Wafer defect detection equipment for semiconductor processing

Abstract

The invention discloses wafer defect detection equipment for semiconductor processing, and relates to the technical field of wafer defect detection. Comprising a detection box and an operation window formed in the front face of the detection box, and a wafer cleaning mechanism, a wafer drying mechanism, a first defect detection mechanism and a second defect detection mechanism are arranged around a rotating disc; when the turntable carries the wafer clamping mechanism to perform circumferential rotation, the wafer cleaning mechanism and the wafer drying mechanism can be used for cleaning, drying and forming a wafer to be detected in sequence, and the first defect detection mechanism and the second defect detection mechanism are used for performing double-sided defect detection on the cleaned and dried wafer. Therefore, the automatic wafer defect detection process of wafer cleaning, drying and double-sided detection is completed, wafer cleaning, drying and detection are integrated in the same detection device, manual intervention is not needed in the period, the labor cost is reduced, the wafer defect detection efficiency is improved, and the wafer defect detection device can be suitable for wafer batch detection.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer defect detection, and in particular to a wafer defect detection device for semiconductor processing. Background Art

[0002] Wafer defects such as scratches, particles, cracks, etc. will directly affect the electrical performance and reliability of the chip. Through defect detection, unqualified wafers can be removed in time to avoid wasting resources and time in subsequent processes, thereby reducing production costs, improving production efficiency and yield rate, and helping to maintain the consistency of product performance and meet the market demand for high-quality, high-performance chips.

[0003] A visual inspection device and method for surface defects of silicon wafers disclosed in a patent application with reference publication number CN115753817A completes the surface defect inspection of silicon wafers by controlling the unloading component to classify and place the inspected silicon wafers, and then continues to repeat the above actions to continuously perform surface defect inspection on silicon wafers. This design realizes surface defect inspection on both sides of silicon wafers, and classifies and stores silicon wafers with qualified and unqualified inspection results, thereby avoiding manual operation errors and improving the accuracy and efficiency of inspection.

[0004] The above-mentioned wafer defect detection equipment in the prior art has the following defects in actual use: Before testing, wafers generally need to be rinsed with deionized water and dried before defect detection can be performed to eliminate the interference of dust on the wafer surface on defect detection, so that wafer cleaning, drying and detection operations are scattered in multiple processing equipment respectively, resulting in existing wafer defect detection equipment being able to only detect wafers after cleaning, and it is difficult to integrate wafer cleaning, drying and detection operations in the same detection equipment, resulting in a low degree of automation in the wafer defect detection process, increased wafer defect detection time, and low efficiency; Wafer defect detection equipment can only perform defect detection on a single side of the wafer. During the detection period, the wafer needs to be flipped manually or using mechanical equipment to complete double-sided defect detection, which prolongs the detection cycle and cannot meet the needs of large-scale production.

[0005] Therefore, the present invention proposes a wafer defect detection device for semiconductor processing to solve the above problems. Summary of the invention

[0006] In view of the deficiencies of the prior art, the present invention provides a wafer defect detection device for semiconductor processing, which solves the problems that the existing wafer defect detection devices can only detect wafers after cleaning, resulting in the wafer cleaning, drying and detection operations being separately dispersed in multiple processing devices, making it difficult to integrate the wafer cleaning, drying and detection operations in the same detection device, resulting in a low degree of automation in the wafer defect detection process, increasing the wafer defect detection time, low efficiency, and the wafer defect detection device can only detect the defects on one side of the wafer, and it is necessary to manually or use mechanical equipment to flip the wafer during detection to complete the double-sided defect detection, resulting in an extended detection cycle and inability to meet the requirements of large-scale detection.

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions: A wafer defect detection device for semiconductor processing, including a detection box and an operation window opened on its front surface. A protective door is rotatably arranged inside the operation window. A defect imaging system is also arranged on the side wall of the detection box. It further includes: A turntable, rotatably arranged on a tray inside the cavity of the detection box and driven by a servo motor. A plurality of wafer clamping mechanisms for clamping the wafers to be detected are evenly arranged on the top of the turntable. The wafer clamping mechanisms can perform circumferential flipping under the drive of a flipping drive assembly to cooperate in completing the double-sided defect detection of the wafers. A wafer cleaning mechanism, arranged on one side of the top of the tray, for first enclosing the wafers to be detected in a flushing space in cooperation with the wafer clamping mechanisms, and then flushing the upper and lower surfaces of the wafers to be detected with deionized water simultaneously. A wafer drying mechanism, arranged on one side of the wafer cleaning mechanism, for first enclosing the rinsed wafers to be detected in a drying space, and then blowing heated nitrogen gas on the upper and lower surfaces of the wafers simultaneously. A first defect detection mechanism and a second defect detection mechanism, respectively arranged on both sides of the top of the tray, for collecting the image data of the top and bottom of the wafers and transmitting them to the defect imaging system.

[0008] Furthermore, the wafer clamping mechanism includes a clamping carrier and a rotating arm assembly arranged on the outer wall of the clamping carrier. A clamping hoop assembly for positioning the wafers is also arranged at the end of the rotating arm assembly away from the clamping carrier. A driving arm is fixedly arranged on the outer wall of the clamping carrier and above the clamping hoop assembly. An arc-shaped convex block is fixedly arranged at the bottom of the driving arm and at a position opposite to the center of the clamping hoop assembly.

[0009] Further, the rotating arm assembly includes a first support arm fixedly arranged on the outer wall of the clamping and bearing frame. An annular limiting groove is formed at one end of the first support arm, and a rotating damper for increasing the rotation resistance of the clamp assembly is further arranged inside the first support arm. A second support arm is fixedly arranged on the output end of the rotating damper. A support ring is fixedly arranged on the side wall of the second support arm opposite to the first support arm, and the support ring is rotatably arranged inside the annular limiting groove.

