Chip capacitor high-voltage test system and use method thereof

Abstract

The invention discloses a chip capacitor high-voltage test system and a use method thereof. Comprising a feeding mechanism, a loading mechanism, a taking mechanism, a testing mechanism, a discharging mechanism and a control module, optical signal detection is carried out when the chip capacitor enters the feeding station, the vacuum degree of the corresponding vacuum pipeline is detected when the chip capacitor is sucked at the suction station, and test data is collected when the chip capacitor is tested by the test unit; according to the collected signal data and test data, the controller can judge whether material leakage or material stacking occurs when the chip capacitors are fed at the feeding station, whether material leakage occurs when the chip capacitors are sucked at the suction station, and whether chip capacitor detection is qualified or missed according to the collected signal data and test data. And sorting and discharging of chip capacitor detection are ensured. According to the chip capacitor testing device, forty chip capacitors can be tested through one-time material taking of the two suction mechanisms, and the testing efficiency is greatly improved.

Description

Technical Field:

[0001] The present invention belongs to the technical field of chip capacitor production, and particularly relates to a high-voltage test system for chip capacitors and a method for using the same. Background Art:

[0002] After the production of chip capacitors, in order to verify the product performance, the products need to be tested, and one of the tests is the high-voltage test to test the performance of the chip capacitors under high-voltage current.

[0003] Most of the existing high-voltage test equipment adopts a single-piece test method, and the next chip capacitor can only be tested after the previous one is tested, resulting in low test efficiency. How to improve the test efficiency of chip capacitors, and at the same time avoid missing materials and overlapping materials during the loading and unloading process of chip capacitors, and avoid missing inspections during the test of chip capacitors, are problems that need to be solved.

[0004] The information disclosed in this background art section is only intended to enhance the overall understanding of the present invention and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Invention:

[0005] The purpose of the present invention is to provide a high-voltage test system for chip capacitors and a method for using the same, so as to overcome the above-mentioned defects in the prior art.

[0006] To achieve the above object, the present invention provides a high-voltage test system for chip capacitors, including a feeding mechanism, a loading mechanism, a picking mechanism, a testing mechanism, a discharging mechanism, and a control module; the feeding mechanism includes a vibrating feeding tray, a feeding channel, and a discharging mechanism. The vibrating feeding tray is connected to the feeding channel, and the feeding channel extends to the loading mechanism. A discharging mechanism is provided at the outlet of the feeding channel; the loading mechanism includes a loading bottom plate, a loading block, an X-axis moving mechanism, and a loading detection device. The X-axis moving mechanism is arranged along the X-axis direction. The loading bottom plate is arranged on the X-axis moving mechanism. A loading block is movably arranged on the loading bottom plate. The top of the loading block forms a loading area, and loading units are evenly arranged in the loading area. A loading station is arranged in each loading unit. The loading detection device is arranged on the loading bottom plate. The loading detection device includes loading detection units, and two loading detection units correspond to one loading station; the loading area is in front of the outlet of the feeding channel, and the discharging mechanism is above the loading area. The discharging mechanism corresponds to five loading units; the picking mechanism includes a suction mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism, and a bracket. The Y-axis moving mechanisms are symmetrically arranged on the bracket. The Y-axis moving mechanism is arranged along the Y-axis direction. A corresponding Z-axis moving mechanism is arranged on each Y-axis moving mechanism. The Z-axis moving mechanism is arranged along the Z-axis direction. A corresponding suction mechanism is arranged on each Z-axis moving mechanism. The suction mechanisms are symmetrically arranged on both sides of the feeding channel. The suction mechanisms are above the loading area. A picking station is arranged on the suction mechanism. Each picking station corresponds to one loading station; the testing mechanism includes a testing rack and testing units. The testing rack is located between the loading area and the discharging mechanism. The top of the testing rack serves as a testing area, and the testing units are evenly arranged in the testing area. The testing units are connected to an external power supply. Each testing unit corresponds to one picking station; the discharging mechanism includes discharging boxes. The discharging boxes are symmetrically arranged on both sides of the bracket. Each discharging box is correspondingly arranged with one suction mechanism. The discharging box is divided into a qualified product area, an unqualified product area, and a to-be-tested area that are isolated from each other; the control module includes a controller and a vacuum detector. The vacuum detector is arranged on the suction mechanism. Each vacuum detector corresponds to one picking station; the loading detection units, the vacuum detectors, and the testing units serve as collectors, and the collectors are connected to the controller; the discharging mechanism, the X-axis moving mechanism, the suction mechanism, the Y-axis moving mechanism, and the Z-axis moving mechanism serve as actuators, and the actuators are connected to the controller; the moving trajectory of the Y-axis moving mechanism is between the loading area and the discharging box; the controller detects whether there is material leakage during the loading of the chip capacitor by detecting the loading station through the loading detection unit, detects whether there is material leakage during the picking of the chip capacitor by detecting the picking station through the vacuum detector, judges whether there is material stacking during the loading of the chip capacitor by combining the detection data of the loading detection unit and the detection data of the vacuum detector, and judges whether there is missed detection during the testing of the chip capacitor by combining the testing data of the testing unit and the detection data of the vacuum detector;The feeding area is controlled by the X-axis moving mechanism to reciprocate between two suction mechanisms, and the suction mechanism is controlled by the Y-axis moving mechanism to reciprocate between the feeding station - the testing unit - the discharging box, and one suction mechanism lags behind the other suction mechanism by one position.

[0007] Preferably, in the technical solution, the discharging mechanism includes a discharging air cylinder, an air cylinder frame, a discharging plate, and a discharging unit. The air cylinder frame is arranged at the outlet of the feeding channel. The discharging air cylinder is arranged on the air cylinder frame. The discharging air cylinder is connected to the discharging plate. Five discharging units are evenly arranged on the discharging plate. Each discharging unit is arranged corresponding to a feeding unit. The discharging unit is located above the corresponding feeding unit. The discharging unit uses an elastic plunger. The discharging air cylinder is connected to the controller. The discharging unit is driven by the discharging air cylinder to send the chip capacitor to the feeding station of the feeding unit.

