Preheating device and preheating method for eutectic machine

Abstract

The invention relates to the technical field of die bonding, and particularly discloses a preheating device and a preheating method for a eutectic machine, the preheating device comprises a mounting seat, a heating piece is arranged in the mounting seat, the heating piece can transfer heat to the mounting seat, and a mounting groove is formed in the bottom side of the mounting seat; the suction nozzle comprises an adsorption head and a suction pipe which are connected, the adsorption head is installed in the installation groove, the adsorption end of the adsorption head is exposed out of the outer side of the installation groove, and a temperature control gap is reserved between the adsorption head and the inner wall of the installation groove; and the adjusting part is arranged in the mounting seat and is used for adjusting the size of the temperature control gap so as to adjust the heat conduction efficiency between the mounting seat and the adsorption head. According to the invention, the chip can be preheated while being transferred, so that the working efficiency can be improved; through the arrangement of the temperature control gap, the heat conduction efficiency between the mounting seat and the adsorption head can be flexibly adjusted through the adjusting piece, so that the preheating temperature and the preheating efficiency of the chip are accurately controlled.

Description

Technical Field

[0001] This application relates to the field of die bonding technology, and particularly to a preheating device and preheating method for an eutectic machine. Background Art

[0002] Eutectic die bonding technology is a die bonding technology that bonds die through the fusion of metal to metal. It uses various heating means such as ultrasonic heating, pulse heating, and constant temperature heating to melt the tin / gold alloy layer between the eutectic chip and the eutectic chip, the eutectic chip and the base or lead frame, thereby forming a stable metal-to-metal molten bond. Compared with the traditional die bonding method, the metal-to-metal bond improves the bond strength, reduces the bond impedance, and also enhances the heat conduction efficiency. It is a good die bonding method, especially widely used in the LED and optical communication industries.

[0003] In current eutectic machines, generally, the substrate is transported to the eutectic stage, and a heating block is provided on the eutectic stage to heat the substrate to the eutectic temperature; at the same time, nitrogen is blown onto the eutectic stage, and then the chip is transferred to the die bonding position of the substrate on the eutectic stage to enable the chip to be eutectically welded to the substrate; and nitrogen is used for protection to prevent oxidation during eutectic, and then the eutectic substrate is removed and collected. In such a structure, heating is only carried out at the eutectic stage, so it is necessary to carry out long-term or high-power heating at the eutectic stage to make the chip reach the eutectic temperature, and the efficiency is low. Summary of the Invention

[0004] In order to improve the working efficiency of the eutectic process, this application provides a preheating device and preheating method for an eutectic machine.

[0005] In the first aspect, this application provides a preheating device for an eutectic machine, adopting the following technical solution: A preheating device for an eutectic machine includes a mounting base. A heating element is provided inside the mounting base, and the heating element can transfer heat to the mounting base. An installation groove is formed on the bottom side of the mounting base; A suction nozzle, including an adsorption head and a suction pipe connected to each other. The adsorption head is installed in the installation groove and the adsorption end of the adsorption head is exposed outside the installation groove. A temperature control gap is reserved between the adsorption head and the inner wall of the installation groove; An adjusting member is provided inside the mounting base for adjusting the size of the temperature control gap to adjust the heat conduction efficiency between the mounting base and the adsorption head.

[0006] By adopting the above technical solution, the heating element in the mounting base can transfer heat to the suction head to preheat the adsorbed chip; the setting of the temperature control gap enables the heat conduction efficiency between the mounting base and the suction head to be flexibly adjusted through the adjusting member, thereby precisely controlling the preheating temperature and preheating efficiency of the chip; this design not only improves the temperature uniformity of chip preheating, but also reduces the influence of temperature fluctuations on chip performance, and further improves the quality and stability of the eutectic process; since the chip can be preheated through the suction head during the transfer process, the working efficiency of the eutectic process can be improved.

[0007] Optionally, the adjusting member includes a tightening bolt, the tightening bolt is threadedly connected to the mounting base, a tapered hole is formed in the suction head, and the axis of the tapered hole is arranged parallel to the center line of the tightening bolt at an interval, so that the suction head is pushed to move towards the side close to the temperature control gap during the tightening process of the tightening bolt.

[0008] By adopting the above technical solution, the cooperation between the tightening bolt and the tapered hole on the suction head can push the suction head to move towards the side close to the temperature control gap during the tightening process, so as to precisely adjust the size of the temperature control gap; the tightening bolt can not only tightly fix the suction head in the mounting base, but also flexibly adjust the heat conduction efficiency between the mounting base and the suction head.

