Air exhaust structure and substrate processing device

Abstract

The invention provides an air exhaust structure and a substrate processing apparatus including the same. The air exhaust structure includes a top member, a bottom member, and a separator. The bottom part is arranged opposite to the top part and is provided with an air exhaust hole at the bottom. A spacer is disposed between the top member and the bottom member and has 2n gas through-holes. According to the air exhaust structure and the substrate processing device comprising the air exhaust structure provided by the invention, the air exhaust path can be consistent, so that the film deposition on the substrate is homogenized.

Description

Technical Field

[0001] The present invention relates to an air extraction structure and a substrate processing apparatus including the same, and particularly to an air extraction structure for making gas paths consistent and a substrate processing apparatus including the same. Background Art

[0002] A substrate processing apparatus is used for processes such as depositing and etching a substrate. When processing the substrate, the substrate is usually placed on a substrate support in a substrate processing chamber, and one or more precursor gas mixtures are injected into the substrate processing chamber to excite a plasma to generate a chemical reaction on the substrate to form a deposited film.

[0003] To maintain the uniformity of the deposited film, the metering of the precursor gas introduced into the substrate processing apparatus, the uniformity of the gas flow field, and the uniformity of the electric field of the plasma are all very important. For example, to improve the uniformity of the gas flow field, the prior art often improves the hole distribution position, the hole diameter size, and the hole shape of the gas nozzle. However, the design of the air extraction path still needs to be improved. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide an air extraction structure and a substrate processing apparatus including the same in view of the deficiencies of the prior art.

[0005] To solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an air extraction structure, which includes: a top member; a bottom member, the bottom member being disposed relative to the top member and having an air extraction hole at the bottom; and a separator, the separator being disposed between the top member and the bottom member and having 2 n gas through holes, where n is an integer greater than zero.

[0006] Furthermore, the top member, the bottom member, and the separator are made of a ceramic material.

[0007] Furthermore, the gap between the top member and the separator is less than 10 mm.

[0008] Furthermore, the top member, the bottom member, and the separator are locked to each other with screws.

[0009] Furthermore, the separator has two gas through holes, and the distance between each gas through hole and the air extraction hole is the same.

[0010] To solve the above technical problems, another technical solution adopted by the present invention is to provide a substrate processing apparatus, which includes: a substrate processing chamber configured to process a substrate; a substrate support unit disposed in the substrate processing chamber and having a substrate heating support plate for supporting the substrate and a support shaft for carrying the substrate heating support plate; and the pumping structure as described above, which is disposed around the substrate support unit.

[0011] Further, the top member, the bottom member, and the partition member are made of a ceramic material.

[0012] Further, there is a gap between the top member and the partition member.

[0013] Further, the gap is an annular gap, and the height of the gap is 10 mm or less.

[0014] Further, the top member, the bottom member, and the partition member are locked to each other with screws.

[0015] Further, the partition member has two gas through-holes, and the distance between each of the two gas through-holes and the pumping hole is the same.

[0016] Further, the pumping hole is connected to a pumping motor through a pumping pipeline.

[0017] Further, the top of the partition member is flush with the top of the substrate heating support plate.

[0018] Further, a part of the support shaft is disposed outside the substrate processing chamber.

[0019] Further, the substrate processing apparatus further includes a gas supply portion disposed at the top of the housing corresponding to the substrate support unit.

[0020] One beneficial effect of the present invention is that the pumping structure provided by the present invention and the substrate processing apparatus including the same can make the paths of the gas during chamber pumping consistent through the technical solutions of "the bottom member is disposed relative to the top member and has a pumping hole at the bottom" and "the partition member is disposed between the top member and the bottom member and has 2 n gas through-holes", thereby increasing the film uniformity.

[0021] To further understand the features and technical content of the present invention, please refer to the following detailed description of the present invention and the drawings. However, the provided drawings are only for reference and illustration, and are not intended to limit the present invention. Description of the Drawings

[0022] Figure 1 It is a schematic diagram of the substrate processing apparatus of the present invention.

