Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, internal electrodes respectively exposed to one of a third surface and a fourth surface of the body opposite to each other in the second direction and spaced apart from a fifth surface and a sixth surface of the body opposite to each other in the third direction; and an external electrode disposed on at least one of the third surface and the fourth surface. When a thickness of a central portion of the inner electrode in the third direction and a width of the inner electrode measured on the one surface are represented by T1 and W1, respectively, T1 and W1 are equal to T1 and W1. And when the thickness of the central portion of the inner electrode in the third direction and the width of the inner electrode measured on the central portion of the body in the second direction are represented by T2 and W2, respectively, T1gt is satisfied; t2 and 0.6 < = W2 / W1 < = 0.9.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0191131, filed with the Korean Intellectual Property Office on December 26, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multilayer electronic component. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip capacitor that is mounted on a printed circuit board of various types of electronic products (such as smartphones, smartwatches, and wearable devices) and is used to charge or discharge from them. Such a multilayer ceramic capacitor can be used as a component of various electronic devices because it has a small size, ensures a high capacitance, and is easy to install.

[0004] Recently, there has been a demand for MLCCs installed in various electronic products to have a smaller size, and the MLCCs can be embedded in a substrate or mounted between an application processor (AP) and a printed circuit board. Accordingly, the market for ultra-small MLCCs with reduced thickness has been expanding.

[0005] However, in an ultra-small MLCC, it may also be necessary for the internal electrodes to have a reduced thickness and width. When the width and thickness of the internal electrodes are reduced, contact failures between the internal electrodes and the external electrodes may easily occur. Accordingly, the MLCC may have a reduced capacitance, or capacitance dispersion may occur. To solve such problems, a new structure for the internal electrodes may be required. Summary of the Invention

[0006] One aspect of the present disclosure provides a multilayer electronic component having excellent electrical characteristics.

[0007] However, aspects of the present disclosure are not limited to the examples set forth herein and will be more readily understood during the process of describing specific example embodiments of the present disclosure.

[0008] According to one aspect of the present disclosure, a multi-layer electronic component is provided. The multi-layer electronic component includes: a main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction. The main body includes a dielectric layer and inner electrodes alternately arranged with the dielectric layer in the first direction. The inner electrodes respectively extend to one of the third surface and the fourth surface and are spaced apart from the fifth surface and the sixth surface; and an outer electrode provided on at least one of the third surface and the fourth surface and connected to the inner electrode. When the thickness in the first direction of the central portion of the inner electrode in the third direction measured on the one surface and the width of the inner electrode in the third direction are represented by T1 and W1 respectively, and the thickness in the first direction of the central portion of the inner electrode in the third direction measured on the central portion of the main body in the second direction and the width of the inner electrode in the third direction are represented by T2 and W2 respectively, T1>T2 and 0.6≤W2 / W1≤0.9 can be satisfied.

[0009] According to an exemplary embodiment of the present disclosure, the multi-layer electronic component can have excellent electrical characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Through the following specific embodiments in conjunction with the drawings, the above and other aspects, features, and advantages of the present disclosure will be more clearly understood. In the drawings: Figure 1 is a schematic perspective view of a multi-layer electronic component according to an exemplary embodiment of the present disclosure; Figure 2 is a schematic cross-sectional view taken along line I-I' of Figure 1 ; Figure 3 is a schematic cross-sectional view taken along line II-II' of Figure 1 ; Figure 4 is a schematic cross-sectional view taken along line III-III' of Figure 1 ; Figure 5 is a schematic cross-sectional view taken along line IV-IV' of Figure 2 ; Figure 6 is a schematic cross-sectional view taken along line V-V' of Figure 2 ; Figure 7 shows Figure 5 andFigure 6 Overlapping views; Figure 8 and Figure 9 is Figure 2 A schematic enlarged view of various examples of the region "K1" of; and Figure 10 is a schematic plan view of a green ceramic sheet printed with an internal electrode pattern for manufacturing a multilayer electronic component according to an exemplary embodiment of the present disclosure. Detailed Description of the Invention

[0011] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the present disclosure can be illustrated in many different forms and should not be construed as limited to the specific exemplary embodiments set forth herein. In addition, exemplary embodiments of the present disclosure are provided to more fully describe the present disclosure to those skilled in the art. Therefore, for clarity of description, the shapes and sizes of the elements in the drawings may be exaggerated, and the elements denoted by the same reference numerals in the drawings may be the same elements.

[0012] To clearly illustrate the present disclosure, parts irrelevant to the description are omitted, and the dimensions (e.g., thickness) are enlarged to clearly represent the layers and regions, and throughout the specification, similar parts having the same functions within the same range are denoted by similar reference numerals. Throughout the specification, unless otherwise specifically stated, when an element is referred to as "comprising" or "including" another element, this means that the element may further include other elements without excluding other elements.

