Electronic equipment, temperature measuring method and temperature measuring device

Abstract

The embodiment of the invention provides electronic equipment which comprises a shell, a plurality of first temperature sensors and a control part, the shell is provided with a plurality of holding areas, and the plurality of first temperature sensors are distributed in the plurality of holding areas of the shell and used for collecting temperature information of the plurality of holding areas as first temperature information. And the control part is used for fitting to obtain the fitting temperature of each holding area according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas, and obtaining the shell temperature of the electronic equipment according to the fitting temperature of the plurality of holding areas and the distribution information of the plurality of holding areas. The fitting temperature of each holding area is acquired according to the first temperature information and the distribution information of the plurality of holding areas, so that the current temperature of each holding area can be determined more accurately, and the obtained shell temperature of the electronic equipment is more accurate. In addition, the embodiment of the invention also provides a temperature measurement method and a temperature measurement device.

Description

Technical Field

[0001] This application relates to the field of consumer electronic products, and particularly relates to an electronic device, a temperature measurement method and a temperature measurement device. Background Art

[0002] Currently, electronic devices such as mobile phones are getting smaller in size, higher in performance, and greater in heat generation, and thus have an increasing demand for heat dissipation. When the heat generation of an electronic device is too large and cannot be dissipated in time, the temperature of the electronic device may rise sharply, affecting the normal use of the electronic device.

[0003] When an electronic device is in use, a user holds the electronic device and is in direct contact with it. Therefore, when the temperature of the electronic device rises rapidly, the user can directly feel the temperature change, which not only results in a poor experience but also affects the user's use. Currently, in related technologies, to avoid the temperature of an electronic device from rising too fast, the electronic device usually controls the temperature, such as performing a frequency reduction process on the processor, closing some background application programs, etc., to prevent the temperature of the electronic device from continuing to rise rapidly. However, the current electronic devices mainly obtain the temperature through temperature sensors arranged on the main board and cannot accurately reflect the temperature felt by the user when using the electronic device. Summary of the Invention

[0004] This application provides an electronic device, a temperature measurement method and a temperature measurement device, which can improve the above technical problems.

[0005] In a first aspect, an embodiment of this application provides an electronic device, including a housing, a plurality of first temperature sensors, and a control unit. The housing has a plurality of holding areas. The plurality of first temperature sensors are arranged inside the housing and are distributed in the plurality of holding areas of the housing for collecting temperature information of the plurality of holding areas as first temperature information. The control unit is configured to fit and obtain the fitted temperature of each holding area according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas, and obtain the housing temperature of the electronic device according to the fitted temperatures of the plurality of holding areas and the distribution information of the plurality of holding areas.

[0006] Second aspect, the embodiments of the present application further provide a method for measuring the temperature of an electronic device. The electronic device includes a housing and a plurality of first temperature sensors. The housing has a plurality of holding areas. The plurality of first temperature sensors are arranged inside the housing and are distributed in the plurality of holding areas of the housing for collecting temperature information of the plurality of holding areas as first temperature information. The method includes: obtaining the first temperature information collected by the plurality of first temperature sensors; fitting to obtain the fitted temperature of each holding area according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas; and obtaining the housing temperature of the electronic device according to the fitted temperatures of the plurality of holding areas and the distribution information of the plurality of holding areas.

[0007] Third aspect, the embodiments of the present application further provide a device for measuring the temperature of an electronic device. The electronic device includes a housing and a plurality of first temperature sensors. The housing has a plurality of holding areas. The plurality of first temperature sensors are arranged inside the housing and are in direct contact with the inner surface of the housing. The plurality of first temperature sensors are distributed in the plurality of holding areas of the housing, and the plurality of first temperature sensors are used for collecting first temperature information. The device includes: an information collection module, a fitting module, and a temperature acquisition module. The information collection module is used for obtaining the first temperature information collected by the plurality of first temperature sensors; the fitting module is used for fitting to obtain the fitted temperature of each holding area according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas; and the temperature acquisition module is used for obtaining the housing temperature of the electronic device according to the fitted temperatures of the plurality of holding areas and the distribution information of the plurality of holding areas.

[0008] In the electronic device, temperature measurement method, and temperature measurement device provided by the embodiments of the present application, the plurality of first temperature sensors are arranged in the plurality of holding areas to directly collect the temperature of each holding area. By obtaining the fitted temperature of each holding area according to the first temperature information and the distribution information of the plurality of holding areas, the temperature of each current holding area can be determined more accurately, and thus the housing temperature of the electronic device obtained is more accurate.

[0009] These aspects or other aspects of the present application will be more clearly understood in the following description of the embodiments. Description of the Drawings

[0010] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0011] Figure 1 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

[0012] Figure 2 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application from another perspective.

