Double-layer mixed fluid domain microchannel radiator with single-side turbulence structure and heat dissipation method

Abstract

The present invention belongs to the technical field of microchannel enhanced heat dissipation, and discloses a double-layer mixed fluid domain microchannel radiator with a single-side turbulence structure and a heat dissipation method; wherein, the double-layer mixed fluid domain microchannel radiator with a single-side turbulence structure includes a heat sink base, a heat sink middle part and a heat sink top part, the heat sink base and the heat sink middle part are connected by a plurality of first baffles, a plurality of lower-layer microchannels are formed between two adjacent first baffles, the heat sink middle part and the heat sink top part are connected by a plurality of second baffles, a plurality of upper-layer microchannels are formed between two adjacent second baffles, a plurality of top outlets are longitudinally opened in the middle part of the heat sink top part, a diverging and merging area is formed between the top outlet and the heat sink base, one end of the lower-layer microchannel is a lower-layer outlet, a lower-layer outlet area is formed between the lower-layer outlet and the diverging and merging area, and a turbulence structure is installed in the lower-layer outlet area; the present invention can effectively increase the heat transfer area, reduce the heat transfer thermal resistance, and thus improve the heat exchange efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of microchannel enhanced heat dissipation, and in particular to a double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure and a heat dissipation method. Background Art

[0002] High power, high performance, and high integration have become the development trend of modern electronic devices and equipment, but they also bring severe challenges to thermal management. In the future, the heat flux density of high-performance computing systems and power chips will reach 1000 W / cm 2 (W / cm 2 ), the heat flux density of local hot spots can even reach tens of kilowatts / cm 2 , which far exceeds the traditional thermal management technology of 100 watts / cm 2 In order to meet the cooling limit and take into account the difficulties in the development of electronic chip manufacturing process, the research and development of three-dimensional stacked chips has become more and more extensive in recent years.

[0003] 3D stacking technology typically uses TSV (Through Silicon Via) technology to vertically integrate components such as the RF front-end, signal processing, storage, sensing, actuation, and energy source, further enhancing functionality and increasing heat flux volume density. However, at high operating temperatures, failures caused by various minor physical defects within the chip are more likely to manifest. High temperatures increase the resistance of internal chip wires and delays, thereby reducing CPU (Central Processing Unit) efficiency. Furthermore, as chip temperature rises, leakage current increases and operating voltage decreases, leading to reduced reliability and even failure. Statistics show that excessive temperature accounts for more than half of the factors that cause electronic device failure and shortened lifespan. According to Arrhenius's law, for every 10°C increase in temperature, the rate of chemical reactions doubles, and the corresponding rate of electronic device failure also doubles.

[0004] With the development of high integration of electronic devices and equipment, the heat flux density continues to increase. If the heat dissipation rate of thermal management technology is lower than the heat generation rate of electronic devices, the temperature of electronic devices and equipment will continue to rise, which will not only greatly reduce the reliability, but also lead to failure or even damage of electronic devices and equipment. This is especially true for high-power, high-performance electronic chips, whose heat flux density can reach 100 to 1000 watts / cm 2 For electronic devices and equipment with low heat flux density, cooling effect can be achieved through natural convection or forced convection of fluid. However, for heat flux density greater than 100 W / cm 2For electronic devices and equipment, it is difficult to achieve the purpose of heat dissipation by using traditional air natural convection or forced convection. It is necessary to use a heat transfer coefficient of not less than 10000 / (m 2 ·K) high-efficiency heat transfer technology. It can be seen that in recent years, in the development of thermal management technology for electronic devices and equipment, uneven convective heat transfer performance and low efficiency have become prominent problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a double-layer mixed fluid domain microchannel radiator with a single-sided spoiler structure and a heat dissipation method to overcome the problems existing in the prior art. The present invention can effectively increase the heat transfer area, optimize fluid flow, and reduce heat transfer thermal resistance through the single-sided spoiler structure, thereby improving the heat exchange efficiency of the heat exchanger.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] In a first aspect, the present invention provides a double-layer mixed fluid domain microchannel heat sink with a single-sided turbulence structure, comprising a heat sink base, a heat sink middle portion, and a heat sink top portion. The heat sink base and the heat sink middle portion are connected by a plurality of first baffles, and a plurality of lower microchannels are formed between two adjacent first baffles. The heat sink middle portion and the heat sink top portion are connected by a plurality of second baffles, and a plurality of upper microchannels are formed between two adjacent second baffles. The middle portion of the heat sink top portion is longitudinally provided with a plurality of top outlets, and the middle portion of the heat sink middle portion is longitudinally provided with a plurality of diversion ports, and a diversion and confluence region is formed between the top outlets and the heat sink base.

[0008] One end of the upper microchannel is an upper outlet, and the other end is an upper inlet. An upper outlet area is formed between the upper outlet and the diverging and merging area, and an upper inlet area is formed between the upper inlet and the diverging and merging area.

[0009] One end of the lower microchannel is a lower inlet, and the other end is a lower outlet. The lower inlet is located at the bottom of the upper outlet, and the lower outlet is located at the bottom of the upper inlet. A lower inlet area is formed between the lower inlet and the flow diverging and merging area, and a lower outlet area is formed between the lower outlet and the flow diverging and merging area. A turbulent flow structure is installed in the lower outlet area, and a turbulent flow area is formed between the turbulent flow structure and the middle part of the heat sink.

