Network construction type energy storage converter power module radiator based on thermal simulation optimization design

Abstract

The invention discloses a thermal simulation optimization design-based grid-forming type energy storage converter power module radiator, which comprises a radiator, a sparse fin radiating fin group, a dense fin radiating fin group, IGBT (Insulated Gate Bipolar Translator) modules, an air duct coaming and a centrifugal fan, and is characterized in that a plurality of IGBT modules are arranged on the front surface of the radiator; a plurality of sparse-fin radiating fin sets and dense-fin radiating fin sets are arranged on the back face of the radiator, the dense-fin radiating fin sets correspond to a plurality of densely-distributed IGBT modules, the sparse-fin radiating fin sets correspond to a plurality of dispersedly-distributed IGBT modules, an air duct surrounding plate is arranged on the edge of the radiator, and the dense-fin radiating fin sets and the dense-fin radiating fin sets are arranged on the back face of the radiator. And the top of the radiator is communicated with a centrifugal fan through an air duct coaming, so that the IGBT modules at different positions can be uniformly radiated, the service life consistency of the IGBT modules is improved, and the reliability of the power module is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of energy storage charge and discharge, in particular to the technical field of a radiator for a grid-forming energy storage converter power module optimized and designed based on thermal simulation. Background Art

[0002] In a grid-forming energy storage converter, the power module, as the core component, undertakes the functions of rectification and inversion. Among them, the IGBT module (Insulated Gate Bipolar Transistor) is an indispensable component in the power module. Since the IGBT module itself passes a large current and has a very high switching frequency, a large amount of heat is generated in the IGBT module. If the temperature of the chips inside the IGBT module is too high, its working performance will be affected, and in severe cases, the IGBT module will be damaged. Therefore, it is necessary to dissipate the heat of the IGBT module in time. In the grid-forming energy storage converter industry, forced air cooling of the IGBT module in cooperation with a radiator is the most common heat dissipation method. In the current radiator design, generally, fins with uniform distribution are adopted on the same radiator, that is, the fins of the entire radiator are designed with equal tooth thickness and equal pitch. This design will cause the temperature rise of the IGBT module on the air inlet side to be low, while the temperature rise of the IGBT module on the air outlet side to be high. Generally, the IGBT modules are arranged in an inverted pyramid shape, and the loss of the lower IGBT module is less than that of the upper IGBT module. When the air flows from bottom to top, the temperature rise difference between the upper and lower IGBT modules is even greater. It can be seen that the existing air-cooled power module radiator will cause uneven heat dissipation of the IGBT module, resulting in inconsistent lifetimes of the IGBT modules and affecting the lifetime of the power module. Therefore, it is very necessary to design a new structure of radiator to fundamentally solve the defect of uneven heat dissipation of the IGBT module. Summary of the Invention

[0003] The purpose of the present invention is to solve the problems in the prior art and propose a radiator for a grid-forming energy storage converter power module optimized and designed based on thermal simulation, which can make the IGBT modules at different positions dissipate heat evenly, thereby improving the consistency of the lifetimes of the IGBT modules and the reliability of the power module.

[0004] To achieve the above object, the present invention proposes a radiator for a grid-forming energy storage converter power module based on thermal simulation optimization design, including a radiator, a sparse fin heat dissipation fin group, a dense fin heat dissipation fin group, an IGBT module, an air duct baffle, and a centrifugal fan. A plurality of IGBT modules are arranged on the front surface of the radiator, and a number of sparse fin heat dissipation fin groups and dense fin heat dissipation fin groups are arranged on the back surface of the radiator. The dense fin heat dissipation fin group corresponds to a plurality of densely distributed IGBT modules, and the sparse fin heat dissipation fin group corresponds to a plurality of dispersedly distributed IGBT modules. An air duct baffle is arranged at the edge of the radiator, and a centrifugal fan is connected through the air duct baffle at the top of the radiator.

