Balancing assembly and substrate processing apparatus

Abstract

The invention provides a balancing assembly and a substrate processing device comprising the same. The balancing assembly comprises a bearing platform, a shaft mounting disc arranged on the bearing platform, a first adjusting unit which is arranged on the bearing platform and abuts against the shaft mounting disc, and a second adjusting unit which is adjacent to the first adjusting unit and is arranged on the shaft mounting disc. The balance assembly provided by the invention can adjust the levelness of the substrate supporting unit in real time outside the processing cavity of the substrate processing device, so that the edge thickness of a thin film is improved.

Description

Technical Field

[0001] The present invention relates to a balancing component, and particularly to a balancing component for a substrate processing apparatus. Background Art

[0002] In a deposition process of processing a substrate using plasma, the temperature uniformity of a substrate carrier heating plate affects the thermal energy for forming chemical bonds. In addition, the levelness of the substrate carrier heating plate also affects the uniformity of gas supply from a gas nozzle to the substrate. When the substrate carrier heating plate is tilted, a thicker deposition film is formed at a portion closer to the gas nozzle, and a thinner deposition film is formed at a portion farther from the gas nozzle.

[0003] That is to say, when the substrate carrier heating plate is unbalanced, it will further affect the thickness consistency of the deposition film. Therefore, in order to adjust the levelness of the substrate carrier heating plate, it is necessary to temporarily stop the substrate processing apparatus and open the cavity to adjust the levelness of the substrate carrier heating plate, which takes a long time and cannot adjust the substrate carrier heating plate in real time. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a balancing component and a substrate processing apparatus including the same in view of the deficiencies of the prior art.

[0005] To solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a balancing component, which includes: a carrying platform; a shaft mounting disc disposed on the carrying platform; a first adjustment unit disposed on the carrying platform and abutting against the shaft mounting disc; and a second adjustment unit disposed on the shaft mounting disc adjacent to the first adjustment unit.

[0006] Furthermore, the surface area of the shaft mounting disc is smaller than the surface area of the carrying platform.

[0007] Furthermore, the first adjustment unit is disposed on the shaft mounting disc by screwing.

[0008] Furthermore, the first adjustment unit includes a first fixing block and a screw and a nut mounted on the first fixing block.

[0009] Furthermore, the second adjustment unit includes a second fixing block and a micrometer mounted on the second fixing block.

[0010] Furthermore, the first adjustment unit moves the shaft mounting disc in the horizontal direction, and the second adjustment unit moves the shaft mounting disc in the vertical direction.

[0011] Furthermore, a mounting portion is provided at the center of the shaft mounting disk, and the mounting portion is configured to mount and support the shaft.

[0012] To solve the above technical problems, another technical solution adopted by the present invention is to provide a substrate processing apparatus, which includes: a housing, the space surrounded by the housing being a processing chamber for processing a substrate; a substrate support unit, the substrate support unit including a support disk for supporting the substrate and a support shaft for carrying the support disk, a part of the support shaft being disposed outside the processing chamber; and the aforementioned balance assembly, the balance assembly being connected to the substrate support unit.

[0013] Furthermore, the support shaft is connected to the shaft mounting disk.

[0014] Furthermore, the substrate processing apparatus further includes an installation confirmation assembly, the installation confirmation assembly including: a housing support unit detachably disposed on the housing; and a measurement platform disposed on the housing support unit and including a plurality of measurement elements.

[0015] To enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the provided drawings are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the substrate processing apparatus of the present invention.

[0017] Figure 2 is a three-dimensional schematic diagram of the connection between the substrate support unit and the balance assembly of the present invention.

[0018] Figure 3 is Figure 2 a cross-sectional view taken along III-III in

[0019] Figure 4 is a schematic diagram of the balance assembly of the present invention.

[0020] Figure 5 is a schematic diagram of the installation confirmation assembly of the present invention.

[0021] Figure 6 is a schematic diagram of using the installation confirmation assembly to adjust the substrate support unit in the processing chamber of the present invention.