[0009] Optionally, the heating element is a ceramic heating plate, a receiving groove is formed in the mounting base, the ceramic heating plate is arranged in the receiving groove, a top plate is arranged on the side of the ceramic heating plate away from the suction head in the receiving groove, a buffer gap is reserved between the top plate and the inner wall of the receiving groove, and a first spring is connected between the top plate and the inner wall of the receiving groove.

[0010] By adopting the above technical solution, the ceramic heating plate can provide efficient heat transfer to ensure that the chip is fully preheated during the transfer process; the receiving groove is provided for installing the ceramic heating plate, making the assembly between the ceramic heating plate and the mounting base more stable; the setting of the buffer gap and the first spring effectively alleviates the stress generated by the thermal expansion and contraction of the ceramic heating plate, avoiding damage due to excessive expansion or contraction, thereby improving the stability and service life of the ceramic heating plate; this design not only ensures the reliability of the preheating process, but also reduces the maintenance cost of the equipment.

[0011] Optionally, an adjusting assembly is arranged on one side of the mounting base, the adjusting assembly includes a connecting block, a first mounting block, a pin shaft, a first screw and a setscrew, the mounting base is arranged on the first mounting block, the pin shaft penetrates between the first mounting block and the connecting block, so that the first mounting block can rotate relative to the connecting block, a through hole with a diameter larger than the diameter of the first screw is formed in the first mounting block, the first screw penetrates through the through hole and is threadedly connected to the connecting block, the setscrew is threadedly connected to the connecting block, and the end of the setscrew is used to abut against the first mounting block.

[0012] By adopting the above technical solution, the adjustment component is arranged such that the mounting base can be angularly adjusted and fixed relative to the connecting block, thereby adapting to the mounting requirements of different chips and enhancing the applicability and flexibility of the device; the penetration of the pin shaft allows the first mounting block to rotate relative to the connecting block, thereby realizing the angular adjustment of the mounting base; the first screw can fix the first mounting block at the required angular position to ensure the stability of the mounting base; when the first screw does not fix the first mounting block, rotating the setscrew can finely adjust the angle of the first mounting block to ensure the precise alignment of the chip and the substrate and improve the eutectic quality; after the fine adjustment is completed, tightening the first screw and the setscrew can enhance the fixing effect on the first mounting block.

[0013] Optionally, a heat insulation member is arranged at the perforation on the first mounting block, the first screw penetrates through the heat insulation member and abuts against the heat insulation member, and a heat insulation strip is arranged between the connecting block and the first mounting block.

[0014] By adopting the above technical solution, the arrangement of the heat insulation member can effectively reduce the heat transferred from the first mounting block to the connecting block through the first screw, thereby reducing the heat transferred from the ceramic heating plate to other transmission components, ensuring the normal operation of other transmission components and guaranteeing the service life; the heat insulation strip further enhances the heat insulation effect between the connecting block and the first mounting block; through the design of the heat insulation member and the heat insulation strip, the system can achieve the zonal control of heat, ensure that the heat is only concentrated in the area that needs to be preheated, guarantee the preheating effect, and at the same time weaken the influence on other components.

[0015] Optionally, a mounting plate is arranged on one side of the connecting block, the connecting block is slidably connected to the mounting plate, a buffer assembly is arranged on the mounting plate, the buffer assembly includes an electromagnet, a connecting member and a second spring, the electromagnet is fixedly connected to the mounting plate, the connecting member is fixedly connected to the connecting block, the electromagnet is used to generate a suction force on the connecting member, two second springs are arranged and are respectively arranged at both ends in the sliding direction of the connecting block, and the second springs are connected between the connecting block and the mounting plate.

[0016] By adopting the above technical solution, the sliding connection structure between the connecting block and the mounting plate cooperates with the second spring to achieve a buffering effect. When the mounting base and the nozzle move down to pick up or place the chip, it can avoid applying excessive pressure to the chip on the suction head, thereby effectively protecting the chip and the nozzle; the electromagnet generates a suction force on the connecting member, and the magnitude of the suction force can be adjusted according to the magnitude of the current applied to the electromagnet, so as to better adjust the initial position of the connecting block relative to the mounting plate, achieve the precise positioning and rapid response of the connecting block, and facilitate the adaptation to different types of chips; the design of the buffer assembly can also effectively isolate external vibrations and ensure the stability of the chip during the preheating process.

[0017] Optionally, a vertical sliding assembly and a horizontal sliding assembly are provided on one side of the mounting plate. The vertical sliding assembly is used to drive the mounting plate to slide vertically, and the horizontal sliding assembly is used to drive the mounting plate to slide horizontally.

[0018] By adopting the above technical solution, the mounting seat can achieve precise multi-directional movement under the drive of the vertical sliding assembly and the horizontal sliding assembly, enabling the suction nozzle to move flexibly, adapting to the chip processing requirements of different sizes and layouts, and improving the applicability and operation flexibility of the device.

