Wafer defect inspection apparatus for semiconductor processing

Abstract

The application discloses a wafer defect detection equipment for semiconductor processing and relates to the technical field of wafer defect detection. The wafer defect detection equipment comprises a detection box and an operation window formed on the front face of the detection box. A wafer cleaning mechanism, a wafer drying mechanism, a first defect detection mechanism and a second defect detection mechanism are arranged around a rotating disc. When the rotating disc carrying a wafer clamping mechanism rotates in a circle, the wafer cleaning mechanism and the wafer drying mechanism can be used to sequentially clean, dry and form the wafer to be detected. The first defect detection mechanism and the second defect detection mechanism are used to detect the double-side defects of the wafer after cleaning and drying. Thus, the automatic wafer defect detection process of wafer cleaning, drying and double-side detection is completed. The wafer cleaning, drying and detection are integrated in the same detection equipment, and no manual intervention is needed during the process. Therefore, the labor cost is reduced, the wafer defect detection efficiency is improved, and the wafer batch detection can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer defect detection, in particular to a wafer defect detection equipment for semiconductor processing. BACKGROUND

[0002] Wafer defects such as scratches, particles, cracks, etc. can directly affect the electrical performance and reliability of chips. Through defect detection, unqualified wafers can be removed in time to avoid wasting resources and time in subsequent processes, thereby reducing production costs, improving production efficiency and yield, and helping to maintain product performance consistency to meet market demand for high-quality, high-performance chips.

[0003] Referring to the visual detection equipment and method for surface defects of a silicon wafer disclosed in patent application No. CN115753817A, the detected silicon wafers are classified and placed by controlling the discharging assembly, completing the detection of surface defects of the silicon wafers, and then repeating the above actions to continuously detect the surface defects of the silicon wafers. This design realizes surface defect detection of both sides of the silicon wafer and classifies and stores the silicon wafers with qualified and unqualified detection results, avoiding manual operation errors and improving the accuracy and efficiency of detection.

[0004] The wafer defect detection equipment in the prior art has the following defects in actual use:

[0005] Before detection, the wafer generally needs to be cleaned with deionized water and dried to exclude the interference of dust on the wafer surface on defect detection, so that the wafer cleaning, drying and detection operations are dispersed in multiple processing equipment, resulting in that the existing wafer defect detection equipment can only detect the cleaned wafer, and it is difficult to integrate the wafer cleaning, drying and detection operations in the same detection equipment, so that the wafer defect detection process has low automation degree, increases the wafer defect detection time and has low efficiency.

[0006] The wafer defect detection equipment can only detect defects on one side of the wafer, and manual or mechanical equipment is needed to flip the wafer during detection to complete double-sided defect detection, resulting in prolonged detection period and inability to meet the needs of mass production.

[0007] Therefore, the present application provides a wafer defect detection equipment for semiconductor processing to solve the above problems. SUMMARY

[0008] In view of the defects of the prior art, the wafer defect detection equipment for semiconductor processing provided by the present application solves the problem that the existing wafer defect detection equipment can only detect the wafer after cleaning, so that the wafer cleaning, drying and detection operations are dispersed in multiple processing equipment, it is difficult to integrate the wafer cleaning, drying and detection operations in the same detection equipment, the wafer defect detection process has low automation degree, the wafer defect detection time is increased, the efficiency is low, and the wafer defect detection equipment can only detect the defects on one side of the wafer, so that the wafer needs to be turned over manually or by using a mechanical device during detection to complete the double-sided defect detection, the detection period is prolonged, and the problem that the demand for large-scale detection cannot be met is solved.

[0009] To achieve the above object, the present application is implemented by the following technical scheme: a wafer defect detection equipment for semiconductor processing, comprising a detection box and an operation window opened on the front face thereof, a protective door is rotatably arranged inside the operation window, a defect imaging system is further arranged on the side wall of the detection box, and the wafer defect detection equipment further comprises:

[0010] A turntable is rotatably arranged on the supporting plate inside the cavity of the detection box and is driven by a servo motor, a plurality of wafer clamping mechanisms for clamping the wafer to be detected are uniformly arranged on the top of the turntable, the wafer clamping mechanisms can be circumferentially turned under the driving of the turning driving assembly, so as to cooperate with the completion of the double-sided defect detection of the wafer;

[0011] A wafer cleaning mechanism is arranged on one side of the top of the supporting plate, which is used for sealing the wafer to be detected in the flushing space in cooperation with the wafer clamping mechanism, and then flushing the upper surface and the lower surface of the wafer to be detected with deionized water at the same time;

[0012] A wafer drying mechanism is arranged on one side of the wafer cleaning mechanism, which is used for sealing the flushed wafer to be detected in the drying space first, and then blowing the upper surface and the lower surface of the wafer with heated nitrogen gas at the same time;

[0013] A first defect detection mechanism and a second defect detection mechanism are arranged on the top of the supporting plate on both sides, respectively, which are used for collecting image data of the top and the bottom of the wafer and transmitting the image data to the defect imaging system.

[0014] Further, the wafer clamping mechanism comprises a clamping carrier and a rotating arm assembly arranged on the outer wall of the clamping carrier, a clamp assembly for positioning the wafer is further arranged on the end of the rotating arm assembly away from the clamping carrier, a driving arm is fixedly arranged on the outer wall of the clamping carrier and above the clamp assembly, and an arc-shaped protrusion is fixedly arranged on the bottom of the driving arm and at a position opposite to the center position of the clamp assembly.

[0015] Further, the rotating arm assembly comprises a first supporting arm fixed on the outer wall of the clamping carrier, one end of the first supporting arm is provided with an annular limiting groove, and the inner part of the first supporting arm is further provided with a rotating damper for increasing the rotating resistance of the clamp assembly, the output end of the rotating damper is further fixed with a second supporting arm, and the second supporting arm is fixed on the side wall of the first supporting arm and is provided with a supporting ring, which is rotatably arranged in the annular limiting groove.

