Variable-pitch chip testing device

Abstract

The invention relates to the technical field of semiconductor chip testing, and particularly discloses a variable-pitch chip testing device which comprises a chip feeding mechanism, a transfer mechanism, a testing machine, a variable-pitch transfer mechanism, a carrier transfer mechanical arm and a non-defective product discharging mechanism. The feeding mechanism sends out the storage carrier, the transfer mechanism conveys the testing carrier, and the testing machine carries out chip testing. And the variable-pitch transfer mechanism is used for adjusting the distance between the chips and matching the storage and test carriers. And the carrier transfer manipulator takes out the tested carriers, and the qualified product discharging mechanism stacks and stores qualified chips. According to the variable-pitch chip testing device provided by the invention, the distance between the chips can be adjusted according to testing requirements in the testing process, so that the working space during chip testing is ensured, and the efficiency of the chips in the storage and transportation process is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip testing, and particularly to a variable pitch chip testing device. Background Art

[0002] Before leaving the factory, chips need to be placed in a test carrier, and then the test carrier loaded with multiple chips is sent into a chip tester, and the chip tester performs unified functional tests on multiple chips in the test carrier.

[0003] Generally, in order to ensure that each chip has sufficient test working space, the chip pitch between two adjacent chips in the test carrier is relatively large.

[0004] However, an overly large chip pitch will result in low storage and transportation efficiency of the chips. If a storage carrier with a smaller chip pitch is used to store and transport chips, it cannot meet the test working requirements of the chip tester.

[0005] Therefore, the present invention is committed to researching and developing a variable pitch chip testing device that can adjust the chip pitch according to test needs during the test process, thereby ensuring the working space during chip testing and improving the efficiency of chips during storage and transportation.

[0006] The above information disclosed in this background section is only included to enhance the understanding of the background of the present disclosure, and thus may include information that does not form the prior art already known to those of ordinary skill in the art. Summary of the Invention

[0007] An object of the present invention is to provide a variable pitch chip testing device that can adjust the chip pitch according to test needs during the test process, thereby ensuring the working space during chip testing and improving the efficiency of chips during storage and transportation.

[0008] To achieve the above object, the present invention provides a variable pitch chip testing device, including:

[0009] A chip feeding mechanism for successively sending out a plurality of stacked storage carriers loaded with chips to be tested;

[0010] A transfer mechanism for transporting a test carrier with a chip pitch larger than that of the storage carrier;

[0011] A chip tester for obtaining the test carrier from the transfer mechanism and sending the tested chips together with the test carrier back to the transfer mechanism;

[0012] A variable pitch transfer mechanism, which is used to take out the chips in the storage carrier, adjust the chip pitch to match the test carrier, and then put each chip into the test carrier; and is used to take out the chips in the test carrier, adjust the chip pitch to match the storage carrier, and then put each chip into the storage carrier;

[0013] A carrier transfer manipulator, which is used to take out the storage carrier loaded with the tested chips in the chip feeding mechanism;

[0014] A good product discharging mechanism, which is used to receive the storage carrier loaded with the tested qualified chips taken out by the carrier transfer manipulator and stack and store each storage carrier.

[0015] Optionally, the variable pitch transfer mechanism includes a variable pitch module for sucking each chip and a suction head driving unit for driving the variable pitch module to move.

[0016] Optionally, the variable pitch module includes:

[0017] A plurality of first chip suction heads arranged at intervals;

[0018] A plurality of second chip suction heads, each of which is located between two of the first chip suction heads;

[0019] A synchronous belt, which includes a first straight belt section and a second straight belt section with opposite movement directions. Among them, each of the first chip suction heads is fixed on the first straight belt section, and each of the second chip suction heads is fixed on the second straight belt section;

[0020] A variable pitch motor, which is in transmission connection with the synchronous belt and drives the synchronous belt to rotate so that each of the first chip suction heads approaches or moves away from each of the second chip suction heads.

[0021] Optionally, each of the first chip suction head and the second chip suction head includes a suction head body and a suction head Z-axis linear driving mechanism for driving the suction head body to move up and down.