[0010] Furthermore, the spoiler structure is arranged in parallel with the heat sink base;

[0011] Furthermore, the size of the spoiler structure is (2-8) mm × 0.2 mm × 0.2 mm;

[0012] Furthermore, the sizes of the plurality of lower-layer microchannels are equal;

[0013] Furthermore, the sizes of the plurality of upper microchannels are equal;

[0014] Furthermore, the top outlet and the diversion port are symmetrically arranged.

[0015] In a second aspect, the present invention further provides a double-layer mixed fluid domain microchannel heat dissipation method with a single-sided spoiler structure, based on the above-mentioned double-layer mixed fluid domain microchannel heat sink with a single-sided spoiler structure, comprising the following steps:

[0016] The coolant flows into the upper microchannel and the lower microchannel from the upper inlet and the lower inlet simultaneously in opposite directions;

[0017] The coolants entering the upper microchannel and the lower microchannel merge and then diverge;

[0018] The divided coolant flows out through the top outlet, the upper outlet and the lower outlet respectively, wherein the coolant flowing out through the lower outlet passes through the turbulent zone;

[0019] Furthermore, the coolant flows from the upper inlet and the lower inlet into the upper microchannel and the lower microchannel in opposite directions at the same time, specifically including:

[0020] The coolant flows from the upper inlet and the lower inlet into the upper inlet area and the lower inlet area of ​​the upper microchannel and the lower microchannel in opposite directions at the same time;

[0021] Furthermore, the coolants entering the upper microchannel and the lower microchannel are merged and then split, specifically including:

[0022] The coolant entering the upper inlet area and the coolant entering the lower inlet area are merged in the diverging and merging area and then split into three coolant streams;

[0023] Furthermore, the split coolant flows out through the top outlet, the upper layer outlet and the lower layer outlet respectively, wherein the coolant flowing out through the lower layer outlet passes through the turbulent flow structure, specifically including:

[0024] The first coolant after diversion flows out through the top outlet, the second coolant enters the upper outlet area and flows out through the upper outlet, and the third coolant enters the lower outlet area, passes through the turbulent area, and flows out from the lower outlet.

[0025] The above technical solution has the following advantages or beneficial effects:

[0026] Firstly, the present invention provides a double-layer mixed fluid domain microchannel radiator with a single-sided turbulence structure. By installing a turbulence structure on one side of the lower microchannel, the flow direction of the coolant in the lower microchannel can be changed, the turbulence effect can be enhanced, the convective heat transfer capacity can be greatly improved, and the defect of insufficient coolant temperature difference in the lower outlet area, that is, the second half of the radiator, can be effectively compensated; secondly, the coolant can be gathered and diverted through the diversion and confluence area, and a stronger temperature gradient distribution can be formed due to the flow resistance, and the heat transfer performance can be significantly improved through the destruction of the local thermal boundary layer and the flow mixing effect; thirdly, the coolant can be diverted into three coolants after merging in the diversion and confluence area, and flow to three outlets respectively (the first coolant flows out through the top outlet, the second coolant flows out through the upper outlet, and the third coolant flows out through the lower outlet), optimizing the flow distribution, and being suitable for heat dissipation scenarios with high heat flux density.

[0027] Furthermore, a regular spoiler area is formed between the parallel spoiler structures and the heat sink base, which can further reduce the resistance of the fluid flow compared to the staggered spoiler structures, thereby reducing the pressure loss of the fluid, helping to improve the flow efficiency of the fluid and reduce energy consumption.

[0028] Furthermore, by setting the specific size of the turbulent structure, it is ensured that the fluid has a sufficient flow path in the lower microchannel, and the increase in coolant resistance caused by an overly long structure is avoided, which helps the coolant to form a stable flow state and improve the flow efficiency of the coolant.

[0029] Furthermore, by setting the sizes of several lower-layer microchannels to be equal, the flow of the coolant in the lower-layer microchannels is more balanced, the deviation or vortex phenomenon during the flow of the coolant is reduced, the flow stability of the coolant is improved, and the heat dissipation effect is enhanced.

[0030] Furthermore, by setting the sizes of several upper microchannels to be equal, the flow resistance and heat transfer characteristics of the coolant can be kept consistent when passing through, which helps to achieve more uniform heat distribution and more efficient heat transfer, thereby improving the overall heat dissipation efficiency of the radiator.

[0031] Furthermore, the symmetrical arrangement of the top outlet and the diversion port helps to avoid deflection or accumulation of the coolant in the flow channel, so that the coolant can fully utilize the heat dissipation area and improve the heat dissipation efficiency.

[0032] In the second aspect, the present invention provides a double-layer mixed fluid domain microchannel heat dissipation method with a single-sided turbulence structure, in which the coolant flows into the upper microchannel and the lower microchannel simultaneously from the upper inlet and the lower inlet, and then flows to the top outlet, the upper outlet and the lower outlet respectively after merging. Among them, the coolant flowing out through the lower outlet also passes through the turbulence zone, further enhancing the mixing effect of the coolant, while destroying the thermal boundary layer, significantly improving the overall heat exchange effect of the microchannel radiator.

