second rotating rod rotatably connected to opposite inner walls of the first mounting frame. The opposite ends of the first rotating rod and the second rotating rod are connected to the conveying plate. A second mounting plate is fixedly connected to one side of the first mounting frame away from the bottom plate. The second mounting plate is connected to a transmission wheel through a third rotating rod, and a transmission wheel is also fixedly connected to the side wall of the second rotating rod. The two transmission wheels are connected by a transmission belt. An avoidance hole is formed in the side wall of the first mounting frame, and the transmission belt is rotatably connected to the avoidance hole. A motor is provided on one side of the second mounting plate away from the transmission wheel, and the output end of the motor is connected to the third rotating rod.

[0012] Preferably, the classification component includes a plurality of second mounting holes formed in the second conveyor belt. Each of the second mounting holes is provided with a second mounting frame in a matching manner. One end of the second mounting frame away from the bottom plate is fixedly connected with a second baffle, and one side of the second mounting frame close to the bottom plate is sealed.

[0013] Preferably, the grasping component includes two robots arranged on the bottom plate. One of the two robots is located at the conveying starting point of the first conveyor belt and the conveying end point of the second conveyor belt, and the other of the two robots is located at the conveying end point of the first conveyor belt and the conveying starting point of the second conveyor belt. The operating ends of the two robots are connected with a fixed frame. Two symmetrically arranged rotating plates are hinged to one side of the two fixed frames close to the bottom plate. A plurality of grasping plates are fixedly connected to one ends of the two rotating plates away from the fixed frame. The two fixed frames are provided with a driving component for driving each grasping plate.

[0014] Preferably, the driving component includes a cylinder arranged on the fixed frame, and the output end of the cylinder is hinged to the rotating plate through a connecting rod.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] The wafer glass carrier thickness measurement and classification device of the present invention, through the arrangement of the detection component and the conveying component, while realizing the automation of the thickness detection of the wafer glass carrier, through the cooperation of the classification component and the grasping component, makes the glass carriers with thickness less than the requirement and the glass carriers with thickness exceeding the requirement be removed from the qualified wafer glass carriers and classified. And during the process of classifying the detected wafer glass carriers, the detection component can normally detect the next batch of wafer glass carriers, thereby realizing the continuous detection of the thickness of the wafer glass carriers and the classification after detection, and further improving the efficiency of the thickness detection of the wafer glass carriers. Description of the Drawings

[0017] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 is a schematic diagram of the positional structure of the conveying component and the first conveyor belt of the present invention;

[0019] Figure 3 is a schematic diagram of the conveying component structure of the present invention;

[0020] Figure 4 is a schematic diagram of the detection component and the moving component of the present invention;

[0021] Figure 5 is a schematic diagram of the limiting component structure of the present invention;

[0022] Figure 6 Schematic diagram of the classification component structure of the present invention;

[0023] Figure 7 Schematic diagram of the grasping component structure of the present invention;

[0024] Figure 8 is Figure 5 Enlarged view of part A in

[0025] In the figure: 101, bottom plate; 102, first conveyor belt; 103, second conveyor belt; 201, U-shaped plate; 202, first mounting plate; 203, laser scanner; 204, control cabinet; 301, first mounting hole; 302, first mounting frame; 303, first baffle; 304, conveying plate; 305, placing hole; 401, mounting cavity; 402, mounting pipe; 403, connecting pipe; 404, conical cover; 405, air hole; 406, electric control valve; 407, air extraction pump; 501, first rotating rod; 502, second rotating rod; 503, second mounting plate; 504, transmission wheel; 505, avoidance hole; 506, motor; 507, transmission belt; 601, second mounting hole; 602, second mounting frame; 603, second baffle; 701, robot; 702, fixed frame; 703, rotating plate; 704, grasping plate; 801, cylinder; 802, connecting rod; 901, threaded rod; 902, moving rod; 903, motor. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] Embodiment 1