[0019] Optionally, an exhaust air assembly is provided on the mounting seat. The exhaust air assembly includes a fan and a wind guiding member. A first flow channel communicating with the air outlet side of the fan is formed in the ceramic heating plate, and a second flow channel communicating with the first flow channel is formed in the adsorption head. The wind guiding member is telescopically arranged in the adsorption head, so that when the fan ventilates the wind guiding member through the first flow channel and the second flow channel, the wind guiding member extends and blows air on the chip attached to the adsorption head.

[0020] By adopting the above technical solution, the air flow generated by the fan enters the wind guiding member through the first flow channel and the second flow channel, prompting the wind guiding member to extend and blow hot air on the bottom side of the chip on the adsorption head. The top side of the chip conducts heat through the adsorption head. Therefore, both sides of the chip can be better preheated, and the heat distribution on the chip surface can be made more uniform; the exhaust air assembly can also blow air on the adsorption holes of the adsorption head, thereby cleaning the adsorption holes, helping to ensure the tight fit between the chip and the adsorption head, and improving the preheating effect.

[0021] Optionally, the wind guiding member includes a bag body and an elastic cord. The bag body is flexible and is arranged in a ring shape. One end of the bag body is fixedly connected to the adsorption head and communicates with the second flow channel. The other end of the bag body is closed, and an exhaust hole is formed at the closed end of the bag body. The elastic cord is connected between the bag body and the adsorption head, and the elastic cord is used to drive the bag body to contract towards the side close to the adsorption head.

[0022] By adopting the above technical solution, the ring structure of the bag body effectively increases the contact area between the blown air and the chip, improving the heat transfer efficiency; the flexible bag body extends under the action of the fan and covers the outside of the chip for blowing and preheating to ensure uniform heating of the chip; since the blown air is concentrated inside the bag body, heat loss can be reduced; since the bag body is in a ring shape, the hot air is concentrated on the bottom side of the chip, and the blown hot air does not directly contact the conical surface of the adsorption head, so the conical surface of the adsorption head can be prevented from heating up too fast, ensuring the stability and uniformity of the preheating process; the elastic cord enables the bag body to contract automatically when there is no wind pressure, avoiding affecting the normal operation of the adsorption head.

[0023] In a second aspect, the present application provides a preheating method, adopting the following technical solution: A preheating method, applying the preheating device for an eutectic machine described in any one of the above, includes the following steps: a. The suction nozzle moves to the chip placement station, the suction head evacuates, and the chip is adsorbed on the suction head. b. The suction head moves from the chip placement station to the substrate on the eutectic stage. During the chip transfer process, the heating element heats up and remains at a constant temperature. The heat on the heating element is transferred to the chip through the mounting base and the suction head to preheat the chip. c. After moving the chip to the substrate on the eutectic stage, the suction head stops evacuating, and the chip is separated from the suction head.

[0024] By adopting the above technical solution, during the chip transfer process, the heating element continuously heats up and transfers the heat to the chip through the mounting base and the suction head, realizing the synchronous preheating of the chip, reducing the temperature difference between the chip and the substrate, and improving the temperature uniformity during the eutectic process; the preheating process of the chip can be carried out during the chip transfer process, thus helping to improve work efficiency; since the heating element remains at a constant temperature, the preheating effect on the chip can be guaranteed.

[0025] In summary, the present application includes the following beneficial technical effects: 1. By arranging a heating element inside the suction nozzle and adjusting the heat conduction efficiency by using the temperature control gap, it is possible to accurately preheat the chip during the chip transfer process, reduce temperature fluctuations, and reduce the temperature difference between the chip and the substrate, thereby improving the quality and stability of the eutectic process; the preheating process is carried out simultaneously with the chip transfer process, which helps to improve work efficiency.

[0026] 2. The design of combining the ceramic heating plate with the buffer structure effectively avoids the problem of ceramic sheet cracking caused by thermal expansion, while ensuring that the heat is concentrated in the heating area, reducing heat loss, improving the heating efficiency and extending the service life of the ceramic heating plate.

[0027] 3. The setting of the buffer component can avoid applying excessive pressure to the chip during the process of picking up or placing the chip, thus helping to protect the chip.

