A TVOC emission reduction system and method for semiconductor temperature control modules

Abstract

The present application relates to a TVOC emission reduction system and method for a semiconductor temperature control module, wherein the semiconductor temperature control module TVOC emission reduction system is used to reduce TVOC emissions from the temperature control module, wherein the temperature control module is connected to an exhaust pipe, the exhaust pipe is connected to an exhaust fan, the exhaust fan is connected to an exhaust gas treatment module via a waste pipe, and is used to discharge TVOC from the temperature control module to the exhaust gas treatment module for treatment; the exhaust pipe and / or the waste pipe are provided with a TVOC concentration sensor, a gas flow meter, a pressure sensor, and a flow regulating valve, and are respectively electrically connected to a control module of the emission reduction system; the exhaust fan is electrically connected to the control module. The present invention can be applied to the treatment of TVOC exceeding the standard in semiconductor manufacturing temperature control modules, and is particularly applicable to temperature control modules where TVOC exceeds the standard due to the use of glue, thermal insulation cotton, coolant, etc., to avoid the risk of exceeding the standard of total volatile organic compounds.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing equipment, and more specifically, to a TVOC emission reduction system and method for a semiconductor temperature control module. Background Art

[0002] The semiconductor manufacturing process has strict requirements on temperature. Temperature control modules are usually used to accurately control the system temperature in the manufacture of semiconductor integrated circuits to ensure process stability and product quality.

[0003] Combine Figure 1 The temperature control module mainly includes a liquid storage tank, a heater, a pressure regulator, a pump and a refrigeration system, etc. At the same time, an external coolant input pipe and a coolant output pipe are required to input the coolant for cooling.

[0004] The liquid storage tank, coolant input pipe, coolant output pipe and refrigeration system often need to be insulated to maintain the coolant temperature, reduce cooling loss, and prevent condensation on the surface of equipment and pipes, which may damage the system.

[0005] The thermal insulation materials mainly use a large amount of thermal insulation cotton and glue, and these two materials usually release a lot of volatile organic compound gases; the refrigerant is usually electronic fluorine liquid, and the use of electronic fluorine liquid has a certain risk of leakage and may release a large amount of fluorine-containing gas; volatile organic compounds and fluorine-containing gas constitute the TVOC of the temperature control module, that is, the total volatile organic compounds of the temperature control module. The large-scale release of TVOC will cause environmental pollution and health risks.

[0006] Traditional methods for removing TVOCs released from temperature control modules primarily rely on ventilation or adsorbents, but these methods are limited in effectiveness and the cost of using adsorbents is high. Therefore, an efficient and cost-effective TVOC reduction solution is urgently needed. Summary of the Invention

[0007] The purpose of this application is to provide a TVOC emission reduction system and method for semiconductor temperature control modules, which can be used to treat TVOC exceeding the standard in semiconductor manufacturing temperature control modules, especially for temperature control modules where TVOC exceeds the standard due to the use of glue, thermal insulation cotton and coolant, so as to avoid the risk of exceeding the standard of total volatile organic compounds.

[0008] To achieve the above objectives, in a first aspect, the present invention provides a semiconductor temperature control module TVOC emission reduction system, which is used for reducing TVOC emissions from the temperature control module. The temperature control module is connected to an exhaust pipe, and the exhaust pipe is connected to an exhaust fan. The exhaust fan is connected to an exhaust gas treatment module through an exhaust pipe, and is used to discharge TVOC from the temperature control module to the exhaust gas treatment module for treatment.

[0009] The extraction and exhaust pipeline and / or the waste discharge pipeline are provided with a TVOC concentration sensor, a gas flow meter, a pressure sensor and a flow regulating valve, and are electrically connected to the control module of the emission reduction system respectively;

[0010] The exhaust fan is electrically connected to the control module.

[0011] In an optional embodiment, the temperature control module includes a temperature control module shell, and a louver cover is provided on the temperature control module shell. The louver cover is detachably connected to the temperature control module shell, and the louver opening of the louver cover is adjustable through an adjustment hole.

[0012] In an optional embodiment, a plurality of exhaust ports are provided on the temperature control module housing, the exhaust pipe is connected to at least one of the exhaust ports, and the exhaust ports not connected to the pipe are blocked;

[0013] The shutter sealing plate and the exhaust port are arranged on both sides of the temperature control module housing opposite to each other.

