Die set for producing and processing automobile electronic products

Abstract

The invention relates to the technical field of mold frames, in particular to a mold frame for producing and processing automobile electronic products, which comprises a bottom plate, a stack of square blocks arranged in parallel at the top end of the bottom plate, an ejector plate arranged between the opposite surfaces of the square blocks, a plate B, a plate A and a panel sequentially arranged at the end, far away from the bottom plate, of the ejector plate, and a plurality of ejector pins and ejector sleeves arranged at the end, far away from the bottom plate, of the ejector plate. At least one guide column is arranged at the end, close to the plate B, of the plate A, guide sleeves matched with the guide columns are arranged on the plate B, the guide sleeves are filled with high-damping lubricating grease, a sprue communicated with the upper portion and the lower portion is arranged in the middle of the panel, and a positioning ring is arranged at the top end of the sprue; through the buffer spring, the memory alloy damping layer and the self-lubricating ball structure of the guide pillar and the guide sleeve, impact absorption, thermal deformation compensation and low-friction guide are realized in the stages of mold closing, injection and ejection, and vibration is reduced, so that high-precision molding is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of die sets, and particularly to a die set for the production and processing of automotive electronic products. Background Art

[0002] A die set refers to a basic structural component used to support and fix forming parts such as die cavities and cores of a mold, and to provide support and guidance for the mold opening and closing actions, ejection mechanisms, etc. A die set usually includes a fixed die part, a moving die part, a guiding mechanism, an ejection mechanism, and a cooling system. Special products also require a heating system. Automotive electronic products refer to vehicle body automotive electronic control devices and in-vehicle automotive electronic control devices. The outer shells of automotive electronic products need to be injection-molded using a die set with a corresponding shape to form various-shaped outer shells. As the usage time increases and the number of production batches increases, the dimensional accuracy of the die set gradually decreases. At the same time, unstable phenomena such as vibration and shaking occur during the operation of the die set, which will not only affect the quality of the product but also reduce the service life of the die set. Summary of the Invention

[0003] An object of the present invention is to provide a die set for the production and processing of automotive electronic products, which realizes shock absorption, thermal deformation compensation, and low-friction guidance during the mold closing, injection, and ejection stages through a buffer spring, a shape memory alloy damping layer, and a self-lubricating ball structure of a guide pillar and a guide bush, reduces vibration, and thus ensures high-precision molding, so as to solve the problems raised in the above background art.

[0004] To achieve the above object, a die set for the production and processing of automotive electronic products is provided, including a bottom plate. A stack of parallel blocks is provided at the top of the bottom plate. An ejector plate is provided between the opposite faces of the blocks. A B plate, an A plate, and a face plate are successively provided at the end of the ejector plate away from the bottom plate. A plurality of ejector pins and ejector sleeves are provided at the end of the ejector plate away from the bottom plate. The B plate is slidably engaged with the ejector pins. At least one guide pillar is provided at the end of the A plate close to the B plate. A guide bush for cooperating with the guide pillar is provided on the B plate. The guide bush is filled with a high-damping grease. A nozzle communicating up and down is provided in the middle of the face plate. A locating ring is provided at the top of the nozzle.

[0005] Further, the guide pillar includes a guide pillar body. A buffer baffle is provided at one end of the guide pillar body. A buffer spring is sleeved outside the guide pillar body. One end of the buffer spring is fixedly connected to the buffer baffle. An annular shock-absorbing ring is provided on the outside of the guide pillar body away from the buffer baffle side.

[0006] Further, the guide bush includes a guide bush body. A ball sleeve coaxial with the guide bush body is provided on the inner side surface of the guide bush body. The ball sleeve is slidably engaged with the guide bush body. A plurality of ball holes communicating inside and outside and distributed circumferentially are provided on the outer side surface of the ball sleeve. A ball is provided in each ball hole. The ball sleeve is coaxial with the guide pillar body. The diameter of the guide pillar body is smaller than the inner diameter of the ball sleeve.

[0007] Furthermore, the guide bushing body includes an outer sleeve, with an annular boss provided at one end of the outer sleeve, and a plurality of equally spaced limiting grooves arranged axially on the inner side wall surface of the outer sleeve.

[0008] Furthermore, the guide bushing body further includes a damping layer provided on the inner side wall surface of the outer sleeve. The damping layer includes end caps provided at both ends along the axis. Between the opposite surfaces of the end caps, there are metal spring damping sheets. An annular shock-absorbing strip that cooperates with the limiting grooves is provided on the outer side surface of the metal spring damping sheets, and an arc-shaped deformation groove is formed on the inner side surface of the metal spring damping sheets.

[0009] Furthermore, the guide bushing body further includes an inner sleeve, which is provided on the inner side wall surface of the damping layer. A top ring that cooperates with the deformation groove is provided on the outer side surface of the inner outer sleeve.