[0028] 4. During the chip preheating process, the suction head heats the top surface of the chip through heat conduction, and the bulging bag heats the bottom surface of the chip by blowing hot air, so the temperature consistency on both sides of the chip can be improved, and it also helps to improve the preheating efficiency. Description of the Drawings

[0029] Figure 1 is a schematic structural view of the mounting base in Embodiment 1 of the present application; Figure 2 is a cross-sectional view of the mounting base in Embodiment 1 of the present application; Figure 3It is a cross-sectional view of another perspective of the mounting base in Embodiment 1 of the present application; Figure 4 It is a schematic structural diagram of the whole in Embodiment 1 of the present application; Figure 5 It is Figure 4 An enlarged schematic view of part A in Figure 6 It is a cross-sectional view of Embodiment 1 of the present application for showing the adjusting assembly; Figure 7 It is Figure 6 An enlarged schematic view of part B in Figure 8 It is Figure 7 An enlarged schematic view of part C in Figure 9 It is a schematic structural diagram of the eccentric part in Embodiment 1 of the present application; Figure 10 It is a cross-sectional view of the bag body after bulging in Embodiment 2 of the present application.

[0030] Reference numerals: 1, mounting base; 11, mounting groove; 12, receiving groove; 13, first threaded hole; 2, ceramic heating plate; 3, suction nozzle; 31, adsorption head; 311, tapered hole; 312, adsorption hole; 313, annular groove; 32, suction pipe; 4, fastening bolt; 5, top plate; 6, buffer gap; 7, first spring; 8, adjusting assembly; 81, connecting block; 811, second threaded hole; 812, third threaded hole; 82, first mounting block; 821, through hole; 83, pin shaft; 84, first screw; 85, setscrew; 9, heat insulation member; 10, heat insulation strip; 14, mounting plate; 141, support block; 15, buffer assembly; 151, electromagnet; 152, connecting member; 153, second spring; 16, lateral sliding assembly; 17, vertical sliding assembly; 171, motor; 172, eccentric part; 1721, convex block; 1722, first shaft body; 1723, second shaft body; 173, connecting rod; 18, bag body; 181, exhaust hole; 19, elastic cord; 20, connecting head; 201, ventilation hole; 21, second mounting block; 22, second screw; 23, support plate; 24, guide block; 25, slider; 26, heat insulation pad. Detailed Description of the Invention

[0031] The following Figures 1 - 10 is a further detailed description of the present application.

[0032] Embodiment 1 Embodiment 1 of the present application discloses a preheating device for an eutectic machine. Refer to Figure 1, the preheating device for the eutectic machine includes a mounting base 1, a suction nozzle 3 and an adjusting member. A receiving groove 12 is formed in the mounting base 1, and a heating member is arranged in the receiving groove 12. The heating member is a ceramic heating plate 2, which has good high-temperature resistance and stable heat conduction characteristics, and can quickly transfer heat to the mounting base 1.

[0033] Referring to Figure 2 and Figure 3 , a mounting groove 11 is formed at the bottom of the mounting base 1; the suction nozzle 3 includes a suction head 31 and a suction pipe 32 fixedly connected to the top surface of the suction head 31. The suction head 31 is located in the mounting groove 11, and the top surface of the suction head 31 fits against the inner wall of the mounting groove 11. The bottom of the suction head 31 is located outside the mounting groove 11 and is used to adsorb the chip. The suction head 31 is made of a metal material, such as aluminum alloy or copper alloy, etc. These materials have good heat conduction performance and can quickly transfer heat to the adsorbed chip. The suction pipe 32 is located above the suction head 31, and a suction hole 312 is formed in the suction head 31. The bottom end of the suction hole 312 is located at the bottom of the suction head 31, and the top end of the suction hole 312 communicates with the suction pipe 32. A connector 20 is threadedly connected to the mounting base 1, and the connector 20 is used to communicate with a vacuum pump; a vent hole 201 is arranged inside the connector 20, and the vent hole 201 communicates with the suction pipe 32. Therefore, the vacuum pump can pump air through the vent hole 201, the suction pipe 32 and the suction hole 312, so as to evacuate the air and adsorb the chip at the bottom of the suction head 31.

[0034] Referring to Figure 2 , a temperature control gap is reserved between the top surface of the suction head 31 and the inner wall of the mounting groove 11, and the adjusting member is used to adjust the size of the temperature control gap. The adjusting member includes a tightening bolt 4. A first threaded hole 13 is formed in the mounting base 1, and the first threaded hole 13 communicates with the mounting groove 11. The tightening bolt 4 is threadedly connected to the first threaded hole 13. A tapered hole 311 is formed in the side wall of the suction head 31, and one end of the tightening bolt 4 located inside the mounting base 1 abuts against the tapered hole 311, so as to fix the suction head 31 on the mounting base 1. The axis of the tapered hole 311 is parallel to the axis of the tightening bolt 4, and the axis of the tapered hole 311 is slightly lower than the axis of the tightening bolt 4. Therefore, tightening the tightening bolt 4 can generate an upward pushing trend on the suction head 31, and abut the suction head 31 against the inner wall of the mounting groove 11, thereby reducing the temperature control gap and ensuring the heat transfer efficiency.