[0022] Optionally, the suction head driving unit includes a suction head X-axis linear driving mechanism for driving the variable pitch module to move back and forth and a suction head Y-axis linear driving mechanism for driving the suction head X-axis linear driving mechanism to move left and right.

[0023] Optionally, it further includes:

[0024] A defective product discharging mechanism, which is used to stack and store the storage carriers loaded with the tested unqualified chips.

[0025] Optionally, it further includes:

[0026] An empty tray feeding mechanism for successively sending out a plurality of stacked empty storage carriers;

[0027] Wherein, the carrier transfer manipulator is further configured to transfer the empty tray feeding mechanism to the defective discharging mechanism, so that the pitch-changing transfer mechanism can place the chips that fail the test into the empty storage carrier of the defective discharging mechanism.

[0028] Optionally, each of the feeding mechanisms and each of the discharging mechanisms includes:

[0029] A storage frame, a carrier passing slot for the storage carrier to pass through is provided at the middle position of the storage frame, and four limiting columns for horizontally limiting the storage carrier are provided at the top of the storage frame;

[0030] A side-pushing air cylinder located on the storage frame for laterally clamping the second-lowest storage carrier to restrict the storage carriers above the second-lowest from falling downward through the carrier passing slot;

[0031] A lifting mechanism located below the carrier passing slot for receiving the lowest-position storage carrier;

[0032] A buffer rack, the buffer rack includes two oppositely arranged material placing plates, and an interval space for the lifting mechanism to pass through is provided between the two material placing plates;

[0033] A carrier linear driving mechanism for driving the lifting mechanism to reciprocate between the storage frame and the buffer rack.

[0034] Optionally, the transfer mechanism includes a first transfer platform, a second transfer platform, a transfer manipulator for performing the transfer operation of the test carrier between the first transfer platform and the second transfer platform, a first transfer linear driving mechanism for driving the first transfer platform to reciprocate between the pitch-changing transfer mechanism and the second transfer platform, and a second transfer linear driving mechanism for driving the second transfer platform to reciprocate between the first transfer platform and the chip tester.

[0035] Optionally, it further includes a buffer platform and a cleaning air nozzle located at the side position of the buffer platform.

[0036] The beneficial effects of the present invention are as follows: A variable pitch chip testing device is provided, and a variable pitch transfer mechanism capable of adjusting the chip pitch is set. During the testing stage, the variable pitch transfer mechanism can adjust the chip pitch to a larger pitch that meets the requirements of the testing machine, ensuring that each chip has sufficient space for testing operations; while during the warehousing and transportation stages, the variable pitch transfer mechanism can adjust the chip pitch to a smaller pitch, thereby improving the space utilization rate of the warehousing carrier and the transportation efficiency.

[0037] Therefore, the variable pitch chip testing device provided by the present invention can adjust the chip pitch according to the testing needs during the testing process, thereby not only ensuring the operation space during chip testing but also improving the efficiency of the chip during warehousing and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0039] Figure 1 Schematic diagram of the front view structure of the variable pitch chip testing device provided for the embodiment;

[0040] Figure 2 Schematic diagram of the rear view structure of the variable pitch chip testing device provided for the embodiment;

[0041] Figure 3 Schematic diagram of the structure of the variable pitch module provided for the embodiment;

[0042] Figure 4 Schematic diagram of the structures of each of the feeding mechanism and the discharging mechanism;

[0043] In the figure:

[0044] 1a, chip feeding mechanism; 1b, good product discharging mechanism; 1c, defective product discharging mechanism; 1d, empty tray feeding mechanism; 101, storage frame; 1011, carrier through slot; 102, side push cylinder; 103, lifting mechanism; 104, buffer rack; 105, carrier linear drive mechanism; 106, limit column;

[0045] 2, transfer mechanism; 201, first transfer platform; 202, second transfer platform; 203, transfer manipulator; 204, first transfer linear drive mechanism; 205, second transfer linear drive mechanism;

[0046] 3, chip testing machine;