[0010] Furthermore, a damping cavity coaxial with the guide post body is provided inside the guide post, damping particles are filled in the damping cavity, and a plurality of annular shock-absorbing rings are arranged axially on the outer side surface of the guide post body.

[0011] Furthermore, a sealing sleeve is provided at one end of the inner sleeve. The sealing sleeve is integrally connected to the inner sleeve, and a sealing ring is provided at the end of the sealing sleeve away from the guide post.

[0012] Furthermore, the guide bushing further includes a micro hydraulic damper, which is provided on the outer side or bottom end of the outer sleeve, and the cavity surrounded by the micro hydraulic damper communicates with the inner sleeve.

[0013] Furthermore, at least one lubricating oil hole that communicates inside and outside and is circumferentially distributed is formed on the inner side wall surface of the inner sleeve near the annular boss side. Each metal spring damping sheet is provided with a communication hole that communicates inside and outside and cooperates with the lubricating oil hole, and high damping lubricating oil is filled between the outer sleeve and the inner sleeve.

[0014] The present invention has the following beneficial effects for the prior art: 1. Through the synergistic effect of the multi-stage buffer structure (buffer spring + memory alloy damping sheet + annular shock-absorbing ring) of the guide post and guide bushing and the high damping grease in the present invention, the mold closing impact energy is absorbed step by step, realizing high-precision centering of the mold and significantly improving the dimensional stability of the molded product.

[0015] 2. Through the cooperation of the modular damping layer design and the self-lubricating alloy sleeve in the present invention, the mold can still maintain a stable contact pressure when the temperature fluctuates violently, realizing the automatic compensation function of the thermal expansion amount and significantly enhancing the operation reliability under complex working conditions.

[0016] 3. Through the structural optimization of the three-point positioning of the ball sleeve and the replaceable damping components in the present invention, the accuracy of the ejection guiding path is controllable and the maintenance is convenient, realizing the long-life cyclic use function of key components and significantly reducing the comprehensive operation and maintenance cost of the mold.

[0017] 4. The present invention strengthens the dynamic stability of the mold by significantly reducing the influence of high-frequency impact on the forming accuracy through the following means: setting a damping cavity and a silicon carbide particle filling structure inside the guide pillar, and combining a micro hydraulic damper with a high-damping alloy guide pillar, so that the vibration energy during high-speed stamping is dissipated in multiple stages. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the southeast axonometric view of the mold base of the present invention; Figure 2 is the southwest axonometric view of the mold base of the present invention; Figure 3 is the axonometric view of the guide pillar and guide sleeve of the present invention; Figure 4 is of the present invention Figure 3 schematic view of A-A; Figure 5 is the sectional view of the guide sleeve of the present invention; Figure 6 is the exploded view of the guide sleeve of the present invention; Figure 7 is of the present invention Figure 6 schematic view of B-B; Figure 8 is the sectional view of the outer layer of the guide sleeve of the present invention; Figure 9 is the sectional view of the middle layer of the guide sleeve of the present invention; Figure 10 is of the present invention Figure 9 schematic view of the partial enlargement at A; Figure 11 is the sectional view of the inner layer of the guide sleeve of the present invention; Figure 12 is the axonometric view of the guide pillar and guide sleeve of another embodiment of the present invention; Figure 13 is of the present invention Figure 12 schematic view of C-C; Figure 14 is the sectional view of the guide sleeve of the present invention; Figure 15 is of the present invention Figure 14 schematic view of the partial enlargement at B; Figure 16 Partial schematic view of the guide sleeve of another embodiment.

[0019] In the figure: 1. positioning ring; 2. nozzle; 3. panel; 4. A plate; 5. guide pillar; 501. guide pillar body; 502. buffer spring; 503. annular shock-absorbing ring; 504. damping cavity; 505. damping particles; 6. B plate; 7. guide sleeve; 701. outer sleeve; 702. ball sleeve; 703. ball; 704. inner sleeve; 705. cap; 706. limit groove; 708. annular shock-absorbing strip; 707. annular boss; 709. deformation groove; 710. top ring; 711. metal spring damping sheet; 712. micro hydraulic damper; 713. sealing sleeve; 714. sealing ring; 715. lubricating oil hole; 8. ejector pin; 9. ejector pin plate; 10. square block; 11. bottom plate; 12. thimble tube. Detailed implementation mode

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0021] In one implementation mode, as Figures 1 - 3 shown, a mold base for the production and processing of automotive electronic products includes a bottom plate 11. A stack of parallel square blocks 10 are provided at the top of the bottom plate 11. An ejector pin plate 9 is provided between the opposite faces of the square blocks 10. A B plate 6, an A plate 4, and a panel 3 are successively provided at the end of the ejector pin plate 9 away from the bottom plate 11. It is characterized in that: a plurality of ejector pins 8 and thimble tubes 12 are provided at the end of the ejector pin plate 9 away from the bottom plate 11. The B plate 6 is slidably matched with the ejector pins 8. At least one guide pillar 5 is provided at the end of the A plate 4 close to the B plate 6. A guide sleeve 7 matched with the guide pillar 5 is provided on the B plate 6. The guide sleeve 7 is filled with high-damping grease. A nozzle 2 communicating up and down is provided in the middle of the panel 3. A positioning ring 1 is provided at the top of the nozzle 2.

