Power strip automatic tin soldering device and power strip tin soldering method

Abstract

The invention relates to the technical field of power strip manufacturing, in particular to a power strip automatic tin soldering device and a power strip tin soldering method. Comprising a positioning assembly which is used for limiting a to-be-soldered power strip; the point location monitoring assembly is arranged above the positioning assembly and used for capturing tin soldering points of the extension socket to be subjected to tin soldering; the moving assembly is connected with a tin soldering gun and used for driving the tin soldering gun to move; and the controller is connected with the moving assembly, the point location monitoring assembly and the tin soldering gun, the controller controls the moving path of the moving assembly according to the tin soldering points captured by the point location monitoring assembly, and the controller controls the tin soldering amount according to the types of the power strip. And the operation is easy.

Description

Technical Field

[0001] The present invention relates to the technical field of socket manufacturing, and particularly relates to an automatic soldering device for sockets and a soldering method for sockets. Background Art

[0002] The automatic soldering device for sockets is used for soldering several positions that require soldering in the production of sockets. When producing sockets, soldering is an important link to ensure the stability and durability of electrical connections. The key solder joints mainly include:

[0003] 1. The connection between the power cord and the metal contact piece;

[0004] 2. The copper core of the power cord needs to be soldered to the metal contact piece arranged inside the socket;

[0005] 3. Fixing of components on the internal circuit board (PCB);

[0006] 4. Buttons and switches;

[0007] 5. Fuses or circuit breakers.

[0008] At present, the soldering process in the socket production line is still traditional manual soldering. Although manual soldering has an irreplaceable position in socket manufacturing, especially for small-batch customization or repair tasks, this traditional process also has some obvious limitations and challenges, affecting the quality of finished products and production efficiency. The following are some of the main drawbacks of manual soldering:

[0009] Manual operation is easily affected by individual differences. Even experienced technicians cannot completely avoid occasional hand tremors, visual fatigue, etc., resulting in inconsistent solder joint sizes and shapes, thus affecting the consistency of electrical performance.

[0010] The speed of manual soldering is significantly slower. Especially when facing large-scale production, the processing time for a single product is long, restricting the expansion of production capacity.

[0011] For extremely small-sized electronic components, manual operation may not be precise enough due to the limitations of hand-eye coordination, especially for solder joints with small pitch, and cannot meet the high-density packaging standards required by high-end products.

[0012] Manual soldering may have defects such as false soldering and bridging, increasing the defective rate, requiring additional quality inspection procedures, and prolonging the product launch cycle. Summary of the Invention

[0013] The purpose of the present invention is to provide an automatic soldering device for sockets to avoid the deficiencies in the prior art. The automatic soldering device for sockets can automatically and precisely solder the sockets and has the advantage of being easy to operate.

[0014] To achieve the above object, the present invention provides the following technical solutions:

[0015] Provide Embodiment 1

[0016] Provide an automatic soldering device for socket strips, including:

[0017] A positioning component for defining the socket strip to be soldered;

[0018] The positioning component stably positions the socket strip to be soldered to achieve subsequent precise soldering.

[0019] A point position monitoring component provided above the positioning component for capturing the soldering points of the socket strip to be soldered;

[0020] Located above the positioning component for capturing the soldering points of the socket strip to be soldered, facilitating the subsequent setting of the movement path.

[0021] A moving component connected to a soldering gun for driving the soldering gun to move;

[0022] A controller respectively connected to the moving component, the point position monitoring component and the soldering gun. The controller controls the movement path of the moving component according to the soldering points captured by the point position monitoring component, and the controller controls the soldering amount according to the type of socket strip.

[0023] The controller designs a specific movement path according to the obtained soldering points, so as to accurately solder the socket strip and ensure the soldering quality.

[0024] In some embodiments, the positioning component includes a plurality of limiting bumps and a bottom plate. The plurality of limiting bumps enclose a limiting cavity on the bottom plate, and the socket strip to be soldered is positioned in the limiting cavity.

[0025] Setting multiple bumps can better stably position the socket strip. During use, the socket strip to be soldered is placed into the limiting cavity.