[0013] In the drawings, the first direction may be defined as the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0014] Multi-layer electronic component Figure 1 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment of the present disclosure.

[0015] Figure 2 is a schematic cross-sectional view taken along the line Figure 1 I-I'.

[0016] Figure 3 is a schematic cross-sectional view taken along the line Figure 1 II-II'.

[0017] Figure 4 is a schematic cross-sectional view taken along the line Figure 1 III-III'.

[0018] Figure 5 is a schematic cross-sectional view taken along the line Figure 2 IV-IV'.

[0019] Figure 6 is taken along the Figure 2 line V-V' of the schematic cross-sectional view.

[0020] Figure 7 is a view in which Figure 5 and Figure 6 are overlapped.

[0021] Figure 8 and Figure 9 are Figure 2 schematic enlarged views of various examples of the region "K1" of.

[0022] Figure 10 is a schematic plan view of a green sheet printed with an internal electrode pattern for manufacturing a multilayer electronic component according to an exemplary embodiment of the present disclosure.

[0023] Hereinafter, a multilayer electronic component 100 according to an exemplary embodiment of the present disclosure will be described in detail with reference to Figures 1 to 10 In addition, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") is described as an example of a multilayer electronic component, but the present disclosure is not limited thereto, and the multilayer electronic component of the present disclosure may also be various electronic products such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0024] The size of the multilayer electronic component 100 is not particularly limited. However, as described above, the technical concept of the present disclosure lies in improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132 of the ultra-small multilayer electronic component 100. The thickness To of the multilayer electronic component 100 in the first direction may be, for example, less than or equal to 150 μm, the length Lo of the multilayer electronic component 100 in the second direction may be, for example, less than or equal to 250 μm, and the width Wo of the multilayer electronic component 100 in the third direction may be, for example, less than or equal to 150 μm. The lower limit of the thickness To of the multilayer electronic component 100 in the first direction is not particularly limited, but may be, for example, greater than or equal to 50 μm, and the lower limit of the length Lo of the multilayer electronic component 100 in the second direction is not particularly limited, but may be, for example, greater than or equal to 100 μm, and the width Wo of the multilayer electronic component 100 in the third direction is not particularly limited, but may be, for example, greater than or equal to 50 μm.

[0025] The multilayer electronic component 100 may include a main body 110 and external electrodes 131 and 132, and the main body 110 includes a dielectric layer 111 and internal electrodes 121 and 122.

[0026] The specific shape of the main body 110 is not particularly limited. However, as Figure 1As shown, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. The ceramic particles included in the main body 110 may shrink during the sintering process or the edge portions of the main body 110 may be polished, such that the main body 110 may not have a perfect hexahedral shape with straight lines, but may have a substantially hexahedral shape.

[0027] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4. The third surface 3 and the fourth surface 4 are opposite to each other in a second direction, and the fifth surface 5 and the sixth surface 6 are opposite to each other in a third direction. At least one of the first surface 1, the second surface 2, the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 of the main body 110 may have an arithmetic mean surface roughness (Ra) of 0.2 μm to 1 μm.

[0028] The main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately provided with the dielectric layer 111 in a first direction. The plurality of dielectric layers 111 included in the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that it is difficult to identify the boundary therebetween without using a scanning electron microscope (SEM).

[0029] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may be, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5).

[0030] The thickness of the dielectric layer 111 is not particularly limited. For example, the average thickness of the dielectric layer 111 measured in the central portion of the main body 110 in the second direction may be 0.1 μm to 0.6 μm, 0.1 μm to 0.5 μm, or 0.1 μm to 0.4 μm.

[0031] Here, the average thickness of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 in the first direction. The average thickness of the dielectric layer 111 measured in the central portion of the main body 110 in the second direction can be measured by the following method: Scanning the central portion of the main body 110 in the second direction in the cross-sections of the main body 110 in the first and second directions with an SEM at a magnification of 10,000 times. More specifically, the average thickness of the dielectric layer 111 can be measured by the following method: Measuring the thickness of the dielectric layer 111 at 10 points equally spaced from each other in the second direction in the central portion of the main body 110 in the second direction. When this average value measurement is performed on ten dielectric layers 111, the average thickness of the dielectric layer 111 can be more generalized.

[0032] The inner electrodes 121 and 122 may include, for example, a first inner electrode 121 and a second inner electrode 122, which are alternately arranged in the first direction and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122. That is to say, the first inner electrode 121 and the second inner electrode 122 (a pair of electrodes with different polarities) may be arranged opposite to each other and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 can be electrically isolated from each other by the dielectric layer 111 interposed between them.