[0016] Further, the clamp assembly comprises an annular clamping carrier and a plurality of installation through grooves uniformly arranged on the inner wall of the annular clamping carrier, the inner part of each installation through groove is fixed with a baffle, and the inner part of each installation through groove is further slidably provided with a clamping arm, the clamping arm slides through the baffle at the corresponding position and extends to the outside, one end of the clamping arm is rotatably provided with a guide wheel through a wheel frame, and the other end of the clamping arm away from the guide wheel is fixed with a short limiting plate and a long limiting plate on the upper and lower sides respectively, a clamping groove for lifting the wafer is formed between the short limiting plate and the long limiting plate, a first spring is slidably sleeved on the outer wall of the clamping arm between the wheel frame and the baffle, a ring plate is fixedly sleeved below the outer wall of the annular clamping carrier, and a driving ring is slidably sleeved above the outer wall of the annular clamping carrier, a plurality of wedge-shaped through grooves corresponding to the positions of the guide wheels are arranged on the inner wall of the driving ring.

[0017] Further, the inclined inner wall of the wedge-shaped through groove is in close contact with the outer wall of the guide wheel at the corresponding position, a plurality of guide rods are uniformly fixed on the bottom of the driving ring, each guide rod slides through the ring plate and extends to the outside, a second spring is slidably sleeved on the outer wall of the guide rod between the driving ring and the ring plate, a plurality of electromagnets are uniformly fixed on the top of the second spring, and a plurality of powerful magnets corresponding to the positions of the electromagnets are uniformly fixed on the top of the driving ring, a transmission pipe is fixedly arranged on the outer wall of the ring plate at the position opposite to the rotating arm assembly through an L-shaped mounting bracket, a gear is fixedly sleeved on the outer wall of the transmission pipe, and an electric contact is fixed at one end of the transmission pipe, the electric contact and the plurality of electromagnets are electrically connected through wires.

[0018] Further, the wafer cleaning mechanism comprises a cleaning carrier fixed on the supporting plate and a first cross-shaped through groove arranged in the cleaning carrier, the inner part of the first cross-shaped through groove is provided with an upper cleaning assembly and a lower cleaning assembly on the upper and lower sides respectively, and the upper cleaning assembly and the lower cleaning assembly are connected through a first gear;

[0019] The upper cleaning assembly comprises a third supporting arm slidingly arranged in the first cross-shaped through slot, the bottom of the third supporting arm is fixedly provided with an upper cleaning cylinder, the outer wall of the upper cleaning cylinder is fixedly sleeved with a first pressing ring below, the inside of the upper cleaning cylinder is uniformly fixedly provided with a plurality of first nozzles, the plurality of first nozzles are commonly connected with a same upper water supply pipe, the top of the third supporting arm is further fixedly provided with a first delay trigger switch and a first lifting rod on the two sides respectively, the first lifting rod slidingly penetrates the first cross-shaped through slot and is fixedly provided with a first spring baffle, the outer wall of the first lifting rod and between the spring baffle and the cleaning carrier are slidingly sleeved with a third spring, and the bottom of the third supporting arm is further fixedly provided with a first rack.

[0020] Further, the lower cleaning assembly comprises a fourth supporting arm slidingly arranged in the first cross-shaped through slot, the top of the fourth supporting arm is fixedly provided with a second rack opposite the position of the first rack, the top of the fourth supporting arm and directly below the upper cleaning cylinder is fixedly provided with a lower cleaning cylinder, the inner cavity of the lower cleaning cylinder is uniformly fixedly provided with a plurality of second nozzles, the plurality of second nozzles are commonly fixedly connected with a lower water supply pipe, the inner cavity of the lower cleaning cylinder is further provided with a drain hole at the center position of the bottom, and the bottom of the lower cleaning cylinder is further fixedly connected with a drain pipe communicated with the drain hole, the second rack and the first rack are symmetrically arranged on the two sides of the first gear and are in meshing connection with the first gear.

[0021] Further, the wafer drying mechanism comprises a drying carrier fixedly arranged at the top of the supporting plate and a second cross-shaped through slot opened in the drying carrier, the inside of the second cross-shaped through slot is provided with an upper drying assembly and a lower drying assembly on the upper and lower sides respectively, the upper drying assembly and the lower drying assembly are connected through a second gear;

[0022] The upper drying assembly comprises a fifth supporting arm slidingly arranged in the second cross-shaped through slot, the top and the bottom of the fifth supporting arm are fixedly provided with a second delay trigger switch and an upper drying cylinder respectively, the outer wall of the upper drying cylinder is further fixedly sleeved with a second pressing ring below, and the inside of the upper drying cylinder is uniformly fixedly provided with a plurality of first air nozzles, the plurality of first air nozzles are commonly fixedly connected with a same upper air supply pipe, the bottom and the top of the fifth supporting arm are fixedly provided with a third rack and a second lifting rod respectively, the second lifting rod slidingly penetrates the drying carrier and is fixedly provided with a second spring baffle, the outer wall of the second lifting rod and between the drying carrier and the second spring baffle are slidingly sleeved with a fourth spring.

[0023] Further, the lower drying assembly comprises a sixth supporting arm slidingly arranged in the No. 2 cross-shaped sliding groove, the top and bottom of the sixth supporting arm are fixedly provided with a fourth rack and a lower drying cylinder respectively, the inner cavity bottom of the lower drying cylinder is uniformly fixedly provided with a plurality of No. 2 air nozzles, the plurality of No. 2 air nozzles are fixedly connected with the same lower air supply pipe, a plurality of exhaust holes are uniformly formed in the inner wall of the lower drying cylinder, and the outer wall of the lower drying cylinder is further fixedly sleeved with an annular air pipe connected with the plurality of exhaust holes.

[0024] Further, the turnover driving assembly comprises an arc-shaped bracket and first and second arc-shaped racks fixedly arranged at the top of the arc-shaped bracket, and the top of the arc-shaped bracket is further fixedly provided with an arc-shaped conductive frame, an arc-shaped conductive groove is formed in the side wall of the arc-shaped conductive frame close to the first arc-shaped rack, and a conductive metal sheet is fixedly arranged in the arc-shaped conductive groove.