[0013] Figure 3 It is a structural block diagram of an electronic device provided by an embodiment of the present application.

[0014] Figure 4 It is a schematic structural diagram of a first temperature sensor in an electronic device provided by an embodiment of the present application.

[0015] Figure 5 It is a flowchart of a method for measuring the temperature of an electronic device provided by an embodiment of the present application.

[0016] Figure 6 It is a flowchart of another method for measuring the temperature of an electronic device provided by an embodiment of the present application.

[0017] Figure 7 It is a block diagram of a device for measuring the temperature of an electronic device provided by an embodiment of the present application. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0019] When using an electronic device, the user holds the electronic device by hand and is in direct contact with the electronic device. Therefore, when the temperature of the electronic device rises rapidly, the user can directly feel the temperature change, which not only results in a poor experience but also affects the user's use. Currently, in related technologies, in order to avoid the temperature of the electronic device from rising too fast, the electronic device usually controls the temperature, such as performing frequency reduction processing on the processor, closing some background application programs, etc., to prevent the temperature of the electronic device from continuing to rise rapidly. However, the current electronic device mainly obtains the temperature through a temperature sensor arranged on the main board, and what it reflects more is the main board temperature. Since the chips arranged on the main board are one of the main sources of heat generation, the temperature information collected by the temperature sensor arranged on the main board may be too high and cannot accurately reflect the temperature felt by the user when using the electronic device. Based on this, the temperature control strategy for the electronic device may lead to a poor experience for the user when using the electronic device.

[0020] The following specifically describes the embodiments of the present application in conjunction with the accompanying drawings.

[0021] Please refer to Figure 1 and Figure 2, this embodiment provides an electronic device 10, which includes a housing 200 and a main board 300. Among them, the main board 300 is disposed within the housing 200. The housing 200 in this embodiment includes all components of the electronic device 10 that serve as the appearance surface.

[0022] It can be understood that the electronic device 10 in this application can be a mobile phone or a smart phone (for example, an iPhone TM - based phone, an Android TM - based phone), a portable gaming device (such as a Nintendo DS TM, a PlayStation Portable TM, a Gameboy Advance TM, an iPhone TM), a laptop computer, a PDA, a portable Internet device, a music player, and a data storage device, other handheld devices, and such as watches, earphones, pendants, earbuds, etc. The electronic device 10 can also be other wearable devices (for example, head - mounted devices (HMDs) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, the electronic device 10 or smart watches). In this embodiment, the electronic device 10 is taken as a mobile phone for introduction.

[0023] Please refer to Figure 1 and Figure 2 , the housing 200 may include a middle frame 220, a rear cover 210, and a display screen 100. Among them, the middle frame 220 has two opposite sides. The rear cover 210 is assembled on one side of the middle frame 220, and the display screen 100 can be assembled on the other side of the middle frame 220. The rear cover 210 can be used to set the camera 300 components. In some embodiments, the rear cover 210 can also be provided with a display screen, which is not limited here. After the middle frame 220 and the rear cover 210 are assembled, a receiving space 230 can be formed. The receiving space 230 is used to accommodate various components of the electronic device 10, such as accommodating components such as the main board 600, the camera, and the speaker.

[0024] Among them, a chip (not shown) is provided on the main board 300. The chip may include a processor and a memory. The processor may include one or more processing cores. The processor connects various parts within the entire electronic device 10 through various interfaces and circuits, and executes various functions of the electronic device 10 and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory, and by calling data stored in the memory. Optionally, the processor may be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), or programmable logic array (PLA). The processor may integrate a combination of one or several of a central processing unit (CPU), a graphics processing unit (GPU), and a modem, etc. Among them, the CPU mainly processes the operating system, user interface, application programs, etc.; the GPU is responsible for rendering and drawing display content; the modem is used to process wireless communication. It can be understood that the above-mentioned modem may not be integrated into the processor and may be implemented separately through a communication chip.

[0025] The memory may include random access memory (RAM) and may also include read-only memory. The memory can be used to store instructions, programs, code, code sets, or instruction sets. The memory may include a program storage area and a data storage area. Among them, the program storage area may store instructions for implementing the operating system, instructions for implementing at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the following various method embodiments, etc. The data storage area may also store data created during the use of the electronic device 10 (such as phone books, audio and video data, chat record data, etc.).

[0026] The middle frame 220 includes a middle board (not shown) and a frame 222. The frame 222 surrounds the middle board and protrudes from the middle board. The rear cover 210 is assembled to the frame 222 of the middle frame 220. The display screen 100 is also assembled to the frame 222 and is located on the opposite sides of the middle board from the rear cover 210. The rear cover 210, the frame 222, and the middle board 221 enclose a receiving space. The main board 300 is installed on the middle frame 220 of the housing 200 and is specifically located on the surface of the middle frame 220 facing the rear cover 210. Components such as the main board 300 are located within the receiving space.