[0005] Preferably, the number of the IGBT modules is nine, including a first IGBT module, a second IGBT module, a third IGBT module, a fourth IGBT module, a fifth IGBT module, a sixth IGBT module, a seventh IGBT module, an eighth IGBT module, and a ninth IGBT module. The first IGBT module, the second IGBT module, and the third IGBT module are arranged in an inverted product shape to form a left chip group. The chip loss of the third IGBT module is less than that of the first IGBT module and the second IGBT module. The fourth IGBT module, the fifth IGBT module, and the sixth IGBT module are arranged in an inverted product shape to form a middle chip group. The chip loss of the sixth IGBT module is less than that of the fourth IGBT module and the fifth IGBT module. The seventh IGBT module, the eighth IGBT module, and the ninth IGBT module are arranged in an inverted product shape to form a right chip group. The chip loss of the ninth IGBT module is less than that of the seventh IGBT module and the eighth IGBT module. The left chip group, the middle chip group, and the right chip group are at the same height.

[0006] Preferably, the centrifugal fan is an air extraction fan, with air intake at the bottom and air outlet at the side of the centrifugal fan.

[0007] Preferably, the fins of the sparse fin heat dissipation fin group and the dense fin heat dissipation fin group are arranged parallel to each other. The dense fin heat dissipation fin group is located on top of the sparse fin heat dissipation fin group, and the fin thickness of the sparse fin heat dissipation fin is less than the fin pitch of the dense fin heat dissipation fin group.

[0008] Preferably, the air duct baffle forms an air duct with air intake at the bottom and air outlet at the top on the back surface of the radiator, and the air duct outlet is directly opposite to the air intake of the centrifugal fan.

[0009] Preferably, the fin pitch of the sparse fin heat dissipation fin group is greater than the fin pitch of the dense fin heat dissipation fin group.

[0010] Preferably, one end of the fins of the sparse fin heat dissipation fin group extends between the fins of the dense fin heat dissipation fin group.

[0011] Advantages of the present invention: By combining a radiator, a sparse-fin heat dissipation fin group, a dense-fin heat dissipation fin group, an IGBT module, an air duct enclosure, and a centrifugal fan, and through experimental optimization, the sparse-fin heat dissipation fin group is adopted at the corresponding positions of the lower third IGBT module, sixth IGBT module, and ninth IGBT module with relatively small heat generation, reducing the heat dissipation area in this section, increasing the ventilation area in this section, thereby reducing the air flow velocity in this section, reducing the heat dissipation capacity in this section, so that the temperature rises of the original relatively low-temperature third IGBT module, sixth IGBT module, and ninth IGBT module increase, achieving the purpose of equalizing the temperature with the upper first IGBT module, second IGBT module, fourth IGBT module, fifth IGBT module, seventh IGBT module, and eighth IGBT module. Since the ventilation area of the sparse-fin heat dissipation fin group increases and the flow velocity decreases, the flow resistance of the radiator decreases, thereby optimizing the operating point of the fan, reducing the corresponding static pressure, and increasing the flow rate. For the dense-fin heat dissipation fin group corresponding to the upper first IGBT module, second IGBT module, fourth IGBT module, fifth IGBT module, seventh IGBT module, and eighth IGBT module with relatively large heat generation, the air flow velocity increases and the heat dissipation capacity increases. Finally, the temperature rises of the upper first IGBT module, second IGBT module, fourth IGBT module, fifth IGBT module, seventh IGBT module, and eighth IGBT module with relatively large heat generation decrease. The present invention can equalize the temperature of the IGBT module, and reduce the temperature rise of the IGBT module chip with the highest original temperature, thereby improving the consistency of the IGBT module life and the service life of the entire power module.