[0022] Reference numerals: 10: balancing component; 11: bearing platform; 12: shaft mounting disc; 13: first adjustment unit; 14: second adjustment unit; 15: mounting portion; 20: substrate support unit; 21: support shaft; 22: support disc; 30: housing; 31: processing chamber; 40: gas supply unit; 50: pumping unit; 51: pumping pipeline; 60: installation confirmation component; 61: housing support unit; 62: measurement platform; 63: measuring element; 131: first fixing block; 132: screw; 133: nut; 141: second fixing block; 142: micrometer; 211: upper half; 212: lower half; w: substrate; x: first direction; y: second direction; z: third direction. Detailed implementation manners

[0023] The following are specific examples to illustrate the implementation manners of the present invention regarding the "balancing component and substrate processing apparatus including the same". Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not drawn according to actual dimensions. The following implementation manners will further elaborate on the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

[0024] It should be understood that although terms such as "first", "second", "third", etc. may be used in this document to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another.

[0025] In addition, the term "or" used in this document may, depending on the actual situation, include any one or a combination of more of the associated listed items. It should be understood that the presence of the features, numbers, steps, operations, elements or components or combinations thereof described by terms such as "include", "comprise", "have", etc. does not preclude the presence or additional possibility of one or more other features, numbers, steps, operations, elements or components or combinations thereof.

[0026] In this specification, when it is mentioned that an element is "connected" to another element, it should be understood that the first element can be directly connected to the second element, but the situation where a third element is disposed between the two elements is not excluded. On the other hand, when it is mentioned that an element is "directly connected" to another element, it should be understood that there is no third element between the two elements.

[0027] In this specification and the drawings, there are arrows indicating the x direction, the y direction, and the z direction, which are directions orthogonal to each other, and in this specification represent the first direction x, the second direction y, and the third direction z. The first direction x is defined as the X-axis direction, the second direction y is defined as the Y-axis direction, and the first direction x is perpendicular to the second direction y. In addition, the third direction z is defined as the Z-axis direction, the third direction z is perpendicular to the first direction x, and the third direction z is also perpendicular to the second direction y.

[0028] Unless otherwise defined, all terms used herein including technical or scientific terms have the same meanings as those understood by those with ordinary knowledge in the technical field. In addition, when using the same terms as those defined in commonly used dictionaries, they should be interpreted as the meanings consistent with those in the articles of the relevant technology.

[0029] See also Figure 1 As shown, the substrate processing device of the present invention may include a balance assembly 10, a substrate supporting unit 20, a housing 30, a gas supply unit 40, and a gas extraction unit 50. The housing 30 may surround a cavity as a processing chamber 31 for processing a substrate w. The substrate supporting unit 20 may include a supporting shaft 21 and a supporting plate 22, wherein the supporting shaft 21 may be used to support the supporting plate 22, and the supporting plate 22 may be used to support the substrate w.

[0030] Specifically, the support shaft 21 can be divided into an upper half 211 and a lower half 212. The upper half 211 of the support shaft 21 is used to support the support plate 22 in the processing chamber 31, and the lower half 212 of the support shaft is located outside the processing chamber 31 and connected to the balance assembly 10. In one embodiment, the support plate 22 may have a heating unit (not shown in the figure) for heating the substrate w.

[0031] In addition, the gas supply unit 40 may be mounted on the top surface of the housing 30 and arranged corresponding to the position of the support plate 22 to supply the processing gas to the substrate w in the processing chamber 31. Preferably, the gas supply unit 40 may have a plurality of gas supply holes (not shown in the figure) to spray the processing gas uniformly on the substrate w. The exhaust unit 50 may be an exhaust motor. The exhaust unit 50 may be connected to the processing chamber 31 through an exhaust line 51. When the exhaust unit 50 is turned on, the gas in the processing chamber 31 can be exhausted through the exhaust line 51.

[0032] For further information, see Figures 2 to 4 The balancing assembly 10 may be configured to control the level of the support plate 22 outside the processing chamber 31. The balancing assembly 10 may include a carrying platform 11, a shaft mounting plate 12, a first adjustment unit 13, and a second adjustment unit 14.

[0033] The bearing platform 11 is used to bear the shaft mounting disc 12, and the center of the shaft mounting disc 12 has a mounting portion 15, so that the substrate support unit 20 can be mounted on the mounting portion 15 of the balancing assembly 10. In an embodiment, the surface area of the shaft mounting disc 12 is smaller than the surface area of the bearing platform 11 to stably set the shaft mounting disc 12 on the bearing platform 11.

