Liquid cooling system, electronic equipment and liquid cooling flow control method

Abstract

The invention discloses a liquid cooling system, an electronic device and a liquid cooling flow control method.The liquid cooling system comprises a liquid cooling cabinet, at least two heat dissipation spaces are arranged in the liquid cooling cabinet in parallel in the cooling liquid flowing direction, and the cooling liquid flow in each heat dissipation space is in positive correlation with the power of a power device in the corresponding heat dissipation space. In the liquid cooling system provided by the invention, the cooling liquid flow corresponding to the heat dissipation space is configured according to the power of the power device, and the heat dissipation spaces are arranged in parallel, so that the high-power device and the low-power device are subjected to heat dissipation through the cooling liquid with lower temperature, and the heat dissipation of the power device with higher power is ensured by controlling the flow, therefore, the heat dissipation efficiency of the power device is improved. And the use safety of the power device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange, and particularly relates to a liquid cooling system, an electronic device, and a liquid cooling flow control method. Background Art

[0002] In a traditional liquid cooling system, heat exchange devices are arranged in series along the flow direction of the coolant. For example, the coolant first flows through the main high-power power components and then exchanges heat with other low-heat power components.

[0003] However, in the process of realizing the above heat exchange, the inventor found that there are at least the following problems in the prior art: after the coolant flows through the high-power power components, the temperature of the coolant rises. Then, when it flows through the low-power power components, the temperature difference between the coolant and the low-power power components becomes smaller, and the heat dissipation effect of the low-power power components is poor, with a risk of overheating, which further reduces the use safety of the power devices.

[0004] Therefore, how to improve the use safety of power devices is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0005] The purpose of the present invention is to provide a liquid cooling system to improve the use safety of power devices. Another purpose of the present invention is to provide an electronic device including the above liquid cooling system. Another purpose of the present invention is to relate to a liquid cooling flow control method.

[0006] A liquid cooling system provided by the present application includes a liquid cooling cabinet, and at least two heat dissipation spaces are arranged in parallel in the liquid cooling cabinet along the flow direction of the coolant. The coolant flow rate in each heat dissipation space is positively correlated with the power of the power device in the corresponding heat dissipation space.

[0007] Optionally, in the above liquid cooling system, a flow dividing plate installed in the inner cavity of the liquid cooling cabinet is further included, and liquid inlet ports corresponding to the coolant flowing into different heat dissipation spaces are provided on the flow dividing plate.

[0008] Optionally, in the above liquid cooling system, a guiding component is further included. The guiding component includes a guiding cylinder and a guiding plate with one end connected to the liquid outlet end of the guiding cylinder. The liquid inlet end of the guiding cylinder is connected to one of the liquid inlet ports.

[0009] Optionally, in the above liquid cooling system, the guiding plate is a U-shaped structure with an upward opening.

[0010] Optionally, in the above liquid cooling system, the inner cavity of the guiding cylinder is a cylindrical cavity structure, and the liquid inlet port connected to the guiding cylinder is set as a circular structure with the same diameter as the cylindrical cavity structure and a sealed edge connection.

[0011] Optionally, in the above liquid cooling system, a corresponding device accommodation cavity for accommodating the second power device is formed between the outer wall of the flow guide plate and the inner wall of the liquid cooling cabinet.

[0012] Optionally, in the above liquid cooling system, the coolant inlet is located at the bottom end of the liquid cooling cabinet, and the coolant outlet is located at the top end of the liquid cooling cabinet.

[0013] Optionally, in the above liquid cooling system, a confluence space is further included. Along the coolant flow direction, the confluence space is located downstream of the heat dissipation space and is communicated with the heat dissipation space.

[0014] An electronic device includes a power device and also includes the liquid cooling system as described in any one of the above. The power device is installed in the heat dissipation space.

[0015] A liquid cooling flow control method for controlling the liquid cooling flow rate in the heat dissipation space of the liquid cooling system as described in any one of the above includes:

[0016] Step 1: Input the design power consumption of each power device, and determine the required flow rate of each power device according to the theoretical calculation of heat transfer.

[0017] Step 2: Calculate the flow resistance of each power device at the required flow rate.

