Circuit board design method and circuit board

Abstract

The invention relates to the technical field of circuit boards, and provides a circuit board design method and a circuit board, the circuit board comprises a first element and a plurality of second elements, each second element is connected to the first element through a corresponding signal line so as to receive a control signal sent by the first element through the signal line, the method comprises the following steps: determining an affected temperature rise upper limit value of a first element and a continuous working time upper limit value of a second element; obtaining the heating power of each second element and the heat transfer parameter of the circuit board; determining the minimum distance between the second element and the first element in the circuit board according to the affected temperature rise upper limit value of the first element, the continuous working time upper limit value of the second element, the heating power of the second element and the heat transfer parameter of the circuit board; and arranging the first element and the plurality of second elements according to the minimum distance between the second elements and the first element. According to the invention, the distance between the control element and the controlled element in the circuit board can be reasonably determined.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and particularly to a circuit board design method and a circuit board. Background Art

[0002] In the design of a PCB (Printed Circuit Board), the layout of the positions of each component is crucial for performance and quality parameters of the circuit board such as its size and stability, as well as the rationality of the wiring.

[0003] For the chips and controlled components in a circuit board, if the components controlled by the chip generate heat during operation, the heat will be radiated to the chip nearby. In particular, the controlled components with a large amount of heat generation will cause a significant decline or even damage to the chip performance. Currently, the chips and controlled components in the circuit board either result in a relatively large volume of the circuit board due to excessive distance and lack of compactness, or cause a large temperature rise to the chip due to too small a distance, affecting the performance of the circuit board. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a circuit board design method and a circuit board, which can reasonably determine the distance between the control component and the controlled component in the circuit board, can not only make the circuit board as small as possible, but also prevent the control component from having too large a temperature rise, effectively ensuring the performance and reliability of the circuit board.

[0005] The technical solution adopted by the present invention is as follows: A circuit board design method, the circuit board includes a first component and a plurality of second components, and each of the second components is connected to the first component through a corresponding signal line to receive a control signal sent by the first component through the signal line. The method includes the following steps: determining an upper limit value of the affected temperature rise of the first component and an upper limit value of the continuous working time of the second component; obtaining the heat generation power of each of the second components and the heat transfer parameter of the circuit board; determining the minimum distance between the second component and the first component in the circuit board according to the upper limit value of the affected temperature rise of the first component, the upper limit value of the continuous working time of the second component, the heat generation power of the second component, and the heat transfer parameter of the circuit board; and arranging the first component and the plurality of second components according to the minimum distance between the second component and the first component.

[0006] Further, the circuit board design method further includes: after completing the layout of the first component and the plurality of second components, constructing a test circuit board based on the completed current layout, wherein the distance between every two adjacent signal lines in the test circuit board is set arbitrarily; obtaining the resistance of the signal line between the second component and the first component, the resistance to ground of the signal line at the first component end, and the resistance to ground of the signal line at the second component end in the test circuit board; obtaining the length and thickness of the signal lines in the test circuit board to be used as the length and thickness of the signal lines in the circuit board to be designed; determining the minimum distance between adjacent signal lines in the circuit board according to the resistance of the signal line between the second component and the first component, the resistance to ground of the signal line at the first component end, the resistance to ground of the signal line at the second component end, the length and thickness of the signal lines in the circuit board; and performing layout of the first component, the plurality of second components, and the plurality of signal lines according to the minimum distance between the second component and the first component and the minimum distance between adjacent signal lines.

[0007] Further, the heat transfer parameters of the circuit board include the thermal conductivity and the thermal diffusivity of the circuit board.

[0008] Further, the thermal conductivity and the thermal diffusivity of the substrate used to manufacture the circuit board are used as the thermal conductivity and the thermal diffusivity of the circuit board.

[0009] Further, the relationship between the distance between the second component and the first component in the circuit board, the upper limit value of the affected temperature rise of the first component, the upper limit value of the continuous working time of the second component, the heat generation power of the second component, and the heat transfer parameters of the circuit board is: ; Wherein, D 1 is the distance between the second component and the first component in the circuit board, k is the thermal conductivity of the circuit board, α is the thermal diffusivity of the circuit board, t max is the upper limit value of the continuous working time of the second component, p is the average heat generation power of the second component during the continuous working time, Δ T max is the upper limit value of the affected temperature rise of the first component, representing the maximum allowable temperature rise of the first component caused by each second component.

