Extended memory module for changing form factor of memory device and memory device including same

Abstract

A storage device includes: a main storage module; and an extended memory module including: a substrate; a functional block on the substrate, where the functional block is configured to provide a first function for the main storage module; a control circuit on the substrate, in which the control circuit is configured to control the functional block; a housing extending around the substrate, the functional block, and the control circuit; and a connector connected to the substrate, where the connector is configured to provide an electrical connection and a physical connection between the extended memory module and the main memory module, where the extended memory module is electrically and physically connectable to and detachable from the main memory module through the connector, and where the extended memory module is electrically and physically connectable to and detachable from the main memory module through the connector. In response to detachment of the extended storage module from the main storage module, the main storage module has a first form factor.

Description

Cross - reference to Related Applications

[0001] This application claims the priority of Korean Patent Application No. 10 - 2023 - 0192210, filed with the Korean Intellectual Property Office (KIPO) on December 27, 2023, the entire content of which is incorporated herein by reference. Technical Field

[0002] Example embodiments generally relate to semiconductor integrated circuits, and more particularly, to an extended storage module for changing the form factor of a storage device, and a storage device including the extended storage module, such as a solid - state drive (SSD) device. Background Art

[0003] Certain types of data storage devices may include one or more semiconductor memory devices. Examples of such data storage devices include solid - state drives (SSDs). These types of data storage devices may have various design and / or performance advantages over hard disk drives (HDDs). Examples of potential advantages may include no moving mechanical parts, higher data access speed, stability, durability, and / or low power consumption. Recently, various systems (e.g., laptop computers, automobiles, airplanes, drones, etc.) have adopted SSDs for data storage. Summary of the Invention

[0004] At least one example embodiment of the present disclosure provides an extended storage module that can effectively change the form factor of a storage device without excessive design changes.

[0005] At least one example embodiment of the present disclosure provides a storage device and a solid - state drive (SSD) device including the extended storage module.

[0006] According to an example embodiment, a storage device includes: a main storage module; and an extended storage module including: a substrate; a functional block on the substrate, wherein the functional block is configured to provide a first function to the main storage module; a control circuit on the substrate, wherein the control circuit is configured to control the functional block; a housing extending around the substrate, the functional block, and the control circuit; and a connector connected to the substrate, wherein the connector is configured to provide an electrical connection and a physical connection between the extended storage module and the main storage module, wherein the extended storage module can be electrically and physically attached to and detached from the main storage module through the connector, and wherein, in response to the extended storage module being detached from the main storage module, the main storage module has a first form factor.

[0007] According to an example embodiment, a storage device includes: a main storage module having a first form factor; and an expansion storage module configured to be electrically and physically attachable to and detachable from the main storage module, wherein the expansion storage module includes: a first substrate; a functional block on the first substrate, wherein the functional block is configured to provide a first function to the main storage module; a control circuit on the first substrate, wherein the control circuit is configured to control the functional block; a first housing extending around the first substrate, the functional block, and the control circuit; and a first connector connected to the first substrate, wherein the first connector is configured to provide an electrical connection and a physical connection to the main storage module, and wherein, in response to the expansion storage module being attached to the main storage module, the storage device has a second form factor different from the first form factor.

[0008] According to an example embodiment, a solid state drive (SSD) device includes: a main module having a first form factor; and an expansion module configured to be electrically and physically attachable to and detachable from the main module, wherein the expansion module includes: a first substrate; an energy storage element on the first substrate, wherein the energy storage element is configured to provide an auxiliary power voltage to the main module; an energy management circuit on the first substrate, wherein the energy management circuit is configured to control the energy storage element; a first housing extending around the first substrate, the energy storage element, and the energy management circuit; and a first connector connected to the first substrate, wherein the first connector is configured to provide an electrical connection and a physical connection to the main module, wherein the main module includes: a second substrate; a storage controller on the second substrate; a plurality of non-volatile memories on the second substrate, wherein the storage controller is configured to control the plurality of non-volatile memories; a buffer memory on the second substrate, wherein the storage controller is configured to control the buffer memory; a second housing extending around the second substrate, the storage controller, the plurality of non-volatile memories, and the buffer memory; and a second connector connected to the second substrate, wherein the second connector is configured to provide an electrical connection and a physical connection to the expansion module, wherein, when the main module is electrically and physically connected to the expansion module through the first connector and the second connector, the SSD device has a second form factor different from the first form factor, wherein the storage controller is configured to: read module information from the expansion module, check the module information, determine a dump size of a data dump operation based on the module information, in response to determining that a data dump event has occurred, send a power request signal to the energy management circuit based on at least one of generation of a data dump command and a decrease in a voltage level of a main power voltage, receive the auxiliary power voltage from the energy storage element, and perform a data dump operation based on the auxiliary power voltage and the dump size, and wherein, in response to determining that the data dump event has occurred and the data dump operation has been performed, the storage controller is configured to move data from the buffer memory to the plurality of non-volatile memories.

[0009] In an extended storage module, a storage device, and an SSD device according to an exemplary embodiment, the extended storage module can be used to change a main storage module having a first form factor into a storage device having a second form factor. A connection between the extended storage module and the main storage module can be implemented without excessive design changes. In addition, the extended storage module can provide at least one of various functions to the main storage module, such as providing an auxiliary power voltage to the main storage module or reducing heat emitted from the main storage module. Accordingly, the form factor of the storage device can be effectively changed using the extended storage module, additional functions can be effectively provided to the storage device, and the customer's environment can be easily and flexibly responded to. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Exemplary non-limiting example embodiments will be more clearly understood from the following detailed description in conjunction with the accompanying drawings.

[0011] Figure 1 is a block diagram showing an extended storage module according to an exemplary embodiment.

[0012] Figure 2 is a block diagram showing a main storage module according to an exemplary embodiment.

[0013] Figure 3 is a diagram showing a storage device including an extended storage module and a main storage module according to an exemplary embodiment.

[0014] Figure 4A 、 Figure 4B 、 Figure 5A and Figure 5B are perspective views of the extended storage module, the main storage module, and the storage device.

[0015] Figure 6 is a block diagram showing an extended storage module according to an exemplary embodiment.

[0016] Figure 7 is a block diagram showing a main storage module according to an exemplary embodiment.

[0017] Figure 8 is a diagram showing a storage device including an extended storage module and a main storage module according to an exemplary embodiment.

[0018] Figure 9A 、 Figure 9B 、 Figure 10A and Figure 10B are perspective views of the extended storage module, the main storage module, and the storage device.

[0019] Figure 11 is a block diagram showing an extended storage module according to an exemplary embodiment.

[0020] Figure 12 FIG. Figure 12 is a diagram showing a storage device including an extended storage module and a main storage module according to an exemplary embodiment.

[0021] Figure 13 FIG. is a block diagram showing an extended storage module according to an exemplary embodiment.

[0022] Figure 14 FIG.

[0021] is a diagram showing a storage device including an extended storage module and a main storage module according to an exemplary embodiment.

[0023] Figure 15A and Figure 15B FIG. Figure 13 is a perspective view of an extended storage module, a main storage module, and a storage device.

[0024] Figure 16 FIG. is a diagram showing a form factor of a storage device according to an exemplary embodiment.

[0025] Figure 17 and Figure 18 FIG.

[0022] is a block diagram showing an operation of a storage device including an extended storage module and a main storage module according to an exemplary embodiment.

[0026] Figure 19 , Figure 20 , Figure 21 , Figure 22 , Figure 23 and Figure 24 FIG. Figure 14 is a flowchart showing a method of operating a storage device according to an exemplary embodiment.

[0027] Figure 25 FIG. is a block diagram showing an extended storage module according to an exemplary embodiment.

[0028] Figure 26 FIG.

[0023] is a block diagram showing a storage device and a storage system including the storage device according to an exemplary embodiment.

[0029] Figure 27 FIG. Figure 15A is a block diagram showing a data center including a storage device according to an exemplary embodiment. DETAILED DESCRIPTION

[0030] The Storage Networking Industry Association (SNIA) Enterprise and Data Center Standard Form Factor (EDSFF) can define various form factors for SSDs. Some products can support various form factors depending on the power, capacity, performance, hardware configuration, etc. of the SSD and / or according to customer requirements. However, products that support various form factors may increase the manufacturing burden.

[0031] Various example embodiments will be described more fully with reference to the accompanying drawings, in which embodiments are shown. However, the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Throughout this application, unless otherwise expressly stated, like reference numerals may refer to like elements.

[0032] Figure 1 is a block diagram showing an extended storage module according to an example embodiment.

[0033] Referring Figure 1 , the extended storage module 100a may include a substrate 110, a functional block 120, a control circuit 130, a housing (or enclosure) 140a, and a connector (CN) 150a. The extended storage module 100a may be simply referred to as an extended module.

[0034] The substrate 110 may be a single-layer or multi-layer circuit substrate having an upper surface and a lower surface opposite to each other. For example, the substrate 110 may be a printed circuit board (PCB). The PCB may include wirings and vias connected (e.g., electrically connected) to the wirings. The wirings may include printed circuit patterns for interconnecting with electronic components (e.g., the functional block 120, the control circuit 130, and / or the connector 150a). It will be understood that when an element or layer is referred to as being "connected to" or "coupled to" another element or layer, it may be directly connected to or coupled to that other element or layer, or there may be one or more intermediate elements or layers. In contrast, when an element is referred to as being "directly coupled", "directly connected", or "directly responsive to" another element, or "directly" "above" another element, there are no intervening elements. Additionally, "electrically connected" conceptually includes physical connection and physical disconnection.

[0035] The functional block 120 may be mounted (or disposed) on the substrate 110 and may provide a first function to a main storage module (e.g., Figure 2 the main storage module 200a). The control circuit 130 may be mounted (or disposed) on the substrate 110 and may control the operation of the functional block 120.