[0033] Furthermore, by the coolant flowing from the upper inlet and the lower inlet simultaneously into the upper inlet area and the lower inlet area of ​​the upper microchannel and the lower microchannel in opposite directions, the uniform distribution of the coolant is ensured and the heat dissipation efficiency is improved.

[0034] Furthermore, by guiding the coolant into three streams, a corner is formed between the divergence and confluence area and the middle of the heat sink, causing part of the coolant to flow in a vortex direction, thereby interfering with the coolant flow characteristics and promoting the efficiency of convective heat transfer.

[0035] Furthermore, by passing through the spoiler structure in the lower outlet area, the high-temperature area at the corner of the spoiler structure is further reduced, the temperature uniformity of the coolant is improved, and the cross-sectional size of the channel from the spoiler structure to the lower outlet is suddenly reduced, so that the flow rate of the coolant rises rapidly in a short period of time. The surge in flow rate greatly improves the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a structural schematic diagram of a double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure according to the present invention;

[0037] Figure 2 This is a schematic diagram of the coolant flow direction of Example 1 of the present invention;

[0038] Figure 3 The temperature cloud diagram of the microchannel along the y-axis section of Example 1 of the present invention;

[0039] Figure 4 This is a heat sink base temperature simulation cloud map of Example 1 of the present invention;

[0040] Figure 5 Schematic diagram of coolant flow in Example 2 of the present invention;

[0041] Figure 6 This is a temperature simulation cloud map of the three-dimensional model of Example 2 of the present invention;

[0042] Figure 7 The temperature cloud diagram of the microchannel along the y-axis section of Example 2 of the present invention;

[0043] Figure 8 This is a heat sink base temperature simulation cloud map of Example 2 of the present invention;

[0044] Figure 9 This is a schematic diagram of the coolant flow direction of Example 3 of the present invention;

[0045] Figure 10 The temperature cloud diagram of the microchannel along the y-axis section of Example 3 of the present invention;

[0046] Figure 11 This is a heat sink base temperature simulation cloud map of Example 3 of the present invention;

[0047] Figure 12 This is a schematic diagram of the coolant flow direction of Example 4 of the present invention;

[0048] Figure 13 The temperature cloud diagram of the microchannel along the y-axis section of Example 4 of the present invention;

[0049] Figure 14 This is a heat sink base temperature simulation cloud map of Example 4 of the present invention;

[0050] Figure 15 Schematic diagram of the test system of the present invention;

[0051] In the figure, 1-upper layer inlet; 2-lower layer inlet; 3-upper layer outlet; 4-top outlet; 5-lower layer outlet; 6-disturbance area; 7-heat sink base; 8-heat sink top; 9-divergence and confluence area; 10-middle part of heat sink; 11-upper layer inlet area; 21-lower layer inlet area; 31-upper layer outlet area; 51-lower layer outlet area; 61-disturbance structure; 71-first baffle; 81-second baffle; 91-divergence outlet. DETAILED DESCRIPTION

[0052] The present invention will be further described in detail below with reference to specific embodiments, which are intended to explain the present invention rather than to limit it.

[0053] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0054] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0055] Example 1:

[0056] See also Figure 1 and Figure 2 The present invention provides a double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising a heat sink top 8, a top outlet 4, a heat sink middle 10, a diversion port 91, a heat sink base 7, a first baffle 71, a second baffle 81, an upper layer inlet 1, a lower layer inlet 2, an upper layer outlet 3, a lower layer outlet 5, and a spoiler structure 61;

[0057] The heat sink base 7 and the heat sink middle part 10 are connected by a number of first baffles 71, and a number of lower microchannels are formed between two adjacent first baffles 71, and the sizes of the several lower microchannels are equal; the heat sink middle part 10 and the heat sink top 8 are connected by a number of second baffles 81, and a number of upper microchannels are formed between two adjacent second baffles 81, and the sizes of the several upper microchannels are equal; a number of top outlets 4 are longitudinally opened in the middle of the heat sink top 8, and a number of diversion ports 91 are longitudinally opened in the middle of the heat sink middle part 10, and the top outlet 4 and the diversion port 91 are symmetrically arranged, and a diversion and confluence area 9 is formed between the top outlet 4 and the heat sink base 7. The diversion and confluence area 9 is located at the point where the upper microchannel and the lower microchannel pass through. The outlet 91 is used for gathering and diverting; one end of the upper microchannel is the upper outlet 3, and the other end is the upper inlet 1. The upper outlet area 31 is formed between the upper outlet 3 and the diversion and confluence area 9, and the upper inlet area 11 is formed between the upper inlet 1 and the diversion and confluence area 9; one end of the lower microchannel is the lower inlet 2, and the other end is the lower outlet 5. The lower inlet 2 is located at the bottom of the upper outlet 3, and the lower outlet 5 is located at the bottom of the upper inlet 1. The lower inlet area 21 is formed between the lower inlet 2 and the diversion and confluence area 9, and the lower outlet area 51 is formed between the lower outlet 5 and the diversion and confluence area 9; the spoiler structure 61 is installed in the lower outlet area 51, the spoiler structure 61 is arranged parallel to the heat sink base 7, and a spoiler area 6 is formed between the spoiler structure 61 and the middle part 10 of the heat sink;

