Enhanced heat dissipation method based on microelectrode surface microstructure processing and electronic component

Abstract

The invention discloses an enhanced heat dissipation method based on microelectrode surface microstructure machining and an electronic component, and the method comprises the steps: machining a fin microstructure on the surface of a thin electrode through femtosecond laser; performing ultrasonic cleaning on the electrode, and then removing a surface oxide layer through an etching solution; and cutting the electrode to obtain a microelectrode, and welding and integrating the microelectrode and the functional material to obtain an electronic component of an electrical path. According to the enhanced heat dissipation method, the fin microstructure can be prepared on the thin microelectrode, and the heat dissipation performance of the microelectrode is improved.

Description

Technical Field

[0001] The invention belongs to the field of heat dissipation of electronic devices, and in particular relates to an enhanced heat dissipation method based on micro-electrode surface microstructure processing and an electronic component. Background Art

[0002] With the rapid development of electronic information technology, electronic devices are evolving towards high integration and miniaturization. In this process, the heat dissipation of micro components has become a key factor affecting device performance. Efficient heat dissipation is increasingly important for maintaining the stability and high working performance of electronic devices. If the heat dissipation is not timely or the effect is not good, the device temperature will be too high, which will lead to performance degradation, shortened life and other problems.

[0003] Take thermoelectric power generation devices as an example. They are composed of many tiny thermoelectric units and can convert thermal energy into electrical energy based on the Seebeck effect. However, in order to achieve high power generation output performance, it is necessary not only to provide a stable heat source at the hot end of the device, but also to perform efficient and powerful heat dissipation at the cold end, so as to establish a large temperature difference between the hot and cold ends of the device. Only in this way can the efficient operation of thermoelectric power generation devices be guaranteed and their energy conversion potential be fully realized. However, at present, in the context of miniaturization, achieving efficient and powerful heat dissipation at the cold end still faces many technical challenges that need to be solved urgently.

[0004] In the field of heat dissipation of electronic devices, how to dissipate heat efficiently and stably has always been a research focus. As one of the most commonly used passive heat dissipation methods, fin heat dissipation plays an important role in practical applications. Its principle is to achieve enhanced heat dissipation by increasing the heat convection area between the device and the air. This heat dissipation method has significant advantages. On the one hand, its structural design is relatively simple, without the need for complex components and precise assembly processes, which reduces production costs and manufacturing difficulties. On the other hand, fin heat dissipation does not require additional energy drive, and will not increase additional energy consumption during operation, which is in line with the concept of green energy saving. This makes it have broad application prospects in some scenarios where there are restrictions on energy supply or strict requirements on energy consumption, such as small electronic equipment, field operation equipment, etc.

[0005] The invention patent application with the publication number CN118102844A discloses a wearable thermoelectric device with a self-fin structure, its preparation method and application, which includes a flexible substrate with a supporting function, and the flexible substrate is closely attached to the heat source; a plurality of fin-shaped thermoelectric units with a power generation function, the proximal ends of the thermoelectric units are encapsulated in the flexible substrate, the heat of the heat source is transmitted to the hot ends of the thermoelectric units through the flexible substrate, and the distal ends of the thermoelectric units are exposed to the environment and serve as the cold ends of the thermoelectric units, and adjacent thermoelectric units are electrically connected. The thermoelectric device provided by this aspect of the patent application, through a special structural design, directly designs the thermoelectric arms into a structure similar to a heat dissipation fin that both has a power generation function and a heat dissipation function, and can effectively reduce the interfacial thermal resistance at the cold end of the device without the need for an additional heat dissipation structure. However, the heat dissipation fins disclosed in this patent application are relatively large in size and are bonded to the flexible substrate, and the interfacial thermal resistance problem is still significant.

[0006] The heat dissipation fins disclosed in the current prior art have the following disadvantages: a. Radiators are generally large in volume and are not conducive to being directly applied to the surface of micro-components; b. The commonly used installation methods of welding or pasting fins will cause significant thermal resistance problems.

[0007] Therefore, it is urgently necessary to design fins with a small interfacial thermal resistance that can be formed on a relatively thin microelectrode to significantly improve the heat dissipation performance of the microelectrode. Summary of the Invention

[0008] The present invention provides a heat dissipation enhancement method based on the microstructural processing of the surface of a microelectrode. This heat dissipation enhancement method can prepare a fin microstructure on a relatively thin microelectrode and improve the heat dissipation performance of the microelectrode.

[0009] The present invention provides a heat dissipation enhancement method based on the microstructural processing of the surface of a microelectrode, including:

[0010] (1) Processing a microstructure on the surface of a thin electrode by femtosecond laser;

[0011] (2) Ultrasonically cleaning the electrode obtained in step (1), and then removing the surface oxide layer by an etching solution;

[0012] (3) Cutting the electrode obtained in step (2) to obtain a microelectrode, and welding and integrating the side of the microelectrode away from the microstructure with a functional material to obtain an electronic component with an electrical path.