[0014] In an optional embodiment, the exhaust port is a flange pipe port arranged on the temperature control module shell, including a first exhaust port and a second exhaust port respectively arranged on the top and bottom sides of the temperature control module shell, the exhaust pipe is flange-connected to the first exhaust port, and the second exhaust port is sealed by a blind plate, the blind plate includes a permanent magnet blind plate detachably connected to the second exhaust port, and a sealing ring is lined on the sealing surface of the permanent magnet blind plate.

[0015] In an optional embodiment, the louver covering plates include two groups distributed upper and lower, each group of the louver covering plates includes a horizontal louver covering plate located at the upper part, and a pair of vertical louver covering plates located at the lower part, and the vertical louver covering plates are arranged at the lateral ends of the horizontal louver covering plates.

[0016] In an optional embodiment, the transverse louver cover plate has windows at both ends thereof, and the vertical louver cover plate is arranged directly below the window openings of the transverse louver cover plate;

[0017] The window opening area of ​​the vertical shutter cover plate is larger than the window opening area of ​​the horizontal shutter cover plate.

[0018] In an optional embodiment, the extraction and drainage pipe and the waste discharge pipe both include stainless steel pipes, or the inner side walls of the extraction and drainage pipe and the waste discharge pipe are lined with a corrosion-resistant coating.

[0019] In an optional embodiment, the exhaust gas treatment module includes a burner or a plasma generator for treating exhaust gas, and the burner or the plasma generator is electrically connected to the control module.

[0020] In an optional embodiment, a monitoring terminal module is further included, and the control module is electrically connected to the monitoring terminal module.

[0021] In a second aspect, the present invention provides a method for reducing TVOC emissions from a semiconductor temperature control module, which is performed using the semiconductor temperature control module TVOC emission reduction system described above, and includes the following steps:

[0022] Determine TVOC treatment parameters based on real-time data detected by the TVOC concentration sensor, gas flow meter, and pressure sensor of the emission reduction system;

[0023] The control module controls and adjusts the operating power of the exhaust fan according to the TVOC processing parameters;

[0024] During operation, the control module synchronously adjusts the operating parameters of the exhaust gas treatment device in the exhaust gas treatment module according to the TVOC treatment parameters of the temperature control module and the exhaust parameters of the exhaust gas after treatment by the exhaust gas treatment module;

[0025] The control module adjusts the operating power of the exhaust fan based on the stability of the gas processing volume of the exhaust gas treatment module and the window opening control of the temperature control module.

[0026] By setting up exhaust pipes, exhaust fans and exhaust pipes between the temperature control module and the exhaust gas treatment module, the TVOC generated by the temperature control module can be discharged to the exhaust gas treatment module for treatment, thereby achieving the purpose of reducing TVOC emissions from the semiconductor temperature control module. At the same time, the TVOC of the temperature control module and the exhaust gas generated by other modules in the semiconductor process are combined and treated through the exhaust gas treatment module, solving the problem of TVOC exceeding the standard in the existing technology, thereby improving the production environment and avoiding health risks.

[0027] By combining the TVOC concentration sensor, gas flow meter, pressure sensor and flow regulating valve installed on the extraction and exhaust pipes and / or waste discharge pipes, and electrically connecting the above valves and components to the control module of the emission reduction system, it is possible to form an automated emission reduction operation of TVOC in the semiconductor temperature control module, and at the same time create conditions for automated linkage control with the exhaust gas treatment module.

[0028] At the same time, by electrically connecting the exhaust fan to the control module, the control module can control the operating frequency of the exhaust fan according to the received data signals such as concentration, pressure, flow, etc., so as to meet the TVOC emission reduction requirements of the temperature control module.

[0029] The TVOC emission reduction method of the semiconductor temperature control module in this application can determine the TVOC processing parameters based on the relevant data of the semiconductor temperature control module TVOC detected in real time, and enable the control module to control and adjust the operating power of the exhaust fan according to the TVOC processing parameters, thereby realizing the automated emission reduction operation of the temperature control module TVOC.

[0030] At the same time, the control module can also control the operating parameters of the exhaust gas treatment device in the exhaust gas treatment module according to the TVOC processing parameters generated by the temperature control module to meet the normal operation of the semiconductor production process.