[0025] The application provides a wafer defect detection equipment for semiconductor processing.

[0026] 1. A wafer defect detection equipment for semiconductor processing, by arranging a wafer cleaning mechanism, a wafer drying mechanism, a No. 1 defect detection mechanism and a No. 2 defect detection mechanism around a turntable, when the turntable carrying a wafer clamping mechanism rotates in a circle, the wafer cleaning mechanism and the wafer drying mechanism can be used to clean and dry the wafer to be detected in turn, and the No. 1 defect detection mechanism and the No. 2 defect detection mechanism can be used to detect the defects on both sides of the wafer after cleaning and drying, so as to complete the automatic wafer defect detection process of cleaning, drying and double-side detection of the wafer, the wafer cleaning, drying and detection are integrated in the same detection equipment, and no manual intervention is needed during the process, so as to reduce the labor cost, improve the efficiency of wafer defect detection, and be applicable to batch wafer detection.

[0027] 2. A wafer defect detection device for semiconductor processing, by providing a plurality of wafer clamping mechanisms, the wafer detection process can be continuously carried out by taking out the wafer after detection using the rotation intermittent time of the servo motor during the position switching process of the plurality of wafer clamping mechanisms, and placing the next wafer to be detected on the wafer clamping mechanism for continuous detection, and the wafer clamping mechanism can automatically drive the upper and lower cleaning assemblies or the upper and lower drying assemblies to approach each other and complete automatic assembly with the annular clamping frame when meeting the wafer cleaning mechanism or the wafer drying mechanism, so that the upper cleaning assembly, the annular clamping frame, the lower cleaning assembly or the upper drying assembly, the annular clamping frame, and the lower drying assembly form a closed operation space, which can avoid the detection interference of the sprayed deionized water or heated nitrogen on the surrounding wafers during wafer cleaning or drying, greatly improving the detection accuracy of wafer defects, and the first delay switch or the second delay switch can be automatically triggered when the wafer clamping mechanism is assembled with the wafer cleaning mechanism or the wafer drying mechanism, realizing the effect of delay control of water pump or air pump operation.

[0028] 3. A wafer defect detection device for semiconductor processing, by cooperating the wafer clamping mechanism with the wafer cleaning mechanism and the wafer drying mechanism, the wafer clamping mechanism can be driven by the wafer cleaning mechanism and the wafer drying mechanism in the initial state of lifting the wafer, so that the clamping arms at multiple positions can clamp the wafer at multiple positions, making the wafer position more stable during washing or drying, avoiding damage caused by wafer shaking, and secondly, the wafer clamping mechanism can cooperate with the turnover driving mechanism to supply power to the plurality of electromagnets through the arc-shaped conductive groove after the first defect detection mechanism completes detection, fix the wafer before turnover, and turn over by one hundred and eighty degrees before reaching the second defect detection mechanism, and reset after completing the defect detection of the other side, which can ensure the stable clamping of the wafer clamping mechanism on the wafer next time on the basis of realizing double-sided detection. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present application;

[0030] Figure 2 It is a schematic diagram of the structure of the operation window opening state of the present application;

[0031] Figure 3 It is a schematic diagram of the first state structure of the detection box removal of the present application;

[0032] Figure 4 It is a schematic diagram of the second state structure of the detection box removal of the present application;

[0033] Figure 5 It is a schematic diagram of the enlarged structure of part A in the present application; Figure 4 ​

[0034] Figure 6 is a schematic view of the wafer clamping mechanism structure of the present application;

[0035] Figure 7 is a schematic view of the first support arm and the second support arm in an exploded state of the present application;

[0036] Figure 8 is a schematic view of the B part in the present application Figure 7 in an enlarged structure;

[0037] Figure 9 is a schematic view of the ring-shaped clamping frame in a cross-sectional structure of the present application;

[0038] Figure 10 is a schematic view of the C part in the present application Figure 9 in an enlarged structure;

[0039] Figure 11 is a schematic view of the wafer cleaning mechanism in a first state of the present application;

[0040] Figure 12 is a schematic view of the D part in the present application Figure 11 in an enlarged structure;

[0041] Figure 13 is a schematic view of the wafer cleaning mechanism in a second state of the present application;

[0042] Figure 14 is a schematic view of the wafer drying mechanism structure of the present application;

[0043] Figure 15 is a schematic view of the E part in the present application Figure 14 in an enlarged structure;

[0044] Figure 16 is a schematic view of the wafer drying mechanism in a second state of the present application;

[0045] Figure 17 is a schematic view of the wafer clamping mechanism and the wafer drying mechanism in an assembled state of the present application;

[0046] Figure 18 is a schematic view of the turnover driving assembly structure of the present application;

[0047] Figure 19 is a schematic view of the F part in the present application Figure 18 in an enlarged structure.

[0048] In the figure: 1, detection box; 2, operation window; 3, protection door; 4, defect imaging system; 5, turntable; 6, wafer clamping mechanism; 61, clamping carrier; 62, first supporting arm; 63, annular limiting groove; 64, rotary damper; 65, second supporting arm; 66, annular clamping frame; 67, mounting slot; 68, clamping arm; 69, guide wheel; 610, clamping groove; 611, first spring; 612, annular plate; 613, driving ring; 614, wedge-shaped slot; 615, guide rod; 616, second spring; 617, electromagnet; 618, strong magnet; 619, gear; 620, power contact; 621, driving arm; 622, arc-shaped protrusion; 7, wafer cleaning mechanism; 71, cleaning carrier; 72, third supporting arm; 73, upper cleaning cylinder; 74, first pressing ring; 75, upper water supply pipe; 76, first time delay trigger switch; 77, first lifting rod; 78, third spring; 79, first rack; 710, fourth supporting arm; 711, second rack; 712, lower cleaning cylinder; 713, lower water supply pipe; 714, drain pipe; 715, first gear; 8, wafer drying mechanism; 81, drying carrier; 82, fifth supporting arm; 83, upper drying cylinder; 84, second pressing ring; 85, upper air supply pipe; 86, second time delay trigger switch; 87, third rack; 88, second lifting rod; 89, fourth spring; 810, sixth supporting arm; 811, fourth rack; 812, lower drying cylinder; 813, annular air pipe; 814, lower air supply pipe; 815, second gear; 9, first defect detection mechanism; 91, mounting frame; 92, visual detection assembly; 10, second defect detection mechanism; 11, turnover driving assembly; 111, arc-shaped bracket; 112, first arc-shaped rack; 113, second arc-shaped rack; 114, arc-shaped conductive frame; 115, arc-shaped conductive slot. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0050] The present application provides four technical solutions: a wafer defect detection device for semiconductor processing, specifically including the following embodiments:

