Processing apparatus

Abstract

The invention provides a processing apparatus capable of preventing deterioration of cooling efficiency of a spindle housing over time. The processing apparatus includes: a chuck table that holds a workpiece; a processing unit (6) having a processing tool for processing the workpiece held by the chuck table; a processing water supply unit (8) that supplies processing water to a region where the workpiece is processed by the processing tool; a processing chamber (10) covering a region including the chuck table and the processing unit; and a gas-liquid separation mechanism (12). The gas-liquid separation mechanism includes: a container (104) that stores used processing water and has an exhaust unit (102); and a duct (106) that communicates with the container and sucks the mist that fills the processing chamber. A cooling path (120) is formed in the processing unit (6), and a pipe (122) communicating with the cooling path (120) is immersed in the processing water stored in the container (104).

Description

Technical Field

[0001] The present invention relates to a processing apparatus for performing predetermined processing such as cutting and grinding on a workpiece such as a wafer. Background Art

[0002] Regarding a wafer formed with a plurality of devices such as ICs and LSIs on the front surface divided by a dicing line, the back surface of the wafer is ground using a grinding apparatus, and then divided into individual device chips using a dicing apparatus. Each of the divided device chips is used in electronic devices such as mobile phones and personal computers.

[0003] The grinding apparatus generally includes: a chuck table for holding a wafer; a grinding unit in which a grinding wheel is rotatably mounted, the grinding wheel being provided with a grinding tool for grinding the wafer held by the chuck table in a ring shape; a grinding water supply unit for supplying grinding water composed of pure water to an area where the wafer held by the chuck table is ground by the grinding tool; and a processing chamber covering the processing area, and the grinding apparatus can grind the wafer into a desired thickness.

[0004] In addition, the dicing apparatus generally includes: a chuck table for holding a wafer; a cutting unit in which a cutting tool is rotatably mounted, the cutting tool cutting the wafer held by the chuck table; a cutting water supply unit for supplying cutting water composed of pure water to an area where the wafer held by the chuck table is cut by the cutting tool; and a processing chamber covering the processing area, and the dicing apparatus can accurately divide the wafer into individual device chips.

[0005] The processing chambers of the grinding apparatus and the dicing apparatus are filled with mist generated by the scattering of processing water (grinding water, cutting water). Therefore, the present applicant has proposed the following processing apparatus: the processing apparatus sucks the mist through a suction pipe and separates the sucked mist into gas and liquid (for example, refer to Patent Document 1).

[0006] In the processing apparatus disclosed in Patent Document 1, the ejection port of the suction pipe is located above the liquid level of a water storage container for storing used processing water. Moreover, the mist is ejected from the ejection port of the suction pipe toward the liquid level of the water storage container, and the mist is separated into gas and liquid in the water storage container. In addition, in the water storage container, when the mist is vaporized, the heat of the processing water in the container is taken away, thereby cooling the processing water. The cooled processing water is used as a refrigerant for cooling the spindle housing of the grinding unit or the cutting unit.

[0007] Patent Document 1: Japanese Patent No. 7139051

[0008] However, the refrigerant sent to the spindle housing contains used processing water. Therefore, the inside of the cooling path formed in the spindle housing is contaminated with the used processing water, and there is a problem that the cooling efficiency of the spindle housing deteriorates over time. SUMMARY OF THE INVENTION

[0009] An object of the present invention is to provide a processing device capable of preventing the deterioration of the cooling efficiency of the spindle housing over time.

[0010] According to the present invention, the following processing device capable of solving the above problems is provided. That is, "a processing device having: a chuck table for holding a workpiece; a processing unit having a processing tool for processing the workpiece held by the chuck table; a processing water supply unit for supplying processing water to a region where the workpiece is processed by the processing tool; a processing chamber for covering a region including the chuck table and the processing unit; and a gas-liquid separation mechanism including: a container for storing used processing water and having an exhaust unit; and a pipe communicating with the container for sucking mist filling the processing chamber, a cooling path is formed in the processing unit, and a pipe communicating with the cooling path is immersed in the processing water stored in the container".