[0031] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 It is a structural diagram of an existing semiconductor temperature control module;

[0034] Figure 2 This is a structural diagram of the TVOC emission reduction system for the semiconductor temperature control module in this application;

[0035] Figure 3 A schematic diagram of the arrangement of the shutter cover on the temperature control module housing;

[0036] Figure 4 It is a partial structural diagram of the shutter cover;

[0037] Figure 5 This is a schematic diagram of the layout of the exhaust port on the temperature control module housing;

[0038] Figure 6 This is a flow chart of the TVOC emission reduction method for the semiconductor temperature control module in this application.

[0039] icon:

[0040] 1-Liquid storage tank; 2-Heater; 3-Pressure regulator; 4-Pump; 5-Refrigeration system; 6-Coolant input pipe; 7-Coolant output pipe;

[0041] 10-temperature control module; 11-temperature control module housing; 12-louver sealing plate; 12a-horizontal louver sealing plate; 12b-vertical louver sealing plate;

[0042] 13-adjustment hole; 14-extraction port; 14a-first extraction port; 14b-second extraction port; 15-permanent magnet blind plate; 16-control rod;

[0043] 20-exhaust gas treatment module; 21-exhaust gas treatment device;

[0044] 30-exhaust pipe; 31-TVOC concentration sensor; 32-gas flow meter; 33-pressure sensor; 34-flow control valve;

[0045] 40-waste pipe;

[0046] 50-Exhaust fan;

[0047] 60-control module;

[0048] 70-Monitoring terminal module. DETAILED DESCRIPTION

[0049] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0050] In the description of this application, it should be noted that the terms "inner" and "outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" and the like are used solely for distinction and should not be construed as indicating or implying relative importance.

[0051] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0052] Combine Figure 2The semiconductor temperature control module emission reduction system in this application is combined with the semiconductor exhaust gas treatment module 20 by setting necessary exhaust pipes and detection components between the temperature control module 10 and the exhaust gas treatment module 20, thereby effectively reducing the TVOC emissions of the temperature control module 10 and solving the problem of excessive temperature control module 10 in the prior art.

[0053] The exhaust gas treatment module 20 is primarily used to treat toxic, corrosive, or flammable exhaust gases generated during the semiconductor manufacturing process, such as perfluorocarbon greenhouse gases and toxic gases such as CF4, NF3, SF6, C2F6, C2HF3, and CH2F2 generated by processes such as dry etching, thin film, and diffusion. The exhaust gas treatment module 20 can also further treat the large amount of TVOC released from the temperature control module 10. By reducing the large amount of TVOC released from the temperature control module 10 and directing it to the exhaust gas treatment module 20, the exhaust gas treatment module 20 can also treat the large amount of TVOC released from the temperature control module 10, thereby achieving the purpose of reducing emissions from the semiconductor temperature control module 10.

[0054] See also Figure 1 The specific composition of the temperature control module 10 is that the temperature control module 10 mainly includes a liquid storage tank 1, a heater 2, a pressure regulator 3, a pump 4 and a refrigeration system 5, etc. At the same time, an external coolant input pipe 6 and a coolant output pipe 7 are required to input coolant for cooling.

[0055] When the necessary pipeline equipment is insulated, the volatile organic compound gas emitted by the insulation material will constitute the main part of the temperature control module 10. Another potential hidden danger is the fluorine-containing gas that may leak from the electronic fluorine liquid. The two together constitute the TVOC of the temperature control module 10.

[0056] By discharging the TVOC in the temperature control module 10 to the exhaust gas treatment module 20 , the exhaust gas treatment module 20 can treat the exhaust gas generated during normal operation while also reducing the TVOC in the temperature control module 10 .

[0057] Combine Figure 2 In the semiconductor temperature control module emission reduction system of the present application, the temperature control module 10 is connected to an exhaust pipe 30, and the exhaust pipe 30 is connected to an exhaust fan 50. The exhaust fan 50 is connected to the exhaust gas treatment module 20 through an exhaust pipe 40, and is used to discharge the TVOC of the temperature control module 10 to the exhaust gas treatment module 20 for treatment.

[0058] By connecting the above-mentioned different pipes with the exhaust fan 50, the TVOC in the temperature control module 10 can be discharged to the exhaust gas treatment module 20 for combined treatment.

[0059] By arranging a TVOC concentration sensor 31, a gas flow meter 32, a pressure sensor 33 and a flow regulating valve 34 on the exhaust pipe 30 and / or the waste discharge pipe 40, it is mainly used to detect the exhaust gas concentration, pressure and gas flow in the temperature control module 10 in real time. The exhaust gas concentration mainly includes the exhaust gas generated by normal production in the temperature control module 10 and the TVOC generated.