[0010] Further, the clamp assembly includes an annular clamping frame and a plurality of installation through grooves uniformly formed on the inner wall of the annular clamping frame. A baffle is fixedly arranged inside each installation through groove, and a clamping arm is further slidably arranged inside each installation through groove. The clamping arm slidably penetrates through the baffle at the corresponding position and extends to the outside. A guide wheel is rotatably arranged at one end of the clamping arm through a wheel frame, and short limiting plates and long limiting plates are respectively fixedly arranged on the upper and lower sides of the end of the clamping arm far away from the guide wheel. A clamping groove for holding the wafer is formed between the short limiting plate and the long limiting plate. A first spring is slidably sleeved on the outer wall of the clamping arm between the wheel frame and the baffle. An annular plate is fixedly sleeved on the lower part of the outer wall of the annular clamping frame, and a driving ring is further slidably sleeved on the upper part of the outer wall of the annular clamping frame. A plurality of wedge-shaped through grooves corresponding to the positions of the guide wheels one by one are formed on the inner wall of the driving ring.

[0011] Further, the inclined inner wall of the wedge-shaped through groove is in close contact with the outer wall of the corresponding guide wheel. A plurality of guide rods are uniformly and fixedly arranged at the bottom of the driving ring. Each guide rod slidably penetrates through the annular plate and extends to the outside. A second spring is slidably sleeved on the outer wall of the guide rod between the driving ring and the annular plate. A plurality of electromagnets are uniformly and fixedly arranged at the top of the second spring, and a plurality of strong magnets corresponding to the positions of the electromagnets one by one are uniformly and fixedly arranged at the top of the driving ring. A transmission pipe is fixedly arranged on the outer wall of the annular plate at the position opposite to the rotating arm assembly through an L-shaped mounting bracket. A gear is fixedly sleeved on the outer wall of the transmission pipe, and a power connection contact is further fixedly arranged at one end of the transmission pipe. The power connection contact is electrically connected to the plurality of electromagnets through a wire.

[0012] Further, the wafer cleaning mechanism includes a cleaning and bearing frame fixedly arranged on the pallet and a first cross-shaped through groove formed inside the cleaning and bearing frame. An upper cleaning component and a lower cleaning component are respectively arranged on the upper and lower sides inside the first cross-shaped through groove, and the upper cleaning component and the lower cleaning component are connected by a first gear; The upper cleaning assembly includes a third support arm slidably disposed inside the first cross-shaped through groove. A upper cleaning cylinder is fixedly provided at the bottom of the third support arm. A first pressing ring is fixedly sleeved below the outer wall of the upper cleaning cylinder. And a plurality of first nozzles are uniformly and fixedly provided inside the upper cleaning cylinder. The plurality of first nozzles are commonly connected to the same upper water supply pipe. On both sides of the top of the third support arm, a first delay trigger switch and a first lifting rod are respectively fixedly provided. The first lifting rod slidably penetrates through the first cross-shaped through groove and is fixedly provided with a first spring baffle. A third spring is slidably sleeved on the outer wall of the first lifting rod between the spring baffle and the cleaning carrier. And a first rack is fixedly provided at the bottom of the third support arm.

[0013] Further, the lower cleaning assembly includes a fourth support arm slidably disposed inside the first cross-shaped through groove. A second rack is fixedly provided at a position on the top of the fourth support arm opposite to the first rack. A lower cleaning cylinder is fixedly provided at the top of the fourth support arm and directly below the upper cleaning cylinder. A plurality of second nozzles are uniformly and fixedly provided at the bottom of the inner cavity of the lower cleaning cylinder. The plurality of second nozzles are commonly and fixedly connected to a lower water supply pipe. A drain hole is further opened at the center position of the bottom of the inner cavity of the lower cleaning cylinder. And a drain pipe communicating with the drain hole is fixedly connected to the bottom of the lower cleaning cylinder. The second rack and the first rack are symmetrically disposed on both sides of a first gear and are both meshed with the first gear.

[0014] Further, the wafer drying mechanism includes a drying carrier fixedly provided on the top of the pallet and a second cross-shaped through groove opened inside the drying carrier. An upper drying assembly and a lower drying assembly are respectively disposed on the upper and lower sides inside the second cross-shaped through groove. The upper drying assembly and the lower drying assembly are connected by a second gear. The upper drying assembly includes a fifth support arm slidably disposed inside the second cross-shaped through groove. A second delay trigger switch and an upper drying cylinder are respectively fixedly provided at the top and bottom of the fifth support arm. A second pressing ring is fixedly sleeved below the outer wall of the upper drying cylinder. And a plurality of first air nozzles are uniformly and fixedly provided inside the upper drying cylinder. The plurality of first air nozzles are commonly and fixedly connected to the same upper air supply pipe. A third rack and a second lifting rod are respectively fixedly provided at the bottom and top of the fifth support arm. The second lifting rod slidably penetrates through the drying carrier and is fixedly provided with a second spring baffle. A fourth spring is slidably sleeved on the outer wall of the second lifting rod between the drying carrier and the second spring baffle.

[0015] Further, the lower drying component includes a sixth support arm slidably disposed inside the second cruciform chute. A fourth rack and a lower drying cylinder are respectively fixedly disposed at the top and bottom of the sixth support arm. A plurality of second air nozzles are uniformly and fixedly disposed at the bottom of the inner cavity of the lower drying cylinder. The plurality of second air nozzles are commonly fixedly connected to the same lower air supply pipe. A plurality of exhaust holes are uniformly formed in the inner wall of the lower drying cylinder. An annular air pipe connected to the plurality of exhaust holes is also fixedly sleeved on the outer wall of the lower drying cylinder.

[0016] Further, the flipping drive component includes an arc bracket and a first arc rack and a second arc rack fixedly disposed on both sides of the top of the arc bracket. An arc-shaped conductive frame is also fixedly disposed on one side of the top of the arc bracket. An arc-shaped conductive groove is formed on the side wall of the arc-shaped conductive frame close to the first arc rack. A conductive metal sheet is fixedly disposed inside the arc-shaped conductive groove.