[0011] Preferably, the ejection port of the pipe is immersed in the processing water stored in the container.

[0012] Preferably, a filter for generating fine bubbles is provided at the ejection port.

[0013] Preferably, the processing device has: a drain pan disposed in the processing chamber for receiving used processing water; and a drain pipe disposed in the drain pan for draining water to the container, and the drain pipe communicates with the container.

[0014] Preferably, the processing device has a processing water purification unit for purifying the processing water stored in the container, and circulating the purified processing water to the processing water supply unit.

[0015] The processing device of the present invention includes: a chuck table for holding a workpiece; a processing unit having a processing tool for processing the workpiece held by the chuck table; a processing water supply unit for supplying processing water to a region where the workpiece is processed by the processing tool; a processing chamber for covering a region including the chuck table and the processing unit; and a gas-liquid separation mechanism including: a container for storing used processing water and having an exhaust unit; and a pipe communicating with the container for sucking mist filling the processing chamber. A cooling path is formed in the processing unit, and a pipe communicating with the cooling path is immersed in the processing water stored in the container. Therefore, without using processing water as a cooling medium for cooling the spindle housing, it is possible to prevent the deterioration of the cooling efficiency of the spindle housing over time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a perspective view of the processing device of the present invention.

[0017] Figure 2 is Figure 1 a perspective view of the chuck table, the processing unit, etc. shown.

[0018] Figure 3 is Figure 1 an enlarged view of the processing unit shown.

[0019] Figure 4 is Figure 1 an enlarged view of the cleaning unit shown.

[0020] Figure 5 is Figure 1 a schematic view of the gas-liquid separation mechanism included in the processing device shown.

[0021] REFERENCE SIGNS LIST

[0022] 2: Cutting device (processing device); 4: Chuck table; 6: Processing unit; 8: Processing water supply unit; 10: Processing chamber; 12: Gas-liquid separation mechanism; 30: First drain pan; 32: First drain pipe; 98: Second drain pan; 100: Second drain pipe; 102: Exhaust unit; 104: Container; 106: Pipe; 114: Filter of the pipe; 116: Processing water purification unit; 120: Cooling path of the processing unit; 122: Pipe. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, a preferred embodiment of the processing device of the present invention will be described with reference to the drawings.

[0024] (Processing device: Cutting device 2)

[0025] In Figure 1In this, as an example of the processing device of the present invention, a cutting device 2 that performs cutting processing on a workpiece is shown. However, the processing device of the present invention is not limited to the cutting device 2, and may also be a grinding device that performs grinding processing on a workpiece, etc.

[0026] The cutting device 2 includes: a chuck table 4 that holds a plate-shaped workpiece such as a wafer W; a processing unit 6 (refer to Figure 2 and Figure 3 ) that has a processing tool for processing the workpiece held by the chuck table 4; a processing water supply unit 8 (refer to Figure 3 ) that supplies processing water to the area where the workpiece is processed by the processing tool; a processing chamber 10 (refer to Figure 1 ) that covers the area including the chuck table 4 and the processing unit 6; and a gas-liquid separation mechanism 12 (refer to Figure 5 ). In addition, Figure 1 the wafer W shown is pasted on an adhesive tape T whose periphery is fixed to an annular frame F.

[0027] (Chuck table 4)

[0028] Refer to Figure 2 for description. A circular suction chuck 14 is arranged at the upper end portion of the chuck table 4. The suction chuck 14 is formed of a porous member such as porous ceramics. In addition, the suction chuck 14 is connected to a suction unit (not shown). Moreover, in the chuck table 4, a suction force is generated on the upper surface of the suction chuck 14 by the suction unit, and the workpiece placed on the upper surface of the suction chuck 14 is sucked and held. In addition, a plurality of jigs 16 for fixing the annular frame F are arranged at intervals along the circumferential direction on the periphery of the chuck table 4.