[0026] In some embodiments, the point position monitoring component includes a plurality of position sensors. The plurality of position sensors capture the positions of the soldering sites in their corresponding regions, and each position sensor transmits the induction signal to the controller.

[0027] Setting multiple position sensors enables each position sensor to specifically detect the soldering sites in the responsible region, so as to ensure the induction effect of the sensor without being affected by other soldering points.

[0028] In some embodiments, the moving component includes a frame and a slider. The top of the frame is provided with an X-axis guide rail and a Y-axis guide rail,

[0029] The slider is slidably connected to the X-axis guide rail. The Y-axis guide rail is divided into a first Y-axis guide rail and a second Y-axis guide rail. The two ends of the X-axis guide rail are respectively slidably connected to the first Y-axis guide rail and the second Y-axis guide rail.

[0030] The slider slides on the X-axis guide rail to achieve movement in the X-axis direction. The X-axis guide rail can also move along the Y-axis guide rail to enable the slider to move in the Y-axis direction, so that the soldering gun can move on the XY two-dimensional plane.

[0031] In some embodiments, the X-axis guide rail includes an X-axis guide post, and the slider is slidably connected to the X-axis guide post.

[0032] The two ends of the X-axis guide post are provided with a first transmission belt, and the slider is also connected to the first transmission belt.

[0033] The first transmission belt is driven by a first motor. The first transmission belt drives the slider to slide along the X-axis guide post, and the soldering gun is installed on the slider.

[0034] The first transmission belt is driven by a motor to move, thereby driving the slider to move along the X-axis guide post.

[0035] In some embodiments, the first Y-axis guide rail and the second Y-axis guide rail respectively include Y-axis guide posts, and a moving plate is slidably connected to the Y-axis guide posts.

[0036] The two ends of the Y-axis guide post are provided with a second transmission belt, and the moving plate is also connected to the second transmission belt.

[0037] The second transmission belt is driven by a second motor. The second transmission belt drives the moving plate to slide along the Y-axis guide post, and the two ends of the X-axis guide rail are respectively installed on the moving plates of the first Y-axis guide rail and the second Y-axis guide rail.

[0038] The second transmission belt is driven by a motor to move, thereby driving the moving plate to move along the Y-axis guide post and then enabling the X-axis guide rail to move, realizing the movement of the soldering gun in the Y-axis direction.

[0039] In some embodiments, the soldering gun includes a connecting block and a gun head. The gun head is connected to the connecting block through a rotating shaft, and the connecting block is fixedly connected to the slider.

[0040] The gun head is connected to the slider through the connecting block, and the rotating shaft enables the gun head to rotate, so that the gun head can rotate to better adapt to soldering.

[0041] The beneficial effects of an automatic soldering device for socket strips according to the present invention:

[0042] The automatic soldering device for socket strips of the present invention is provided with a positioning component, which stably positions the socket strip to be soldered at a set position, facilitating the subsequent soldering gun to accurately solder the positioned socket strip. The spot monitoring component is arranged above the positioning component. Within the visual range, the fixed-point monitoring component can capture the soldering points of the socket strip to be soldered, facilitating the subsequent design of the movement position of the soldering gun according to the positions of the soldering points. The moving component plays a role in driving the soldering gun. The controller designs the movement trajectory of the moving component according to the soldering points transmitted by the positioning component, thereby controlling the soldering gun to accurately solder the soldering points, ensuring the consistency and accuracy of each soldering point, greatly improving the quality and efficiency of the soldering points, and avoiding the problem of uneven soldering quality caused by manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 FIG. 1 is a first visual structure diagram of the automatic soldering device for socket strips according to an embodiment of the present invention.

[0044] Figure 2 FIG. 2 is a second visual structure diagram of the automatic soldering device for socket strips according to an embodiment of the present invention.

[0045] Figure 3 FIG. 3 is a third visual structure diagram of the automatic soldering device for socket strips according to an embodiment of the present invention.

[0046] Figure 4 FIG. 4 is a fourth visual structure diagram of the automatic soldering device for socket strips according to an embodiment of the present invention.