[0047] 4. Variable pitch transfer mechanism; 401. Variable pitch module; 4011a. First chip suction head; 4011b. Second chip suction head; 4011a1. Suction head body; 4011a2. Suction head Z-axis linear drive mechanism; 4012. Variable pitch motor; 402. X-axis linear drive mechanism; 403. Y-axis linear drive mechanism;

[0048] 5. Carrier transfer manipulator;

[0049] 6. Buffer platform;

[0050] 7. Cleaning nozzle. Detailed implementation manners

[0051] In the present invention, referring to "embodiment" means that the specific features, structures or characteristics described in combination with the embodiment may be included in at least one embodiment of the present invention. The term "embodiment" appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it particularly limited to the independence or relevance to other embodiments. In principle, in the present invention, as long as there is no technical contradiction or conflict, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0052] Unless otherwise defined, the meanings of the technical terms used herein are the same as those commonly understood by those skilled in the technical field to which the present invention belongs; the use of the relevant terms herein is only for describing specific embodiments and is not intended to limit the present invention.

[0053] In the description of the present invention, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that there can be three relationships, for example, A and / or B, which means: there is A, there is B, and there is both A and B at the same time. In addition, the character " / " in this article generally represents an "or" logical relationship between the related objects before and after.

[0054] In the present invention, terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, primary-secondary or order relationship between these entities or operations.

[0055] Without further limitation, in the present invention, the expressions such as "comprising", "including", "having" or other similar expressions used in the statements are intended to cover non-exclusive inclusion. These expressions do not exclude that there may be other elements in the process, method or product including the said elements, so that the process, method or product including a series of elements may not only include those defined elements, but also include other elements not explicitly listed, or also include the elements inherent to this process, method or product.

[0056] Similar to the understanding in the "Examination Guidelines", in the present invention, expressions such as "greater than", "less than", "exceeding", etc. are understood as not including the number itself; expressions such as "above", "below", "within", etc. are understood as including the number itself. In addition, in the description of the embodiments of the present invention, the meaning of "a plurality of" is two or more (including two), and similar expressions related to "many" are understood in the same way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically defined.

[0057] In the description of the embodiments of the present invention, the spatially related expressions used, such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "perpendicular", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the specific embodiment or the accompanying drawings. It is only for the convenience of describing the specific embodiments of the present invention or for the reader to understand, rather than indicating or implying that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it cannot be understood as a limitation to the embodiments of the present invention.

[0058] Unless otherwise clearly specified or limited, in the description of the embodiments of the present invention, the terms "installed", "connected", "joined", "fixed", "set", etc. should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two components or the interaction relationship between two components. For those skilled in the technical field to which the present invention belongs, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0059] The present invention provides a variable pitch chip testing device, which is applicable to the application scenario of testing chips. It can adjust the chip pitch according to the testing needs during the testing process, thereby not only ensuring the working space during chip testing but also improving the efficiency during chip storage and transportation.

[0060] See Figures 1 to 2 , the variable pitch chip testing device provided in this embodiment includes a chip feeding mechanism 1a, a transfer mechanism 2, a chip testing machine 3, a variable pitch transfer mechanism 4, a carrier transfer manipulator 5, and a good product discharging mechanism 1b.

[0061] The chip feeding mechanism 1a is used to send out the stacked storage carriers loaded with chips to be tested one by one. The transfer mechanism 2 is used to transport the test carriers with chip spacing greater than that of the storage carriers. The chip tester 3 is used to obtain the test carriers from the transfer mechanism 2 and send back the tested chips together with the test carriers to the transfer mechanism 2.

[0062] The pitch-changing transfer mechanism 4 is used to take out the chips from the storage carriers and adjust the chip pitch to match that of the test carriers, and then put each chip into the test carriers; and is used to take out the chips from the test carriers and adjust the chip pitch to match that of the storage carriers, and then put each chip into the storage carriers.

[0063] The carrier transfer manipulator 5 is used to take out the storage carriers loaded with tested chips in the chip feeding mechanism 1a. The good product discharging mechanism 1b is used to receive the storage carriers loaded with tested qualified chips taken out by the carrier transfer manipulator 5 and stack and store each storage carrier.