[0029] As Figure 2 shown, the chuck table 4 is rotatably mounted on the upper end of a column 18 and rotates by a motor (not shown) built in the column 18. The lower end of the column 18 is fixed to the upper surface of an X-axis movable plate 20. The X-axis movable plate 20 is movably supported along the X-axis direction on the upper surface of the base 22 of the cutting device 2. Among them, the X-axis direction is Figure 2 the direction indicated by the arrow X in Figure 2 . In addition, the Y-axis direction indicated by the arrow Y in Figure 2 is a direction perpendicular to the X-axis direction, and the Z-axis direction indicated by the arrow Z in

[0030] is the vertical direction perpendicular to the X-axis direction and the Y-axis direction. The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.In addition, the chuck table 4 is fed for machining in the X-axis direction by the X-axis feed unit 24. The X-axis feed unit 24 includes a ball screw 26 that is connected to the X-axis movable plate 20 and extends in the X-axis direction, and a motor 28 that rotates the ball screw 26. The X-axis feed unit 24 converts the rotational motion of the motor 28 into a linear motion through the ball screw 26 and transmits it to the X-axis movable plate 20, causing the X-axis movable plate 20 to move in the X-axis direction along a pair of X-axis guide rails 22a provided on the base 22. Thereby, the chuck table 4 is fed for machining in the X-axis direction.

[0031] (First drain pan 30, first drain pipe 32)

[0032] Refer to Figure 2 Continuing the description, below the movable range of the chuck table 4 in the X-axis direction, there is provided a first drain pan 30 for catching machining water and a first drain pipe 32 disposed in the first drain pan 30. However, in Figure 2 , for convenience, the positions of the first drain pan 30 and the first drain pipe 32 are described as being offset in the X-axis direction. When performing cutting machining on the workpiece held by the chuck table 4 and when machining water is supplied from the machining water supply unit 8, if the machining water and cutting chips flow into the X-axis feed unit 24, the X-axis feed unit 24, which is a precision mechanical element, may be damaged. Therefore, a rectangular cover plate 34 is installed on the chuck table 4, and corrugated covers 36 that are telescopable in the X-axis direction are provided on one side and the other side of the cover plate 34 in the X-axis direction. Moreover, the above-mentioned first drain pan 30 is disposed at a position for catching the machining water flowing down from the cover plate 34 and the corrugated covers 36. The machining water caught by the first drain pan 30 is discharged via the first drain pipe 32.

[0033] (Machining unit 6)

[0034] The machining unit 6 of the present embodiment is configured as a cutting unit for performing cutting machining on the workpiece held by the chuck table 4. As Figure 2 shown, the machining unit 6 includes: a Y-axis movable body 38 that is supported on the upper surface of the base 22 so as to be movable in the Y-axis direction; and a Z-axis movable body 40 that is supported on the Y-axis movable body 38 so as to be movable in the Z-axis direction. A spindle housing 42 that extends in the Y-axis direction is installed on the Z-axis movable body 40. As Figure 3 shown, in the spindle housing 42, a spindle 44 that extends in the Y-axis direction is rotatably supported. A ring-shaped cutting tool 46 for cutting the workpiece is fixed to the front end of the spindle 44. The cutting tool 46 is covered by a tool cover 48, and the tool cover 48 is provided at the front end of the spindle housing 42. In addition, as Figure 2As shown, a photographing unit 50 is arranged at an interval from a cutting tool 46 in the X-axis direction, and the photographing unit 50 is supported by a spindle housing 42.

[0035] The position of the cutting tool 46 in the Y-axis direction is adjusted by a Y-axis feed unit 52. As Figure 2 shown, the Y-axis feed unit 52 has a ball screw 54 connected to a Y-axis movable body 38 and extending in the Y-axis direction, and a motor 56 that rotates the ball screw 54. The Y-axis feed unit 52 converts the rotational motion of the motor 56 into a linear motion through the ball screw 54 and transmits it to the Y-axis movable body 38, causing the Y-axis movable body 38 to move in the Y-axis direction along a pair of Y-axis guide rails 22b provided on a base 22. Thereby, the cutting tool 46 is indexed and fed in the Y-axis direction to adjust the position of the cutting tool 46 in the Y-axis direction.