[0047] REFERENCE NUMERALS

[0048] 1, limit bump; 2, bottom plate; 3, position sensor; 4, frame; 5, slider; 6, X-axis guide post; 7, first transmission belt; 8, driven by the first motor; 9, Y-axis guide post; 10, moving plate; 11, second transmission belt; 12, second motor; 13, moving plate; 14, gun head; 15, rotating shaft; 16, connecting block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0049] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0050] The terms used in this invention are for the purpose of describing specific embodiments only and are not intended to limit the invention. The singular forms "a", "the" used in this invention and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0051] It should be understood that although the terms "first", "second", "third", etc. may be used in this invention to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this invention, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this invention, "a plurality" means two or more unless otherwise specifically defined.

[0052] Embodiment 1

[0053] The automatic plug-in soldering device is used for soldering several positions in the socket strip that require soldering. When producing the socket strip, soldering is an important link to ensure the stability and durability of electrical connections. The key solder joints involved mainly include:

[0054] 1. The connection between the power cord and the metal contact piece;

[0055] 2. The copper core of the power cord needs to be soldered to the metal contact piece provided inside the socket strip;

[0056] 3. Fixing of components on the internal circuit board (PCB);

[0057] 4. Buttons and switches;

[0058] 5. Fuses or circuit breakers.

[0059] Currently, the soldering process in the socket strip production line is still traditional manual soldering. Although manual soldering has an irreplaceable position in socket strip manufacturing, especially for small-batch customization or repair tasks, this traditional process also has some obvious limitations and challenges, affecting the quality of the finished product and production efficiency. The following are some of the main drawbacks of manual soldering:

[0060] Manual operation is easily affected by individual differences. Even experienced technicians cannot completely avoid occasional hand tremors, visual fatigue, etc., resulting in inconsistent solder joint sizes and shapes, thus affecting the consistency of electrical performance.

[0061] The speed of manual soldering is significantly slower. Especially when facing large-scale production, the processing time for a single product is long, restricting the expansion of production capacity.

[0062] For extremely small electronic components, manual operation may not be precise enough due to the limitations of hand-eye coordination. Especially for solder joints with tiny pitches, it is impossible to meet the high-density packaging standards required by high-end products.

[0063] Manual soldering may have defects such as false soldering and bridging, increasing the defective rate, requiring additional quality inspection procedures, and prolonging the product launch cycle.

[0064] To address this technical problem, this embodiment discloses an automatic soldering device for socket strips, as Figures 1 to 4 shown, including:

[0065] A positioning component for defining the socket strip to be soldered;

[0066] The positioning component stably positions the socket strip to be soldered, enabling subsequent precise soldering.

[0067] A point position monitoring component disposed above the positioning component for capturing the solder points of the socket strip to be soldered;

[0068] Located above the positioning component, it captures the solder points of the socket strip to be soldered, facilitating the subsequent setting of the movement path.

[0069] A moving component connected to a soldering gun for driving the soldering gun to move;

[0070] A controller respectively connected to the moving component, the point position monitoring component, and the soldering gun. The controller controls the movement path of the moving component according to the solder points captured by the point position monitoring component, and the controller controls the solder volume according to the type of socket strip.

[0071] The controller designs a specific movement path based on the obtained solder points, thereby accurately soldering the socket strip and ensuring the solder quality.

[0072] In this embodiment, the positioning component includes a plurality of limiting bumps 1 and a bottom plate 2. The plurality of limiting bumps 1 surround a limiting cavity on the bottom plate 2, and the socket strip to be soldered is positioned within the limiting cavity.

[0073] Specifically, setting multiple bumps can better stably position the socket strip. During use, the socket strip to be soldered can be placed into this limiting cavity.

[0074] The limiting cavity formed by the limiting bumps 1 can ensure that the socket does not shift during the welding process, thereby improving the welding accuracy. Multiple bumps provide multiple contact points, increasing the friction between the socket and the base plate 2, making the socket more stable during the welding process. If the design of the limiting bumps 1 is standardized, then this positioning component can be applied to sockets of various different sizes and shapes. The user only needs to place the socket to be soldered into the limiting cavity to start the welding work, simplifying the operation process. Since the positioning of the socket is more accurate and stable, rework caused by improper positioning can be reduced, thereby improving production efficiency.