[0051] As Figures 1-5 The first embodiment is shown: a wafer defect detection device for semiconductor processing, comprising a detection box 1 and an operation window 2 opened on the front surface thereof, a protection door 3 is rotatably arranged inside the operation window 2, and a defect imaging system 4 is further arranged on the side wall of the detection box 1, further comprising:

[0052] The rotating disc 5 is arranged on the tray inside the cavity of the detection box 1 and is driven by a servo motor. The top of the rotating disc 5 is uniformly provided with a plurality of wafer clamping mechanisms 6 for clamping the wafer to be detected. The wafer clamping mechanism 6 can be circumferentially flipped under the driving of the flipping driving assembly 11 to cooperate with the completion of the double-sided defect detection of the wafer. The servo motor rotates clockwise at a low speed intermittently according to a preset program, so that each wafer clamping mechanism 6 sequentially passes through the wafer cleaning mechanism 7, the wafer drying mechanism 8, the first defect detection mechanism 9 and the second defect detection mechanism 10, and finally the wafer clamping mechanism 6 carries the detected wafer back to the operating window 2 position again.

[0053] The wafer cleaning mechanism 7 is arranged on one side of the top of the tray and is used to cooperate with the wafer clamping mechanism 6 to first seal the wafer to be detected in a flushing space and then flush the upper surface and the lower surface of the wafer to be detected with deionized water at the same time to remove impurities on the surface of the wafer to be detected.

[0054] The wafer drying mechanism 8 is arranged on one side of the wafer cleaning mechanism 7 and is used to first seal the flushed wafer to be detected in a drying space and then simultaneously blow heated nitrogen gas on the upper surface and the lower surface of the wafer to quickly dry the wafer.

[0055] The first defect detection mechanism 9 and the second defect detection mechanism 10 are respectively arranged on the top of the tray on both sides and are used to collect image data of the top and the bottom of the wafer and transmit the image data to the defect imaging system 4. The first defect detection mechanism 9 and the second defect detection mechanism 10 are the same in structure. The first defect detection mechanism 9 includes a mounting frame 91 fixedly arranged on the tray. A visual detection assembly 92 is fixedly arranged on the side wall of the mounting frame 91. The visual detection assembly 92 can capture the image of the surface of the wafer from below the annular clamping frame 66 and transmit the image to the defect imaging system 4.

[0056] As Figures 6-10 , Figures 18-19 The second embodiment is shown. The wafer clamping mechanism 6 includes a clamping carrier 61 and a rotating arm assembly arranged on the outer wall of the clamping carrier 61. A hoop assembly for positioning the wafer is further arranged on the end of the rotating arm assembly away from the clamping carrier 61. A driving arm 621 is fixedly arranged on the outer wall of the clamping carrier 61 and above the hoop assembly. An arc-shaped protrusion 622 is fixedly arranged on the bottom of the driving arm 621 and at a position opposite to the center position of the hoop assembly.

[0057] In this embodiment, the rotating arm assembly comprises a first supporting arm 62 fixedly arranged on the outer wall of the clamping carrier 61, one end of the first supporting arm 62 is provided with an annular limiting groove 63, and the inside of the first supporting arm 62 is further provided with a rotating damper 64 for increasing the rotating resistance of the clamp assembly, the output end of the rotating damper 64 is further fixedly provided with a second supporting arm 65, and the second supporting arm 65 is fixedly arranged with a supporting ring on the side wall opposite to the first supporting arm 62, the supporting ring is rotatably arranged in the annular limiting groove 63, the second supporting arm 65 is a “U” shaped structure, and the cavity inner walls of the second supporting arm 65 are connected with the top and bottom of the annular clamping frame 66 respectively.

[0058] In the embodiment, the clamp assembly comprises a ring-shaped clamping frame 66 and a plurality of mounting through slots 67 evenly provided on the inner wall of the ring-shaped clamping frame 66, the inside of each mounting through slot 67 is fixedly provided with a baffle, and the inside of each mounting through slot 67 is also slidably provided with a clamping arm 68, the clamping arm 68 slides through the baffle at the corresponding position and extends to the outside, one end of the clamping arm 68 is rotatably provided with a guide wheel 69 through a wheel frame, and the other end of the clamping arm 68 away from the guide wheel 69 is fixedly provided with a short limiting plate and a long limiting plate on the upper and lower sides respectively, a clamping groove 610 for lifting the wafer is formed between the short limiting plate and the long limiting plate, a first spring 611 is slidably sleeved on the outer wall of the clamping arm 68 and between the wheel frame and the baffle, a ring-shaped plate 612 is also fixedly sleeved on the lower outer wall of the ring-shaped clamping frame 66, and a driving ring 613 is also slidably sleeved on the upper outer wall of the ring-shaped clamping frame 66, a plurality of wedge-shaped through slots 614 corresponding to the positions of the guide wheels 69 are provided on the inner wall of the driving ring 613. The clamping arm 68 is composed of an elongated slider and a jacking rod, the jacking rod is fixedly arranged at one end of the elongated slider, the mounting through slot 67 is adapted to the structure of the elongated slider, and the elongated slider is slidably arranged in the mounting through slot 67, the jacking rod can freely move in the mounting through slot 67, the elongated slider and the jacking rod are respectively located on the two sides of the baffle, the inclined inner wall of the wedge-shaped through slot 614 is in close contact with the outer wall of the guide wheel 69 at the corresponding position, a plurality of guide rods 615 are uniformly fixedly arranged on the bottom of the driving ring 613, each guide rod 615 slides through the ring-shaped plate 612 and extends to the outside, a second spring 616 is slidably sleeved on the outer wall of the guide rod 615 and between the driving ring 613 and the ring-shaped plate 612, a plurality of electromagnets 617 are uniformly fixedly arranged on the top of the second spring 616, a plurality of powerful magnets 618 corresponding to the positions of the electromagnets 617 are also uniformly fixedly arranged on the top of the driving ring 613, a transmission pipe is fixedly arranged on the outer wall of the ring-shaped plate 612 and at the position opposite to the rotating arm assembly through an L-shaped mounting frame, a gear 619 is fixedly sleeved on the outer wall of the transmission pipe, and an electric contact 620 is also fixedly arranged at one end of the transmission pipe, the electric contact 620 and the plurality of electromagnets 617 are electrically connected through wires, the axis of the transmission pipe and the output shaft of the rotating damper 64 are on the same straight line.