[0036] In some example embodiments, the functional block 120 may include an energy storage element (or device) that provides an auxiliary power supply voltage to the main storage module, and the control circuit 130 may include an energy management circuit that controls the energy storage element. In some example embodiments, the functional block 120 may include a cooling element (or device) for reducing heat emitted or generated from the main storage module, and the control circuit 130 may include a cooling control circuit that controls the cooling element. In other words, the cooling element may dissipate heat more effectively and may reduce the temperature of the main storage module. In some example embodiments, the functional block 120 may include both an energy storage element and a cooling element. ReferringFigure 17 and Figure 18 Describe examples of the functional block 120 and the control circuit 130.

[0037] However, the example embodiments are not limited thereto, and the functional block 120 may include at least one of various elements and / or devices that provide various functions to the main storage module.

[0038] The housing 140a may extend around (e.g., surround) the substrate 110, the functional block 120, and the control circuit 130. In other words, the substrate 110, the functional block 120, and the control circuit 130 may be fastened to (e.g., integrated in) the housing 140a such that the functional block 120 and the control circuit 130 may be fixedly positioned within the housing 140a. For example, as Figure 1 shown, the housing 140a may be integrally formed as a single housing. For example, although Figure 1 not shown in, the housing 140a may include a lower housing for mounting the substrate 110, and an upper housing coupled to the lower housing to overlap (e.g., cover) the substrate 110, the functional block 120, and the control circuit 130 (in the third direction D3 (e.g., the Z-axis direction)). As used herein, "element A overlaps element B in the X direction" (or similar language) means that at least one line extends in the X direction and intersects both element A and B.

[0039] In some example embodiments, the housing 140a may include, for example, metal, plastic (e.g., polymer), thin film, material coated with epoxy resin, etc.

[0040] The connector 150a may be connected (e.g., electrically connected) to the substrate 110 and may form for electrical connection and / or physical connection with the main storage module. For example, the connector 150a may include a Universal Serial Bus (USB) connector, a board-to-board (B-to-B) connector, a PCB tab terminal, etc. Although Figure 1 shown the connector 150a is directly connected to the substrate 110, the example embodiments are not limited thereto, and the extended storage module 100a may further include a connection portion for electrically connecting the connector 150a to the substrate 110.

[0041] The extended storage module 100a may be electrically connected and physically attached to the main storage module via the connector 150a and detached from the main storage module. When a combined (or coupled) module is obtained by attaching the extended storage module 100a to the main storage module, the combined module may have a predetermined form factor. In other words, the extended storage module 100a may be used to change the form factor of the main storage module. For example, although the extended storage module 100a itself does not meet a specific form factor, the configuration of the combination of the extended storage module 100a and the main storage module may meet a specific form factor.

[0042] A form factor can be in the aspect of hardware design, which defines and specifies the dimensions, shape, and other physical specifications of components, especially in electronic products. A form factor can represent a large class of components with similar dimensions, can specify certain standards, and / or can define an entire system, such as a computer form factor. Standardization of form factors is crucial for hardware compatibility between different manufacturers.

[0043] In some example embodiments, a predetermined form factor can correspond to one of the multiple form factors defined in the Enterprise and Data Center Standard Form Factor (EDSFF) developed by the Storage Networking Industry Association (SNIA), which will be described with reference to Figure 16 for description.

[0044] In some example embodiments, in a plan view or on a plane, the control circuit 130 can be disposed adjacent to the connector 150a on the upper surface of the substrate 110, and the functional block 120 can be disposed adjacent to the control circuit 130 on the upper surface of the substrate 110.

[0045] Figure 2 is a block diagram showing a main storage module according to an example embodiment.

[0046] Referring to Figure 2 , the main storage module 200a can include a substrate 210, a storage controller 220, a plurality of non-volatile memories (NVMs) 230, a buffer memory (BUF) 240, a housing 250a, and a connector 260a. The main storage module 200a can be simply referred to as the main module.

[0047] The substrate 210 can be a single-layer or multi-layer circuit substrate, such as a PCB. The substrate 210 can be similar to the Figure 1 substrate 110.

[0048] In some example embodiments, the substrate 210 can extend in a first direction (e.g., the length direction). For example, the substrate 210 can have a rectangular or square shape and can have a first side and a second side opposite to each other. For example, although Figure 2Although not shown in the figure, a host connector having connection terminals for connection to an external host device may be provided in the first side portion of the substrate 210. The main storage module 200a may be attached to or detached from an external host device through the host connector, and may be electrically connected to the external host device through the host connector. As used hereinafter, the terms "external / outer configuration", "external / outer device", "external / outer power supply", "external / outer signal", or "outer" are intended to broadly refer to devices, circuits, blocks, modules, power supplies, and / or signals located outside (e.g., outside the functional or physical boundary) of a given circuit, block, module, system, or device.

[0049] The storage controller 220 may be mounted (or provided) on the substrate 210. A plurality of non-volatile memories 230 and a buffer memory 240 may be mounted (or provided) on the substrate 210, and may be controlled by the storage controller 220.

[0050] The storage controller 220 may control the overall operation of the main storage module 200a and the storage device including the main storage module 200a, and may perform signal communication with an external host device using a host interface. For example, signals communicated between the storage controller 220 and the external host device may include commands, addresses, data, etc. The storage controller 220 may analyze and process signals received from the external host device, and may control the operation of the plurality of non-volatile memories 230 based on the received commands, addresses, and data.

[0051] The plurality of non-volatile memories 230 may be used as a storage medium for the main storage module 200a and the storage device including the main storage module 200a, and may be connected (e.g., electrically connected) to the storage controller 220 through at least one channel. For example, the plurality of non-volatile memories 230 may store various data, such as metadata, various user data, etc.

[0052] The buffer memory 240 may store instructions and / or data executed and / or processed by the storage controller 220, and may temporarily store data that has been stored or will be stored in the plurality of non-volatile memories 230.

[0053] The housing 250a may extend around (e.g., surround) the substrate 210, the storage controller 220, the plurality of non-volatile memories 230, and the buffer memory 240. The housing 250a may be similar to Figure 1 the housing 140a in

[0054] The connector 260a may be connected (e.g., electrically connected) to the substrate 210, and may form a connection for an expansion storage module (e.g., Figure 1The expansion storage module 100a) is electrically and / or physically connected. The connector 260a can be similar to Figure 1 the connector 150a in

[0055] The main storage module 200a can have a predetermined first form factor. When a combined module is obtained by attaching an expansion storage module (e.g., Figure 1 the expansion storage module 100a) to the main storage module 200a, the combined module can have a predetermined second form factor different from the first form factor. In other words, the expansion storage module can be used to change the form factor of the main storage module 200a. For example, the expansion storage module may not have a predetermined form factor.

[0056] In some example embodiments, in a plan view or on a plane, the storage controller 220 can be disposed on the upper surface of the substrate 210 adjacent to the connector 260a and the host connector, and the plurality of non-volatile memories 230 and the buffer memory 240 can be disposed on the upper surface of the substrate 210 adjacent to the storage controller 220.

[0057] Figure 3 is a diagram showing a storage device including an expansion storage module and a main storage module according to an example embodiment.

[0058] In Figure 3 , two directions that are parallel or substantially parallel to and cross (e.g., intersect) each other with respect to the first surface (e.g., the upper surface) of the substrate (such as the substrate 110 in Figure 1 and / or the substrate 210 in Figure 2 are referred to as a first direction D1 (e.g., the X-axis direction) and a second direction D2 (e.g., the Y-axis direction). In addition, the direction perpendicular or substantially perpendicular to the first surface of the substrate is referred to as a third direction D3 (e.g., the Z-axis direction). For example, the first direction D1 and the second direction D2 can be perpendicular or substantially perpendicular to each other. In addition, the third direction D3 can be perpendicular or substantially perpendicular to both the first direction D1 and the second direction D2. In addition, the direction indicated by the arrow in the figure and its opposite direction are regarded as the same direction. The definitions of the first direction D1, the second direction D2, and the third direction D3 are the same in the subsequent figures.

[0059] Referring to Figure 3 , the storage device 300a can include an expansion storage module 100a and a main storage module 200a.

[0060] In some example embodiments, the main storage module 200a and the storage device 300a including the main storage module 200a may be solid state drive (SSD) devices. For example, the main storage module 200a and the storage device 300a may be SSD devices used in data centers, servers, etc. that collect various data and provide various services, or may be SSD devices for replacing hard disk drive (HDD) devices used in personal computers (PCs), laptop computers, etc.

[0061] Hereinafter, example embodiments will be described based on an example where the main storage module 200a and the storage device 300a are SSD devices. However, the example embodiments are not limited thereto, and the main storage module 200a and the storage device 300a may be one of universal flash storage (UFS), multimedia card (MMC), embedded multimedia card (eMMC), secure digital (SD) card, micro SD card, memory stick, chip card, universal serial bus (USB) card, smart card, compact flash (CF) card, etc. In some embodiments, the main storage module 200a and the storage device 300a may be the same type or different types of storage devices.

[0062] For example, the expansion storage module 100a and the main storage module 200a may be (substantially) the same as the expansion storage module and the main storage module respectively referred to Figure 1 and Figure 2 described.

[0063] The connector 150a included in the expansion storage module 100a and the connector 260a included in the main storage module 200a may be directly connected to each other, and thereby the expansion storage module 100a and the main storage module 200a may be electrically and physically connected to each other.

[0064] In some example embodiments, the connector 260a may be a socket or may have a recessed structure (or groove structure), and the connector 150a may be a terminal or may have a protruding structure corresponding to the shape of the connector 260a. For example, the connector 150a may be inserted into the connector 260a such that the expansion storage module 100a is attached or coupled to the main storage module 200a, and the connector 150a may be removed from the connector 260a such that the expansion storage module 100a is detached or separated from the main storage module 200a. For example, the connector 150a and the connector 260a may be referred to as a male connector and a female connector, respectively.