[0058] Preferably, with z=15.225 mm as the center point, the geometric dimensions of the spoiler structure 61 are 2 mm×0.2 mm×0.2 mm, and the shortest distance between the spoiler structure 61 and the lower layer outlet 5 is 3.775 mm, so as to compensate for the defect of insufficient coolant temperature difference in the lower layer outlet area 51;

[0059] Preferably, the number of upper microchannels and lower microchannels is 20 to 30, preferably 25 in this embodiment, and the upper microchannels and lower microchannels are symmetrically arranged to form a 20 mm × 20 mm × 2.4 mm double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure;

[0060] Preferably, the length of the upper inlet 1 and the lower inlet 2 is 0.9 mm, and the width is 0.4 mm.

[0061] See also Figure 2 The present invention also provides a double-layer mixed fluid domain microchannel heat dissipation method with a single-side spoiler structure, based on the above-mentioned double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising the following steps:

[0062] The coolant flows from the upper inlet 1 and the lower inlet 2 into the upper inlet area 11 and the lower inlet area 21 of the upper microchannel and the lower microchannel of the radiator in opposite directions at the same time, and the coolant is redistributed in the diverging and merging area 9. Since a corner is formed between the diverging and merging area 9 and the middle part 10 of the heat sink, part of the coolant generates a vortex flow direction, which produces the first interference with the flow characteristics of the coolant. This interference is very beneficial to convective heat transfer; it is distributed into three fluids in the diverging and merging area 9, the first fluid flows out through the top outlet 4, the second fluid enters the upper outlet area 31, flows out through the upper outlet 3, and the third fluid enters the lower outlet area 51, encounters the turbulence structure 61, passes through the turbulence area 6, and flows out from the lower outlet 5.

[0063] See also Figure 3 and Figure 4 In order to verify the heat dissipation advantage of this configuration design, the temperature cloud diagrams of the single upper microchannel and lower microchannel along the y-axis section of this embodiment 1 and the simulated temperature cloud diagram of the heat sink base are displayed. The presence of the spoiler structure 61 will produce a continuous spoiler effect. The cross-sectional size of the channel from the spoiler structure 61 to the lower outlet 5 suddenly decreases, and the flow rate of the coolant will increase sharply in a short period of time. The higher flow rate can bring better heat exchange effect.

[0064] Example 2:

[0065] See also Figure 1 and Figure 5The present invention provides a double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising a heat sink top 8, a top outlet 4, a heat sink middle 10, a diversion port 91, a heat sink base 7, a first baffle 71, a second baffle 81, an upper layer inlet 1, a lower layer inlet 2, an upper layer outlet 3, a lower layer outlet 5, and a spoiler structure 61;

[0066] The heat sink base 7 and the heat sink middle part 10 are connected by a number of first baffles 71, and a number of lower microchannels are formed between two adjacent first baffles 71, and the sizes of the several lower microchannels are equal; the heat sink middle part 10 and the heat sink top 8 are connected by a number of second baffles 81, and a number of upper microchannels are formed between two adjacent second baffles 81, and the sizes of the several upper microchannels are equal; a number of top outlets 4 are longitudinally opened in the middle of the heat sink top 8, and a number of diversion ports 91 are longitudinally opened in the middle of the heat sink middle part 10, and the top outlet 4 and the diversion port 91 are symmetrically arranged, and a diversion and confluence area 9 is formed between the top outlet 4 and the heat sink base 7. The diversion and confluence area 9 is located at the point where the upper microchannel and the lower microchannel pass through. The outlet 91 is used for gathering and diverting; one end of the upper microchannel is the upper outlet 3, and the other end is the upper inlet 1. The upper outlet area 31 is formed between the upper outlet 3 and the diversion and confluence area 9, and the upper inlet area 11 is formed between the upper inlet 1 and the diversion and confluence area 9; one end of the lower microchannel is the lower inlet 2, and the other end is the lower outlet 5. The lower inlet 2 is located at the bottom of the upper outlet 3, and the lower outlet 5 is located at the bottom of the upper inlet 1. The lower inlet area 21 is formed between the lower inlet 2 and the diversion and confluence area 9, and the lower outlet area 51 is formed between the lower outlet 5 and the diversion and confluence area 9; the spoiler structure 61 is installed in the lower outlet area 51, the spoiler structure 61 is arranged parallel to the heat sink base 7, and a spoiler area 6 is formed between the spoiler structure 61 and the middle part 10 of the heat sink;

[0067] Preferably, with z=15.225 mm as the center point, the geometric dimensions of the spoiler structure 61 are 4 mm×0.2 mm×0.2 mm, and the shortest distance between the spoiler structure 61 and the lower layer outlet 5 is 2.775 mm, so as to compensate for the defect of insufficient coolant temperature difference in the lower layer outlet area 51;

[0068] Preferably, the number of upper microchannels and lower microchannels is 20 to 30, preferably 25 in this embodiment, and the upper microchannels and lower microchannels are symmetrically arranged to form a 20 mm × 20 mm × 2.4 mm double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure;

[0069] Preferably, the length of the upper inlet 1 and the lower inlet 2 is 0.9 mm, and the width is 0.4 mm.