[0075] In this embodiment, the spot monitoring component includes a plurality of position sensors 3. The plurality of position sensors 3 capture the positions of the welding spots within their corresponding regions, and each position sensor 3 transmits the induction signal to the controller.

[0076] Setting a plurality of position sensors 3 enables each position sensor 3 to specifically detect the welding spots within the responsible region, thus being able to avoid the influence of other solder joints and ensuring the induction effect of the sensor.

[0077] Specifically,

[0078] By using a plurality of position sensors 3 to capture the positions of the welding spots within their respective responsible regions and transmit the induction signals to the controller, each position sensor 3 is specifically responsible for monitoring the welding spots within a specific region, which can ensure the precise positioning of the welding spots and is not affected by the welding spots in other regions.

[0079] Since each sensor only focuses on its responsible region, interference from other welding spots can be reduced, improving the accuracy of the induction signal.

[0080] The parallel operation of multiple sensors can improve the reliability of the system. Even if a certain sensor fails, other sensors can still continue to work, ensuring the continuity of the welding process.

[0081] This allows the system to adapt to different welding tasks and workpieces because the position and quantity of the sensors can be adjusted as needed.

[0082] The position sensor 3 can capture the position information of the welding spots in real time and transmit this information to the controller, enabling the controller to make timely adjustments to cope with any deviations that may occur during the welding process.

[0083] By precisely controlling the positions of the welding spots, welding defects can be reduced, and the quality and strength of the welded joints can be improved.

[0084] The collected position data can be used for subsequent data analysis to optimize the welding process and improve production efficiency.

[0085] This kind of point position monitoring component can be easily integrated into the existing welding production line without large-scale transformation of the existing equipment.

[0086] In this embodiment, the moving component includes a frame 4 and a slider 5. The top of the frame 4 is provided with an X-axis guide rail and a Y-axis guide rail.

[0087] The slider 5 is slidably connected to the X-axis guide rail. The Y-axis guide rail is divided into a first Y-axis guide rail and a second Y-axis guide rail. The two ends of the X-axis guide rail are respectively slidably connected to the first Y-axis guide rail and the second Y-axis guide rail.

[0088] The slider 5 slides on the X-axis guide rail to achieve movement in the X-axis direction. The X-axis guide rail can also move along the Y-axis guide rail to enable the slider 5 to move in the Y-axis direction, so that the soldering gun can move on the XY two-dimensional plane.

[0089] In this embodiment, the X-axis guide rail includes an X-axis guide post 6. The slider 5 is slidably connected to the X-axis guide post 6.

[0090] Both ends of the X-axis guide post 6 are provided with a first transmission belt 7. The slider 5 is also connected to the first transmission belt 7.

[0091] The first transmission belt 7 is driven by a first motor 8. The first transmission belt 7 drives the slider 5 to slide along the X-axis guide post 6. The soldering gun is installed on the slider 5.

[0092] The first transmission belt 7 is driven by a motor to move, thereby driving the slider 5 to move along the X-axis guide post 6.

[0093] In this embodiment, the first Y-axis guide rail and the second Y-axis guide rail respectively include a Y-axis guide post 9. A moving plate 10 is slidably connected to the Y-axis guide post 9.

[0094] Both ends of the Y-axis guide post 9 are provided with a second transmission belt 11. The moving plate 10 is also connected to the second transmission belt 11.

[0095] The second transmission belt 11 is driven by a second motor 12. The second transmission belt 11 drives the moving plate 10 to slide along the Y-axis guide post 9. The two ends of the X-axis guide rail are respectively installed on the moving plates 10 of the first Y-axis guide rail and the second Y-axis guide rail.

[0096] The second transmission belt 11 is driven by a motor to move, thereby driving the moving plate 10 to move along the Y-axis guide post 9 and then enabling the X-axis guide rail to move, achieving the movement of the soldering gun in the Y-axis direction.