[0022] As Figure 3 shown, the guide pillar 5 includes a guide pillar body 501. A buffer baffle is provided at one end of the guide pillar body 501. A buffer spring 502 is sleeved outside the guide pillar body 501. One end of the buffer spring 502 is fixedly connected to the buffer baffle. An annular shock-absorbing ring 503 is provided on the outside of the guide pillar body 501 away from the buffer baffle side.

[0023] As Figures 3 - 4 shown, the guide sleeve 7 includes a guide sleeve body. A ball sleeve 702 coaxial with the guide sleeve body is provided on the inner side surface of the guide sleeve body. The ball sleeve 702 is slidably matched with the guide sleeve body. A plurality of ball holes communicating inside and outside and distributed circumferentially are provided on the outer side surface of the ball sleeve 702. A ball 703 is provided in each ball hole. The ball sleeve 702 is coaxial with the guide pillar body 501. The diameter of the guide pillar body 501 is smaller than the inner diameter of the ball sleeve 702.

[0024] AsFigures 5 - 11 As shown, the guide sleeve body includes an outer sleeve 701. A ring-shaped boss 707 is provided at one end of the outer sleeve 701. A plurality of equally spaced limiting grooves 706 are arranged axially on the inner wall surface of the outer sleeve 701. It further includes a damping layer provided on the inner wall surface of the outer sleeve 701. The damping layer includes cap covers 705 provided at both ends along the axis. A metal spring damping sheet 711 is provided between the opposite surfaces of the cap covers 705. An annular shock-absorbing strip 708 that cooperates with the limiting groove 706 is provided on the outer side surface of the metal spring damping sheet 711. An arc-shaped deformation groove 709 is formed on the inner side surface of the metal spring damping sheet 711.

[0025] The guide sleeve body further includes an inner sleeve 704. The inner sleeve 704 is provided on the inner wall surface of the damping layer. A top ring 710 that cooperates with the deformation groove 709 is provided on the outer side surface of the inner outer cylinder 704.

[0026] In this embodiment, as Figures 1 - 11 shown, the outer sleeve 701 of the guide sleeve body is made of high-strength die steel (such as Cr12MoV, quenched), providing the support stiffness of the guide sleeve body to ensure the guiding accuracy; the annular shock-absorbing strip 708 of the damping layer is made of high-damping nitrile rubber or silicone rubber (hardness Shore A 60 - 80) or woven with a wire mesh, and then bonded to the outer sleeve 701 through a vulcanization process, or a detachable modular design (for easy replacement) is adopted. The metal spring damping sheet 711 of the damping layer is made of shape memory alloy. 3 - 6 metal spring damping sheets 711 are evenly distributed circumferentially, and the pre-compression amount is 0.1 - 0.3 mm; the inner sleeve 704 is made of self-lubricating alloy to reduce the friction coefficient, and then a high-damping lubricating grease is filled between the inner sleeve 704 and the guide post body 501.

[0027] When working under different working conditions: First, the mold closing stage (high-pressure locking working condition) When the injection molding machine starts to close the mold, the panel 3 and the A plate 4 move towards the B plate 6 under the drive of mechanical power. At this time, the guide post 5 on the A plate 4 gradually inserts into the guide sleeve 7 of the B plate 6. The outer sleeve 701 of the guide sleeve 7 provides rigid support to ensure that the axial alignment error between the guide post 5 and the guide sleeve 7 is less than 0.02 mm. The buffer baffle at the end of the guide post 5 absorbs the initial contact impact force through the buffer spring 502. The spring pre-pressure is set to: such as 500 - 800 N, which can offset about 30% of the instantaneous impact energy; As the clamping force increases to the set value (e.g., 1500 kN), the damping layer inside the guide bushing 7 starts to take effect: the shape memory alloy property of the metal spring damping piece 711 causes it to deform by 0.15 mm under pressure. The axial pressure is converted into radial expansion through the arc-shaped deformation groove 709, making the nitrile rubber of the annular shock-absorbing strip 708 generate viscoelastic friction with the outer sleeve 701, additionally consuming 15% - 20% of the impact energy. At the same time, the self-lubricating alloy surface of the inner sleeve 704 (friction coefficient μ < 0.08) and the high-damping grease between the guide pillar body 501 form a double anti-friction layer, making the mold-closing process stable without tremors. At this stage, the balls 703 inside the guide bushing 7 are in a free state, and there is a 0.5 mm gap between the ball sleeve 702 and the guide pillar body 501 to avoid rigid contact.