[0035] Further, in order to reduce the possibility of cracks occurring due to the expansion of the ceramic heating plate 2 after being heated, a top plate 5 is provided in the receiving groove 12. The top plate 5 is located above the ceramic heating plate 2, and the bottom wall of the top plate 5 is attached to the top wall of the ceramic heating plate 2. A buffer gap 6 is reserved between the top wall of the top plate 5 and the inner wall of the receiving groove 12. Therefore, after the ceramic heating plate 2 is heated and expands, it can have a certain buffer deformation space, thereby reducing the possibility of cracks occurring in the ceramic heating plate 2 after being heated. A first spring 7 is provided in the buffer gap 6. The first spring 7 is fixedly connected between the top wall of the top plate 5 and the inner wall of the receiving groove 12. The first spring 7 can make the ceramic heating plate 2 abut against the bottom wall of the receiving groove 12, thereby ensuring the heat conduction effect.

[0036] Referring to Figure 4 and Figure 5 , an adjusting assembly 8 is provided on one side of the mounting base 1. The adjusting assembly 8 includes a connecting block 81, a first mounting block 82, a pin shaft 83, a first screw 84 and a setscrew 85. The mounting base 1 is provided on the first mounting block 82. The first mounting block 82 and the connecting block 81 are provided with coaxially arranged mounting holes. The pin shaft 83 passes through the mounting holes. The diameter of the pin shaft 83 is the same as the diameter of the mounting holes. Therefore, the first mounting block 82 can be rotationally adjusted relative to the connecting block 81.

[0037] Referring to Figure 6 , Figure 7 and Figure 8 , on both sides of the mounting hole on the first mounting block 82, through holes 821 are provided. The through holes 821 are parallel to the axis of the mounting hole. Correspondingly, two second threaded holes 811 are provided on the connecting block 81. Each second threaded hole 811 corresponds to a through hole 821. The second threaded holes 811 and the through holes 821 are coaxially arranged. Two first screws 84 are provided and respectively pass through the two through holes 821. The diameter of the second threaded hole 811 is the same as the diameter of the first screw 84. The diameter of the through hole 821 is larger than the diameter of the first screw 84. Therefore, by inserting the first screw 84 into the through hole 821 and threading the first screw 84 with the second threaded hole 811, the first mounting block 82 can be fixedly connected to the connecting block 81. Since the diameter of the through hole 821 is larger than the diameter of the first screw 84, a clearance space is provided for the rotational adjustment of the first mounting block 82, so that after the first mounting block 82 rotates, the first screw 84 can still be inserted into the through hole 821.

[0038] Referring to Figure 7 and Figure 8, third threaded holes 812 are provided at both ends of the connecting block 81. There are two setscrews 85, which are respectively threadedly connected to the two third threaded holes 812. One end of the setscrew 85 passing through the third threaded hole 812 abuts against the first mounting block 82. Therefore, by rotating the setscrew 85, the end of the first mounting block 82 can be pushed to move, thereby realizing fine adjustment of the mounting angle of the first mounting block 82, which helps to improve the mounting accuracy.

[0039] Furthermore, a heat insulation member 9 is provided in the through hole 821 on the first mounting block 82. The heat insulation member 9 is a cylindrical structure with a stepped cross-section. The outer wall of the heat insulation member 9 fits against the inner wall of the through hole 821, and the inner wall of the heat insulation member 9 is spaced from the first screw 84; the head of the first screw 84 abuts against the end face of the heat insulation member 9. Since the heat insulation member 9 has good heat insulation effect, the heat on the first mounting block 82 cannot be directly transferred to the connecting block 81 through the first screw 84, and the heat is difficult to transfer upward, avoiding the overheating of the upper components, which helps to protect the upper components.

[0040] A heat insulation strip 10 is also provided between the connecting block 81 and the first mounting block 82, which can further block the conduction of heat. It should be noted that an avoidance hole for the first screw 84 to pass through is provided on this heat insulation strip 10, and the diameter of the avoidance hole is larger than the diameter of the first screw 84, so that after rotation adjustment, the first screw 84 can still pass through the avoidance hole.

[0041] Refer to Figure 5 and Figure 7 , the adjusting assembly 8 can make the first mounting block 82 rotate and fine-tune around an axis. In order to make the first mounting block 82 rotate and fine-tune around another axis, a second mounting block 21 is provided on one side of the first mounting block 82, and the mounting seat 1 is fixedly connected to the second mounting block 21. A pin shaft 83 is commonly passed through between the second mounting block 21 and the first mounting block 82, so that the second mounting block 21 can be rotationally adjusted relative to the first mounting block 82. A second screw 22 is provided between the first mounting block 82 and the second mounting block 21 for fixing the second mounting block 21 on the first mounting block 82; the connection structure between the first mounting block 82 and the second mounting block 21 is the same as that between the connecting block 81 and the first mounting block 82, which will not be elaborated here. Among them, there are two second screws 22, which are respectively located at both ends of the first mounting block 82, and the two second screws 22 are staggered, which helps to enhance the connection effect.