[0033] The inner electrodes 121 and 122 may be exposed to one of the third surface 3 and the fourth surface 4 (i.e., the exposed surface), and may be spaced apart from the fifth surface 5 and the sixth surface 6. That is to say, the first inner electrode 121 may be exposed to the third surface 3 and may be spaced apart from the fifth surface 5 and the sixth surface 6, and the second inner electrode 122 may be exposed to the fourth surface 4 and may be spaced apart from the fifth surface 5 and the sixth surface 6. Hereinafter, the third surface 3 exposing the end portion of the first inner electrode 121 may be defined as the first exposed surface, and the fourth surface 4 exposing the end portion of the second inner electrode 122 may be defined as the second exposed surface.

[0034] The metal included in the inner electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and may preferably include Ni, but the present disclosure is not limited thereto.

[0035] The main body 110 may include a capacitance forming portion disposed in the main body 110, and a first covering portion 112 and a second covering portion 113 respectively disposed on one surface and the other surface of the capacitance forming portion in a first direction. The capacitance forming portion includes a first internal electrode 121 and a second internal electrode 122, and a dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122 to form a capacitance. The covering portions 112 and 113 may mainly be used to prevent damage to the internal electrodes caused by physical stress or chemical stress. Except for not including internal electrodes, the covering portions 112 and 113 may have materials similar to those of the dielectric layer 111.

[0036] External electrodes 131 and 132 may be disposed on the exposed surfaces and connected to the internal electrodes 121 and 122. For example, the external electrode 131 may include a first external electrode 131 disposed on the third surface 3 and a second external electrode 132 disposed on the fourth surface 4. The first external electrode 131 extends onto a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6. The second external electrode 132 extends onto a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6. The first external electrode 131 may be connected to the first internal electrode 121 on the third surface 3, and the second external electrode 132 may be connected to the second internal electrode 122 on the fourth surface 4.

[0037] The types or shapes of the external electrodes 131 and 132 are not particularly limited, and the external electrodes 131 and 132 may have a multilayer structure. For example, the external electrodes 131 and 132 may include matrix electrode layers 131a and 132a respectively in contact with the internal electrodes 121 and 122, and plating layers 131b and 132b respectively disposed on the matrix electrode layers 131a and 132a.

[0038] The matrix electrode layers 131a and 132a may be sintered electrode layers including metal and glass. The metals included in the matrix electrode layers 131a and 132a may include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys including them, but the present disclosure is not limited thereto. The glass included in the matrix electrode layers 131a and 132a may include one or more of oxides of Ba, Ca, Zn, Al, B, and Si, but the present disclosure is not limited thereto.

[0039] The matrix electrode layers 131a and 132a may be formed only by sintered electrode layers including metal and glass, but the present disclosure is not limited thereto, and the matrix electrode layers 131a and 132a may have a multilayer structure. For example, the matrix electrode layers 131a and 132a may include matrix plating layers in contact with the internal electrodes 121 and 122 and sintered electrode layers disposed on the matrix plating layers.

[0040] The base coating may be provided only on a part of the exposed surface, and the sintered electrode layer may extend from the exposed surface to a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6. The base coating may be used to improve the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 32. The base coating may be provided on the ends of the internal electrodes 121 and 122 and may be discontinuously provided on the exposed surface. The base coating may include one or more of Ni, Cu, and Pd.

[0041] The coatings 131b and 132b may improve the mounting performance. The coatings 131b and 132b may include, for example, Ni, Sn, Pd, and / or alloys including them, and may be formed of multiple layers. The coatings 131b and 132b may be, for example, Ni coatings or Sn coatings or Ni coatings and Sn coatings formed sequentially. Additionally, the coatings 131b and 132b may include multiple Ni coatings and / or multiple Sn coatings.

[0042] In the drawings, a structure of the multilayer electronic component 100 having two external electrodes 131 and 132 is shown, but the present disclosure is not limited thereto, and the number or shape of the external electrodes 131 and 132 may be changed according to the shape of the internal electrodes 121 and 122 or other purposes.

[0043] Referring Figure 3 and Figure 4 When the thickness in the first direction of the central portion in the third direction of the internal electrodes 121 and 122 measured on the exposed surface and the width in the third direction of the internal electrodes 121 and 122 are represented by T1 and W1, respectively, and the thickness in the first direction of the central portion in the third direction of the internal electrodes 121 and 122 and the width in the third direction of the internal electrodes 121 and 122 measured on the central portion in the second direction of the main body 110 are represented by T2 and W2, respectively, T1>T2 and W1>W2 may be satisfied.

[0044] For example, the thickness in the first direction of the central portion in the third direction of the first internal electrode 121 measured on the first exposed surface may be greater than the thickness in the first direction of the central portion in the third direction of the first internal electrode 121 measured on the central portion in the second direction of the main body 110, and the width in the third direction of the first internal electrode 121 measured on the first exposed surface may be greater than the width in the third direction of the first internal electrode 121 measured on the central portion in the second direction of the main body 110.