[0010] Further, the relationship between the distance between adjacent signal lines in the circuit board, the resistance of the signal line between the second element and the first element, the resistance of the signal line to the ground at the first element end, the resistance of the signal line to the ground at the second element end, the length and thickness of the signal line in the circuit board is as follows: ; Wherein, D 2 is the distance between adjacent signal lines in the circuit board, R 1 is the resistance of the signal line to the ground at the first element end, R 2 is the resistance of the signal line to the ground at the second element end, R is the resistance of the signal line between the second element and the first element, C is the mutual capacitance between adjacent two signal lines in the circuit board, M is the mutual inductance between adjacent two signal lines in the circuit board, l is the length of the signal line in the circuit board, h is the thickness of the signal line in the circuit board, ω is the angular frequency, K is the Coulomb constant, μ 0 is the permeability of free space, ε 0 is the permittivity of free space, A th is the preset crosstalk parameter threshold.

[0011] Further, by manufacturing a test circuit including the first element, a plurality of the second elements and a plurality of the signal lines, and detecting in advance in the test the voltage of one signal line at the second element end and the voltage of the other signal line at the first element end in two adjacent signal lines in the test circuit, the preset crosstalk parameter threshold is obtained.

[0012] Further, the second element is a power device, and the first element is a control chip.

[0013] Further, the second element is a power switch tube, an LED (Light Emitting Diode), or a power amplifier.

[0014] A circuit board designed by the circuit board design method described above.

[0015] Advantages of the present invention: The present invention can determine the minimum distance between the second component and the first component on the circuit board according to the upper limit value of the affected temperature rise of the first component, the upper limit value of the continuous working time of the second component, the heat generation power of the second component, and the heat transfer parameter of the circuit board. Thus, the distance between the control component and the controlled component on the circuit board can be reasonably determined, which can not only make the circuit board as small as possible, but also prevent the temperature rise of the control component from being too large, effectively ensuring the performance and reliability of the circuit board.

[0016] Furthermore, the present invention can determine the minimum distance between adjacent signal lines on the circuit board according to the resistance of the signal line between the second component and the first component, the resistance to ground of the signal line at the first component end, the resistance to ground of the signal line at the second component end, the length and thickness of the signal line on the circuit board. Thus, the distance between adjacent signal lines can be reasonably determined, which can not only make the circuit board as small as possible, but also effectively prevent the influence of crosstalk between adjacent signal lines on the performance of the circuit board. Description of the Drawings

[0017] Figure 1 It is a flowchart of the circuit board design method according to an embodiment of the present invention.

[0018] Figure 2 It is a flowchart of the circuit board design method according to a further embodiment of the present invention. Detailed Embodiments

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] The circuit board to be designed in the embodiment of the present invention includes a first component and a plurality of second components. Each second component is connected to the first component through a corresponding signal line to receive the control signal sent by the first component through the signal line. That is to say, the first component is a control component, and the second component is a controlled component.

[0021] In an embodiment of the present invention, the circuit board is a PCB, the second component is a component that generates obvious heat on the circuit board, such as a power device, and the first component is a component that controls the second component and is negatively affected by the heat generated by the second component, such as a control chip. In a specific embodiment of the present invention, the circuit board is a power main board or an audio amplification main board, etc., the second component is a power switch tube, such as an IGBT (Insulate Gate Bipolar Transistor), or the second component is an LED, a power amplifier, etc.

[0022] Therefore, for the design of the circuit board according to the embodiments of the present invention, the distance between the second component and the first component needs to be considered.

[0023] As Figure 1 shown, the circuit board design method according to the embodiments of the present invention includes the following steps: S1. Determine the upper limit value of the affected temperature rise of the first component and the upper limit value of the continuous working time of the second component.

[0024] The upper limit value of the affected temperature rise of the first component represents the maximum value of the temperature rise brought by each second component to the first component that is allowed. This value can be preset according to the high-temperature tolerance of the first component, the number of second components, and the heat dissipation conditions of the circuit board, etc. For example, it can be 5 - 10°C.