[0012] The features and advantages of the present invention will be described in detail through embodiments in conjunction with the accompanying drawings. Brief Description of the Drawings

[0013] Figure 1 is a three-dimensional structural schematic diagram of a radiator for a grid-forming energy storage converter power module based on thermal simulation optimization design of the present invention; Figure 2 is a structural schematic diagram of the radiator for a grid-forming energy storage converter power module based on thermal simulation optimization design of the present invention; Figure 3 is a front view structural schematic diagram of a radiator for a grid-forming energy storage converter power module based on thermal simulation optimization design of the present invention; Figure 4 is a temperature field cloud diagram of the thermal simulation result under a certain working condition of a traditional uniform fin radiator; Figure 5 is a temperature field cloud diagram of the thermal simulation result under the same working condition of a radiator for a grid-forming energy storage converter power module based on thermal simulation optimization design of the present invention.

[0014] In the figure: 1 - radiator, 2 - IGBT module, 3 - air duct baffle, 4 - centrifugal fan, 11 - sparse fin heat dissipation fin group, 12 - dense fin heat dissipation fin group, 21 - first IGBT module, 22 - second IGBT module, 23 - third IGBT module, 24 - fourth IGBT module, 25 - fifth IGBT module, 26 - sixth IGBT module, 27 - seventh IGBT module 28 -, eighth IGBT module, 29 - ninth IGBT module. Detailed implementation manner

[0015] Refer to Figure 1 , Figure 2 and Figure 3, a radiator for a grid-forming energy storage converter power module based on thermal simulation optimization design of the present invention, includes a radiator 1, a sparse fin heat dissipation fin group 11, a dense fin heat dissipation fin group 12, an IGBT module 2, an air duct enclosure 3 and a centrifugal fan 4. A plurality of IGBT modules 2 are arranged on the front surface of the radiator 1. A number of sparse fin heat dissipation fin groups 11 and dense fin heat dissipation fin groups 12 are arranged on the back surface of the radiator 1. The dense fin heat dissipation fin group 12 corresponds to a plurality of densely distributed IGBT modules 2, and the sparse fin heat dissipation fin group 11 corresponds to a plurality of dispersedly distributed IGBT modules 2. An air duct enclosure 3 is arranged at the edge of the radiator 1. A centrifugal fan 4 is connected and arranged through the air duct enclosure 3 at the top of the radiator 1. The number of the IGBT modules 2 is nine, including a first IGBT module 21, a second IGBT module 22, a third IGBT module 23, a fourth IGBT module 24, a fifth IGBT module 25, a sixth IGBT module 26, a seventh IGBT module 27, an eighth IGBT module 28 and a ninth IGBT module 29. The first IGBT module 21, the second IGBT module 22 and the third IGBT module 23 are distributed in an inverted product shape to form a left chip group. The chip loss of the third IGBT module 23 is less than the chip losses of the first IGBT module 21 and the second IGBT module 22. The fourth IGBT module 24, the fifth IGBT module 25 and the sixth IGBT module 26 are distributed in an inverted product shape to form a middle chip group. The chip loss of the sixth IGBT module 26 is less than the chip losses of the fourth IGBT module 24 and the fifth IGBT module 25. The seventh IGBT module 27, the eighth IGBT module 28 and the ninth IGBT module 29 are distributed in an inverted product shape to form a right chip group. The chip loss of the ninth IGBT module 29 is less than the chip losses of the seventh IGBT module 27 and the eighth IGBT module 28. The left chip group, the middle chip group and the right chip group are at the same height. The centrifugal fan 4 is an air extraction fan. The bottom of the centrifugal fan 4 intakes air, and the side of the centrifugal fan 4 discharges air. The fins of the sparse fin heat dissipation fin group 11 and the dense fin heat dissipation fin group 12 are arranged parallel to each other. The dense fin heat dissipation fin group 12 is located on the top of the sparse fin heat dissipation fin group 11. The fin thickness of the sparse fin heat dissipation fin is less than the fin pitch of the dense fin heat dissipation fin group 12. The air duct enclosure 3 forms an air duct with air intake from the bottom and air discharge from the top on the back surface of the radiator 1. The air duct outlet is directly opposite to the air inlet of the centrifugal fan 4. The fin pitch of the sparse fin heat dissipation fin group 11 is greater than the fin pitch of the dense fin heat dissipation fin group 12. One end of the fin of the sparse fin heat dissipation fin group 11 extends between the fins of the dense fin heat dissipation fin group 12.