[0018] Step 3: Determine the required resistance of the liquid inlet hole corresponding to each power device in the heat dissipation space according to the pressure difference, the required flow rate of each power device, and the flow resistance of each power device.

[0019] Step 4: Determine the hole area of the liquid inlet hole of the heat dissipation space, and determine the position of the liquid inlet hole corresponding to the heat dissipation space according to the position of each power device.

[0020] In the above technical solution, the liquid cooling system provided by the present invention includes a liquid cooling cabinet. At least two heat dissipation spaces are arranged in parallel in the liquid cooling cabinet along the coolant flow direction. The coolant flow rate in each heat dissipation space is positively correlated with the power of the power device in the corresponding heat dissipation space.

[0021] It can be known from the above description that the liquid cooling system provided in the present application has at least the following technical effects: The coolant flow rate of the corresponding heat dissipation space is configured according to the power of the power device, and the heat dissipation spaces are arranged in parallel, so that both high-power devices and low-power devices are cooled by the coolant with a lower temperature, and by controlling the flow rate, the coolant flow rate is further controlled to ensure the heat dissipation of the power device with a higher power. Therefore, the use safety of the power device is improved. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to the provided drawings.

[0023] Figure 1 Structural schematic diagram of the liquid cooling system provided by the embodiment of the present invention;

[0024] Figure 2 Installation position diagram of the diversion component provided by the embodiment of the present invention;

[0025] Figure 3 Structural schematic diagram of the flow splitting plate provided by the embodiment of the present invention.

[0026] Among them Figures 1-3 In the figure: 1 - coolant outlet, 2 - server hard disk, 3 - second power device, 4 - coolant inlet, 5 - server power supply, 6 - first power device, 7 - diversion component, 8 - flow splitting plate, 9 - liquid inlet channel, 10 - first liquid inlet, 11 - second liquid inlet, 12 - diversion cylinder, 13 - diversion plate, 14 - first device accommodation cavity, 15 - confluence space. Specific embodiments

[0027] The core of the present invention is to provide a liquid cooling system to improve the use safety of power devices. Another core of the present invention is to provide an electronic device including the above liquid cooling system. Another core of the present invention relates to a liquid cooling flow control method.

[0028] Please refer to Figures 1 to 3 .

[0029] In a specific embodiment, the liquid cooling system provided by the present invention includes a liquid cooling cabinet, and at least two heat dissipation spaces are arranged in parallel in the liquid cooling cabinet along the coolant flow direction. The number of heat dissipation spaces can be two, three, or at least four, etc.

[0030] The coolant flow rate in each heat dissipation space is positively correlated with the power of the power device in the corresponding heat dissipation space. Specifically, at least two heat dissipation spaces are arranged in parallel in the liquid cooling cabinet along the coolant flow direction, and the coolant flow rates in different heat dissipation spaces are different, so as to dissipate heat for different power devices. A heat dissipation space with a large coolant flow rate is configured for high-power power devices, and a heat dissipation space with a small coolant flow rate is configured for low-power power devices.

[0031] Among them, the shape and size of the heat dissipation space are determined according to the size of the power device installed inside, and no specific limitation is made in this application.

[0032] As described above, in the liquid cooling system provided by the specific embodiment of the present application, the coolant flow rate of the corresponding heat dissipation space is configured according to the power of the power device, and the heat dissipation spaces are connected in parallel, so that both high-power devices and low-power devices are cooled by coolant with a lower temperature, and by controlling the flow rate, the coolant flow rate is further controlled to ensure the heat dissipation of the power device with a higher power. Therefore, the use safety of the power device is improved.

[0033] Preferably, the ratio of the power of the power device in each heat dissipation space to the coolant flow rate in the corresponding heat dissipation space is the same. For example, the ratio of the power of the first power device 6 to the coolant flow rate in the first heat dissipation space where the first power device 6 is correspondingly installed is the same as the ratio of the power of the second power device 3 to the coolant flow rate in the second heat dissipation space where the second power device 3 is correspondingly installed. With such a setting, the power devices in each heat dissipation space are evenly cooled.

[0034] In a specific embodiment, the two heat dissipation spaces are respectively the first heat dissipation space and the second heat dissipation space, and the coolant flow rate in the first heat dissipation space is greater than that in the second heat dissipation space. There are a coolant inlet 4 and a coolant outlet 1 on the liquid cooling cabinet. Specifically, the coolant inlet 4 and the coolant outlet 1 are respectively arranged at both ends of the liquid cooling cabinet.