[0027] The display screen 100 may adopt an LCD (Liquid Crystal Display) screen to display information. The LCD screen may be a TFT (Thin Film Transistor) screen, an IPS (In-Plane Switching) screen, or an SLCD (Splice Liquid Crystal Display) screen. In some other embodiments, the display screen 100 may adopt an OLED (Organic Light-Emitting Diode) screen to display information. The OLED screen may be an AMOLED (Active Matrix Organic Light Emitting Diode) screen, a Super AMOLED (Super Active Matrix Organic Light Emitting Diode) screen, or a Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus) screen, which will not be elaborated here.

[0028] In this embodiment, the frame 222 includes opposite first and second edges 211 and 212 and opposite third and fourth edges 213 and 214. The third and fourth edges 213 and 214 are connected between the first and second edges 211 and 212. The first and second edges 211 and 212 are disposed substantially along the length direction of the electronic device 10, and the third and fourth edges 213 and 214 are disposed substantially along the width direction of the electronic device 10.

[0029] The housing 200 of the electronic device 10 has a plurality of holding areas 50. The holding area 50 refers to the direct contact area between the user's hand and the electronic device 10 when the user holds the electronic device 10. It can be understood that the holding area 50 in this embodiment refers to the area where the user commonly holds the electronic device 10, especially when the electronic device 10 generates a large amount of heat during long-term use. Taking the user's behaviors such as playing games and watching videos with the electronic device 10 as an example, the user usually uses the landscape mode of the electronic device 10. At this time, the plurality of holding areas 50 of the housing 200 may include a first holding area 51, a second holding area 52, a third holding area 53, and a fourth holding area 54 at the corner positions of the frame 222. The plurality of holding areas 50 further include a fifth holding area 55 and a sixth holding area 56 on the rear cover 210, and a seventh holding area 57 and an eighth holding area 58 on the display screen. Among them, the fifth holding area 55 and the sixth holding area 56 may be approximately located in the approximate middle area of the rear cover 210, and the fifth holding area 55 and the sixth holding area 56 are approximately symmetrically distributed. When the user uses the landscape mode of the electronic device 10, the hand is usually supported on the fifth holding area 55 and the sixth holding area 56. The seventh holding area 57 and the eighth holding area 58 may be approximately located in the approximate middle area of the display screen 100, and the seventh holding area 57 and the eighth holding area 58 are approximately symmetrically distributed. When the user uses the landscape mode of the electronic device 10, the fingers usually operate in the seventh holding area 57 and the eighth holding area 58.

[0030] It should be noted that the corner positions of the frame 222 refer to the connection areas and the areas near the connection areas between the first edge 211 and the third edge 213, the connection areas and the areas near the connection areas between the first edge 211 and the fourth edge 214, the connection areas and the areas near the connection areas between the second edge 212 and the third edge 213, and the connection areas and the areas near the connection areas between the second edge 212 and the fourth edge 214. These corner positions can be in a right-angle transition or an arc transition, and this embodiment does not make any limitations on this.

[0031] It can be understood that one or more of the above-mentioned plurality of holding areas 50 may be in a holding state. In some application scenarios, all of the above-mentioned plurality of holding areas 50 may also be in a holding state at the same time. In other application scenarios, the electronic device 10 may also have other holding areas 50.

[0032] Refer to Figure 3, the electronic device 10 further includes a plurality of first temperature sensors 310. The plurality of first temperature sensors 310 are disposed within the housing 200 and are distributed in a plurality of gripping regions 50 of the housing 200 for collecting temperature information of the plurality of gripping regions 50 as first temperature information, where at least one first temperature sensor 310 is disposed in each gripping region 50. In some embodiments, one first temperature sensor 310 may be disposed in each gripping region 50, or at least two first temperature sensors 310 may be disposed in some or all of the gripping regions 50.

[0033] In this embodiment, the first temperature sensor 310 directly contacts the gripping region 50 of the housing 200 to collect temperature information. For example, the first temperature sensor 310 may be directly disposed on the inner surface of the housing 200 corresponding to the gripping region 50. In this way, the sampling distance is relatively short and the thermal resistance is small, so that the collected temperature information is more accurate.