[0097] In this embodiment, the soldering gun includes a connecting block 16 and a gun head 14. The gun head 14 is connected to the connecting block 16 through a rotating shaft 15, and the connecting block 16 is fixedly connected to the slider 5.

[0098] The gun head 14 is connected to the slider 5 through the connecting block 16, and the rotating shaft 15 enables the gun head 14 to rotate around the rotating shaft 15, so that the gun head 14 can rotate to better adapt to soldering.

[0099] In this embodiment, the soldering gun head 14 is connected with a temperature sensor to monitor the melting degree of the soldering tin through the temperature sensor.

[0100] By using the automatic soldering device for socket strips of the present invention, soldering can be automatically and quickly performed on specific areas, solving problems such as long time consumption, easy missed soldering, insufficient soldering accuracy, low production efficiency, and high labor cost in the manual soldering method, thereby reducing the occurrence of product defect rate and improving the production efficiency of products. According to the large number of soldering points on the socket strip and the low efficiency of manual soldering, which cannot ensure the firmness of the soldering points and avoid damage to components caused by manual soldering mistakes, an automatic soldering device for socket strips is independently designed in combination with the distribution of soldering on the currently produced socket strip products. The device fixes the soldering gun on the slide rail of the bracket of the automatic soldering device, controls the movement of the horizontal slider 5 and the vertical slider 5 by using a motor, and makes the soldering gun move to the corresponding solder joint through the position set by the position sensor 3. The tin output amount and soldering of the soldering gun each time can be set to a fixed value, which can solve the consistency and accuracy of each soldering point. Greatly improve the quality and efficiency of the soldering points.

[0101] Embodiment 2

[0102] The automatic soldering method for socket strips disclosed in this embodiment uses the following automatic soldering device for socket strips, including:

[0103] A positioning component for defining the socket strip to be soldered;

[0104] The positioning component stably positions the socket strip to be soldered to achieve subsequent precise soldering.

[0105] A point position monitoring component provided above the positioning component for capturing the solder joints of the socket strip to be soldered;

[0106] Located above the positioning component for capturing the solder joints of the socket strip to be soldered, facilitating the subsequent setting of the movement path.

[0107] A moving component connected with a soldering gun for driving the soldering gun to move;

[0108] A controller, which is respectively connected to the moving component, the point position monitoring component and the soldering gun. The controller controls the moving path of the moving component according to the solder points captured by the point position monitoring component, and the controller controls the solder volume according to the type of socket strip.

[0109] The controller designs a specific moving path according to the obtained welding points, so as to accurately solder the socket strip and ensure the solder quality.

[0110] In this embodiment, the positioning component includes a plurality of limiting bumps 1 and a bottom plate 2. The plurality of limiting bumps 1 surround a limiting cavity on the bottom plate 2, and the socket strip to be soldered is positioned in the limiting cavity.

[0111] Setting multiple bumps can better stably position the socket strip. During use, the socket strip to be soldered can be placed into the limiting cavity.

[0112] In this embodiment, the point position monitoring component includes a plurality of position sensors 3. The plurality of position sensors 3 capture the positions of the welding points in their corresponding areas, and each position sensor 3 transmits the induction signal to the controller.

[0113] Setting multiple position sensors 3 enables each position sensor 3 to specifically detect the welding points in the responsible area, so as to be unaffected by other solder points and ensure the induction effect of the sensor.

[0114] In this embodiment, the moving component includes a frame 4 and a slider 5. The top of the frame 4 is provided with an X-axis guide rail and a Y-axis guide rail.

[0115] The slider 5 is slidably connected to the X-axis guide rail. The Y-axis guide rail is divided into a first Y-axis guide rail and a second Y-axis guide rail. The two ends of the X-axis guide rail are respectively slidably connected to the first Y-axis guide rail and the second Y-axis guide rail.

[0116] The slider 5 slides on the X-axis guide rail to achieve movement in the X-axis direction. The X-axis guide rail can also move along the Y-axis guide rail to achieve the movement of the slider 5 in the Y-axis direction, so that the soldering gun can move in the XY two-dimensional plane.

[0117] In this embodiment, the X-axis guide rail includes an X-axis guide post 6. The slider 5 is slidably connected to the X-axis guide post 6.