[0065] However, the exemplary embodiment is not limited thereto, and the connector 150a included in the expansion storage module 100a may have a recessed structure, and the connector 260a included in the main storage module 200a may have a protruding structure. In addition, each of the connectors 150a and 260a may be implemented in various other structures to facilitate the connection between the expansion storage module 100a and the main storage module 200a.

[0066] In some example embodiments, each of the connectors 150a and 260a may include an electrical pin or pad. For example, the expansion storage module 100a and the main storage module 200a may exchange electrical signals, such as voltage signals and / or current signals (e.g., power supply voltage, control signals, etc.) through the connectors 150a and 260a. For example, the pin or pad may be a contact pad or a contact pin, but example embodiments are not limited thereto.

[0067] In some example embodiments, the expansion storage module 100a and the housing 140a included therein may have a rectangular parallelepiped shape (or a cuboid shape). Similarly, the main storage module 200a and the housing 250a included therein may have a rectangular parallelepiped shape. For example, each of the housing 140a and the housing 250a having a rectangular parallelepiped shape may include an upper surface, a lower surface, and four side surfaces, each of which has a rectangular shape. The upper surface and the lower surface may be parallel to each other, and the four side surfaces may intersect with the upper surface and the lower surface. Here, when element A is referred to as intersecting with element B, element A may intersect with element B. For example, the four side surfaces may intersect with the upper surface and the lower surface.

[0068] In some example embodiments, the connector 150a of the expansion storage module 100a may be at least partially exposed (e.g., protruding) from one of the upper surface and the lower surface of the housing 140a to the outside of the housing 140a. In some example embodiments, the connector 260a of the main storage module 200a may be formed from one of the upper surface and the lower surface of the housing 250a to the inside of the housing 250a, and may be at least partially exposed (e.g., a portion of the recessed structure may be exposed) to the outside of the housing 250a. For example, the connector 150a may extend outward from the housing 140a, and the connector 260a may extend inward from the housing 250a, or vice versa.

[0069] Figure 4A , Figure 4B , Figure 5A and Figure 5B is a perspective view of expansion enclosures, primary enclosures, and storage devices.

[0070] refer to Figure 4A and Figure 4B, shows an example in which the extended storage module 101a and the main storage module 201a are combined to form a storage device 301a. The extended storage module 101a, the main storage module 201a, and the storage device 301a may respectively correspond to Figure 1 , Figure 2 and Figure 3 the extended storage module 100a, the main storage module 200a, and the storage device 300a in

[0071] The main storage module 201a (e.g., the housing of the main storage module 201a) may have a first length L1 (in the first direction D1), a first thickness T1 (in the third direction D3), and a first width W (in the second direction D2). In other words, the first form factor of the main storage module 201a may be defined by the first length L1, the first thickness T1, and the first width W. Hereinafter, similar references to length, thickness, and width may refer to similar values of length, thickness, and width, rather than the same element. For example, the first length L1 of the extended storage module 101a and the first length L1 of the main storage module 201a may represent the same length value, rather than the same element.

[0072] The extended storage module 101a (e.g., the housing of the extended storage module 101a) may have a first length L1 (in the first direction D1), a thickness TA (in the third direction D3), and a first width W (in the second direction D2). For example, the thickness TA may be the same as or different from the first thickness T1.

[0073] The storage device 301a may be formed and / or implemented by attaching and / or combining the extended storage module 101a to the main storage module 201a. For example, a raised connector may be formed on the lower surface of the extended storage module 101a, and a recessed connector may be formed on the upper surface of the main storage module 201a. For example, when the raised connector is inserted into the recessed connector, the extended storage module 101a may be attached to the main storage module 201a such that the lower surface of the extended storage module 101a (e.g., the lower surface of the housing of the extended storage module 101a) and the upper surface of the main storage module 201a (e.g., the upper surface of the housing of the main storage module 201a) may be in contact with each other. However, the exemplary embodiments are not limited thereto, and one of the upper and lower surfaces of the extended storage module 101a (e.g., one of the upper and lower surfaces of the housing of the extended storage module 101a) and one of the upper and lower surfaces of the main storage module 201a (e.g., one of the upper and lower surfaces of the housing of the main storage module 201a) may be in contact with each other.

[0074] A storage device 301a formed by attaching and / or combining an extended storage module 101a to a main storage module 201a may have a first length L1 (in a first direction D1), a second thickness T2 (in a third direction D3), and a first width W (in a second direction D2). For example, the second thickness T2 may correspond to the sum of a first thickness T1 and a thickness TA (e.g., T2 = T1 + TA). In other words, the second form factor of the storage device 301a may be defined by the first length L1, the second thickness T2, and the first width W.

[0075] In some example embodiments, the main storage module 201a may have an E3.S form factor defined in the EDSFF, and the storage device 301a may have an E3.S 2T form factor defined in the EDSFF.

[0076] Reference Figure 5A and Figure 5B , an example of an extended storage module 103a and a main storage module 203a combined to form a storage device 303a is shown. For the sake of brevity, descriptions that are repetitive or overlapping with Figure 4A and Figure 4B may be omitted. The extended storage module 103a, the main storage module 203a, and the storage device 303a may respectively correspond to Figure 1 , Figure 2 and Figure 3 the extended storage module 100a, the main storage module 200a, and the storage device 300a in

[0077] The main storage module 203a (e.g., the housing of the main storage module 203a) may have a second length L2 (in the first direction D1), a first thickness T1 (in the third direction D3), and a first width W (in the second direction D2). For example, the second length L2 may be longer than Figure 4A the first length L1 in

[0078] The extended storage module 103a (e.g., the housing of the extended storage module 103a) may have a second length L2 (in the first direction D1), a thickness TA (in the third direction D3), and a first width W (in the second direction D2).

[0079] A storage device 303a that may be formed by attaching and / or combining the extended storage module 103a to the main storage module 203a may have a second length L2 (in the first direction D1), a second thickness T2 (in the third direction D3), and a first width W (in the second direction D2). In other words, the second form factor of the storage device 303a may be defined by the second length L2, the second thickness T2, and the first width W.

[0080] In some example embodiments, the main storage module 203a may have an E3.L form factor defined in the EDSFF, and the storage device 303a may have an E3.L 2T form factor defined in the EDSFF.

[0081] Figure 4A 、 Figure 4B 、 Figure 5A and Figure 5B The expansion storage modules 101a and 103a shown in may have the same length and the same width as the main storage modules 201a and 203a, respectively. The storage devices 301a and 303a formed by attaching the expansion storage modules 101a and 103a to the main storage modules 201a and 203a, respectively, may have the same length and the same width as the main storage modules 201a and 203a, respectively, and may be thicker than the main storage modules 201a and 203a, respectively. Accordingly, the expansion storage modules 101a and 103a may be referred to as thickness expansion modules.

[0082] Figure 6 is a block diagram showing an expansion storage module according to an example embodiment. For simplicity, descriptions that are repetitive or overlapping with the description of Figure 1 may be omitted.

[0083] Referring to Figure 6 , the expansion storage module 100b may include a substrate 110, a functional block 120, a control circuit 130, a housing 140b, and a connector 150b.

[0084] The expansion storage module 100b may be substantially the same as the expansion storage module 100a of Figure 1 , except that the position of the connector 150b and a structural portion of the housing 140b are changed. For example, the connector 150b may extend outwardly (e.g., may protrude) from a side surface of the housing 140b. The descriptions of the substrate 110, the functional block 120, the control circuit 130, the housing 140b, and the connector 150b may be substantially the same as those described with reference to Figure 1 .

[0085] Figure 7 is a block diagram showing a main storage module according to an example embodiment. For simplicity, descriptions that are repetitive or overlapping with the description of Figure 2 may be omitted.

[0086] Referring to Figure 7 , the main storage module 200b may include a substrate 210, a storage controller 220, a plurality of non-volatile memories 230, a buffer memory 240, a housing 250b, and a connector 260b.

[0087] ​​​​​​The main storage module 200b may be substantially the same as Figure 2 the main storage module 200a, except that the position of the connector 260b and a structural portion of the housing 250b are changed. For example, the connector 260b may extend inwardly from a side surface of the housing 250b. The description of the substrate 210, the storage controller 220, the plurality of non-volatile memories 230, the buffer memory 240, the housing 250b, and the connector 260b may be substantially the same as those described with reference to Figure 2 .

[0088] Figure 8 FIG. Figure 3 is a diagram illustrating a storage device including an extended storage module and a main storage module according to an exemplary embodiment. For the sake of brevity, descriptions that are repetitive or overlapping with the description of

[0089] may be omitted. Figure 8 , the storage device 300b may include an extended storage module 100b and a main storage module 200b.

[0090] The extended storage module 100b and the main storage module 200b may be substantially the same as those described with reference to Figure 6 and Figure 7 respectively.

[0091] The connector 150b included in the extended storage module 100b and the connector 260b included in the main storage module 200b may be directly connected to each other, and thus, the extended storage module 100b and the main storage module 200b may be electrically and physically connected to each other.

[0092] In some exemplary embodiments, the extended storage module 100b and the housing 140b included therein may have a rectangular parallelepiped shape. Similarly, the main storage module 200b and the housing 250b included therein may have a rectangular parallelepiped shape.

[0093] In some exemplary embodiments, the connector 150b of the extended storage module 100b may be at least partially exposed (e.g., protrude) from one of the four side surfaces of the housing 140b to the outside of the housing 140b. In some exemplary embodiments, the connector 260b of the main storage module 200b may be formed from one of the four side surfaces of the housing 250b to the inside of the housing 250b and may be at least partially exposed (e.g., a part of a recessed structure may be exposed) to the outside of the housing 250b.