[0060] The combination of different sensors, the gas flow meter 32, the flow regulating valve 34 and the exhaust fan 50 are electrically connected to the control module 60 of the emission reduction system respectively, so that the control module 60 can control the operation of the exhaust fan 50 according to the TVOC concentration and pressure conditions in the temperature control module 10 detected in real time, and discharge the TVOC in the temperature control module 10 to the exhaust gas treatment module 20.

[0061] Furthermore, the control module 60 can control the opening of the flow regulating valve 34 according to the pressure condition and gas flow of the temperature control module 10 to achieve automatic emission reduction operation.

[0062] The TVOC concentration sensor 31, gas flow meter 32, pressure sensor 33 and flow regulating valve 34 in this application are preferably arranged on the exhaust pipe 30 directly connected to the temperature control module 10, so as to obtain relatively real and accurate real-time parameters of the temperature control module 10. They are also arranged on the exhaust pipe 40 connected to the exhaust gas treatment module 20, or the TVOC concentration sensor 31, gas flow meter 32, pressure sensor 33 and flow regulating valve 34 are arranged on both the exhaust pipe 30 and the exhaust pipe 40, which can also achieve more precise self-control operation.

[0063] Combine Figure 3-Figure 5 From the perspective of effectively extracting TVOC from the temperature control module 10, the temperature control module 10 includes a temperature control module housing 11. The temperature control module housing 11 is specifically a housing including a louvered cover plate 12. The vacuum negative pressure inside the temperature control module housing 11 during the suction operation of the suction fan can be adjusted by controlling the size of the window on the louvered cover plate 12. The larger the window, the smaller the negative pressure and the lower the suction effect. The smaller the window, the higher the negative pressure and the better the suction effect, but it will cause unnecessary impact on the equipment of the temperature control module 10. During the suction process, the outside air is sucked into the interior of the housing through the window and the TVOC is discharged to the exhaust gas treatment module 20 in parallel.

[0064] By detachably connecting the shutter cover 12 to the temperature control module housing 11 and fixing it with fasteners such as nuts, the housing can be sealed in a detachable manner.

[0065] The shutter opening of the shutter cover 12 is adjustable through the adjustment hole 13 and can be flexibly adjusted to ensure that the TVOC released by the temperature control module 10 can be mixed with the outside air and effectively extracted by the exhaust pipe 30, while avoiding excessive negative pressure inside the shell.

[0066] Combine Figure 4 An adjustment plate (not shown in the figure) is also provided between the shutter cover 12 and the temperature control module housing 11. The adjustment plate is also provided with a window opening portion with the same window opening structure as the shutter cover 12. A control rod 16 protruding from the adjustment hole 13 is provided on the adjustment plate. The control rod 16 is raised and lowered to control the intersection area of ​​the window opening portion on the adjustment plate and the window opening portion of the shutter cover 12, thereby adjusting the opening degree of the shutter cover 12.

[0067] From the perspective of reducing the corrosion of the shell by exhaust gas and TVOC, the contact surface between the shutter sealing plate 12 and the shell uses a high-temperature resistant and corrosion-resistant sealing material to ensure airtightness.

[0068] In order to ensure the connection of the exhaust pipe 30 on the temperature control module housing 11, a plurality of exhaust ports 14 are provided on the temperature control module housing 11. The exhaust pipe 30 is connected to at least one exhaust port 14. The exhaust port 14 that is not connected to the pipe can be used as a spare pipe port for sealing.

[0069] With respect to the opening angle of the louver, in order to form an effective exhaust airflow between the exhaust port 14 and the louver cover 12, the louver cover 12 and the exhaust port 14 are arranged on both sides of the temperature control module shell 11 relative to each other, so that the suction airflow of the exhaust port 14 can be correspondingly covered on the shell side wall on the other side of the exhaust port 14, that is, correspondingly covered on the shell side wall where the louver cover 12 is provided, so that the louver opening part on the shell side wall forms a stable and reliable air induction, thereby ensuring the extraction effect.