[0008] Preferably, in the technical solution, the feeding unit includes an installation groove and a unit block. The installation groove is arranged in the feeding area. The unit block is arranged in the installation groove. A fixing groove and a detection groove are formed on the unit block. The fixing groove is arranged along the Y-axis direction, and the detection groove is arranged along the X-axis direction. The fixing groove and the detection groove communicate to form a T-shaped structure. The detection groove is a runway-shaped structure. Positioning blocks are symmetrically arranged on the two inner side surfaces of the fixing groove. The distance between the positioning blocks matches the width dimension of the chip capacitor. A positioning groove is arranged on the inner bottom surface of the fixing groove and extends into the detection groove. The size of the positioning groove matches the size of the detection area of the chip capacitor. The fixing groove, the detection groove, the positioning blocks, and the positioning groove form the feeding station. Detection holes are symmetrically arranged in the detection groove. The installation groove is opened at a position corresponding to the detection holes for placing the feeding detection unit.

[0009] Preferably, in the technical solution, the feeding detection unit includes an optical fiber sensor, an optical fiber detection line, and a detection head. The optical fiber sensor is arranged on the feeding bottom plate. The optical fiber detection line is arranged in the feeding block. The output end of the optical fiber sensor faces the optical fiber detection line. The detection head is arranged on the top of the optical fiber detection line. The detection head is arranged in the detection hole. The detection end of the detection head extends into the detection groove. The detection ends of the two detection heads in the detection groove are arranged oppositely. The optical fiber sensor is connected to the controller. The optical fiber sensor sends an optical signal to the detection head through the optical fiber detection line. The feeding station is detected by the oppositely arranged detection ends of the detection head to detect whether there is a chip capacitor in the feeding station.

[0010] Preferably, in the technical solution, the suction mechanism includes a mounting frame, a suction seat, a suction unit, and a vacuum pipeline. The mounting frame is arranged on the Z-axis moving mechanism. A suction seat is arranged at the lower end of the mounting frame. A suction unit and a vacuum pipeline are arranged on the suction seat. Each suction unit corresponds to a vacuum pipeline. The suction unit is connected to the corresponding vacuum pipeline. The vacuum pipeline is connected to an external vacuum generator. A vacuum detector is arranged on the vacuum pipeline. The suction unit includes a suction rod, a rod seat, and a spring. The rod seat is arranged on the suction seat and is connected to the corresponding vacuum pipeline. The suction rod is connected to the rod seat. The end of the suction rod is used as the material taking station. A spring is sleeved on the suction rod. A support plate is arranged on the suction rod. The spring is abutted between the support plate and the suction seat. The vacuum degree of the vacuum pipeline is detected by the vacuum detector to judge whether the material taking station sucks the chip capacitor.

[0011] Preferably, in the technical solution, the testing unit includes a support seat, a cushion block, and a test piece. The support seat is arranged in the testing area. The test pieces are symmetrically arranged on the front and rear sides of the support seat. A cushion block is arranged at the end of the test piece. A support groove is arranged in the support seat. The size of the support groove matches the width size of the chip capacitor. The height of the cushion block is flush with the bottom of the support groove. The position of the cushion block corresponds to the testing area of the chip capacitor. The test piece is connected to an external power supply and is connected to the controller. A circuit is formed by the test piece, the cushion block, and the chip capacitor to test the performance of the chip capacitor under high-voltage current.

[0012] Preferably, in the technical solution, the X-axis moving mechanism, the Y-axis moving mechanism, and the Z-axis moving mechanism all adopt linear module transmission.

[0013] Preferably, in the technical solution, a cylinder and a cross rail are arranged on the loading bottom plate. The loading block is arranged on the cross rail and is connected to the cylinder. The Y-axis position of the loading block is finely adjusted by the cylinder.

[0014] Preferably, in the technical solution, a photoelectric detector and a cover plate are arranged on the feeding channel. The cover plate covers the surface of the feeding channel. An observation hole is arranged on the cover plate. The photoelectric detector is arranged towards the observation hole and is connected to the controller. The conveying condition of the chip capacitors in the feeding channel is detected by the photoelectric detector. The cover plate is used to prevent the chip capacitors in the feeding channel from flying out.

[0015] A method for using a high-voltage testing system for chip capacitors comprises the following steps:

[0016] (1) Place the chip capacitors into the vibrating feeding tray, start the vibrating feeding tray, and the chip capacitors are fed into the feeding channel with five feeding lanes by the vibrating feeding tray; when the chip capacitors are conveyed to the outlet of the feeding channel, the blanking cylinder is started, and the blanking unit descends to push the chip capacitors in the corresponding feeding lane out of the feeding channel; at this time, the first five loading stations in the loading area are located in front of the outlet of the feeding channel.

[0017] (2) The chip capacitor enters the loading station. The chip capacitor is located between the positioning blocks, the detection area of the chip capacitor enters the positioning groove, the front end of the chip capacitor is located in the detection groove, and the front end of the chip capacitor blocks the detection heads arranged oppositely in the detection groove, interrupting the optical signal emitted by the detection heads. The fiber optic sensor sends the feedback signal of the detection heads to the controller, and the controller determines that the chip capacitor has entered the loading station;

[0018] (3) The controller controls the X-axis moving mechanism to drive the loading area to move along the X-axis direction, moving the next batch of five loading stations to the front of the outlet of the feeding track. Then, the unloading cylinder drives the unloading unit to push out the next batch of five chip capacitors from the feeding track, and repeat step (2) until all the loading stations in the loading area are completed with loading; if the optical signal in a loading station is still not interrupted at this time, the controller determines that there is material leakage during the loading of this loading station;