[0036] In addition, the position of the cutting tool 46 in the Z-axis direction is adjusted by a Z-axis feed unit 58. The Z-axis feed unit 58 has a ball screw (not shown) connected to a Z-axis movable body 40 and extending in the Z-axis direction, and a motor 60 that rotates the ball screw. The Z-axis feed unit 58 converts the rotational motion of the motor 60 into a linear motion through the ball screw and transmits it to the Z-axis movable body 40, causing the Z-axis movable body 40 to move in the Z-axis direction along a pair of Z-axis guide rails 38a (only one is shown) attached to the Y-axis movable body 38. Thereby, the cutting tool 46 is fed in the Z-axis direction for plunge cutting to adjust the position of the cutting tool 46 in the Z-axis direction.

[0037] (Processing water supply unit 8)

[0038] As Figure 3 shown, the processing water supply unit 8 includes a pair of supply ports 62 provided at the upper part of a tool cover 48 and a pair of spray nozzles 64 (only one side is shown) provided at the lower part of the tool cover 48. Although not shown, the pair of supply ports 62 are connected to a water source via a pipeline such as a hose. In addition, the pair of supply ports 62 are connected to the pair of spray nozzles 64 via a flow path (not shown) inside the tool cover 48. The pair of spray nozzles 64 are arranged at an interval from each other in the Y-axis direction with the cutting tool 46 interposed therebetween. In addition, a plurality of spray ports (not shown) are formed at an interval from each other in the X-axis direction on the spray nozzles 64. Moreover, the processing water supply unit 8 sprays the processing water (for example, pure water) supplied from the water source from the spray ports of the pair of spray nozzles 64 onto the cutting tool 46 and the workpiece.

[0039] (Processing chamber 10)

[0040] As Figure 1As shown, the processing chamber 10 covers an area provided with a chuck table 4, a processing unit 6, etc. On the ceiling and side walls partitioning the processing chamber 10, there is a transparent cover 68 that is openably and closably mounted via a hinge 66 on the upper part of the cutting device 2. In addition, on the side walls partitioning the processing chamber 10 other than the transparent cover 68 (for example, the side wall indicated by reference numeral 70), there is a suction port 72 for sucking the mist generated by the scattering of the processing water sprayed from the processing water supply unit 8.

[0041] The cutting device 2 further has: a vertically movable cassette table 76 that places and stores a cassette 74 containing a plurality of workpieces such as wafers W; a loading / unloading unit 80 that pulls out the workpiece before cutting from the cassette 74 and unloads it to the temporary placement table 78, and loads the workpiece after cutting positioned on the temporary placement table 78 into the cassette 74; a first transfer unit 82 that transfers the workpiece before cutting unloaded from the cassette 74 to the temporary placement table 78 to the chuck table 4; a cleaning unit 84 that cleans the workpiece after cutting; and a second transfer unit 86 that transfers the workpiece after cutting from the chuck table 4 to the cleaning unit 84.

[0042] (Cleaning unit 84)

[0043] Referring to Figure 4 As shown, the cleaning unit 84 has: a rotary table 88 that holds the workpiece; a cleaning water nozzle 90 that sprays cleaning water (such as pure water) onto the workpiece held by the rotary table 88; and an air nozzle 92 that sprays drying air onto the workpiece held by the rotary table 88.

[0044] (Rotary table 88)

[0045] A circular adsorption chuck 94 is disposed at the upper end portion of the rotary table 88. The adsorption chuck 94 is formed of a porous member such as porous ceramics. In addition, the adsorption chuck 94 is connected to an attracting unit (not shown). And in the rotary table 88, an attracting force is generated on the upper surface of the adsorption chuck 94 by the attracting unit, and the workpiece placed on the upper surface of the adsorption chuck 94 is attracted and held.