[0034] Figure 4 The structure of a first temperature sensor 310 is shown. In this embodiment, the first temperature sensor 310 includes a pull-up power supply 311, a pull-up resistor 312, and a sensor 313. The pull-up resistor 312 is electrically connected between the pull-up power supply 311 and the sensor 313. The pull-up resistor 312 may be a thermosensitive thin-film resistor. The sensor 313 is grounded, and the pull-up power supply 311 is electrically connected to a circuit within the electronic device 10. Among them, the thermosensitive thin-film resistor has the characteristics of being thin in thickness, with a dimensional thickness of about 500 nm or less. At the same time, the thermosensitive thin-film resistor is made of a semiconductor material ratio, and its resistance value decreases non-linearly with the increase of temperature. Therefore, the measurement accuracy is higher, and the thermosensitive thin-film resistor can be made into a flexible FPC form and attached to the inner surface of the housing 200, which is more convenient to set and occupies less space. It can be understood that in some other embodiments, the pull-up resistor 312 may also use a conventional resistor device.

[0035] In some other embodiments, the first temperature sensor 310 may also use other semiconductor IC temperature sensors, semiconductor thermistors, etc. This embodiment does not limit this.

[0036] Please refer to again Figure 3 , the electronic device 10 further includes a control unit 400. The control unit 400 is electrically connected to the plurality of first temperature sensors 310 and can obtain the first temperature information collected by the first temperature sensors 310. In this embodiment, the control unit 400 may be a chip integrated on the main board 300. This embodiment does not limit this.

[0037] Generally, the overall temperature of the electronic device 10 is relatively uniform. However, the temperature of each holding area 50 is affected by factors such as its distance from the heat source, the difference in heat dissipation efficiency, and whether it is blocked. Therefore, the actual temperature values of each holding area 50 will vary. That is, the first temperature information obtained by multiple first temperature sensors 310 will vary. Therefore, the first temperature information collected by a single first temperature sensor 310 cannot accurately reflect the temperature of the housing 200 of the electronic device 10 and the temperature of the housing 200 actually perceived by the user. Therefore, how to accurately calculate the temperature of the housing 200 of the electronic device 10 is very important for subsequent corresponding temperature control strategies for the electronic device 10.

[0038] In this embodiment, the control unit 400 can be used to fit the fitting temperature of each holding area 50 according to the first temperature information collected by multiple first temperature sensors 310 and the distribution information of multiple holding areas 50. By performing temperature fitting on each holding area 50, the temperature interference factors of each holding area 50 can be excluded, and a more accurate temperature of each holding area 50 can be obtained. Furthermore, a more accurate temperature of the housing 200 of the electronic device 10 can be obtained subsequently.

[0039] In this embodiment, the control unit 400 can also be used to obtain the temperature of the housing 200 of the electronic device 10 according to the fitting temperature of multiple holding areas 50 and the distribution information of multiple holding areas 50. The electronic device 10 can execute corresponding temperature control strategies according to the obtained temperature of the housing 200 of the electronic device 10.

[0040] Specifically, referring to Figure 5 , this embodiment also provides a method for measuring the temperature of an electronic device, including the following steps:

[0041] Step S110: Obtain the first temperature information collected by multiple first temperature sensors.

[0042] The first temperature sensor 310 can collect the first temperature information of the holding area 50 in real time. Since in this embodiment, the first temperature sensor 310 is directly disposed in the holding area 50 and directly contacts and measures the holding area 50 of the electronic device 10, the measured data is more accurate.

[0043] Since the temperature of each holding area 50 is affected by its position, the first temperature information collected by each first temperature sensor 310 may be interfered with and not accurate enough. Therefore, step S120 is executed after step S110.

[0044] Step S120: Fit the fitting temperature of each holding area according to the first temperature information collected by multiple first temperature sensors and the distribution information of multiple holding areas.

[0045] Among them, the distribution information of the multiple holding areas 50 may include the position information of each holding area 50 and the fitting parameters of each holding area 50 determined according to the position information of each holding area 50. The fitting parameters may be a constant or a variable. As a more specific implementation manner, in this embodiment, the fitting temperature of each holding area 50 in step S120 may be determined in the following manner:

[0046] shell qi = a1*T1 + a2*T2 + … + a i *T i , where a1 - a i are preset coefficients determined according to the distribution information of the multiple holding areas 50, T1 - T i are the first temperature information collected by the multiple first temperature sensors 310 respectively, and shell qi is the fitting temperature of each holding area 50. The number of i is equal to the number of holding areas 50.

[0047] Among them, it should be noted that for each holding area 50, a1 - a i can adopt the same preset coefficients or different preset coefficients. For example: for the first holding area 50, its fitting temperature shell q1 = a 11 *T1 + a 12 *T2 + … + a 1i *T i , and for the second holding area 50, its fitting temperature shell q2 = a 21 *T1 + a 22 *T2 + … + a 2i *T i , where a 11 - a 1i and a 21 - a 2i can be correspondingly equal one by one or completely unequal.