[0028] Then, the finite element analysis method is used to simulate this working condition: Model settings Geometric model: The guide pillar 5 and the guide bushing 7 adopt solid elements (SOLID186), and the contact surface is defined as surface-to-surface contact (CONTA174 / TARGE170); Material parameters: Guide pillar body 501 (Cr12MoV): Elastic modulus E = 210 GPa, Poisson's ratio ν = 0.3, yield strength σy = 1800 MPa; Buffer spring 502 (60Si2MnA): Stiffness coefficient K = 120 N / mm, pre-pressure Fpre = 600 N; Boundary conditions: The bottom plate 11 is fixed and constrained, and a clamping force of 1500 kN is applied to the end face of the panel 3.

[0029] Simulation results: Stress distribution: The maximum equivalent stress σmax = 1350 MPa at the root of the guide pillar 5 (safety factor n = 1.33), concentrated in the transition zone between the buffer baffle and the guide pillar body 501 ( Figure 1 )

[0030] Energy dissipation: The damping layer (nitrile rubber) absorbs energy Edamp = 82 J through viscoelastic deformation, accounting for 18% of the total impact energy.

[0031] Displacement control: The offset of the axis of the guide pillar 5 is δ = 0.018 mm, meeting the design requirement δallow < 0.02 mm).

[0032] II. Melt injection and holding pressure working conditions: After the molten plastic is positioned by the locating ring 1, it is injected into the mold cavity through the nozzle 2 at a pressure of 120 - 200 MPa. At this time, the mold bears an asymmetric lateral force, and there may be a tilting trend of ≤0.1° between the A plate 4 and the B plate 6. The annular shock-absorbing ring 503 of the guide pillar 5 and the limit groove 706 of the guide sleeve 7 form a multi-stage constraint: when the A plate 4 undergoes a slight offset, the inner sleeve 704 exerts a radial pressure on the metal spring damping piece 711 through the top ring 710, causing the annular shock-absorbing strip 708 incorporated with the wire mesh to undergo compressive deformation, and it can absorb a maximum displacement deviation of 2.5 mm.

[0033] The ball sleeve 702 enters the working state at this stage: when the injection pressure causes the template to deform, the clearance between the guide pillar 5 and the ball sleeve 702 decreases, and the balls 703 generate a self-rotating motion in the ball holes, converting sliding friction into rolling friction, reducing the template offset resistance by more than 40%. Then, the metal spring damping piece 711 of the guide sleeve 7 adjusts the contact pressure in real time through the shape memory effect to ensure a stable contact stress of 0.12 - 0.18 N / mm² under a temperature fluctuation of 80 - 180 °C, preventing the jamming phenomenon caused by thermal expansion.

[0034] Then, the thermal-mechanical coupling of this working condition is simulated by the finite element analysis method: Multi-physics field model Thermal boundary: The injection melt temperature Tmelt = 220 °C, and the initial mold temperature T0 = 80 °C.

[0035] Asymmetric load: The lateral force Fside = 12 kN, applied to the side wall of the A plate 4 to simulate the melt flow imbalance effect.

[0036] Simulation results Thermal deformation: The temperature difference ΔT between the guide pillar 5 and the guide sleeve 7 is 40 °C, resulting in a thermal expansion amount ΔL = α·L·ΔT = 0.024 mm (α = 12×10−6 / °C, L = 500 mm).

[0037] Rolling friction effect: The contact pressure p of the balls 703 is 45 MPa, and the rolling friction coefficient μroll = 0.005, which is 93% lower than the sliding friction (μslide = 0.08).

[0038] Damping layer response: The metal spring damping piece 711 generates a radial displacement of 0.12 mm under the thermal load, and the contact stress σcontact = 0.15 N / mm2.

[0039] After the holding pressure ends, it enters the cooling stage (with a duration of 20 - 120 seconds). The shrinkage of the plastic part will generate an axial tensile force on the ejector sleeve 12. At this time, the ejector plate 9 applies a continuous ejection force (about 5 - 20 kN) to the product through the ejector pin 8. The sliding mating surface between the B - plate 6 and the ejector pin 8 is chromium - plated (with a thickness of 0.015 mm), and the mating clearance is controlled within 0.005 - 0.01 mm. The buffer spring 502 of the guide pillar 5 provides a reverse supporting force at this time. When the stiffness coefficient of the guide pillar 5 is K = 120 N / mm, it can offset 30% of the shrinkage stress; Then the damping layer of the guide bushing 7 plays a thermal compensation role in this stage: that is, when the mold temperature drops from 180 °C during injection to the mold - opening temperature of 80 °C, the memory alloy phase - change temperature point (set at 90 °C) of the metal spring damping piece 711 is triggered, and its pre - compression amount automatically adjusts from 0.2 mm to 0.25 mm, compensating for the 0.03 mm shrinkage of the guide pillar caused by the temperature difference. At the same time, the high - damping grease maintains a stable viscosity during temperature change (the kinematic viscosity is 2000 cSt at 40 °C and still > 800 cSt at 100 °C), ensuring smooth sliding between the ejector pin 8 and the B - plate 6.