[0023] Figure 2 It is a three-dimensional schematic diagram of the air extraction structure of the present invention.

[0024] Figure 3 It is a side view schematic diagram of the air extraction structure of the present invention.

[0025] Figure 4 It is a schematic diagram of the gas path for air extraction using the air extraction structure of the present invention.

[0026] Reference numerals: W: substrate; 10: air extraction structure; 11: top member; 12: partition member; 13: bottom member; 14: gap; 20: substrate processing chamber; 30: substrate support unit; 31: substrate heating support plate; 32: support shaft; 40: gas supply unit; 50: air extraction motor; 51: air extraction pipeline; 52: air extraction port; 111: screw; 121: fixing hole; 122, 123: gas through hole; 131: screw hole; 132: air extraction hole. Detailed Embodiments

[0027] The following are specific examples to illustrate the embodiments of the present invention regarding "an air extraction structure and a substrate processing apparatus including the same". Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, it is stated in advance that the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions. The following embodiments will further detail the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

[0028] It should be understood that the term "or" used herein may include any one or a combination of more of the related listed items depending on the actual situation. It should be understood that the presence of the features, numbers, steps, operations, elements, or components or combinations thereof described by the terms "include", "comprise", "have", etc. does not preclude the presence or additional possibility of one or more other features, numbers, steps, operations, elements, or components or combinations thereof.

[0029] In this specification, when referring to an element "connected" to another element, it should be understood that the first element can be directly connected to the second element, but the situation where a third element is disposed between the two elements is not excluded. On the other hand, when referring to an element "directly connected" to another element, it should be understood that there is no third element between the two elements.

[0030] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this technology pertains. Additionally, when using terms with the same definitions as in a common dictionary, they should be interpreted as having the same meaning as in the relevant technical articles.

[0031] The present invention provides an air extraction structure, as Figure 2 shown, the air extraction structure 10 of the present invention includes a top member 11, a partition member 12, and a bottom member 13. The top member 11 and the bottom member 13 are correspondingly arranged, and the partition member 12 is disposed between the top member 11 and the bottom member 13 and has 2 n gas through-holes, where n is an integer greater than zero. In an embodiment of the present invention, the cross-section of the top member 11 can be arranged in an inverted L shape, such that one side of the top member has a gap 14 for gas flow.

[0032] Specifically, the gap 14 can be the distance between the top member 11 and the partition member 12. In an embodiment of the present invention, the height d of the gap 14 can be 10 mm or less, so that the processing gas in the substrate processing chamber 20 can flow uniformly to the air extraction structure 10. In a preferred embodiment of the present invention, the height d of the gap 14 can be between 0.5 mm and 10 mm (for example, any positive integer between 0.5 mm and 10 mm), preferably between 0.5 mm and 3 mm. Additionally, the top member 11, the bottom member 13, and the partition member 12 can be made of ceramic materials. However, the present invention is not limited to the examples given above.

[0033] Furthermore, the partition member 12 can have 2 n gas through-holes 122, 123, where n is an integer greater than zero. For example, the partition member 12 can have 2 gas through-holes, 4 gas through-holes, or 8 gas through-holes. In an embodiment of the present invention, the maximum number of gas through-holes can be 64 to uniformly increase the air extraction volume, thereby solving the problem of uneven air flow during a large amount of exhaust. However, the present invention is not limited to the examples given above. Additionally, the diameter of the gas through-holes can be between 10 mm and 40 mm (for example, any positive integer between 10 mm and 40 mm), preferably between 20 mm and 30 mm.

[0034] The bottom member 13 can have an air extraction hole 132 through which gas can be extracted. Specifically, the air extraction hole 132 is connected to an air extraction motor 50 through an air extraction port 52 and an air extraction pipeline 51. In an embodiment of the present invention, the distances from the air extraction hole 132 to the two gas through-holes 122, 123 on the partition member 12 are the same. Therefore, when the air extraction motor 50 is turned on to extract air from the air extraction hole 132, the gas path can be made consistent.