[0016] In the present invention, a radiator 1, a sparse-fin heat dissipation fin group 11, a dense-fin heat dissipation fin group 12, an IGBT module 2, an air duct enclosure 3, and a centrifugal fan 4 are combined. Through experimental optimization, the sparse-fin heat dissipation fin group 11 is adopted at the corresponding positions of the lower third IGBT module 23, the sixth IGBT module 26, and the ninth IGBT module 29 with relatively small heat generation, reducing the heat dissipation area in this section, increasing the ventilation area in this section, thereby reducing the air flow velocity in this section, decreasing the heat dissipation capacity in this section, and thus increasing the temperature rise of the third IGBT module 23, the sixth IGBT module 26, and the ninth IGBT module 29 with relatively small original temperature rise, achieving the purpose of equalizing the temperature with the upper first IGBT module 21, the second IGBT module 22, the fourth IGBT module 24, the fifth IGBT module 25, the seventh IGBT module 27, and the eighth IGBT module 28. Since the ventilation area of the sparse-fin heat dissipation fin group 11 increases and the flow velocity decreases, the flow resistance of the radiator 1 decreases, thereby optimizing the operating point of the fan, reducing the corresponding static pressure, and increasing the flow rate. For the upper first IGBT module 21, the second IGBT module 22, the fourth IGBT module 24, the fifth IGBT module 25, the seventh IGBT module 27, and the eighth IGBT module 28 with relatively large heat generation, the corresponding dense-fin heat dissipation fin group 12 is adopted, the air flow velocity increases, and the heat dissipation capacity increases. Finally, the temperature rise of the upper first IGBT module 21, the second IGBT module 22, the fourth IGBT module 24, the fifth IGBT module 25, the seventh IGBT module 27, and the eighth IGBT module 28 with relatively large heat generation decreases. The present invention can equalize the temperature of the IGBT module 2, and reduce the temperature rise of the IGBT module 2 chip with the highest original temperature, thereby improving the consistency of the service life of the IGBT module 2 and the service life of the entire power module.

[0017] Thermal simulations are carried out on the traditional uniform-fin radiator and the sparse-dense-fin radiator of the present invention under the same working conditions. The temperature field contour maps of the thermal simulation results are as Figure 4 and Figure 5As shown, temperature detection is performed on the first IGBT module 21, the second IGBT module 22, the third IGBT module 23, the fourth IGBT module 24, the fifth IGBT module 25, the sixth IGBT module 26, the seventh IGBT module 27, the eighth IGBT module 28, and the ninth IGBT module 29 in the thermal simulation software and recorded in Table 1 below. Under the same working conditions, compared with the traditional uniform fin radiator of the present invention, the temperature rise of each IGBT of the present invention is more uniform. The temperature difference between the highest temperature chip of the upper IGBT and the highest temperature chip of the lower IGBT is reduced from 28.6 K to 4.2 K, with a reduction amplitude of 85.3%. When the temperature of the highest temperature chip is reduced from 126.7 °C to 123.7 °C at an ambient temperature of 45 °C, the reduction amplitude is 2.4%. The static pressure of the fan is reduced from 421.9 Pa to 362.1 Pa, with a reduction amplitude of 14.2%. The air volume of the fan is increased from 630 m3 / h to 802.4 m3 / h, with an increase amplitude of 27.4%.

[0018]

[0019] Compared with the existing radiator with uniform fin distribution, through thermal simulation optimization and comparison, the present invention finds a radiator with a dense and sparse fin structure that can evenly distribute the chip temperature rise of different IGBT modules, and can reduce the temperature rise of the highest temperature chip of the IGBT module, improving the life consistency of the IGBT module and the service life of the entire power module.