[0064] The pitch-changing chip testing device provided in this embodiment works as follows:

[0065] S10: Operation of the chip feeding mechanism 1a:

[0066] The chip feeding mechanism 1a sends out the stacked storage carriers one by one, providing storage carriers for the chip testing preparation process.

[0067] S20: Operation of the pitch-changing transfer mechanism 4:

[0068] The pitch-changing transfer mechanism 4 takes out the chips from the storage carriers sent out by the chip feeding mechanism 1a.

[0069] The manipulator adjusts the pitch between the chips according to the testing requirements to make it match the pitch of the test carriers.

[0070] After adjusting the pitch, the manipulator places the chips into the test carriers provided by the transfer mechanism 2.

[0071] S30: Operation of the transfer mechanism 2:

[0072] The transfer mechanism 2 is responsible for transporting the test carriers with chip spacing greater than that of the storage carriers to the chip tester 3.

[0073] S40: Operation of the chip tester 3:

[0074] The chip tester 3 receives the test carriers from the transfer mechanism 2 and conducts functional tests.

[0075] After the test is completed, the chip tester 3 sends the test carrier with the tested chips back to the transfer mechanism 2, and the transfer mechanism 2 then sends the test carrier back to the variable pitch manipulator;

[0076] S50: The variable pitch transfer mechanism 4 operates again:

[0077] The variable pitch transfer mechanism 4 takes out the tested chips sent by the transfer mechanism 2 from the test carrier and adjusts the chip pitch to match the pitch of the storage carrier.

[0078] After the adjustment is completed, the manipulator places the chips back into the storage carrier of the chip feeding mechanism 1a.

[0079] S60: The carrier transfer manipulator 5 operates:

[0080] The carrier transfer manipulator 5 takes out the storage carrier loaded with the tested chips from the chip feeding mechanism 1a and places it into the good product discharging mechanism 1b;

[0081] S70: The good product discharging mechanism 1b operates:

[0082] The good product discharging mechanism 1b receives the storage carrier taken out by the carrier transfer manipulator 5 and stacks and stores the storage carrier for easy storage and transportation.

[0083] The variable pitch chip testing device provided in this embodiment is provided with a variable pitch transfer mechanism 4 that can adjust the chip pitch. During the testing stage, the variable pitch transfer mechanism 4 can adjust the chip pitch to a larger pitch that meets the requirements of the tester, ensuring that each chip has sufficient testing space; while in the storage and transportation stage, the variable pitch transfer mechanism 4 can adjust the chip pitch to a smaller pitch, thereby improving the space utilization rate of the storage carrier and the transportation efficiency.

[0084] Therefore, the variable pitch chip testing device provided by the present invention can adjust the chip pitch according to the testing needs during the testing process, thereby not only ensuring the working space during chip testing but also improving the efficiency of the chips during storage and transportation.

[0085] The variable pitch transfer mechanism 4 includes a variable pitch module 401 for sucking each of the chips and a suction head driving unit for driving the variable pitch module 401 to move.

[0086] See Figure 3 , the variable pitch module 401 includes a plurality of first chip suction heads 4011a arranged at intervals, a plurality of second chip suction heads 4011b, a synchronous belt, and a variable pitch motor 4012.

[0087] Each of the second chip suckers 4011b is located between two of the first chip suckers 4011a. The synchronous belt includes a first straight belt section and a second straight belt section with opposite movement directions. Among them, each of the first chip suckers 4011a is fixed on the first straight belt section, and each of the second chip suckers 4011b is fixed on the second straight belt section. The pitch-changing motor 4012 is drivingly connected to the synchronous belt to drive the synchronous belt to rotate, so that each of the first chip suckers 4011a approaches or moves away from each of the second chip suckers 4011b.

[0088] Both the first chip sucker 4011a and the second chip sucker 4011b include a sucker body 4011a1 and a sucker Z-axis linear driving mechanism 4011a2 for driving the sucker body 4011a1 to move up and down. The sucker driving unit includes a sucker X-axis linear driving mechanism 402 for driving the pitch-changing module 401 to move back and forth, and a sucker Y-axis linear driving mechanism 403 for driving the sucker X-axis linear driving mechanism 402 to move left and right.