[0035] In an embodiment of the present invention, the diameter of the air extraction hole 132 is larger than the diameters of the gas through holes 122 and 123, so as to facilitate the uniform discharge of the gas entering from the gas through holes 122 and 123 from the air extraction hole 132. For example, the diameter of the air extraction hole 132 can be between 30 mm and 70 mm (for example, any positive integer between 30 mm and 70 mm), preferably between 40 mm and 60 mm.

[0036] In an embodiment of the present invention, the top member 11 may have screws 111, the separator 12 may have fixing holes 121, and the bottom member 13 may have screw holes 131. Accordingly, the top member 11, the separator 12, and the bottom member 13 can be arranged corresponding to each other and joined or screwed together through the screws 111, the fixing holes 121, and the screw holes 131.

[0037] Furthermore, when the air extraction structure of the present invention is used in a substrate processing apparatus, please refer to Figures 1 to 3 as shown. The substrate processing apparatus of the present invention may include the aforementioned air extraction structure 10, a substrate processing chamber 20, and a substrate support unit 30. The substrate processing chamber 20 is surrounded by a housing to form a chamber for processing substrates. The substrate support unit 30 is disposed in the substrate processing chamber 20 and has a substrate heating support plate 31 for supporting a substrate W and a support shaft 32 for carrying the substrate heating support plate 31.

[0038] In addition, the substrate processing apparatus of the present invention may further include a gas supply unit 40 and an air extraction motor 50. The gas supply unit 40 can be fixed to the top of the substrate processing chamber 20 through a joining unit, connected to a gas supply pipe, and may have a plurality of gas supply holes to uniformly spray a processing gas onto the substrate W opposite to the gas supply unit 40. In an embodiment, the gas supply unit 40 may have a buffer space inside, so that the processing gas can be mixed into a gas mixture in the buffer space and then injected into the substrate processing chamber 20 through the plurality of gas supply holes.

[0039] The air extraction motor 50 can be connected to the air extraction structure 10 to discharge the residual gas inside the substrate processing chamber 20. Specifically, the air extraction motor 50 can be connected to the air extraction structure 10 through an air extraction port 52. In an embodiment, the air extraction port 52 can be an automatic pressure control (APC) valve serving as a pressure adjustment unit.

[0040] Furthermore, please refer to Figure 4 as shown. Figure 4Schematic diagram of the gas path for pumping gas using the pumping structure of the present invention. The processing gas injected into the substrate processing chamber 20 from the gas supply unit 40 can process the substrate W on the substrate heating support disk 31. After the substrate W is processed, the pumping motor 50 is turned on, and the remaining processing gas flows into the pumping structure 10 from the gap 14. Subsequently, the processing gas is restricted by the pumping ring surrounded by the top member 11 and the bottom member 13, causing the processing gas to form a ring and flow into the bottom member 13 of the pumping structure 10 through the paired gas through-holes 122 and 123. The bottom member 13 has pumping holes 132 that are equidistant from the two gas through-holes 122 and 123, enabling the processing gas to uniformly converge into the pumping holes 132 and flow out of the substrate processing chamber 20 through the pumping port 52 to the pumping motor 50.

[0041] In an embodiment of the present invention, the top of the separator 12 can be flush with the top of the substrate heating support disk 31, such that the gas flowing through the substrate heating support disk 31 uniformly flows into the pumping structure 10 through the annular gap 14. In other words, the height of the annular gap 14 can be greater than the height of the substrate W, such that an air flow channel conducive to gas flowing into the gap 14 is formed between the substrate W and the top member 11.