[0048] The advantage of adopting the above fitting method is that: for each holding area 50, the distance from it to the heat source is different, so the heat conducted to the holding area 50 after the heat source generates heat is not equal. At the same time, there may be multiple heat sources, which will also form a temperature difference between different holding areas 50. This leads to a temperature difference between different holding areas 50. Therefore, the actual temperature of each holding area 50 will also be affected by the temperature of other holding areas 50. By fitting the first temperature information obtained from each holding area 50, the temperature of each holding area 50 can be determined more accurately.

[0049] Wherein, in some embodiments, a1-a i It can be predetermined and stored locally in the electronic device 10, and directly called when the first temperature sensor 310 in the electronic device 10 collects the first temperature information. a1-a i It can be determined by pre-simulation. For example, an operator simulates a user using the electronic device 10 for a long time to play games, so that the electronic device 10 quickly and in large quantities heats up, and the first temperature information is collected by the multiple first temperature sensors 310, and then the temperature of the touch area (i.e., the temperature of the outer surface of the electronic device 10 corresponding to the touch area) is collected by an external device, and compared with the first temperature information collected by the multiple first temperature sensors 310, and fitted to obtain the corresponding preset coefficients a1-a i .

[0050] It is understandable that in some other implementations, the corresponding preset coefficients a1-a may also be obtained by other methods. i For example, the electronic device 10 may autonomously learn and update the preset coefficients in an iterative manner, which is not limited in this embodiment.

[0051] The fitting temperature of each holding area 50 obtained in the above manner can more accurately reflect the temperature of the current holding area 50, which is convenient for obtaining the temperature of the housing 200 of the electronic device 10 more accurately in the future and reflects the temperature change perceived by the user.

[0052] After obtaining the fitting temperature of each holding area 50, since there may be a certain temperature difference in the fitting temperature of each holding area 50, step S130 may be executed in order to obtain a more accurate temperature of the housing 200 of the electronic device 10 and truly reflect the temperature perceived by the user in the holding state.

[0053] Step S130: obtaining the housing temperature of the electronic device according to the fitting temperatures of the plurality of holding areas and the distribution information of the plurality of holding areas.

[0054] The distribution information of the plurality of gripping areas 50 may include the position information of each gripping area 50 and the weighted parameter of each gripping area 50 determined according to the position information of each gripping area 50. The weighted parameter may be a constant or a variable. As a more specific implementation, in this embodiment, the temperature of the housing 200 of the electronic device 10 in step S130 may be determined in the following manner:

[0055] shell=b1*shell q1 +b2*shell q2 +…+b i *shell qi , where b1-bi is a weighting coefficient determined according to the distribution information of multiple holding areas 50, shell qi is the fitted temperature of each holding area 50, and shell is the temperature of the housing 200 of the electronic device 10.

[0056] where b1 - b i can be pre - determined and stored locally in the electronic device 10, and can be directly called when the first temperature sensor 310 in the electronic device 10 collects the first temperature information. b1 - b i can be determined through pre - simulation. For example, by an operator simulating a user using the electronic device 10 for a long time to play games, making the electronic device 10 heat up quickly and in large quantities, multiple first temperature sensors 310 collect the first temperature information, and then an external device collects the temperature of the touch area (i.e., the temperature of the corresponding touch area on the outer surface of the electronic device 10) and the temperature of other areas of the electronic device 10, and compares and fits them with the first temperature information collected by multiple first temperature sensors 310 to obtain the corresponding weighting coefficients b1 - b i .

[0057] It can be understood that in some other embodiments, the corresponding preset coefficients b1 - b can also be obtained by other means i , for example, the electronic device 10 can autonomously learn and update the preset coefficients in an iterative manner, and this embodiment does not limit this.

[0058] In the method for measuring the temperature of the electronic device provided in this embodiment, multiple first temperature sensors 310 are arranged in multiple holding areas 50 to directly collect the temperature of each holding area 50. By obtaining the fitted temperature of each holding area 50 according to the first temperature information and the distribution information of multiple holding areas 50, the temperature of each current holding area 50 can be determined more accurately, and thus the temperature of the housing 200 of the electronic device 10 obtained is more accurate.

[0059] The chip set on the main board 300 is one of the main heat sources of the electronic device 10. Therefore, during the use of the electronic device 10, the main board 300 is closer to the heat source, and the temperature of the main board 300 may be higher than that of the housing 200. At the same time, the temperature change of the main board 300 will also reflect the change trend of the temperature of the housing 200. At the same time, the heat on the main board 300 will conduct to the holding area 50, so the temperature of the main board 300 can be obtained.