[0017] The present invention provides a wafer defect detection device for semiconductor processing. Compared with the prior art, the following beneficial effects are achieved: 1. A wafer defect detection device for semiconductor processing. By arranging a wafer cleaning mechanism, a wafer drying mechanism, a first defect detection mechanism and a second defect detection mechanism around a turntable, when the turntable drives the wafer clamping mechanism to rotate circumferentially, the wafer cleaning mechanism and the wafer drying mechanism can be used to clean and dry the wafer to be detected in sequence, and the first defect detection mechanism and the second defect detection mechanism are used to perform double-sided defect detection on the cleaned and dried wafer, so as to complete the automatic wafer defect detection process of wafer cleaning, drying and double-sided detection. The wafer cleaning, drying and detection are integrated in the same detection device, and no manual intervention is required during this period, thereby reducing the labor cost and improving the efficiency of wafer defect detection, and being applicable to batch detection of wafers.

[0018] 2. A wafer defect detection device for semiconductor processing. By setting multiple wafer clamping mechanisms, it can remove the wafers that have completed detection during the rotation and intermittent time of the servo motor during the position switching of the multiple wafer clamping mechanisms, and at the same time, it can place the next wafer to be detected on the wafer clamping mechanism again to continue the detection, enabling the wafer detection process to proceed continuously. Moreover, when the wafer clamping mechanism meets the wafer cleaning mechanism or the wafer drying mechanism, it can automatically drive the upper cleaning component, the lower cleaning component, or the upper drying component, the lower drying component to approach each other, and complete the automatic assembly with the annular clamping frame, so as to form a sealed operation space between the upper cleaning component, the annular clamping frame, the lower cleaning component, or the upper drying component, the annular clamping frame, the lower drying component, avoiding the deionized water or heated nitrogen ejected during wafer cleaning or drying from interfering with the surrounding wafers, greatly improving the detection accuracy of wafer defects. And when the wafer clamping mechanism is assembling with the wafer cleaning mechanism or the wafer drying mechanism, it can automatically trigger the first delay switch or the second delay switch to achieve the effect of delaying the control of the water pump or the air pump operation.

[0019] 3. A wafer defect detection device for semiconductor processing. Through the cooperation of the wafer clamping mechanism, the wafer cleaning mechanism, and the wafer drying mechanism, when the wafer clamping mechanism is in the initial state of lifting the wafer, it can be driven by the wafer cleaning mechanism and the wafer drying mechanism so that the clamping arms at multiple positions can clamp the wafer from multiple positions, making the wafer position more stable during the flushing or drying process, avoiding damage caused by wafer shaking. Secondly, the wafer clamping mechanism can also cooperate with the flipping drive mechanism. After the first defect detection mechanism completes the detection, it can supply power to multiple electromagnets using the arc-shaped conductive groove, fix the wafer before flipping, and can perform a 180-degree flip before reaching the second defect detection mechanism, and flip back to the original position after completing the defect detection on the other side, ensuring the next stable clamping of the wafer by the wafer clamping mechanism on the basis of realizing double-sided detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic three-dimensional structure diagram of the whole invention; Figure 2 It is a schematic structure diagram of the invention in the open state of the operation window; Figure 3 It is a schematic structure diagram of the first state of removing the detection box of the invention; Figure 4 It is a schematic structure diagram of the second state of removing the detection box of the invention; Figure 5 For the present invention Figure 4 The enlarged structure diagram of part A in; Figure 6 It is a schematic structure diagram of the wafer clamping mechanism of the invention; Figure 7 Schematic structural diagram of the disassembled state of the first support arm and the second support arm of the present invention; Figure 8 Of the present invention Figure 7 Schematic enlarged structural diagram of part B therein; Figure 9 Schematic cross-sectional structural diagram of the annular clamping bracket of the present invention; Figure 10 Of the present invention Figure 9 Schematic enlarged structural diagram of part C therein; Figure 11 Schematic structural diagram of the first state of the wafer cleaning mechanism of the present invention; Figure 12 Of the present invention Figure 11 Schematic enlarged structural diagram of part D therein; Figure 13 Schematic structural diagram of the second state of the wafer cleaning mechanism of the present invention; Figure 14 Schematic structural diagram of the wafer drying mechanism of the present invention; Figure 15 Of the present invention Figure 14 Schematic enlarged structural diagram of part E therein; Figure 16 Schematic structural diagram of the second state of the wafer drying mechanism of the present invention; Figure 17 Schematic structural diagram of the assembled state of the wafer clamping mechanism and the wafer drying mechanism of the present invention; Figure 18 Schematic structural diagram of the flipping drive assembly of the present invention; Figure 19 Of the present invention Figure 18 Schematic enlarged structural diagram of part F therein.

[0021] In the figure: 1. Detection box; 2. Operation window; 3. Protection door; 4. Defect imaging system; 5. Turntable; 6. Wafer clamping mechanism; 61. Clamping carrier; 62. First support arm; 63. Annular limiting groove; 64. Rotary damper; 65. Second support arm; 66. Annular clamping frame; 67. Installation through groove; 68. Clamping arm; 69. Guide wheel; 610. Clamping groove; 611. First spring; 612. Annular plate; 613. Driving ring; 614. Wedge-shaped through groove; 615. Guide rod; 616. Second spring; 617. Electromagnet; 618. Strong magnet; 619. Gear; 620. Power connection contact; 621. Driving arm; 622. Arc-shaped convex block; 7. Wafer cleaning mechanism; 71. Cleaning carrier; 72. Third support arm; 73. Upper cleaning cylinder; 74. First pressing ring; 75. Upper water supply pipe; 76. First delay trigger switch; 77. First lifting rod; 78. Third spring; 79. First rack; 710. Fourth support arm; 711. Second rack; 712. Lower cleaning cylinder; 713. Lower water supply pipe; 714. Drain pipe; 715. First gear; 8. Wafer drying mechanism; 81. Drying carrier; 82. Fifth support arm; 83. Upper drying cylinder; 84. Second pressing ring; 85. Upper air supply pipe; 86. Second delay trigger switch; 87. Third rack; 88. Second lifting rod; 89. Fourth spring; 810. Sixth support arm; 811. Fourth rack; 812. Lower drying cylinder; 813. Annular air pipe; 814. Lower air supply pipe; 815. Second gear; 9. First defect detection mechanism; 91. Mounting frame; 92. Visual detection component; 10. Second defect detection mechanism; 11. Flipping drive component; 111. Arc-shaped bracket; 112. First arc-shaped rack; 113. Second arc-shaped rack; 114. Arc-shaped conductive frame; 115. Arc-shaped conductive groove. Specific implementation mode