[0013] Preferably, the energy of the femtosecond laser is 10 - 30W. By controlling the energy and wavelength of the femtosecond laser, the present invention can prepare a microstructure with a suitable height on the surface of the electrode. This microstructure is a fin-like structure and can enhance the heat dissipation effect of a relatively thin microelectrode.

[0014] Preferably, the laser cutting path of the femtosecond laser technology is set to crosswise and longitudinal line interleaved processing, and the hollowed-out area is a micro-structure.

[0015] Preferably, the electrode is made of a conductive material, and the thickness of the electrode is 0.2 - 0.3 mm.

[0016] More preferably, the conductive material is copper or aluminum.

[0017] Preferably, the cleaning solution is a volatile solvent such as acetone, ethanol, or water.

[0018] Preferably, the etching solution is a mixed solution prepared from dilute hydrochloric acid and ferric chloride.

[0019] Preferably, the cutting method in step (3) is any one of laser cutting, water cutting, wire cutting, or scribing cutting.

[0020] Preferably, the present invention also provides an electronic component, which is prepared by the heat dissipation enhancement method based on the micro-structure processing on the surface of a micro-electrode.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] By using the femtosecond laser technology, the present invention processes micro-structures on the surface of a relatively thin electrode. Compared with the welding and pasting of fins disclosed in the prior art, the micro-structures provided by the present invention are integrated with the micro-electrodes, avoiding the problem of interfacial thermal resistance, and enabling a better heat dissipation enhancement function, thereby playing a role in enhancing heat dissipation and improving the device performance. Description of the Drawings

[0023] Figure 1 It is a flowchart of the heat dissipation enhancement method based on the micro-structure processing on the surface of a micro-electrode provided by a specific embodiment of the present invention;

[0024] Figure 2 It is a CAD design drawing of the micro-structure processing provided by Embodiment 1 of the present invention;

[0025] Figure 3 It is a surface and side view of the micro-structure provided by Embodiment 1 of the present invention;

[0026] Figure 4 It is a photo of the integrated micro-component prepared in Embodiment 1 of the present invention;

[0027] Figure 5 It is a comparison chart of the power generation performance between the thermoelectric device with micro-structures and the device without micro-structures on the electrode prepared in Embodiment 1 of the present invention;

[0028] Figure 6 It is a surface and side view of the micro-structure provided by Embodiment 2 of the present invention;

[0029] Figure 7 This is a comparison chart of the power generation performance between the electrode thermoelectric device with microstructures prepared in Example 2 of the present invention and the device without microstructures. Detailed implementation manners

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings, and other implementation manners can also be obtained.

[0031] Example 1

[0032] This example is a method for enhancing heat dissipation based on the microstructural processing of the surface of a microelectrode. A copper sheet with a thickness of 0.2 mm is used as the electrode, and microstructural processing is carried out to obtain the surface appearance of a convex platform array for integrating a thermoelectric generator device, as shown in Figure 1 (a), (b), and (c) of. The steps are as follows:

[0033] (1) Microstructural processing of the electrode surface: Prepare a purple copper sheet with a thickness of 0.2 mm and a surface area of 10 cm × 10 cm. First, use CAD software to design the processing drawing, as shown in Figure 2 . The horizontal and vertical lines are processed in an interleaved manner, and the hollowed-out area is designed as a convex platform of the copper sheet with a size of 0.09 mm × 0.09 mm. The lines are laser cutting lines, that is, the areas where the lines are located will be ablated by the laser to form grooves. Then, the 0.2 mm thick copper sheet is processed by femtosecond laser according to the designed pattern. The specific parameters are: laser wavelength 343 nm, laser energy about 10 W. Finally, the surface microstructures of the convex platform array shown in Figure 3 (a) and (b) are formed, that is, microstructures similar to fins are processed. The height of the convex platform is 100 um. Compared with the flat electrode surface, the convective heat dissipation area of the microstructural surface increases by 54%.

[0034] (2) Clean the electrode surface: Ultrasonically clean the copper sheet with ethanol, acetone, and ethanol in sequence to remove the contamination during the laser processing and the oil on the surface of the copper sheet. Then, use a mixed solution prepared by mixing HCl and FeCl3 at a mass fraction of 10% and 0.1% to etch and remove the oxide layer on the surface of the copper sheet.

[0035] (3) Prepare microelectrodes: According to the needs of micro-components, use femtosecond laser to cut the electrode with microstructures into microelectrodes for integrating electronic devices.