[0025] The upper limit value of the continuous working time of the second component is the rated continuous working time of the circuit board product to be set, which is also preset like the upper limit value of the affected temperature rise of the first component.

[0026] S2. Obtain the heat generation power of each second component and the heat transfer parameters of the circuit board.

[0027] The heat generation power of the second component refers to the average heat generation power of the second component during the continuous working time.

[0028] The heat transfer parameters of the circuit board include the thermal conductivity and the temperature diffusivity of the circuit board.

[0029] Since the heat transfer parameters of the circuit board mainly depend on the substrate used to make the circuit board. For example, wiring only changes the thin copper layer and will not have a great impact on the heat transfer parameters, at least it will not significantly affect the basic relationship between the temperature rise of the first component and the distance between the second component and the first component. Therefore, in an embodiment of the present invention, the thermal conductivity and the temperature diffusivity of the substrate used to make the circuit board can be used as the thermal conductivity and the temperature diffusivity of the circuit board.

[0030] In another embodiment of the present invention, the thermal conductivity and the temperature diffusivity of the circuit board can also be used as the thermal conductivity and the temperature diffusivity of the circuit board with reference to the heat transfer parameters of the circuit board. The circuit board with reference to the heat transfer parameters refers to a pre-manufactured circuit board including a first component, a plurality of second components, and a plurality of signal lines, and the distance between the second component and the first component is determined according to the experience of the manufacturing personnel. The difference in the heat transfer parameters between the circuit board with reference to the heat transfer parameters and the circuit board to be designed is smaller.

[0031] In addition, it should be noted that although the heat transfer between components in the circuit board includes two ways, namely circuit board heat transfer and air heat transfer, the circuit board heat transfer accounts for a relatively large proportion, and common air-cooling heat dissipation, etc., will disrupt the air heat transfer. Therefore, the temperature rise of the first component caused by the heat generation of the second component is mainly brought about by the circuit board heat transfer. In the embodiments of the present invention, only the heat transfer of the circuit board itself is considered. In other words, by setting the upper limit value of the affected temperature rise of the first component to be smaller, redundancy can be provided for the ignored air heat transfer, that is, it is feasible to only consider the heat transfer of the circuit board itself in the embodiments of the present invention.

[0032] S3. Determine the minimum distance between the second component and the first component in the circuit board according to the upper limit value of the affected temperature rise of the first component, the upper limit value of the continuous working time of the second component, the heat generation power of the second component, and the heat transfer parameters of the circuit board.

[0033] In an embodiment of the present invention, the relationship between the distance between the second component and the first component in the circuit board, the upper limit value of the affected temperature rise of the first component, the upper limit value of the continuous working time of the second component, the heat generation power of the second component, and the heat transfer parameters of the circuit board is as follows: ; Wherein, D 1 is the distance between the second component and the first component in the circuit board, k is the thermal conductivity of the circuit board, α is the thermal diffusivity of the circuit board, t max is the upper limit value of the continuous working time of the second component, p is the average heat generation power of the second component during the continuous working time, Δ T max is the upper limit value of the affected temperature rise of the first component, representing the maximum value of the temperature rise allowed for each second component to the first component.

[0034] That is to say, the minimum distance between the second component and the first component in the circuit board can be determined according to the above relationship. When the above inequality takes the equal sign, the calculated D value of 1 is the minimum distance between the second component and the first component in the circuit board.

[0035] S4. Layout the first component and multiple second components according to the minimum distance between the second component and the first component.

[0036] Preferably, the actual distance between the second component and the first component in the circuit board is equal to the minimum distance determined in step S3. Of course, it can also be slightly greater than the minimum distance determined in step S3.

[0037] According to the circuit board design method of the embodiments of the present invention, the minimum distance between the second component and the first component in the circuit board can be determined based on the upper limit value of the affected temperature rise of the first component, the upper limit value of the continuous working time of the second component, the heat generation power of the second component, and the heat transfer parameter of the circuit board. Thus, the distance between the control component and the controlled component in the circuit board can be reasonably determined, which can not only make the circuit board as small as possible, but also prevent the temperature rise of the control component from being too large, effectively ensuring the performance and reliability of the circuit board.