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] The present invention provides four technical solutions: A wafer defect detection device for semiconductor processing, specifically including the following embodiments: As Figures 1 - 5 The first implementation mode is shown: A wafer defect detection device for semiconductor processing, including a detection box 1 and an operation window 2 opened on its front surface. A protection door 3 is rotatably arranged inside the operation window 2. A defect imaging system 4 is also arranged on the side wall of the detection box 1, and further includes: The turntable 5 is rotatably arranged on the pallet inside the cavity of the detection box 1 and is driven by a servo motor. A plurality of wafer clamping mechanisms 6 for clamping the wafers to be detected are evenly arranged on the top of the turntable 5. The wafer clamping mechanisms 6 can be circumferentially flipped under the drive of the flipping drive assembly 11 to cooperate in the double-sided defect detection of the wafers. The servo motor rotates clockwise at a low speed intermittently according to a preset program, so that each wafer clamping mechanism 6 passes through the wafer cleaning mechanism 7, the wafer drying mechanism 8, the first defect detection mechanism 9 and the second defect detection mechanism 10 in turn. Finally, the wafer clamping mechanism 6 carries the detected wafer back to the operation window 2 position again; The wafer cleaning mechanism 7 is arranged on one side of the top of the pallet and is used to cooperate with the wafer clamping mechanism 6 to first enclose the wafer to be detected in the flushing space and then flush the upper and lower surfaces of the wafer to be detected with deionized water at the same time to remove the impurities on the surface of the wafer to be detected; The wafer drying mechanism 8 is arranged on one side of the wafer cleaning mechanism 7 and is used to first enclose the wafer to be detected after flushing in the drying space and then blow hot nitrogen on the upper and lower surfaces of the wafer at the same time to quickly dry the wafer; The first defect detection mechanism 9 and the second defect detection mechanism 10 are respectively arranged on both sides of the top of the pallet and are used to collect the image data of the top and bottom of the wafer and transmit it to the defect imaging system 4. The structures of the first defect detection mechanism 9 and the second defect detection mechanism 10 are the same. The first defect detection mechanism 9 includes a mounting frame 91 fixedly arranged on the pallet. A visual detection component 92 is fixedly arranged on the side wall of the mounting frame 91. The visual detection component 92 can capture the image of the wafer surface from below the annular clamping frame 66 and transmit the image into the defect imaging system 4.

[0024] As Figures 6 - 10 , Figures 18 - 19 shown in the second embodiment, the wafer clamping mechanism 6 includes a clamping and bearing frame 61 and a rotating arm assembly arranged on the outer wall of the clamping and bearing frame 61. A clamping hoop assembly for positioning the wafer is further arranged at the end of the rotating arm assembly far away from the clamping and bearing frame 61. A driving arm 621 is fixedly arranged on the outer wall of the clamping and bearing frame 61 and above the clamping hoop assembly. An arc-shaped convex block 622 is fixedly arranged at the bottom of the driving arm 621 and at a position opposite to the center position of the clamping hoop assembly.

[0025] In this embodiment, the rotating arm assembly includes a first support arm 62 fixedly arranged on the outer wall of the clamping and carrying frame 61. An annular limiting groove 63 is formed at one end of the first support arm 62. A rotary damper 64 for increasing the rotation resistance of the clamp assembly is further arranged inside the first support arm 62. A second support arm 65 is fixedly arranged on the output end of the rotary damper 64. A support ring is fixedly arranged on the side wall of the second support arm 65 opposite to the first support arm 62, and the support ring is rotatably arranged inside the annular limiting groove 63. The second support arm 65 is of a "U" - shaped structure, and the inner walls of the cavity of the second support arm 65 are respectively connected to the top and bottom of the annular clamping frame 66.

[0026] In this embodiment, the clamp assembly includes an annular clamping frame 66 and a plurality of mounting through grooves 67 uniformly formed on the inner wall of the annular clamping frame 66. A baffle is fixedly arranged inside each mounting through groove 67, and a clamping arm 68 is also slidably arranged inside each mounting through groove 67. The clamping arm 68 slidably penetrates through the baffle at the corresponding position and extends to the outside. A guiding wheel 69 is rotatably arranged at one end of the clamping arm 68 through a wheel frame. Short limiting plates and long limiting plates are respectively fixedly arranged on the upper and lower sides of the end of the clamping arm 68 far away from the guiding wheel 69. A clamping groove 610 for holding the wafer is formed between the short limiting plate and the long limiting plate. A first spring 611 is slidably sleeved on the outer wall of the clamping arm 68 between the wheel frame and the baffle. An annular plate 612 is fixedly sleeved on the lower part of the outer wall of the annular clamping frame 66, and a driving ring 613 is also slidably sleeved on the upper part of the outer wall of the annular clamping frame 66. A plurality of wedge-shaped through grooves 614 corresponding to the positions of the guiding wheels 69 one by one are formed on the inner wall of the driving ring 613. The clamping arm 68 is composed of a long strip-shaped slider and a top rod. The top rod is fixedly arranged at one end of the long strip-shaped slider. The structure of the mounting through groove 67 is adapted to that of the long strip-shaped slider, and the long strip-shaped slider is slidably arranged inside the mounting through groove 67. The top rod can move freely inside the mounting through groove 67. The long strip-shaped slider and the top rod are respectively located on both sides of the baffle. The inclined inner wall of the wedge-shaped through groove 614 is in close contact with the outer wall of the guiding wheel 69 at the corresponding position. A plurality of guiding rods 615 are uniformly fixedly arranged at the bottom of the driving ring 613. Each guiding rod 615 slidably penetrates through the annular plate 612 and extends to the outside. A second spring 616 is slidably sleeved on the outer wall of the guiding rod 615 between the driving ring 613 and the annular plate 612. A plurality of electromagnets 617 are uniformly fixedly arranged at the top of the second spring 616, and a plurality of strong magnets 618 corresponding to the positions of the electromagnets 617 one by one are also uniformly fixedly arranged at the top of the driving ring 613. A transmission pipe is fixedly arranged on the outer wall of the annular plate 612 at the position opposite to the rotating arm assembly through an L-shaped mounting frame. A gear 619 is fixedly sleeved on the outer wall of the transmission pipe, and a power connection contact 620 is also fixedly arranged at one end of the transmission pipe. The power connection contact 620 is electrically connected to the plurality of electromagnets 617 through a wire. The axis of the transmission pipe is on the same straight line as the output shaft of the rotary damper 64.