[0036] (4) Integrated micro-components: Select thermoelectric materials as the functional materials for micro-components, and weld and integrate the thermoelectric particles with the other side of the microelectrode, i.e., the side far from the micro-structure. For example, Figure 4 as shown, select tin-bismuth-silver solder paste, and the welding temperature is 220 °C. The test results of the power generation performance of the device show that, as Figure 5 shown, compared with the thermoelectric device with a flat electrode, the power generation output power of this micro-structure device has increased by 19.84% at a wind speed of 2 m / s.

[0037] Example 2

[0038] The present invention is a method for enhancing heat dissipation based on the processing of micro-structures on the surface of microelectrodes. A copper sheet with a thickness of 0.3 mm is used as the electrode, and micro-structure processing is carried out to obtain a surface topography of a convex platform array for integrating thermoelectric power generation devices. The steps are as follows:

[0039] (1) Micro-structure processing on the electrode surface: Prepare a piece of purple copper sheet with a thickness of 0.3 mm and a surface area of 10 cm × 10 cm. First, use CAD software to design the processing drawings. As Figure 2 shown, the horizontal and vertical lines are processed alternately, and the hollowed-out area is designed as a copper sheet convex platform with a size of 0.09 mm × 0.09 mm. Among them, the lines are laser cutting lines, that is, the areas where the lines are located will be ablated by the laser to form grooves. Then, the 0.3 mm thick copper sheet is processed by femtosecond laser according to the designed pattern. The specific parameters are: laser wavelength 343 nm, laser energy about 30 W. Finally, the surface micro-structure of the convex platform array shown in (a) and (b) of Figure 6 is formed. The height of the convex platform is 200 μm. Compared with the flat electrode surface, the convective heat dissipation area of the micro-structure surface has increased by 185%.

[0040] (2) Clean the electrode surface: First, use ethanol, acetone, and ethanol to ultrasonically clean the copper sheet thoroughly to remove the contamination during the laser processing and the oil on the copper sheet surface. Then, use a mixed solution prepared by mixing HCl and FeCl3 at a mass fraction of 10% and 0.1% to etch and remove the oxide layer on the copper sheet surface.

[0041] (3) Prepare microelectrodes: According to the needs of micro-components, use femtosecond laser to cut the electrode with micro-structures into microelectrodes for integrating electronic devices.

[0042] (4) Integrate micro-components: Select thermoelectric materials as the functional materials for micro-components, and weld and integrate the thermoelectric particles with the other side of the microelectrode, i.e., the side far from the micro-structure. Select tin-bismuth-silver solder paste, and the welding temperature is 220 °C. The test results of the power generation performance of the device show that as Figure 7 shown, compared with the thermoelectric device with a flat electrode, the power generation output power of this micro-structure device has increased by 35.22% at a wind speed of 2 m / s.

Claims

1. A method for enhancing heat dissipation based on microstructure processing of microelectrode surface, characterized in that: include: (1) Processing microstructures on the surface of thin electrodes using femtosecond lasers; (2) ultrasonically cleaning the electrode obtained in step (1), and then removing the surface oxide layer using an etching solution; (3) Cutting the electrode obtained in step (2) to obtain a microelectrode, and welding the side of the microelectrode away from the microstructure to the functional material to obtain an electronic component of the electrical path.

2. The method for enhancing heat dissipation based on micro-electrode surface microstructure processing according to claim 1, characterized in that: The energy of the femtosecond laser is 10-30W.

3. The enhanced heat dissipation method based on micro-electrode surface microstructure processing according to claim 1 is characterized in that: The laser cutting line of the femtosecond laser technology is set to be processed in a staggered manner with horizontal and vertical lines, and the hollow area is a microstructure.

4. The method for enhancing heat dissipation based on micro-electrode surface micro-structure processing according to claim 1, characterized in that: The electrode is made of conductive material, and the thickness of the electrode is 0.2-0.3 mm.

5. The method for enhancing heat dissipation based on micro-electrode surface micro-structure processing according to claim 4, characterized in that: The conductive material is copper or aluminum.

6. The method for enhancing heat dissipation based on micro-electrode surface micro-structure processing according to claim 1, characterized in that: The cleaning liquid is acetone, ethanol or water.

7. The enhanced heat dissipation method based on micro-electrode surface microstructure processing according to claim 1 is characterized in that: The etching solution is a mixed solution of dilute hydrochloric acid and ferric chloride.

8. The method for enhancing heat dissipation based on micro-electrode surface micro-structure processing according to claim 1, characterized in that: The cutting method in step (3) is any one of laser cutting, water jet cutting, wire cutting and scribing cutting.

9. An electronic component, characterized in that: The heat dissipation enhancement method based on micro-electrode surface microstructure processing is prepared according to any one of claims 1 to 8.

Images