[0028] Please refer to Figures 1-8, A thickness measurement and classification device for a wafer glass carrier in the figure, including a bottom plate 101, a first conveyor belt 102 and a second conveyor belt 103 arranged on the bottom plate 101. The first conveyor belt 102 and the second conveyor belt 103 are arranged in a cross pattern, and the conveying surface of the second conveyor belt 103 is located below that of the first conveyor belt 102. It also includes a detection component arranged on the bottom plate 101 for detecting the thickness of the wafer glass carrier, a conveying component arranged on the first conveyor belt 102 for continuously conveying the wafer glass carrier to be detected, a classification component arranged on the second conveyor belt 103 for classifying the wafer glass carrier after detection, and a gripping component arranged on the bottom plate 101 for gripping the wafer glass carrier to be detected and the wafer glass carrier after classification;

[0029] It should be noted here that: through the setting of the detection component and the conveying component, while realizing the automation of the thickness detection of the wafer glass carrier, under the combined action of the classification component and the gripping component, the glass carriers with thickness less than the requirement and those exceeding the thickness requirement are removed from the qualified wafer glass carriers and classified. Moreover, during the classification of the wafer glass carrier after detection, the detection component can normally detect the next batch of wafer glass carriers, thus realizing the continuous detection of the thickness of the wafer glass carrier and the classification after detection, and further improving the efficiency of the thickness detection of the wafer glass carrier.

[0030] Please refer to Figure 1 and Figure 4 , The detection component in the figure includes a U-shaped plate 201 fixedly connected to one side of the bottom plate 101 close to the first conveyor belt 102. The U-shaped plate 201 straddles the first conveyor belt 102. A first mounting plate 202 is slidably connected to one side of the U-shaped plate 201 close to the first conveyor belt 102. The first mounting plate 202 is provided with a laser scanner 203. The U-shaped plate 201 is provided with a moving component for moving the laser scanner 203. A signal control cabinet 204 is arranged on the side of the U-shaped plate 201 away from the first conveyor belt 102;

[0031] It should be noted here that: through the setting of the detection component, it is convenient to synchronously detect the thickness of multiple wafer glass carriers arranged in a rectangular array, thus ensuring the efficiency of the thickness detection of the wafer glass carrier.

[0032] Please refer to Figure 1 and Figure 4 , The moving component in the figure is a threaded rod 901 and a moving rod 902 arranged between the opposite inner walls of the U-shaped plate 201. One side of the first mounting plate 202 is threadedly connected to the threaded rod 901, and the other side of the first mounting plate 202 is slidably connected to the moving rod 902. A motor 903 is arranged on one side of the U-shaped plate 201, and the output end of the motor 903 is connected to the threaded rod 901;

[0033] It should be noted here that: through the setting of the moving component, it is convenient to drive the laser scanner 203 to move. Furthermore, through the movement of the laser scanner 203, the position of the rectangular array wafer glass carrier can be scanned completely, so as to ensure that the laser beam can irradiate the surface of the wafer glass carrier vertically or approximately vertically to obtain the best scanning effect.

[0034] Please refer to Figure 1 、 Figure 3 and Figure 5 , in the illustrated conveying component, a plurality of first mounting holes 301 are formed in the first conveyor belt 102. Each first mounting hole 301 is provided with a first mounting frame 302 in a matching manner. One end of the first mounting frame 302 far from the bottom plate 101 is fixedly connected with a first baffle 303. The first mounting frame 302 is connected with a conveying plate 304 through a rotating component. A plurality of placement holes 305 arranged in a rectangular array are formed on one side of the conveying plate 304 close to the laser scanner 203. The conveying plate 304 is provided with a limiting component for limiting the wafer glass carrier placed in the placement holes 305;

[0035] It should be noted here that: through the setting of the conveying component, it is convenient to move the wafer glass carrier to be detected and after the detection is completed.

[0036] It is worth noting that: there is a gap between the conveying plate 304 and the first mounting frame 302, which provides a rotating space for the rotation of the conveying plate 304.