[0042] Refer to Figure 5 , a heat insulation strip 10 is provided between the first mounting block 82 and the second mounting block 21, and a heat insulation strip 10 is also provided between the second mounting block 21 and the mounting seat 1. Therefore, the conduction of heat from the mounting seat 1 upward can be weakened, thereby protecting the upper structure.

[0043] Refer toFigure 6 and Figure 9 , in order to drive the suction nozzle 3 to move and complete the transfer of the chip, a horizontal sliding assembly 16 and a vertical sliding assembly 17 are provided on one side of the connecting block 81. The horizontal sliding assembly 16 includes a linear motor, the sliding direction of the movable end of the linear motor is horizontally arranged, and the movable end of the linear motor is fixedly connected with a support plate 23. The vertical sliding assembly 17 includes a motor 171, an eccentric member 172 and a connecting rod 173. An installation plate 14 is provided on one side of the connecting block 81, and the connecting block 81 is arranged on the installation plate 14. The motor 171 is fixedly connected to the top wall of the support plate 23, and the output shaft of the motor 171 is horizontally arranged. The installation plate 14 is slidably connected to the support plate 23 in the vertical direction. The eccentric member 172 includes a convex block 1721, a first shaft body 1722 and a second shaft body 1723; both the first shaft body 1722 and the second shaft body 1723 are fixedly connected to the convex block 1721, and the first shaft body 1722 and the second shaft body 1723 are arranged in parallel at intervals. The first shaft body 1722 is coaxially and fixedly connected to the output shaft of the motor 171, and the second shaft body 1723 is hinged to the top end of the connecting rod 173; the bottom end of the connecting rod 173 is hinged to the installation plate 14. Therefore, under the transmission action of the eccentric member 172 and the connecting rod 173, the rotation of the output shaft of the motor 171 can drive the installation plate 14 to move up and down. Since the mounting seat 1 is arranged on the installation plate 14, under the action of the horizontal sliding assembly 16 and the vertical sliding assembly 17, the mounting seat 1 can be moved horizontally and vertically, so as to realize the transfer of the chip through the suction nozzle 3 on the mounting seat 1.

[0044] In other embodiments, the horizontal sliding assembly 16 and the vertical sliding assembly 17 can also adopt air cylinders.

[0045] Refer to Figure 5, To avoid exerting excessive pressure on the chip during the process of the mounting base 1 moving downward to pick up or place the chip, a buffer assembly 15 is provided on the mounting plate 14. A guide block 24 is fixedly connected to the mounting plate 14, and the length direction of the guide block 24 is vertically arranged; a slider 25 is slidably connected to the guide block 24 in the vertical direction, and a connecting block 81 is fixedly connected to the slider 25; a heat insulation pad 26 is fixedly connected between the connecting block 81 and the slider 25. The buffer assembly 15 includes an electromagnet 151, a connecting member 152, and a second spring 153. The electromagnet 151 is fixedly connected to the mounting plate 14. The connecting member 152 is fixedly connected to the connecting block 81, and the connecting member 152 is made of steel, so that the electromagnet 151 can generate a suction force on the connecting member 152 after being energized. Two second springs 153 are provided and are respectively located at the upper and lower ends of the slider 25; support blocks 141 are fixedly connected to the mounting plate 14 at the upper and lower ends of the slider 25, and the second spring 153 is fixedly connected between the slider 25 and the support block 141. Therefore, the second spring 153 can be used for the reset of the slider 25 and the connecting block 81. By adjusting the magnitude of the current applied to the electromagnet 151, the suction force on the connecting member 152 can be adjusted, thereby adjusting the initial position of the connecting block 81 relative to the mounting plate 14.

[0046] The implementation principle of Embodiment 1 is as follows: The suction holes 312 are evacuated to adsorb the chip at the bottom end of the suction head 31, so that the chip is in contact with the end face at the bottom end of the suction head 31. Through the cooperation of the horizontal sliding assembly 16 and the vertical sliding assembly 17, the chip can be moved from the chip placement station to the eutectic stage. During the process of transferring the chip, the ceramic heating plate 2 is in a working state, and the ceramic heating plate 2 quickly heats up and maintains a constant temperature; the heat on the ceramic heating plate 2 is transferred to the suction head 31 through the mounting base 1, and then the suction head 31 transfers the heat to the chip at the bottom, thereby preheating the chip, which helps to improve work efficiency.