[0118] Both ends of the X-axis guide post 6 are provided with a first transmission belt 7. The slider 5 is also connected to the first transmission belt 7.

[0119] The first transmission belt 7 is driven by a first motor 8. The first transmission belt 7 drives the slider 5 to slide along the X-axis guide post 6. The soldering gun is installed on the slider 5.

[0120] The first transmission belt 7 is driven by a motor to move, thereby driving the slider 5 to move along the X-axis guide post 6.

[0121] In this embodiment, the first Y-axis guide rail and the second Y-axis guide rail respectively include Y-axis guide posts 9. A moving plate 10 is slidably connected to the Y-axis guide posts 9.

[0122] Both ends of the Y-axis guide post 9 are provided with a second transmission belt 11. The moving plate 10 is also connected to the second transmission belt 11.

[0123] The second transmission belt 11 is driven by a second motor 12. The second transmission belt 11 drives the moving plate 10 to slide along the Y-axis guide post 9. Both ends of the X-axis guide rail are respectively installed on the moving plates 10 of the first Y-axis guide rail and the second Y-axis guide rail.

[0124] The second transmission belt 11 is driven by a motor to move, thereby driving the moving plate 10 to move along the Y-axis guide post 9, and then enabling the X-axis guide rail to move, realizing the movement of the soldering gun in the Y-axis direction.

[0125] In this embodiment, the soldering gun includes a connecting block 16 and a gun head 14. The gun head 14 is connected to the connecting block 16 through a rotating shaft 15. The connecting block 16 is fixedly connected to the slider 5.

[0126] The gun head 14 is connected to the slider 5 through the connecting block 16. The rotating shaft 15 can cause the gun head 14 to rotate around the rotating shaft 15, enabling the gun head 14 to rotate and adapt to better soldering.

[0127] It includes the following steps:

[0128] The socket to be soldered is positioned below the position monitoring component. The position monitoring component captures the soldering positions of the socket to be soldered.

[0129] The soldering position data is transmitted to the controller. The controller calculates the movement path. The movement path controls the soldering gun to perform automatic soldering on the socket.

[0130] In this embodiment, a vision detection system is further included. The vision detection system detects whether the solder joints of the soldered socket are full, and whether there are short circuits or missed soldering.

[0131] The soldering gun uses a high-speed rotating soldering iron head or a hot air soldering gun to start heating. When the set temperature is reached, the soldering material will be melted and have good heat conduction with the metal contact surface. Precise soldering

[0132] The automatic soldering machine starts working. According to the set programming control logic, it can execute the predetermined soldering path. The position accuracy is identified by the position sensor 3 for the soldering points of the socket. The position sensor 3 (such as Figure 4 Note 4, 5) sends out signals to control the horizontal movement motor and the vertical movement motor to control the soldering gun to move along the predetermined soldering path to the corresponding soldering points of the socket for soldering.

[0133] During the soldering process, the temperature needs to be maintained within a certain range. Too high a temperature is likely to cause excessive oxidation or damage to the circuit board, while too low a temperature will result in poor soldering. Therefore, the soldering machine is equipped with a temperature sensor that can monitor and adjust the heating intensity in real time.

[0134] After soldering is completed, the processed socket needs to be taken out manually, and it needs a certain cooling time for the solder to solidify and then its soldering quality is detected.

[0135] The soldering gun, using a high-speed rotating soldering iron tip or a hot air soldering gun, starts heating. When the set temperature is reached, the solder material will be melted and have good heat conduction with the metal contact surface. Precise soldering

[0136] The automatic soldering machine starts working. According to the set programming control logic, it can execute the predetermined soldering path. The position accuracy is identified by the position sensor 3 for the soldering points of the socket. The position sensor 3 sends out signals to control the horizontal movement motor and the vertical movement motor to control the soldering gun to move along the predetermined soldering path to the corresponding soldering points of the socket for soldering.

[0137] During the soldering process, the temperature needs to be maintained within a certain range. Too high a temperature is likely to cause excessive oxidation or damage to the circuit board, while too low a temperature will result in poor soldering. Therefore, the soldering machine is equipped with a temperature sensor that can monitor and adjust the heating intensity in real time.