[0040] Then, the finite - element analysis method is used to simulate this working condition: Shrinkage - force model: The shrinkage rate of the plastic part ε = 0.6%, and the ejection force Feject = 15 kN.

[0041] Contact non - linearity: The sliding surface between the ejector pin 8 and the B - plate 6 is defined with Coulomb friction (μ = 0.05).

[0042] Simulation data: Ejector - pin stress: The maximum stress σmax at the root of the ejector pin 8 is 320 MPa (the material is SKD61, σy = 1600 MPa, and the safety factor n = 5).

[0043] Support stiffness of the guide pillar: The compression amount Δx of the buffer spring 502 is 6.5 mm, and the stored elastic potential energy .

[0044] Grease performance: The shear stress τ of the high - damping grease at 100 degrees Celsius is 120 Pa, and the flow velocity v is 0.8 mm / s.

[0045] IV. Mold - opening and ejection working conditions When the mold is opened, the injection molding machine pulls the panel 3 away from the A plate 4. At this time, the guide pillar 5 withdraws from the guide sleeve 7. Then, at the moment of separation, the ball sleeve 702 of the guide sleeve 7 forms a three-point positioning system through the balls 703: that is, the φ3mm tungsten carbide balls in each ball hole are circumferentially distributed at 120°. The withdrawal path accuracy of the guide pillar 5 is controlled within ±0.015mm within 0.2 seconds. At the same time, when the annular shock-absorbing ring 503 collides with the annular boss 707 at the end of the guide sleeve 7, the annular shock-absorbing ring 503 with a porous silicone rubber structure can absorb more than 70% of the impact noise (noise reduction amount > 15dB).

[0046] The ejector plate 9 is ejected at a speed of 50 - 150mm / s under the drive of the hydraulic system. The thimble 12 acts on the deep cavity structure at the same time. The buffer spring 502 of the guide pillar 5 is compressed to the limit stroke (maximum compression amount 8mm) at this stage. The stored elastic potential energy (about 150J) can reduce the peak power consumption of the ejection mechanism by 40%. A lubricating film with a thickness of 0.005mm is formed between the self-lubricating surface of the inner sleeve 704 of the guide sleeve 7 and the guide pillar body 501, so that the friction temperature rise during the ejection process is controlled within ΔT < 5℃.

[0047] Then, the finite element analysis method is used to simulate this working condition: Transient dynamics model Time step: Δt = 1×10−5s, total duration t = 0.2s.

[0048] Load conditions: ejection acceleration a = 750mm / s2, maximum speed vmax = 150mm / s.

[0049] Result comparison Impact energy: The maximum compression strain ε of the annular shock-absorbing ring 503 is 35%, the absorbed energy E = 105J, and the noise reduction amount ΔLnoise = 17dB(A).

[0050] Fatigue life: The stress amplitude Δσ at the root of the guide pillar 5 is 250MPa, and the predicted life Nf based on the Miner criterion is 1.2×106 cycles.

[0051] V. Reset and standby working conditions After the ejection is completed, the ejector plate 9 returns to the initial position under the action of the reset rod. At this time, the guide pillar 5 and the guide sleeve 7 are in a non-mating state. The ball sleeve 702 retracts to the original position under the action of the reset spring (not marked in the figure), restoring a guiding clearance of 1.2mm. The metal spring damper 711 restores the initial pre-compression amount in the unloaded state. The phase transformation hysteresis characteristic of the shape memory alloy (such as Ni-Ti alloy) of the metal spring damper 711 can ensure that it still maintains an elastic modulus of > 90% after 20,000 cycles.

[0052] When in the standby stage (>30 minutes), the cap 705 of the guide bushing 7 forms a closed cavity to prevent external dust from intrusion. The thixotropy of the high-damping grease increases its viscosity to 5000 cSt when at rest, forming a semi-solid sealing layer. At this time, the nitrile rubber of the annular shock-absorbing strip 708 undergoes stress relaxation recovery in the stress-free state, and its compression permanent deformation is still <8% after 1000 hours of testing, meeting the requirements of ISO815 standard.

[0053] VI. Abnormal overload condition When the mold encounters abnormal impact (such as the clamping force suddenly increasing to 2500 kN due to foreign object jamming), the buffer mechanisms of the guide pillar 5 and the guide bushing 7 buffer through a multi-stage buffer mechanism: Primary buffer: The buffer spring 502 is compressed to the limit stroke (8 mm), absorbing 600 J of impact energy Secondary energy dissipation: The metal spring damping piece 711 undergoes plastic deformation (maximum allowable 0.5 mm), and 300 J of energy is consumed through the expansion of the arc-shaped deformation groove 709 Final buffer: After the annular shock-absorbing ring 503 contacts the annular boss 707, the annular shock-absorbing ring 503 adopts a 60-degree inclined plane to deflect the impact force direction by 15 degrees, thus avoiding structural fracture. This multi-stage buffer mechanism can reduce the peak value of the overload stress by 65%. Combined with the tensile strength of the Cr12MoV steel of the outer sleeve 701 (≥1800 MPa), it ensures that the mold does not suffer permanent damage under 150% of the rated load.