[0035] For the convenience of placing the liquid cooling cabinet, both the coolant inlet 4 and the coolant outlet 1 are arranged on the side wall of the liquid cooling cabinet. Specifically, the coolant inlet 4 is located at the bottom end of the liquid cooling cabinet, and the coolant outlet 1 is located at the top end of the liquid cooling cabinet.

[0036] The first heat dissipation space is used to cool the first power device 6, and the second heat dissipation space is used to cool the second power device 3. The power of the first power device 6 is greater than that of the second power device 3. Specifically, the first power device 6 includes but is not limited to server chips, and the second power device 3 includes but is not limited to server memories.

[0037] When the liquid cooling system needs to be used, the corresponding heat dissipation space is set according to the position of the power device.

[0038] As described above, in the liquid cooling system provided by the specific embodiment of the present application, since the first heat dissipation space and the second heat dissipation space are connected in parallel, both the first power device 6 and the second power device 3 can be cooled by coolant with a lower temperature, and by controlling the flow rate, the coolant flow rate is further controlled to ensure the heat dissipation of the power device with a larger power. Therefore, the use safety of the power device is improved.

[0039] In a specific embodiment, the liquid cooling system further includes a flow dividing plate 8 installed in the inner cavity of the liquid cooling cabinet, and the flow dividing plate 8 is provided with liquid inlet ports corresponding to the coolant flowing into different heat dissipation spaces.

[0040] Specifically, an inlet channel 9 is formed between the flow dividing plate 8 and the coolant inlet 4 in the inner cavity of the liquid cooling cabinet. The flow dividing plate 8 is provided with a first inlet 10 for the coolant to flow into the first heat dissipation space and a second inlet 11 for the coolant to flow into the second heat dissipation space.

[0041] As Figure 1 shown, the inlet channel 9 is located at the bottom end of the liquid cooling cabinet. Preferably, according to the flow direction of the coolant in the inlet channel, the first inlet 10 is located downstream of the second inlet 11. That is, the coolant entering the liquid cooling cabinet first flows to the position of the second inlet 11 and then flows to the position of the first inlet 10. Since the coolant flow rate in the first heat dissipation space corresponding to the first inlet 10 is greater than the coolant flow rate in the second heat dissipation space corresponding to the second inlet, in order to control the coolant flow rate in the first heat dissipation space to be greater than that in the second heat dissipation space, usually the sizes of the corresponding inlets are adjusted. For example, the size of the first inlet 10 is larger than the size of the second inlet 11. And in order to enable the coolant to flow smoothly into the second heat dissipation space, the first inlet 10 is arranged downstream of the second inlet 11 to ensure the inlet of the second heat dissipation space, that is, to facilitate the coolant to flow into the second heat dissipation space through the second inlet 11.

[0042] The shapes and sizes of the first inlet 10 and the second inlet 11 can be designed according to actual requirements and are not limited in the present invention. For the convenience of processing and the flow of the coolant, preferably, the first inlet 10 and / or the second inlet 11 are of a round hole structure.

[0043] In a specific embodiment, the liquid cooling system further includes a flow guiding assembly 7. The flow guiding assembly 7 includes a flow guiding cylinder 12 and a flow guiding plate 13 with one end connected to the liquid outlet end of the flow guiding cylinder 12. The liquid inlet end of the flow guiding cylinder 12 is connected to one of the inlets. Specifically, the power device is installed on the flow path formed by the inner enclosures of the flow guiding cylinder 12 and the flow guiding plate 13.

[0044] As Figure 2 and Figure 3 shown, the flow guiding cylinder 12 is connected to the first inlet 10. A first device accommodating cavity 14 for placing the first power device 6 is formed between the inner wall of the flow guiding plate 13 and the inner wall of the liquid cooling cabinet. The cross-sectional area of the liquid inlet end of the first device accommodating cavity 14 gradually increases along the horizontal direction perpendicular to the coolant flow direction.

[0045] Specifically, the flow guiding plate 13 is of a U-shaped structure with an upward opening. For the convenience of assembly, preferably, the flow guiding plate 13 is of an integrally formed structure, which can be specifically injection molded or formed by bending a plate.