[0094] Figure 9A , Figure 9B , Figure 10A and Figure 10B are perspective views of the extended storage module, the main storage module, and the storage device. For the sake of brevity, descriptions related to Figure 4A ,Figure 4B , Figure 5A and Figure 5B descriptions that are repetitive or overlapping with the description of

[0095] Referring to Figure 9A and Figure 9B , an example is shown in which the extended storage module 101b and the main storage module 201b are combined to form a storage device 301b. The extended storage module 101b, the main storage module 201b, and the storage device 301b may respectively correspond to Figure 6 , Figure 7 and Figure 8 the extended storage module 100b, the main storage module 200b, and the storage device 300b in

[0096] The main storage module 201b (e.g., the housing of the main storage module 201b) may have a first length L1 (in the first direction D1), a first thickness T1 (in the third direction D3), and a first width W (in the second direction D2). In other words, the first form factor of the main storage module 201b may be defined by the first length L1, the first thickness T1, and the first width W.

[0097] The extended storage module 101b (e.g., the housing of the extended storage module 101b) may have a length LB (in the first direction D1), a first thickness T1 (in the third direction D3), and a first width W (in the second direction D2). For example, the length LB may be different from the first length L1.

[0098] The storage device 301b may be formed and / or implemented by attaching and / or combining the extended storage module 101b to the main storage module 201b. For example, a raised connector may be formed on the right surface (or front surface) of the extended storage module 101b, and a recessed connector may be formed on the left surface (or rear surface) of the main storage module 201b. For example, when the raised connector is inserted into the recessed connector, the extended storage module 101b may be attached to the main storage module 201b such that the right surface of the extended storage module 101b (e.g., the right surface of the housing of the extended storage module 101b) and the left surface of the main storage module 201b (e.g., the left surface of the housing of the main storage module 201b) may be in contact with each other. However, the example embodiments are not limited thereto, and one of the four side surfaces of the extended storage module 101b (e.g., one of the four side surfaces of the housing of the extended storage module 101b) and one of the four side surfaces of the main storage module 201b (e.g., one of the four side surfaces of the housing of the main storage module 201b) may be in contact with each other.

[0099] A storage device 301b formed by attaching and / or combining an expansion storage module 101b to a main storage module 201b may have a second length L2 (in a first direction D1), a first thickness T1 (in a third direction D3), and a first width W (in a second direction D2). For example, the second length L2 may correspond to the sum of the first length L1 and a length LB (e.g., L2 = L1 + LB). In other words, the second form factor of the storage device 301b may be defined by the second length L2, the first thickness T1, and the first width W.

[0100] In some example embodiments, the main storage module 201b may have an E3.S form factor defined in the EDSFF, and the storage device 301b may have an E3.L form factor defined in the EDSFF.

[0101] Reference Figure 10A and Figure 10B , an example of an expansion storage module 103b and a main storage module 203b combined to form a storage device 303b is shown. For the sake of brevity, descriptions that are repetitive or overlapping with Figure 9A and Figure 9B may be omitted. The expansion storage module 103b, the main storage module 203b, and the storage device 303b may respectively correspond to Figure 6 , Figure 7 , Figure 8 the expansion storage module 100b, the main storage module 200b, and the storage device 300b in

[0102] The main storage module 203b (e.g., the housing of the main storage module 203b) may have a first length L1 (in a first direction D1), a second thickness T2 (in a third direction D3), and a first width W (in a second direction D2). For example, in Figure 9A , the second thickness T2 may be thicker than the first thickness T1. In other words, the first form factor of the main storage module 203b may be defined by the first length L1, the second thickness T2, and the first width W.

[0103] The expansion storage module 103b (e.g., the housing of the expansion storage module 103b) may have a length LB (in a first direction D1), a second thickness T2 (in a third direction D3), and a first width W (in a second direction D2).

[0104] A storage device 303b formed by attaching and / or combining an expansion storage module 103b to a main storage module 203b may have a second length L2 (in a first direction D1), a second thickness T2 (in a third direction D3), and a first width W (in a second direction D2). In other words, the second form factor of the storage device 303b may be defined by the second length L2, the second thickness T2, and the first width W.

[0105] In some example embodiments, the main storage module 203b may have an E3.S 2T form factor defined in the EDSFF, and the storage device 303b may have an E3.L 2T form factor defined in the EDSFF.

[0106] Figure 9A 、 Figure 9B 、 Figure 10A and Figure 10B The expansion storage modules 101b and 103b shown in may respectively have the same thickness and the same width as the main storage modules 201b and 203b. The storage devices 301b and 303b formed by attaching the expansion storage modules 101b and 103b to the main storage modules 201b and 203b respectively may respectively have the same thickness and the same width as the main storage modules 201b and 203b, and may be respectively longer than the main storage modules 201b and 203b. Accordingly, the expansion storage modules 101b and 103b may be referred to as length expansion modules.

[0107] Figure 11 is a block diagram showing an expansion storage module according to an example embodiment. For simplicity, descriptions that are repetitive or overlapping with the description of Figure 1 may be omitted.

[0108] Referring to Figure 11 , the expansion storage module 100c may include a substrate 110, a functional block 120, a control circuit 130, a housing 140c, and a connector 150c. The expansion storage module 100c may further include a connection part 155c.

[0109] The expansion storage module 100c may be substantially the same as the expansion storage module 100a of Figure 1 , except that it further includes a connection part 155c, and the position of the connector 150c and the structure and shape of the housing 140c are partially changed.

[0110] The connection part 155c may electrically connect the substrate 110 to the connector 150c. For example, the connection part 155c may include a cable, a PCB, and / or a flexible PCB (FPCB).

[0111] Figure 12 is a diagram showing a storage device including an expansion storage module and a main storage module according to an example embodiment. For simplicity, descriptions that are repetitive or overlapping with the description of Figure 3 may be omitted.

[0112] Referring to Figure 12 , the storage device 300c may include an expansion storage module 100c and a main storage module 200b.

[0113] The extended storage module 100c and the main storage module 200b can be substantially the same as those respectively described above with reference to Figure 11 and Figure 7 are substantially the same.

[0114] The connector 150c included in the extended storage module 100c and the connector 260b included in the main storage module 200b can be directly connected to each other, and thus, the extended storage module 100c and the main storage module 200b can be electrically and physically connected to each other.

[0115] In some example embodiments, the extended storage module 100c and the housing 140c included therein can have a two - stage stepped shape (e.g., an inverted two - stage stepped shape). For example, the housing 140c having a two - stage stepped shape can include an upper surface, an intermediate surface, a lower surface, a first side surface, a second side surface, a third side surface, a fourth side surface, and a fifth side surface. The upper surface, the intermediate surface, and the lower surface can be parallel to each other, and each of the upper surface, the intermediate surface, and the lower surface can have a rectangular shape. The first side surface and the second side surface can intersect with the upper surface, the intermediate surface, and the lower surface, the third side surface can intersect with the upper surface and the intermediate surface, the fourth side surface can intersect with the upper surface and the lower surface, and the fifth side surface intersects with the intermediate surface and the lower surface.

[0116] In some example embodiments, the connector 150c of the extended storage module 100c can be at least partially exposed (e.g., protrude) from the fifth side surface of the housing 140c to the outside of the housing 140c.

[0117] Figure 13 is a block diagram showing an extended storage module according to an example embodiment. For simplicity, descriptions that are repetitive or overlapping with the descriptions of Figure 1 and Figure 11 can be omitted.

[0118] Referring to Figure 13 , the extended storage module 100d can include a substrate 110, a functional block 120, a control circuit 130, a housing 140d, and a connector 150d.

[0119] The extended storage module 100d can be substantially the same as the extended storage module 100a of Figure 1 , except that the position of the connector 150d and the structure and shape of the housing 140d are partially changed.

[0120] Figure 14 is a diagram showing a storage device including an extended storage module and a main storage module according to an example embodiment. For simplicity, descriptions that are repetitive or overlapping with the descriptions of Figure 3 and Figure 12 can be omitted.

[0121] Reference Figure 14 The storage device 300d may include an expansion storage module 100d and a main storage module 200a.

[0122] The expansion storage module 100d and the main storage module 200a may be substantially the same as those described with reference to Figure 13 and Figure 2 respectively.

[0123] The connector 150d included in the expansion storage module 100d and the connector 260a included in the main storage module 200a may be directly connected to each other, and thus, the expansion storage module 100d and the main storage module 200a may be electrically and physically connected to each other.

[0124] In some example embodiments, the expansion storage module 100d and the housing 140d included therein may have a two - stage stepped shape.

[0125] In some example embodiments, the connector 150d of the expansion storage module 100d may be at least partially exposed (e.g., protruded) from the middle surface of the housing 140d to the outside of the housing 140d.

[0126] Figure 15A and Figure 15B are perspective views of the expansion storage module, the main storage module, and the storage device. For the sake of brevity, descriptions that are repetitive or overlapping with Figure 4A , Figure 4B , Figure 5A , Figure 5B , Figure 9A , Figure 9B , Figure 10A and Figure 10B may be omitted.

[0127] Reference Figure 15A and Figure 15B , for example, the expansion storage module 101c and the main storage module 201b may be combined to form a storage device 301c. In another example, the expansion storage module 101d and the main storage module 201a may be combined to form a storage device 301d. The expansion storage module 101c and the expansion storage module 101d may respectively correspond to the expansion storage module 100c of Figure 11 and the expansion storage module 100d of Figure 13 . The main storage module 201b and the main storage module 201a may respectively correspond to the main storage module 200b of Figure 7 and the main storage module 200a of Figure 2 . The storage device 301c and the storage device 301d may respectively correspond to the storage device 300c of Figure 12 and the storage device 300d of Figure 14 .

[0128] As described above, the extended storage module 101c (or extended storage module 101d) may have a two - level stepped shape. For example, in the extended storage module 101c (or extended storage module 101d) and the housing it includes, the upper surface may have a second length L2 (in the first direction D1) and a first width W (in the second direction D2), the intermediate surface may have a first length L1 (in the first direction D1) and a first width W, and the lower surface may have a length LB (in the first direction D1) and a first width W. For example, the extended storage module 101c (or extended storage module 101d) and the housing it includes may have a first side surface where the upper surface and the lower surface meet, and a second side surface that is symmetric and opposite to the first side surface (in the second direction D2). For example, in the extended storage module 101c (or extended storage module 101d) and the housing it includes, the third side surface may have a height corresponding to the thickness TA (in the third direction D3) and a first width W, the fourth side surface may have a height corresponding to the second thickness T2 (in the third direction D3) and a first width W, and the fifth side surface may have a height corresponding to the first thickness T1 (in the third direction D3) and a first width W.