[0045] For example, the thickness in the first direction of the central portion in the third direction of the second internal electrode 122 measured on the second exposed surface may be greater than the thickness in the first direction of the central portion in the third direction of the second internal electrode 122 measured on the central portion in the second direction of the main body 110, and the width in the third direction of the second internal electrode 122 measured on the second exposed surface may be greater than the width in the third direction of the second internal electrode 122 measured on the central portion in the second direction of the main body 110.

[0046] The thickness in the first direction of the central portion in the third direction of each of the internal electrodes 121 and 122 measured on the exposed surface may be greater than the thickness in the first direction of the central portion in the third direction of each of the internal electrodes 121 and 122 measured on the central portion in the second direction of the main body 110, and the width in the third direction of each of the internal electrodes 121 and 122 measured on the exposed surface may be greater than the width in the third direction of each of the internal electrodes 121 and 122 measured on the central portion in the second direction of the main body 110, such that the contact area between the internal electrodes 121 and 122 and the external electrodes 131 and 132 may be increased. As a result, the multilayer electronic component 100 may have improved electrical characteristics, such as suppressing the capacitance dispersion of the multilayer electronic component 100.

[0047] When the total thickness in the first direction of each of the internal electrodes 121 and 122 is increased to increase the contact area between the internal electrodes 121 and 122 and the external electrodes 131 and 132, the ultra-small multilayer electronic component 100 may have an excessively reduced capacitance. When the total width in the third direction of each of the internal electrodes 121 and 122 is increased, cracks may occur in the main body 110, or the multilayer electronic component 100 may have reduced moisture resistance reliability. Therefore, it is preferably satisfied that T1>T2 and W1>W2.

[0048] According to an exemplary embodiment of the present disclosure, 0.6≤W2 / W1≤0.9 may be satisfied. When W2 / W1 satisfies the above conditions, the reliability of the multilayer electronic component 100 can be ensured while improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132.

[0049] When W2 / W1 is less than 0.6 because W1 has an excessively large value, the multi-layer electronic component 100 may have reduced moisture resistance reliability or cracks may occur in the main body 110. When W2 / W1 is less than 0.6 because W2 has an excessively small value, the multi-layer electronic component 100 may have a reduced capacitance. When W2 / W1 is greater than 0.9 because W1 has an excessively small value, the effect of improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132 of the present disclosure may not be obvious. When W2 / W1 is greater than 0.9 because W2 has an excessively large value, the multi-layer electronic component 100 may have reduced moisture resistance reliability or cracks may occur in the main body 110.

[0050] W1 is not particularly limited. However, when the width of the main body 110 in the third direction is represented by Wb, the ratio of W1 to Wb (W1 / Wb) may be greater than or equal to 0.2 and less than or equal to 0.8. When W1 / Wb is less than 0.2, the effect of improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132 of the present disclosure may not be obvious. When W1 / Wb is greater than 0.8, the multi-layer electronic component 100 may have reduced moisture resistance reliability or cracks may occur in the main body 110.

[0051] According to an exemplary embodiment of the present disclosure, 0.5 ≤ T2 / T1 < 1 can be satisfied. When T2 / T1 satisfies the above conditions, the reliability of the multi-layer electronic component 100 can be ensured while improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132.

[0052] When T2 / T1 is less than 0.5 because T1 has an excessively large value, delamination may occur in the internal electrodes 121 and 122 or cracks may occur in the main body 110, such that the multi-layer electronic component 100 may have reduced moisture resistance reliability. When T2 / T1 is less than 0.5 because T2 has an excessively small value, the dielectric breakdown voltage property may be reduced. The upper limit of T2 / T1 is not particularly limited, and T2 / T1 may be less than 1.

[0053] T1 is not particularly limited, but for example, it may be greater than or equal to 0.2 μm and less than or equal to 2.0 μm.

[0054] T1 and W1 can be measured in an image obtained by polishing the multi-layer electronic component 100 in the second direction to expose the surface so that the exposed surface (for example, Figure 3The cross-section shown in

[0055] T2 and W2 can be measured in the image obtained by polishing the multilayer electronic component 100 in the second direction to the central portion of the main body 110 in the second direction so that the central portion of the main body 110 in the second direction (e.g., Figure 4 the cross-section illustrated in

[0056] is exposed, and then the exposed cross-section is observed using SEM. Considering the error of the polishing process for measurement, T2 and W2 can be measured not only at the exact center CP2 of the main body 110 in the second direction, but also in the cross-sections of the main body 110 in the first and third directions within a distance of 5 μm from the exact center CP2 of the main body 110 in the second direction along the second direction. T2 can be measured at the exact center CP3 of the main body 110 in the third direction.