[0027] In this embodiment, the flipping drive assembly 11 includes an arc-shaped bracket 111, a first arc-shaped rack 112 and a second arc-shaped rack 113 fixedly arranged on both sides of the top of the arc-shaped bracket 111. An arc-shaped conductive frame 114 is also fixedly arranged on one side of the top of the arc-shaped bracket 111. An arc-shaped conductive groove 115 is formed on the side wall of the arc-shaped conductive frame 114 close to the first arc-shaped rack 112. A conductive metal sheet is fixedly arranged inside the arc-shaped conductive groove 115. During the rotation of the synchronous turntable 5, the gear 619 will respectively meet and engage with the first arc-shaped rack 112 and the second arc-shaped rack 113. At the same time, the electrical contact 620 slides into the inside of the arc-shaped conductive groove 115. Moreover, both the first arc-shaped rack 112 and the second arc-shaped rack 113 can respectively drive the gear 619 to rotate 180 degrees. One end of the arc-shaped conductive groove 115 protrudes from the arc-shaped bracket 111, and electric energy can be transmitted to the electrical contact 620 through the arc-shaped conductive groove 115 first.

[0028] As Figures 11 - 13 The third implementation manner is shown. The wafer cleaning mechanism 7 includes a cleaning carrier 71 fixedly arranged on the pallet and a first cross-shaped through groove formed inside the cleaning carrier 71. An upper cleaning component and a lower cleaning component are respectively arranged on the upper and lower sides inside the first cross-shaped through groove. The upper cleaning component and the lower cleaning component are connected by a first gear 715.

[0029] In this embodiment, the upper cleaning component includes a third support arm 72 slidably arranged inside the first cross-shaped through groove. A upper cleaning cylinder 73 is fixedly arranged at the bottom of the third support arm 72. A first pressing ring 74 is fixedly sleeved below the outer wall of the upper cleaning cylinder 73. A plurality of first nozzles are evenly and fixedly arranged inside the upper cleaning cylinder 73. The plurality of first nozzles are commonly connected to the same upper water supply pipe 75. First delay trigger switches 76 and first lifting rods 77 are respectively fixedly arranged on both sides of the top of the third support arm 72. The first lifting rods 77 slidably penetrate through the first cross-shaped through groove and are fixedly provided with first spring baffles. A third spring 78 is slidably sleeved on the outer wall of the first lifting rods 77 between the spring baffles and the cleaning carrier 71. Moreover, a first rack 79 is fixedly arranged at the bottom of the third support arm 72. The first delay trigger switch 76 is located at the center of the top of the upper cleaning cylinder 73. During the rotation of the synchronous turntable 5, the arc-shaped bump 622 will meet the first delay trigger switch 76 and move downward a preset distance under the thrust of the arc-shaped bump 622. The top of the first pressing ring 74 faces the top of the driving ring 613. The top and bottom of the annular clamping frame 66 respectively face the bottom of the upper cleaning cylinder 73 and the top of the lower cleaning cylinder 712. Sealing gaskets are fixedly arranged on both the top and bottom of the annular clamping frame 66 to prevent the leakage of deionized water. In this embodiment, the lower cleaning assembly includes a fourth support arm 710 slidably disposed inside the first cross-shaped through groove. A second rack 711 is fixedly disposed at a position on the top of the fourth support arm 710 opposite to the first rack 79. A lower cleaning cylinder 712 is fixedly disposed at the top of the fourth support arm 710 and directly below the upper cleaning cylinder 73. A plurality of second nozzles are uniformly fixedly disposed at the bottom of the inner cavity of the lower cleaning cylinder 712. The plurality of second nozzles are commonly fixedly connected to a lower water supply pipe 713. A drain hole is further formed at the center of the bottom of the inner cavity of the lower cleaning cylinder 712. A drain pipe 714 communicating with the drain hole is fixedly connected to the bottom of the lower cleaning cylinder 712. The second rack 711 and the first rack 79 are symmetrically disposed on both sides of the first gear 715 and are both meshed with the first gear 715. One ends of the upper water supply pipe 75 and the lower water supply pipe 713 are both connected to an external water pump. The water pump is used to pump deionized water and supply it to the first nozzles and the second nozzles inside the upper cleaning cylinder 73 and the lower cleaning cylinder 712. The first delay trigger switch 76 is used to control the water pump to start and operate for a preset time. The drain pipe 714 is connected to an external waste water tank; As Figures 14 - 17 The fourth embodiment is shown. The wafer drying mechanism 8 includes a drying carrier 81 fixedly disposed on the top of the pallet and a second cross-shaped through groove formed inside the drying carrier 81. An upper drying assembly and a lower drying assembly are respectively disposed on the upper and lower sides inside the second cross-shaped through groove. The upper drying assembly and the lower drying assembly are connected by a second gear 815.