[0129] In some embodiments, the storage device 301c may be formed and / or implemented by attaching and / or combining the extended storage module 101c to the main storage module 201b. For example, a raised connector may be formed on the fifth side surface of the extended storage module 101c, and a recessed connector may be formed on the left side surface (or rear surface) of the main storage module 201b. For example, when the raised connector is inserted into the recessed connector, the extended storage module 101c may be attached to the main storage module 201b such that the intermediate surface of the extended storage module 101c contacts the upper surface of the main storage module 201b, and the fifth side surface of the extended storage module 101c contacts the left side surface of the main storage module 201b. In some embodiments, the storage device 301d may be formed and / or implemented by attaching and / or combining the extended storage module 101d to the main storage module 201a. For example, a raised connector may be formed on the intermediate surface of the extended storage module 101d, and a recessed connector may be formed on the upper surface of the main storage module 201a. For example, when the raised connector is inserted into the recessed connector, the extended storage module 101d may be attached to the main storage module 201a such that the intermediate surface of the extended storage module 101d contacts the upper surface of the main storage module 201a, and the fifth side surface of the extended storage module 101d contacts the left side surface of the main storage module 201a.

[0130] Each of the storage devices 301c formed by attaching and / or combining the expansion storage module 101c to the main storage module 201b and the storage device 301d formed by attaching and / or combining the expansion storage module 101d to the main storage module 201a may have a second length L2, a second thickness T2, and a first width W. In other words, the second form factor of the storage device 301c (or the storage device 301d) may be defined by the second length L2, the second thickness T2, and the first width W.

[0131] In some example embodiments, the main storage module 201b may have an E3.S form factor defined in the EDSFF, and the storage device 301c may have an E3.L 2T form factor defined in the EDSFF. In some example embodiments, the main storage module 201a may have an E3.S form factor defined in the EDSFF, and the storage device 301d may have an E3.L 2T form factor defined in the EDSFF.

[0132] Figure 15A and Figure 15B The expansion storage module 101c shown in may have the same width (in the second direction D2) as the main storage module 201b. Figure 15A and Figure 15B The expansion storage module 101d shown in may have the same width (in the second direction D2) as the main storage module 201a. The storage device 301c formed by attaching the expansion storage module 101c to the main storage module 201b may have the same width (in the second direction D2) as the main storage module 201b, and may be longer (in the first direction D1) and thicker (in the third direction D3) than the main storage module 201b. Therefore, the expansion storage module 101c may be referred to as a volume expansion module. The storage device 301d formed by attaching the expansion storage module 101d to the main storage module 201a may have the same width (in the second direction D2) as the main storage module 201a, and may be longer (in the first direction D1) and thicker (in the third direction D3) than the main storage module 201a. Therefore, the expansion storage module 101d may be referred to as a volume expansion module.

[0133] All of the main storage modules 201a, 203a, 201b and 203b, the expansion storage modules 101a, 103a, 101b, 103b, 101c and 101d, and the storage devices 301a, 303a, 301b, 303b, 301c and 301d may have the same width (in the second direction D2).

[0134] Figure 16 is a diagram showing the form factor of a storage device according to an example embodiment.

[0135] Reference Figure 16 , showing the E3.S form factor, E3.S 2T form factor, E3.L form factor, and E3.L 2T form factor defined in the EDSFF. Figure 16 The four form factors shown in can have different lengths and different thicknesses, and can have the same width. In some example embodiments, the width can be referred to as the height, and the thickness can be defined as the width.

[0136] Factors determining the form factor of a storage device can include power, capacity, performance, hardware configuration, etc. Among the various components included in the storage device, the component that occupies the largest volume in the hardware configuration can be the energy storage component. Even if storage devices with the same performance are developed, storage devices with the E3.S form factor with the smallest form factor or the E3.L 2T form factor with the largest form factor can be developed depending on the presence or absence of a power loss protection (PLP) function. Alternatively, the types of supported form factors can vary according to customer requirements and / or specifications. Therefore, it is necessary to develop and manufacture storage devices with the same performance and various form factors, which increases the burden and cost of the manufacturing process.

[0137] In an extended storage module and a storage device according to an example embodiment, an extended storage module can be used to change the form factor of the storage device. For example, the extended storage module can be attached and / or combined with a main storage module having a first form factor, and thus, a storage device having a second form factor can be formed. The connection between the extended storage module and the main storage module can be achieved by adding connectors with relatively simple design changes without excessive design changes. In addition, the extended storage module can provide at least one of various functions to the main storage module, such as providing an auxiliary power voltage to the main storage module or reducing the heat emitted from the main storage module. Therefore, the form factor of the storage device can be effectively changed using the extended storage module, additional functions can be effectively provided to the storage device, and the customer's environment can be easily and flexibly responded to.

[0138] Figure 17 and Figure 18 are block diagrams showing the operations of an extended storage module and a storage device including the extended storage module according to an example embodiment.

[0139] Reference Figure 17 , showing an example of a functional block 120 included in an extended storage module (e.g., the extended storage module 100a in Figure 1 ) and an example of a control circuit 130, and showing an example of a storage controller 220a included in a main storage module (e.g., the main storage module 200a in Figure 2 ).

[0140] In some example embodiments, the functional block 120 may include an energy storage element 120a, and the control circuit 130 may include an energy management circuit 130a.

[0141] The energy storage element 120a may store energy based on the main power supply voltage PWR and may provide an auxiliary power supply voltage APWR to the main storage module (e.g., to the storage controller 220a). For example, the energy storage element 120a may include a capacitor, a battery, a supercapacitor, etc. For example, the capacitor that can be included in the energy storage element 120a may be classified as an electrolytic capacitor, a thin film capacitor, a tantalum capacitor, a ceramic capacitor, etc. according to the dielectric material included therein. For example, the main power supply voltage PWR may be provided by the main storage module.

[0142] When the expansion storage module is connected to the main storage module, the energy management circuit 130a may provide module information MI1 to the main storage module (e.g., to the storage controller 220a). When receiving a power request signal PREQ from the main storage module (e.g., from the storage controller 220a), the energy management circuit 130a may control the energy storage element 120a by generating a control signal ECON for controlling the energy storage element 120a, so as to provide the auxiliary power supply voltage APWR to the main storage module (e.g., to the storage controller 220a).

[0143] In addition, the energy management circuit 130a may manage the charging and discharging operations of the energy storage element 120a, may monitor the operation and life of the energy storage element 120a, and / or may notify the main storage module (e.g., the storage controller 220a) that the auxiliary power supply voltage APWR cannot be provided when a defect or failure occurs in the energy storage element 120a.

[0144] When the expansion storage module is attached to the main storage module, the storage controller 220a may read the module information MI1 from the expansion storage module (e.g., from the energy management circuit 130a) and may check or identify the module information MI1.

[0145] When it is checked based on the module information MI1 that the expansion storage module includes the energy storage element 120a and the energy management circuit 130a, the storage controller 220a may determine the dump size of the data dump operation to be performed when a data dump event occurs based on the module information MI1. For example, the storage controller 220a may include a dump size manager 222 for determining the dump size.

[0146] The data dump operation may represent or indicate an operation to normally terminate the operation of a storage device based on an auxiliary power supply voltage APWR. The data dump operation may be referred to as a PLP operation or a PLP dump operation. For example, during the data dump operation, the storage device may temporarily operate based on the auxiliary power supply voltage APWR, and before the auxiliary power supply voltage APWR is blocked from being provided, a reset operation and / or a flush operation for transferring data from a buffer memory (e.g., Figure 2 the buffer memory 240) to a plurality of non-volatile memories (e.g., the plurality of non-volatile memories 230) may be performed based on the auxiliary power supply voltage APWR. The dump size may represent or indicate the size of the data to be moved from the buffer memory 240 to the plurality of non-volatile memories 230.

[0147] When a data dump event occurs, the storage controller 220a may generate a power request signal PREQ. For example, the storage controller 220a may include a command generator 224 that generates and / or detects a data dump event and a sudden power-off (SPO) detector 226.

[0148] In some example embodiments, the data dump event may occur based on a data dump command generated from the storage controller 220a. For example, the command generator 224 may generate a data dump command, and the storage controller 220a may generate a power request signal PREQ based on the data dump command.

[0149] In some example embodiments, the data dump event may occur based on the state of the main power supply voltage PWR monitored by the storage controller 220a. For example, the SPO detector 226 may monitor the main power supply voltage PWR. For example, in an SPO condition (or situation) where the main power supply voltage PWR suddenly (e.g., unexpectedly) shuts off, for example, when the voltage level of the main power supply voltage PWR becomes lower than a reference voltage level, the storage controller 220a may generate a power request signal PREQ.

[0150] When a data dump event occurs, the storage controller 220a may generate a power request signal PREQ, may receive an auxiliary power supply voltage APWR from an energy storage element 120a, and may perform a data dump operation based on the auxiliary power supply voltage APWR and the dump size determined by a dump size manager 222.

[0151] Although Figure 17 not shown, the main power supply voltage PWR may be provided from an external host device to all components of the main storage module and the extended storage module, and the auxiliary power supply voltage APWR may be provided to all components of the main storage module. When the data dump operation is completed, the storage controller 220a may generate a request to stop providing the auxiliary power supply voltage APWR.

[0152] Reference Figure 18 , shows an example of a functional block 120 included in an extended storage module (e.g., the extended storage module 100a in Figure 1 ) and an example of a control circuit 130, and shows an example of a storage controller 220b included in a main storage module (e.g., the main storage module 200a in Figure 2 ).

[0153] In some example embodiments, the functional block 120 may include a cooling element 120b, and the control circuit 130 may include a cooling control circuit 130b.