[0037] Please refer to Figure 5 and Figure 8 , in the illustrated limiting component, an installation cavity 401 is formed in the conveying plate 304. A plurality of staggered installation pipes 402 are arranged on the inner wall of the installation cavity 401. One side of each installation pipe 402 close to the placement hole 305 is fixedly connected with a connecting pipe 403. Each connecting pipe 403 is concentrically arranged with the placement hole 305. One end of each connecting pipe 403 far from the installation pipe 402 is fixedly connected with a conical cover 404. The large conical ends of each conical cover 404 are abutted against the inner wall of the installation cavity 401. A plurality of air holes 405 arranged in an annular array are formed on the bottom wall of each placement hole 305. An air extraction pump 407 is arranged on one side of the conveying plate 304 far from the placement hole 305. The working end of the air extraction pump 407 is connected with one of the installation pipes 402 through a fixed pipe;

[0038] It should be noted here that: through the setting of the limiting component, it is convenient to limit the wafer glass carrier, so as to ensure the stability of the conveying and detection of the wafer glass carrier.

[0039] Please refer to Figure 5 and Figure 8, on the side walls of each connecting pipe 403 in the figure, there is an electric control valve 406, and each electric control valve 406 is connected to the signal control cabinet 204 through a wireless controller;

[0040] It should be noted here that: through the setting of the electric control valve 406 and the wireless controller, it is convenient to receive and mark the test results, so as to facilitate the removal of glass wafers with a thickness less than the requirement and glass wafers with a thickness exceeding the requirement from the qualified wafer glass wafers.

[0041] Please refer to Figure 5 and Figure 8 , the rotation assembly in the figure includes a first rotating rod 501 and a second rotating rod 502 rotatably connected to opposite inner walls of the first mounting frame 302. One end of the first rotating rod 501 and the second rotating rod 502 facing each other is connected to the conveying plate 304. A second mounting plate 503 is fixedly connected to the side of the first mounting frame 302 away from the bottom plate 101. The second mounting plate 503 is connected with a transmission wheel 504 through a third rotating rod, and a transmission wheel 504 is also fixedly connected to the side wall of the second rotating rod 502. The two transmission wheels 504 are connected by a transmission belt 507. An avoidance hole 505 is opened on the side wall of the first mounting frame 302, and the transmission belt 507 is rotatably connected to the avoidance hole 505. A motor 506 is provided on the side of the second mounting plate 503 away from the transmission wheel 504, and the output end of the motor 506 is connected to the third rotating rod;

[0042] It should be noted here that: through the setting of the rotation assembly, it is used to drive the first mounting frame 302 to rotate, so as to facilitate the removal of glass wafers with a thickness less than the requirement and glass wafers with a thickness exceeding the requirement from the qualified wafer glass wafers.

[0043] Please refer to Figure 1 and Figure 6 , the classification assembly in the figure includes a plurality of second mounting holes 601 opened on the second conveyor belt 103. Each second mounting hole 601 is provided with a second mounting frame 602 in a matching manner. One end of the second mounting frame 602 away from the bottom plate 101 is fixedly connected with a second baffle 603, and the side of the second mounting frame 602 close to the bottom plate 101 is sealed;

[0044] It should be noted here that: through the setting of the classification assembly, two different second mounting frames 602 are used to remove glass wafers with a thickness less than the requirement and glass wafers with a thickness exceeding the requirement from the qualified wafer glass wafers and place them in separate frames, thus realizing the classification of wafer glass wafers.

[0045] Please refer to Figure 1 and Figure 7, in the illustrated grasping assembly, there are two robots 701 arranged on the bottom plate 101. One of the two robots 701 is located at the conveying starting point of the first conveyor belt 102 and the conveying ending point of the second conveyor belt 103, and the other of the two robots 701 is located at the conveying ending point of the first conveyor belt 102 and the conveying starting point of the second conveyor belt 103. The operating ends of the two robots 701 are connected with a fixed frame 702. On one side of the two fixed frames 702 close to the bottom plate 101, there are two symmetrically arranged rotating plates 703 hinged. At the ends of the two rotating plates 703 far from the fixed frame 702, there are fixedly connected multiple grasping plates 704. The two fixed frames 702 are provided with a driving assembly for driving each grasping plate 704;

[0046] It should be noted here that: through the setting of the grasping assembly, it is used to automatically grasp the first mounting frame 302 and the second mounting frame 602, thereby realizing the automatic feeding of the wafer glass carrier and the classification of the wafer glass carrier after the detection is completed.