[0070] See also Figure 5The present invention also provides a double-layer mixed fluid domain microchannel heat dissipation method with a single-side spoiler structure, based on the above-mentioned double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising the following steps:

[0071] The coolant flows from the upper inlet 1 and the lower inlet 2 into the upper inlet area 11 and the lower inlet area 21 of the upper microchannel and the lower microchannel of the radiator at the same time, and the coolant is redistributed in the diverging and merging area 9. Since a corner is formed between the diverging and merging area 9 and the middle part 10 of the heat sink, part of the coolant generates a vortex flow direction, which causes the first interference with the flow characteristics of the coolant. This interference is very beneficial to convective heat transfer and promotes the efficiency of convective heat transfer. In the diverging and merging area 9, the coolant is distributed into three streams. The first stream flows out through the top outlet 4, the second stream enters the upper outlet area 31, flows out through the upper outlet 3, and the third stream enters the lower outlet area 51, encounters the turbulence structure 61, passes through the turbulence area 6, and flows out from the lower outlet 5.

[0072] See also Figure 6 、 Figure 7 and Figure 8 To demonstrate the heat dissipation advantage of this configuration design, the three-dimensional model temperature simulation cloud map of Example 2, the temperature cloud map of a single upper microchannel and a lower microchannel along the y-axis section, and the heat sink base temperature simulation cloud map are displayed. The length of the spoiler structure 61 is increased to 4 mm, the high-temperature area at the corner of the spoiler structure 61 is further reduced, the temperature uniformity of the coolant fluid is improved, and the cross-sectional size of the channel from the spoiler structure 61 to the lower layer outlet 5 is suddenly reduced, so that the coolant flow rate increases rapidly in a short period of time. The surge in flow rate greatly improves the heat dissipation performance.

[0073] Example 3:

[0074] See also Figure 1 and Figure 9 The present invention provides a double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising a heat sink top 8, a top outlet 4, a heat sink middle 10, a diversion port 91, a heat sink base 7, a first baffle 71, a second baffle 81, an upper layer inlet 1, a lower layer inlet 2, an upper layer outlet 3, a lower layer outlet 5, and a spoiler structure 61;

[0075] The heat sink base 7 and the heat sink middle part 10 are connected by a number of first baffles 71, and a number of lower microchannels are formed between two adjacent first baffles 71, and the sizes of the several lower microchannels are equal; the heat sink middle part 10 and the heat sink top 8 are connected by a number of second baffles 81, and a number of upper microchannels are formed between two adjacent second baffles 81, and the sizes of the several upper microchannels are equal; a number of top outlets 4 are longitudinally opened in the middle of the heat sink top 8, and a number of diversion ports 91 are longitudinally opened in the middle of the heat sink middle part 10, and the top outlet 4 and the diversion port 91 are symmetrically arranged, and a diversion and confluence area 9 is formed between the top outlet 4 and the heat sink base 7. The diversion and confluence area 9 is located at the point where the upper microchannel and the lower microchannel pass through. The outlet 91 is used for gathering and diverting; one end of the upper microchannel is the upper outlet 3, and the other end is the upper inlet 1. The upper outlet area 31 is formed between the upper outlet 3 and the diversion and confluence area 9, and the upper inlet area 11 is formed between the upper inlet 1 and the diversion and confluence area 9; one end of the lower microchannel is the lower inlet 2, and the other end is the lower outlet 5. The lower inlet 2 is located at the bottom of the upper outlet 3, and the lower outlet 5 is located at the bottom of the upper inlet 1. The lower inlet area 21 is formed between the lower inlet 2 and the diversion and confluence area 9, and the lower outlet area 51 is formed between the lower outlet 5 and the diversion and confluence area 9; the spoiler structure 61 is installed in the lower outlet area 51, the spoiler structure 61 is arranged parallel to the heat sink base 7, and a spoiler area 6 is formed between the spoiler structure 61 and the middle part 10 of the heat sink;

[0076] Preferably, with z=15.225 mm as the center point, the geometric dimensions of the spoiler structure 61 are 6 mm×0.2 mm×0.2 mm, and the shortest distance between the spoiler structure 61 and the lower layer outlet 5 is 1.775 mm, so as to compensate for the defect of insufficient coolant temperature difference in the lower layer outlet area 51;

[0077] Preferably, the number of upper microchannels and lower microchannels is 20 to 30, preferably 25 in this embodiment, and the upper microchannels and lower microchannels are symmetrically arranged to form a 20 mm × 20 mm × 2.4 mm double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure;

[0078] Preferably, the length of the upper inlet 1 and the lower inlet 2 is 0.9 mm, and the width is 0.4 mm.