[0059] In the embodiment, the turnover driving assembly 11 comprises an arc-shaped bracket 111 and first and second arc-shaped gear racks 112 and 113 fixedly arranged at the top of the arc-shaped bracket 111 on both sides, and an arc-shaped conductive bracket 114 is further fixedly arranged at the top of the arc-shaped bracket 111 on one side, the arc-shaped conductive bracket 114 is provided with an arc-shaped conductive groove 115 on the side wall close to the first arc-shaped gear rack 112, a conductive metal sheet is fixedly arranged in the arc-shaped conductive groove 115, the gear 619 will meet and be connected with the first and second arc-shaped gear racks 112 and 113 during the rotation of the synchronous turntable 5, the electrical contact 620 will slide into the arc-shaped conductive groove 115, and the first and second arc-shaped gear racks 112 and 113 can drive the gear 619 to rotate by 180 degrees, and one end of the arc-shaped conductive groove 115 protrudes from the arc-shaped bracket 111, so that the electrical contact 620 can be supplied with electric energy through the arc-shaped conductive groove 115.

[0060] As Figures 11-13 A third embodiment is shown, the wafer cleaning mechanism 7 comprises a cleaning carrier 71 fixedly arranged on the supporting plate and a first cross-shaped through groove arranged in the cleaning carrier 71, and an upper cleaning assembly and a lower cleaning assembly are arranged on the upper and lower sides of the first cross-shaped through groove.

[0061] In the embodiment, the upper cleaning assembly comprises a third supporting arm 72 slidingly arranged in the first cross-shaped through groove, the third supporting arm 72 is fixedly provided with an upper cleaning cylinder 73 at the bottom, the outer wall of the upper cleaning cylinder 73 is fixedly sleeved with a first pressure ring 74 at the bottom, a plurality of first nozzles are uniformly fixedly arranged in the upper cleaning cylinder 73, the plurality of first nozzles are commonly connected with a same upper water supply pipe 75, the top of the third supporting arm 72 is further fixedly provided with a first delay trigger switch 76 and a first lifting rod 77 on both sides, the first lifting rod 77 slidingly penetrates through the first cross-shaped through groove and is fixedly provided with a first spring baffle, a third spring 78 is sleeved on the outer wall of the first lifting rod 77 between the spring baffle and the cleaning carrier 71, and the bottom of the third supporting arm 72 is further fixedly provided with a first gear rack 79. The first delay trigger switch 76 is located at the top center of the upper cleaning cylinder 73, the arc-shaped lug 622 will meet the first delay trigger switch 76 during the rotation of the synchronous turntable 5, and will move downward by a preset distance under the pushing force of the arc-shaped lug 622, the first pressure ring 74 and the top of the driving ring 613 are opposite to each other, the top and the bottom of the annular clamping bracket 66 are opposite to the bottom of the upper cleaning cylinder 73 and the top of the lower cleaning cylinder 712 respectively, and the top and the bottom of the annular clamping bracket 66 are both fixedly provided with sealing pads for preventing the leakage of deionized water.

[0062] In the embodiment, the lower cleaning assembly comprises a fourth supporting arm 710 slidingly arranged in the first cross-shaped through slot, a second rack 711 fixedly arranged on the top of the fourth supporting arm 710 relative to the position of the first rack 79, a lower cleaning cylinder 712 fixedly arranged on the top of the fourth supporting arm 710 and directly below the upper cleaning cylinder 73, a plurality of second nozzles uniformly fixedly arranged on the inner cavity bottom of the lower cleaning cylinder 712, a lower water supply pipe 713 commonly fixedly connected with the plurality of second nozzles, a drain hole further arranged on the inner cavity bottom center of the lower cleaning cylinder 712, and a drain pipe 714 fixedly connected with the drain hole and arranged on the bottom of the lower cleaning cylinder 712. The second rack 711 and the first rack 79 are symmetrically arranged on the two sides of the first gear 715 and are in meshing connection with the first gear 715. One end of the upper water supply pipe 75 and the lower water supply pipe 713 is connected with an external water pump. The water pump is used to draw deionized water to the first nozzles and the second nozzles inside the upper cleaning cylinder 73 and the lower cleaning cylinder 712. The first delay trigger switch 76 is used to control the water pump to be turned on and run for a preset time. The drain pipe 714 is connected with an external wastewater tank.

[0063] As Figures 14-17 A fourth embodiment is shown. The wafer drying mechanism 8 comprises a drying carrier 81 fixedly arranged on the top of the supporting plate and a second cross-shaped through slot arranged in the drying carrier 81. An upper drying assembly and a lower drying assembly are respectively arranged on the upper and lower sides of the second cross-shaped through slot.