[0057] When the thickness of the side end in the third direction of each of the inner electrodes 121 and 122 measured on the exposed surface is represented by T1', T1 > T1' can be satisfied. In the exemplary embodiment, the thickness of each of the inner electrodes 121 and 122 measured on the exposed surface can gradually decrease from the central portion of each of the inner electrodes 121 and 122 in the third direction toward the side end of each of the inner electrodes 121 and 122 in the third direction. That is, the thickness of the first inner electrode 121 measured on the first exposed surface can gradually decrease from the central portion of the first inner electrode 121 in the third direction toward the side end of the first inner electrode 121 in the third direction, and the thickness of the second inner electrode 122 measured on the second exposed surface can gradually decrease from the central portion of the second inner electrode 122 in the third direction toward the side end of the second inner electrode 122 in the third direction.

[0057] Here, the thickness of each of the inner electrodes 121 and 122 gradually decreases from the central portion of each of the inner electrodes 121 and 122 in the third direction toward the side ends of each of the inner electrodes 121 and 122 in the third direction, which can indicate that: even when the thickness of each of the inner electrodes 121 and 122 is constant in some sections, or when the thickness of each of the inner electrodes 121 and 122 gradually increases from the central portion of each of the inner electrodes 121 and 122 in the third direction toward the side ends of each of the inner electrodes 121 and 122 in the third direction, the total thickness of each of the inner electrodes 121 and 122 also tends to gradually decrease from the central portion of each of the inner electrodes 121 and 122 in the third direction toward the side ends of each of the inner electrodes 121 and 122 in the third direction.

[0058] In addition, referring to Figure 2 , the thickness of each of the inner electrodes 121 and 122 can gradually decrease from the exposed surface to the inside of the main body 110. That is, the thickness of the first inner electrode 121 can gradually decrease from the first exposed surface to the inside of the main body 110, and the thickness of the second inner electrode 122 can gradually decrease from the second exposed surface to the inside of the main body 110.

[0059] Here, the thickness of each of the inner electrodes 121 and 122 gradually decreasing from the exposed surface to the inside of the main body 110 can indicate that: even when the thickness of each of the inner electrodes 121 and 122 is constant in some sections, or when the thickness of each of the inner electrodes 121 and 122 gradually increases from the exposed surface to the inside of the main body 110 in some sections, the total thickness of each of the inner electrodes 121 and 122 also tends to gradually decrease from the exposed surface to the inside of the main body 110.

[0060] Referring to Figures 5 to 7 , the inner electrodes 121 and 122 can include main portions 121a and 122a provided on the central portion of the main body 110 in the second direction and lead portions 121b and 122b extending from the main portions 121a and 122a to the exposed surface.

[0061] The first inner electrode 121 can include a first main portion 121a provided on the central portion of the main body 110 in the second direction and a first lead portion 121b extending from the first main portion 121a to the first exposed surface.

[0062] The second inner electrode 122 can include a second main portion 122a provided on the central portion of the main body 110 in the second direction and a second lead portion 122b extending from the second main portion 122a to the second exposed surface. The first main portion 121a can be stacked with the second main portion 122a in the first direction, thereby forming the capacitance of the multilayer electronic component 100.

[0063] The width in the third direction of each of the lead-out portions 121b and 122b may be greater than the width in the third direction of each of the main portions 121a and 122a, and the width in the third direction of each of the lead-out portions 121b and 122b may gradually increase from each of the main portions 121a and 122a to the exposed surface. A part of the first main portion 121a may overlap with the second lead-out portion 122b in the first direction, and a part of the second main portion 122a may overlap with the first lead-out portion 121b in the first direction, but the present disclosure is not limited thereto.

[0064] In a cross-section of the main body 110 in the second and third directions, the side ends SE1 and SE2 in the third direction of the lead-out portions may be bendable. In an exemplary embodiment, in a cross-section of the main body 110 in the second and third directions, the radius of curvature of each of the side ends SE1 and SE2 in the third direction of the lead-out portions may be 50 μm to 90 μm. In a cross-section of the main body 110 in the second and third directions, the side ends in the third direction of the main portions 121a and 122a may be substantially straight, but the present disclosure is not limited thereto. The boundary between the main portions 121a and 122a and the lead-out portions 121b and 122b may be defined as a point where the slope change of each of the side ends in the third direction of the inner electrodes 121 and 122 is discontinuous.

[0065] In a cross-section of the main body 110 in the second and third directions, the edges EG1 and EG2 where the ends of the inner electrodes 121 and 122 in the second direction and spaced apart from the exposed surface intersect with the side ends in the third direction of the inner electrodes 121 and 122 may be bendable. Accordingly, the multilayer electronic component 100 may have improved withstand voltage characteristics. The radius of curvature of each of the edges EG1 and EG2 may be smaller than the radius of curvature of each of the side ends SE1 and SE2 in the third direction of the lead-out portions.