[0047] This embodiment also discloses a preheating method, including the following steps: Step a. The suction nozzle 3 moves to the chip placement station, and the suction head 31 is evacuated to adsorb the chip at the bottom end of the suction head 31.

[0048] Step b. Under the cooperation of the horizontal sliding assembly 16 and the vertical sliding assembly 17, the suction head 31 moves from the chip placement station to the substrate on the eutectic stage. During the chip transfer process, the ceramic heating plate 2 heats up and then maintains a constant temperature, and the heat on the ceramic heating plate 2 is transferred to the chip through the mounting base 1 and the suction head 31 to preheat the chip.

[0049] Step c. After the chip is moved to the substrate on the eutectic stage, the suction head 31 stops evacuating, and the chip is separated from the suction head 31.

[0050] Embodiment 2 Refer toFigure 10 , the difference between this embodiment and Embodiment 1 is that an exhaust component is provided on the mounting base 1 in this embodiment. The exhaust component includes a fan and a wind guiding member. The fan is fixedly connected to the mounting base 1. A first flow channel is formed in the ceramic heating plate 2; a second flow channel and an annular groove 313 are formed in the suction head 31. One end of the first flow channel is communicated with the air outlet side of the fan, the other end of the first flow channel is communicated with the second flow channel, and the second flow channel is communicated with the annular groove 313. Therefore, the air blown out by the fan can first flow into the first flow channel, and after being heated by the ceramic heating plate 2, it then flows into the second flow channel and the annular groove 313.

[0051] The wind guiding member includes a bag body 18 and an elastic cord 19. The bag body 18 is flexible and is arranged in a ring shape. The top end of the bag body 18 is open and fixedly connected to the suction head 31, and the inside of the bag body 18 is communicated with the annular groove 313; the bottom end of the bag body 18 is closed. A plurality of exhaust holes 181 are formed in the bottom end of the bag body 18 and are arranged in a circumferential array. Therefore, after the fan is started, the hot air in the annular groove 313 flows into the bag body 18, causing the bag body 18 to bulge. At this time, the hot air in the bag body 18 can be discharged outward through the exhaust holes 181, so as to blow hot air to the lower surface of the chip adsorbed to the bottom end of the suction head 31 and preheat the lower surface of the chip, which helps to enhance the preheating effect on the chip. The elastic cord 19 is located in the bag body 18. The top end of the elastic cord 19 is fixedly connected to the inner wall of the annular groove 313, and the bottom end of the elastic cord 19 is fixedly connected to the inner wall of the bottom end of the bag body 18. When the fan stops working, the elastic cord 19 can cause the bag body 18 to close upward, so that the bag body 18 shrinks to the side close to the surface of the suction head 31, avoiding the influence of the bag body 18 on the picking and feeding processes of the suction head 31.

[0052] The implementation principle of Embodiment 2 is: during the process of transferring the chip, the ceramic heating plate 2 is in a heating state, and the heat on the ceramic heating plate 2 is transferred to the top wall of the chip through the mounting base 1 and the suction head 31 to preheat the upper surface of the chip. At the same time, the fan is in a working state. When the air blown out by the fan flows into the first flow channel, it will be heated, and the heated air then flows into the bag body 18 through the second flow channel and the annular groove 313, causing the bag body 18 to bulge. The hot air in the bag body 18 is discharged outward through the exhaust holes 181 to blow hot air to the lower surface of the chip for preheating; therefore, both sides of the chip can be heated simultaneously, which helps to improve the preheating efficiency.

[0053] The above are the optional embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A preheating device for a eutectic machine, characterized in that: include: A mounting seat (1), wherein a heating element is provided in the mounting seat (1), and the heating element is capable of transferring heat to the mounting seat (1), and a mounting groove (11) is provided on the bottom side of the mounting seat (1); A suction nozzle (3), comprising a suction head (31) and a suction tube (32) connected to each other, wherein the suction head (31) is installed in the installation groove (11) and the suction end of the suction head (31) is exposed outside the installation groove (11), and a temperature control gap is reserved between the suction head (31) and the inner wall of the installation groove (11); An adjusting member is disposed in the mounting seat (1) and is used to adjust the size of the temperature control gap so as to adjust the heat conduction efficiency between the mounting seat (1) and the adsorption head (31).

2. A preheating device for a eutectic machine according to claim 1, characterized in that: The adjusting member comprises a clamping bolt (4), wherein the clamping bolt (4) is threadedly connected to the mounting seat (1), and a conical hole (311) is provided on the adsorption head (31), wherein the axis of the conical hole (311) is arranged parallel to the center line of the clamping bolt (4) so ​​that the adsorption head (31) is pushed to move toward a side close to the temperature control gap during the tightening process of the clamping bolt (4).