[0034] As described above, the support shaft 21 of the substrate support unit 20 can be mounted on the mounting portion 15 of the balancing assembly 10, so that the substrate support unit 20 can move along with the movement of the shaft mounting disc 12. Therefore, the horizontal cross-sectional shape of the mounting portion 15 corresponds to the horizontal cross-sectional shape of the support shaft 21 to facilitate the fixing of the support shaft 21 in the mounting portion 15. For example, the support shaft 21 can be fixed in the mounting portion 15 by locking. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0035] The first adjustment unit 13 can be arranged on the bearing platform 11 and abuts against the shaft mounting disc 12. By arranging a plurality of first adjustment units 13, the shaft mounting disc 12 can be moved forward and backward or left and right. That is to say, the first adjustment unit 13 can move the shaft mounting disc 12 in the horizontal direction, so that the shaft mounting disc 12 drives the support shaft 21 to move in the first direction x or the second direction y.

[0036] The second adjustment unit 14 is arranged adjacent to the first adjustment unit 13 on the shaft mounting disc 12. The second adjustment unit 14 can move the shaft mounting disc 12 up and down, that is, the second adjustment unit 14 can move the shaft mounting disc 12 in the third direction z to adjust the height of the shaft mounting disc 12, thereby driving the support shaft 21 to adjust the height of the support disc 22. In other words, the second adjustment unit 14 can adjust the distance between the support disc 22 and the gas supply unit 40.

[0037] Furthermore, the first adjustment unit 13 and the second adjustment unit 14 can be correspondingly arranged, that is, the adjacent first adjustment unit 13 and the second adjustment unit 14 can be set as a group. In an embodiment, the distance between the adjacent first adjustment unit 13 and the second adjustment unit 14 can be 0.5 mm to 20 mm (for example, any positive integer between 0.5 mm and 20 mm). Preferably, the distance between the first adjustment unit 13 and the second adjustment unit 14 can be 1 mm to 15 mm to provide an appropriate adjustment space.

[0038] In a preferred embodiment of the present invention, three groups of the first adjustment unit 13 and the second adjustment unit 14 can be adopted, and the three groups of the first adjustment unit 13 and the second adjustment unit 14 are arranged in an equilateral triangle form at equal intervals to stably support and adjust the substrate support unit 20. In other words, the distance between each group of the first adjustment unit 13 and the second adjustment unit 14 and the mounting portion 15 is equal.

[0039] For example, the distance between two adjacent first adjustment units 13 may be from 120 mm to 240 mm (for example, any positive integer between 120 mm and 240 mm). Preferably, the distance between two adjacent first adjustment units 13 may be from 150 mm to 200 mm. On the other hand, the distance between two adjacent second adjustment units 14 may be from 90 mm to 180 mm (for example, any positive integer between 90 mm and 180 mm). Preferably, the distance between two adjacent second adjustment units 14 may be from 100 mm to 150 mm.

[0040] Furthermore, the first adjustment unit 13 includes a first fixing block 131, a screw 132 and a nut 133 mounted on the first fixing block 131. That is to say, the first fixing block 131 is a structure for locking the screw 132 and the nut 133 on the first fixing block 131, and the position of the shaft mounting disc 12 can be adjusted by adjusting the degree to which the screw 132 is screwed into the nut 133. The second adjustment unit 14 includes a second fixing block 141 and a micrometer 142 mounted on the second fixing block 141. The micrometer 142 is a structure in which a precision screw is matched with a nut, and the rotational motion of the screw can be changed into an axial diameter displacement, thereby improving the adjustment accuracy. For example, the screw of the micrometer 142 can abut against the bearing platform, so that the shaft mounting disc 12 moves a distance of ±10 mm in the third direction z to raise and lower the shaft mounting disc 12.

[0041] In an embodiment of the present invention, the balance assembly 10 can instantaneously adjust the levelness of the substrate support unit 20 according to the coating result. Specifically, when the edge film thickness is relatively thin, the balance assembly 10 can be adjusted to raise the support disc 22 in this area, making this area closer to the upper electrode, and thus increasing the thickness of the edge film. Therefore, the overall coating condition after adjustment will be more uniform. Herein, adjusting the levelness means adjusting the height or position of the bearing surface of the support disc 22 in the horizontal direction or in the vertical direction. In one embodiment, the coating may be a polysilicon film, a silicon oxide film and a silicon nitride film. However, the above examples are only one feasible embodiment and are not intended to limit the present invention.