[0060] In another embodiment, please refer to again Figure 4, the electronic device 10 may further include a second temperature sensor 320. The second temperature sensor 320 may be one or more, and the second temperature sensor 320 may be disposed on the main board 300 and used to collect the temperature information of the main board 300 as the second temperature information. Among them, the second temperature sensor 320 may adopt the same structure as the first temperature sensor 310, which will not be elaborated here.

[0061] The control unit 400 may be used to fit and obtain the fitting temperature of each holding area 50 according to the first temperature information collected by multiple first temperature sensors 310, the second temperature information, and the distribution information of multiple holding areas 50. By integrating the first temperature information, the second temperature information, and the distribution information of the holding area 50, on the one hand, it is possible to avoid errors caused by abnormal measurements of a single temperature sensor. On the other hand, since the second temperature information can reflect the change trend of the first temperature information, using the second temperature information as a fitting factor can significantly improve the accuracy of the fitting temperature of the holding area 50.

[0062] By performing temperature fitting on each holding area 50, the temperature interference factors of each holding area 50 can be excluded, and a more accurate temperature of each holding area 50 can be obtained. Furthermore, a more accurate temperature of the housing 200 of the electronic device 10 can be obtained subsequently.

[0063] The control unit 400 may also be used to obtain the temperature of the housing 200 of the electronic device 10 according to the fitting temperatures of multiple holding areas 50 and the distribution information of multiple holding areas 50. The electronic device 10 may execute a corresponding temperature control strategy according to the obtained temperature of the housing 200 of the electronic device 10.

[0064] Specifically, referring to Figure 6 , this embodiment also provides another method for measuring the temperature of an electronic device, including the following steps:

[0065] Step S210: Obtain the first temperature information collected by multiple first temperature sensors.

[0066] Step S220: Fit and obtain the fitting temperature of each holding area according to the temperature information collected by multiple first temperature sensors, the second temperature information, and the distribution information of multiple holding areas.

[0067] In this embodiment, the fitting temperature of each holding area 50 in step S220 may be determined in the following manner:

[0068] shell qi =a1*T1+a2*T2+…+a i *T i + a i+1 *T i+1, where a1 - a i+1 is a preset coefficient determined according to the distribution information of multiple holding areas 50, and T1 - T i is the first temperature information collected by multiple first temperature sensors 310, and T i+1 is the second temperature information collected by the second temperature sensor 320, and shell qi is the fitted temperature of each holding area 50.

[0069] It should be noted that, for each holding area 50, a1 - a i+1 can adopt the same preset coefficient or different preset coefficients. For example: for the first holding area 51, its fitted temperature shell q1 = a 11 *T1 + a 12 *T2 + … + a 1i *T i + a 1(i+1) *T i+1 , and for the second holding area 52, its fitted temperature shell q2 = a 21 *T1 + a 22 *T2 + … + a 2i *T i + a 2(i+1) *T i+1 , where a 11 - a 1(i+1) and a 21 - a 2(i+1) can be equal to each other one by one or completely unequal.

[0070] The advantage of adopting the above fitting method is that: for each holding area 50, the distance from it to the heat source is different, so the heat conducted to the holding area 50 after the heat source generates heat is not equal. At the same time, there may be multiple heat sources, which will also form a temperature difference between different holding areas 50. This leads to a temperature difference between different holding areas 50. Therefore, the actual temperature of each holding area 50 will also be affected by the temperature of other holding areas 50. By fitting the first temperature information obtained from each holding area 50, the temperature of each holding area 50 can be determined more accurately. At the same time, by introducing the second temperature information as a fitting factor, the change trend of the first temperature information can be reflected, and the accuracy of the fitted temperature of the holding area 50 can be significantly improved.

[0071] Among them, in some embodiments, a1 - a i+1It can be determined in advance and stored locally in the electronic device 10, and directly called when the first temperature sensor 310 in the electronic device 10 collects the first temperature information. a1-a i+1 It can be determined through pre-simulation. For example, an operator simulates a user using the electronic device 10 for a long time to play games, causing the electronic device 10 to generate heat quickly and in large quantities. Multiple first temperature sensors 310 collect the first temperature information, and then an external device collects the temperature of the touch area (i.e., the temperature of the corresponding touch area on the outer surface of the electronic device 10), compares it with the first temperature information collected by the multiple first temperature sensors 310, and fits to obtain the corresponding preset coefficients a1-a i+1 .