[0019] (4) The controller controls the X-axis moving mechanism to drive the loading area back to the initial position, the Y-axis moving mechanism drives one side of the suction mechanism to move along the Y-axis direction above the loading area, and the Z-axis moving mechanism drives the suction mechanism to descend along the Z-axis direction. At the same time, the external vacuum generator generates suction at the suction station through the vacuum pipeline. When the suction station descends to the loading station, the suction mechanism sucks the chip capacitors in all the loading stations in the loading area, and through the cooperation of the Z-axis moving mechanism and the Y-axis moving mechanism, moves the chip capacitors towards the testing mechanism; the vacuum detector detects the vacuum degree in the vacuum pipeline. If it is within the set vacuum degree range, it indicates that the suction station takes materials normally. If it is not within the set vacuum degree range, it indicates that there is material leakage during the material taking process of this suction station;

[0020] (5) When the chip capacitor in the loading station is taken out, the detection heads arranged oppositely in the detection groove resume optical communication, and the fiber optic sensor sends the feedback signal of the detection heads to the controller. The controller determines that the chip capacitor has moved out of the loading station; if there is still optical communication interrupted in a loading station at this time, then detect the corresponding suction station for this loading station. If the vacuum degree of the vacuum pipeline of the corresponding suction station is normal, it indicates that there is overlapping material situation during the loading process of the loading station;

[0021] (6) When in step (5), all the chip capacitors in the loading stations in the loading area are sucked by the suction mechanism, the controller controls the X-axis moving mechanism to drive the loading area to move to the outlet of the feeding track, and repeat step (2) until all the loading stations in the loading area are completed with loading; then the controller controls the X-axis moving mechanism to drive the loading area to move to the suction mechanism on the other side, and the controller drives the suction mechanism on the other side to suck the chip capacitors in the loading area through the Y-axis moving mechanism and the Z-axis moving mechanism; the controller controls the X-axis moving mechanism to drive the loading area to reciprocate between the suction mechanisms on both sides to load materials for the suction mechanisms on both sides;

[0022] (7) When the suction mechanism moves to the test area, the suction station places the chip capacitor into the corresponding test unit, and the external power supply is energized. In the conducting test path, the performance of the chip capacitor under high-voltage current is tested; the controller determines the test situation of the chip capacitor according to the vacuum degree of the vacuum pipeline at the suction station and combines the test data of the test unit; if the vacuum degree of the vacuum pipeline at the suction station is normal and the test data of the corresponding test unit is normal, the chip capacitor test is normal; if the vacuum degree of the vacuum pipeline at the suction station is normal and the test data of the corresponding test unit is abnormal, the chip capacitor test is unqualified; if the vacuum degree of the vacuum pipeline at the suction station is normal and the test data of the corresponding test unit does not change, it means that there is a problem with the test unit resulting in the chip capacitor being missed in the inspection; if the vacuum degree of the vacuum pipeline at the suction station is abnormal and the test data of the corresponding test unit does not change, it means that the suction station has not sucked the chip capacitor.

[0023] (8) When in step (7), one suction mechanism moves to the test area, the other suction mechanism sucks the chip capacitors in the loading area, and the other suction mechanism lags behind one suction mechanism by one position.

[0024] (9) According to the test results of the chip capacitors in step (7), the controller controls the suction mechanism to move to the discharge box; in the good product area, the vacuum pipeline of the corresponding suction station is closed, and the qualified chip capacitors fall into the good product area; in the defective product area, the vacuum pipeline of the corresponding suction station is closed, and the unqualified chip capacitors fall into the defective product area; in the area to be tested, the vacuum pipeline of the corresponding suction station is closed, and the chip capacitors not detected due to problems with the test unit fall into the area to be tested.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The loading area with twenty loading stations reciprocates to supply materials for the two suction mechanisms. Each suction mechanism includes twenty suction stations. The two suction mechanisms can test forty chip capacitors in one material taking, greatly improving the test efficiency.

[0027] 2. Optical signal detection is carried out when the chip capacitor enters the loading station, the vacuum degree of the corresponding vacuum pipeline is detected when the suction station sucks the chip capacitor, and the test data is collected when the test unit tests the chip capacitor; the controller can judge whether there is material leakage or stacking when the chip capacitor is loaded at the loading station, whether there is material leakage when the suction station sucks the chip capacitor, and whether the chip capacitor test is qualified or missed in the inspection according to the collected signal data and test data. By monitoring the process of the chip capacitor from loading to detection, the sorting and discharging of the chip capacitor detection are ensured. Description of the Drawings:

[0028] Figure 1 It is a schematic structural diagram of the high-voltage test system for chip capacitors of the present invention;

[0029] Figure 2 is the perspective view of the high-voltage test system for the chip capacitors of the present invention;

[0030] Figure 3 is the front view of the high-voltage test system for the chip capacitors of the present invention;

[0031] Figure 4 is the right view of the high-voltage test system for the chip capacitors of the present invention;

[0032] Figure 5 is the top view of the high-voltage test system for the chip capacitors of the present invention;

[0033] Figure 6 is the structural schematic diagram of the feeding mechanism of the present invention;

[0034] Figure 7 is Figure 6 the enlarged view of part A of

[0035] Figure 8 is the frontward structural schematic diagram of the loading mechanism of the present invention;

[0036] Figure 9 is Figure 7 the enlarged view of part B of

[0037] Figure 10 is the backward structural schematic diagram of the loading mechanism of the present invention;

[0038] Figure 11 is the structural schematic diagram of the loading station of the present invention;

[0039] Figure 12 is Figure 11 the enlarged view of part C of

[0040] Figure 13 is the loading state diagram of the loading station of the present invention;

[0041] Figure 14 is the structural schematic diagram of the picking mechanism of the present invention;

[0042] Figure 15 is Figure 14 the enlarged view of part D of

[0043] Figure 16 is the structural schematic diagram of the testing mechanism of the present invention;

[0044] Figure 17 is Figure 16 the enlarged view of part E of

[0045] Figure 18 is the control principle diagram of the control module of the present invention. Specific embodiments:

[0046] The following describes the specific embodiments of the present invention in detail, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0047] Unless otherwise clearly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "having" etc. will be understood to include the stated elements or components, without excluding other elements or other components.