[0042] The pumping structure 10 of the present invention can be set to be circular and arranged to surround the substrate support unit 30. In other words, the pumping structure 10 of the present invention has an annular gap 14 surrounding the substrate support unit 30. The pumping structure 10 of the present invention enables the processing gas to flow into the pumping structure 10 from the annular gap 14, rather than through a plurality of annularly arranged pumping holes, and uniformly discharges from the substrate processing chamber 20 through the gas through-holes 122, 123 and the pumping holes 132 in the pumping structure 10. Accordingly, the pumping motor 50 indirectly pumps out the gas in the pumping structure 10, enabling the path traveled by the gas to be unified, achieving the purpose of making the gas flow field in the substrate processing chamber 20 uniform.

[0043] Beneficial effects of the embodiment

[0044] One of the beneficial effects of the present invention is that the pumping structure provided by the present invention and the substrate processing apparatus including the same can unify the path traveled by the gas during chamber pumping through the technical solutions of "the bottom member is arranged relative to the top member and has a pumping hole at the bottom" and "the separator is arranged between the top member and the bottom member and has 2 n gas through-holes", thereby increasing the film uniformity.

[0045] Furthermore, the ratio of the diameter of the gas through-hole to the diameter of the air extraction hole may be 1:2, which is conducive to uniformly discharging the gas entering from the gas through-hole from the air extraction hole. Since the air extraction ring can limit the upper air extraction from entering through two gas through-holes, and the distances between the two gas through-holes and the air extraction hole are the same, it is possible to reduce the air extraction hole positions in the cavity while making the gas paths consistent and increase the utilization space outside the cavity with only one air extraction hole and one air extraction motor. In other words, through the design of the air extraction hole position, the present invention can save the space of the cavity air extraction pipeline and increase the convenience of the cavity design.

[0046] The above-disclosed content is only the preferred feasible embodiment of the present invention, and does not limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the protection scope of the claims of the present invention.

Claims

1. An air extraction structure, characterized in that, The air extraction structure includes: A top component; A bottom component, which is disposed relative to the top component and has an air extraction hole at the bottom; and A separator, the separator is disposed between the top member and the bottom member and has 2 n gas through holes, where n is an integer greater than zero.

2. The air extraction structure according to claim 1, wherein, The top component, the bottom component, and the separator are made of ceramic material.

3. The air extraction structure according to claim 1, characterized in that, There is a gap less than 10 mm between the top component and the separator.

4. The air extraction structure according to claim 1, wherein The top component, the bottom component, and the separator are locked to each other with screws.

5. The air extraction structure according to claim 1, characterized in that The separator has two gas through holes, and the distance between each of the two gas through holes and the air extraction hole is the same.

6. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: A substrate processing chamber configured to process a substrate; A substrate support unit disposed in the substrate processing chamber and having a substrate heating support plate for supporting the substrate and a support shaft for carrying the substrate heating support plate; and The air extraction structure according to claim 1, the air extraction structure being disposed around the substrate support unit.

7. The substrate processing apparatus according to claim 6, wherein, The top component, the bottom component, and the separator are made of ceramic material.

8. The substrate processing apparatus according to claim 6, wherein There is a gap between the top component and the separator.

9. The substrate processing apparatus according to claim 8, wherein, The gap is an annular gap, and the height of the gap is 10 mm or less.

10. The substrate processing apparatus according to claim 6, wherein The top component, the bottom component, and the separator are locked to each other with screws.

11. The substrate processing apparatus according to claim 6, wherein The separator has two gas through holes, and the distance between each of the two gas through holes and the air extraction hole is the same.

12. The substrate processing apparatus according to claim 6, wherein The air extraction hole is connected to an air extraction motor through an air extraction pipeline.

13. The substrate processing apparatus according to claim 6, wherein, The top of the separator is flush with the top of the substrate heating support plate.

14. The substrate processing apparatus according to claim 6, wherein, A part of the support shaft is disposed outside the substrate processing chamber.

15. The substrate processing apparatus according to claim 6, wherein, The substrate processing apparatus further includes a gas supply unit provided at the top of the housing corresponding to the substrate support unit.

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