[0047] Please refer to Figure 1 and Figure 7 , in the illustrated driving assembly, there is a cylinder 801 arranged on the fixed frame 702, and the output end of the cylinder 801 is hinged with the rotating plate 703 through a connecting rod 802;

[0048] It should be noted here that: through the setting of the driving assembly, it is used to push the multiple grasping plates 704 on one side of the fixed frame 702 to move closer to or away from the wafer glass carrier.

[0049] In this solution: a wafer glass carrier thickness measurement and classification device includes the following steps:

[0050] When detecting the thickness of the wafer glass carrier, first place the wafer glass carrier in the placement holes 305 on each conveying plate 304, and by starting the air extraction pump 407, under the conveying action of the gas in each mounting pipe 402 and the connecting pipe 403, under the action of vacuum adsorption, the wafer glass carrier placed in each placement hole 305 is adsorbed and fixed. Using the same operation method, the wafer glass carriers can be placed in advance in multiple conveying plates 304 and vacuum adsorbed and fixed, and then the first mounting frames 302 with the wafer glass carriers placed on them are stacked on top of each other at the conveying starting point of the first conveyor belt 102;

[0051] After the wafer glass carrier to be detected is stacked at the conveying starting point of the first conveyor belt 102, the robot 701 can be started to place a plurality of gripping plates 704 on both sides on both sides of the first baffle 303. Then, by the pushing action of the air cylinder 801, the gripping plates 704 on both sides are abutted against the side walls of the first baffle 303, thereby realizing the gripping of the first baffle 303. After the first baffle 303 is gripped, the robot 701 can be used to move the first mounting frame 302 into the first mounting hole 301 on the first conveyor belt 102 and make the first baffle 303 abut against the side wall of the first conveyor belt 102. At this time, the first conveyor belt 102 can be used to rotate to move the wafer glass carrier to be detected under the laser scanner 203. And after the wafer glass carrier to be detected is conveyed under the laser scanner 203, the first conveyor belt 102 stops running. At this time, the robot 701 can be used to pre-place another first mounting frame 302 with a wafer glass carrier;

[0052] After the wafer glass carrier to be detected is conveyed under the laser scanner 203, the operating software of the three-dimensional laser scanner 203 can be opened. According to the characteristics and measurement requirements of the wafer glass carrier, appropriate scanning parameters are set, including scanning resolution, scanning speed, laser intensity, etc. Then, the motor 903 is started to drive the threaded rod 901 to rotate. During the rotation of the threaded rod 901, under the threaded meshing transmission action of the threaded rod 901 and the first mounting plate 202 and the guiding action of the moving rod 902, the laser scanner 203 will be driven to move. Thus, through the movement of the laser scanner 203, the positions of the rectangular array wafer glass carriers can be completely scanned, so as to ensure that the laser beam can be irradiated on the surface of the wafer glass carrier vertically or approximately vertically to obtain the best scanning effect;

[0053] During the process that the laser scanner 203 starts to emit laser beams to scan the carrier, the laser beams will be reflected on the surface of the carrier. The laser scanner 203 receives the reflected light and records relevant data to obtain the three-dimensional coordinate information of the surface of the carrier;

[0054] After the scanning is completed, the scanned data is imported into professional data processing software such as Geomagic, PolyWorks, etc. for preprocessing the data, including removing noise points, filtering abnormal data, smoothing, etc. to improve the data quality. Then, using the segmentation function of the data processing software, according to the characteristics of the rectangular array and the position information of the carrier, the entire scanned data is segmented into multiple individual carrier areas for calculating the thickness of each carrier separately. For each carrier area, by analyzing the three-dimensional coordinate data of the upper and lower surfaces of the carrier, the thickness of the carrier is calculated. Generally, the thickness of the carrier can be obtained by finding the highest and lowest points on the upper and lower surfaces of the carrier and calculating the distance between the two points as the thickness of the carrier. Then, the thickness data of each calculated carrier is sorted out and output, and reports in the form of tables, charts, etc. can be generated to visually display the thickness measurement results of multiple carriers;