[0048] As Figures 1-5 shown, a high-voltage test system for chip capacitors includes a feeding mechanism 1, a loading mechanism 2, a picking mechanism 3, a testing mechanism 4, a discharging mechanism 5, and a control module; as Figure 6 shown, the feeding mechanism 1 includes a vibrating feeding tray 10, a feeding channel 11, a discharging mechanism 12, a photoelectric detector 13, and a cover plate 14. The vibrating feeding tray 10 is connected to the feeding channel 11, and the feeding channel 11 extends to the loading mechanism 2. A discharging mechanism 12 is provided at the outlet of the feeding channel 11. A photoelectric detector 13 and a cover plate 14 are provided on the feeding channel 11. The cover plate 14 covers the surface of the feeding channel 11, and an observation hole 15 is provided on the cover plate 14. The photoelectric detector 13 is arranged facing the observation hole 15, and the photoelectric detector 13 is connected to the controller 60; the conveying condition of the chip capacitors 7 in the feeding channel 11 is detected by the photoelectric detector 13; the cover plate 14 is used to prevent the chip capacitors 7 in the feeding channel 11 from flying out.

[0049] As Figure 7 shown, the discharging mechanism 12 includes a discharging cylinder 120, a cylinder frame 121, a discharging plate 122, and discharging units 123. The cylinder frame 121 is provided at the outlet of the feeding channel 11. A discharging cylinder 120 is provided on the cylinder frame 121. The discharging cylinder 120 is connected to the discharging plate 122. Five discharging units 123 are evenly arranged on the discharging plate 122. Each discharging unit 123 is correspondingly arranged with a loading unit 24, and the discharging unit 123 is located above the corresponding loading unit 24; the discharging unit 123 uses an elastic plunger; the discharging cylinder 120 is connected to the controller 60, and the discharging cylinder 120 drives the discharging units 123 to send the chip capacitors 7 into the loading stations of the loading units 24.

[0050] As Figures 8-10As shown in the figure, the feeding mechanism 2 includes a feeding bottom plate 20, a feeding block 21, an X-axis moving mechanism 22, a feeding detection device 23, a feeding unit 24, a cylinder 25, and a cross guide rail 26. The X-axis moving mechanism 22 is arranged along the X-axis direction. The feeding bottom plate 20 is arranged on the X-axis moving mechanism 22. The feeding bottom plate 20 is provided with a cylinder 25, a cross guide rail 26, and a feeding detection device 23. The feeding block 21 is arranged on the cross guide rail 26. The feeding block 21 is connected to the cylinder 25. The Y-axis position of the feeding block 26 is finely adjusted by the cylinder 25. A feeding area is formed at the top of the feeding block 21. Twenty feeding units 24 are evenly arranged in the feeding area. The feeding area is located in front of the outlet of the feeding channel 11. The blanking mechanism 12 is located above the feeding area. The blanking mechanism 12 corresponds to five feeding units 24. The X-axis moving mechanism 22 is driven by a linear module.

[0051] As Figures 11-13 shown in the figure, the feeding unit 24 includes a mounting groove 240 and a unit block 241. The mounting groove 240 is arranged in the feeding area. The unit block 241 is arranged in the mounting groove 240. A fixing groove 242 and a detection groove 243 are formed on the unit block 241. The fixing groove 242 is arranged along the Y-axis direction. The detection groove 243 is arranged along the X-axis direction. The fixing groove 242 and the detection groove 243 communicate to form a T-shaped structure. The detection groove 243 is a runway-shaped structure. Positioning blocks 244 are symmetrically arranged on the two inner side surfaces of the fixing groove 242. The distance between the positioning blocks 244 matches the width dimension of the chip capacitor 7. A positioning groove 245 is arranged on the inner bottom surface of the fixing groove 242. The positioning groove 245 extends into the detection groove 243. The size of the positioning groove 245 matches the size of the detection area of the chip capacitor 7. The fixing groove 242, the detection groove 243, the positioning blocks 244, and the positioning groove 245 form a feeding station. Detection holes 246 are symmetrically arranged in the detection groove 243. The mounting groove 240 is opened at a position corresponding to the detection holes 246 for placing the feeding detection unit 23.

[0052] As Figures 8-13 shown in the figure, the feeding detection unit 23 includes an optical fiber sensor 230, an optical fiber detection line 231, and a detection head 232. The optical fiber sensor 230 is arranged on the feeding bottom plate 20. The optical fiber detection line 231 is arranged in the feeding block 21. The output end of the optical fiber sensor 230 faces the optical fiber detection line 231. A detection head 232 is arranged at the top of the optical fiber detection line 231. The detection head 232 is arranged in the detection hole 246. The detection end of the detection head 232 extends into the detection groove 243. The detection ends of the two detection heads 232 in the detection groove 243 are arranged opposite to each other. The optical fiber sensor 230 is connected to the controller 60. An optical signal is sent from the optical fiber sensor 230 to the detection head 232 through the optical fiber detection line 231. The feeding station is detected by the opposite detection ends of the detection heads 232 to detect whether there is a chip capacitor 7 in the feeding station.