[0064] In the embodiment, the upper drying assembly comprises a fifth supporting arm 82 slidingly arranged in the second cross-shaped through slot. The top and bottom of the fifth supporting arm 82 are respectively fixedly arranged with a second delay trigger switch 86 and an upper drying cylinder 83. A second compression ring 84 is further fixedly sleeved on the lower outer wall of the upper drying cylinder 83. A plurality of first air nozzles are uniformly fixedly arranged in the inner cavity of the upper drying cylinder 83. The same upper gas supply pipe 85 is commonly fixedly connected with the plurality of first air nozzles. The bottom and top of the fifth supporting arm 82 are respectively fixedly arranged with a third rack 87 and a second lifting rod 88. The second lifting rod 88 slidingly penetrates the drying carrier 81 and is fixedly arranged with a second spring baffle. The fourth spring 89 is slidingly sleeved on the outer wall of the second lifting rod 88 and between the drying carrier 81 and the second spring baffle.

[0065] In the embodiment, the lower drying assembly comprises the sixth supporting arm 810 slidingly arranged in the No.2 cross-shaped sliding groove, the top and bottom of the sixth supporting arm 810 are respectively fixedly provided with the fourth rack 811 and the lower drying cylinder 812, the inner cavity bottom of the lower drying cylinder 812 is uniformly fixedly provided with a plurality of No.2 air nozzles, the plurality of No.2 air nozzles are commonly fixedly connected with the same lower air supply pipe 814, a plurality of air exhaust holes are uniformly formed in the inner wall of the lower drying cylinder 812, and an annular air pipe 813 connected with the plurality of air exhaust holes is further fixedly sleeved on the outer wall of the lower drying cylinder 812. A drainage pipe is further fixedly arranged on the outer wall of the annular air pipe 813, the drainage pipe penetrates the detection box 1 and is connected with an external air suction pump, the lower air supply pipe 814 and the upper air supply pipe 85 are both connected with the external air pump, the air pump is used for simultaneously supplying the heated nitrogen to the upper air supply pipe 85 and the lower air supply pipe 814, the third rack 87 and the fourth rack 811 are symmetrically arranged on the two sides of the second gear 815, and the third rack 87 and the fourth rack 811 are both meshingly connected with the second gear 815; the arc-shaped protrusion 622 meets the second delay trigger switch 86 in the rotating process and can downward push the second delay trigger switch 86 to move downward by a preset distance, so as to control the air pump to work for a preset time.

[0066] In use, first, through the operation of the window 2 to be detected wafer placed in the plurality of clamping groove 610 in the long limit plate, to be detected wafer bottom of the plurality of position is lifted by the long limit plate and can be stable placed, then through the external controller control servo motor according to the preset program drive turntable 5 rotation, turntable 5 drive one of the loading wafer wafer clamping mechanism 6 to meet and wafer cleaning mechanism 7, at this time, the annular clamping frame 66 is located between the upper cleaning cylinder 73 and the lower cleaning cylinder 712, and the center of the annular clamping frame 66 and the axis of the upper cleaning cylinder 73, the lower cleaning cylinder 712 coincide, when the wafer clamping mechanism 6 and wafer cleaning mechanism 7 meet, the arc-shaped protrusion 622 and the first delay trigger switch 76 meet and trigger the first delay trigger switch 76 to open, the arc-shaped protrusion 622 is lowered while pushing the first delay trigger switch 76 to move downward, until the bottom of the arc-shaped protrusion 622 and the top of the first delay trigger switch 76 contact, the annular clamping frame 66 reaches the preset position, because the second rack 711 and the first rack 79 are simultaneously connected with the first gear 715, the fourth support arm 710 is synchronously moved upward under the drive of the first gear 715 while the third support arm 72 is synchronously moved downward with the first delay trigger switch 76, so that the upper cleaning cylinder 73 and the lower cleaning cylinder 712 simultaneously approach the position of the annular clamping frame 66, because the bottom of the first compression ring 74 is slightly protruding from the upper cleaning cylinder 73, the first compression ring 74 contacts the upper cleaning cylinder 73 and the drive ring 613 first, and the drive ring 613 is gradually moved downward under the pushing force of the first compression ring 74, the slope surface inside the wedge-shaped through groove 614 at multiple positions pushes the corresponding position of the guide wheel 69 to move a preset distance, the clamping arm 68 at multiple positions gradually approaches the center position of the annular clamping frame 66, at this time, the clamping groove 610 at multiple positions simultaneously applies force to the wafer sidewall to further clamp the wafer, because the inner wall of the clamping groove 610 is provided with a buffer pad, the wafer sidewall can be protected, after the bottom of the upper cleaning cylinder 73 and the top of the lower cleaning cylinder 712 and the annular clamping frame 66 are tightly connected, the delay time of the first delay trigger switch 76 ends, the water pump draws deionized water into the upper cleaning cylinder 73 and the lower cleaning cylinder 712 through the upper water supply pipe 75 and the lower water supply pipe 713 respectively, and sprays through the No. 1 nozzle and the No. 2 nozzle inside the upper cleaning cylinder 73 and the lower cleaning cylinder 712, the deionized water simultaneously flushes on the top and bottom of the wafer, the waste water washed down enters the drain pipe 714 through the drain hole at the center position of the lower cleaning cylinder 712, and is output to the waste water tank outside the detection box 1 through the drain pipe 714;

[0067] After the time delay of the first time delay trigger switch 76 ends, the servo motor drives the rotating disc 5 to rotate again, at this time, the top of the first time delay trigger switch 76 slides from the bottom of the arc-shaped protrusion 622 to a higher position, the first lifting rod 77 moves upward under the elastic force of the third spring 78, the third support arm 72 moves upward and pushes the second rack 711 to move downward synchronously through the first gear 715, until the upper cleaning cylinder 73 and the lower cleaning cylinder 712 return to the original position;