[0070] The exhaust port 14 is a flange pipe port arranged on the temperature control module shell 11, which can facilitate the matching connection between the exhaust pipe 30 and the flange pipe port. Based on the opening of multiple exhaust ports 14 on the temperature control module shell 11, in order to reduce the impact of multiple openings on the shell structure strength, the multiple exhaust ports 14 should be arranged far away from each other. Specifically, the exhaust port 14 includes a first exhaust port 14a and a second exhaust port 14b respectively arranged on the top and bottom sides of the temperature control module shell 11. The exhaust pipe 30 is flange-connected to the first exhaust port 14a. In this case, the second exhaust port 14b is sealed by a blind plate as a spare port.

[0071] In order to facilitate flexible adjustment of the connection and sealing angle of the exhaust port 14, the corresponding sealing blind plate on the second exhaust port 14b is made of permanent magnets, and specifically includes a permanent magnet blind plate 15 detachably connected to the second exhaust port 14b. This setting method can facilitate disassembly and maintenance.

[0072] Furthermore, an additional regulating valve can be provided at the air outlet to control the gas flow. The sealing surface of the permanent magnet blind plate 15 is lined with a sealing ring, which can effectively seal under the condition of magnetic attraction and blocking.

[0073] In order to fully cover the space inside the temperature control shell, the louver sealing plates 12 include two groups distributed upper and lower. Each group of louver sealing plates 12 includes a horizontal louver sealing plate 12a located at the upper part and a pair of vertical louver sealing plates 12b located at the lower part. The vertical louver sealing plates 12b are arranged at the lateral ends of the horizontal louver sealing plates 12a.

[0074] More specifically, the horizontal louver covering plate 12a has windows at both ends thereof, and the vertical louver covering plate 12b is arranged directly below the window opening of the horizontal louver covering plate 12a. Furthermore, the window opening area of ​​the vertical louver covering plate 12b is larger than the window opening area of ​​the horizontal louver covering plate 12a.

[0075] In detail, the horizontal louver cover 12a has windows only at its two horizontal ends, while the vertical louver cover 12b has windows in most areas, and the window openings are almost continuously extended in the vertical direction, thus forming a criss-cross window arrangement of the horizontal louver cover 12a and the vertical louver cover 12b, which can form a certain airflow intersection and ensure the suction and exhaust effect of TVOC inside the temperature control shell.

[0076] The extraction and exhaust pipe 30 and the waste discharge pipe 40 in this application are made of corrosion-resistant materials, such as stainless steel 316L. In this setting, the extraction and exhaust pipe 30 and the waste discharge pipe 40 both include stainless steel pipes made of 316L material, or the extraction and exhaust pipe 30 and the waste discharge pipe 40 are anti-corrosion in the form of lining with a corrosion-resistant coating. In this setting, the inner side walls of the extraction and exhaust pipe 30 and the waste discharge pipe 40 are lined with a corrosion-resistant polytetrafluoroethylene coating to adapt to the corrosiveness of TVOC.

[0077] The diameters of the extraction and exhaust pipe 30 and the waste discharge pipe 40 are determined based on the gas flow rate and pressure loss, and are usually 40-100 mm to ensure smooth gas flow.

[0078] The exhaust pipe 30 is connected to the exhaust port 14 to collect TVOC released by the equipment. The exhaust port 14 is connected by a flange or a quick connector to facilitate maintenance and replacement.

[0079] Similarly, the exhaust gas treatment module 20 also includes an air inlet, and the exhaust pipe 40 is connected to the air inlet of the exhaust gas treatment module 20. The connection can be flanged or clamped to ensure sealing.

[0080] During operation, the exhaust fan 50 extracts TVOC from the temperature control module housing 11 and discharges it to the exhaust gas treatment module 20 through the exhaust pipe 40 and the air inlet. The exhaust gas treatment module 20 decomposes or adsorbs TVOC and exhaust gas through combustion, high-temperature plasma or adsorption.

[0081] Specifically, the exhaust gas treatment module 20 includes a burner or a plasma generator for treating exhaust gas. Based on the automatic linkage control relationship between the semiconductor temperature control module emission reduction system and the exhaust gas treatment module 20 described above, the control module 60 in this application is also electrically connected to the burner or plasma generator, so that the control module 60 of the emission reduction system and the exhaust gas treatment device 21 of the exhaust gas treatment module 20 can form a linkage control effect.

[0082] When the exhaust gas treatment device 21 is in the form of a burner, the exhaust gas treatment module 20 uses high-temperature combustion technology of 800°C to 1200°C to decompose TVOC and exhaust gas into harmless substances such as CO2 and H2O, and then uses water cooling to reduce the high-temperature gas to a safe temperature to achieve safe purified emissions.