[0046] Below the center of the rotary table 88, the rotary shaft 96a of a motor 96 that rotates the rotary table 88 is connected. The motor 96 rotates the rotary table 88 about the vertical direction as the axis. In addition, on the outer peripheral surface of the motor 96, a lifting unit 97 that can be constituted by an actuator such as a cylinder is mounted. The lifting unit 97 raises and lowers the rotary table 88 between the rising position for loading and unloading the workpiece ( Figure 4 the position shown) and the lowering position for cleaning the workpiece.

[0047] (Cleaning water nozzle 90)

[0048] After positioning the rotary table 88 holding the workpiece at the lowered position by the lifting unit 97, the cleaning water nozzle 90 sprays cleaning water from the spray port 90a toward the workpiece to clean the workpiece. When cleaning the workpiece, the cleaning water nozzle 90 is rotated by a motor (not shown) to position the spray port 90a above the central portion of the workpiece. Further, near the cleaning unit 84, a suction port (not shown) for sucking the mist generated by the scattering of the cleaning water sprayed from the cleaning water nozzle 90 may be formed on the side wall partitioning the processing chamber 10.

[0049] (Air nozzle 92)

[0050] After cleaning the workpiece held by the rotary table 88, the air nozzle 92 sprays dry air from the spray port 92a toward the workpiece to dry the workpiece. When drying the workpiece, the air nozzle 92 is rotated by a motor (not shown) to position the spray port 92a above the central portion of the workpiece.

[0051] (Second drain pan 98, second drain pipe 100)

[0052] The cleaning unit 84 further includes: a second drain pan 98 that catches the cleaning water (used processing water) used for cleaning the workpiece; and a second drain pipe 100 disposed in the second drain pan 98. The second drain pan 98 surrounds the rotary table 88. The cleaning water (processing water) caught by the second drain pan 98 is discharged via the second drain pipe 100.

[0053] (Gas-liquid separation mechanism 12)

[0054] Refer to Figure 5 The gas-liquid separation mechanism 12 will be described. The gas-liquid separation mechanism 12 includes: a container 104 that stores the used processing water and has an exhaust unit 102; and a pipe 106 that communicates with the container 104 and sucks the mist filling the processing chamber 10.

[0055] (Exhaust unit 102)

[0056] The exhaust unit 102 includes a fan 108 disposed at the upper part of the container 104 and a motor (not shown) that rotates the fan 108. Since the cutting device 2 is generally installed in a clean room, a filter 110 for filtering cutting chips and the like is provided so that fine cutting chips and the like contained in the used processing water are not discharged through the exhaust unit 102.

[0057] (Container 104)

[0058] The container 104 is connected to the first drain pipe 32 and the second drain pipe 100. Therefore, the used processing water is sent from the first drain pan 30 and the second drain pan 98 to the container 104 via the first drain pipe 32 and the second drain pipe 100.

[0059] (Pipe 106)

[0060] The pipe 106 connects the suction port 72 of the processing chamber 10 to the container 104. The jet outlet 106a of the pipe 106 is immersed in the processing water stored in the container 104. In addition, a pressure feeding unit 112 for sucking the mist in the processing chamber 10 and delivering it to the container 104 is provided on the pipe 106. When the pressure feeding unit 112 operates, the mist in the processing chamber 10 is sucked from the suction port 72 and guided through the pipe 106 into the container 104. Moreover, the mist guided into the container 104 becomes bubbles and mixes with the processing water in the container 104. The contact area with the processing water increases and it is stirred, so that a large amount of mist is incorporated into the processing water. Therefore, in the container 104, the mist is efficiently separated into gas and liquid.

[0061] In addition, it is preferable to dispose a filter 114 for generating fine bubbles at the jet outlet 106a of the pipe 106. Thereby, when the mist guided through the pipe 106 becomes bubbles and mixes with the processing water in the container 104, the contact area between the bubbles of the mist and the processing water further increases, and thus the gas-liquid separation property is further improved.