[0068] The wafer clamping mechanism 6 continues to rotate to meet the wafer drying mechanism 8, that is, the annular clamping frame 66 is located between the upper drying cylinder 83 and the lower drying cylinder 812, since the second pressing ring 84 slightly protrudes from the bottom of the upper drying cylinder 83, the second pressing ring 84 pushes the driving ring 613 to move downward, at the same time, the driving ring 613 pushes the clamping arms 68 at multiple positions to move towards each other, thereby exerting clamping force on the sidewall of the wafer at multiple positions simultaneously, the clamping process is the same as the operation when the wafer cleaning mechanism 7 is met, at the same time, the arc-shaped protrusion 622 triggers the second time delay trigger switch 86 to open, and the second time delay trigger switch 86 moves upward synchronously under the pushing of the arc-shaped protrusion 622, since the third rack 87 and the fourth rack 811 are connected with the second gear 815 at the same time, the upper drying cylinder 83 moves downward at the same time, and the lower drying cylinder 812 moves upward synchronously, until the top and bottom of the annular clamping frame 66 are in close contact with the bottom and top of the upper drying cylinder 83 and the lower drying cylinder 812 respectively, after the time delay of the second time delay trigger switch 86 ends, the gas pump starts to input heated nitrogen into the upper drying cylinder 83 and the lower drying cylinder 812 in the corresponding position through the upper gas supply pipe 85 and the lower gas supply pipe 814, the nitrogen is blown through the first gas nozzle and the second gas nozzle to the top and bottom of the wafer, the deionized water remaining on the surface of the wafer is quickly evaporated under the action of hot nitrogen, and the water vapor is pumped out of the detection box 1 by the exhaust pump through the annular gas pipe 813;

[0069] After the time controlled by the second time delay trigger switch 86 ends, the servo motor drives the rotating disc 5 to rotate again. When the wafer clamping mechanism 6 rotates, it first meets the first defect detection mechanism 9. The visual detection assembly 92 in the first defect detection mechanism 9 acquires the image of the bottom of the wafer and transmits the image to the defect imaging system 4 for defect analysis. When the wafer clamping mechanism 6 continues to rotate to the front of the second defect detection mechanism 10, the electrical contact 620 first slides into the arc-shaped conductive groove 115 and is electrically connected with the conductive metal sheet in the arc-shaped conductive groove 115. The electric energy is transmitted to the electromagnets 617 at multiple positions through the wires. The electromagnets 617 generate magnetic force and attract the strong magnets 618 downward. The strong magnets 618 at multiple positions simultaneously drive the driving ring 613 to move downward, so that the clamping grooves 610 at multiple positions clamp the side wall of the wafer again. The clamping process is the same as the process of clamping the wafer when the wafer cleaning mechanism 7 and the wafer clamping mechanism 6 meet. Then the gear 619 meets and meshes with the first arc-shaped rack 112. During the connection between the gear 619 and the first arc-shaped rack 112, the first arc-shaped rack 112 drives the gear 619 to rotate by one hundred and eighty degrees. The annular clamping frame 66 also rotates by one hundred and eighty degrees synchronously. Due to the rotation resistance of the rotation damper 64 between the first support arm 62 and the second support arm 65, the top of the annular clamping frame 66 can maintain a stable horizontal state after rotating by one hundred and eighty degrees. The visual detection assembly 92 in the second defect detection mechanism 10 is located between the first arc-shaped rack 112 and the second arc-shaped rack 113. After the annular clamping frame 66 rotates by one hundred and eighty degrees and moves to the position below the visual detection assembly 92 in the second defect detection mechanism 10, the visual detection assembly 92 acquires the image of the top of the wafer and transmits the image to the defect imaging system 4 for defect analysis.

[0070] After the rotating disc 5 drives the wafer clamping mechanism 6 to pass through the second defect detection mechanism 10 and return to the original position, i.e., the position close to the operation window 2, the wafer after detection can be taken down, and the wafer to be detected can be placed again, so that the wafer defect detection process can continue.

[0071] It should be noted that, in the present document, the terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms “include”, “contain” or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or device.

[0072] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.

Claims

1. A wafer defect inspection device for semiconductor processing, comprising an inspection box and an operation window opened on its front side, wherein a protective door is rotatably installed inside the operation window, and a defect imaging system is also provided on the side wall of the inspection box, characterized in that, Also include: Rotary disc, rotary set in the detection box cavity inside the tray and driven by servo motor, the top of the rotary disc is uniformly provided with a plurality of wafer clamping mechanism for clamping the wafer to be detected, wafer clamping mechanism can be driven by the drive assembly to rotate to complete the double-sided defect detection of wafer; Wafer cleaning mechanism, set in the tray top side, for cooperating with wafer clamping mechanism to seal the wafer to be detected in the flushing space, and then flushing the upper surface and lower surface of the wafer to be detected with deionized water; Wafer drying mechanism, set in the wafer cleaning mechanism side, for sealing the wafer to be detected in the drying space after flushing, and then blowing heated nitrogen on the upper surface and lower surface of the wafer; A defect detection mechanism and a second defect detection mechanism are respectively arranged on the top of the tray, for collecting image data of the top and bottom of the wafer and transmitting to the defect imaging system; The wafer clamping mechanism includes a clamping carrier and a rotating arm assembly arranged on the outer wall of the clamping carrier, the end of the rotating arm assembly away from the clamping carrier is further provided with a clamp assembly for positioning the wafer, the outer wall of the clamping carrier is fixedly provided with a driving arm above the clamp assembly, and the bottom of the driving arm and the center position of the clamp assembly are fixedly provided with an arc-shaped protrusion. The wafer cleaning mechanism includes a cleaning carrier fixedly arranged on the tray and a first cross-shaped through slot opened in the cleaning carrier, the upper and lower sides of the first cross-shaped through slot are respectively provided with an upper cleaning assembly and a lower cleaning assembly, and the upper cleaning assembly and the lower cleaning assembly are connected by a first gear. The upper cleaning assembly includes a third supporting arm slidingly arranged in the first cross-shaped through slot, the bottom of the third supporting arm is fixedly provided with an upper cleaning cylinder, the outer wall of the upper cleaning cylinder is fixedly provided with a first pressure ring below, and the inner wall of the upper cleaning cylinder is uniformly provided with a plurality of first nozzles, the plurality of first nozzles are connected with a same upper water supply pipe, the top of the third supporting arm is further fixedly provided with a first delay trigger switch and a first lifting rod respectively, the first lifting rod slidingly penetrates the first cross-shaped through slot and is fixedly provided with a first spring baffle, the outer wall of the first lifting rod and between the spring baffle and the cleaning carrier is slidingly provided with a third spring, and the bottom of the third supporting arm is further fixedly provided with a first rack. The lower cleaning assembly includes a fourth supporting arm slidingly arranged in the first cross-shaped through slot, the top of the fourth supporting arm is fixedly provided with a second rack opposite to the first rack, the top of the fourth supporting arm and below the upper cleaning cylinder is fixedly provided with a lower cleaning cylinder, the inner cavity of the lower cleaning cylinder is uniformly fixedly provided with a plurality of second nozzles, the plurality of second nozzles are fixedly connected with a lower water supply pipe, the inner cavity of the lower cleaning cylinder is further provided with a drain hole at the center position, and the bottom of the lower cleaning cylinder is further fixedly connected with a drain pipe communicated with the drain hole, the second rack and the first rack are symmetrically arranged on both sides of the first gear and are meshingly connected with the first gear.