[0038] In view of factors such as wiring efficiency, space design, heat dissipation design, and anti-power line interference design, generally, parallel wiring is adopted for the signal lines of the circuit board in the above embodiments, that is, each signal line is arranged parallel and side by side between the end close to the first component and the end close to the second component. For the parallel wiring method to reduce crosstalk between signal lines, in principle, the smaller the distance between the second component and the first component, the better. However, as described in the above embodiments, considering the temperature rise of the control component caused by the heat generation of the controlled component, there should be at least the minimum distance determined in step S3 between the second component and the first component. At this distance, crosstalk between adjacent signal lines is also a problem that needs to be solved.

[0039] Therefore, for the circuit board of the embodiments of the present invention, relevant designs can also be adopted to reduce crosstalk. It should be understood that the larger the distance between adjacent signal lines, the smaller the crosstalk. However, for the similar reason as in the above embodiments, the distance between adjacent signal lines cannot be designed infinitely large. Therefore, the distance between adjacent signal lines can also be considered in the circuit board design.

[0040] As Figure 2 shown, the circuit design method of the embodiments of the present invention further includes the following steps: S5, after completing the layout of the first component and multiple second components, construct a test circuit board based on the completed current layout, wherein the distance between every two adjacent signal lines in the test circuit board is set arbitrarily.

[0041] Since the test circuit board of the embodiments of the present invention is only used for subsequent detection of relevant resistance parameters and has nothing to do with crosstalk, the distance between adjacent signal lines in the test circuit board of the embodiments of the present invention can be set arbitrarily, and other parameters and rules such as wire specifications are the same as those of the circuit board to be designed.

[0042] S6, obtain the resistance of the signal line between the second component and the first component, the resistance to ground of the signal line at the first component end, and the resistance to ground of the signal line at the second component end in the test circuit board.

[0043] In an embodiment of the present invention, for both ends of each signal line, the end connected to the first component is called the first component end, and the end connected to the second component is called the second component end. Each resistance parameter can be obtained by detecting on a test circuit board.

[0044] S7. Obtain the length and thickness of the signal lines in the test circuit board to be used as the length and thickness of the signal lines in the circuit board to be designed.

[0045] In an embodiment of the present invention, in the test circuit board and in the circuit board to be designed, each signal line is of equal length or has only a small length difference. If the signal lines in the test circuit board are not of equal length, then the shortest length of each signal line is used as the length for subsequent calculations.

[0046] In view of the fact that the first component and the second component also have certain dimensions, the length here should be less than the actual distance between the second component and the first component.

[0047] S8. Determine the minimum distance between adjacent signal lines in the circuit board according to the resistance of the signal line between the second component and the first component, the resistance to ground of the signal line at the first component end, the resistance to ground of the signal line at the second component end, the length and thickness of the signal lines in the circuit board.

[0048] In an embodiment of the present invention, the relationship between the distance between adjacent signal lines in the circuit board and the resistance of the signal line between the second component and the first component, the resistance to ground of the signal line at the first component end, the resistance to ground of the signal line at the second component end, the length and thickness of the signal lines in the circuit board is as follows: ; wherein, D 2 is the distance between adjacent signal lines in the circuit board, R 1 is the resistance to ground of the signal line at the first component end, R 2 is the resistance to ground of the signal line at the second component end, R is the resistance of the signal line between the second component and the first component, C is the mutual capacitance between two adjacent signal lines in the circuit board, M is the mutual inductance between two adjacent signal lines in the circuit board, l is the length of the signal lines in the circuit board, h is the thickness of the signal lines in the circuit board, ω is the angular frequency, K is the Coulomb constant, μ 0 is the vacuum permeability, ε 0 is the vacuum permittivity, A th is the preset crosstalk parameter threshold.

[0049] That is to say, the minimum distance between adjacent signal lines on the circuit board can be determined according to the above relationship. When the above inequality takes the equal sign, the calculated D value of 2 is the minimum distance between adjacent signal lines on the circuit board.