[0072] It can be understood that in some other embodiments, the corresponding preset coefficients a1-a can also be obtained by other means i+1 , for example, the electronic device 10 can autonomously learn and update the preset coefficients in an iterative manner, and this embodiment does not limit this

[0073] The fitted temperature of each holding area 50 obtained by the above method can more accurately reflect the temperature of the current holding area 50, which is convenient for more accurately obtaining the temperature of the housing 200 of the electronic device 10 later and reflecting the temperature change situation perceived by the user. After obtaining the fitted temperatures of multiple holding areas 50, step S230 is executed

[0074] Step S230: Obtain the housing temperature of the electronic device according to the fitted temperatures of multiple holding areas and the distribution information of multiple holding areas

[0075] In the electronic device temperature measurement method provided in this embodiment, multiple first temperature sensors 310 are arranged in multiple holding areas 50 to directly collect the temperature of each holding area 50, and the second temperature sensor 320 collects the temperature of the main board 300 as the second temperature information. According to the first temperature information, the second temperature information, and the distribution information of multiple holding areas 50, the fitted temperature of each holding area 50 is obtained, which can more accurately determine the temperature of each current holding area 50, and thus the temperature of the housing 200 of the electronic device 10 obtained is more accurate

[0076] Referring to Figure 7 , this embodiment also provides an electronic device temperature measurement device 500, which can be applied to the aforementioned electronic device 10. The electronic device temperature measurement device 500 may include an information collection module 510, a fitting module 520, and a temperature acquisition module 530. The information collection module 510 is used to obtain the first temperature information collected by multiple first temperature sensors

[0077] The fitting module 520 is configured to obtain the fitted temperature of each holding area by fitting according to the first temperature information collected by multiple first temperature sensors and the distribution information of multiple holding areas.

[0078] In some embodiments, the fitting module 520 may obtain the fitted temperature in the following manner:

[0079] shell qi =a1*T1+a2*T2+…+a i *T i ,where a1 - a i are preset coefficients determined according to the distribution information of multiple holding areas, T1 - T i are the first temperature information collected by multiple first temperature sensors respectively, and shell qi is the fitted temperature of each holding area.

[0080] In some other embodiments, the fitting module 520 may obtain the fitted temperature in the following manner:

[0081] shell qi =a1*T1+a2*T2+…+a i *T i + a i+1 *T i+1 ,where a1 - a i+1 are preset coefficients determined according to the distribution information of multiple holding areas, T1 - T i are the first temperature information collected by multiple first temperature sensors, T i+1 is the second temperature information collected by the second temperature sensor, and shell qi is the fitted temperature of each holding area.

[0082] The temperature acquisition module 530 is configured to obtain the housing temperature of the electronic device according to the fitted temperatures of multiple holding areas and the distribution information of multiple holding areas. In some embodiments, the temperature acquisition module 530 may obtain the housing temperature of the electronic device in the following manner:

[0083] shell=b1*shell q1 +b2*shell q2 +…+b i *shell qi ,where b1 - b i are weighting coefficients determined according to the distribution information of multiple holding areas, shell qi is the fitted temperature of each holding area, and shell is the housing temperature of the electronic device.

[0084] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the devices and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be described herein again.

[0085] In several embodiments provided in the present application, the coupling between modules can be electrical, mechanical or other forms of coupling.

[0086] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. An electronic device, characterized in that: include: a housing having a plurality of gripping areas; A plurality of first temperature sensors, wherein the plurality of first temperature sensors are disposed in the housing and distributed in a plurality of gripping areas of the housing, and are used to collect temperature information of the plurality of gripping areas as first temperature information; as well as A control unit, wherein the control unit is used to fit the fitting temperature of each of the holding areas according to the first temperature information collected by the multiple first temperature sensors and the distribution information of the multiple holding areas, and to obtain the shell temperature of the electronic device according to the fitting temperatures of the multiple holding areas and the distribution information of the multiple holding areas.

2. The electronic device according to claim 1, characterized in that: The control unit obtains the fitting temperature of each holding area by fitting according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas in the following manner: shell qi =a1*T1+a2*T2+…+a i *T i , where a1-a i is a preset coefficient determined according to the distribution information of the plurality of holding areas, T1-T i The first temperature information collected by the plurality of first temperature sensors is respectively, qi Fitting temperature for each grip zone.

3. The electronic device according to claim 1, characterized in that: The electronic device also includes a mainboard and one or more second temperature sensors, the mainboard is arranged in the shell, the one or more second temperature sensors are used to collect temperature information of the mainboard as second temperature information, and the control unit is used to fit the fitting temperature of each holding area according to the first temperature information and the second temperature information.