[0062] In addition, the pipe 106 may also connect the suction port provided near the cleaning unit 84 to the container 104. In this case, by the operation of the pressure feeding unit 112, the mist generated in the cleaning unit 84 is guided into the container 104.

[0063] (Processing water purification unit 116)

[0064] The gas-liquid separation mechanism 12 of the present embodiment has a processing water purification unit 116 for purifying the processing water stored in the container 104. Although not shown, the processing water purification unit 116 can be configured to include, for example: a filter that filters the used processing water stored in the container 104 to generate clean water; an ultraviolet irradiator that destroys the organic substances mixed in the clean water generated by the filter; an ion exchange resin that generates pure water from the clean water in which the organic substances have been destroyed by the ultraviolet irradiator; and a temperature controller that adjusts the temperature of the pure water generated by the ion exchange resin.

[0065] The processing water purified by the processing water purification unit 116 is circulated to the processing water supply unit 8, the cleaning water nozzle 90, and the container 104. As Figure 5As shown, a first pump 118 is provided between the processed water purification unit 116 and the container 104. Through the first pump 118, the processed water in the container 104 is conveyed via the processed water purification unit 116 to the processed water supply unit 8 and the washing water nozzle 90 of the washing unit 84. Moreover, the processed water ejected from the processed water supply unit 8 and the washing water nozzle 90 is caught by the first drain pan 30 and the second drain pan 98, and returns to the container 104 via the first drain pipe 32 and the second drain pipe 100.

[0066] (Cooling path 120 of the processing unit 6)

[0067] As Figure 5 shown, a cooling path 120 is provided in the spindle housing 42 of the processing unit 6 of the present embodiment. A pipe 122 communicates with the cooling path 120, and a part of the pipe 122 is immersed in the processed water stored in the container 104. The immersed portion 122a (the portion immersed in the processed water in the container 104) of the pipe 122 is formed of a material with high thermal conductivity (such as a metal material like copper). Therefore, heat exchange can be performed between the cooling medium in the immersed portion 122a and the processed water in the container 104. The immersed portion 122a is preferably formed in a coil shape or the like, whereby a large heat conduction area can be ensured with a small installation area. In addition, no opening is provided in the immersed portion 122a, and the processed water in the container 104 does not enter the pipe 122.

[0068] A second pump 124 is provided on the pipe 122. And the cooling medium sent toward the cooling path 120 by the second pump 124 takes heat from the spindle housing 42 that generates heat during cutting and cools the spindle housing 42. The cooling medium that has taken heat from the spindle housing 42 is cooled by the processed water in the container 104 in the immersed portion 122a of the pipe 122.

[0069] Thus, in the present embodiment, used processed water is not used as the cooling medium for cooling the spindle housing 42, so the cooling path 120 of the spindle housing 42 is not contaminated by the used processed water. Therefore, it is possible to prevent the deterioration of the cooling efficiency of the spindle housing 42 over time.

[0070] Next, a cutting method for cutting a wafer W as a workpiece using the above-described cutting device 2 will be described. Although not shown, the front surface of the wafer W is divided into a plurality of rectangular regions by lattice-shaped dicing lines, and devices such as ICs and LSIs are formed in each rectangular region. Here, a method of cutting along the lattice-shaped dicing lines will be described.

[0071] (Holding process)

[0072] In this embodiment, first, the following holding process is performed: The wafer W is transferred from the cassette 74 to the chuck table 4 to hold the wafer W on the chuck table 4.

[0073] In the holding process, first, the wafer W before cutting is taken out from the cassette 74 to the temporary stage 78 by the loading / unloading unit 80. Then, the wafer W is transferred from the temporary stage 78 to the chuck table 4 positioned at the transfer position ( Figure 1 the position shown) by the first transfer unit 82, and the wafer W is placed on the upper surface of the chuck table 4. Next, an attractive force is generated on the suction chuck 14 of the chuck table 4 to attract and hold the wafer W by the chuck table 4. In addition, the ring frame F supporting the wafer W by means of the adhesive tape T is fixed by a plurality of jigs 16.