[0020] The above embodiments are illustrative of the present invention, not limiting the present invention. Any solution obtained by simply transforming the present invention falls within the protection scope of the present invention.

Claims

1. A grid-type energy storage converter power module heat sink based on thermal simulation optimization design, characterized in that: The invention comprises a heat sink (1), a sparse-fin heat sink fin group (11), a dense-fin heat sink fin group (12), an IGBT module (2), an air duct enclosure (3) and a centrifugal fan (4); a plurality of IGBT modules (2) are arranged on the front of the heat sink (1); a plurality of sparse-fin heat sink fin groups (11) and a dense-fin heat sink fin group (12) are arranged on the back of the heat sink (1); the dense-fin heat sink fin group (12) corresponds to a plurality of densely distributed IGBT modules (2); the sparse-fin heat sink fin group (11) corresponds to a plurality of dispersedly distributed IGBT modules (2); an air duct enclosure (3) is arranged on the edge of the heat sink (1); and a centrifugal fan (4) is arranged on the top of the heat sink (1) in communication with the air duct enclosure (3).

2. A grid-type energy storage converter power module heat sink based on thermal simulation optimization design as claimed in claim 1, characterized in that: The number of the IGBT modules (2) is nine, including a first IGBT module (21), a second IGBT module (22), a third IGBT module (23), a fourth IGBT module (24), a fifth IGBT module (25), a sixth IGBT module (26), a seventh IGBT module (27), an eighth IGBT module (28) and a ninth IGBT module (29); the first IGBT module (21), the second IGBT module (22) and the third IGBT module (23) are arranged in an inverted triangle shape to form a left chip group; the chip loss of the third IGBT module (23) is less than that of the first IGBT module (21) and the second IGBT module (22); The fourth IGBT module (24), the fifth IGBT module (25) and the sixth IGBT module (26) are arranged in an inverted T-shape to form a middle chipset, and the chip loss of the sixth IGBT module (26) is less than the chip loss of the fourth IGBT module (24) and the fifth IGBT module (25). The seventh IGBT module (27), the eighth IGBT module (28) and the ninth IGBT module (29) are arranged in an inverted T-shape to form a right chipset, and the chip loss of the ninth IGBT module (29) is less than the chip loss of the seventh IGBT module (27) and the eighth IGBT module (28). The left chipset, the middle chipset and the right chipset are located at the same height.

3. A grid-type energy storage converter power module heat sink based on thermal simulation optimization design as claimed in claim 1, characterized in that: The centrifugal fan (4) is an exhaust-type fan, air is taken in from the bottom of the centrifugal fan (4), and air is discharged from the side of the centrifugal fan (4).

4. A grid-type energy storage converter power module heat sink based on thermal simulation optimization design as claimed in claim 1, characterized in that: The fins of the sparse-fin heat dissipation fin group (11) and the dense-fin heat dissipation fin group (12) are arranged parallel to each other, the dense-fin heat dissipation fin group (12) is located on the top of the sparse-fin heat dissipation fin group (11), and the fin thickness of the sparse-fin heat dissipation fin is smaller than the fin spacing of the dense-fin heat dissipation fin group (12).

5. A grid-type energy storage converter power module heat sink based on thermal simulation optimization design as claimed in claim 1, characterized in that: The air duct enclosure (3) forms an air duct on the back side of the radiator (1) with air entering from the bottom and exiting from the top, and the air duct outlet faces the air inlet of the centrifugal fan (4).

6. A grid-type energy storage converter power module heat sink based on thermal simulation optimization design as claimed in claim 1, characterized in that: The fin spacing of the sparse-fin heat dissipation fin group (11) is greater than the fin spacing of the dense-fin heat dissipation fin group (12).

7. A grid-type energy storage converter power module heat sink based on thermal simulation optimization design as claimed in claim 1, characterized in that: One end of the fins of the sparse-fin heat dissipation fin group (11) extends between the fins of the dense-fin heat dissipation fin group (12).

Images