2. The wafer defect inspection apparatus for semiconductor processing according to claim 1, characterized by: The rotating arm assembly comprises a first supporting arm fixed on the outer wall of the clamping carrier, one end of the first supporting arm is provided with an annular limiting groove, and a rotating damper for increasing the rotating resistance of the clamp assembly is further arranged in the first supporting arm, a second supporting arm is further fixed on the output end of the rotating damper, and a supporting ring is fixed on the side wall of the second supporting arm relative to the first supporting arm, and the supporting ring is rotatably arranged in the annular limiting groove.

3. The wafer defect inspection apparatus for semiconductor processing according to claim 1, wherein: The clamp assembly comprises an annular clamping frame and a plurality of mounting through grooves uniformly arranged on the inner wall of the annular clamping frame, a baffle is fixed in each mounting through groove, and a clamping arm is slidably arranged in each mounting through groove, the clamping arm slides through the baffle at the corresponding position and extends to the outside, one end of the clamping arm is rotatably provided with a guide wheel through a wheel frame, and a short limiting plate and a long limiting plate are fixed on the upper and lower sides of the end of the clamping arm away from the guide wheel, respectively, a clamping groove for lifting the wafer is formed between the short limiting plate and the long limiting plate, a first spring is slidably sleeved on the outer wall of the clamping arm between the wheel frame and the baffle, a ring plate is fixedly sleeved below the outer wall of the annular clamping frame, and a driving ring is slidably sleeved above the outer wall of the annular clamping frame, a plurality of wedge-shaped through grooves corresponding to the positions of the guide wheels are arranged on the inner wall of the driving ring.

4. The wafer defect inspection apparatus for semiconductor processing according to claim 3, wherein: The inclined inner wall of the wedge-shaped through groove is in close contact with the outer wall of the guide wheel at the corresponding position, a plurality of guide rods are uniformly fixed on the bottom of the driving ring, each guide rod slides through the ring plate and extends to the outside, a second spring is slidably sleeved on the outer wall of the guide rod between the driving ring and the ring plate, a plurality of electromagnets are uniformly fixed on the top of the second spring, and a plurality of strong magnets corresponding to the positions of the electromagnets are uniformly fixed on the top of the driving ring, a transmission pipe is fixedly arranged on the outer wall of the ring plate at a position opposite to the rotating arm assembly through an L-shaped mounting bracket, a gear is fixedly sleeved on the outer wall of the transmission pipe, and an electric contact is further fixed on one end of the transmission pipe, and the electric contact and the plurality of electromagnets are electrically connected through wires.

5. The wafer defect inspection apparatus for semiconductor processing according to claim 1, wherein: The wafer drying mechanism comprises a drying carrier fixed on the top of the supporting plate and a No. 2 cross-shaped through groove arranged in the drying carrier, and an upper drying assembly and a lower drying assembly are arranged on the inner wall of the No. 2 cross-shaped through groove, respectively, and the upper drying assembly and the lower drying assembly are connected through a second gear; The upper drying assembly comprises a fifth supporting arm slidingly arranged in the No.2 cross-shaped sliding slot, the top and bottom of the fifth supporting arm are respectively fixedly provided with a second time-delay trigger switch and an upper drying cylinder, a second pressing ring is further fixedly sleeved below the outer wall of the upper drying cylinder, a plurality of No.1 air nozzles are uniformly fixedly arranged in the inner portion of the upper drying cylinder, the same upper air supply pipe is fixedly connected to the plurality of No.1 air nozzles, the bottom and top of the fifth supporting arm are respectively fixedly provided with a third rack and a second lifting rod, the second lifting rod slidingly penetrates through the drying carrier and is fixedly provided with a No.2 spring baffle, a fourth spring is slidingly sleeved on the outer wall of the second lifting rod and between the drying carrier and the No.2 spring baffle.

6. The wafer defect inspection apparatus for semiconductor processing according to claim 5, wherein: The lower drying assembly comprises a sixth supporting arm slidingly arranged in the No.2 cross-shaped sliding slot, the top and bottom of the sixth supporting arm are respectively fixedly provided with a fourth rack and a lower drying cylinder, a plurality of No.2 air nozzles are uniformly fixedly arranged in the inner cavity of the lower drying cylinder, the same lower air supply pipe is fixedly connected to the plurality of No.2 air nozzles, a plurality of air exhaust holes are uniformly formed in the inner wall of the lower drying cylinder, and an annular air pipe connected with the plurality of air exhaust holes is further fixedly sleeved on the outer wall of the lower drying cylinder.

7. The wafer defect inspection apparatus for semiconductor processing according to claim 1, wherein: The turnover driving assembly comprises an arc-shaped bracket and first and second arc-shaped racks fixedly arranged on both sides of the top of the arc-shaped bracket, an arc-shaped conductive frame is further fixedly arranged on one side of the top of the arc-shaped bracket, an arc-shaped conductive groove is formed in the side wall of the arc-shaped conductive frame close to the first arc-shaped rack, and a conductive metal sheet is fixedly arranged in the arc-shaped conductive groove.

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