[0089] The sucker X-axis linear driving mechanism 402, the sucker Y-axis linear driving mechanism 403, and the sucker Z-axis linear driving mechanism 4011a2 cooperate with each other to drive each of the sucker bodies 4011a1 to perform translational movements up, down, left, right, and back and forth, so as to transfer the chips.

[0090] The pitch-changing type chip testing device further includes a defective discharging mechanism 1c and an empty tray feeding mechanism 1d. The defective discharging mechanism 1c is used for stacking and storing the storage carriers loaded with the chips that fail the test. The empty tray feeding mechanism 1d is used for sending out the stacked several empty storage carriers one by one. Among them, the carrier transfer manipulator 5 is also used to transfer the empty tray feeding mechanism 1d to the defective discharging mechanism 1c, so that the pitch-changing transfer mechanism 4 can put the chips that fail the test into the empty storage carriers of the defective discharging mechanism 1c.

[0091] The empty tray feeding mechanism 1d sends out the empty storage carriers, and then the carrier transfer manipulator 5 transfers the empty tray feeding mechanism 1d to the defective discharging mechanism 1c. The pitch-changing transfer mechanism 4 can then put the chips that fail the test into the empty storage carriers of the defective discharging mechanism 1c. After the storage carriers are full, the defective discharging mechanism 1c stacks and stores the storage carriers loaded with the chips that fail the test.

[0092] See Figure 4 , each of the feeding mechanisms and each of the discharging mechanisms includes a storage frame 101, a side pushing air cylinder 102, a lifting mechanism 103, a buffer rack 104, and a carrier linear driving mechanism 105.

[0093] A vehicle passing slot 1011 for the storage carrier to pass through is provided at the middle position of the storage bin 101, and four limiting columns 106 for horizontally limiting the storage carrier are provided at the top of the storage bin 101. The side push cylinder 102 is located on the storage bin 101 and is used for laterally clamping the storage carrier at the second lowest position to restrict the storage carriers at the second lowest position and above from falling downward through the vehicle passing slot 1011. The lifting mechanism 103 is located below the vehicle passing slot 1011 and is used for receiving the storage carrier at the first lowest position. The buffer rack 104 includes two oppositely arranged feeding plates, and an interval space for the lifting mechanism 103 to pass through is provided between the two feeding plates. The vehicle linear driving mechanism 105 drives the lifting mechanism 103 to reciprocate between the storage bin 101 and the buffer rack 104.

[0094] When it is necessary to convey the storage carrier from the storage bin 101 to the buffer rack 104, the operation process is as follows:

[0095] ① The side push cylinder 102 clamps the storage carrier at the second lowest position to prevent the storage carriers at the second lowest position and above from falling downward;

[0096] ② The lifting mechanism 103 moves upward to receive the storage carrier at the first lowest position, and then moves downward, so that the storage carrier at the first lowest position moves through the vehicle passing slot 1011 to a position lower than the storage bin 101;

[0097] ③ The vehicle linear driving mechanism 105 drives the lifting mechanism 103 to carry the storage carrier to the buffer rack 104, and the lifting mechanism 103 drives the storage carrier to descend, and then places the storage carrier on the buffer rack 104.

[0098] The steps of transferring the storage carrier from the buffer rack 104 to the storage bin 101 are opposite to the above process, and will not be elaborated in this embodiment.

[0099] The transfer mechanism 2 includes a first transfer platform 201, a second transfer platform 202, a transfer manipulator 203 for performing the transfer operation of the test vehicle between the first transfer platform 201 and the second transfer platform 202, a first transfer linear driving mechanism 204 for driving the first transfer platform 201 to reciprocate between the variable pitch transfer mechanism 4 and the second transfer platform 202, and a second transfer linear driving mechanism 205 for driving the second transfer platform 202 to reciprocate between the first transfer platform 201 and the chip tester 3.