[0053] As Figure 14As shown in the figure, the material taking mechanism 3 includes a suction mechanism 30, a Y-axis moving mechanism 31, a Z-axis moving mechanism 32, and a bracket 33. The Y-axis moving mechanisms 31 are symmetrically arranged on the bracket 33 and are arranged along the Y-axis direction. Each Y-axis moving mechanism 31 is provided with a corresponding Z-axis moving mechanism 32, which is arranged along the Z-axis direction. Each Z-axis moving mechanism 32 is provided with a corresponding suction mechanism 30. The suction mechanisms 30 are symmetrically arranged on both sides of the feeding channel 11 and are located above the loading area. The Y-axis moving mechanism 31 and the Z-axis moving mechanism 32 both adopt linear module transmission;

[0054] As Figure 15 shown in the figure, the suction mechanism 30 includes a mounting frame 300, a suction seat 301, a suction unit 302, and a vacuum pipeline 303. The mounting frame 300 is arranged on the Z-axis moving mechanism 32. The lower end of the mounting frame 300 is provided with a suction seat 301. The suction seat 301 is provided with a suction unit 302 and a vacuum pipeline 303. Each suction unit 302 corresponds to a vacuum pipeline 303. The suction unit 302 is connected to the corresponding vacuum pipeline 303. The vacuum pipeline 303 is connected to an external vacuum generator. A vacuum detector 61 is arranged on the vacuum pipeline 303. The suction unit 302 includes a suction rod 304, a rod seat 305, and a spring 306. The rod seat 305 is arranged on the suction seat 301 and is connected to the corresponding vacuum pipeline 303. The suction rod 304 is connected to the rod seat 305. The end of the suction rod 304 serves as the material taking station. A spring 306 is sleeved on the suction rod 304. A support plate 307 is arranged on the suction rod 304. The spring 306 is abutted between the support plate 307 and the suction seat 301. The vacuum detector 61 is used to detect the vacuum degree of the vacuum pipeline 303 to judge whether the material taking station sucks the chip capacitor 7.

[0055] As Figure 16 shown in the figure, the testing mechanism 4 includes a testing frame 40 and a testing unit 41. The testing frame 40 is located between the loading area and the discharging mechanism 5. The top of the testing frame 40 serves as a testing area 42. The testing units 41 are evenly arranged in the testing area 42. The testing units 41 are connected to an external power supply. Each testing unit 41 corresponds to a material taking station;

[0056] As Figure 17As shown in the figure, the test unit 41 includes a support base 410, a spacer 411, and a test piece 412. The support base 410 is disposed in the test area 42. The test pieces 412 are symmetrically arranged on the front and back sides of the support base 410. A spacer 411 is provided at the end of the test piece 412. A support groove 413 is provided in the support base 410. The size of the support groove 413 matches the width size of the chip capacitor 7. The height of the spacer 411 is flush with the bottom of the support groove 413. The position of the spacer 411 corresponds to the test area of the chip capacitor 7. The test piece 412 is connected to an external power supply and the test piece 412 is connected to the controller 60. A path is formed through the test piece 412, the spacer 411, and the chip capacitor 7 to test the performance of the chip capacitor 7 under high-voltage current.

[0057] The feeding mechanism 5 includes a feeding box 50. The feeding boxes 50 are symmetrically arranged on both sides of the bracket 33. Each feeding box 50 is correspondingly arranged with a suction mechanism 30. The feeding box 50 is divided into a qualified product area 51, a defective product area 52, and a to-be-tested area 53 that are isolated from each other.

[0058] As Figure 18 As shown in the figure, the control module includes a controller 60 and a vacuum detector 61. Each vacuum detector 61 corresponds to a material-taking station. The fiber optic sensor 230, the vacuum detector 61, and the test piece 412 serve as collectors, and the collectors are connected to the controller 60. The blanking cylinder 120, the X-axis moving mechanism 22, the suction mechanism 30, the Y-axis moving mechanism 31, and the Z-axis moving mechanism 32 serve as actuators, and the actuators are connected to the controller 60. The moving track of the Y-axis moving mechanism 31 is between the loading area and the feeding box 50. The controller 60 detects whether there is material leakage during the loading of the chip capacitor 7 by detecting the loading station through the loading detection unit 23, detects whether there is material leakage during the material-taking of the chip capacitor 7 by detecting the material-taking station through the vacuum detector 61, combines the detection data of the loading detection unit 23 and the detection data of the vacuum detector 61 to judge whether there is overlapping during the loading of the chip capacitor 7, and combines the test data of the test unit 41 and the detection data of the vacuum detector 61 to judge whether there is missed detection during the testing of the chip capacitor 7. The X-axis moving mechanism 22 is controlled to reciprocate the loading area between the two suction mechanisms 30, and the Y-axis moving mechanism 31 is controlled to reciprocate the suction mechanism 30 between the loading station - test unit 41 - feeding box 50, and one suction mechanism 30 lags behind the other suction mechanism 30 by one position.

[0059] A method for using a high-voltage test system for chip capacitors, the steps of which are as follows:

[0060] (1) Place the chip capacitor 7 into the vibrating feeder tray 10, start the vibrating feeder tray 10, and the chip capacitor 7 is fed into the feeder track 11 with five tracks by the vibrating feeder tray 10; when the chip capacitor 7 is conveyed to the outlet of the feeder track 11, the blanking cylinder 120 is started, and the blanking unit 123 descends to push the chip capacitor 7 in the corresponding track out of the feeder track 11; at this time, the first five loading stations in the loading area are located in front of the outlet of the feeder track 11.

[0061] (2) Five chip capacitors 7 enter the corresponding loading stations. The chip capacitor 7 is located between the positioning blocks 244, the detection area of the chip capacitor 7 enters the positioning groove 245, the front end of the chip capacitor 7 is located in the detection groove 243, and the front end of the chip capacitor 7 blocks the detection heads 232 arranged oppositely in the detection groove 243, interrupting the optical signal emitted by the detection heads 232. The fiber optic sensor 230 sends the feedback signal of the detection heads 232 to the controller 60, and the controller 60 determines that the chip capacitor 7 has entered the loading station.

[0062] (3) The controller 60 controls the X-axis moving mechanism 22 to drive the loading area to move along the X-axis direction, moves the next batch of five loading stations to the front of the outlet of the feeder track 11, and then the blanking cylinder 120 drives the blanking unit 123 to push the next batch of five chip capacitors 7 out of the feeder track 11, and repeats step (2) until all twenty loading stations in the loading area are loaded; if the optical signal in a loading station is still not interrupted at this time, the controller 60 determines that there is material leakage during the loading of this loading station.