[0055] After the thickness detection of each wafer glass carrier is completed, the detection results of the wafer glass carriers at different positions can be compared, and the glass carriers with thickness less than the requirement and those exceeding the thickness requirement can be marked. After the thickness detection of each wafer glass carrier on the conveying plate 304 is completed, under the conveying action of the first conveyor belt 102, it can be moved out from below the laser scanner 203, and the wafer glass carriers on the next conveying plate 304 can be moved to below the laser scanner 203. And after the laser scanner 203 completes the thickness detection of the wafer glass carriers below, by starting the second conveyor belt 103, the second mounting frame 602 is moved to below the wafer glass carriers after the detection is completed, and the first mounting frame 302 is driven to rotate by the rotating assembly. When the wafer glass carriers that have completed the detection in the first mounting frame 302 are opposite to the second mounting frame 602, the vacuum adsorption force of the wafer glass carriers with thickness less than the requirement can be released according to the pre-marked detection results, and then under the action of gravity, they fall into the second mounting frame 602. Then, the second conveyor belt 103 continues to rotate, moving the next second mounting frame 602 to below the wafer glass carriers, releasing the vacuum adsorption force of the wafer glass carriers exceeding the thickness requirement in the detection results, and then under the action of gravity, they fall into the second mounting frame 602, so that the glass carriers with thickness less than the requirement and those exceeding the thickness requirement are removed from the qualified wafer glass carriers and classified. And during the classification of the wafer glass carriers after the detection is completed, the laser scanner 203 can normally detect the next batch of wafer glass carriers, thus realizing the continuous detection of the thickness of the wafer glass carriers and the classification after the detection, and further improving the efficiency of the thickness detection of the wafer glass carriers.

[0056] It should be noted that, in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0057] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer glass carrier thickness measurement and classification device, comprising: A bottom plate (101) and a first conveyor belt (102) and a second conveyor belt (103) arranged on the bottom plate (101), wherein the first conveyor belt (102) and the second conveyor belt (103) are arranged crosswise, and the conveying surface of the second conveyor belt (103) is located below the first conveyor belt (102); It is characterized by further comprising: A detection component arranged on the bottom plate (101) for detecting the thickness of the wafer glass carrier; A conveying component arranged on the first conveyor belt (102) for continuously conveying the wafer glass carrier to be inspected; A classification component arranged on the second conveyor belt (103) for classifying the wafer glass carriers that have completed the inspection; A gripping assembly is arranged on the bottom plate (101) and is used for gripping the wafer glass carrier to be inspected and the wafer glass carrier after classification.

2. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: The detection component comprises a U-shaped plate (201) fixedly connected to a side of a bottom plate (101) close to a first conveyor belt (102); the U-shaped plate (201) is arranged to straddle the first conveyor belt (102); a first mounting plate (202) is slidably connected to a side of the U-shaped plate (201) close to the first conveyor belt (102); the first mounting plate (202) is provided with a laser scanner (203); the U-shaped plate (201) is provided with a moving component for moving the laser scanner (203); and a signal control cabinet (204) is provided on a side of the U-shaped plate (201) away from the first conveyor belt (102).

3. The device for measuring and classifying the thickness of a wafer glass carrier according to claim 2, characterized in that: The moving assembly is arranged on a threaded rod (901) and a moving rod (902) between two inner walls of the U-shaped plate (201); one side of the first mounting plate (202) is threadedly connected to the threaded rod (901); the other side of the first mounting plate (202) is slidably connected to the moving rod (902); a motor (903) is arranged on one side of the U-shaped plate (201); and an output end of the motor (903) is connected to the threaded rod (901).