[0154] The cooling element 120b may provide a cooling function CLF to reduce heat emitted or generated from the main storage module (e.g., from the storage controller 220b) (e.g., control the operating temperature). For example, the cooling element 120b may include a fan that provides forced air, a water-cooled cooler that provides cold water, a thermoelectric cooler (TEC), etc.

[0155] When the extended storage module is attached to the main storage module, the cooling control circuit 130b may provide module information MI2 to the main storage module (e.g., to the storage controller 220b). When receiving a cooling request signal CREQ from the main storage module (e.g., from the storage controller 220b), the cooling control circuit 130b may control the cooling element 120b by generating a control signal CCON for controlling the cooling element 120b, so that the operating temperature of the main storage module (e.g., the storage controller 220b) is reduced (so as to provide the cooling function CLF to the main storage module (e.g., to the storage controller 220b)). For example, the cooling control circuit 130b may include a power management integrated circuit (PMIC), a microcontroller unit (MCU), etc.

[0156] When the extended storage module is attached to the main storage module, the storage controller 220b may read the module information MI2 from the extended storage module (e.g., from the cooling control circuit 130b), and may check or identify the module information MI2.

[0157] When it is checked based on the module information MI2 that the extended storage module includes the cooling element 120b and the cooling control circuit 130b, the storage controller 220b may monitor the operating temperature and may generate a cooling request signal CREQ. For example, the storage controller 220b may include a temperature sensor 228 that measures the operating temperature.

[0158] When the operating temperature becomes higher than the reference temperature, the storage controller 220b may generate a cooling request signal CREQ and may receive the cooling function CLF from the cooling element 120b.

[0159] AlthoughFigure 18 Although not shown in the figure, when the operating temperature becomes lower than the second reference temperature due to the cooling function CLF, the storage controller 220b may generate a request to stop providing the cooling function CLF.

[0160] In some example embodiments, the functional block 120, the control circuit 130, and the storage controller 220 may be implemented by examples in combination with Figure 17 and Figure 18 are flowcharts showing methods of operating a storage device according to example embodiments.

[0161] Figure 19 , Figure 20 , Figure 21 , Figure 22 , Figure 23 and Figure 24 are flowcharts showing methods of operating a storage device according to example embodiments.

[0162] Referring to Figure 19 , in the method of operating a storage device according to an example embodiment, an extended storage module is combined with a main storage module (operation S100). For example, as described in reference to Figures 1 to 16 , the extended storage module and the main storage module can be combined in various ways through a connector, and thus, the form factor of the storage device can be changed.

[0163] The storage controller included in the main storage module may read module information from the extended storage module and check the module information (operation S200). The storage controller may control the operation of the extended storage module based on the module information (operation S300). For example, based on the module information, the functions provided by the extended storage module can be identified, and appropriate control operations can be performed.

[0164] Referring to Figure 17 and Figure 20 , an example of providing an auxiliary power voltage APWR from the extended storage module in operation S300 of Figure 19 is shown.

[0165] For example, the storage controller 220a may determine the dump size of the data dump operation based on the module information MI1 (operation S410). When a data dump event occurs (operation S420: Yes), the storage controller 220a may send a power request signal PREQ to the energy management circuit 130a (operation S430), may receive the auxiliary power voltage APWR provided from the energy storage element 120a under the control of the energy management circuit 130a (operation S440), and may perform a data dump operation based on the auxiliary power voltage APWR and the dump size (operation S450).

[0166] When a data dump event does not occur (Operation S420: No), the storage controller 220a may wait for the occurrence of a data dump event (Operation S425), or may perform at least one of various normal operations of the storage device.

[0167] Reference Figure 17 and Figure 21 , shows Figure 20 an example of checking for the occurrence of a data dump event in Operation S420 of

[0168] When the command generator 224 generates a data dump command (Operation S422: Yes), the storage controller 220a may determine that a data dump event has occurred (Operation S424), and may perform Operations S430, S440, and S450. When the command generator 224 does not generate a data dump command (Operation S422: No), the storage controller 220a may determine that a data dump event has not occurred (Operation S426), and may perform Operation S425.

[0169] Reference Figure 17 and Figure 22 , shows Figure 20 an example of checking for the occurrence of a data dump event in Operation S420 of

[0170] When it is detected by monitoring the main power supply voltage PWR that the voltage level of the main power supply voltage PWR has become lower than the reference voltage level (Operation S423: Yes), the storage controller 220a may determine that a data dump event has occurred (Operation S424), and may perform Operations S430, S440, and S450. When the voltage level of the main power supply voltage PWR is higher than or equal to the reference voltage level (Operation S423: No), the storage controller 220a may determine that a data dump event has not occurred (Operation S426), and may perform Operation S425.

[0171] Reference Figure 18 and Figure 23 , shows Figure 19 an example of providing a cooling function CLF from an extended storage module in Operation S300 of

[0172] For example, the storage controller 220b may use the temperature sensor 228 to check or monitor the operating temperature (Operation S510). When the operating temperature becomes higher than the reference temperature (Operation S520: Yes), the storage controller 220b may send a cooling request signal CREQ to the cooling control circuit 130b (Operation S530), and may perform a cooling operation (Operation S540) based on the cooling function CLF provided from the cooling element 120b under the control of the cooling control circuit 130b.

[0173] When the operating temperature is lower than or equal to the reference temperature (operation S520: No), the storage controller 220b may wait to increase the operating temperature (operation S525) or may perform at least one of various normal operations of the storage device.

[0174] For example, when the operating temperature becomes lower than the second reference temperature through a cooling operation, the storage controller 220b may generate a request to stop the cooling operation (e.g., stop the operation of the cooling element 120b).

[0175] Reference Figure 24 , in the method of operating a storage device according to an exemplary embodiment, operations S100, S200, and S300 may be substantially the same as those Figure 19 described.

[0176] When an abnormal event occurs in the expansion storage module (operation S600: Yes), the storage controller may generate a notification signal (operation S700) and may change the state of the storage device (operation S800).

[0177] In some exemplary embodiments, the abnormal event may indicate a situation where an operation abnormality, defect, failure, etc. of the expansion storage module is detected. For example, when the expansion storage module includes the energy storage element 120a, the abnormal event may indicate that the energy storage element 120a cannot operate normally due to the end of the service life of the energy storage element 120a and / or defects or failures such as open circuit, short circuit, etc. occurring in the energy storage element 120a. For example, when the expansion storage module includes the cooling element 120b, the abnormal event may indicate that the operating temperature does not decrease even when the cooling element 120b is driven because the cooling element 120b cannot operate normally.

[0178] In some exemplary embodiments, the state change may indicate an operation of replacing the expansion storage module. For example, the replacement operation may be performed by detaching the defective expansion storage module from the main storage module and attaching a normal expansion storage module to the main storage module.

[0179] In some exemplary embodiments, the state change may indicate an operation of processing or disposing of the expansion storage module as an unavailable state. For example, the operation mode of the expansion storage module may be changed so that the function of the expansion storage module is not used while maintaining the connection of the expansion storage module.

[0180] When no abnormal event occurs (operation S600: No), operation S300 may be continued or repeated.

[0181] Traditionally, the functional block 120 is formed to be integrated into a storage device (e.g., mounted on a substrate 210), and there is a problem that it is difficult to replace or change the functional block 120. In addition, due to the heat generation of the controller chip, memory chip, etc., there is a problem that the lifespan of the functional block 120 is shortened.

[0182] In the storage device according to the exemplary embodiment, the functional block 120 may be included in an extended storage module formed separately from the main storage module. Therefore, the possibility of defects or failures can be reduced, and the operation of replacing or changing the functional block 120 can be performed relatively easily.

[0183] Figure 25 is a block diagram showing an extended storage module according to an exemplary embodiment. For the sake of brevity, descriptions that are repetitive or overlapping with Figure 1 will be omitted.

[0184] Refer to Figure 25 , the extended storage module 100e may include a substrate 110, a functional block 120, a control circuit 130, a housing 140a, and a connector 150a. The extended storage module 100e may also include a compensation circuit (COMP) 160.

[0185] The extended storage module 100e may be substantially the same as Figure 1 the extended storage module 100a, except that the extended storage module 100e further includes a compensation circuit 160.

[0186] When the extended storage module 100e and the main storage module 200a are connected to each other through the connectors 150a and 260a, the compensation circuit 160 may correct or compensate for signal distortion (e.g., signal integrity (SI) distortion) caused by the connectors 150a and 260a.

[0187] Although not shown in detail, Figure 6 , Figure 11 and Figure 13 each of the extended storage modules 100b, 100c, and 100d of

[0188] Figure 26 may also include a compensation circuit 160.

[0189] Refer to Figure 26 , the storage system 500 may include a host device 600 and a storage device 700.

[0190] The host device 600 may control the overall operation of the storage system 500. The host device 600 may include a host processor 610 and a host memory 620.

[0191] The host processor 610 may control the operation of the host device 600. For example, the host processor 610 may execute an operating system (OS). For example, the operating system may include a file system for file management and a device driver for controlling peripheral devices including the storage device 700 at the operating system level. The host memory 620 may store instructions and / or data executed and / or processed by the host processor 610.

[0192] The storage device 700 may be accessed by the host device 600. The storage device 700 may include a main storage module 710 and an extended storage module 720.

[0193] The main storage module 710 may include a storage controller 712, a plurality of non-volatile memories 714a, 714b, and 714c, and a buffer memory 716.

[0194] The storage controller 712 may control the operation of the storage device 700. For example, the storage controller 712 may control the operation of the main storage module 710 and the extended storage module 720 based on requests and data received from the host device 600.

[0195] The plurality of non-volatile memories 714a, 714b, and 714c may be controlled by the storage controller 712 and may store a plurality of data. For example, the plurality of non-volatile memories 714a, 714b, and 714c may store metadata, various user data, etc.