[0030] In this embodiment, the upper drying assembly includes a fifth support arm 82 slidably disposed inside the second cross-shaped through groove. A second delay trigger switch 86 and an upper drying cylinder 83 are respectively fixedly disposed at the top and bottom of the fifth support arm 82. A second pressure ring 84 is fixedly sleeved below the outer wall of the upper drying cylinder 83. A plurality of first air nozzles are uniformly fixedly disposed inside the upper drying cylinder 83. The plurality of first air nozzles are commonly fixedly connected to the same upper air supply pipe 85. A third rack 87 and a second lifting rod 88 are respectively fixedly disposed at the bottom and top of the fifth support arm 82. The second lifting rod 88 slidably penetrates through the drying carrier 81 and is fixedly provided with a second spring baffle. A fourth spring 89 is slidably sleeved on the outer wall of the second lifting rod 88 between the drying carrier 81 and the second spring baffle.

[0031] In this embodiment, the lower drying assembly includes a sixth support arm 810 slidably disposed inside the second cruciform chute. A fourth rack 811 and a lower drying cylinder 812 are respectively fixed to the top and bottom of the sixth support arm 810. A plurality of second air nozzles are evenly fixed to the bottom of the inner cavity of the lower drying cylinder 812. The plurality of second air nozzles are commonly and fixedly connected to the same lower air supply pipe 814. A plurality of exhaust holes are evenly formed in the inner wall of the lower drying cylinder 812. An annular air pipe 813 connected to the plurality of exhaust holes is also fixedly sleeved on the outer wall of the lower drying cylinder 812. A drainage pipe is also fixedly disposed on the outer wall of the annular air pipe 813. The drainage pipe penetrates through the detection box 1 and is connected to an external air pump. Both the lower air supply pipe 814 and the upper air supply pipe 85 are connected to an external air pump. The air pump is used to supply heated nitrogen to both the upper air supply pipe 85 and the lower air supply pipe 814 simultaneously. The third rack 87 and the fourth rack 811 are symmetrically disposed on both sides of the second gear 815, and both the third rack 87 and the fourth rack 811 are meshed with the second gear 815. During the rotation process, the arc-shaped convex block 622 will meet the second delay trigger switch 86 and can push the second delay trigger switch 86 downward by a preset distance to control the air pump to work for a preset time.