[0050] The preset crosstalk parameter threshold in the above relational expression A th on the left , the physical meaning represented is: the modulus value of the quotient of the voltage phasor of one signal line at the second element end and the voltage phasor of the other signal line at the first element end among two adjacent signal lines. The magnitude of this modulus value can represent the strength of crosstalk between two adjacent signal lines on the circuit board. The larger this modulus value, the stronger the crosstalk. The preset crosstalk parameter threshold A th is the upper limit of crosstalk that the control system composed of the first element and the second element can withstand between two adjacent signal lines. Below this upper limit, the first element can successfully send a control signal to the second element, while above this upper limit, the control signal may be distorted.

[0051] In an embodiment of the present invention, a test circuit including a first element, a plurality of second elements, and a plurality of signal lines can be manufactured, and the voltage of one signal line at the second element end and the voltage of the other signal line at the first element end among two adjacent signal lines in the test circuit can be detected in advance during the test to obtain the preset crosstalk parameter threshold. For example, two adjacent signal lines can be gradually brought closer until the second element cannot successfully receive the control signal sent by the first element. The modulus value of the quotient of the voltage phasor of one signal line at the second element end and the voltage phasor of the other signal line at the first element end measured at the critical state is the preset crosstalk parameter threshold A th .

[0052] Since the test circuit is mainly used to test the robustness of the control system composed of the first element and the second element against crosstalk, the test circuit only needs to include a first element, a plurality of second elements, and a plurality of signal lines, and there are no requirements for other parameters. Even for the form of the circuit, it can be in the form of a circuit board or a simple form of connecting the first element and the second element with wires.

[0053] S9. Layout the first element, the plurality of second elements, and the plurality of signal lines according to the minimum distance between the second element and the first element and the minimum distance between adjacent signal lines.

[0054] According to the circuit board design method of a further embodiment of the present invention, the minimum distance between adjacent signal lines in the circuit board can be determined based on the resistance of the signal line between the second component and the first component, the resistance to ground of the signal line at the first component end, the resistance to ground of the signal line at the second component end, the length and thickness of the signal line in the circuit board. Thus, the distance between adjacent signal lines can be reasonably determined, which can not only make the circuit board as small as possible, but also effectively prevent the influence of crosstalk between adjacent signal lines on the performance of the circuit board.

[0055] The circuit board design method of the embodiment of the present invention can be executed by a circuit board automatic design device. The determination and acquisition of parameters in each calculation condition can come from those stored in a storage device, detected by a detection device, or input by an operator operating the device.

[0056] Based on the circuit board design method of the above embodiment, the present invention also proposes a circuit board.

[0057] The circuit board of the embodiment of the present invention is designed by the circuit board design method of any of the above embodiments. Further implementation manners of the circuit board of the present invention can refer to the above respective embodiments and will not be elaborated herein.

[0058] For the circuit board according to the embodiment of the present invention, the distance between the control component and the controlled component is reasonable, the volume is small, the temperature rise of the control component is small, and the performance and reliability are high.

[0059] In addition, the crosstalk between adjacent signal lines in the circuit board will not affect the performance.

[0060] In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. The meaning of "a plurality" is two or more unless otherwise specifically defined.

[0061] In the present invention, unless otherwise clearly specified and limited, the terms such as "mounted", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0062] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is less than that of the second feature.

[0063] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0064] Any process or method description shown in a flowchart or described in other ways herein can be understood to represent a module, segment, or portion of code including one or more executable instructions for implementing a specific logical function or process. The scope of the preferred embodiments of the present invention includes additional implementations, where the functions may be executed in a manner not shown or discussed, including in a substantially simultaneous manner or in a reverse order according to the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention pertain.

[0065] The logic and / or steps represented in the flowchart or otherwise described herein can, for example, be considered as a definitional sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or used in conjunction with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connection parts with one or more wirings (electronic devices), portable computer disk cartridges (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber devices, and portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other appropriate processing as necessary, and then stored in a computer memory.