[0066] In an exemplary embodiment, in a cross-section of the main body 110 in the second and third directions, the radius of curvature of each of the edges EG1 and EG2 may be 10 μm to 20 μm. When the radius of curvature of each of the edges EG1 and EG2 is less than 10 μm, current may concentrate on the edges EG1 and EG2, and thus the multilayer electronic component 100 may have reduced withstand voltage characteristics. When the radius of curvature of each of the edges EG1 and EG2 is greater than 20 μm, the multilayer electronic component 100 may have a reduced capacitance.

[0067] Referring to Figures 5 to 7, the width of each of the inner electrodes 121 and 122 in the third direction may gradually decrease from the exposed surface to the inside of the main body 110. Here, the width of each of the inner electrodes 121 and 122 in the third direction gradually decreasing from the exposed surface to the inside of the main body 110 means that even when the width of each of the inner electrodes 121 and 122 in the third direction is constant in some sections, or when the width of each of the inner electrodes 121 and 122 in the third direction gradually increases from the exposed surface to the inside of the main body 110 in some sections, the total width of each of the inner electrodes 121 and 122 in the third direction also tends to gradually decrease from the exposed surface to the inside of the main body 110.

[0068] Referring to Figure 9 , in the exemplary embodiment, the inner electrode may protrude from the exposed surface. For example, the first inner electrode 121 may protrude from the first exposed surface. Although not shown, the second inner electrode 122 may protrude from the second exposed surface. When the inner electrodes 121 and 122 protrude from the exposed surface, the contact between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 can be improved. The length Lp of the first inner electrode 121 protruding from the first exposed surface is not particularly limited, but may be, for example, 0.1 μm to 1.0 μm. When the length Lp of the first inner electrode 121 protruding from the first exposed surface is less than 0.1 μm, the effect of improving the contact between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 may not be obvious. When the length Lp is greater than 1.0 μm, cracks may occur in the main body 110 due to the excessive protruding length of each of the inner electrodes 121 and 122.

[0069] Hereinafter, referring to Figure 10 an example of a method for forming the multilayer electronic component 100 according to an exemplary embodiment of the present disclosure will be described.

[0070] First, ceramic particles for forming the green sheets 211a and 211b may be prepared. The ceramic particles may be (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3 or (Ca 1-x Sr x )(Zr 1- yTi y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). Subsequently, the prepared ceramic particles can be dried and ground, and an organic solvent (such as ethanol) and a binder (such as polyvinyl butyral) can be mixed with the ceramic particles to prepare a ceramic slurry. Then, the ceramic slurry can be coated on a carrier film and dried to prepare green ceramic sheets 211a and 211b.

[0071] Subsequently, a conductive paste for internal electrodes (including metal particles, a binder, an organic solvent, etc.) can be printed on the green ceramic sheets 211a and 211b to a predetermined thickness by using a screen printing method, a gravure printing method, etc. to form internal electrode patterns 221 and 222. More specifically, a plurality of first internal electrode patterns 221 can be formed on the first green ceramic sheet 211a, and a plurality of second internal electrode patterns 222 can be formed on the second green ceramic sheet 211b.

[0072] The first internal electrode pattern 221 can include a first convex portion 221a and a first extension portion 221b and a second extension portion 221c extending from the first convex portion 221a. The thickness of the first convex portion 221a in the first direction can be greater than the thickness of each of the first extension portion 221b and the second extension portion 221c in the first direction, and the width of the first convex portion 221a in the third direction can be greater than the width of each of the first extension portion 221b and the second extension portion 221c in the third direction. Additionally, the second internal electrode pattern 222 can include a second convex portion 222a and a third extension portion 222b and a fourth extension portion 222c extending from the second convex portion 222a. The thickness of the second convex portion 222a in the first direction can be greater than the thickness of each of the third extension portion 222b and the fourth extension portion 222c in the first direction, and the width of the second convex portion 222a in the third direction can be greater than the width of each of the third extension portion 222b and the fourth extension portion 222c in the third direction. The convex portions 221a and 222a can form lead-out portions 121b and 122b of the internal electrodes 121 and 122 through sintering, and the extension portions 221b, 221c, 222b, and 222c can form main portions 121a and 122a of the internal electrodes 121 and 122 through sintering.

[0073] The method for forming the convex portions 221a and 222a is not particularly limited. For example, when forming the internal electrode patterns 221 and 222 using a gravure printing method, the convex portions 221a and 222a can be formed by adjusting the size of the pattern unit of the gravure roll or the size of the micro-units included in the pattern unit. For example, when the size of the micro-units corresponding to the convex portions 221a and 222a decreases, the thickness of the convex portions 221a and 222a can increase.