[0074] (Cutting process)

[0075] After the holding process is performed, the following cutting process is performed: The wafer W is subjected to cutting by the cutting tool 46 of the processing unit 6.

[0076] In the cutting process, first, the dividing line of the wafer W is aligned with the X-axis direction. At this time, the wafer W is moved to directly below the imaging unit 50 by the X-axis feed unit 24, and the wafer W is imaged by the imaging unit 50. Then, based on the image of the wafer W captured by the imaging unit 50, the chuck table 4 is appropriately rotated, whereby the dividing line of the wafer W is aligned with the X-axis direction.

[0077] After aligning the dividing line of the wafer W with the X-axis direction, cutting is performed along the dividing line of the wafer W. At this time, the chuck table 4 is moved to below the processing unit 6 by the X-axis feed unit 24. In addition, the cutting tool 46 is rotated in the direction indicated by the arrow R1 in Figure 3 . Then, the cutting tool 46 is lowered by the Z-axis feed unit 58 so that the cutting edge of the cutting tool 46 cuts into the upper surface of the wafer W to a specified depth, and while supplying machining water from the spray nozzle 64 of the machining water supply unit 8 to the cutting tool 46 and the wafer W, the chuck table 4 is fed in the X-axis direction for cutting by the X-axis feed unit 24. In this way, cutting is performed along the dividing line of the wafer W. In addition, while performing indexing feed in the Y-axis direction at the Y-axis direction interval of the dividing line by the Y-axis feed unit 52, cutting is repeatedly performed to perform cutting on all the dividing lines aligned with the X-axis direction. Then, after rotating the chuck table 4 by 90 degrees, cutting and indexing feed are repeatedly performed to perform cutting on all the dividing lines perpendicular to the dividing lines on which cutting has been performed previously.

[0078] In the cutting process, as the main shaft 44 rotates at high speed, the main shaft housing 42 that supports the main shaft 44 may generate heat and thermal expansion. When the main shaft housing 42 undergoes thermal expansion, high-precision cutting cannot be performed. Therefore, during the cutting process, the second pump 124 is operated to circulate the cooling medium inside the cooling path 120 and the pipe 122. As a result, the cooling medium supplied to the cooling path 120 extracts heat from the main shaft housing 42, so that the main shaft housing 42 can be cooled. In addition, the cooling medium that has extracted heat from the main shaft housing 42 is cooled by the processing water in the container 104 at the immersion portion 122a of the pipe 122.

[0079] In addition, during the cutting process, a large amount of mist is generated due to the scattering of the processing water ejected from the processing water supply unit 8. Therefore, during the cutting process, the pressure feeding unit 112 of the gas-liquid separation mechanism 12 is operated to suck the mist from the suction port 72 provided near the processing unit 6. The mist sucked from the suction port 72 is ejected from the ejection port 106a through the pipe 106. As described above, since the ejection port 106a is immersed in the processing water in the container 104, the mist guided by the pipe 106 becomes bubbles, mixes with the processing water in the container 104, and the contact area with the processing water increases and is agitated, so that a large amount of mist is incorporated into the processing water. Therefore, in the container 104, the mist is efficiently separated into gas and liquid. In addition, during the cutting process, the processing water ejected from the processing water supply unit 8 flows down from the cover plate 34 and the corrugated cover 36 and is received by the first drain pan 30, and then returns to the container 104 through the first drain pipe 32.

[0080] (Transportation process)

[0081] After the cutting process is performed, the following transportation process is performed: The cut wafer W is transported to the cleaning unit 84.

[0082] In the transportation process, first, the chuck table 4 is positioned at the above-mentioned transfer position ( Figure 1 the position shown) by the X-axis feed unit 24. Next, the suction force of the chuck table 4 is released, and the fixing of the fixture 16 to the ring frame F is released. Then, the cut wafer W is transported from the chuck table 4 to the rotary table 88 of the cleaning unit 84 by the second transfer unit 86.

[0083] (Cleaning process)

[0084] After the transportation process is performed, the following cleaning process is performed: The cut wafer W is cleaned.