[0066] It should be understood that the various parts of the present invention can be implemented using hardware, software, firmware, or combinations thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application-specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0067] Those of ordinary skill in the art of this technology can understand that all or part of the steps carried by the method of implementing the above embodiments can be completed by instructing relevant hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0068] In addition, in each embodiment of the present invention, each functional unit may be integrated into a processing module, may exist physically separately for each unit, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. When the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0069] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A circuit board design method, characterized in that: The circuit board includes a first component and a plurality of second components, each of the second components is connected to the first component via a corresponding signal line to receive a control signal sent by the first component via the signal line, and the method includes the following steps: Determining an upper limit value of the affected temperature rise of the first element and an upper limit value of the continuous working time of the second element; Acquire the heat generation power of each of the second elements and the heat transfer parameters of the circuit board; Determining a minimum distance between the second element and the first element in the circuit board according to an upper limit value of the affected temperature rise of the first element, an upper limit value of the continuous working time of the second element, a heating power of the second element, and a heat transfer parameter of the circuit board; The first element and a plurality of the second elements are arranged according to a minimum distance between the second element and the first element.

2. The circuit board design method according to claim 1, characterized in that: Also includes: After completing the layout of the first component and the plurality of the second components, constructing a test circuit board with the completed current layout, wherein the distance between every two adjacent signal lines in the test circuit board is arbitrarily set; Obtaining, in the test circuit board, the resistance of the signal line between the second element and the first element, the resistance of the signal line to ground at the first element end, and the resistance of the signal line to ground at the second element end; Obtaining the length and thickness of the signal line in the test circuit board as the length and thickness of the signal line in the circuit board to be designed; Determine the minimum distance between adjacent signal lines in the circuit board according to the resistance of the signal line between the second element and the first element, the resistance of the signal line to ground at the first element end, the resistance of the signal line to ground at the second element end, and the length and thickness of the signal line in the circuit board; The first element, a plurality of the second elements, and a plurality of the signal lines are laid out according to a minimum distance between the second element and the first element and a minimum distance between adjacent signal lines.

3. The circuit board design method according to claim 1, characterized in that: The heat transfer parameters of the circuit board include the thermal conductivity and the temperature conductivity of the circuit board.

4. The circuit board design method according to claim 3, characterized in that: The thermal conductivity and thermal conductivity of the substrate used to make the circuit board are used as the thermal conductivity and thermal conductivity of the circuit board.

5. The circuit board design method according to claim 3, characterized in that: The relationship between the distance between the second element and the first element in the circuit board, the upper limit of the affected temperature rise of the first element, the upper limit of the continuous working time of the second element, the heating power of the second element, and the heat transfer parameters of the circuit board is: ； in, D 1 is the distance between the second component and the first component in the circuit board, k is the thermal conductivity of the circuit board, α is the thermal conductivity of the circuit board, t max is the upper limit of the continuous working time of the second element, p is the average heat generation power of the second element during continuous working time, Δ T max is the upper limit of the affected temperature rise of the first element, indicating the maximum value of the temperature rise allowed to be brought to the first element by each second element.

6. The circuit board design method according to claim 2, characterized in that: The relationship between the distance between adjacent signal lines in the circuit board, the resistance of the signal line between the second element and the first element, the ground resistance of the signal line at the first element end, the ground resistance of the signal line at the second element end, and the length and thickness of the signal line in the circuit board is: ； in, D 2 is the distance between adjacent signal lines in the circuit board, R 1 is the resistance of the signal line to ground at the first element end, R 2 is the resistance of the signal line to ground at the second element end, R is the resistance of the signal line between the second element and the first element, C is the mutual capacitance between two adjacent signal lines in the circuit board, M is the mutual inductance between two adjacent signal lines in the circuit board, l is the length of the signal line in the circuit board, h is the thickness of the signal line in the circuit board, ω is the angular frequency, K is the Coulomb constant, μ 0 is the vacuum permeability, ε 0 is the dielectric constant of vacuum, A th is the preset crosstalk parameter threshold.

7. The circuit board design method according to claim 6, characterized in that: The preset crosstalk parameter threshold is obtained by manufacturing a test circuit including the first element, multiple second elements and multiple signal lines, and detecting in advance in the test the voltage of one signal line at the second element end and the voltage of the other signal line at the first element end of two adjacent signal lines in the test circuit.

8. The circuit board design method according to any one of claims 1 to 7, characterized in that: The second component is a power device, and the first component is a control chip.

9. The circuit board design method according to claim 8, characterized in that: The second component is a power switch tube, an LED or a power amplifier.

10. A circuit board, characterized in that: The circuit board is designed by the circuit board design method according to any one of claims 1 to 9.

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