3. The preheating device for a eutectic machine according to claim 1, characterized in that: The heating element is a ceramic heating plate (2), a receiving groove (12) is provided in the mounting seat (1), the ceramic heating plate (2) is arranged in the receiving groove (12), a top plate (5) is provided in the receiving groove (12) on a side of the ceramic heating plate (2) away from the adsorption head (31), a buffer gap (6) is reserved between the top plate (5) and the inner wall of the receiving groove (12), and a first spring (7) is connected between the top plate (5) and the inner wall of the receiving groove (12).

4. The preheating device for a eutectic machine according to claim 1, characterized in that: An adjustment component (8) is provided on one side of the mounting seat (1). The adjustment component (8) comprises a connecting block (81), a first mounting block (82), a pin shaft (83), a first screw (84) and a top screw (85). The mounting seat (1) is provided on the first mounting block (82). The pin shaft (83) is passed through between the first mounting block (82) and the connecting block (81) so that the first mounting block (82) can rotate relative to the connecting block (81). The first mounting block (82) is provided with a through hole (821) having a larger diameter than the first screw (84). The first screw (84) is passed through the through hole (821) and is threadedly connected to the connecting block (81). The top screw (85) is threadedly connected to the connecting block (81). The end of the top screw (85) is used to abut against the first mounting block (82).

5. The preheating device for a eutectic machine according to claim 4, characterized in that: A heat insulating member (9) is provided at the through hole (821) on the first mounting block (82), the first screw (84) is passed through the heat insulating member (9) and abuts against the heat insulating member (9), and a heat insulating strip (10) is provided between the connecting block (81) and the first mounting block (82).

6. A preheating device for a eutectic machine according to claim 4, characterized in that: A mounting plate (14) is provided on one side of the connecting block (81); the connecting block (81) is slidably connected to the mounting plate (14); a buffer assembly (15) is provided on the mounting plate (14); the buffer assembly (15) comprises an electromagnet (151), a connecting piece (152) and a second spring (153); the electromagnet (151) is fixedly connected to the mounting plate (14); the connecting piece (152) is fixedly connected to the connecting block (81); the electromagnet (151) is used to generate suction force on the connecting piece (152); two second springs (153) are provided and are respectively arranged at two ends of the connecting block (81) in a sliding direction; the second spring (153) is connected between the connecting block (81) and the mounting plate (14).

7. A preheating device for a eutectic machine according to claim 6, characterized in that: A vertical sliding component (17) and a lateral sliding component (16) are provided on one side of the mounting plate (14); the vertical sliding component (17) is used to drive the mounting plate (14) to slide vertically, and the lateral sliding component (16) is used to drive the mounting plate (14) to slide horizontally.

8. The preheating device for a eutectic machine according to claim 3, characterized in that: An exhaust assembly is arranged on the mounting seat (1), and the exhaust assembly comprises a fan and an air guide. A first flow channel connected to the air outlet side of the fan is provided in the ceramic heating plate (2), and a second flow channel connected to the first flow channel is provided in the adsorption head (31). The air guide is telescopically arranged in the adsorption head (31), so that when the fan ventilates the air guide through the first flow channel and the second flow channel, the air guide is extended and blows air toward the chip attached to the adsorption head (31).

9. A preheating device for a eutectic machine according to claim 8, characterized in that: The air guide member comprises a bag body (18) and an elastic rope (19); the bag body (18) is flexible and arranged in a ring shape; one end of the bag body (18) is fixedly connected to the adsorption head (31) and communicates with the second flow channel; the other end of the bag body (18) is closed; one end of the bag body (18) that is closed is provided with an exhaust hole (181); the elastic rope (19) is connected between the bag body (18) and the adsorption head (31); and the elastic rope (19) is used to drive the bag body (18) to shrink toward a side close to the adsorption head (31).

10. A preheating method using the preheating device for a eutectic machine according to any one of claims 1 to 9, characterized in that: The preheating method comprises the following steps: a. The suction nozzle (3) moves to the chip placement station, the suction head (31) is evacuated, and the chip is sucked onto the suction head (31); b. The adsorption head (31) is moved from the chip placement station to the substrate on the eutectic table. During the chip transfer process, the heating element is heated and maintained at a constant temperature. The heat on the heating element is transferred to the chip through the mounting base (1) and the adsorption head (31), thereby preheating the chip. c. After the chip is moved onto the substrate on the eutectic table, the adsorption head (31) stops evacuating the vacuum, and the chip is separated from the adsorption head (31).

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