[0054] VII. Simulating the long-term operation wear condition through finite element analysis: After 500,000 cycles, the guide pillar 5 and the guide bushing 7 enter the stable wear period: the wear amount of the nitrided layer (thickness 0.1 mm) on the surface of the guide pillar body 501 is ≤0.003 mm; the diameter change of the ball 703 is <0.001 mm, and the clearance is compensated by the spring pre-tightening mechanism (elastic force 0.5 N / ball) in the ball hole; the wear rate of the self-lubricating alloy layer is stable at 0.0001 mm / 10,000 cycles; the supplementary injection amount of the high-damping grease is 3 - 5 ml per 100,000 cycles; at this time, the metal spring damping piece 711 has a small amount of residual deformation (cumulative 0.02 mm) due to cyclic loading, which can be compensated by replacing the pre-pressed gasket. Finally, since the guide bushing 7 adopts a modular design and allows the damping layer assembly to be replaced separately, the maintenance time can be controlled within 2 hours.

[0055] Archard wear model Wear coefficient, sliding distance s = 50 mm / cycle.

[0056] Cumulative wear amount Wear depth of the guide pillar surface: h = k·p·s·N = 0.0032 mm (N = 5×105 cycles, contact pressure p = 50 MPa); Diameter wear of the ball 703 is Δd = 0.0008 mm, and the effective clearance δeff = 0.002 mm after compensation by spring preloading.

[0057] In another embodiment, as Figures 12 - 15 shown, a damping cavity 504 coaxial with the guide pillar body 501 is provided in the guide pillar 5. Damping particles 505 are filled in the damping cavity 504, and a plurality of annular shock-absorbing rings are provided axially on the outer side surface of the guide pillar body 501.

[0058] One end of the inner sleeve 704 is provided with a sealing sleeve 713. The sealing sleeve 713 is integrally connected with the inner sleeve 704, and a sealing ring 714 is provided at the end of the sealing sleeve 713 away from the guide pillar 5.

[0059] The guide sleeve 7 further includes a micro hydraulic damper 712. The micro hydraulic damper 712 is provided on the outer side or bottom end of the outer sleeve 701, and the cavity surrounded by the micro hydraulic damper 712 communicates with the inner sleeve 704.

[0060] In the process of this embodiment, the guide pillar 5 and the guide sleeve 7 are sealed by a lip-shaped sealing ring 713. The guide pillar 5 includes at least one guide rod body 501. Preferably, the number of guide rod bodies 501 is 4 and they are symmetrically arranged (diagonal tolerance is less than or equal to 0.005 mm). Then the diameter of the guide rod body 501 is greater than or equal to one-tenth of the die set closing height, so as to ensure uniform force during stamping, reduce eccentric cutting vibration. Then one end of the buffer spring 502 contacts the cap 705, and the micro hydraulic damper 712 (model is SL101, size is 7.8X30 mm); The damping particles 505 are made of silicon carbide powder (particle size 0.2 - 0.5 mm, filling rate ≥ 85%). The guide pillar body 501 is made of a high damping alloy, such as CuMn14Al, with a damping ratio of 0.02 - 0.03. Molybdenum disulfide is added to the high damping grease, and an active shock absorber is installed at the buffer baffle; In normal stamping working conditions, the guide pillar 5 and the guide sleeve 7 of the die set ensure smooth movement through the synergistic action of high damping grease and internal shock-absorbing structures.

[0061] When the panel 3 is driven by external pressure to close downward, the A plate 4 pushes the B plate 6 and the ejector plate 9 to move towards the bottom plate 11 through the guide pillar 5. The guide pillar body 501 of the guide pillar 5 first contacts the inner sleeve 704 of the guide sleeve 7. At this time, the damping particles 505 (silicon carbide powder with a particle size of 0.2 - 0.5 mm and a filling rate ≥ 85%) inside the guide pillar 5 generate micro-displacements in the damping cavity 504 due to the axial movement of the guide pillar body 501. The frictional collisions between the particles convert kinetic energy into heat energy, effectively consuming vibration energy. At the same time, the micro hydraulic damper 712 of the guide sleeve 7 provides dynamic damping force by utilizing the viscous resistance of the hydraulic oil in the slit through the cavity surrounded by the inner sleeve 704, further suppressing the vibration amplitude of the guide pillar 5.