4. The electronic device according to claim 3, characterized in that: The control unit obtains the fitting temperature of each holding area by fitting according to the first temperature information and the second temperature information in the following manner: shell qi =a1*T1+a2*T2+…+a i *T i + a i+1 *T i+1 , where a1-a i+1 is a preset coefficient determined according to the distribution information of the plurality of holding areas, T1-T i is the first temperature information collected by the plurality of first temperature sensors, T i+1 The second temperature information collected by the second temperature sensor, shell qi Fitting temperature for each grip zone.

5. The electronic device according to claim 2 or 4, characterized in that: According to the fitting temperatures of the multiple holding areas, the housing temperature of the electronic device is obtained in the following manner: shell=b1*shell q1 +b2*shell q2 +…+b i *shell qi , where b1-b i is a weighting coefficient determined according to the distribution information of the plurality of holding areas, shell qi is the fitting temperature of each holding area, and shell is the shell temperature of the electronic device.

6. The electronic device according to any one of claims 1 to 4, characterized in that: The shell includes a middle frame, a back cover and a display screen, the middle frame includes a frame, the back cover and the display screen are assembled on the frame, the multiple gripping areas include a first gripping area, a second gripping area, a third gripping area and a fourth gripping area located at the corners of the frame, the multiple gripping areas also include a fifth gripping area and a sixth gripping area located on the back cover and a seventh gripping area and an eighth gripping area located on the display screen.

7. A method for measuring temperature of an electronic device, characterized in that: The electronic device comprises a housing and a plurality of first temperature sensors, the housing having a plurality of gripping areas, the plurality of first temperature sensors being arranged in the housing, the plurality of first temperature sensors being distributed in the plurality of gripping areas of the housing, and being used to collect temperature information of the plurality of gripping areas as first temperature information; the method comprising: Acquire first temperature information collected by the plurality of first temperature sensors; fitting to obtain a fitting temperature of each of the holding areas according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas; The housing temperature of the electronic device is obtained according to the fitting temperatures of the plurality of holding areas and the distribution information of the plurality of holding areas.

8. The electronic equipment temperature measurement method according to claim 7, characterized in that: The fitting of obtaining the fitting temperature of each holding area according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas is performed in the following manner: shell qi =a1*T1+a2*T2+…+a i *T i , where a1-a i is a preset coefficient determined according to the distribution information of the plurality of holding areas, T1-T i The first temperature information is collected by the plurality of first temperature sensors respectively, shell qi Fitting temperature for each grip zone.

9. The electronic device temperature measurement method according to claim 7, characterized in that: The electronic device further includes a mainboard and one or more second temperature sensors, wherein the mainboard is disposed in the housing; and fitting to obtain a fitting temperature of each holding area according to the first temperature information collected by the multiple first temperature sensors and the distribution information of the multiple holding areas includes: A fitting temperature of each of the holding areas is obtained by fitting according to the temperature information collected by the multiple first temperature sensors, the second temperature information, and the distribution information of the multiple holding areas.

10. The electronic equipment temperature measurement method according to claim 9, characterized in that: According to the fitting temperatures of the plurality of gripping areas and the distribution information of the plurality of gripping areas, the fitting temperature of each of the gripping areas is obtained by fitting in the following manner: shell qi =a1*T1+a2*T2+…+a i *T i + a i+1 *T i+1 , where a1-a i+1 is a preset coefficient determined according to the distribution information of the plurality of holding areas, T1-T i is the first temperature information collected by the plurality of first temperature sensors, T i+1 The second temperature information collected by the second temperature sensor, shell qi Fitting temperature for each grip zone.

11. The electronic equipment temperature measurement method according to claim 8 or 10, characterized in that: The housing temperature of the electronic device is obtained according to the fitting temperatures of the plurality of holding areas and the distribution information of the plurality of holding areas in the following manner: shell=b1*shell q1 +b2*shell q2 +…+b i *shell qi , where b1-b i is a weighting coefficient determined according to the distribution information of the plurality of holding areas, shell qi is the fitting temperature of each holding area, and shell is the shell temperature of the electronic device.

12. An electronic equipment temperature measuring device, characterized in that: The electronic device comprises a housing and a plurality of first temperature sensors, the housing having a plurality of gripping areas, the plurality of first temperature sensors being arranged in the housing and directly contacting an inner surface of the housing, the plurality of first temperature sensors being distributed in the plurality of gripping areas of the housing, and the plurality of first temperature sensors being used to collect first temperature information; The device comprises: An information acquisition module, used to acquire first temperature information acquired by the plurality of first temperature sensors; A fitting module, configured to obtain a fitting temperature of each of the holding areas by fitting according to the first temperature information collected by the plurality of first temperature sensors and the distribution information of the plurality of holding areas; The temperature acquisition module is used to obtain the housing temperature of the electronic device according to the fitting temperatures of the multiple holding areas and the distribution information of the multiple holding areas.

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