[0063] (4) The controller 60 controls the X-axis moving mechanism 22 to drive the loading area back to the initial position, the Y-axis moving mechanism 31 drives one side of the suction mechanism 30 to move along the Y-axis direction above the loading area, and the Z-axis moving mechanism 32 drives the suction mechanism 30 to descend along the Z-axis direction. At the same time, an external vacuum generator generates suction at the suction station through the vacuum pipeline 303. When the suction station descends to the loading station, the suction mechanism 30 sucks the chip capacitors 7 in all the loading stations in the loading area, and through the cooperation of the Z-axis moving mechanism 32 and the Y-axis moving mechanism 31, moves the chip capacitor 7 towards the testing mechanism 4; the vacuum detector 61 detects the vacuum degree in the vacuum pipeline 303. If it is within the set vacuum degree range, it means that the suction station takes materials normally. If it is not within the set vacuum degree range, it means that there is material leakage during the material taking process of this suction station.

[0064] (5) When the chip capacitor 7 in the loading station is taken out, the detection heads 232 arranged oppositely in the detection slot 243 resume optical communication, and the fiber optic sensor 230 sends the feedback signal of the detection head 232 to the controller 60. The controller 60 determines that the chip capacitor 7 has moved out of the loading station. If the optical communication in the loading station is still blocked at this time, then the corresponding picking station of this loading station is detected. If the vacuum degree of the vacuum pipeline 303 of the corresponding picking station is normal, it indicates that there is a stacking situation during the loading process of the loading station;

[0065] (6) When in step (5), all the chip capacitors 7 in the loading stations in the loading area are picked up by the picking mechanism 30, the controller 60 controls the X-axis moving mechanism 22 to drive the loading area to move to the outlet of the feeding track 11, and repeats step (2) until all the loading stations in the loading area have completed loading; then the controller 60 controls the X-axis moving mechanism 22 to drive the loading area to move to the picking mechanism 30 on the other side. The controller 60 drives the picking mechanism 30 on the other side to pick up the chip capacitors 7 in the loading area through the Y-axis moving mechanism 31 and the Z-axis moving mechanism 32; the controller 60 controls the X-axis moving mechanism 22 to drive the loading area to reciprocate between the picking mechanisms 30 on both sides to load the picking mechanisms 30 on both sides;

[0066] (7) When the picking mechanism 30 moves to the testing area 42, the picking station places the chip capacitor 7 into the corresponding testing unit 41, and the external power supply is energized. In the conducting test path, the performance of the chip capacitor 7 under high-voltage current is tested; the controller 60 judges the testing situation of the chip capacitor 7 according to the vacuum degree of the vacuum pipeline 303 of the picking station and combines the test data of the testing unit 41. If the vacuum degree of the vacuum pipeline 303 of the picking station is normal and the test data of the corresponding testing unit 41 is normal, then the chip capacitor 7 is tested normally; if the vacuum degree of the vacuum pipeline 303 of the picking station is normal and the test data of the corresponding testing unit 41 is abnormal, then the chip capacitor 7 fails the test; if the vacuum degree of the vacuum pipeline 303 of the picking station is normal and the test data of the corresponding testing unit 41 has no change, it means that there is a problem with the testing unit 41 resulting in the chip capacitor 7 being missed in the inspection; if the vacuum degree of the vacuum pipeline 303 of the picking station is abnormal and the test data of the corresponding testing unit 41 has no change, it means that the picking station has not picked up the chip capacitor 7;

[0067] (8) When in step (7), one picking mechanism 30 moves to the testing area 42, the picking mechanism 30 on the other side picks up the chip capacitors 7 in the loading area, and the picking mechanism 30 on the other side lags behind the picking mechanism 30 on one side by one position;

[0068] (9) According to the test results of the chip capacitor 7 in step (7), the controller 60 controls the suction mechanism 30 to move to the feeding box 50. In the good product area 51, the vacuum pipeline 303 corresponding to the suction station is closed, and the qualified chip capacitors 7 fall into the good product area 51. In the defective product area 52, the vacuum pipeline 303 corresponding to the suction station is closed, and the unqualified chip capacitors 7 fall into the defective product area 52. In the to-be-tested area 53, the vacuum pipeline 303 corresponding to the suction station is closed, and the chip capacitors 7 that have not been detected due to problems with the test unit 41 fall into the to-be-tested area 53. The two suction mechanisms 30 can test a total of forty chip capacitors 7 in one material taking operation, greatly improving the test efficiency.