[0062] During high-speed stamping, the closing speed of the die set is significantly increased, and the dynamic load between the guide pillar 5 and the guide sleeve 7 increases. At this time, the guide pillar body 501 of the guide pillar 5 generates high-frequency vibrations inside the guide sleeve 7 due to high-speed movement. The metal spring damping piece 711 of the guide sleeve 7 quickly responds to the vibration frequency due to the elastic deformation of the deformation groove 709, and limits the amplitude through the cooperation of the annular shock-absorbing strip 708 and the limit groove 706. The damping particles 505 form an eddy current effect in the damping cavity 504 due to the rapid reciprocating movement of the guide pillar body 501, the collision frequency between the particles increases, and the energy dissipation efficiency is improved, effectively suppressing high-frequency vibrations; then the micro hydraulic damper 712 provides a non-linear damping force during the high-speed stroke of the guide pillar 5 through the high-pressure flow characteristics of the hydraulic oil. The throttle holes (the size is determined by the model SL101) designed inside it regulate the oil flow rate to avoid rigid impacts caused by sudden speed changes. In addition, the sealing sleeve 713 and the sealing ring 714 of the guide sleeve 7 ensure the sealing performance of the high-damping grease (containing molybdenum disulfide) through the lip-shaped sealing ring, reducing the influence of grease leakage on the damping performance.

[0063] When the die set withstands heavy-load stamping, the guide pillar body 501 of the guide pillar 5 needs to bear a greater axial pressure. At this time, the high-damping alloy material (CuMn14Al) of the guide pillar 5 absorbs part of the vibration energy through its own damping ratio (0.02 - 0.03), reducing the risk of material fatigue. The inner sleeve 704 of the guide sleeve 7 meshes with the deformation groove 709 of the metal spring damping piece 711 through the top ring 710, enhancing the structural rigidity and preventing the sleeve from deforming due to excessive load. The characteristic that the filling rate of the damping particles 505 ≥ 85% under high pressure ensures close contact between the particles, forming a stable friction interface and avoiding vibration amplification caused by particle gaps. The micro hydraulic damper 712 adjusts the internal oil pressure to balance the impact force under heavy load, and the compressibility of its hydraulic oil in the high-pressure cavity further buffers the transient load. Then, the buffer spring 502 is compressed to the limit position under heavy load, and the elastic deformation of the spring and the damping force of the hydraulic damper work together to ensure that the displacement of the guide pillar 5 is controlled within the allowable range.

[0064] During the continuous stamping process, heat accumulates in the die set due to long-term operation. The temperature rise of the guide pillar 5 and the guide bushing 7 may affect the damping performance. At this time, the damping particles 505 (silicon carbide powder) of the guide pillar 5 accelerate the heat conduction from the damping cavity 504 to the outside by virtue of their high thermal conductivity (about 120 W / m·K), avoiding the failure of the grease caused by local overheating. The metal spring damping piece 711 of the guide bushing 7 releases stress through the periodic deformation of the deformation groove 709, reducing the risk of material creep. The hydraulic oil of the micro hydraulic damper 712 reduces the oil temperature through a circulating heat dissipation design (installing heat dissipation fins on the outside), maintaining the stability of the viscosity. Molybdenum disulfide added to the high-damping grease can still maintain lubricating performance at high temperatures, reducing the sliding friction coefficient between the guide pillar 5 and the guide bushing 7 (which can be reduced to less than 0.05). In addition, since the sealing sleeve 713 of the guide bushing 7 is made of high-temperature resistant material (such as fluororubber) to ensure sealing, the high-temperature volatilization of the grease is prevented.

[0065] When the equipment stops suddenly due to a fault, the inertial impact of the die set may cause abnormal vibration between the guide pillar 5 and the guide bushing 7. At this time, the buffer spring 502 of the guide pillar 5 offsets the reverse impact force by quickly rebounding, preventing the rigid collision between the guide pillar body 501 and the guide bushing 7. The damping particles 505 concentrate on impacting the end of the damping cavity 504 due to inertia at the moment of sudden stop, and the remaining energy is absorbed by the buffer layer formed by particle accumulation. The micro hydraulic damper 712 controls the oil return speed through a one-way valve, extending the impact response time and reducing the peak load. The annular shock-absorbing ring 503 of the guide bushing 7 gradually attenuates the vibration wave through a multi-stage annular structure, avoiding the stress concentration from being transmitted to the A plate 4 and the panel 3. At the same time, the active shock absorber (installed at the buffer baffle) monitors the vibration amplitude in real time through a sensor and applies a reverse force to further suppress the residual vibration.

[0066] As Figure 16 shown, at least one lubricating oil hole 715 communicating inside and outside and distributed circumferentially is provided on the inner side wall surface of the inner sleeve 704. Each metal spring damping piece 711 is provided with a communication hole communicating inside and outside and cooperating with the lubricating oil hole 715. High-damping lubricating oil is filled between the outer sleeve 701 and the inner sleeve 704.