4. The device for measuring and classifying wafer glass carrier thickness according to claim 3, characterized in that: The conveying assembly includes a plurality of first mounting holes (301) opened on the first conveying belt (102), each of the first mounting holes (301) is matched with a first mounting frame (302), one end of the first mounting frame (302) away from the bottom plate (101) is fixedly connected to a first baffle (303), the first mounting frame (302) is connected to a conveying plate (304) through a rotating assembly, a side of the conveying plate (304) close to the laser scanner (203) is provided with a plurality of placement holes (305) arranged in a rectangular array, and the conveying plate (304) is provided with a limiting assembly for limiting the position of a wafer glass carrier placed in the placement hole (305).

5. The device for measuring and classifying the thickness of a wafer glass carrier according to claim 4, characterized in that: The limiting assembly comprises an installation cavity (401) opened on the conveying plate (304); the inner wall of the installation cavity (401) is provided with a plurality of staggered installation tubes (402); a connecting tube (403) is fixedly connected to a side of each installation tube (402) close to the placement hole (305); each connecting tube (403) is concentrically arranged with the placement hole (305); a conical cover (404) is fixedly connected to an end of each connecting tube (403) away from the installation tube (402); a conical large end of each conical cover (404) is arranged against the inner wall of the installation cavity (401); a plurality of air holes (405) arranged in a ring array are opened on the bottom wall of each placement hole (305); an air pump (407) is provided on a side of the conveying plate (304) away from the placement hole (305); a working end of the air pump (407) is connected to one of the installation tubes (402) through a fixed tube.

6. The device for measuring and classifying wafer glass carrier thickness according to claim 5, characterized in that: An electric control valve (406) is provided on the side wall of each connecting pipe (403), and each electric control valve (406) is connected to the signal control cabinet (204) via a wireless controller.

7. The device for measuring and classifying wafer glass carrier thickness according to claim 6, characterized in that: The rotating assembly comprises a first rotating rod (501) and a second rotating rod (502) which are rotatably connected to two opposite inner walls of the first mounting frame (302); opposite ends of the first rotating rod (501) and the second rotating rod (502) are connected to the conveying plate (304); a second mounting plate (503) is fixedly connected to a side of the first mounting frame (302) away from the bottom plate (101); the second mounting plate (503) is connected to a transmission wheel (504) through a third rotating rod; and a side wall of the second rotating rod (502) is also fixedly connected to a transmission wheel (504); the two transmission wheels (504) are connected by a transmission belt (507); an avoidance hole (505) is provided on the side wall of the first mounting frame (302); the transmission belt (507) is rotatably connected to the avoidance hole (505); a motor (506) is provided on a side of the second mounting plate (503) away from the transmission wheel (504); and an output end of the motor (506) is connected to the third rotating rod.

8. The device for measuring and classifying the thickness of a wafer glass carrier according to claim 7, characterized in that: The classification component includes a plurality of second mounting holes (601) opened on the second conveyor belt (103), each of the second mounting holes (601) is matched with a second mounting frame (602), one end of the second mounting frame (602) away from the bottom plate (101) is fixedly connected to a second baffle (603), and the second mounting frame (602) is sealed on one side close to the bottom plate (101).

9. The device for measuring and classifying wafer glass carrier thickness according to claim 8, characterized in that: The grabbing assembly comprises two robots (701) arranged on a base plate (101), one of the two robots (701) is located at the conveying starting point of a first conveyor belt (102) and the conveying end point of a second conveyor belt (103), the other of the two robots (701) is located at the conveying end point of the first conveyor belt (102) and the conveying starting point of the second conveyor belt (103), the operating ends of the two robots (701) are connected to a fixed frame (702), two rotating plates (703) arranged symmetrically with each other are hingedly connected on one side of the two fixed frames (702) close to the base plate (101), a plurality of grabbing plates (704) are fixedly connected to one end of the two rotating plates (703) away from the fixed frames (702), and the two fixed frames (702) are provided with a driving assembly for driving each grabbing plate (704).

10. The device for measuring and classifying wafer glass carrier thickness according to claim 9, characterized in that: The driving assembly comprises a cylinder (801) arranged on a fixed frame (702), and an output end of the cylinder (801) is hingedly connected to a rotating plate (703) via a connecting rod (802).

Images