[0046] Specifically, the inner cavity of the draft tube 12 is a cylindrical cavity structure, and the liquid inlet connecting the draft tube 12 is set as a circular structure with the same diameter as the cylindrical cavity structure and sealed at the edge. Specifically, the first liquid inlet 10 has the same diameter as the cylindrical cavity structure and is sealed at the edge. By providing the draft tube 12, it is convenient to quickly divert the coolant to the position of the flow guide plate 13, thereby facilitating the heat dissipation of the first power device 6.

[0047] Specifically, a second device accommodation cavity for accommodating the second power device 3 is formed between one side of the flow guide plate 13 and the inner wall of the liquid cooling cabinet, that is, in the present application, the coolant can be split by adding a flow splitting plate 8 and a flow guiding assembly 7 inside the traditional liquid cooling cabinet.

[0048] In a specific embodiment, the liquid cooling system further includes a confluence space 15. Along the flow direction of the coolant, the confluence space 15 is located downstream of the first heat dissipation space and the second heat dissipation space and is communicated with the first heat dissipation space and the second heat dissipation space. During specific use, power devices can be arranged in the confluence space 15. Specifically, preferably, the power devices placed at this position have a low heat dissipation requirement and almost no heat dissipation structure. Specifically, the confluence space 15 can accommodate, including but not limited to, server hard disks 2 and server power supplies 5.

[0049] For ease of understanding, the cooling method of the liquid cooling system will be described below in combination with a specific working method. When the liquid cooling system works, the coolant enters the liquid inlet passage 9 from the coolant inlet 4 and is split by the flow splitting plate 8 into each heat dissipation space, for example, enters the server interior. The flow splitting plate 8 is provided with large and small holes with different hole areas. Specifically, it includes a first liquid inlet 10 and a second liquid inlet 11. The positions and hole areas of the first liquid inlet 10 and the second liquid inlet 11 are determined according to the positions and power consumptions of the power devices in each heat dissipation space. Preferably, along the flow direction of the coolant in the heat dissipation space, the liquid inlet holes of each heat dissipation space are aligned with the corresponding power devices in the heat dissipation space to dissipate heat from the power devices in a timely manner.

[0050] After being split by the flow splitting plate 8, most of the coolant flows into the first liquid inlet 10 of the flow splitting plate 8 and is transported to the high-power power devices of the server via the flow guiding assembly 7.

[0051] A small part of the flow rate flows into the server through the second liquid inlet 11 of the server to cool the low-power power devices inside the server.

[0052] After the coolant takes away the heat of each power device inside the server, it finally flows out from the coolant outlet 1. Specifically, the coolant outlet 1 can be an overflow port provided at the top of the liquid cooling cabinet.

[0053] Since the flow path between the first power device and the second power device in this application is in a parallel relationship, the coolant can directly cool the low-power device, and there is no flow dead zone in the server, that is, there is no risk of overheating of the electronic devices inside the liquid cooling cabinet, which is convenient for wide promotion and use.

[0054] This application provides an electronic device, including a power device and any one of the above liquid cooling systems, and the power device is installed in a heat dissipation space. The specific structure of the liquid cooling system has been described above. This application includes the above liquid cooling system and also has the above technical effects.

[0055] A liquid cooling flow rate control method provided by this application is used to control the above liquid cooling system, including:

[0056] Step 1: Input the designed power consumption of each power device, and determine the required flow rate of each power device according to the theoretical calculation of heat transfer.

[0057] Step 2: Calculate the flow resistance of each power device at the required flow rate.

[0058] Step 3: Determine the required resistance of the liquid inlet hole corresponding to the heat dissipation space of each power device according to the pressure difference, the required flow rate of each power device, and the flow resistance of each power device.

[0059] Step 4: Determine the hole area of the liquid inlet hole of the heat dissipation space, and determine the position of the liquid inlet hole corresponding to the heat dissipation space according to the position of each power device.