[0196] In some example embodiments, each of the plurality of non-volatile memories 714a, 714b, and 714c may include a NAND flash memory. In some example embodiments, each of the plurality of non-volatile memories 714a, 714b, and 714c may include, for example, an electrically erasable programmable read-only memory (EEPROM), a phase change random access memory (PRAM), a resistive random access memory (RRAM), a nano floating gate memory (NFGM), a polymer random access memory (PoRAM), a magnetic random access memory (MRAM), a ferroelectric random access memory (FRAM), etc.

[0197] The buffer memory 716 may store instructions and / or data executed and / or processed by the storage controller 712 and may temporarily store data that has been stored or will be stored in the plurality of non-volatile memories 714a, 714b, and 714c. For example, the buffer memory 716 may include at least one of various volatile memories, such as a static random access memory (SRAM), a dynamic random access memory (DRAM), etc.

[0198] The extended storage module 720 and the storage device 700 may be an extended storage module and a storage device according to example embodiments and may utilize referenceFigures 1 to 25 The described structure performs operations. When the expansion storage module 720 is attached to the main storage module 710, the main storage module 710 having a first form factor can be changed into a storage device 700 having a second form factor (by physically and electrically connecting to the expansion storage module 720). In addition, the expansion storage module 720 can provide various functions to the main storage module 710, such as providing an auxiliary power voltage to the main storage module 710 and / or reducing heat emitted from the main storage module 710.

[0199] In some example embodiments, the storage device 700 can be connected (e.g., electrically connected) to the host device 600 via a block-accessible interface, which can include, for example, UFS, eMMC, Non-Volatile Memory Express (NVMe) bus, Serial Advanced Technology Attachment (SATA) bus, Small Computer System Interface (SCSI) bus, Serial Attached SCSI (SAS) bus, etc. The storage device 700 can provide a block-accessible interface to the host device 600 using a block-accessible address space corresponding to the access sizes of the plurality of non-volatile memories 714a, 714b, and 714c to allow access to data stored in the plurality of non-volatile memories 714a, 714b, and 714c in units of storage blocks.

[0200] Figure 27 is a block diagram showing a data center including a storage device according to an example embodiment.

[0201] Reference Figure 27 , the data center 3000 can be a facility that collects various types of data and provides various services, and can be referred to as a data storage center. The data center 3000 can be a system for operating a search engine and a database, and can be a computing system used by a company such as a bank or a government agency. The data center 3000 can include application servers 3100 to 3100n and storage servers 3200 to 3200m. The number of application servers 3100 to 3100n and the number of storage servers 3200 to 3200m can be selected differently according to example embodiments, and the number of application servers 3100 to 3100n and the number of storage servers 3200 to 3200m can be different from each other.

[0202] The application server 3100 may include at least one processor 3110 and at least one memory 3120, and the storage server 3200 may include at least one processor 3210 and at least one memory 3220. The operation of the storage server 3200 will be described as an example. The processor 3210 may control the overall operation of the storage server 3200 and may access the memory 3220 to execute instructions and / or data loaded in the memory 3220. The memory 3220 may include, for example, double data rate (DDR) synchronous dynamic random access memory (SDRAM), high bandwidth memory (HBM), hybrid memory cube (HMC), dual in-line memory module (DIMM), Optane DIMM, non-volatile DIMM (NVDIMM), etc. The number of processors 3210 and the number of memories 3220 included in the storage server 3200 may be differently selected according to the exemplary embodiments. In some exemplary embodiments, the processor 3210 and the memory 3220 may provide a processor-memory pair. In some exemplary embodiments, the number of processors 3210 and the number of memories 3220 may be different from each other. The processor 3210 may include a single-core processor or a multi-core processor. The above description of the storage server 3200 may be similarly applied to the application server 3100. The application server 3100 may include at least one storage device 3150, and the storage server 3200 may include at least one storage device 3250. In some exemplary embodiments, the application server 3100 may not include the storage device 3150. The number of storage devices 3250 included in the storage server 3200 may be differently selected according to the exemplary embodiments.

[0203] The application servers 3100 to 3100n and the storage servers 3200 to 3200m may communicate with each other through the network 3300. The network 3300 may be implemented using Fibre Channel (FC) or Ethernet. FC may be a medium for relatively high-speed data transmission and may use optical switches that provide high performance and / or high availability. The storage servers 3200 to 3200m may be provided as file storage, block storage, or object storage according to the access scheme of the network 3300.

[0204] In some example embodiments, network 3300 may be a storage-only network or a network dedicated to storage, such as a storage area network (SAN). For example, a SAN may be an FC-SAN that uses an FC network and is implemented according to the FC protocol (FCP). As another example, a SAN may be an IP-SAN that uses a Transmission Control Protocol / Internet Protocol (TCP / IP) network and may be implemented according to the iSCSI (SCSI over TCP / IP or Internet SCSI) protocol. In other example embodiments, network 3300 may be a general network such as a TCP / IP network. For example, network 3300 may be implemented according to at least one of protocols such as Fibre Channel over Ethernet (FCoE), Network Attached Storage (NAS), Non-Volatile Memory Express over Fabrics (NVMe) (NVMe-oF), etc.

[0205] Hereinafter, example embodiments will be described based on application server 3100 and storage server 3200. The description of application server 3100 may be applied to other application servers 3100n, and the description of storage server 3200 may be applied to other storage servers 3200m.

[0206] Application server 3100 may store data requested by a user or a client through network 3300 into (at least) one of storage servers 3200 to 3200m. In addition, application server 3100 may obtain data requested by a user or a client to be read through network 3300 from (at least) one of storage servers 3200 to 3200m. For example, application server 3100 may be implemented as a web server or a database management system (DBMS).

[0207] The application server 3100 can access the memory 3120n or the storage device 3150n included in another application server 3100n through the network 3300, and / or can access the memory 3220 to 3220m or the storage device 3250 to 3250m included in the storage servers 3200 to 3200m through the network 3300. Therefore, the application server 3100 can perform various operations on the data stored in the application servers 3100 to 3100n and / or the storage servers 3200 to 3200m. For example, the application server 3100 can execute commands for moving or copying data between the application servers 3100 to 3100n and the storage servers 3200 to 3200m. The data can be transmitted from the storage devices 3250 to 3250m of the storage servers 3200 to 3200m to the memories 3120 to 3120n of the application servers 3100 to 3100n directly or through the memories 3220 to 3220m of the storage servers 3200 to 3200m. For example, the data transmitted through the network 3300 can be data encrypted for security or privacy purposes.

[0208] In the storage server 3200, the interface 3254 of the storage device 3250 can provide a physical (and / or electrical) connection between the processor 3210 and the controller 3251 of the storage device 3250 and / or a physical (and / or electrical) connection between the network interface card (NIC) 3240 and the controller 3251. For example, the interface 3254 can be implemented based on a direct attached storage (DAS) scheme, where the storage device 3250 is directly connected to a dedicated cable. For example, the interface 3254 can be implemented based on at least one of various interface schemes, such as Advanced Technology Attachment (ATA), Serial ATA (SATA), External SATA (e-SATA), Small Computer System Interface (SCSI), Serial Attached SCSI (SAS), Peripheral Component Interconnect (PCI), PCI Express (PCIe), NVMe, Compute Express Link (CXL), IEEE 1394, Universal Serial Bus (USB), Secure Digital (SD) card interface, Multimedia Card (MMC) interface, Embedded MMC (eMMC) interface, Universal Flash Storage (UFS) interface, Embedded UFS (eUFS) interface, CompactFlash (CF) card interface, etc.

[0209] The storage server 3200 can also include a switch 3230 and a NIC 3240. The switch 3230 can selectively connect the processor 3210 to the storage device 3250 or selectively connect the NIC 3240 to the storage device 3250 under the control of the processor 3210. Similarly, the application server 3100 can also include a switch 3130 and a NIC 3140.

[0210] In some example embodiments, the NIC 3240 may include a network interface card, a network adapter, etc. The NIC 3240 may be connected to the network 3300 through a wired interface, a wireless interface, a Bluetooth interface, an optical fiber interface, etc. The NIC 3240 may also include an internal memory, a digital signal processor (DSP), a host bus interface, etc., and may be connected to the processor 3210 and / or the switch 3230 through the host bus interface. The host bus interface may be implemented as one of the above examples of the interface 3254. In some example embodiments, the NIC 3240 may be integrated with at least one of the processor 3210, the switch 3230, and the storage device 3250.

[0211] In the storage servers 3200 to 3200m and / or the application servers 3100 to 3100n, the processor may send commands to the storage devices 3150 to 3150n and 3250 to 3250m or the memories 3120 to 3120n and 3220 to 3220m to program or read data. For example, the data may be data error-corrected by an error correction code (ECC) engine. For example, the data may be processed by data bus inversion (DBI) or data masking (DM), and may include cyclic redundancy code (CRC) information. For example, the data may be data encrypted for security or privacy purposes.

[0212] The storage devices 3150 to 3150n and 3250 to 3250m may send control signals and command / address signals to the NAND flash devices 3252 to 3252m of the storage device 3250 to 3250m in response to read commands received from the processor. When reading data from the NAND flash devices 3252 to 3252m, the read enable (RE) signal may be input as a data output control signal and may be used to output data to the DQ bus. A data strobe signal (DQS) may be generated using the RE signal. The command and address signals may be latched into the page buffer based on the rising edge or falling edge of the write enable (WE) signal.

[0213] The controller 3251 may control the overall operation of the storage device 3250. In some example embodiments, the controller 3251 may include static random access memory (SRAM). The controller 3251 may write data to the NAND flash device 3252 in response to a write command, or may read data from the NAND flash device 3252 in response to a read command. For example, the write command and / or the read command may be provided by the processor 3210 in the storage server 3200, the processor 3210m in another storage server 3200m, or the processors 3110 to 3110n in the application servers 3100 to 3100n. The DRAM 3253 in the storage device 3250 may temporarily store (e.g., buffer) the data to be written to the NAND flash device 3252 or the data read from the NAND flash device 3252. In addition, the DRAM 3253 may store metadata. The metadata may be data generated by the controller 3251 for managing user data or the NAND flash device 3252.