[0079] See also Figure 9 The present invention also provides a double-layer mixed fluid domain microchannel heat dissipation method with a single-side spoiler structure, based on the above-mentioned double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising the following steps:

[0080] The coolant flows from the upper inlet 1 and the lower inlet 2 into the upper inlet area 11 and the lower inlet area 21 of the upper microchannel and the lower microchannel of the radiator in opposite directions at the same time, and the coolant is redistributed in the diverging and merging area 9. Since a corner is formed between the diverging and merging area 9 and the middle part 10 of the heat sink, part of the coolant generates a vortex flow direction, which produces the first interference with the flow characteristics of the coolant. This interference is very beneficial to convective heat transfer; it is distributed into three fluids in the diverging and merging area 9, the first fluid flows out through the top outlet 4, the second fluid enters the upper outlet area 31, flows out through the upper outlet 3, and the third fluid enters the lower outlet area 51, encounters the turbulence structure 61, passes through the turbulence area 6, and flows out from the lower outlet 5.

[0081] See also Figure 10 and Figure 11 To demonstrate the heat dissipation advantage of this configuration design, the temperature cloud diagrams of a single upper microchannel and a lower microchannel along the y-axis section of Example 3, as well as the simulated temperature cloud diagram of the heat sink base, are displayed. The length of the spoiler structure 61 is increased to 6 mm, the high-temperature area at the corner of the spoiler structure 61 is further reduced, the temperature uniformity of the coolant fluid is improved, and the cross-sectional size of the channel from the spoiler structure 61 to the lower outlet 5 is suddenly reduced, thereby causing the coolant flow rate to increase sharply in a short period of time. The higher flow rate further improves the heat exchange efficiency.

[0082] Example 4:

[0083] See also Figure 1 and Figure 12 The present invention provides a double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising a heat sink top 8, a top outlet 4, a heat sink middle 10, a diversion port 91, a heat sink base 7, a first baffle 71, a second baffle 81, an upper layer inlet 1, a lower layer inlet 2, an upper layer outlet 3, a lower layer outlet 5, and a spoiler structure 61;

[0084] The heat sink base 7 and the heat sink middle part 10 are connected by a number of first baffles 71, and a number of lower microchannels are formed between two adjacent first baffles 71, and the sizes of the several lower microchannels are equal; the heat sink middle part 10 and the heat sink top 8 are connected by a number of second baffles 81, and a number of upper microchannels are formed between two adjacent second baffles 81, and the sizes of the several upper microchannels are equal; a number of top outlets 4 are longitudinally opened in the middle of the heat sink top 8, and a number of diversion ports 91 are longitudinally opened in the middle of the heat sink middle part 10, and the top outlet 4 and the diversion port 91 are symmetrically arranged, and a diversion and confluence area 9 is formed between the top outlet 4 and the heat sink base 7. The diversion and confluence area 9 is located at the point where the upper microchannel and the lower microchannel pass through. The outlet 91 is used for gathering and diverting; one end of the upper microchannel is the upper outlet 3, and the other end is the upper inlet 1. The upper outlet area 31 is formed between the upper outlet 3 and the diversion and confluence area 9, and the upper inlet area 11 is formed between the upper inlet 1 and the diversion and confluence area 9; one end of the lower microchannel is the lower inlet 2, and the other end is the lower outlet 5. The lower inlet 2 is located at the bottom of the upper outlet 3, and the lower outlet 5 is located at the bottom of the upper inlet 1. The lower inlet area 21 is formed between the lower inlet 2 and the diversion and confluence area 9, and the lower outlet area 51 is formed between the lower outlet 5 and the diversion and confluence area 9; the spoiler structure 61 is installed in the lower outlet area 51, the spoiler structure 61 is arranged parallel to the heat sink base 7, and a spoiler area 6 is formed between the spoiler structure 61 and the middle part 10 of the heat sink;

[0085] Preferably, with z=15.225 mm as the center point, the geometric dimensions of the spoiler structure 61 are 8 mm×0.2 mm×0.2 mm, and the shortest distance between the spoiler structure 61 and the lower layer outlet 5 is 0.775 mm, so as to compensate for the defect of insufficient coolant temperature difference in the lower layer outlet area 51;

[0086] Preferably, the number of upper microchannels and lower microchannels is 20 to 30, preferably 25 in this embodiment, and the upper microchannels and lower microchannels are symmetrically arranged to form a 20 mm × 20 mm × 2.4 mm double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure;

[0087] Preferably, the length of the upper inlet 1 and the lower inlet 2 is 0.9 mm, and the width is 0.4 mm.

[0088] See also Figure 12 The present invention also provides a double-layer mixed fluid domain microchannel heat dissipation method with a single-side spoiler structure, based on the above-mentioned double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure, comprising the following steps:

[0089] The coolant flows from the upper inlet 1 and the lower inlet 2 into the upper inlet area 11 and the lower inlet area 21 of the upper microchannel and the lower microchannel of the radiator in opposite directions at the same time, and the coolant is redistributed in the diverging and merging area 9. Since a corner is formed between the diverging and merging area 9 and the middle part 10 of the heat sink, part of the coolant generates a vortex flow direction, which produces the first interference with the flow characteristics of the coolant. This interference is very beneficial to convective heat transfer; it is distributed into three fluids in the diverging and merging area 9, the first fluid flows out through the top outlet 4, the second fluid enters the upper outlet area 31, flows out through the upper outlet 3, and the third fluid enters the lower outlet area 51, encounters the turbulence structure 61, passes through the turbulence area 6, and flows out from the lower outlet 5.