[0100] At the beginning, the test vehicle is located in the first transfer platform 201. After the variable pitch transfer mechanism 4 takes out the chips from the storage vehicle and adjusts the pitch, it places them in the test vehicle provided by the first transfer platform 201. Then, the first transfer linear drive mechanism 204 drives the first transfer platform 201 to move to a position close to the second transfer platform 202, and the transfer manipulator 203 transfers the test vehicle to the second transfer platform 202. The second transfer linear drive mechanism 205 transfers the second transfer platform 202 to the chip tester 3, and the chip tester 3 takes out the test vehicle from the second transfer platform 202 and conducts tests.

[0101] After the test is completed, the chip tester 3 sends the test vehicle back to the second transfer platform 202. Then, the first transfer platform 201, the second transfer platform 202, the transfer manipulator 203, the first transfer linear drive mechanism 204, and the second transfer linear drive mechanism 205 cooperate with each other to send the test vehicle back to the initial position, so that the variable pitch transfer mechanism 4 can take out the chips in the test vehicle and put them back into the storage vehicle.

[0102] The variable pitch chip testing device further includes a buffer platform 6 and a cleaning air nozzle 7 located on the side of the buffer platform 6. For chips that need to be retested due to abnormal tests, the variable pitch transfer mechanism 4 can first transfer them to the buffer platform 6 for buffering. Optionally, before putting them into the buffer platform 6, the chips are first transferred above the cleaning air nozzle 7 to clean the bottom of the chips.

[0103] In summary, the variable pitch chip testing device provided in this embodiment has the following advantages:

[0104] ① High flexibility: Through the variable pitch transfer mechanism 4, the chip pitch can be adjusted according to the test requirements to adapt to different test environments and requirements, ensuring that each chip has sufficient test working space.

[0105] ② Efficiency improvement: In the storage and transportation stages, by adjusting the chip pitch, the space utilization rate of the storage vehicle and the transportation efficiency are improved.

[0106] ③ High degree of automation: The entire testing process, including feeding, testing, discharging, etc., is automated, reducing manual operations and lowering labor intensity and production costs.

[0107] ④ Clean and environmentally friendly: There is a cleaning air nozzle 7, which can clean the chips with abnormal tests to ensure the cleanliness and test accuracy of the chips.

[0108] ⑤ Convenient retesting: For chips that need to be retested, they can be buffered through the buffer platform 6 for subsequent processing.

[0109] It should be noted that the linear drive mechanism mentioned in the present invention can be a cylinder, a hydraulic cylinder, an electric cylinder, or a motor screw linear module, etc., and the rotary drive mechanism mentioned can be a brushed motor, a brushless motor, or a rotary cylinder, etc. The specific structural forms of the linear drive mechanism and the rotary drive mechanism are not limited in the present invention.

[0110] Finally, it should be noted that although the above embodiments have been described in the text and drawings of the specification of the present application, the patent protection scope of the present application cannot be limited thereby. Any technical solutions generated by equivalent structure or equivalent process substitution or modification based on the essential concept of the present application and using the content recorded in the text and drawings of the specification of the present application, as well as those directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, etc., are all included in the patent protection scope of the present application.

Claims

1. A variable-distance chip testing device, characterized in that: include: A chip feeding mechanism (1a), the chip feeding mechanism (1a) being used to deliver a plurality of stacked storage carriers loaded with chips to be tested one by one; A transfer mechanism (2), the transfer mechanism (2) being used to transport a test carrier having a chip spacing greater than that of the storage carrier; A chip tester (3), the chip tester (3) being used to obtain a test carrier from the transfer mechanism (2), and to return the tested chip together with the test carrier to the transfer mechanism (2); A variable distance transfer mechanism (4), the variable distance transfer mechanism (4) being used to take out the chips from the storage carrier and adjust the chip spacing to match that of the test carrier, and then place each chip into the test carrier; and for taking out the chips from the tested carrier and adjusting the chip spacing to match that of the storage carrier, and then placing each of the chips into the storage carrier; A carrier transfer robot (5), the carrier transfer robot (5) being used to take out a storage carrier loaded with tested chips from the chip feeding mechanism (1a); A good product unloading mechanism (1b), the good product unloading mechanism (1b) is used to receive the storage carrier loaded with chips that have passed the test taken out by the carrier transfer robot (5), and stack the storage carriers for storage.