[0069] The foregoing description of the specific exemplary embodiments of the present invention is for purposes of illustration and exemplification. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many changes and variations are possible in light of the above teaching. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the present invention and its practical applications, so that those skilled in the art can implement and utilize various different exemplary embodiments of the present invention, as well as various different selections and changes. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A chip capacitor high voltage test system, characterized by: It includes a feeding mechanism, a loading mechanism, a picking mechanism, a testing mechanism, a discharging mechanism, and a control module; the feeding mechanism includes a vibrating feeding plate, a feeding channel, and a discharging mechanism, the vibrating feeding plate is connected to the feeding channel, the feeding channel extends to the feeding mechanism, and a discharging mechanism is arranged at the outlet of the feeding channel; the feeding mechanism includes a loading bottom plate, a loading block, an X-axis moving mechanism, and a loading detection device, the X-axis moving mechanism is arranged along the X-axis, the loading bottom plate is arranged on the X-axis moving mechanism, the loading bottom plate is movably provided with a loading block, the top of the loading block forms a loading area, and the loading units are evenly arranged in the loading area The feeding unit is provided with a feeding station, the feeding detection device is provided on the feeding bottom plate, the feeding detection device includes a feeding detection unit, and two feeding detection units correspond to one feeding station; the feeding area is located in front of the outlet of the feeding channel, the unloading mechanism is located above the feeding area, and the unloading mechanism corresponds to the five feeding units; the picking mechanism includes a suction mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism, and a bracket, the bracket is symmetrically provided with a Y-axis moving mechanism, the Y-axis moving mechanism is arranged along the Y-axis, each Y-axis moving mechanism is provided with a corresponding Z-axis moving mechanism, and the Z-axis moving mechanism is arranged along the Z-axis The Z-axis moving mechanism is arranged in a direction, and a corresponding suction mechanism is arranged on each Z-axis moving mechanism. The suction mechanisms are symmetrically arranged on both sides of the feeding channel, and the suction mechanism is located above the loading area. A material picking station is arranged on the suction mechanism, and each material picking station corresponds to a loading station; the testing mechanism includes a test frame and a testing unit. The test frame is located between the loading area and the unloading mechanism. The top of the test frame is used as a testing area. The testing units are evenly arranged in the testing area. The testing units are connected to an external power supply, and each test unit corresponds to a material picking station; the unloading mechanism includes a material unloading box, which is symmetrically arranged on both sides of the bracket. On the side, each discharge box is arranged corresponding to a suction mechanism, and the discharge box is divided into mutually isolated good product area, defective product area and test area; the control module includes a controller and a vacuum detector, and the vacuum detector is arranged on the suction mechanism, and each vacuum detector corresponds to a material picking station; the feeding detection unit, the vacuum detector, and the test unit serve as collectors, and the collector is connected to the controller; the unloading mechanism, the X-axis moving mechanism, the suction mechanism, the Y-axis moving mechanism, and the Z-axis moving mechanism serve as actuators, and the actuators are connected to the controller; the moving track of the Y-axis moving mechanism is between the feeding area and the discharge box; The controller detects the loading station through the loading detection unit to determine whether there is leakage when the chip capacitor is loaded, detects the picking station through the vacuum detector to determine whether there is leakage when the chip capacitor is picked up, determines whether there is overlap when the chip capacitor is loaded by combining the detection data of the loading detection unit and the detection data of the vacuum detector, and determines whether there is leakage during the chip capacitor test by combining the test data of the test unit and the detection data of the vacuum detector; the loading area is controlled to reciprocate between the two suction mechanisms through the X-axis moving mechanism, and the suction mechanism is controlled to reciprocate between the loading station-test unit-discharging box through the Y-axis moving mechanism, and the suction mechanism on one side is delayed by one position relative to the suction mechanism on the other side.

2. The chip capacitor high voltage test system according to claim 1, characterized in that: The unloading mechanism includes an unloading cylinder, a cylinder rack, an unloading plate, and an unloading unit. The cylinder rack is arranged at the outlet of the feeding channel. The cylinder rack is provided with an unloading cylinder, which is connected to the unloading plate. Five unloading units are evenly arranged on the unloading plate. Each unloading unit is arranged corresponding to a loading unit, and the unloading unit is located above the corresponding loading unit. The unloading unit adopts an elastic plunger. The unloading cylinder is connected to the controller, and the unloading cylinder drives the unloading unit to deliver the chip capacitor to the loading station of the loading unit.

3. The chip capacitor high voltage test system according to claim 2, characterized in that: The feeding unit includes a mounting groove and a unit block. The mounting groove is arranged in the feeding area, and the unit block is arranged in the mounting groove. A fixing groove and a detection groove are provided on the unit block. The fixing groove is arranged in the Y-axis direction, and the detection groove is arranged in the X-axis direction. The fixing groove is connected with the detection groove to form a T-shaped structure. The detection groove is a runway-shaped structure. Positioning blocks are symmetrically arranged on both inner sides of the fixing groove. The distance between the positioning blocks matches the width dimension of the chip capacitor. A positioning groove is arranged on the bottom surface of the fixing groove. The positioning groove extends into the detection groove. The size of the positioning groove matches the size of the detection area of ​​the chip capacitor. The fixing groove, the detection groove, the positioning block, and the positioning groove form a feeding station. The detection groove is symmetrically provided with detection holes, and the mounting groove has an opening at a position corresponding to the detection hole for placing the feeding detection unit.

4. The chip capacitor high voltage test system according to claim 3, characterized in that: The feeding detection unit includes an optical fiber sensor, an optical fiber detection line, and a detection head. The optical fiber sensor is arranged on a feeding bottom plate, the optical fiber detection line is arranged in a feeding block, the output end of the optical fiber sensor is arranged toward the optical fiber detection line, a detection head is arranged on the top of the optical fiber detection line, the detection head is arranged in a detection hole, the detection end of the detection head extends into a detection slot, and the two detection ends of the detection head in the detection slot are arranged opposite to each other; the optical fiber sensor is connected to a controller, and an optical signal is sent to the detection head through the optical fiber sensor via the optical fiber detection line, and the feeding station is detected through the detection ends of the detection heads arranged oppositely to detect whether there is a chip capacitor in the feeding station.

5. The chip capacitor high voltage test system according to claim 4, characterized in that: The suction mechanism includes a mounting frame, a suction seat, a suction unit, and a vacuum pipeline. The mounting frame is arranged on the Z-axis moving mechanism. A suction seat is arranged at the lower end of the mounting frame. A suction unit and a vacuum pipeline are arranged on the suction seat. Each suction unit corresponds to a vacuum pipeline. The suction unit is connected to the corresponding vacuum pipeline. The vacuum pipeline is connected to an external vacuum generator. A vacuum detector is arranged on the vacuum pipeline. The suction unit includes a suction rod, a rod seat, and a spring. The rod seat is arranged on the suction seat. The rod seat is connected to the corresponding vacuum pipeline. The suction rod is connected to the rod seat. The end of the suction rod serves as a material picking station. A spring is mounted on the suction rod. A support plate is arranged on the suction rod. The top of the spring is placed between the support plate and the suction seat. The vacuum degree of the vacuum pipeline is detected by the vacuum detector to determine whether the material picking station picks up the chip capacitor.