[0090] See also Figure 13 and Figure 14 To demonstrate the heat dissipation advantage of this configuration design, the temperature cloud maps of a single upper microchannel and a lower microchannel along the y-axis section of Example 4, as well as the simulated temperature cloud map of the heat sink base, are displayed. The length of the spoiler structure 61 is increased to 8 mm, which increases the high-temperature area at the corner of the spoiler structure 61, which is not as conducive to the uniform distribution of the coolant temperature as in Examples 1-3. However, the cross-sectional dimension of the channel from the spoiler structure 61 to the lower outlet 5 is suddenly reduced, causing the coolant flow rate to increase sharply in a short period of time, which also improves the heat exchange efficiency to a certain extent.

[0091] In order to evaluate the heat dissipation effect of the double-layer mixed fluid domain microchannel radiator with a single-side turbulence structure provided by the present invention, the convection heat transfer coefficient is used. h , Reynolds number , Nusselt number Nu , thermal resistance R and comprehensive enhanced heat transfer coefficient PEC To evaluate, the specific formula includes:

[0092]

[0093]

[0094]

[0095]

[0096] PEC=(Nu / Nu 0 ) / (Δp / Δp 0 ) 1 / 3

[0097] Where, h It represents the convection heat transfer coefficient, which reflects the heat transfer capacity between the fluid and the solid surface. The larger the convection heat transfer coefficient, the better the heat transfer effect and the faster the heat transfer rate. QIndicates total power; n Indicates the number of transfer surfaces; A w represents the simulated surface area of ​​each microchannel; represents the average temperature; represents the inlet Reynolds number; represents the density of the upper microchannel; represents the hydraulic diameter; Indicates the dynamic viscosity of the coolant; Nu Represents the Nusselt number, which is used to quantify the intensity of heat transfer between the fluid and the solid surface. The larger the Nusselt number, the higher the heat transfer per unit area, that is, the stronger the convective heat transfer; Nu 0 represents the initial Nusselt number; Thermal coefficient expressing temperature change; R It represents thermal resistance, which reflects the resistance of a material to heat conduction. The smaller the value, the stronger the thermal conductivity. Indicates the maximum temperature; represents the inlet temperature; PEC It represents the comprehensive enhanced heat transfer coefficient, which can directly reflect the overall cooling efficiency of the model. If the value of the comprehensive enhanced heat transfer coefficient is greater than 1, it is considered to have a certain cooling effect. The larger the value, the higher the cooling efficiency. Δp Indicates the pressure loss at the inlet; Δp 0 represents the initial pressure loss at the inlet.

[0098] In order to obtain the data required for simulation, after completing the modeling, finite element analysis software was used to perform finite element analysis on the traditional straight double-layer microchannel and Examples 2 to 4, and numerical solutions were obtained. ICEM CFD (The Integrated Computer Engineering and Manufacturing code for Computational Fluid Dynamics, computational fluid dynamics pre-processing software) was used for meshing. In order to verify the independence of the mesh, four sizes (i.e., 40 50 300, 40 100 300, 60 100 300, 60 100 400) mesh was used for finite element analysis and verification. The results showed that except for the mesh size of 40 50 The errors of temperature and pressure drop after simulation of the grid with 300 mesh and other mesh sizes are all within 1%, which means that the mesh size has little effect on the simulation results and can be ignored, thus verifying the independence of the mesh. Then, FLUENT 2022 R1 (fluid dynamics simulation software 2022 R1 version) was used to solve the problem, selecting the turbulence model, setting the number of iterations, convergence criteria, etc., to verify the superiority of the heat dissipation performance of the present invention. The final results are shown as follows Figure 3 、 Figure 4 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 10 、 Figure 11 、 Figure 13 and Figure 14 The detailed comparison data is shown in the following table:

[0099] Table 1 Finite element analysis table

[0100]

[0101] The experimental equipment is as follows: a thermal circulation water bath, a Masterflex digital pump, and connecting pipes provide circulating cooling for a double-layer mixed fluid domain microchannel heat sink with a single-sided perturbation structure. The coolant temperature at the water bath outlet is 293.15 K. The upper and lower inlets are controlled by Masterflex digital pumps with a flow rate of 0.05-3400 mL / min. The Masterflex digital pumps not only have the advantages of high resolution and good sealing, but also have good repeatability and stability. The coolant temperature at the thermal circulation water bath inlet is controlled by a thermostat. An electric micro-ceramic heat source chip is integrated into the STG-500 (single-phase stepless adjustable power supply voltage transformer) adjustable power supply. In the study, the electric micro-ceramic heat source chip is used to heat a 3D (three-dimensional) printer test model. It is not only highly efficient but also has strong thermal conductivity and can quickly perform thermal compensation. The thermal resistance of the electric micro-ceramic heat source chip is 100 Ω. American Arctic Silver thermal conductive adhesive is used to coat the flat surface of the microchannel heat sink. The effective thermal conductivity coefficient is approximately 7.5 W×m -1 ·K -1 .