[0083] When the exhaust gas treatment device 21 is in the form of a plasma generator, a high-temperature plasma generator is used to generate high-energy electrons to decompose gas molecules into low-toxic or non-toxic components, which are then cooled to achieve safe purification and emission.

[0084] At the same time, the exhaust gas treatment module 20 can also use activated carbon or corresponding adsorption catalysts to adsorb TVOC, which is suitable for low-concentration gas treatment.

[0085] The emission reduction system of the present invention further includes a monitoring terminal module 70, and the control module 60 is electrically connected to the monitoring terminal module 70. The monitoring terminal module 70 is used to monitor TVOC concentration and adjust the operating parameters of the exhaust fan 50 and the exhaust gas treatment device 21 to achieve automatic control.

[0086] The TVOC concentration sensor 31, gas flow meter 32 and pressure sensor 33 are provided to monitor the gas status in real time. The exhaust fan 50 can also adjust the air volume in real time according to sensors such as TVOC pressure. In addition, temperature sensors and flow sensors can be installed as needed to comprehensively monitor the system operation status.

[0087] The control module 60 uses a PLC or DCS as the core control unit, and automatically adjusts the opening of the flow control valve 34 on the extraction pipe 30 and / or the exhaust pipe 40 and the operating parameters of the exhaust treatment device 21 in the exhaust treatment module 20, such as the combustion temperature, plasma temperature, etc., according to the sensor data.

[0088] The monitoring terminal module 70 is equipped with a touch screen or a remote monitoring terminal, which displays the system operation status and gas treatment effect in real time, supports an alarm function, and automatically alarms and records data when the TVOC concentration exceeds the standard or the system is abnormal.

[0089] At the same time, the monitoring terminal module 70 has a built-in data storage module to record historical operating data, support export and analysis, and optimize system operating parameters through data analysis, thereby improving processing efficiency and reducing energy consumption.

[0090] See also Figure 6 , while combining Figure 2 The present application also provides a method for reducing emissions of a semiconductor temperature control module, which is performed by the semiconductor temperature control module emission reduction system described above, and includes the following steps:

[0091] During operation, the semiconductor temperature control module 10 adjusts the shutter opening of the shutter cover 12 on the temperature control module housing 11 to ensure that the TVOC released by the device can be mixed with the outside air and effectively extracted by the exhaust pipe 30, while avoiding excessive negative pressure inside the temperature control module 10.

[0092] The exhaust pipe 30 collects TVOC gas released by the temperature control module 10 through one or more exhaust ports 14 on the temperature control module housing 11 .

[0093] TVOC gas is fed into the waste gas treatment module 20 through the waste pipe 40 and removed through a decomposition or adsorption process. At the same time, the control module 60 monitors the TVOC concentration and system operating status in real time, and automatically adjusts parameters to ensure that TVOC is effectively treated and achieves standard emissions.

[0094] During operation of the emission reduction system, the processing parameters of TVOC are determined based on the data detected in real time by the TVOC concentration sensor 31, the gas flow meter 32 and the pressure sensor 33 of the emission reduction system.

[0095] The control module 60 controls and adjusts the operating power of the exhaust fan 50 according to the TVOC processing parameters to maintain the pressure in the temperature control module housing 11 at a relatively stable slightly negative pressure state to maintain the suction effect of TVOC and exhaust gas.

[0096] During operation, the control module 60 synchronously adjusts the operating parameters of the exhaust gas treatment device 21 in the exhaust gas treatment module 20 according to the TVOC processing parameters of the temperature control module 10 and the exhaust parameters of the exhaust gas after treatment by the exhaust gas treatment module 20, thereby realizing the coordinated and synchronous operation of the emission reduction system and the exhaust gas treatment module 20.

[0097] During the dynamic control process, the linkage relationship between the temperature control module 10 and the exhaust gas treatment module 20 is optimized in this application. The basis of the optimization is to ensure the stability of the gas volume treated by the exhaust gas treatment module 20.

[0098] Specifically, since the exhaust gas treatment module 20 can simultaneously process the TVOC of the temperature control module 10 and the semiconductor process exhaust gas, it is necessary to establish a mixed treatment model of the semiconductor process exhaust gas with high flow, high concentration and volatility characteristics and the TVOC of the temperature control module 10 with low flow, low concentration and volatility characteristics.