6. The chip capacitor high voltage test system according to claim 1, characterized in that: The test unit includes a support seat, a cushion block, and a test piece. The support seat is arranged in the test area. The test piece is symmetrically arranged on the front and rear sides of the support seat. The end of the test piece is provided with a cushion block. A support groove is arranged in the support seat. The size of the support groove matches the width of the patch capacitor. The height of the cushion block is flush with the bottom of the support groove. The pad block position corresponds to the chip capacitor test area, the test piece is connected to the external power supply, and the test piece is connected to the controller.

7. The chip capacitor high voltage test system according to claim 1, characterized in that: The X-axis moving mechanism, Y-axis moving mechanism and Z-axis moving mechanism all adopt linear module transmission.

8. The chip capacitor high voltage test system according to claim 1, characterized in that: A cylinder and a cross guide rail are arranged on the feeding bottom plate, a feeding block is arranged on the cross guide rail, and the feeding block is connected with the cylinder.

9. The chip capacitor high voltage test system according to claim 1, characterized in that: A photoelectric detector and a cover plate are arranged on the feeding channel. The cover plate covers the surface of the feeding channel. An observation hole is opened on the cover plate. The photoelectric detector is arranged toward the observation hole. The photoelectric detector is connected to the controller.

10. A method for using the chip capacitor high voltage test system according to any one of claims 1 to 9, the steps of which are: (1) Place the chip capacitors into the vibrating feeding tray, start the vibrating feeding tray, and feed the chip capacitors from the vibrating feeding tray into the feeding channel with five channels; when the chip capacitors are transported to the outlet of the feeding channel, the unloading cylinder is started, and the unloading unit descends to push the chip capacitors in the corresponding channel out of the feeding channel; at this time, the first five loading stations in the loading area are located in front of the outlet of the feeding channel; (2) The SMD capacitor enters the loading station, the SMD capacitor is located between the positioning blocks, the SMD capacitor detection area enters the positioning slot, the front end of the SMD capacitor is located in the detection slot, the front end of the SMD capacitor blocks the detection head arranged relatively in the detection slot, and blocks the light signal emitted by the detection head. The optical fiber sensor sends the detection head feedback signal to the controller, and the controller determines that the SMD capacitor enters the loading station; (3) The controller controls the X-axis moving mechanism to drive the loading area to move along the X-axis direction, and moves the next batch of five loading stations to the front of the feeding channel exit. Then the unloading cylinder drives the unloading unit to push the next batch of five chip capacitors out of the feeding channel, and repeats step (2) until all loading stations in the loading area have completed loading. If the light signal in a loading station is still not blocked at this time, the controller determines that this loading station leaks material during loading; (4) The controller controls the X-axis moving mechanism to drive the loading area back to the initial position, the Y-axis moving mechanism drives the suction mechanism on one side to move along the Y-axis direction to the top of the loading area, and the Z-axis moving mechanism drives the suction mechanism to descend along the Z-axis direction. At the same time, the external vacuum generator generates suction at the suction station through the vacuum pipeline. When the suction station descends to the loading station, the suction mechanism absorbs the chip capacitors in all the loading stations in the loading area, and moves the chip capacitors to the testing mechanism through the cooperation of the Z-axis moving mechanism and the Y-axis moving mechanism; the vacuum detector detects the vacuum degree in the vacuum pipeline. If it is within the set vacuum degree range, it means that the suction station is taking materials normally. If it is not within the set vacuum degree range, it means that the suction station leaks materials during the material taking process; (5) When the chip capacitor in the loading station is taken out, the detection head arranged relatively in the detection slot resumes optical communication, and the optical fiber sensor sends the detection head feedback signal to the controller, and the controller determines that the chip capacitor is moved out of the loading station; if the optical communication is still blocked in the loading station at this time, the suction station corresponding to this loading station is detected. If the vacuum degree of the vacuum pipeline corresponding to the suction station is normal, it means that the loading station has overlapped materials during the loading process; (6) When the chip capacitors in all the loading stations in the loading area are sucked by the suction mechanism in step (5), the controller controls the X-axis moving mechanism to drive the loading area to move to the outlet of the feeding channel, and repeats step (2) until all the loading stations in the loading area have completed loading; then the controller controls the X-axis moving mechanism to drive the loading area to move to the suction mechanism on the other side, and the controller drives the suction mechanism on the other side to suck the chip capacitors in the loading area through the Y-axis moving mechanism and the Z-axis moving mechanism; the controller controls the X-axis moving mechanism to drive the loading area to reciprocate between the suction mechanisms on both sides to load the suction mechanisms on both sides; (7) When the suction mechanism moves to the test area, the suction station places the chip capacitor into the corresponding test unit, the external power supply is powered on, and the performance of the chip capacitor under high voltage current is tested in the conductive test path; the controller determines the test condition of the chip capacitor based on the vacuum degree of the vacuum pipeline of the suction station and the test data of the test unit; if the vacuum degree of the vacuum pipeline of the suction station is normal and the test data of the corresponding test unit is normal, the chip capacitor test is normal; if the vacuum degree of the vacuum pipeline of the suction station is normal and the test data of the corresponding test unit is abnormal, the chip capacitor test fails; if the vacuum degree of the vacuum pipeline of the suction station is normal and the test data of the corresponding test unit does not change, the test unit has a problem and the chip capacitor is missed; if the vacuum degree of the vacuum pipeline of the suction station is abnormal and the test data of the corresponding test unit does not change, the suction station does not suck the chip capacitor; (8) When the suction mechanism on one side moves to the test area in step (7), the suction mechanism on the other side sucks the chip capacitor in the loading area, and the suction mechanism on the other side is delayed by one position relative to the suction mechanism on the one side; (9) According to the test results of the chip capacitors in step (7), the controller controls the suction mechanism to move to the discharge box; in the good product area, the vacuum pipeline corresponding to the suction station is closed, and the qualified chip capacitors fall into the good product area; in the defective product area, the vacuum pipeline corresponding to the suction station is closed, and the unqualified chip capacitors fall into the defective product area; in the waiting area, the vacuum pipeline corresponding to the suction station is closed, and the chip capacitors that have not been tested due to test unit problems fall into the waiting area.

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