[0102] See also Figure 15, is a schematic diagram of the test system. The coolant temperature, flow rate and pressure drop of the upper inlet 1, lower inlet 2, top outlet 4, upper outlet 3 and lower outlet 5 are measured by Omega's thermal sensors; the pressure of the upper inlet 1, lower inlet 2, top outlet 4, upper outlet 3 and lower outlet 5 are measured by a digital pressure gauge, and the real-time pressure drop is observed; the measurement data can be collected and converted by a data logger, and then transmitted to a computer for further processing.

[0103] The present invention provides a double-layer mixed fluid domain microchannel radiator with a single-sided spoiler structure and a heat dissipation method suitable for high heat flux density and high-power electronic devices. The double-layer mixed fluid domain microchannel radiator with a single-sided spoiler structure has high overall heat exchange characteristics and can control the pressure drop within a certain range. It is of great significance for promoting the performance improvement and sustainable development of electronic equipment and systems.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure, characterized in that: The heat sink comprises a heat sink base (7), a heat sink middle portion (10) and a heat sink top portion (8); the heat sink base (7) and the heat sink middle portion (10) are connected via a plurality of first baffles (71), and a plurality of lower microchannels are formed between two adjacent first baffles (71); the heat sink middle portion (10) and the heat sink top portion (8) are connected via a plurality of second baffles (81), and a plurality of upper microchannels are formed between two adjacent second baffles (81); a plurality of top outlets (4) are longitudinally opened in the middle portion of the heat sink top portion (8), a plurality of diversion ports (91) are longitudinally opened in the middle portion of the heat sink middle portion (10), and a diversion and confluence region (9) is formed between the top outlet (4) and the heat sink base (7); One end of the upper microchannel is an upper outlet (3), and the other end is an upper inlet (1); an upper outlet region (31) is formed between the upper outlet (3) and the diverging and merging region (9); and an upper inlet region (11) is formed between the upper inlet (1) and the diverging and merging region (9); One end of the lower microchannel is a lower inlet (2), and the other end is a lower outlet (5). The lower inlet (2) is located at the bottom of the upper outlet (3), and the lower outlet (5) is located at the bottom of the upper inlet (1). A lower inlet area (21) is formed between the lower inlet (2) and the flow diverging and merging area (9), and a lower outlet area (51) is formed between the lower outlet (5) and the flow diverging and merging area (9). The lower outlet area (51) is provided with a flow disturbance structure (61). A flow disturbance area (6) is formed between the flow disturbance structure (61) and the middle part (10) of the heat sink. The flow disturbance structure (61) is arranged parallel to the heat sink base (7), and the size of the flow disturbance structure (61) is (2-8) mm×0.2 mm×0.2 mm.

2. The double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure according to claim 1, characterized in that: The sizes of the plurality of lower-layer microchannels are equal.

3. The double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure according to claim 1, characterized in that: The sizes of the plurality of upper microchannels are equal.

4. The double-layer mixed fluid domain microchannel radiator with a single-side spoiler structure according to claim 1, characterized in that: The top outlet (4) and the diversion port (91) are symmetrically arranged.

5. A double-layer mixed fluid domain microchannel heat dissipation method with a single-side spoiler structure, based on the double-layer mixed fluid domain microchannel heat sink with a single-side spoiler structure according to any one of claims 1 to 4, characterized in that: The following steps are involved: The coolant flows into the upper microchannel and the lower microchannel from the upper inlet (1) and the lower inlet (2) simultaneously in opposite directions; The coolants entering the upper microchannel and the lower microchannel merge and then diverge; The divided coolant flows out through the top outlet (4), the upper outlet (3) and the lower outlet (5) respectively, wherein the coolant flowing out through the lower outlet (5) passes through the turbulent zone (6).

6. The heat dissipation method for a double-layer mixed fluid domain microchannel with a single-side spoiler structure according to claim 5, characterized in that: The coolant flows from the upper inlet (1) and the lower inlet (2) into the upper microchannel and the lower microchannel simultaneously in opposite directions, specifically including: The coolant flows from the upper inlet (1) and the lower inlet (2) simultaneously into the upper inlet area (11) and the lower inlet area (21) of the upper microchannel and the lower microchannel in opposite directions.

7. The heat dissipation method for a double-layer mixed fluid domain microchannel with a single-side spoiler structure according to claim 6, characterized in that: The coolants entering the upper microchannel and the lower microchannel are merged and then divided, specifically including: The coolant entering the upper inlet area (11) and the coolant entering the lower inlet area (21) are merged in the diversion and merging area (9) and then diverted into three streams of coolant.

8. The double-layer mixed fluid domain microchannel heat dissipation method with a single-side spoiler structure according to claim 7, characterized in that: The split coolant flows out through the top outlet (4), the upper outlet (3) and the lower outlet (5) respectively, wherein the coolant flowing out through the lower outlet (5) passes through the turbulent structure (61), which specifically includes: The first coolant after diversion flows out through the top outlet (4), the second coolant enters the upper outlet area (31) and flows out through the upper outlet (3), and the third coolant enters the lower outlet area (51), passes through the turbulent area (6), and flows out from the lower outlet (5).

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