[0214] Each of the storage devices 3250 to 3250m may be a storage device according to an example embodiment. Using an extended storage module according to an example embodiment, the form factor of each of the storage devices 3250 to 3250m can be effectively changed, and additional functions can be effectively provided to each of the storage devices 3250 to 3250m.

[0215] Example embodiments may be applied to various electronic devices and systems including storage devices. For example, example embodiments may be applied to systems such as personal computers (PCs), server computers, data centers, workstations, mobile phones, smartphones, tablets, laptop computers, personal digital assistants (PDAs), portable multimedia players (PMPs), digital cameras, portable game consoles, music players, video cameras, video players, navigation devices, wearable devices, Internet of Things (IoT) devices, Internet of Everything (IoE) devices, e-book readers, virtual reality (VR) devices, augmented reality (AR) devices, robotic devices, drones, automobiles, and the like.

[0216] The foregoing is illustrative of example embodiments and should not be construed as limiting thereof. Although some example embodiments have been described, those skilled in the art will readily appreciate that various modifications may be made to the example embodiments without materially departing from the novel teachings and advantages of the example embodiments. Accordingly, all such modifications are intended to be included within the scope of the example embodiments as defined in the claims. Therefore, it should be understood that the foregoing is illustrative of various example embodiments and should not be construed as limited to the specific example embodiments disclosed, and that modifications to the disclosed example embodiments and other example embodiments are intended to be included within the scope of the appended claims.

Claims

1. A storage device, comprising: Main storage module; as well as Expansion storage module, including: substrate; a functional block on the substrate, wherein the functional block is configured to provide a first function for the main storage module; a control circuit on the substrate, wherein the control circuit is configured to control the functional block; a housing extending around the substrate, the functional blocks, and the control circuit; and A connector connected to the baseboard, wherein the connector is configured to provide an electrical connection and a physical connection between the expansion storage module and the main storage module, wherein the expansion storage module is electrically and physically attachable to and detachable from the main storage module via the connector, and Wherein, in response to the expansion storage module being detached from the main storage module, the main storage module has a first form factor.

2. The storage device according to claim 1, in, In response to the expansion storage module being attached to the primary storage module, the storage device has a second form factor, and Wherein, the first form factor is different from the second form factor.

3. The storage device according to claim 1, wherein: The functional blocks include: An energy storage element is configured to provide an auxiliary power supply voltage to the main storage module.

4. The storage device according to claim 3, wherein: The control circuit is configured to control the energy storage element to provide the auxiliary power supply voltage to the main storage module.

5. The storage device according to claim 1, wherein: The functional blocks include: A cooling element is configured to reduce the temperature of the primary storage module.

6. The storage device according to claim 5, wherein: The control circuit is configured to control the cooling element to reduce the temperature of the primary storage module.

7. The storage device according to claim 1, wherein: The housing has a rectangular parallelepiped shape, and the housing comprises: an upper surface and a lower surface that are parallel to each other; and a side surface intersecting the upper surface and the lower surface, and Wherein, the connector is at least partially exposed from one of the upper surface, the lower surface and the side surface of the housing.

8. The storage device according to claim 1, wherein: The housing has a two-step shape, and comprises: an upper surface, an intermediate surface, and a lower surface that are parallel to each other, wherein each of the upper surface, the intermediate surface, and the lower surface has a rectangular shape; a first side surface and a second side surface intersecting the upper surface, the middle surface and the lower surface; a third side surface intersecting the upper surface and the middle surface; a fourth side surface intersecting the upper surface and the lower surface; and a fifth side surface intersecting the middle surface and the lower surface, and Wherein, the connector is at least partially exposed from the middle surface or the fifth side surface of the housing.

9. The storage device according to claim 1, wherein: The first form factor is E3.S, E3.S 2T or E3.L2T.

10. A storage device comprising: a primary storage module having a first form factor; as well as an expansion storage module configured to be electrically and physically attachable to and detachable from the main storage module, Wherein, the extended storage module includes: a first substrate; a functional block on the first substrate, wherein the functional block is configured to provide a first function for the main storage module; a control circuit on the first substrate, wherein the control circuit is configured to control the functional block; a first housing extending around the first substrate, the functional block, and the control circuit; and a first connector connected to the first substrate, wherein the first connector is configured to provide an electrical connection and a physical connection with the primary storage module, and Wherein, in response to the expansion storage module being attached to the main storage module, the storage device has a second form factor different from the first form factor.

11. The storage device according to claim 10, wherein: The main storage module comprises: a second substrate; A storage controller, on the second substrate; a plurality of non-volatile memories on the second substrate, wherein the memory controller is configured to control the plurality of non-volatile memories; a buffer memory on the second substrate, wherein the memory controller is configured to control the buffer memory; a second housing extending around the second substrate, the memory controller, the plurality of nonvolatile memories, and the buffer memory; and A second connector is connected to the second substrate, wherein the second connector is configured to provide an electrical connection and a physical connection with the expansion storage module.

12. The storage device according to claim 11, wherein: In response to determining that the expansion storage module is attached to the main storage module, the storage controller is configured to read module information from the expansion storage module, check the module information, and send a request signal for the first function to the expansion storage module based on the module information.

13. The storage device according to claim 12, wherein: The functional blocks include: an energy storage element configured to provide an auxiliary supply voltage to the main storage module, Wherein, the storage controller is configured as: determining a dump size of a data dump operation based on the module information; and In response to determining that a data dump event has occurred, performing the data dump operation based on the auxiliary power supply voltage provided from the expansion memory module and the dump size, and In response to determining that the data dump event has occurred, the storage controller is configured to move data from the buffer memory to the plurality of non-volatile memories.

14. The storage device according to claim 13, wherein: In response to determining that the data dump event has occurred, the storage controller is configured to generate a data dump command.

15. The storage device according to claim 13, wherein: In response to determining that a voltage level of a main power supply voltage of the main memory module is lower than a reference voltage level, the memory controller is configured to determine that the data dump event has occurred.

16. The storage device according to claim 11, in, The first shell has a first rectangular parallelepiped shape, and the first shell includes: A first upper surface and a first lower surface parallel to each other; and a first side surface intersecting the first upper surface and the first lower surface, Wherein, the second shell has a second rectangular parallelepiped shape, and the second shell includes: a second upper surface and a second lower surface parallel to each other; and a second side surface intersecting the second upper surface and the second lower surface, and Wherein, when the expansion storage module is attached to the main storage module, one of the first upper surface and the first lower surface of the first shell and one of the second upper surface and the second lower surface of the second shell are in contact with each other.

17. The storage device according to claim 11, in, The first shell has a first rectangular parallelepiped shape, and the first shell includes: A first upper surface and a first lower surface parallel to each other; and a first side surface intersecting the first upper surface and the first lower surface, Wherein, the second shell has a second rectangular parallelepiped shape, and the second shell includes: a second upper surface and a second lower surface parallel to each other; and a second side surface intersecting the second upper surface and the second lower surface, and Wherein, when the expansion storage module is attached to the main storage module, one of the first side surfaces of the first shell and one of the second side surfaces of the second shell are in contact with each other.

18. The storage device according to claim 11, in, The first housing has a two-stepped shape, and the first housing includes: a first upper surface, a first intermediate surface, and a first lower surface parallel to each other, wherein each of the first upper surface, the first intermediate surface, and the first lower surface has a rectangular shape; a first side surface and a second side surface intersecting the first upper surface, the first intermediate surface, and the first lower surface; a third side surface intersecting the first upper surface and the first intermediate surface; a fourth side surface intersecting the first upper surface and the first lower surface; a fifth side surface intersecting the first middle surface and the first lower surface, Wherein, the second shell has a rectangular parallelepiped shape, and the second shell includes: a second upper surface and a second lower surface parallel to each other; and a sixth side surface intersecting the second upper surface and the second lower surface, and Wherein, when the expansion storage module is attached to the main storage module, the first middle surface of the first shell contacts one of the second upper surface and the second lower surface of the second shell, and the fifth side surface of the first shell contacts one of the sixth side surfaces of the second shell.

19. The storage device according to claim 11, wherein: The first shell and the second shell have the same width.

20. A solid state drive (SSD) device, comprising: a main module having a first form factor; as well as an expansion module configured to be electrically and physically attachable to and detachable from the main module, Wherein, the expansion module includes: a first substrate; an energy storage element on the first substrate, wherein the energy storage element is configured to provide an auxiliary power supply voltage to the main module; an energy management circuit on the first substrate, wherein the energy management circuit is configured to control the energy storage element; a first housing extending around the first substrate, the energy storage element, and the energy management circuit; and a first connector connected to the first substrate, wherein the first connector is configured to provide an electrical connection and a physical connection with the main module, Wherein, the main module includes: a second substrate; A storage controller, on the second substrate; a plurality of non-volatile memories on the second substrate, wherein the memory controller is configured to control the plurality of non-volatile memories; a buffer memory on the second substrate, wherein the memory controller is configured to control the buffer memory; a second housing extending around the second substrate, the memory controller, the plurality of nonvolatile memories, and the buffer memory; and a second connector connected to the second substrate, wherein the second connector is configured to provide an electrical connection and a physical connection with the expansion module, wherein, when the main module is electrically and physically connected to the expansion module through the first connector and the second connector, the SSD device has a second form factor different from the first form factor, Wherein, the storage controller is configured as: Read module information from the extension module; Checking the module information; Determining a dump size of a data dump operation based on the module information; in response to determining that a data dump event has occurred, sending a power request signal to the energy management circuit based on at least one of generation of a data dump command and reduction of a voltage level of a main power supply voltage; receiving the auxiliary supply voltage from the energy storage element; and performing the data dump operation based on the auxiliary power supply voltage and the dump size, and In response to determining that the data dump event has occurred and performing the data dump operation, the storage controller is configured to move data from the buffer memory to the plurality of non-volatile memories.

Images