[0085] In the cleaning process, first, an attractive force is generated on the suction chuck 94 of the rotary table 88 to attract and hold the wafer W on the rotary table 88. At this time, the rotary table 88 is positioned at Figure 4the raised position shown, and position the cleaning water nozzle 90 and the air nozzle 92 at Figure 4 the standby position shown.

[0086] After sucking and holding the wafer W using the rotary table 88, cleaning water is sprayed toward the wafer W to clean the wafer W. At this time, first, position the rotary table 88 at a specified lowered position using the lifting unit 97. Next, rotate the cleaning water nozzle 90 to position the ejection port 90a above the central portion of the wafer W. Then, while rotating the rotary table 88 in the Figure 4 direction of arrow R2 shown in at a specified rotational speed (for example, about 300 rpm to 500 rpm), spray cleaning water from the ejection port 90a of the cleaning water nozzle 90 to clean the wafer W.

[0087] During the cleaning process, the cleaning water (processing water) sprayed from the cleaning water nozzle 90 scatters to generate mist. Therefore, during the cleaning process, operate the pressure feeding unit 112 of the gas-liquid separation mechanism 12 to suck the mist from the suction port provided near the cleaning unit 84. The mist sucked from this suction port is ejected from the ejection port 106a through the pipe 106. In addition, during the cleaning process, the cleaning water (processing water) sprayed from the cleaning water nozzle 90 is caught by the second drain pan 98 and returned to the container 104 via the second drain pipe 100.

[0088] After cleaning the wafer W, spray dry air toward the wafer W to dry the wafer W. At this time, rotate the cleaning water nozzle 90 to the standby position ( Figure 4 the position shown). In addition, rotate the air nozzle 92 to position the ejection port 92a above the central portion of the wafer W. Then, while rotating the rotary table 88 in the Figure 4 direction of arrow R2 shown in at a specified rotational speed (for example, about 2000 rpm to 3000 rpm), spray dry air from the ejection port 92a of the air nozzle 92 to dry the wafer W.

[0089] After drying the wafer W, transfer the wafer W from the cleaning unit 84 to the temporary storage table 78 using the first transfer unit 82, and then transfer the wafer W from the temporary storage table 78 into the cassette 74 using the loading / unloading unit 80.

[0090] As described above, in the dicing apparatus 2 of the present embodiment, a cooling path 120 is formed in the spindle housing 42 of the processing unit 6, and the pipe 122 communicating with the cooling path 120 is immersed in the processing water stored in the container 104. Therefore, processing water is not used as the cooling medium for cooling the spindle housing 42, and the cooling path 120 of the spindle housing 42 is not contaminated by the used processing water. Therefore, it is possible to prevent the deterioration of the cooling efficiency of the spindle housing 42 over time.

Claims

1. A processing device, wherein: The processing device has: A chuck table that holds the workpiece; A processing unit having a processing tool for processing a workpiece held by the chuck table; a processing water supply unit for supplying processing water to an area where a processing object is processed by the processing tool; a processing chamber covering the area containing the chuck table and the processing unit; and Gas-liquid separation mechanism, The gas-liquid separation mechanism comprises: a container storing used process water and having a degassing unit; and a pipe connected to the container to attract the mist filling the processing chamber, A cooling path is formed in the processing unit, and a pipe communicating with the cooling path is immersed in the processing water stored in the container.

2. The processing device according to claim 1, wherein: The spout of the pipe is immersed in the process water stored in the container.

3. The processing device according to claim 2, wherein: A filter for generating fine bubbles is provided at the ejection port.

4. The processing device according to claim 1, wherein: The processing device has: a drain pan disposed in the processing chamber to collect used process water; and a drain pipe, which is arranged on the drain pan and drains water to the container, The drain pipe is in communication with the container.

5. The processing device according to claim 1, wherein: The processing device includes a processed water purification unit for purifying the processed water stored in the container, and circulates the purified processed water to the processed water supply unit.

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