[0099] The mixed exhaust gas ratio equation is established through the dynamic coupling control of gas volume and pressure, specifically:

[0100] The waste gas treatment module 20 includes a flow sensor for treating gas, which monitors the total gas volume treated by the waste gas treatment module 20 in real time and calculates the process waste gas fluctuation coefficient α and the temperature-controlled exhaust efficiency β.

[0101] When the process waste gas volume increases suddenly, such as the waste gas volume fluctuates at a certain moment in the etching process, the control module adjusts the fan power in advance through the feedforward control algorithm to achieve a stable total volume of the mixed waste gas and maintain the operating stability of the waste gas treatment module 20.

[0102] Q 总 =Q 工艺 × (1 + α) + Q 温控 ×β

[0103] Among them, Q 总 is the total gas volume processed by the exhaust gas treatment module 20, Q 工艺 is the volume of semiconductor process waste gas, Q 温控 is the TVOC gas volume of the temperature control module 10;

[0104] α is the process exhaust gas fluctuation coefficient, and β is the temperature control exhaust efficiency, both of which are fixed values ​​that can be determined.

[0105] The TVOC volume of the temperature control module 10 is determined by the window opening and the power of the exhaust fan 50. When the window opening is determined, the power parameters of the exhaust fan 50 can be dynamically adjusted to maintain the target flow rate using the following correlation formula:

[0106]

[0107] Where P is the power of the exhaust fan; k is the dimensionless comprehensive correction coefficient, K pipe is the pipe flow resistance coefficient; K window is the flow resistance coefficient of the blinds, which is negatively correlated with the opening degree, S e is the equivalent throttling area directly related to the shutter window opening, and ρ is the air density.

[0108] The relationship between the total flow of the temperature control module 10, the window opening and the fan power is:

[0109]

[0110] The comprehensive resistance coefficient is defined as:

[0111]

[0112] Equivalent throttling area mapping is the core of gas volume-pressure dynamic coupling control. Its essence is to simplify the flow characteristics of complex piping systems into equivalent throttling area S through fluid dynamics models. e The mathematical expression of is used to achieve precise control of the mixed exhaust gas volume.

[0113] The equivalent throttling area refers to the minimum effective flow area when the fluid passes through the throttling device. Its value is determined by the actual geometric cross-sectional area and the fluid contraction effect.

[0114] The relationship between the shutter window opening and the equivalent throttling area includes:

[0115] The shutter window opening (θ) directly affects the effective flow area S e For rectangular blinds, the equivalent area can be modeled as:

[0116] S e =n×L×θ×sinα

[0117] Where n is the number of blades; L is the blade length; θ is the opening angle of the shutter from 0° to 90°; α is the blade tilt angle, usually 15° to 45°.

[0118] Through the relationships at different angles established above, the control module can control and adjust the operating power of the exhaust fan based on the stability of the gas treatment volume processed by the exhaust gas treatment module and the window opening of the temperature control module, thereby achieving a stable and reliable control effect while taking into account the overall stability of the semiconductor process.

[0119] At the same time, the independent fan of the exhaust gas treatment module is eliminated, and the exhaust fan of the temperature control module is directly used as the air source. The exhaust fan speed is adjusted in real time (with an accuracy of ±0.5Hz) through the control module, and the TVOC ratio (5% to 15%) and oxygen content (18% to 22%) in the mixed exhaust gas are synchronously controlled.

[0120] Dynamic air volume distribution: When the process exhaust gas volume decreases, such as the exhaust gas volume fluctuation at a certain moment in the semiconductor manufacturing process, the exhaust volume of the temperature control module is automatically increased to 120% of the design value to ensure that there is no local accumulation of TVOC.

[0121] The semiconductor temperature control module emission reduction system and method in the present invention, through the mutual combination of the temperature control module 10 and the exhaust gas treatment module 20, is optimized and designed based on the TVOC emission characteristics of the temperature control module 10 equipment. While the exhaust gas treatment module 20 treats the exhaust gas from the semiconductor process, it also solves the problem of TVOC exceeding the standard of the temperature control module 10 equipment, thereby meeting environmental protection requirements.

[0122] The louver sealing structure and the magnetic suction and exhaust port of the temperature control module housing 11 are simple in structure and easy to use and maintain.

[0123] The control module 60 realizes automation and efficiency of TVOC emission reduction, improves efficiency and effectively reduces TVOC processing costs.