[0032] During use, first place the wafer to be detected on the long limit plate in the plurality of clamping grooves 610 through the operation window 2. Multiple positions at the bottom of the wafer to be detected are supported by the long limit plate and can be stably placed. Then, control the servo motor through the peripheral controller to drive the turntable 5 to rotate according to a preset program. The turntable 5 drives one of the wafer clamping mechanisms 6 loaded with the wafer to be detected to move to meet the wafer cleaning mechanism 7. At this time, the annular clamping frame 66 is located between the upper cleaning cylinder 73 and the lower cleaning cylinder 712, and the center position of the annular clamping frame 66 coincides with the axes of the upper cleaning cylinder 73 and the lower cleaning cylinder 712. When the wafer clamping mechanism 6 and the wafer cleaning mechanism 7 meet, the arc-shaped convex block 622 meets and triggers the first delay trigger switch 76 to turn on. While moving downward, the arc-shaped convex block 622 also pushes the first delay trigger switch 76 downward. Until the lowest point of the arc at the bottom of the arc-shaped convex block 622 contacts the top of the first delay trigger switch 76, the annular clamping frame 66 reaches the preset position. Since the second rack 711 and the first rack 79 are both meshed and connected to the first gear 715, while the third support arm 72 moves downward synchronously with the first delay trigger switch 76, the fourth support arm 710 moves upward synchronously under the drive of the first gear 715. Thus, the upper cleaning cylinder 73 and the lower cleaning cylinder 712 simultaneously move closer to the position of the annular clamping frame 66. Since the bottom of the first pressing ring 74 protrudes slightly from the upper cleaning cylinder 73, the first pressing ring 74 contacts the driving ring 613 before the upper cleaning cylinder 73, and the driving ring 613 gradually moves downward under the downward thrust of the first pressing ring 74. The inclined planes on the inner slopes of the wedge-shaped through grooves 614 at multiple positions push the guide wheels 69 at the corresponding positions to move a preset distance, and the plurality of clamping arms 68 gradually move closer to the center position of the annular clamping frame 66. At this time, the clamping grooves 610 at multiple positions simultaneously apply a force to the side wall of the wafer to further clamp the wafer. Since buffer pads are provided on the inner walls of the clamping grooves 610, the side wall of the wafer can be protected. After the bottom of the upper cleaning cylinder 73 and the top of the lower cleaning cylinder 712 are tightly connected to the annular clamping frame 66, the delay time of the first delay trigger switch 76 ends. The water pump extracts deionized water and enters the upper cleaning cylinder 73 and the lower cleaning cylinder 712 through the upper water supply pipe 75 and the lower water supply pipe 713 respectively, and is sprayed out through the first nozzles and the second nozzles inside the upper cleaning cylinder 73 and the lower cleaning cylinder 712. The deionized water simultaneously flushes the top and the bottom of the wafer. The wastewater flushed down enters the drain pipe 714 through the drain hole at the center position of the lower cleaning cylinder 712 and is output to the wastewater tank outside the detection box 1 through the drain pipe 714; After the delay time of the first delay trigger switch (76) ends, the servo motor drives the turntable 5 to rotate at a low speed again. At this time, the top of the first delay trigger switch 76 slides from the lowest point at the bottom of the arc-shaped convex block 622 to a higher position. The first lifting rod 77 moves upward under the elastic force of the third spring 78. While the third support arm 72 moves upward, it pushes the second rack 711 to move downward synchronously through the first gear 715 until the upper cleaning cylinder 73 and the lower cleaning cylinder 712 return to their original positions; The wafer clamping mechanism 6 continues to rotate until it meets the wafer drying mechanism 8, that is, the annular clamping frame 66 is in the position between the upper drying cylinder 83 and the lower drying cylinder 812. Since the second pressure ring 84 protrudes slightly from the bottom of the upper drying cylinder 83, the second pressure ring 84 pushes the driving ring 613 to move downward. While the driving ring 613 moves downward, it pushes the clamping arms 68 at multiple positions to move towards each other, applying clamping forces to the side walls of the wafer simultaneously from multiple positions. This clamping process is the same as the operation when it meets the wafer cleaning mechanism 7. At the same time, the arc-shaped convex block 622 touches the second delay trigger switch 86 to turn it on, and the second delay trigger switch 86 moves downward synchronously with the upper drying cylinder 83 under the push of the arc-shaped convex block 622. Since the third rack 87 and the fourth rack 811 are both meshed with the second gear 815, the lower drying cylinder 812 moves upward synchronously while the upper drying cylinder 83 moves downward until the top and bottom of the annular clamping frame 66 are in close contact with the bottom and top of the upper drying cylinder 83 and the lower drying cylinder 812 respectively. After the delay time of the second delay trigger switch 86 ends, the air pump is controlled to input the heated nitrogen gas into the upper drying cylinder 83 and the lower drying cylinder 812 at the corresponding positions through the upper air supply pipe 85 and the lower air supply pipe 814 respectively. The nitrogen gas blows over the top and bottom of the wafer through the first air nozzle and the second air nozzle. The deionized water remaining on the surface of the wafer quickly evaporates under the action of the hot nitrogen gas, and the water vapor is pumped out of the detection box 1 by the air extraction pump through the annular air pipe 813; After the time for the second delay trigger switch 86 to control the air pump ends, the servo motor drives the turntable 5 to rotate again, and the wafer clamping mechanism 6 first meets the No. 1 defect detection mechanism 9 when rotating. The visual detection component 92 in the No. 1 defect detection mechanism 9 obtains the image of the bottom of the wafer and transmits the image to the defect imaging system 4 for defect analysis. When the wafer clamping mechanism 6 continues to rotate to the front of the No. 2 defect detection mechanism 10, the electrical contact 620 first slides into the arc-shaped conductive groove 115 and is electrically connected to the conductive metal sheet in the arc-shaped conductive groove 115. The electrical energy is transmitted to the electromagnets 617 at multiple positions through the wire. The electromagnet 617 is energized to generate magnetic force and attract the strong magnet 618 downward. The strong magnets 618 at multiple positions simultaneously drive the drive ring 613 to move downward, so that the clamping grooves 610 at multiple positions clamp the side wall of the wafer again. This clamping process meets the wafer cleaning mechanism 7 and the wafer clamping mechanism 6. The process of clamping the wafer is the same, and then the gear 619 and the first arc-shaped rack 112 meet and complete the meshing. During the connection between the gear 619 and the first arc-shaped rack 112, the first arc-shaped rack 112 drives the gear 619 to rotate 180 degrees, and the annular clamping frame 66 as a whole also rotates 180 degrees synchronously. Due to the rotational resistance of the rotation damper 64 between the first support arm 62 and the second support arm 65, the top of the annular clamping frame 66 can maintain a stable horizontal state after rotating 180 degrees. The visual inspection component 92 in the No. 2 defect detection mechanism 10 is located between the first arc-shaped rack 112 and the second arc-shaped rack 113. After the annular clamping frame 66 is loaded with the wafer and rotated 180 degrees, it moves to the bottom of the visual inspection component 92 in the No. 2 defect detection mechanism 10. The visual inspection component 92 at this position obtains an image of the top of the wafer and transmits the image to the defect imaging system 4 for defect analysis; The turntable 5 drives the wafer clamping mechanism 6 to pass through the No. 2 defect detection mechanism 10 and then returns to the original position, that is, stops near the operation window 2. During the stop of the turntable 5, the detected wafer can be removed, and the wafer defect detection process can be continued after the wafer to be detected is replaced.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer defect detection device for semiconductor processing, comprising a detection box and an operation window opened on the front thereof, wherein a protective door is rotatably arranged inside the operation window, and a defect imaging system is also arranged on the side wall of the detection box, characterized in that: Also includes: A turntable is rotatably arranged on a support plate inside the detection box cavity and driven by a servo motor. A plurality of wafer clamping mechanisms for clamping wafers to be detected are evenly arranged on the top of the turntable. The wafer clamping mechanisms can be turned in a circle under the drive of a turning drive assembly to cooperate in completing double-sided defect detection of the wafer. The wafer cleaning mechanism is arranged on one side of the top of the support plate, and is used to cooperate with the wafer clamping mechanism to first seal the wafer to be inspected in the washing space, and then use deionized water to wash the upper and lower surfaces of the wafer to be inspected at the same time; The wafer drying mechanism is arranged on one side of the wafer cleaning mechanism, and is used to first seal the rinsed wafer to be inspected in a drying space, and then blow heated nitrogen gas to the upper and lower surfaces of the wafer at the same time; Defect detection mechanism No. 1 and defect detection mechanism No. 2 are respectively arranged on both sides of the top of the pallet, and are used to collect image data of the top and bottom of the wafer and transmit them to the defect imaging system.

2. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The wafer clamping mechanism includes a clamping carrier and a rotating arm assembly arranged on the outer wall of the clamping carrier. A clamp assembly for positioning the wafer is also arranged at one end of the rotating arm assembly away from the clamping carrier. A driving arm is fixedly arranged on the outer wall of the clamping carrier and above the clamp assembly. An arc-shaped protrusion is fixedly arranged at the bottom of the driving arm and at a position opposite to the center position of the clamp assembly.

3. The semiconductor processing wafer defect detection device according to claim 2, characterized in that: The rotating arm assembly includes a first support arm fixedly arranged on the outer wall of the clamping support frame, an annular limit groove is opened at one end of the first support arm, and a rotation damper for increasing the rotation resistance of the clamp assembly is also arranged inside the first support arm, and a second support arm is also fixedly arranged on the output end of the rotation damper, and a support ring is fixedly arranged on the side wall of the second support arm relative to the first support arm, and the support ring is rotatably arranged inside the annular limit groove.