[0042] On the other hand, the substrate processing device of the present invention may further include an installation confirmation assembly 60 for calibrating the substrate support unit 20 in the cavity opening state before starting to process the substrate w. Please refer to Figure 5 As shown, the installation confirmation assembly 60 may include a housing support unit 61, a measurement platform 62 and a measurement element 63.

[0043] Furthermore, please refer to Figure 6As shown, the housing support unit 61 is detachably disposed on the housing 30 to serve as the position where the measurement platform 62 is placed. That is, the measurement platform 62 can be disposed on the housing support unit 61 and includes a plurality of measurement elements 63. In an embodiment of the present invention, the measurement element 63 can be an altimeter. During the process of calibrating the substrate support unit 20, the support disk 22 of the substrate support unit 20 can be raised until it contacts the measurement element 63, and then the balance assembly 10 can be adjusted according to the measurement results of the measurement element 63 to adjust the substrate support unit 20.

[0044] For example, the measurement platform 62 can include three measurement elements 63 to uniformly measure the levels of different positions of the support disk 22. However, the above example is only one possible embodiment, and the number of measurement elements 63 is not used to limit the present invention.

[0045] Advantages of the Embodiment

[0046] One of the advantages of the present invention is that the balance assembly provided by the present invention and the substrate processing apparatus including the same can enable the substrate processing apparatus of the present invention to instantaneously adjust the level of the support member outside the chamber through the technical solutions of "the first adjustment unit, the first adjustment unit is disposed on the carrier platform and abuts against the shaft mounting disk" and "the second adjustment unit, the second adjustment unit is disposed on the shaft mounting disk adjacent to the first adjustment unit", thereby improving the film edge thickness.

[0047] Furthermore, the balance assembly of the present invention can be used to quickly and easily adjust the level of the support disk of the substrate support unit to make the levels of the substrate and the gas nozzle consistent. In addition, the substrate processing apparatus of the present invention does not need to stop the machine to adjust the level of the support disk, but can finely adjust the support disk in real time according to the edge thickness of the film deposition, increasing the film uniformity.

[0048] The above-disclosed content is only the preferred feasible embodiment of the present invention, and does not limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the protection scope of the claims of the present invention.

Claims

1. A balance component, characterized in that, The balance assembly includes: A carrier platform; A shaft mounting disc, which is arranged on the carrier platform; A first adjustment unit, which is arranged on the carrier platform and abuts against the shaft mounting disc; and A second adjustment unit, which is arranged on the shaft mounting disc adjacent to the first adjustment unit.

2. The balance component according to claim 1, characterized in that The surface area of the shaft mounting disc is smaller than that of the carrier platform.

3. The balance component according to claim 1, characterized in that, The first adjustment unit is arranged on the shaft mounting disc by means of screw fixation.

4. The balance component according to claim 1, wherein The first adjustment unit includes a first fixing block and screws and nuts mounted on the first fixing block.

5. The balance component according to claim 1, characterized in that, The second adjustment unit includes a second fixing block and a micrometer mounted on the second fixing block.

6. The balance component according to claim 1, characterized in that The first adjustment unit moves the shaft mounting disc in the horizontal direction, and the second adjustment unit moves the shaft mounting disc in the vertical direction.

7. The balance component according to claim 1, characterized in that, The center of the shaft mounting disc has a mounting portion, and the mounting portion is configured to mount a support shaft.

8. A substrate processing apparatus, characterized in that, The substrate processing device includes: A housing, and the space surrounded by the housing is a processing chamber for processing a substrate; A substrate support unit, which includes a support disc for supporting the substrate and a support shaft for carrying the support disc, and a part of the support shaft is arranged outside the processing chamber; and The balance assembly according to claim 1, and the balance assembly is connected to the substrate support unit.

9. The substrate processing apparatus according to claim 8, wherein, The support shaft is connected to the shaft mounting disc.

10. The substrate processing apparatus according to claim 8, wherein The substrate processing device further includes an installation confirmation assembly, and the installation confirmation assembly includes: A housing support unit, which is detachably arranged on the housing; and A measurement platform, which is arranged on the housing support unit and includes a plurality of measurement elements.

Images