[0124] The exhaust ducts of the exhaust gas treatment module and the temperature control module are designed as a modular quick-disassembly structure, which supports on-site expansion or maintenance within 1 hour.

[0125] When the waste gas treatment equipment fails, the TVOC of the temperature control device and the semiconductor process waste gas will be automatically switched to the emergency channel to ensure that the TVOC removal rate is ≥99%.

[0126] It should be noted that, unless there is any conflict, the features in the embodiments of this application can be combined with each other.

[0127] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A TVOC emission reduction system for semiconductor temperature control modules, used for TVOC emission reduction of temperature control modules, characterized in that: The temperature control module is connected to an exhaust pipe, the exhaust pipe is connected to an exhaust fan, and the exhaust fan is connected to the exhaust gas treatment module through an exhaust pipe, and is used to discharge TVOC from the temperature control module to the exhaust gas treatment module for treatment; The extraction and exhaust pipeline and / or the waste discharge pipeline are provided with a TVOC concentration sensor, a gas flow meter, a pressure sensor and a flow regulating valve, and are electrically connected to the control module of the emission reduction system respectively; The exhaust fan is electrically connected to the control module; The temperature control module includes a temperature control module housing, and a shutter cover is provided on the temperature control module housing. The shutter cover is detachably connected to the temperature control module housing, and the shutter opening of the shutter cover is adjustable through an adjustment hole; The louver covering plates include two groups distributed upper and lower, each group of louver covering plates includes a horizontal louver covering plate located at the upper part, and a pair of vertical louver covering plates located at the lower part, wherein the vertical louver covering plates are arranged at the lateral ends of the horizontal louver covering plates; The horizontal shutter cover plate has windows at both ends thereof, and the vertical shutter cover plate is arranged just below the window openings of the horizontal shutter cover plate; The window opening area of ​​the vertical shutter cover plate is larger than the window opening area of ​​the horizontal shutter cover plate.

2. The TVOC emission reduction system for semiconductor temperature control modules according to claim 1, characterized in that: The temperature control module housing is provided with a plurality of exhaust ports, the exhaust pipe is connected to at least one of the exhaust ports, and the exhaust ports not connected to the pipe are blocked; The shutter sealing plate and the exhaust port are arranged on both sides of the temperature control module housing opposite to each other.

3. The TVOC emission reduction system for semiconductor temperature control modules according to claim 2, characterized in that: The exhaust port is a flange pipe port arranged on the temperature control module housing, including a first exhaust port and a second exhaust port respectively arranged on the top and bottom sides of the temperature control module housing. The exhaust pipe is connected to the flange of the first exhaust port, and the second exhaust port is sealed by a blind plate. The blind plate includes a permanent magnet blind plate detachably connected to the second exhaust port, and a sealing ring is lined on the sealing surface of the permanent magnet blind plate.

4. The TVOC emission reduction system for semiconductor temperature control modules according to claim 1, characterized in that: The extraction and drainage pipe and the waste discharge pipe both include stainless steel pipes, or the inner side walls of the extraction and drainage pipe and the waste discharge pipe are lined with a corrosion-resistant coating.

5. The TVOC emission reduction system for semiconductor temperature control modules according to claim 1, characterized in that: The exhaust gas treatment module includes a burner or a plasma generator for treating exhaust gas, and the burner or the plasma generator is electrically connected to the control module.

6. The TVOC emission reduction system for semiconductor temperature control modules according to claim 1, characterized in that: It also includes a monitoring terminal module, and the control module is electrically connected to the monitoring terminal module.

7. A method for reducing TVOC emissions from a semiconductor temperature control module, performed by the semiconductor temperature control module TVOC emission reduction system according to any one of claims 1 to 6, characterized in that: The following steps are involved: Determine TVOC treatment parameters based on real-time data detected by the TVOC concentration sensor, gas flow meter, and pressure sensor of the emission reduction system; The control module controls and adjusts the operating power of the exhaust fan according to the TVOC processing parameters; During operation, the control module synchronously adjusts the operating parameters of the exhaust gas treatment device in the exhaust gas treatment module according to the TVOC treatment parameters of the temperature control module and the exhaust parameters of the exhaust gas after treatment by the exhaust gas treatment module; The control module adjusts the operating power of the exhaust fan based on the stability of the gas processing volume of the exhaust gas treatment module and the window opening control of the temperature control module.

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