[0060] Specifically, first, according to the power consumption of the high-power power devices and the low-power power devices in the liquid cooling cabinet, the h value is obtained through Q = hAΔt. Among them, Q is the power consumption of the power device; h is the convective heat transfer coefficient, which is related to the coolant flow rate and the shape factor of the power device; A is the area of the power device, and Δt is the temperature difference between the power device and the coolant;

[0061] Then, through the following formula, the flow rate u of the coolant is obtained;

[0062]

[0063] Among them, h is the convective heat transfer coefficient, d is the characteristic size of the power device, u is the flow rate of the coolant, k is the thermal conductivity of the coolant, c p is the specific heat capacity of the coolant, μ is the viscosity of the coolant, and a, b, C are constants;

[0064] That is, a functional relationship between power consumption and flow rate is established through the above two formulas.

[0065] Calculate the resistance required to flow through each power component at the obtained flow rate required for each power device.

[0066] The calculation relationship between resistance and flow rate is: Where ΔP is the pressure drop, λ is the friction coefficient, l is the length of the power device, d is the characteristic dimension of the power device, and u is the flow velocity of the coolant. The area of the small holes on the flow splitter 8 is adjusted to regulate the resistance of the coolant flowing through the small holes, thereby controlling the flow velocity of the coolant to achieve the corresponding flow distribution. According to the power consumption of each device in the server, the flow splitter 8 is designed to direct the distribution of the coolant flow as needed.

[0067] Meet the heat dissipation requirements of each power component, without redundant design of flow rate, and save the energy consumption of the system.

[0068] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other.

[0069] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liquid cooling system, characterized in that, It includes a liquid cooling cabinet, and at least two heat dissipation spaces are arranged in parallel along the flow direction of the coolant in the liquid cooling cabinet. The coolant flow rate in each heat dissipation space is positively correlated with the power of the power device in the corresponding heat dissipation space.

2. The liquid cooling system according to claim 1, wherein It further includes a flow dividing plate (8) installed in the inner cavity of the liquid cooling cabinet. The flow dividing plate (8) is provided with corresponding liquid inlet ports for the coolant to flow into different heat dissipation spaces.

3. The liquid cooling system according to claim 2, wherein It further includes a flow guiding assembly (7). The flow guiding assembly (7) includes a flow guiding cylinder (12) and a flow guiding plate (13) with one end connected to the liquid outlet end of the flow guiding cylinder (12). The liquid inlet end of the flow guiding cylinder (12) is connected to one of the liquid inlet ports.

4. The liquid cooling system according to claim 3, wherein The flow guiding plate (13) is a U-shaped structure with an upward opening.

5. The liquid cooling system according to claim 3, characterized in that, The inner cavity of the flow guiding cylinder (12) is a cylindrical cavity structure. The liquid inlet port connecting the flow guiding cylinder (12) is set as a circular structure with the same diameter as the cylindrical cavity structure and sealed at the edge.

6. The liquid cooling system according to claim 3, wherein, A corresponding device accommodating cavity for accommodating the second power device (3) is formed between the outer wall of the flow guiding plate (13) and the inner wall of the liquid cooling cabinet.

7. The liquid cooling system according to claim 2, wherein The coolant inlet (4) is located at the bottom end of the liquid cooling cabinet, and the coolant outlet (1) is located at the top end of the liquid cooling cabinet.

8. The liquid cooling system according to claim 1, characterized in that, It further includes a confluence space (15). Along the flow direction of the coolant, the confluence space (15) is located downstream of the heat dissipation space and is communicated with the heat dissipation space.

9. An electronic device includes a power device, characterized in that, It further includes a liquid cooling system according to any one of claims 1-8, and the power device is installed in the heat dissipation space.

10. A liquid cooling flow control method, characterized in that, For controlling the liquid cooling flow rate in the heat dissipation space in the liquid cooling system according to any one of claims 1-8, it includes: Step 1: Input the designed power consumption of each power device, and determine the required flow velocity of each power device according to the theoretical calculation of heat transfer. Step 2: Calculate the flow resistance of each power device at the required flow velocity. Step 3: Determine the required resistance of the liquid inlet hole of the corresponding heat dissipation space of each power device according to the pressure difference, the required flow velocity of each power device, and the flow resistance of each power device. Step 4: Determine the hole area of the liquid inlet hole of the heat dissipation space, and determine the position of the liquid inlet hole of the corresponding heat dissipation space according to the position of each power device.

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