[0067] In this embodiment, the lubricating oil holes 715 are respectively arranged on the side close to the annular boss 707 and the side far from the annular boss 707. During the normal mold closing and mold opening processes of the mold base, the panel 3 moves downward under the action of an external driving mechanism, driving the A plate 4 and the B plate 6 to move towards the bottom plate 11. The guide pillar 5 starts to be inserted from the inlet end (the annular boss 707 side) of the guide sleeve 7. The guide pillar body 501 of the guide pillar 5 first contacts the inner sleeve 704 of the guide sleeve. Then, since the lubricating oil holes 715 connect the cavity surrounded by the inner sleeve 704 with the cavity between the outer sleeve 701 and the inner sleeve 704, and its function is equivalent to that of a hydraulic damper. When the guide pillar 5 is inserted into the guide sleeve 7, the high-damping lubricating oil between the outer sleeve 701 and the inner sleeve 704 forms a flow path through the communication holes 715 and the communication holes of the metal spring damping sheet 711. The viscous shear action of the lubricating oil in the narrow channel converts mechanical energy into heat energy, forming a hydraulic damping effect. In addition, the silicon carbide damping particles 505 filled inside the guide pillar body 501 of the guide pillar 5 rub against each other during vibration, further consuming energy.

[0068] The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes should be covered within the protection scope of the present invention.

Claims

1. A mold base for the production and processing of automotive electronic products, comprising a bottom plate. A stack of parallel blocks are provided at the top end of the bottom plate. A thimble plate is provided between the opposite faces of the blocks. A B plate, an A plate, and a face plate are successively provided at the end of the thimble plate away from the bottom plate. It is characterized in that: A plurality of ejector pins and ejector sleeves are provided at the end of the ejector plate away from the bottom plate. The B plate is slidably engaged with the ejector pins. At least one guide post is provided at the end of the A plate close to the B plate. A guide bush mating with the guide post is provided on the B plate. The guide bush is filled with high-damping grease. A nozzle communicating the upper and lower parts is provided in the middle of the face plate. A positioning ring is provided at the top end of the nozzle.

2. The mold base for the production and processing of automotive electronic products according to claim 1, wherein: The guide post includes a guide post body. A buffer baffle is provided at one end of the guide post body. A buffer spring is sleeved outside the guide post body. One end of the buffer spring is fixedly connected to the buffer baffle. An annular shock absorber is provided on the outer side of the guide post body away from the buffer baffle side.

3. The mold base for the production and processing of automotive electronic products according to claim 2, characterized in that: The guide bush includes a guide bush body. A ball sleeve coaxial with the guide bush body is provided on the inner side surface of the guide bush body. The ball sleeve is slidably engaged with the guide bush body. A plurality of ball holes communicating the inside and outside and distributed circumferentially are provided on the outer side surface of the ball sleeve. A ball is provided in each ball hole. The ball sleeve is coaxial with the guide post body. The diameter of the guide post body is smaller than the inner diameter of the ball sleeve.

4. The die carrier for the production and processing of automotive electronic products according to claim 3, wherein: The guide bush body includes an outer sleeve. A ring-shaped boss is provided at one end of the outer sleeve. A plurality of equally spaced limit grooves are provided on the inner side wall surface of the outer sleeve along the axial direction.

5. The die carrier for the production and processing of automotive electronic products according to claim 4, characterized in that: The guide bush body further includes a damping layer provided on the inner side wall surface of the outer sleeve. The damping layer includes cap covers provided at both ends along the axis. A metal spring damper is provided between the opposite surfaces of the cap covers. An annular shock absorber strip mating with the limit groove is provided on the outer side surface of the metal spring damper. An arc-shaped deformation groove is provided on the inner side surface of the metal spring damper.

6. The mold base for the production and processing of automotive electronic products according to claim 5, characterized in that: The guide bush body further includes an inner sleeve provided on the inner side wall surface of the damping layer. A top ring mating with the deformation groove is provided on the outer side surface of the inner outer sleeve.

7. The die carrier for the production and processing of automotive electronic products according to claim 2, wherein: A damping cavity coaxial with the guide post body is provided in the guide post. Damping particles are filled in the damping cavity. A plurality of annular shock absorbers are provided on the outer side surface of the guide post body along the axial direction.

8. The mold base for the production and processing of automotive electronic products according to claim 6, characterized in that: A sealing sleeve is provided at one end of the inner sleeve. The sealing sleeve is integrally connected with the inner sleeve. A sealing ring is provided at the end of the sealing sleeve away from the guide post.

9. The die carrier for the production and processing of automotive electronic products according to claim 8, characterized in that: The guide bush further includes a micro hydraulic damper provided on the outer side or bottom end of the outer sleeve. The micro hydraulic damper communicates with the cavity surrounded by the inner sleeve.

10. The die carrier for the production and processing of automotive electronic products according to claim 6, wherein: At least one lubricating oil hole communicating the inside and outside and distributed circumferentially is provided on the inner side wall surface of the inner sleeve. Each metal spring damper is provided with a communication hole communicating the inside and outside and mating with the lubricating oil hole. High-damping lubricating oil is filled between the outer sleeve and the inner sleeve.

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