[0074] Thereafter, the green sheets 211a and 211b printed with the inner electrode patterns 221 and 222 can be peeled off from the carrier film. Subsequently, the first green sheet 211a having the first inner electrode pattern 221 formed thereon and the second green sheet 211b having the second inner electrode pattern 222 formed thereon can be alternately stacked to correspond to a predetermined number of layers, and then pressed to form a ceramic laminate. Predetermined numbers of green sheets on which no inner electrode pattern is formed can be stacked on the upper and lower portions of the ceramic laminate to form portions that become the covering portions 112 and 113 after performing a sintering process.

[0075] Thereafter, the ceramic laminate can be cut along a plurality of first cutting lines C1 and a plurality of second cutting lines C2 into a predetermined sheet size. The convex portions 221a and 222a can be positioned on the first cutting line C1. Thereafter, when the cut sheets are sintered at a temperature of, for example, 1000 °C or higher and 1400 °C or lower, the main body 110 can be formed.

[0076] Thereafter, the base electrode layers 131a and 132a can be formed by dipping the main body 110 in a conductive paste (including metal particles, glass frit, binder, and organic solvent) and sintering the conductive paste at a temperature of, for example, 500 °C to 900 °C.

[0077] When the base electrode layers 131a and 132a include a base plating layer and a sintered electrode layer provided on the base plating layer, the base electrode layers 131a and 132a can be formed by: forming a base plating layer on the main body 110 using an electroplating method and / or an electroless plating method, dipping the main body 110 having the base plating layer formed thereon in a conductive paste, and then sintering the main body 110.

[0078] Subsequently, the multilayer electronic component 100 can be manufactured by forming plating layers 131b and 132b using an electroplating method and / or an electroless plating method. However, the above manufacturing method can be an example, and the method for manufacturing the multilayer electronic component 100 is not limited to the above manufacturing method.

[0079] (Experimental Example) Using the above method, a sample piece with dimensions of 0201 (Lo: approximately 0.2 mm, Wo: approximately 0.1 mm, To: approximately 0.1 mm) was fabricated. Thereafter, the sample piece was polished so that the exposed surface was exposed to the outside, and the exposed surface (cross-sections in the first direction and the third direction) was observed using SEM to measure T1 and W1. T1 was measured at the central portion in the third direction of the main body of the sample piece. Subsequently, the sample piece was polished to the central portion in the second direction of the main body, and then the exposed cross-sections (cross-sections in the first direction and the third direction) were observed using SEM to measure T2 and W2. T2 was measured at the central portion in the third direction of the main body of the sample piece. In Table 1 below, W2 for each test number was fixed at 50 μm and T2 was fixed at 1.0 μm, and only T1 and W1 were adjusted for each test number, but T1 was adjusted to be greater than T2.

[0080] After that, contact evaluation and crack defect evaluation were performed based on W2 / W1 and T2 / T1. Specifically, the contact was evaluated using a capacitance meter. Based on a target capacitance of 100 pF, when the capacitance was greater than or equal to 90 pF, the contact was determined to be good (○), when the capacitance was greater than or equal to 80 pF and less than 90 pF, the contact was determined to be normal (△), and when the capacitance was less than 80 pF, the contact was determined to be defective (×). In addition, in the crack defect evaluation, for each test number, when even one cracked sample piece was present among 100 sample pieces, the crack defect was determined to be defective (NG), and when no cracked sample piece was present, the crack defect was determined to be good (OK), and the results of this determination are shown in Table 1 below.

[0081] [Table 1]

[0082] Referring to Table 1, in the remaining test numbers except for Test No. 1-1, Test No. 2-1, Test No. 3-1, and Test No. 4-1, the contact was good or normal. This may be because the W2 / W1 of Test No. 1-1, Test No. 2-1, Test No. 3-1, and Test No. 4-1 was 0.95, that is, W1 did not have a large enough value compared to W2, so the contact between the inner electrode and the outer electrode could not be sufficiently improved.

[0083] In Test No. 1-6, Test No. 2-6, Test No. 3-6, and Test No. 4-6, the contact was good or normal, but it was confirmed that crack defects occurred. This may be because the W2 / W1 of Test No. 1-6, Test No. 2-6, Test No. 3-6, and Test No. 4-6 was 0.5, that is, W1 had an excessively large value compared to W2, so crack defects occurred.

[0084] In Tests Nos. 4-1 to 4-6, good contact was achieved except for Test No. 4-1. However, crack defects occurred in all of Tests Nos. 4-1 to 4-6. This may be because the T2 / T1 of Tests Nos. 4-1 to 4-6 was 0.4, that is, T1 had an excessively large value compared to T2, and thus crack defects caused by delamination of the internal electrodes occurred.