2. The variable-distance chip testing device according to claim 1, characterized in that: The variable distance transfer mechanism (4) comprises a variable distance module (401) for sucking each of the chips, and a suction head driving unit for driving the variable distance module (401) to move.

3. The variable-distance chip testing device according to claim 2, characterized in that: The variable pitch module (401) comprises: A plurality of first chip suction tips (4011a) arranged at intervals; A plurality of second chip suction heads (4011b), each of the second chip suction heads (4011b) being located between two of the first chip suction heads (4011a); A synchronous belt, the synchronous belt comprising a first straight belt segment and a second straight belt segment with opposite movement directions, wherein each of the first chip suction heads (4011a) is fixed on the first straight belt segment, and each of the second chip suction heads (4011b) is fixed on the second straight belt segment; A variable pitch motor (4012), the variable pitch motor (4012) being connected to a synchronous belt transmission to drive the synchronous belt to rotate so that each of the first chip suction heads (4011a) moves closer to or farther away from each of the second chip suction heads (4011b).

4. The variable-distance chip testing device according to claim 3, characterized in that: The first chip suction head (4011a) and the second chip suction head (4011b) both comprise a suction head body (4011a1) and a suction head Z-axis linear drive mechanism (4011a2) for driving the suction head body (4011a1) to move up and down.

5. The variable-distance chip testing device according to claim 2, characterized in that: The suction head driving unit comprises a suction head X-axis linear driving mechanism (402) for driving the variable distance module (401) to move forward and backward, and a suction head Y-axis linear driving mechanism (403) for driving the suction head X-axis linear driving mechanism (402) to move left and right.

6. The variable-distance chip testing device according to claim 1, characterized in that: Also includes: A defective unloading mechanism (1c), wherein the defective unloading mechanism (1c) is used to stack and store storage carriers loaded with chips that fail testing.

7. The variable-distance chip testing device according to claim 6, characterized in that: Also includes: An empty tray feeding mechanism (1d), the empty tray feeding mechanism (1d) being used to deliver a plurality of stacked empty storage carriers one by one; The carrier transfer robot (5) is also used to transfer the empty tray feeding mechanism (1d) to the defective unloading mechanism (1c), so that the variable distance transfer mechanism (4) can place the chips that fail the test into the empty storage carrier of the defective unloading mechanism (1c).

8. The variable-distance chip testing device according to claim 7, characterized in that: Each of the feeding mechanisms and each of the unloading mechanisms comprises: A material storage frame (101), wherein a carrier passage slot (1011) is provided in the middle of the material storage frame (101) for a storage carrier to pass through, and four limit columns (106) are provided on the top of the material storage frame (101) for horizontally limiting the storage carrier; A side-pushing cylinder (102), the side-pushing cylinder (102) being located on the material storage frame (101) and being used to laterally clamp the storage carrier at the second lowest position, so as to prevent the storage carriers at and above the second lowest position from falling downward through the carrier slot (1011); A lifting mechanism (103), the lifting mechanism (103) being located below the carrier slot (1011) and being used to receive a first low-position storage carrier; A cache rack (104), the cache rack (104) comprising two oppositely disposed material discharge plates, with a spacing space provided between the two material discharge plates for the lifting mechanism (103) to pass through; A carrier linear drive mechanism (105), wherein the carrier linear drive mechanism (105) drives the lifting mechanism (103) to reciprocate between the material storage frame (101) and the buffer rack (104).

9. The variable-distance chip testing device according to claim 1, characterized in that: The transfer mechanism (2) comprises a first transfer platform (201), a second transfer platform (202), a transfer robot (203) for performing a test carrier transfer operation between the first transfer platform (201) and the second transfer platform (202), a first transfer linear drive mechanism (204) for driving the first transfer platform (201) to reciprocate between the variable-distance transfer mechanism (4) and the second transfer platform (202), and a second transfer linear drive mechanism (205) for driving the second transfer platform (202) to reciprocate between the first transfer platform (201) and the chip tester (3).

10. The variable-distance chip testing device according to claim 1, characterized in that: It also includes a cache platform (6) and a cleaning air nozzle (7) located on the side of the cache platform (6).

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