[0138] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps described in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn according to the actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0139] In the description of the present application, it should be understood that the orientation or positional relationship indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the protection scope of the present application; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0140] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above-mentioned", etc. can be used here to describe the spatial positional relationship between a device or feature shown in the drawings and other devices or features. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation described in the drawings for the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned as "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations should be made for the spatial relative descriptions used here.

[0141] In addition, it should be noted that the use of words such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional declaration, the above-mentioned words have no special meaning. Therefore, it should not be construed as a limitation on the protection scope of the present application.

[0142] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An automatic soldering device for a power strip, characterized in that: include: A positioning assembly, the positioning assembly is used to limit the socket to be soldered; A point monitoring component, which is arranged above the positioning component and is used to capture the solder points of the power strip to be soldered; A moving component, wherein the moving component is connected to a soldering gun and is used to drive the soldering gun to move; A controller, wherein the controller is respectively connected to the moving component, the point monitoring component and the solder gun, and the controller controls the moving path of the moving component according to the solder points captured by the point monitoring component, and the controller controls the amount of solder according to the type of the socket strip.

2. The automatic soldering device for power strips according to claim 1, characterized in that: The positioning assembly includes a plurality of limiting protrusions and a bottom plate. The plurality of limiting protrusions are arranged on the bottom plate to form a limiting cavity, and the socket strip to be soldered is positioned in the limiting cavity.

3. The automatic soldering device for power strips according to claim 2, characterized in that: The point monitoring component includes a plurality of position sensors, which capture the positions of welding sites in their corresponding areas, and each position sensor transmits a sensing signal to the controller.

4. The automatic soldering device for power strips according to claim 1, characterized in that: The moving assembly includes a frame and a slider, and the top of the frame is provided with an X-axis guide rail and a Y-axis guide rail. The slider is slidably connected to the X-axis guide rail, the Y-axis guide rail is divided into a first Y-axis guide rail and a second Y-axis guide rail, and both ends of the X-axis guide rail are slidably connected to the first Y-axis guide rail and the second Y-axis guide rail respectively.

5. The automatic soldering device for power strips according to claim 4, characterized in that: The X-axis guide rail includes an X-axis guide column, and the slider is slidably connected to the X-axis guide column. The two ends of the X-axis guide column are provided with a first transmission belt, and the slider is also connected to the first transmission belt. The first transmission belt is driven by the first motor, and the first transmission belt drives the slider to slide along the X-axis guide column, and the solder gun is installed on the slider.

6. The automatic soldering device for power strips according to claim 5, characterized in that: The first Y-axis guide rail and the second Y-axis guide rail respectively include a Y-axis guide column, and a moving plate is slidably connected to the Y-axis guide column. The two ends of the Y-axis guide column are provided with a second transmission belt, and the movable plate is also connected to the second transmission belt. The second transmission belt is driven by the second motor, and the second transmission belt drives the movable plate to slide along the Y-axis guide column. The two ends of the X-axis guide rail are respectively installed on the movable plates of the first Y-axis guide rail and the second Y-axis guide rail.

7. The automatic soldering device for power strips according to claim 5, characterized in that: The soldering gun comprises a connecting block and a gun head, wherein the gun head is connected to the connecting block via a rotating shaft, and the connecting block is fixedly connected to the sliding block.

8. The automatic soldering device for power strips according to claim 7, characterized in that: The soldering gun head is connected with a temperature sensor.

9. A method for automatic soldering of a power strip, characterized in that: The automatic soldering device for strips according to any one of claims 1 to 8 comprises the following steps: Position the socket strip to be soldered below the point position monitoring component, and the point position monitoring component captures the soldering point of the socket strip to be soldered. The soldering site data is transmitted to a controller, and the controller calculates a moving path, and the moving path controls the solder gun to automatically solder the strip.

10. The automatic soldering method of a power strip according to claim 9, characterized in that: It also includes a visual inspection system, which detects whether the solder joints of the socket strip are full after soldering, and whether there is a short circuit or welding leakage.

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