[0085] Conversely, it was confirmed that Tests Nos. 1-2 to 1-5, Tests Nos. 2-2 to 2-5, and Tests Nos. 3-2 to 3-5 satisfied 0.6 ≤ W2 / W1 ≤ 0.9 and 0.5 ≤ T2 / T1 ≤ 1, resulting in good contact and no crack defects occurring.

[0086] Although example embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

[0087] In addition, the term "example embodiment" as used herein does not denote the same example embodiment, but is provided to emphasize a specific feature or characteristic different from those of another example embodiment. However, the example embodiments provided herein are considered capable of being implemented by combining them wholly or partially with each other. For example, an element described in a specific example embodiment can be understood to be related to another example embodiment even if it is not described in the other example embodiment, unless a contrary or conflicting description is provided in the other example.

[0088] As used herein, the term "connection" can refer not only to "direct connection" but also to "indirect connection" by means of an adhesive layer or the like. The term "electrical connection" can include cases where components are "physically connected" and cases where components are "not physically connected". In addition, terms such as "first", "second", etc. can be used to distinguish one component from another component, and do not limit the order and / or importance or others related to the component. In some cases, the first component can be referred to as the second component, and similarly, the second component can be referred to as the first component without departing from the scope of the example embodiment.

Claims

1. A multilayer electronic component comprising: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, the body comprising a dielectric layer and inner electrodes alternately arranged with the dielectric layer in the first direction, the inner electrodes respectively extending to one of the third surface and the fourth surface; and an external electrode disposed on at least one of the third surface and the fourth surface and connected to the internal electrode, Wherein, when the thickness of the inner electrode in the first direction at the central portion in the third direction measured on the one surface and the width of the inner electrode in the third direction are represented by T1 and W1, respectively, and the thickness of the inner electrode in the first direction at the central portion in the third direction measured on the central portion in the second direction of the body and the width of the inner electrode in the third direction are represented by T2 and W2, respectively, T1>T2 and 0.6≤W2 / W1≤0.9 are satisfied.

2. The multilayer electronic component of claim 1, wherein: T1 and T2 satisfy 0.5≤T2 / T1<1.

3. The multilayer electronic component of claim 1, wherein: The internal electrode includes a main portion disposed on the central portion of the body in the second direction and a lead portion extending from the main portion to the one surface, and A width of the lead-out portion in the third direction is greater than a width of the main portion in the third direction, and the width of the lead-out portion in the third direction gradually increases from the main portion toward the one surface.

4. The multilayer electronic component of claim 3, wherein: In cross sections of the main body in the second direction and the third direction, a side end of the lead-out portion in the third direction is bent.

5. The multilayer electronic component of claim 4, wherein: In cross sections of the body in the second and third directions, a radius of curvature of the side end of the lead-out portion in the third direction is 50 μm to 90 μm.

6. The multilayer electronic component of claim 1, wherein: In a cross section of the body in the second and third directions, an end portion of the internal electrode in the second direction spaced apart from the one surface has an edge that intersects a side end of the internal electrode in the third direction bent.

7. The multilayer electronic component of claim 6, wherein: In cross sections of the body in the second and third directions, a radius of curvature of the edge is 10 μm to 20 μm.

8. The multilayer electronic component of claim 1, wherein: When the thickness in the first direction of the side end of the internal electrode in the third direction measured on the one surface is denoted by T1 ′, T1 > T1 ′ is satisfied.

9. The multilayer electronic component of claim 1, wherein: A thickness of the internal electrode in the first direction measured on the one surface gradually decreases from the central portion of the internal electrode in the third direction toward a side end of the internal electrode in the third direction.

10. The multilayer electronic component of claim 1, wherein: A width of the inner electrode in the third direction gradually decreases from the one surface toward an inner portion of the body.

11. The multilayer electronic component of claim 1, wherein: A thickness of the internal electrode in the first direction gradually decreases from the one surface to an inner portion of the body.

12. The multilayer electronic component of claim 1, wherein: The inner electrode protrudes from the one surface.

13. The multilayer electronic component of claim 1, wherein: The thickness of the multilayer electronic component in the first direction is less than or equal to 150 μm, The length of the multilayer electronic component in the second direction is less than or equal to 250 μm, and The width of the multilayer electronic component in the third direction is less than or equal to 150 μm.

14. The multilayer electronic component of claim 1, wherein: The inner electrode is spaced apart from the fifth surface and the sixth surface.

15. The multilayer electronic component of claim 1, wherein: When the width of the body in the third direction is represented by Wb, a ratio of W1 to Wb (W1 / Wb) is greater than or equal to 0.2 and less than or equal to 0.8.

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