4. The semiconductor processing wafer defect detection device according to claim 2, characterized in that: The clamp assembly includes an annular clamping frame and a plurality of mounting slots evenly opened on the inner wall of the annular clamping frame, each of the mounting slots being fixedly provided with a baffle, and a clamping arm being slidably provided inside each of the mounting slots, the clamping arm slidingly passing through the baffle at the corresponding position and extending to the outside, one end of the clamping arm being provided with a guide wheel through the rotation of the wheel frame, and a short limit plate and a long limit plate being fixedly provided on the upper and lower sides of the end of the clamping arm away from the guide wheel, a clamping groove for lifting the wafer is formed between the short limit plate and the long limit plate, an outer wall of the clamping arm and a sliding sleeve provided with a first spring between the wheel frame and the baffle, an annular plate is also fixedly provided under the outer wall of the annular clamping frame, and a driving ring is also slidably provided above the outer wall of the annular clamping frame, and a plurality of wedge-shaped slots corresponding to the positions of the guide wheels are opened on the inner wall of the driving ring.

5. The semiconductor processing wafer defect detection device according to claim 4, characterized in that: The inclined inner wall of the wedge-shaped through groove is in close contact with the outer wall of the guide wheel at the corresponding position, and a plurality of guide rods are evenly fixedly arranged on the bottom of the driving ring, and each of the guide rods slides through the annular plate and extends to the outside, and a second spring is slidably sleeved on the outer wall of the guide rod and located between the driving ring and the annular plate, and a plurality of electromagnets are evenly fixedly arranged on the top of the second spring, and a plurality of strong magnets corresponding to the positions of the electromagnets are also evenly fixedly arranged on the top of the driving ring, and a transmission tube is fixedly arranged on the outer wall of the annular plate and at a position opposite to the rotating arm assembly through an L-shaped mounting frame, a gear is fixedly sleeved on the outer wall of the transmission tube, and an electrical contact is also fixedly arranged on one end of the transmission tube, and the electrical contact and the plurality of electromagnets are electrically connected through a wire.

6. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The wafer cleaning mechanism comprises a cleaning carrier fixedly arranged on the support plate and a No. 1 cross-shaped through slot opened inside the cleaning carrier, an upper cleaning assembly and a lower cleaning assembly are respectively arranged on the upper and lower sides of the No. 1 cross-shaped through slot, and the upper cleaning assembly and the lower cleaning assembly are connected by a first gear; The upper cleaning assembly includes a third support arm slidably arranged inside the No. 1 cross-shaped through groove, an upper cleaning cylinder is fixedly arranged at the bottom of the third support arm, a first pressure ring is fixedly sleeved at the lower part of the outer wall of the upper cleaning cylinder, and a plurality of No. 1 nozzles are evenly fixedly arranged inside the upper cleaning cylinder, and the plurality of No. 1 nozzles are commonly connected to the same upper water supply pipe, a first delay trigger switch and a first lifting rod are also fixedly arranged on both sides of the top of the third support arm, the first lifting rod slides through the No. 1 cross-shaped through groove and is fixedly arranged with a No. 1 spring baffle, a third spring is slidably sleeved on the outer wall of the first lifting rod and located between the spring baffle and the cleaning carrier, and a first rack is also fixedly arranged at the bottom of the third support arm.

7. The semiconductor processing wafer defect detection device according to claim 6, characterized in that: The lower cleaning assembly includes a fourth support arm slidably arranged inside the No. 1 cross-shaped through groove, a second rack is fixedly arranged at a position on the top of the fourth support arm relative to the first rack, a lower cleaning cylinder is fixedly arranged at the top of the fourth support arm and directly below the upper cleaning cylinder, a No. 2 nozzle is evenly fixedly arranged at the bottom of the inner cavity of the lower cleaning cylinder, and a plurality of No. 2 nozzles are commonly and fixedly connected to a lower water supply pipe, a drainage hole is also opened at the center position of the bottom of the inner cavity of the lower cleaning cylinder, and a drainage pipe connected to the drainage hole is also fixedly connected to the bottom of the lower cleaning cylinder, the second rack and the first rack are symmetrically arranged on both sides of the first gear, and are both meshingly connected to the first gear.

8. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The wafer drying mechanism comprises a drying carrier fixedly arranged on the top of the support plate and a second cross-shaped through slot opened inside the drying carrier, an upper drying assembly and a lower drying assembly are respectively arranged on the upper and lower sides of the second cross-shaped through slot, and the upper drying assembly and the lower drying assembly are connected by a second gear; The upper drying assembly includes a fifth support arm slidably arranged in a No. 2 cross-shaped through groove, and a second delayed trigger switch and an upper drying cylinder are fixedly arranged on the top and bottom of the fifth support arm respectively, and a second pressure ring is fixedly sleeved under the outer wall of the upper drying cylinder, and a plurality of No. 1 air nozzles are evenly fixedly arranged inside the upper drying cylinder, and the plurality of No. 1 air nozzles are commonly fixedly connected to the same upper air supply pipe, and a third rack and a second lifting rod are fixedly arranged on the bottom and top of the fifth support arm respectively, the second lifting rod slides through the drying carrier frame and is fixedly arranged with a No. 2 spring baffle, and a fourth spring is slidably sleeved on the outer wall of the second lifting rod and located between the drying carrier frame and the No. 2 spring baffle.

9. The semiconductor processing wafer defect detection device according to claim 8, characterized in that: The lower drying component includes a sixth support arm slidably arranged inside the No. 2 cross-shaped slide groove, and the top and bottom of the sixth support arm are respectively fixedly provided with a fourth rack and a lower drying cylinder, and the bottom of the inner cavity of the lower drying cylinder is evenly fixedly provided with a plurality of No. 2 air nozzles, and the plurality of No. 2 air nozzles are commonly fixedly connected to the same lower air supply pipe, and a plurality of exhaust holes are evenly opened on the inner wall of the lower drying cylinder, and an annular air pipe connected to the plurality of exhaust holes is also fixedly sleeved on the outer wall of the lower drying cylinder.

10. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The flip drive assembly includes an arc-shaped bracket and a first arc-shaped rack and a second arc-shaped rack fixedly arranged on both sides of the top of the arc-shaped bracket. An arc-shaped conductive frame is also fixedly arranged on one side of the top of the arc-shaped bracket. An arc-shaped conductive groove is opened on the side wall of the arc-shaped conductive frame close to the first arc-shaped rack, and a conductive metal sheet is fixedly arranged inside the arc-shaped conductive groove.

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